© Semiconductor Components Industries, LLC, 2012
November, 2018 − Rev. 15
1Publication Order Number:
MC74HC1G08/D
MC74HC1G08
Single 2-Input AND Gate
The MC74HC1G08 is a high speed CMOS 2−input AND gate
fabricated with silicon gate CMOS technology.
The internal circuit is composed of multiple stages, including a
buffer output which provides high noise immunity and stable output.
The MC74HC1G08 output drive current is 1/2 compared to
MC74HC series.
Features
•High Speed: tPD = 7 ns (Typ) at VCC = 5 V
•Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
•High Noise Immunity
•Balanced Propagation Delays (tpLH = tpHL)
•Symmetrical Output Impedance (IOH = IOL = 2 mA)
•Chip Complexity: < 100 FETs
•NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Figure 1. Pinout
Figure 2. Logic Symbol
A
BY
&
VCC
B
A
YGND
1
2
34
5
PIN ASSIGNMENT
1
2
3 GND
B
A
4
5V
CC
Y
L
L
H
H
L
H
L
H
FUNCTION TABLE
Inputs Output
AB
L
L
L
H
Y
See detailed ordering, marking and shipping information in
the package dimensions section on page 6 of this data
ORDERING INFORMATION
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MARKING
DIAGRAMS
XX = Device Code
M = Date Code*
G= Pb−Free Package
SC−88A
DF SUFFIX
CASE 419A
TSOP−5
DT SUFFIX
CASE 483
XX MG
G
1
5
XX MG
G
M
1
5
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
1
5
XXX MG
G
SC−74A
DBV SUFFIX
CASE 318BQ
XXX = Specific Device Code
M = Date Code
G= Pb−Free Package
(Note: Microdot may be in either location)
MC74HC1G08
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2
MAXIMUM RATINGS
Symbol Parameter Value Unit
VCC DC Supply Voltage SC−88A (NLV), TSOP−5
SC−88A, SC−74A *0.5 to )7.0
*0.5 to +6.5
V
VIN DC Input Voltage *0.5 to VCC )0.5 V
VOUT DC Output Voltage *0.5 to VCC )0.5 V
IIK DC Input Diode Current $20 mA
IOK DC Output Diode Current $20 mA
IOUT DC Output Source/Sink Current $12.5 mA
ICC or IGND DC Supply Current per Supply Pin or Ground Pin $25 mA
TSTG Storage Temperature Range −65 to )150 °C
TLLead Temperature, 1 mm from Case for 10 Seconds 260 °C
TJJunction Temperature Under Bias )150 °C
qJA Thermal Resistance (Note 1) SC70−5/SC−88A/SOT−353
SOT23−5/TSOP−5/SC59−5
SC−74A
659
555
555
°C/W
PDPower Dissipation in Still Air at 85°CSC70−5/SC−88A/SOT−353
SOT23−5/TSOP−5/SC59−5
SC−74A
190
225
225
mW
MSL Moisture Sensitivity Level 1
FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
VESD ESD Withstand Voltage (Note 2) Human Body Model
Charged Device Model
2000
1000
V
ILATCHUP Latchup Performance (Note 3) SC−88A (NLV), SOT−23
SC−88A, SC−74A $500
$100
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 20 ounce copper trace with no air flow.
2. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to JESD22−C101−F. JEDEC recommends that ESD qualification to
EIA/JESD22−A115A (Machine Model) be discontinued per JEDEC/JEP172A.
3. Tested to EIA/JESD78 Class II.
MC74HC1G08
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3
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC DC Supply Voltage 2.0 6.0 V
VIN DC Input Voltage 0.0 VCC V
VOUT DC Output Voltage 0.0 VCC V
TAOperating Temperature Range *55 )125 °C
tr , tfInput Rise and Fall Time SC−88A (NLV), TSOP−5
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
0
0
0
0
1000
600
500
400
ns/V
Input Rise and Fall Time SC−88A, SC−74A
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 6.0 V
0
0
0
0
20
20
10
5
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
VCC
(V)
TA = 255C−40°C ≤ TA ≤ 85°C−55°C ≤ TA ≤ 125°C
Symbol Parameter Test Conditions Min Typ Max Min Max Min Max Unit
VIH High−Level Input
Voltage
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.20
−
−
−
−
−
−
−
−
1.5
2.1
3.15
4.20
−
−
−
−
1.5
2.1
3.15
4.20
−
−
−
−
V
VIL Low−Level Input
Voltage
2.0
3.0
4.5
6.0
−
−
−
−
−
−
−
−
0.5
0.9
1.35
1.80
−
−
−
−
0.5
0.9
1.35
1.80
−
−
−
−
0.5
0.9
1.35
1.80
V
VOH High−Level Output
Voltage
VIN = VIH or VIL
IOH = −20 mA
2.0
3.0
4.5
6.0
1.9
2.9
4.4
5.9
2.0
3.0
4.5
6.0
−
−
−
−
1.9
2.9
4.4
5.9
−
−
−
−
1.9
2.9
4.4
5.9
−
−
−
−
V
VIN = VIH or VIL
IOH = −2 mA
IOH = −2.6 mA
4.5
6.0
4.18
5.68
4.31
5.80
−
−
4.13
5.63
−
−
4.08
5.58
−
−
VOL Low−Level Output
Voltage
VIN = VIH or VIL
IOL = 20 mA
2.0
3.0
4.5
6.0
−
−
−
−
0.0
0.0
0.0
0.0
0.1
0.1
0.1
0.1
−
−
−
−
0.1
0.1
0.1
0.1
−
−
−
−
0.1
0.1
0.1
0.1
V
VIN = VIH or VIL
IOL = 2 mA
IOL = 2.6 mA
4.5
6.0
−
−
0.17
0.18
0.26
0.26
−
−
0.33
0.33
−
−
0.40
0.40
IIN Input Leakage
Current
VIN = 6.0 V or
GND
6.0 − − $0.1
*
−$1.0 −$1.0 mA
ICC Quiescent Supply
Current
VIN = VCC or
GND
6.0 − − 1.0 −10 −40 mA
*Guaranteed by design.
MC74HC1G08
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4
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 6.0 ns)
TA = 255C−40°C ≤ TA ≤ 85°C−55°C ≤ TA ≤ 125°C
Symbol Parameter Test Conditions Min Typ Max Min Max Min Max Unit
tPLH,
tPHL
Propagation Delay,
Input A or B to Y
VCC = 5.0 V CL = 15 pF −3.5 15 −20 −25 ns
VCC = 2.0 V CL = 50 pF
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
−
−
−
−
20
11
8
7
100
27
20
17
−
−
−
−
125
35
25
21
−
−
−
−
155
90
35
26
tTLH,
tTHL
Output Transition
Time
VCC = 5.0 V CL = 15 pF −3 10 −15 −20 ns
VCC = 2.0 V CL = 50 pF
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
−
−
−
−
25
16
11
9
125
35
25
21
−
−
−
−
155
45
31
26
−
−
−
−
200
60
38
32
CIN Input Capacitance −5 10 −10 −10 pF
Typical @ 255C, VCC = 5.0 V
CPD Power Dissipation Capacitance (Note 4) 10 pF
4. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
MC74HC1G08
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5
Figure 3. Test Circuit
*CL includes probe and jig capacitance
RT is ZOUT of pulse generator (typically 50 W)
f = 1 MHz
DUT
OPEN
OUTPUT
GND
VCC
CL*
RL
RT
Test
Switch
Position CL, pF RL, W
tPLH / tPHL Open
See AC Characteristics
Table
X
tTLH / tTHL
(Note 5)
Open X
tPLZ / tPZL VCC 1 k
tPHZ / tPZH GND 1 k
X − Don’t Care
Figure 4. Switching Waveforms
90%
Vmi
10%
90%
10%
Vmo
tr = 6 ns tf = 6 ns
tPHL
tPLH
tPLH
tPHL
VCC
VOH
VOL
VOH
VOL
GND
OUTPUT
OUTPUT
tTHL
tTLH
VL
tTLH
tTHL
VH
VL
VH
VL
VH
VL
VH
Vmi
Vmo
Vmo Vmo
Vmi
Vmo
tPZL
tPZH
tPLZ
tPHZ
VCC
~ VCC
VOL
VOH
~0 V
GND
INPUT
OUTPUT
OUTPUT
VOL + VY
Vmo
VOH - VY
Vmi
INPUT
VCC, V Vmi, V
Vmo, V
VL, V VH, V VY
, V
tPLH, tPHL tPZL, tPLZ, tPZH, tPHZ
3.0 to 3.6 VCC/2 (VOH − VOL)/2 VCC/2 VOL + 0.1 (VOH − VOL) VOL + 0.9 (VOH − VOL) 0.3
4.5 to 5.5 VCC/2 (VOH − VOL)/2 VCC/2 VOL + 0.1 (VOH − VOL) VOL + 0.9 (VOH − VOL) 0.3
5. tTLH and tTHL are measured from 10% to 90% of (VOH − VOL), and 90% to 10% of (VOH − VOL), respectively.
MC74HC1G08
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6
ORDERING INFORMATION
Device Packages Specific Device Code
Pin 1 Orientation
(See below) Shipping†
MC74HC1G08DFT1G SC−88A H2 Q2 3000 / Tape & Reel
NLVHC1G08DFT1G* SC−88A H2 Q2 3000 / Tape & Reel
MC74HC1G08DFT2G SC−88A H2 Q4 3000 / Tape & Reel
NLVHC1G08DFT2G* SC−88A H2 Q4 3000 / Tape & Reel
MC74HC1G08DTT1G TSOP−5 H2 Q4 3000 / Tape & Reel
NLVHC1G08DTT1G* TSOP−5 H2R Q4 3000 / Tape & Reel
MC74HC1G08DBVT1G
(In Development)
SC−74A TBD Q4 3000 / Tape & Reel
†For complete information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
Pin 1 Orientation in Tape and Reel
MC74HC1G08
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7
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
1.80 2.200.071 0.087
INCHES
B1.15 1.350.045 0.053
C0.80 1.100.031 0.043
D0.10 0.300.004 0.012
G0.65 BSC0.026 BSC
H--- 0.10---0.004
J0.10 0.250.004 0.010
K0.10 0.300.004 0.012
N0.20 REF0.008 REF
S2.00 2.200.079 0.087
B0.2 (0.008) MM
12 3
45
A
G
S
D 5 PL
H
C
N
J
K
−B−
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
ǒmm
inchesǓ
SCALE 20:1
0.65
0.025
0.65
0.025
0.50
0.0197
0.40
0.0157
1.9
0.0748
SOLDER FOOTPRINT
MC74HC1G08
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8
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE M
0.7
0.028
1.0
0.039
ǒmm
inchesǓ
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
DIM MIN MAX
MILLIMETERS
A
B
C0.90 1.10
D0.25 0.50
G0.95 BSC
H0.01 0.10
J0.10 0.26
K0.20 0.60
M0 10
S2.50 3.00
123
54 S
A
G
B
D
H
C
J
__
0.20
5X
CAB
T0.10
2X
2X T0.20
NOTE 5
CSEATING
PLANE
0.05
K
M
DETAIL Z
DETAIL Z
TOP VIEW
SIDE VIEW
A
B
END VIEW
1.35 1.65
2.85 3.15
MC74HC1G08
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9
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM MIN MAX
MILLIMETERS
D
E1
A0.90 1.10
b0.25 0.50
e0.95 BSC
A1 0.01 0.10
c0.10 0.26
L0.20 0.60
M0 10
E2.50 3.00
123
54
E
D
E1
b
A
c
__
0.20
5X
CAB
CSEATING
PLANE
L
M
DETAIL A
TOP VIEW
SIDE VIEW
A
B
END VIEW
1.35 1.65
2.85 3.15
2.40
0.70
5X
DIMENSIONS: MILLIMETERS
RECOMMENDED
0.95
PITCH
1.00
5X
e
A1
0.05
DETAIL A
MC74HC1G08/D
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