MC74HC1G08 Single 2-Input AND Gate The MC74HC1G08 is a high speed CMOS 2-input AND gate fabricated with silicon gate CMOS technology. The internal circuit is composed of multiple stages, including a buffer output which provides high noise immunity and stable output. The MC74HC1G08 output drive current is 1/2 compared to MC74HC series. www.onsemi.com MARKING DIAGRAMS Features * High Speed: tPD = 7 ns (Typ) at VCC = 5 V Low Power Dissipation: ICC = 1 mA (Max) at TA = 25C High Noise Immunity Balanced Propagation Delays (tpLH = tpHL) Symmetrical Output Impedance (IOH = IOL = 2 mA) Chip Complexity: < 100 FETs NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q100 Qualified and PPAP Capable These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant 5 SC-88A DF SUFFIX CASE 419A 1 A 2 GND 3 5 VCC 4 Y XX MG G 1 5 TSOP-5 DT SUFFIX CASE 483 XX M G B M * * * * * * * XX MG G 1 = Device Code = Date Code* = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. 5 1 SC-74A DBV SUFFIX CASE 318BQ Figure 1. Pinout A B & XXX M G Y Figure 2. Logic Symbol XXX MG G = Specific Device Code = Date Code = Pb-Free Package (Note: Microdot may be in either location) PIN ASSIGNMENT 1 B 2 A 3 GND 4 Y 5 VCC FUNCTION TABLE Inputs Output A B Y L L H H L H L H L L L H ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 6 of this data (c) Semiconductor Components Industries, LLC, 2012 November, 2018 - Rev. 15 1 Publication Order Number: MC74HC1G08/D MC74HC1G08 MAXIMUM RATINGS Symbol Parameter Unit *0.5 to )7.0 *0.5 to +6.5 V VCC DC Supply Voltage VIN DC Input Voltage *0.5 to VCC )0.5 V DC Output Voltage *0.5 to VCC )0.5 V VOUT SC-88A (NLV), TSOP-5 SC-88A, SC-74A Value IIK DC Input Diode Current $20 mA IOK DC Output Diode Current $20 mA IOUT DC Output Source/Sink Current $12.5 mA ICC or IGND TSTG DC Supply Current per Supply Pin or Ground Pin Storage Temperature Range $25 mA -65 to )150 C 260 C )150 C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias qJA Thermal Resistance (Note 1) SC70-5/SC-88A/SOT-353 SOT23-5/TSOP-5/SC59-5 SC-74A 659 555 555 C/W PD Power Dissipation in Still Air at 85C SC70-5/SC-88A/SOT-353 SOT23-5/TSOP-5/SC59-5 SC-74A 190 225 225 mW MSL Moisture Sensitivity FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V-0 @ 0.125 in ESD Withstand Voltage (Note 2) Human Body Model Charged Device Model 2000 1000 V SC-88A (NLV), SOT-23 SC-88A, SC-74A $500 $100 mA VESD ILATCHUP Level 1 Latchup Performance (Note 3) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 20 ounce copper trace with no air flow. 2. HBM tested to ANSI/ESDA/JEDEC JS-001-2017. CDM tested to JESD22-C101-F. JEDEC recommends that ESD qualification to EIA/JESD22-A115A (Machine Model) be discontinued per JEDEC/JEP172A. 3. Tested to EIA/JESD78 Class II. www.onsemi.com 2 MC74HC1G08 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC DC Supply Voltage 2.0 6.0 V VIN DC Input Voltage 0.0 VCC V DC Output Voltage 0.0 VCC V *55 )125 C VOUT TA tr , tf Operating Temperature Range Input Rise and Fall Time SC-88A (NLV), TSOP-5 VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 6.0 V 0 0 0 0 1000 600 500 400 Input Rise and Fall Time SC-88A, SC-74A VCC = 1.65 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 3.0 V to 3.6 V VCC = 4.5 V to 6.0 V 0 0 0 0 20 20 10 5 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DC ELECTRICAL CHARACTERISTICS TA = 255C VCC Symbol Parameter Test Conditions -40C TA 85C -55C TA 125C (V) Min Typ Max Min Max Min Max Unit VIH High-Level Input Voltage 2.0 3.0 4.5 6.0 1.5 2.1 3.15 4.20 - - - - - - - - 1.5 2.1 3.15 4.20 - - - - 1.5 2.1 3.15 4.20 - - - - V VIL Low-Level Input Voltage 2.0 3.0 4.5 6.0 - - - - - - - - 0.5 0.9 1.35 1.80 - - - - 0.5 0.9 1.35 1.80 - - - - 0.5 0.9 1.35 1.80 V VOH High-Level Output Voltage 2.0 3.0 4.5 6.0 1.9 2.9 4.4 5.9 2.0 3.0 4.5 6.0 - - - - 1.9 2.9 4.4 5.9 - - - - 1.9 2.9 4.4 5.9 - - - - V 4.5 6.0 4.18 5.68 4.31 5.80 - - 4.13 5.63 - - 4.08 5.58 - - 2.0 3.0 4.5 6.0 - - - - 0.0 0.0 0.0 0.0 0.1 0.1 0.1 0.1 - - - - 0.1 0.1 0.1 0.1 - - - - 0.1 0.1 0.1 0.1 4.5 6.0 - - 0.17 0.18 0.26 0.26 - - 0.33 0.33 - - 0.40 0.40 VIN = VIH or VIL IOH = -20 mA VIN = VIH or VIL IOH = -2 mA IOH = -2.6 mA VOL Low-Level Output Voltage VIN = VIH or VIL IOL = 20 mA VIN = VIH or VIL IOL = 2 mA IOL = 2.6 mA V IIN Input Leakage Current VIN = 6.0 V or GND 6.0 - - $0.1 * - $1.0 - $1.0 mA ICC Quiescent Supply Current VIN = VCC or GND 6.0 - - 1.0 - 10 - 40 mA *Guaranteed by design. www.onsemi.com 3 MC74HC1G08 AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 6.0 ns) TA = 255C Symbol Parameter Test Conditions Min Typ -40C TA 85C Max Min -55C TA 125C Max Min Max Unit ns tPLH, tPHL Propagation Delay, Input A or B to Y VCC = 5.0 V CL = 15 pF - 3.5 15 - 20 - 25 VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 6.0 V CL = 50 pF - - - - 20 11 8 7 100 27 20 17 - - - - 125 35 25 21 - - - - 155 90 35 26 tTLH, tTHL Output Transition Time VCC = 5.0 V CL = 15 pF - 3 10 - 15 - 20 VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 6.0 V CL = 50 pF - - - - 25 16 11 9 125 35 25 21 - - - - 155 45 31 26 - - - - 200 60 38 32 CIN Input Capacitance - 5 10 - 10 - 10 CPD Power Dissipation Capacitance (Note 4) ns pF Typical @ 255C, VCC = 5.0 V 10 pF 4. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. www.onsemi.com 4 MC74HC1G08 OPEN VCC Test Switch Position tPLH / tPHL Open tTLH / tTHL (Note 5) Open tPLZ / tPZL VCC tPHZ / tPZH GND GND RL DUT OUTPUT RT CL, pF RL, W X See AC Characteristics Table X 1k 1k X - Don't Care CL* *CL includes probe and jig capacitance RT is ZOUT of pulse generator (typically 50 W) f = 1 MHz Figure 3. Test Circuit tr = 6 ns tf = 6 ns 90% 90% VCC INPUT Vmi Vmi Vmi Vmi INPUT VCC GND 10% 10% tPHL OUTPUT tPLH tTLH VH VH VL VL tPLH VH OUTPUT VOH OUTPUT tPLZ VOL + VY VOL Vmo tPZH VOH VH ~ VCC Vmo VOL tPHL tTLH tPZL Vmo Vmo tTHL GND OUTPUT tPHZ VOH VOH - VY Vmo Vmo VL VL tTHL ~0 V VOL Figure 4. Switching Waveforms Vmo, V VCC, V Vmi, V tPLH, tPHL tPZL, tPLZ, tPZH, tPHZ VL, V VH, V VY, V 3.0 to 3.6 VCC/2 (VOH - VOL)/2 VCC/2 VOL + 0.1 (VOH - VOL) VOL + 0.9 (VOH - VOL) 0.3 4.5 to 5.5 VCC/2 (VOH - VOL)/2 VCC/2 VOL + 0.1 (VOH - VOL) VOL + 0.9 (VOH - VOL) 0.3 5. tTLH and tTHL are measured from 10% to 90% of (VOH - VOL), and 90% to 10% of (VOH - VOL), respectively. www.onsemi.com 5 MC74HC1G08 ORDERING INFORMATION Packages Specific Device Code Pin 1 Orientation (See below) Shipping MC74HC1G08DFT1G SC-88A H2 Q2 3000 / Tape & Reel NLVHC1G08DFT1G* SC-88A H2 Q2 3000 / Tape & Reel MC74HC1G08DFT2G SC-88A H2 Q4 3000 / Tape & Reel NLVHC1G08DFT2G* SC-88A H2 Q4 3000 / Tape & Reel MC74HC1G08DTT1G TSOP-5 H2 Q4 3000 / Tape & Reel NLVHC1G08DTT1G* TSOP-5 H2R Q4 3000 / Tape & Reel MC74HC1G08DBVT1G (In Development) SC-74A TBD Q4 Device 3000 / Tape & Reel For complete information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q100 Qualified and PPAP Capable. Pin 1 Orientation in Tape and Reel www.onsemi.com 6 MC74HC1G08 PACKAGE DIMENSIONS SC-88A (SC-70-5/SOT-353) CASE 419A-02 ISSUE L A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A-01 OBSOLETE. NEW STANDARD 419A-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. G 5 4 -B- S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) M B M N J C K H SOLDER FOOTPRINT 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 www.onsemi.com 7 SCALE 20:1 mm inches INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 MC74HC1G08 PACKAGE DIMENSIONS TSOP-5 CASE 483 ISSUE M 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. D 5X NOTE 5 0.20 C A B 0.10 T M 2X 0.20 T B 5 1 4 2 B S 3 K DETAIL Z G A A TOP VIEW DIM A B C D G H J K M S DETAIL Z J C 0.05 H SIDE VIEW C SEATING PLANE END VIEW MILLIMETERS MIN MAX 2.85 3.15 1.35 1.65 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 0_ 10 _ 2.50 3.00 SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 8 MC74HC1G08 PACKAGE DIMENSIONS SC-74A CASE 318BQ ISSUE B 5X b 0.20 C A B E1 5 M 4 1 2 E 3 B 0.05 A1 L DETAIL A e A D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. TOP VIEW A SIDE VIEW C DETAIL A c SEATING PLANE END VIEW DIM A A1 b c D E E1 e L M MILLIMETERS MIN MAX 0.90 1.10 0.01 0.10 0.25 0.50 0.10 0.26 2.85 3.15 2.50 3.00 1.35 1.65 0.95 BSC 0.20 0.60 0_ 10 _ RECOMMENDED SOLDERING FOOTPRINT* 0.95 PITCH 2.40 5X 1.00 5X 0.70 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. 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