MB39C602
High Power Factor
LED Driver IC for LED Lighting
Cypress Semiconductor Corporation • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600
Document Number: 002-08397 Rev. *A Revised April 13, 2016
MB39C602 is a flyback type switching regulator controller IC. The LED current is regulated by controlling the switching on-time
depending on the LED load.
It is most suitable for the general lighting applications, for example stocks of commercial and residential light bulbs and so on.
Features
High power factor in Single Conversion
Helps to achieve high efficiency and low EMI by detecting auxiliary transformer zero current
Switching frequency setting depend on the FC pin current : 30 kHz to 120 kHz
Control of the current of Primary Winding without the external sense resistor
Built-in under voltage lock out function
Built-in output over voltage protection function
Built-in over temperature protection function
Input voltage range VDD : 9 V to 20 V
Input voltage range for LED lighting applications : AC110VRMS, AC230VRMS
Package : SOP-8 (3.9 mm × 5.05 mm × 1.75 mm [Max])
Applications
LED lighting
PWM dimmable LED lighting etc.
Document Number: 002-08397 Rev. *A Page 2 of 40
MB39C602
Contents
1. Pin Assignment ................................................................................................................................................................. 3
2. Pin Descriptions ................................................................................................................................................................ 3
3. Block Diagram ................................................................................................................................................................... 4
4. Absolute Maximum Ratings ............................................................................................................................................. 5
5. Recommended Operating Conditions ............................................................................................................................. 6
6. Electrical Characteristics ................................................................................................................................................. 7
7. Typical Characteristics ..................................................................................................................................................... 9
8. Function Explanation ...................................................................................................................................................... 11
9. Various Protection Circuits ............................................................................................................................................ 18
10. Various Function Tables ................................................................................................................................................ 19
11. I/O Pin Equivalent Circuit Diagram ................................................................................................................................ 20
12. Example Application Circuit .......................................................................................................................................... 22
13. Reference Data ................................................................................................................................................................ 27
14. Usage Precaution ............................................................................................................................................................ 32
15. Ordering Information ...................................................................................................................................................... 33
16. RoHS Compliance Information Of Lead (Pb) Free Version ......................................................................................... 33
17. Marking Format (Lead Free version) ............................................................................................................................. 33
18. Labeling Sample (Lead free version) ............................................................................................................................. 34
19. MB39C602PNF Recommended Conditions of Moisture Sensitivity Level ................................................................. 35
20. Package Dimensions ...................................................................................................................................................... 37
21. Major Changes ................................................................................................................................................................ 38
Document History ................................................................................................................................................................. 39
Document Number: 002-08397 Rev. *A Page 3 of 40
MB39C602
1. Pin Assignment
(TOP VIEW)
(FPT-8P-M02)
2. Pin Descriptions
Pin No.
Pin Name
I/O
Description
1
FC
I
Switching frequency setting pin.
2
ZCD
I
Transformer auxiliary winding zero current detecting pin.
3
CL
I
Pin for controlling peak current of transformer primary winding.
4
OTC
I
On-time control pin.
5
VCG
-
External MOSFET gate bias pin.
6
DRN
O
External MOSFET source connection pin.
7
GND
-
Ground pin.
8
VDD
-
Power supply pin.
4
3
2
1
OTC
CL
ZCD
VDDFC
VCG
GND
DRN
5
6
7
8
Document Number: 002-08397 Rev. *A Page 4 of 40
MB39C602
3. Block Diagram
Rst
CVDD
CBUL
K
CVCG
D1
DBIAS
Rs
Vs
Co
1
1
1
1
1
1
1
1
1
1
2
2 2
2
10V/6V
10V/8V
VDD 8
FC 1
IFC
Fault Latch
13V
VVCG
LDO
VVDD
Switch
VVCG
Shunt
Enable
PWM
14V
2V
HS
Drive
Driver
1/tSW
I
FC
Freq. Modulator
IFC
VGATE
Discharge
D Q
Q
Enable
PWM
UVLO
DRN
6
VCG
5
GND
7
5V
ZCD 2
OV
Fault
On-Time Modulation
Fault Timing
and Control Fault
VGATE
OTC 4
3V
IOTC
1V Shutdown
and Restart Thermal
Shutdown
UVLO
Fault Latch
Reset
CL
RCL
3
Current
Sence
MB39C602
Current
Sense
20mV
Zero Current
Detect
Document Number: 002-08397 Rev. *A Page 5 of 40
MB39C602
4. Absolute Maximum Ratings
Parameter
Symbol
Condition
Rating
Unit
Min
Max
Power supply voltage
VVDD
VDD pin
-0.3
+25.0
V
Input voltage
VDRN
DRN pin
-
20
V
VVCG
VCG pin
-0.3
+16.0
V
VZCD
ZCD pin
-0.3
+6.0
V
VOTC
OTC pin
-0.3
+6.0
V
VCL
CL pin
-0.3
+6.0
V
VFC
FC pin
-0.3
+2.0
V
Input current
IVCG
VCG pin
-
10
mA
IOTC
OTC pin
-1
0
mA
ICL
CL pin
-1
0
mA
IFC
FC pin
0
1
mA
Output current
IDRN
DRN pin
-
800
mA
IDRN
DRN pin,
Pulsed 400 ns, 2% duty cycle
-1.5
+6.0
A
Power dissipation
PD
Ta ≤+25°C
-
800[1]
mW
Storage temperature
TSTG
-55
+125
°C
[1]: The value when using two layers PCB.
Reference: θja (wind speed 0 m/s): +125°C/W
WARNING:
Semiconductor devices may be permanently damaged by application of stress (including, without limitation, voltage, current or
temperature) in excess of absolute maximum ratings.
Do not exceed any of these ratings.
Document Number: 002-08397 Rev. *A Page 6 of 40
MB39C602
5. Recommended Operating Conditions
Parameter
Symbol
Condition
Value
Unit
Min
Typ
Max
VDD pin input voltage
VDD
VDD pin
9
-
20
V
VCG pin input voltage
VCG
VCG pin (from low-impedance source)
9
-
13
V
VCG pin input current
IVCG
VCG pin (from high-impedance source)
10
-
2000
µA
OTC pin resistance to GND
ROTC
OTC pin
10
-
100
kΩ
CL pin resistance to GND
RCL
CL pin
24.3
-
200.0
kΩ
ZCD pin resistance to auxiliary
winding
RZCD
ZCD pin Transformer auxiliary winding
connection resistor
50
-
200
kΩ
VCG pin capacitance to GND
CVCG
VCG pin
33
-
200
nF
VDD pin bypass capacitance
CBP
Ceramic capacitance to set between VDD and
GND pin
0.1
-
1.0
µF
Operating ambient temperature
Ta
-
-40
+25
+85
°C
WARNING:
The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the
device's electrical characteristics are warranted when the device is operated under these conditions.
Any use of semiconductor devices will be under their recommended operating condition.
Operation under any conditions other than these conditions may adversely affect reliability of device and could result in device
failure.
No warranty is made with respect to any use, operating conditions or combinations not represented on this data sheet. If you are
considering application under any conditions other than listed herein, please contact sales representatives beforehand.
Document Number: 002-08397 Rev. *A Page 7 of 40
MB39C602
6. Electrical Characteristics
(Ta = +25°C, VVDD = 12 V)
Parameter
Symbol
Pin
No.
Condition
Value
Unit
Min
Typ
Max
VDD and VCG
SUPPLY
VCG voltage (Operating)
VCG (OPERATING)
5
VVDD = 14 V, IVCG = 2.0 mA
13
14
15
V
VCG voltage (Disable)
VCG (DISABLED)
5
VOTC = 0 V, IVCG = 26 μA
15
16
17
V
VCG voltage difference
ΔVCG
5
VCG (DISABLED) -
VCG (OPERATING)
1.75
2.00
2.15
V
VCG Shunt input current
IVCG (SREG)
5
VVCG = VCG (DISABLED) - 100 mV,
VOTC = 0 V
-
12
26
μA
VCG Shunt Load Regulation
ΔVCG (SREG)
5
VOTC = 0V,
26 μA < IVCG ≤ 5 mA
-
125
200
mV
VCG LDO regulation voltage
VCG (LREG)
5
VVDD = 20 V, IVCG = -2 mA
-
13
-
V
VCG LDO Dropout voltage
VCG (LREG, DO)
-
VDD - VCG, VVDD = 11 V,
IVCG = -2 mA
-
2.0
2.8
V
UVLO Turn-on threshold
voltage
VDD (ON)
8
-
9.7
10.2
10.7
V
UVLO Turn-off threshold
voltage
VDD (OFF)
8
-
7.55
8.00
8.50
V
UVLO hysteresis
ΔVDD (UVLO)
8
VDD (ON) - VDD (OFF)
1.9
2.2
2.5
V
VDD switch on-resistance
RDS, ON (VDD)
6,8
VVCG = 12 V, VVDD = 7 V,
IDRN = 50 mA
-
4[1]
10[1]
Ω
Fault Latch Reset VDD
voltage
VDD (FAULT RESET)
8
-
5.6
6.0
6.4
V
MODULATION
Minimum switching period
tSW (HF)
6
IFC = 5 μA
7.215
7.760
8.305
μs
Maximum switching period
tSW (LF)
6
IFC = 165 μA
31.5[1]
35.0[1]
38.5[1]
μs
DRN peak current
IDRN (peak)
6
IFC = 5 μA, ICL = 100 μA
-
3[1]
-
A
6
IFC = 5 μA, ICL = 30 μA
-
1[1]
-
A
Minimum peak current for RCL
open
IDRN (peak, absmin)
6
RCL = OPEN
-
0.45[1]
-
A
ILIM blanking time
tBLANK (ILIM)
6
IFC = 5 μA, RCL = 100 kΩ,
1.2 A pull-up on DRN
-
400[1]
-
ns
CL voltage
VCL
3
IFC = 5 μA
2.94
3.00
3.06
V
FC voltage
VFC
1
IFC = 10 μA
0.34
0.70
0.84
V
DRIVER
Driver on-resistance
RDS (on) (DRN)
6,7
IDRN = 4.0 A
-
200[1]
400[1]
mΩ
Driver off leakage current
IDRN (OFF)
6,7
VDRN = 12 V
-
1.5
20.0
μA
High-side driver on-resistance
RDS (on) (HSDRV)
5,6
High-side driver
current = 50 mA
-
6[1]
11[1]
Ω
DRN discharge current
IDIS
6,7
VDD = OPEN, DRN = 12 V,
Fault latch set
2.38
3.40
4.42
mA
Document Number: 002-08397 Rev. *A Page 8 of 40
MB39C602
Parameter
Symbol
Pin
No.
Condition
Value
Unit
Min
Typ
Max
TRANSFORMER
ZERO
CURRENT
DETECTION
Zero current threshold voltage
VZCD (TH)
2
-
5[1]
20[1]
50[1]
mV
Clamp voltage
VZCD (CLAMP)
2
IZCD = -10 μA
-200
-160
-100
mV
Start timer operation threshold
voltage
VZCD (START)
2
-
0.10
0.15
0.20
V
Driver turn-on Delay time
tDLY (ZCD)
6
150 Ω pull-up 12 V on DRN
-
150
-
ns
Wait time for zero current
detection
tWAIT (ZCD)
6
-
2.0
2.4
2.8
μs
Start timer period
tST
6
VZCD = 0 V
150
240
300
μs
OVERVOLTAGE
FAULT
OVP threshold voltage
VZCD (OVP)
2
-
4.85
5.00
5.15
V
OVP blanking time
tBLANK, OVP
6
-
0.6
1.0
1.7
μs
Input bias current
IZCD (bias)
2
VZCD = 5 V
-0.1
0
+0.1
μA
SHUTDOWN
THRESHOLD
Shutdown Threshold voltage
VOTC (Vth)
4
OTC =
0.7
1.0
1.3
V
Shutdown OTC current
IOTC, PU
4
VOTC = VOTC (vth)
-600
-450
-300
μA
MAXIMUM ON
TIME
ON-Time
tOTC
6
ROTC = 76 kΩ
3.4
3.8
4.2
μs
OTC voltage
VOTC
4
-
2.7
3.0
3.3
V
OTP
Shutdown temperature
TSD
-
Tj, temperature rising
-
+150[1]
-
°C
Hysteresis
TSD_HYS
-
Tj, temperature falling,
degrees below TSD
-
+25[1]
-
°C
POWER
SUPPLY
CURRENT
Power supply current
IVDD (STATIC)
8
VVDD = 20 V, VZCD = 1 V
1.36
1.80
2.34
mA
IVDD (OPERATING)
8
VVDD = 20 V
-
3.0[1]
3.7[1]
mA
Power supply current for
UVLO
IVDD (UVLO)
8
VVDD = VDD (ON) – 100 mV
-
285
500
uA
[1]: Standard design value
Document Number: 002-08397 Rev. *A Page 9 of 40
MB39C602
7. Typical Characteristics
Power supply current vs. VDD
Power supply current vs. Ta
Switching frequency vs. IFB
DRN peak current vs. Ta
DRN peak current vs. IPCL
ON time vs. ROTM
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
810 12 14 16 18 20
VDD [V]
IDD [mA]
VDD; decreasing from 20 V
VCG=OPEN
IFB=5μA
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
-40
-35
-30
-25
-20
-15
-10-5 0+5
+10
+15
+20
+25
+30
+35
+40
+45
+50
+55
+60
+65
+70
+75
+80
+85
Ta [°C]
IDD+ICG [mA]
VDD=12V
VCG=12V
IFB=5μA
0
20
40
60
80
100
120
140
160
050 100 150 200
IFB [μA]
fSW [kHz]
Ta=-40°C
Ta=25°C
Ta=85°C
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
IDRN(peak) at RPCL=33.2kΩ[A]
Ta [°C]
-40
-35
-30
-25
-20
-15
-10-5 0+5
+10
+15
+20
+25
+30
+35
+40
+45
+50
+55
+60
+65
+70
+75
+80
+85
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
020 40 60 80 100
IPCL [μA]
IDRN(peak) [A]
n=30
0
1
2
3
4
5
6
010 20 30 40 50 60 70 80 90 100110120
ROTM [kΩ]
tOTM [μs]
Ta=-40°C
Ta=+25°C
Ta=+85°C
Document Number: 002-08397 Rev. *A Page 10 of 40
MB39C602
Driver ON resistance vs. Ta
High-side Driver ON resistance vs. Ta
Power dissipation vs. Ta
Power dissipation [mW]
0
50
100
150
200
250
300
350
400
Ta [°C]
RDS(on)(DRN) [mΩ]
-40
-35
-30
-25
-20
-15
-10-5 0+5
+10
+15
+20
+25
+30
+35
+40
+45
+50
+55
+60
+65
+70
+75
+80
+85
0
1
2
3
4
5
6
7
8
9
10
11
12
RDS(on)(HSDRN) [Ω]
-40
-35-30
-25-20
-15
-10-5 0+5+10
+15
+20
+25
+30
+35
+40
+45
+50
+55
+60
+65
+70
+75
+80
+85
Ta [°C]
0
100
200
300
400
500
600
700
800
900
1000
-50 -40 -30 -20 -10 0 +10+20+30+40+50+60+70+80+90+100
Ta[°C]
Document Number: 002-08397 Rev. *A Page 11 of 40
MB39C602
8. Function Explanation
1. LED Current Control Function
MB39C602 is a flyback type switching regulator controller. The LED current is regulated by controlling the switching on-time
depending on the LED load.The LED current is converted into detecting voltage (Vs) by sense resistor (Rs) connected in series
with LED. Vs is compared by an external error amplifier (Err AMP).When Vs falls below a reference voltage, Err AMP output
rises and the current that flows into the Opto-Coupler is decreased.
The OTC pin current is controlled via the Opto-Coupler in the on-time control block. In on-time control, it controls on-time at
OTC pin current. So, on-time increases when the current of the OTC pin decreases. And the average current supplied to LED is
regulated, because on-time is regulated at the constant switching frequency.
2. Cascode Switching
The switch in Primary Winding is a cascode connection.The gate of external MOSFET is connected with the VCG pin, and the
source is connected with the drain of internal Driver MOSFET. When the swich is on-state, internal Driver MOSFET is turned on,
HS Driver MOSFET is turned off, and the source voltage of external MOSFET goes down to GND. For this period the DC bias is
supplied to the gate of external MOSFET from the VCG pin. Therefore external MOSFET is turned on.
When the switch is off-state, internal Driver MOSFET is turned off, HS Driver MOSFET is turned on, and the source voltage of
external MOSFET goes up to VCG voltage. For this period the DC bias is supplied to the gate of external MOSFET from the
VCG pin. Therefore external MOSFET is turned off. Moreover, the current flowing into internal Driver MOSFET is equal to the
current of Primary Winding. Therefore, the peak current into Primary Winding can be detected without the sense resistor.
3. Natural PFC (Power Factor Correction) Function
In the AC voltage input, when the input current waveform is brought close to the sine-wave, and the phase difference is brought
close to Zero, Power Factor is improved. In the flyback method operating in discontinuous conduction mode, when the input
capacitance is set small, the input current almost becomes equal with peak current (IPEAK) of Primary Winding.
VBULK : Supply voltage of Primary Winding
LMP : Inductance of Primary Winding
tON : On-time
In on-time control, if loop response of Error Amp. is set to lower than the AC frequency (below 1/10 of the AC frequency),
on-time can be constant. Therefore, input current is proportional to input voltage, so Power Factor is regulated.
ON
MP
BULK
MP
BULK
PEAK
t
L
V
L
V
I = =
ON
t
×
Document Number: 002-08397 Rev. *A Page 12 of 40
MB39C602
4. Power-Up Sequencing
When the voltage is input to VBULK, the electric charge is charged to capacitance of the VCG pin (CVCG) through starting
resistor (Rst). So, the voltage of the VCG pin rises. The voltage of the DRN pin rises by source follower when the voltage of the
VCG pin reaches the threshold voltage of the external HVMOSFET.
The DRN pin is connected with the VDD pin through the internal VDD Switch, and VDD capacitor (CVDD) is charged from the
DRN pin. When the voltage at the VDD pin reaches the threshold voltage of UVLO, the VDD Switch is turned off, and the
internal Bias circuit operates, and the switching is started.
After the switching begins, the voltage at the VDD pin is supplied from Auxiliary Winding through the external diode (DBIAS).
The voltage of an Auxiliary Winding is decided by rolling number ratio of Auxiliary Winding and Secondary Winding, and the
voltage of Secondary Winding. Therefore, the voltage at the VDD pin is not supplied, until the voltage of Auxiliary Winding rises
more than the voltage at the VDD pin. In this period, it is necessary to set the capacitor of the VDD pin to prevent the voltage of
the VDD pin from falling below the threshold voltage of UVLO.
The external Schottky diode (D1) is required between the DRN pin and VDD pin. This diode is used to prevent the current that
flows through the body diode of the VDD Switch.
Current Passing When Starting
10V/8V
VCG
Shunt
Enable
PWM
14V
2V
UVLO DRN
6
VCG 5
Fault
8
VDD
VDD
Switch HS
Drive
Driver GND
7
PWM
Control
D1
DBIAS
CVDD
Rst
CVCG
VBULK
VDD Start-up Current
VDD Operating andLPMCurrent
HV-MOSFET
Primary
Winding
Auxiliary
Winding
Ist
Document Number: 002-08397 Rev. *A Page 13 of 40
MB39C602
Power-Up Sequencing
5. Power Down Sequencing
When AC power is removed from the AC line, the current does not flow to Secondary Winding even if HV MOSFET is switching.
The LED current is supplied from the output capacitance and decreases gradually. Similarly, the voltage at the VDD pin
decreases because the current does not flow into Auxiliary Winding. The switching stops and MB39C602 becomes shutdown
when the voltage at the VDD pin falls below the threshold voltage of UVLO.
Power Down Sequencing
UVLO threshold
UVLO threshold
UVLO threshold 8V
Document Number: 002-08397 Rev. *A Page 14 of 40
MB39C602
6. OTC Part
It is set on-time by connecting resistance (ROTC) with OTC pin.
As shown in following figure, the on-time can be controlled by connecting the collector of the Opto-Coupler through
resistor from OTC.
OTC pin Control
The following figure shows how the on-time is programmed over the range of between 1.5 μs and 5.0 μs for either range of
programming resistors. On-time is related to the programmed resistor based on the following equations.
ROTC = tOTC × (2 × 1010 [
Ω
] )
S
On-time Setting Range
ROTC - Constant On-Time Resistance [kΩ]
Moreover, it can be shutted down by making the voltage of the OTC pin below "VOTC (Vth) (typ 1V)".
On-Time Modulation
Fault Timing
and Control Fault
VGATE
OTC
ROTC
4
3V
IOTC
1V Shutdown
and Restart Thermal
Shutdown
UVLO
Fault Latch
Reset
tOTC - Constant On-Time [μs]
Document Number: 002-08397 Rev. *A Page 15 of 40
MB39C602
7. CL Part
It is set the peak current of Primary Winding by connecting resistance with CL pin.
The maximum peak current of Primary Side is set by connecting resistance (RCL) between the CL pin and GND.
IDRN(pk) = (
100kV
)
RCL
An about 400 ns blanking time of the beginning of switching cycle is masking the spike noise. As a result, it prevents the
sense of current from malfunctioning (See the figure below.).
Peak Current Control with CL pin
Driver
VGATE
DRN
6
GND
7
CL
RCL
3V
3
Current
Sense
IDRN
ICL
tBLANKCL
From
High-Voltage
MOSFET Source
Document Number: 002-08397 Rev. *A Page 16 of 40
MB39C602
8. FC Part
The switching frequency is controlled by setting the current of the FC pin. In on-time control, the switching frequency is set by
pulling up the FC pin to VDD.
Switching frequency range is from 30 kHz to 120 kHz.
Switching Frequency Range
IFC-fSW Control Current [μA]
tSW (max) - Max Switching
Frequency [kHz]
Document Number: 002-08397 Rev. *A Page 17 of 40
MB39C602
9. ZCD Part
MB39C602 requires the following two conditions in order to start the next switching cycle.
(1) The time since the last turn-on edge must be equal to or longer than the switching time set by IFC.
(2) Immediately after zero current detection at ZCD pin. Or, the time since the last zero current detection must be longer
than tWAIT (ZCD) (2.4 μs or less).
The ZCD pin is connected with Auxiliary Winding of the transformer through the resistance division, and detects zero
current as shown below.
A delay, 50 ns to 200 ns, can be added with CZCD to adjust the turn-on of the primary switch with the resonant bottom of
Primarty Winding waveform.
Switching Waveform at detecting zero current
ZCD pin Connection
CZCD
1
ZCD 2
RZCD2
RZCD1
NB
NPNS
5V
OV
Fault
20mV
Zero Current
Detect
Fault Timing
and Control
Document Number: 002-08397 Rev. *A Page 18 of 40
MB39C602
9. Various Protection Circuits
Under voltage lockout protection (UVLO)
The under voltage lockout protection (UVLO) protects IC from malfunction and protects the system from destruction/deterioration
during the transient state and momentary drop due to start up for the power supply pin voltage (VDD). The voltage decrease of
the VDD pin is detected with comparator, and output HS DRIVER is turned off and output DRIVER is turned off, and the switching
is stopped. The system returns if the VDD pin becomes more than the threshold voltage of the UVLO circuit.
Output over voltage Proteciton (OVP)
When LED is in the state of open and the output voltage rises too much, the voltage of Auxiliary Winding and the voltage of the
ZCD pin rise. The over voltage is detected by sampling this voltage of the ZCD pin.
When ZCD pin voltage rises more than the threshold voltage of OVP, the over voltage is detected. Output HS DRIVER is turned
off, and output DRIVER is turned off, and the switching is stopped. (latch-off)
If the VDD pin becomes below the voltage of Fault Latch Reset, OVP is released.
Over temperature protection (OTP)
The over temperature protection (OTP) is a function to protect IC from the thermal destruction. When the junction temperature
reaches +150°C, output HS DRIVER is turn off, and output DRIVER is turned off, and the switching is stopped. It returns again
when the junction temperature falls to +125°C (automatic recovery).
Document Number: 002-08397 Rev. *A Page 19 of 40
MB39C602
10. Various Function Tables
Function
DRN
Detection
Condition at
Protected
Operation
Return
Condition
Remarks
LS_DRV
HS_DRV
VDD SW
Discharge
SW
Normal Operation
OFF
OFF
-
-
-
Under Voltage Lockout
Protection (UVLO)
OFF
OFF
ON
OFF
VDD < 8.0 V
VDD > 10.2 V
Standby
OTC
Shutdown
OFF
OFF
ON
OFF
OTC = GND
OTC > 1 V
Standby
Output Over Voltage
Protection (OVP)
OFF
OFF
ON
ON
ZCD > 5 V
VDD < 6 V →
VDD > 10.2 V
Latch-off
Over Temperature Protection
(OTP)
OFF
OFF
ON
OFF
Tj > +150°C
Tj < +125°C
-
Document Number: 002-08397 Rev. *A Page 20 of 40
MB39C602
11. I/O Pin Equivalent Circuit Diagram
Pin No.
Pin
Name
Equivalent Circuit Diagram
1
FC
2
ZCD
3
CL
Document Number: 002-08397 Rev. *A Page 21 of 40
MB39C602
Pin No.
Pin
Name
Equivalent Circuit Diagram
4
OTC
5
VCG
6
DRN
Document Number: 002-08397 Rev. *A Page 22 of 40
MB39C602
12. Example Application Circuit
1. Isolation circuit
AC1
AC2
+
-
1
2
3
4
D4
R11
R14
C15
R15 R18R13
R12
C10
C3 C4 C5 ＋
R1
R31
1
1
1
T1
Q1
R16
1
D3
1
U2
M1
2D5
R29
D8 C16
2
LED_OUTp
C6 C7 C8 ＋
R19
2
LED_OUTn
R35
R24
C19
2
C13
R23
R33
C17 R32
R30
C18
2
IC5
1
2
3
4
5
7
8
9
10
MB39C602
4
3
2
1
OTC
CL
ZCD
FC VDD
VCG
GND
DRN
5
6
7
8
C3
R40
AC1
AC2
F1
VR1
BR1
C2
T2
1
4
2
3
1R2
C2
R4 D1
C4
R17
R26
Document Number: 002-08397 Rev. *A Page 23 of 40
MB39C602
2. Non-isolation circuit
AC1
AC2
+
-
1
2
3
4
D5
R7
R6
R9 R10
C5R8
C6 C7 C8
R3
1
T1
Q1
R5
D4
M1
LED_OUTp
C4 LED_OUTn
MB39C602
4
3
2
1
OTC
CL
ZCD
FC VDD
VCG
GND
DRN
5
6
7
8
C9
L1
D1
AC1
AC2
F1
R2
R4
R1
D6
D3
1
2
3
4
6
5
7
+
+
+
+
C1
D7
D9 D8
C2
C3
D2
Document Number: 002-08397 Rev. *A Page 24 of 40
MB39C602
Part list
1. Isolation circuit
No
Component
Description
Part No.
Vendor
1
M1
IC PWM CTRLR CASCODE 8-SOIC
MB39C602
Cypress
2
T1
TRANSFORMER FLYBACK EE20/10/6
430 μH 1.6 A RATIO Np/Ns=2.91/1 Np/Na=6.4/1
750811146
Wurth
3
T2
IND COMMON MODE CHOKE 40 mH
750311650
Wurth
4
F1
Fuse, axial, fast acting, 2.5 A, 250 V, 0.160 × 0.400 inch
026302.5MXL
Littelfuse Inc
5
IC5
IC OPAMP GP R-R 1MHz SGL SOT23-5
LMV321IDBVR
Texas Instruments
6
Q1
MOSFET N-ch 650 V 7.3 A TO-220 FP
SPA07N60C3
Infineon
7
U2
OPTO ISOLATOR TRANSISTOR OUTPUT
PS2561L-1-A
CEL
8
BR1
IC RECT BRIDGE 0.5 A 600 V 4SOIC
MB6S
Fairchild
9
D1
DIODE ULTRA FAST 800 V 1 A SMA
RS1K-13-F
Diodes
10
D3
DIODE ULTRA FAST 200 V SOT-23
MMBD1404
Fairchild
11
D4
DIODE ZENER 18 V 225 mW SOT-23
BZX84C18LT1G
On Semi
12
D5
DIODE GPP FAST 1 A 600 V DO-41
UF4005
Fairchild
13
D8
SHUNT REGULATOR 5.0 V SOT-23
LM4040C50IDBZT
Texas Instruments
14
VR1
SUR ABSORBER 7 mm 430 V 1250 A ZNR
ERZ-V07D431
Panasonic
15
C2
CAP CER 15000 pF 250 V X7R 1206
GRM31BR72E153KW01L
muRata
16
C3
CAP CER 10000 pF 50 V X7R 0603
GRM188R71H103KA01D
muRata
17
C4
CAP CER .1 μF 25 V X7R 10% 0603
GRM188R71E104KA01D
muRata
18
C5
CAP 100 μF 25 V ELECT RADIAL 2.5 mm
EKMG250ELL101MF11D
Nippon Chemi-con
19
C6, C7
CAP CER 2.2 μF 100 V X7R 1210
GRM32ER72A225KA35
muRata
20
C8
CAP 1000 μF 50 V ELECT HE RADIAL
EKMG500ELL102MK25S
Nippon Chemi-con
21
C9
CAP .022 μF/630 VDC METAL POLY
ECQE6223KF
Panasonic
22
C10, C15, C17,
C18, C19
CAP CER 10000 pF 50 V X7R 0603
GRM188R71H103KA01D
muRata
23
C11
CAP CER 2.2 nF X1/Y1 RADIAL
DE1E3KX222MA4BL01
muRata
24
C13
CAP CER 0.33 μF 16 V X7R 0603
C0603C334K4RACTU
Kemet
25
C16
CAP CER .1 μF 25 V 0805
GRM21BR71E104KA0
muRata
26
C21
CAP .022 μF/305 VAC X2 METAL POLYPRO
B32921C3223M
Epcos
27
R1, R2, R31
RES 560 kΩ 1/4W 1% 1206 SMD
RK73H2BTTD5603F
KOA
28
R4
RES 75.0 kΩ 1/4 W 1% 1206 SMD
RK73H2BTTD7502F
KOA
29
R11
RES 110 kΩ, 1/8 W, 1%, 0603 SMD
RK73H1JTTD1103F
KOA
30
R12
RES 33 kΩ 1/10 W 1% 0603 SMD
RK73H1JTTD3302F
KOA
Document Number: 002-08397 Rev. *A Page 25 of 40
MB39C602
No
Component
Description
Part No.
Vendor
31
R13
RES 39 kΩ 1/10 W 1% 0603 SMD
RK73H1JTTD3902F
KOA
32
R14, R30
RES 620 kΩ 1/10 W 1% 0603 SMD
RK73H1JTTD6203F
KOA
33
R15
RES 100 kΩ 1/10 W 1% 0603 SMD
RK73H1JTTD1003F
KOA
34
R16
RES 5.1 Ω 1/10 W 1% 0603 SMD
RK73H1JTTD5R10F
KOA
35
R17
RES 3 Ω 1/8 W 1% 0805 SMD
RK73H2ATTD3R00F
KOA
36
R18
RES 10.0 kΩ 1/10 W 1% 0603 SMD
RK73H1JTTD1002F
KOA
37
R19
RES .33 Ω 1/4 W 1% 1206 SMD
ERJ-8RQFR33V
Panasonic
38
R23
RES 20 kΩ 1/10 W 1% 0603 SMD
RK73H1JTTD2002F
KOA
39
R24, R35
RES 3 kΩ 1/10 W 1% 0603 SMD
RK73H1JTTD3001F
KOA
40
R33
RES 1.00 MΩ 1/10 W 1% 0603 SMD
RK73H1JTTD1004F
KOA
41
R26
RES 2.00 kΩ 1/10 W 1% 0603 SMD
RK73H1JTTD2001F
KOA
42
R29
RES 12 kΩ 1/10 W 1% 0603 SMD
RK73H1JTTD1202F
KOA
43
R32
RES 18 kΩ 1/10 W 1% 0603 SMD
RK73H1JTTD1802F
KOA
44
R40
JUMPER (RES 0.0 Ω 1210)
RK73Z2E
KOA
Wurth : Adolf Wurth GmbH & Co. KG
Texas Instruments : Texas Instruments, Inc
Infineon : Infineon Technologies AG
CEL : California Eastern Laboratories, Inc
Fairchild : Fairchild Semiconductor International, lnc.
Diodes : Diodes, Inc
On Semi : ON Semiconductor
Panasonic : Panasonic Corporation
muRata : Murata Manufacturing Co., Ltd.
Nippon Chemi-con : Nippon Chemi-Con Corporation
Kemet : KEMET Electronics Corporation
Epcos : EPCOS AG
KOA : KOA Corporation
Document Number: 002-08397 Rev. *A Page 26 of 40
MB39C602
2. Non-isolation circuit
No
Component
Description
Part No.
Vendor
1
IC
Driver IC for LED Lighting, SOL8
MB39C602
Cypress
2
C1
Capacitor, alumninum electrolytic, 47 μF, 250 V, 12.5 × 20
EKXG251ELL470MK20S
Nippon Chemi-con
3
C2
4
C3
Capacitor, ceramic, 10 μF, 50 V, X7R, +/-10%, 1210
GRM32DF51H106ZA01L
muRata
5
C4
Capacitor, alumninum electrolytic, 100 μF, 50 V, 8 × 11.5
EKMG500ELL101MHB5D
Nippon Chemi-con
6
C5, C6
Capacitor, ceramic, 0.01 μF, 50 V, X7R, +/-10%, 0603
GRM188R71H103KA01D
muRata
7
C7
Capacitor, ceramic, 0.1 μF, 25 V, X7R, +/-10%, 0603
GRM188R71E104KA01D
muRata
8
C8
Capacitor, alumninum electrolytic, 100 μF, 25 V, 6.3 × 11
EKMG250ELL101MF11D
Nippon Chemi-con
9
C9
Capacitor,polyester film, 0.22 μF, 250 V, 12 × 5.5 × 10.5
ECQ-E2224KF
Panasonic
10
D1
Diode, bridge rectifier, 0.5 A, 600 V, SO-4
MB6S
Fairchild
11
D2
Diode, ultra fast rectifier, 1 A, 400 V, SMA
ES1G
Fairchild
12
D3
Diode, Schottky, 1 A, 30 V, SOD-323
SDM100K30
Diodes
13
D4
Diode, ultra fast, 1 A, 200 V, SMA
CSFA103-G
On Semi
14
D5
Diode, Zener, 18 V, 500 mW, SOD-123
MMSZ18T1G
On Semi
15
D6, D7
Jumper
RK73ZW2H
KOA
16
D8, D9
17
F1
Fuse, axial, fast acting, 2.5 A, 250 V, 0.160 inch × 0.400
inch
026302.5MXL
Littelfuse Inc
18
L1
Inductor, 100 μH, 0.67 A max, 0.39 Ω max
22R104C
muRata Ps
19
T1
Coupling inductor, 280 μH, 1.4 A, Na/Nm=0.6
EI-191-03377-T
SUMIDA
20
Q1
MOSFET, N-ch, 650 V, 7.3 A, 0.6 W, TO-220
FDPF10N60NZ
Fairchild
21
R1
NTC thermistor, 8.0 Ω, 1.5 A
NTPA78R0LBMBO
muRata
22
R2, R3
Resistor, chip, 1.00 MΩ, 1/8 W, +/-1%, 0805
RK73H2ATTD1004F
KOA
23
R4
Resistor, chip, 3.0 Ω, 1/8 W, +/-1%, 0805
RK73H2ATTD3R00F
KOA
24
R5
Resistor, chip, 5.1 Ω, 1/10 W, +/-1%, 0603
RK73H1JTTD5R10F
KOA
25
R6
Resistor, chip, 1.00 MΩ, 1/10 W, +/-1%, 0603
RK73H1JTTD1004F
KOA
26
R7
Resistor, chip, 110 kΩ, 1/10 W, +/-1%, 0603
RK73H1JTTD1103F
KOA
27
R8
Resistor, chip, 33 kΩ, 1/10 W, +/-1%, 0603
RK73H1JTTD3302F
KOA
28
R9
Resistor, chip, 91 kΩ, 1/10 W, +/-1%, 0603
RK73H1JTTD9102F
KOA
29
R10
Resistor, chip, 100 kΩ, 1/10 W, +/-1%, 0603
RK73H1JTTD1003F
KOA
Nippon Chemi-con : Nippon Chemi-Con Corporation
muRata : Murata Manufacturing Co., Ltd.
Panasonic : Panasonic Corporation
Fairchild : Fairchild Semiconductor International, lnc.
Diodes : Diodes, Inc
On Semi : ON Semiconductor
KOA : KOA Corporation
muRata Ps : Murata Power Solutions, Inc
SUMIDA : SUMIDA CORPORATION.
Document Number: 002-08397 Rev. *A Page 27 of 40
MB39C602
13. Reference Data
1. Isolation circuit
Efficiency vs. AC power supply voltage
Power factor vs. AC power supply voltage
Conversion efficiency η[%]
Power factor PF
AC power supply voltage Vac [Vrms]
AC power supply voltage Vac [Vrms]
Line Regulation
Load Regulation
Output Current ILED [mA]
Output Current ILED [mA]
AC power supply voltage Vac [Vrms]
Output voltage VLED[V]
60%
65%
70%
75%
80%
85%
90%
95%
100%
80 120 160 200 240
60Hz
50Hz
LED; 9 pcs in series
0.95
0.96
0.97
0.98
0.99
1.00
80 120 160 200 240
60Hz
50Hz
LED; 9 pcs in series
350
360
370
380
390
400
410
420
430
440
450
80 120 160 200 240
60Hz
50Hz
LED; 9 pcs in series
350
360
370
380
390
400
410
420
430
440
450
20 25 30 35
100V/60Hz
220V/50Hz
VIN=100VRMS, 220VRMS
LED ; 7- 11 pieces in series
Document Number: 002-08397 Rev. *A Page 28 of 40
MB39C602
VIN=100VRMS, 60 Hz, LED; 9 pcs in series
I/O waveform
Switching waveform
Startup waveform
Stop waveform
LED Open waveform
Document Number: 002-08397 Rev. *A Page 29 of 40
MB39C602
VIN =220VRMS, 50 Hz, LED; 9 pcs in series
I/O waveform
Switching waveform
Startup waveform
Stop waveform
LED Open waveform
Document Number: 002-08397 Rev. *A Page 30 of 40
MB39C602
2. Non-isolation circuit
Efficiency vs. AC power supply voltage
Power factor vs. AC power supply voltage
Conversion efficiency η[%]
Power factor PF
AC power supply voltage Vac [Vrms]
AC power supply voltage Vac [Vrms]
Line Regulation
Load Regulation
Output Current ILED [mA]
Output Current ILED [mA]
AC power supply voltage Vac [Vrms]
Output voltage VLED[V]
60%
65%
70%
75%
80%
85%
90%
95%
100%
85 95 105 115 125 135 145
60Hz
50Hz
LED; 9 pcs in series
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
85 95 105 115 125 135 145
60Hz
50Hz
LED; 9 pcs in series
450
470
490
510
530
550
570
590
610
630
650
85 95 105 115 125 135 145
60Hz
50Hz
LED; 9 pcs in series
450
470
490
510
530
550
570
590
610
630
650
20 25 30 35
60Hz
50Hz
VIN=100VRMS
LED ; 7- 11 pieces in series
Document Number: 002-08397 Rev. *A Page 31 of 40
MB39C602
VIN=AC100VRMS, fac=60 Hz, LED; 9 pieces in series
I/O waveform
Switching waveform
Startup waveform
Stop waveform
LED Open waveform
Document Number: 002-08397 Rev. *A Page 32 of 40
MB39C602
14. Usage Precaution
Do not configure the IC over the maximum ratings.
If the IC is used over the maximum ratings, the LSI may be permanently damaged.
It is preferable for the device to normally operate within the recommended usage conditions. Usage outside of these conditions can
have an adverse effect on the reliability of the LSI.
Use the device within the recommended operating conditions.
The recommended values guarantee the normal LSI operation under the recommended operating conditions.
The electrical ratings are guaranteed when the device is used within the recommended operating conditions and under the
conditions stated for each item.
Printed circuit board ground lines should be set up with consideration for common impedance.
Take appropriate measures against static electricity.
Containers for semiconductor materials should have anti-static protection or be made of conductive material.
After mounting, printed circuit boards should be stored and shipped in conductive bags or containers.
Work platforms, tools, and instruments should be properly grounded.
Working personnel should be grounded with resistance of 250 kΩ to 1 MΩ in serial between body and ground.
Do not apply negative voltages.
The use of negative voltages below - 0.3 V may make the parasitic transistor activated to the LSI, and can cause malfunctions.
Document Number: 002-08397 Rev. *A Page 33 of 40
MB39C602
15. Ordering Information
Part number
Package
Remarks
MB39C602PNF
8-pin plastic SOP
(FPT-8P-M02)
16. RoHS Compliance Information Of Lead (Pb) Free Version
The LSI products of Cypress with “E1” are compliant with RoHS Directive, and have observed the standard of lead, cadmium,
mercury, Hexavalent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl ethers (PBDE). A product whose part
number has trailing characters “E1” is RoHS compliant.
17. Marking Format (Lead Free Version)
C602
E1XXXX
XXX
INDEX
Lead-free version
Document Number: 002-08397 Rev. *A Page 34 of 40
MB39C602
18. Labeling Sample (Lead free Version)
Lead-free mark
JEITA logo
JEDEC logo
The part number of a lead-free product has
the trailing characters "E1".
"ASSEMBLED IN CHINA" is printed on the label
of a product assembled in China.
Document Number: 002-08397 Rev. *A Page 35 of 40
MB39C602
19. MB39C602PNF Recommended Conditions of Moisture Sensitivity Level
[Cypress Recommended Mounting Conditions]
Recommended Reflow Condition
Item
Condition
Mounting Method
IR (infrared reflow), warm air reflow
Mounting times
2 times
Storage period
Before opening
Please use it within two years after manufacture.
From opening to the 2nd reflow
Less than 8 days
When the storage period after
opening was exceeded
Please process within 8 days
after baking (125°C ±3°C, 24H+ 2H/─0H) .
Baking can be performed up to two times.
Storage conditions
5°C to 30°C, 70% RH or less (the lowest possible humidity)
[Mounting Conditions]
1. Reflow Profile
2. JEDEC Condition: Moisture Sensitivity Level 3 (IPC/JEDEC J-STD-020D)
260°C
(e)
(d')
(d)
255°C
170 °C
190 °C
RT (b)
(a)
(c)
to
Main heating
"H" rank : 260°C Max
(a) Temperature Increase gradient : Average 1°C/s to 4°C /s
(b) Preliminary heating : Temperature 170°C to 190°C, 60 s to 180 s
(c) Temperature Increase gradient : Average 1°C /s to 4°C /s
(d) Peak temperature : Temperature 260°C Max; 255°C or more, 10 s or less
(d') Main Heating : Temperature 230°C or more, 40 s or less
or
Temperature 225°C or more, 60 s or less
or
Temperature 220°C or more, 80 s or less
(e) Cooling : Natural cooling or forced cooling
Note: Temperature : the top of the package body.
Document Number: 002-08397 Rev. *A Page 36 of 40
MB39C602
3. Recommended manual soldering (partial heating method)
Item
Condition
Storage period
Before opening
Within two years after manufacture
Between opening and mounting
Within two years after manufacture
(No need to control moisture during the storage period because
of the partial heating method.)
Storage conditions
5°C to 30°C, 70% RH or less (the lowest possible humidity)
Mounting conditions
Temperature at the tip of a soldering iron: 400°C Max
Time: Five seconds or below per pin[1]
[1]: Make sure that the tip of a soldering iron does not come in contact with the package body.
4. Recommended dip soldering
Item
Condition
Mounting times
1 time
Storage period
Before opening
Please use it within two years after manufacture.
From opening and mounting
Less than 14 days
When the storage period after
opening was exceeded
Please process within 14 days
after baking (125°C ±3°C, 24H+ 2H/─0H) .
Baking can be performed up to two times.
Storage conditions
5°C to 30°C, 70% RH or less (the lowest possible humidity)
Mounting condition
Temperature at soldering tub: 260°C Max
Time: Five seconds or below
Document Number: 002-08397 Rev. *A Page 37 of 40
MB39C602
20. Package Dimensions
Document Number: 002-08397 Rev. *A Page 38 of 40
MB39C602
21. Major Changes
Spansion Publication Number: MB39C602_DS405-00010
Page
Section
Change Results
Revision 1.0 [December, 2012]
-
-
Initial release
Revision 2.0 [July, 2013]
5
RECOMMENDED OPERATING
CONDITIONS
Revised the minimam value of symbol "ROTC".
25 → 10
8, 9
TYPICAL CHARACTERISTICS
Added "TYPICAL CHARACTERISTICS".
21 to 25
EXAMPLE APPLICATION CIRCUIT
Added "EXAMPLE APPLICATION CIRCUIT".
26 to 30
REFERENCE DATA
Added "REFERENCE DATA".
Revision 2.1 [January 31, 2014]
-
-
Company name and layout design change
NOTE: Please see “Document History” about later revised information.
Document Number: 002-08397 Rev. *A Page 39 of 40
MB39C602
Document History
Document Title: MB39C602 High Power Factor LED Driver IC for LED Lighting
Document Number: 002-08397
Revision
ECN
Orig. of
Change
Submission
Date
Description of Change
**
−
TAOA
01/31/2014
Migrated to Cypress and assigned document number 002-08397.
No change to document contents or format.
*A
5211073
TAOA
04/13/2016
Updated to Cypress format.
Document Number: 002-08397 Rev. *A April 13, 2016 Page 40 of 40
MB39C602
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the
office closest to you, visit us at Cypress Locations.
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© Cypress Semiconductor Corporation, 2012-2016. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC (“Cypress”). This document,
including any software or firmware included or referenced in this document (“Software”), is owned by Cypress under the intellectual property laws and treaties of the United States and other countries
worldwide. Cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this paragraph, grant any license under its patents, copyrights, trademarks, or
other intellectual property rights. If the Software is not accompanied by a license agreement and you do not otherwise have a written agreement with Cypress governing the use of the Software,
then Cypress hereby grants you under its copyright rights in the Software, a personal, non-exclusive, nontransferable license (without the right to sublicense) (a) for Software provided in source code
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