35
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WEBSITE: http://www.microsemi.com
1N4148-1
FIGURE 1
DESIGN DATA
CASE: Hermetically sealed
glass case per MIL-S-19500/116
D0-35 outline
LEAD MATERIAL: Copper clad steel.
LEAD FINISH: Tin / Lead
THERMAL RESISTANCE: (ROJL):
250 °C/W maximum at L = .375
THERMAL IMPEDANCE: (ZOJX): 70
°C/W maximum
POLARITY: Cathode end is banded.
MOUNTING POSITION: Any.
I R1 I R2 I R3 I R4 CAPACITANCE CAPACITANCE
@ 20 V dc @ 75 V dc @ 20 V @ 75 V @ 0 V @ 1.5 V
TA= 150°C TA= 150°C
nA µA µA µA pF pF
25 0.5 35 75 4.0 2.8
Vf 1 Vf 2 t rr
VBR V RWM I0@
I F = 10 mA @I F = 100 mA
@100µA
Volts Volts (pk) mA V dc V dc n sec
100 75 200 0.8 1.2 5
MAXIMUM RATINGS
Operating Temperature: -65°C to +200°C
Storage Temperature: -65°C to +200°C
Operating Current: 200 mA @ TA= +25°C
Derating Factor: 1.14 mA/°C Above TA = + 25°C
Surge Current A: 2A, sine wave, Pw= 8.3ms
Surge Current B: 1.41A, square wave, Pw= 8.3ms
ELECTRICAL CHARACTERISTICS @ 25°C, unless otherwise speci½ed.
• 1N4148-1 AVAILABLE IN JAN, JANTX, AND JANTXV
PER MIL-PRF-19500/116
• SWITCHING DIODE
• HERMETICALLY SEALED
• METALLURGICALLY BONDED
• DOUBLE PLUG CONSTRUCTION