PAGE . 1REV.0.0-AUG.4.2008
2N7002DW
MECHANICAL DATA
• Case: SOT-363 Package
• Terminals : Solderable per MIL-STD-750,Method 2026
• Apporx. Weight: 0.0002 ounces , 0.006grams
• Marking : 702
60V N-Channel Enhancement Mode MOSFET
Maximum RATINGS and Thermal Characteristics (TA=25OC unless otherwise noted )
Note: 1. Maximum DC current limited by the package
2. Surface mounted on FR4 board, t < 10 sec
PAN JIT RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,FUNCTIONS AND RELIABILITY WITHOUT NOTICE
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FEATURES
• RDS(ON), VGS@10V,IDS@500mA=5Ω
• RDS(ON), VGS@4.5V,IDS@75mA=7.5Ω
• Advanced Trench Process Technology
• High Density Cell Design For Ultra Low On-Resistance
• Specially Designed for Battery Operated Systems, Solid-State Relays
Drivers : Relays, Displays, Lamps, Solenoids, Memories, etc.
• /HDGIUHHLQFRPSO\ZLWK(85R+6(&GLUHFWLYHV
*UHHQPROGLQJFRPSRXQGDVSHU,(&6WG+DORJHQ)UHH
0.012(0.30)
0.005(0.15)
0.044(1.10)
MAX.
0.
0.
040(1.00)
031(0.80)
0.018(0.45)
0.006(0.15)
0.010(0.25)
Unit inch(mm):
SOT-363
0.054(1.35)
0.045(1.15)
0.087(2.20)
0.074(1.90)
0.030(0.75)
0.021(0.55)
0.056(1.40)
0.047(1.20)
0.087(2.20)
0.078(2.00)
0.010(0.25)
0.003(0.08)