MC74HCT244ADWR2G - ON Semiconductor

May, 2011 − Rev. 12

1Publication Order Number:

MC74HCT244A/D

MC74HCT244A

Octal 3-State Noninverting

Buffer/Line Driver/

Line Receiver with

LSTTL-Compatible Inputs

High−Performance Silicon−Gate CMOS

The MC74HCT244A is identical in pinout to the LS244. This

device may be used as a level converter for interfacing TTL or NMOS

outputs to High−Speed CMOS inputs. The HCT244A is an octal

noninverting buffer line driver line receiver designed to be used with

3−state memory address drivers, clock drivers, and other bus−oriented

systems. The device has non−inverted outputs and two active−low

output enables.

The HCT244A is the non−inverting version of the HCT240. See

also HCT241.

Features

•Output Drive Capability: 15 LSTTL Loads

•TTL NMOS−Compatible Input Levels

•Outputs Directly Interface to CMOS, NMOS, and TTL

•Operating Voltage Range: 4.5 to 5.5 V

•Low Input Current: 1 mA

•In Compliance with the Requirements Defined by JEDEC Standard

No. 7 A

•Chip Complexity: 112 FETs or 28 Equivalent Gates

•These Devices are Pb−Free and are RoHS Compliant

Figure 1. Logic Diagram

DATA INPUTS

A1

A2

A3

A4

B1

B2

B3

B4 17

15

13

11

8

6

4

218

16

14

12

9

7

5

3YB4

YB3

YB2

YB1

YA4

YA3

YA2

YA1

NONINVERTING

OUTPUTS

PIN 20 = VCC

PIN 10 = GND

OUTPUT

ENABLES

ENABLE A

ENABLE B

1

19

PIN ASSIGNMENT

A3

A2

YB4

A1

ENABLE A

GND

YB1

A4

YB2

YB3 5

4

3

2

1

10

9

8

7

6

14

15

16

17

18

19

20

11

12

13

YA2

B4

YA1

ENABLE B

VCC

B1

YA4

B2

YA3

B3

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SOIC−20W

DW SUFFIX

CASE 751D

TSSOP−20

DT SUFFIX

CASE 948E

SOEIAJ−20

M SUFFIX

CASE 967

1

PDIP−20

N SUFFIX

CASE 738

1

See detailed ordering, shipping, and marking information in

the package dimensions section on page 5 of this data sheet.

ORDERING AND MARKING INFORMATION

FUNCTION TABLE

Inputs Outputs

Enable A,

Enable B A, B YA, YB

LLL

LHH

HXZ

Z = high impedance, X = don’t care

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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

MAXIMUM RATINGS

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎÎÎ

Value

ÎÎÎ

Unit

ÎÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply Voltage (Referenced to GND)

ÎÎÎÎÎÎ

– 0.5 to + 7

ÎÎÎ

V

ÎÎÎÎ

Vin

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Input Voltage (Referenced to GND)

ÎÎÎÎÎÎ

– 0.5 to VCC + 0.5

ÎÎÎ

V

ÎÎÎÎ

Vout

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Output Voltage (Referenced to GND)

ÎÎÎÎÎÎ

– 0.5 to VCC + 0.5

ÎÎÎ

V

ÎÎÎÎ

Iin

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Input Current, per Pin

ÎÎÎÎÎÎ

±20

ÎÎÎ

mA

ÎÎÎÎ

Iout

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Output Current, per Pin

ÎÎÎÎÎÎ

±35

ÎÎÎ

mA

ÎÎÎÎ

ICC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply Current, VCC and GND Pins

ÎÎÎÎÎÎ

± 75

ÎÎÎ

mA

ÎÎÎÎ

PD

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Power Dissipation in Still Air, Plastic DIP†

SOIC Package†

TSSOP Package†

ÎÎÎÎÎÎ

750

500

450

ÎÎÎ

mW

ÎÎÎÎ

Tstg

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Storage Temperature

ÎÎÎÎÎÎ

– 65 to + 150

ÎÎÎ

_C

ÎÎÎÎ

TL

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Lead Temperature, 1 mm from Case for 10 Seconds

(Plastic DIP, SOIC, SSOP or TSSOP Package)

ÎÎÎÎÎÎ

260

ÎÎÎ

_C

†Derating −Plastic DIP: – 10 mW/_C from 65_ to 125_C

−SOIC Package: – 7 mW/_C from 65_ to 125_C

−TSSOP Package: − 6.1 mW/_C from 65_ to 125_C

RECOMMENDED OPERATING CONDITIONS

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎ

Min

ÎÎÎ

Max

ÎÎÎ

Unit

ÎÎÎÎ

VCC

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Supply Voltage (Referenced to GND)

ÎÎÎ

4.5

ÎÎÎ

5.5

ÎÎÎ

V

ÎÎÎÎ

Vin, Vout

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

DC Input Voltage, Output Voltage (Referenced to GND)

ÎÎÎ

0

ÎÎÎ

VCC

ÎÎÎ

V

ÎÎÎÎ

TA

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Operating Temperature, All Package Types

ÎÎÎ

– 55

ÎÎÎ

+ 125

ÎÎÎ

_C

ÎÎÎÎ

tr, tf

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Input Rise and Fall Time (Figure 1)

ÎÎÎ

0

ÎÎÎ

500

ÎÎÎ

ns

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎÎÎÎÎÎ

Test Conditions

ÎÎÎ

VCC

V

ÎÎÎÎÎÎÎÎÎÎ

Guaranteed Limit

ÎÎ

Unit

ÎÎÎÎ

– 55 to

25_C

ÎÎÎÎ

v 85_C

ÎÎÎÎ

v 125_C

ÎÎÎÎ

VIH

ÎÎÎÎÎÎÎÎÎÎ

Minimum High−Level Input Voltage

ÎÎÎÎÎÎÎÎÎ

Vout = 0.1 V or VCC – 0.1 V

|Iout| v 20 mA

ÎÎÎ

4.5

5.5

ÎÎÎÎ

2

ÎÎÎÎ

2

ÎÎÎÎ

2

ÎÎ

V

ÎÎÎÎ

VIL

ÎÎÎÎÎÎÎÎÎÎ

Maximum Low−Level Input

Voltage

ÎÎÎÎÎÎÎÎÎ

Vout = 0.1 V or VCC – 0.1 V

|Iout| v 20 mA

ÎÎÎ

4.5

5.5

ÎÎÎÎ

0.8

ÎÎÎÎ

0.8

ÎÎÎÎ

0.8

ÎÎ

V

ÎÎÎÎ

VOH

ÎÎÎÎÎÎÎÎÎÎ

Minimum High−Level Output

Voltage

ÎÎÎÎÎÎÎÎÎ

Vin = VIH or VIL

|Iout| v 20 mA

ÎÎÎ

4.5

5.5

ÎÎÎÎ

4.4

5.4

ÎÎÎÎ

4.4

5.4

ÎÎÎÎ

4.4

5.4

ÎÎ

V

ÎÎÎÎÎÎÎÎÎ

Vin = VIH or VIL

|Iout| v 6 mA

ÎÎÎ

4.5

ÎÎÎÎ

3.98

ÎÎÎÎ

3.84

ÎÎÎÎ

3.7

ÎÎÎÎ

VOL

ÎÎÎÎÎÎÎÎÎÎ

Maximum Low−Level Output

Voltage

ÎÎÎÎÎÎÎÎÎ

Vin = VIH or VIL

|Iout| v 20 mA

ÎÎÎ

4.5

5.5

ÎÎÎÎ

0.1

ÎÎÎÎ

0.1

ÎÎÎÎ

0.1

ÎÎ

V

ÎÎÎÎÎÎÎÎÎ

Vin = VIH or VIL

|Iout| v 6 mA

ÎÎÎ

4.5

ÎÎÎÎ

0.26

ÎÎÎÎ

0.33

ÎÎÎÎ

0.4

ÎÎÎÎ

Iin

ÎÎÎÎÎÎÎÎÎÎ

Maximum Input Leakage Current

ÎÎÎÎÎÎÎÎÎ

Vin = VCC or GND

ÎÎÎ

5.5

ÎÎÎÎ

±0.1

ÎÎÎÎ

±1.0

ÎÎÎÎ

±1.0

ÎÎ

mA

ÎÎÎÎ

IOZ

ÎÎÎÎÎÎÎÎÎÎ

Maximum Three−State Leakage

Current

ÎÎÎÎÎÎÎÎÎ

Output in High−Impedance State

Vin = VIL or VIH; Vout = VCC or GND

ÎÎÎ

5.5

ÎÎÎÎ

±0.5

ÎÎÎÎ

±5.0

ÎÎÎÎ

±10

ÎÎ

mA

ÎÎÎÎ

ICC

ÎÎÎÎÎÎÎÎÎÎ

Maximum Quiescent Supply

Current (per Package)

ÎÎÎÎÎÎÎÎÎ

Vin = VCC or GND Iout = 0 mA

ÎÎÎ

5.5

ÎÎÎÎ

4

ÎÎÎÎ

40

ÎÎÎÎ

160

ÎÎ

mA

ÎÎÎÎ

DICC

ÎÎÎÎÎÎÎÎÎÎ

Additional Quiescent Supply

Current

ÎÎÎÎÎÎÎÎÎ

Vin = 2.4 V, Any One Input

Vin = VCC or GND, Other Inputs

lout = 0 mA

ÎÎÎ

5.5

ÎÎÎÎ

≥ −55_C

ÎÎÎÎÎÎÎ

25_C to 125_C

ÎÎ

mA

ÎÎÎÎ

2.9

ÎÎÎÎÎÎÎ

2.4

1. Total Supply Current = ICC + ΣDICC.

This device contains protection

circuitry to guard against damage

due to high static voltages or electric

fields. However, precautions must

be taken to avoid applications of any

voltage higher than maximum rated

voltages to this high−impedance cir-

cuit. For proper operation, Vin and

Vout should be constrained to the

range GND v (Vin or Vout) v VCC.

Unused inputs must always be

tied to an appropriate logic voltage

level (e.g., either GND or VCC).

Unused outputs must be left open.

MC74HCT244A

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3

AC ELECTRICAL CHARACTERISTICS (VCC = 5.0 V ± 10%, CL = 50 pF, Input tr = tf = 6 ns)

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Parameter

ÎÎÎÎÎÎÎÎÎÎÎÎ

Guaranteed Limit

ÎÎ

Unit

ÎÎÎÎÎ

– 55 to 25_C

ÎÎÎÎ

v 85_C

ÎÎÎÎÎ

v 125_C

ÎÎÎÎ

tPLH,

tPHL

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Propagation Delay, A to YA or B to YB

(Figures 1 and 3)

ÎÎÎÎÎ

20

ÎÎÎÎ

25

ÎÎÎÎÎ

30

ÎÎ

ns

ÎÎÎÎ

tPLZ,

tPHZ

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Propagation Delay, Output Enable to YA or YB

(Figures 2 and 4)

ÎÎÎÎÎ

26

ÎÎÎÎ

33

ÎÎÎÎÎ

39

ÎÎ

ns

ÎÎÎÎ

tPZL,

tPZH

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Propagation Delay, Output Enable to YA or YB

(Figures 2 and 4)

ÎÎÎÎÎ

22

ÎÎÎÎ

28

ÎÎÎÎÎ

33

ÎÎ

ns

ÎÎÎÎ

tTLH,

tTHL

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Output Transition Time, Any Output

(Figures 1 and 3)

ÎÎÎÎÎ

12

ÎÎÎÎ

15

ÎÎÎÎÎ

18

ÎÎ

ns

ÎÎÎÎ

Cin

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Input Capacitance

ÎÎÎÎÎ

10

ÎÎÎÎ

10

ÎÎÎÎÎ

10

ÎÎ

pF

ÎÎÎÎ

Cout

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Maximum Three−State Output Capacitance

(Output in High−Impedance State)

ÎÎÎÎÎ

15

ÎÎÎÎ

15

ÎÎÎÎÎ

15

ÎÎ

pF

CPD Power Dissipation Capacitance (Per Enabled Output)*

Typical @ 25°C, VCC = 5.0 V

pF

55

* Used to determine the no−load dynamic power consumption: PD = CPD VCC2f + ICC VCC.

SWITCHING WAVEFORMS

Figure 2.

Figure 3.

3 V

GND

tf

tr

INPUT

A OR B

OUTPUT

YA OR YB

0.3 V

1.3 V

2.7 V

10%

1.3 V

90%

tTLH

tPLH tPHL

tTHL

ENABLE

A OR B

OUTPUT Y

1.3 V

90%

10%

tPZL tPLZ

tPZH tPHZ

3 V

GND

HIGH

IMPEDANCE

VOL

VOH

HIGH

IMPEDANCE

MC74HCT244A

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4

TEST CIRCUITS

*Includes all probe and jig capacitance

CL*

TEST POINT

DEVICE

UNDER

TEST

OUTPUT

Figure 4.

*Includes all probe and jig capacitance

CL*

TEST POINT

DEVICE

UNDER

TEST

OUTPUT

Figure 5.

CONNECT TO VCC WHEN

TESTING tPLZ AND tPZL.

CONNECT TO GND WHEN

TESTING tPHZ AND tPZH.

1 kW

LOGIC DETAIL

DATA INPUT

A OR B

ENABLE A OR ENABLE B

TO THREE OTHER

A OR B INVERTERS

ONE OF 8

BUFFERS

YA

OR

YB

VCC

MC74HCT244A

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5

ORDERING INFORMATION

Device Package Shipping†

MC74HCT244ANG PDIP−20

(Pb−Free) 18 Units / Rail

MC74HCT244ADWG SOIC−20

(Pb−Free) 38 Units / Rail

MC74HCT244ADWR2G SOIC−20

(Pb−Free) 1000 / Tape & Reel

MC74HCT244ADTR2G TSSOP−20* 2500 / Tape & Reel

MC74HCT244AFG SOEIAJ−20

(Pb−Free) 40 Units / Rail

MC74HCT244AFELG SOEIAJ−20

(Pb−Free) 2000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*These packages are inherently Pb−Free.

MARKING DIAGRAMS

PDIP−20 SOIC−20W TSSOP−20 SOEIAJ−20

20

1

74HCT244A

AWLYWWG

A = Assembly Location

WL, L = Wafer Lot

YY, Y = Year

WW, W = Work Week

G or G= Pb−Free Package

(Note: Microdot may be in either location)

1

20

HCT

244A

ALYWG

G

20

1

HCT244A

AWLYYWWG

1

20

MC74HCT244AN

AWLYYWWG

MC74HCT244A

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PACKAGE DIMENSIONS

PDIP−20

N SUFFIX

PLASTIC DIP PACKAGE

CASE 738−03

ISSUE E

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD

FLASH.

M

L

J20 PL

M

B

M

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A25.66 27.171.010 1.070

B6.10 6.600.240 0.260

C3.81 4.570.150 0.180

D0.39 0.550.015 0.022

G2.54 BSC0.100 BSC

J0.21 0.380.008 0.015

K2.80 3.550.110 0.140

L7.62 BSC0.300 BSC

M0 15 0 15

N0.51 1.010.020 0.040

____

E

1.27 1.770.050 0.070

1

11

10

20

−A−

SEATING

PLANE

K

N

FG

D20 PL

−T−

M

A

M

0.25 (0.010) T

E

B

C

F

1.27 BSC0.050 BSC

SOIC−20W

DW SUFFIX

CASE 751D−05

ISSUE G

20

1

11

10

B20X

H10X

C

L

18X A1

A

SEATING

PLANE

q

hX 45_

E

D

M

0.25 M

B

M

0.25 S

AS

B

T

eT

B

A

DIM MIN MAX

MILLIMETERS

A2.35 2.65

A1 0.10 0.25

B0.35 0.49

C0.23 0.32

D12.65 12.95

E7.40 7.60

e1.27 BSC

H10.05 10.55

h0.25 0.75

L0.50 0.90

q0 7

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION

SHALL BE 0.13 TOTAL IN EXCESS OF B

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

__

MC74HCT244A

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7

PACKAGE DIMENSIONS

TSSOP−20

DT SUFFIX

CASE 948E−02

ISSUE C

DIM

A

MIN MAX MIN MAX

INCHES

6.60 0.260

MILLIMETERS

B4.30 4.50 0.169 0.177

C1.20 0.047

D0.05 0.15 0.002 0.006

F0.50 0.75 0.020 0.030

G0.65 BSC 0.026 BSC

H0.27 0.37 0.011 0.015

J0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L6.40 BSC 0.252 BSC

M0 8 0 8

____

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION:

MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE

MOLD FLASH, PROTRUSIONS OR GATE

BURRS. MOLD FLASH OR GATE BURRS

SHALL NOT EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION

SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

ÍÍÍÍ

110

1120

PIN 1

IDENT

A

B

−T−

0.100 (0.004)

C

DGH

SECTION N−N

K

K1

JJ1

N

M

F

−W−

SEATING

PLANE

−V−

−U−

S

U

M

0.10 (0.004) V S

T

20X REFK

L

L/2

2X

S

U0.15 (0.006) T

DETAIL E

0.25 (0.010)

DETAIL E 6.40 0.252

--- ---

S

U0.15 (0.006) T

7.06

16X

0.36 16X

1.26

0.65

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT

MC74HCT244A

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8

PACKAGE DIMENSIONS

SOEIAJ−20

F SUFFIX

CASE 967−01

ISSUE A

DIM MIN MAX MIN MAX

INCHES

--- 2.05 --- 0.081

MILLIMETERS

0.05 0.20 0.002 0.008

0.35 0.50 0.014 0.020

0.15 0.25 0.006 0.010

12.35 12.80 0.486 0.504

5.10 5.45 0.201 0.215

1.27 BSC 0.050 BSC

7.40 8.20 0.291 0.323

0.50 0.85 0.020 0.033

1.10 1.50 0.043 0.059

0

0.70 0.90 0.028 0.035

--- 0.81 --- 0.032

A1

HE

Q1

LE

_10 _0

_10 _

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS D AND E DO NOT INCLUDE

MOLD FLASH OR PROTRUSIONS AND ARE

MEASURED AT THE PARTING LINE. MOLD FLASH

OR PROTRUSIONS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

4. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

5. THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

HE

A1

LE

Q1

_

c

A

Z

D

E

20

110

11

b

M

0.13 (0.005)

e

0.10 (0.004)

VIEW P

DETAIL P

M

L

A

b

c

D

E

e

L

M

Z

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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MC74HCT244A/D

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