Serializer
Deserializer
DS15BA101 DS15EA101
CML
LVPECL
LVDS
150 Mbps
to
1.5 Gbps
100-ohm Differential Cable
(i.e. CAT5e/6/7, Twinax)
50-ohm Coaxial Cable
(i.e. Belden 9914)
Max Cable Loss ~ 35 dB @ 750 MHz
DS15BA101
www.ti.com
SNLS234J –OCTOBER 2006–REVISED APRIL 2013
DS15BA101 1.5 Gbps Differential Buffer with Adjustable Output Voltage
Check for Samples: DS15BA101
1FEATURES DESCRIPTION
The DS15BA101 is a high-speed differential buffer for
2• Data Rates from DC to 1.5+ Gbps cable driving, level translation, signal buffering, and
• Differential or Single-ended Input signal repeating applications. Its fully differential
• Adjustable Output Amplitude signal path ensures exceptional signal integrity and
noise immunity and it drives both differential and
• Single 3.3V Supply single-ended transmission lines at data rates in
• Industrial -40°C to +85°C Temperature excess of 1.5 Gbps.
• Low Power: 150 mW (typ) at 1.5 Gbps Output voltage amplitude is adjustable via a single
• Space-saving 3 x 3 mm WSON-8 Package external resistor for level translation and cable driving
applications into 50-ohm single-ended and 100-ohm
APPLICATIONS differential mode impedances.
• Cable Extension Applications The DS15BA101 is powered from a single 3.3V
• Level Translation supply and consumes 150 mW (typ) at 1.5 Gbps. It
operates over the full −40°C to +85°C industrial
• Signal Buffering and Repeating temperature range and is available in a space saving
• Security Cameras 3x3 mm WSON-8 package.
Typical Application
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2006–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
DS15BA101
SNLS234J –OCTOBER 2006–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)
Supply Voltage −0.5V to 3.6V
Input Voltage (all inputs) −0.3V to VCC+0.3V
Output Current 28 mA
Storage Temperature Range −65°C to +150°C
Junction Temperature +150°C
Lead Temperature
(Soldering 4 Sec) +260°C
θJA WSON-8 +90.7°C/W
Package Thermal Resistance θJC WSON-8 +41.2°C/W
ESD Rating (HBM) 5 kV
ESD Rating (MM) 250V
(1) "Absolute Maximum Ratings" are those parameter values beyond which the life and operation of the device cannot be ensured. The
stating herein of these maximums shall not be construed to imply that the device can or should be operated at or beyond these values.
The table of "Electrical Characteristics" specifies acceptable device operating conditions.
Recommended Operating Conditions
Supply Voltage (VCC – GND): 3.3V ±5%
Operating Free Air Temperature (TA)
DS15BA101SD −40°C to +85°C
DC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.(1)(2)
Symbol Parameter Conditions Reference Min Typ Max Units
VICM Input Common Mode Voltage See Note(3) IN+, IN- VCC –
0.8 V
VID/2
VID Differential Input Voltage Swing 100 2000 mVP−P
VOS Output Common Mode Voltage OUT+, OUT- VCC –V
VOUT/2
VOUT Output Voltage Single-ended, 25Ωload 400 mVP-P
RVO = 953Ω1%,
Single-ended, 25Ωload 800 mVP-P
RVO = 487Ω1%,
ICC Supply Current See Note(4) 45 49 mA
(1) Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to GND.
(2) Typical values are stated for VCC = +3.3V and TA= +25°C.
(3) Specification is ensured by characterization.
(4) Maximum ICC is measured at VCC = +3.465V and TA= +70°C.
2Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: DS15BA101
IN+
IN-
GND
RVO
OUT+
OUT-
GND
VCC
1
2
3
4
8
6
5
7
(GND)
DAP
DS15BA101
www.ti.com
SNLS234J –OCTOBER 2006–REVISED APRIL 2013
AC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified(1).
Symbol Parameter Conditions Reference Min Typ Max Units
DRMAX Maximum Data Rate See Note(2) IN+, IN- 1.5 2.0 Gbps
tLHT Output Low to High Transition 20% – 80%(3) OUT+, OUT- 120 220 ps
Time
tHLT Output High to Low Transition 120 220 ps
Time
tPLHD Propagation Low to High Delay See Note(2) 0.95 1.10 1.35 ns
tPHLD Propagation High to Low Delay See Note(2) 0.95 1.10 1.35 ns
tTJ Total Jitter 1.5 Gbps 26 psP-P
(1) Typical values are stated for VCC = +3.3V and TA= +25°C.
(2) Specification is ensured by characterization.
(3) Specification is ensured by characterization and verified by test.
CONNECTION DIAGRAM
Figure 1. 8-Pad WSON
See NGQ Package
PIN DESCRIPTIONS
Pin # Name Description
1 IN+ Non-inverting input pin.
2 IN- Inverting input pin.
3 GND Circuit common (ground reference).
4 RVO Output voltage amplitude control. Connect a resistor to VCC to set output voltage.
5 VCC Positive power supply (+3.3V).
6 GND Circuit common (ground reference).
7 OUT- Inverting output pin.
8 OUT+ Non-inverting output pin.
Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: DS15BA101
OUT+
OUT-
DS15BA101
IN+
IN-
50:50:
100: Differential T-Line
LVPECL 100:
OUT+
OUT-
DS15BA101
IN+
IN-
50:50:
VCC
CML3.3V or CML2.5V
100:
100: Differential T-Line
OUT+
OUT-
DS15BA101
IN+
IN-
100:
100: Differential T-Line
LVDS
DS15BA101
SNLS234J –OCTOBER 2006–REVISED APRIL 2013
www.ti.com
DEVICE OPERATION
INPUT INTERFACING
The DS15BA101 accepts either differential or single-ended input. The inputs are self-biased, allowing for simple
AC or DC coupling. DC-coupled inputs must be kept within the specified common-mode range. The IN+ and IN-
pins are self-biased at approximately 2.1V with VCC = 3.3V. The following three figures illustrate typical DC-
coupled interface to common differential drivers.
Figure 2. Typical LVDS Driver DC-Coupled Interface to DS15BA101 Input
Figure 3. Typical CML Driver DC-Coupled Interface to DS15BA101 Input
Figure 4. Typical LVPECL Driver DC-Coupled Interface to DS15BA101 Input
OUTPUT INTERFACING
The DS15BA101 uses current mode outputs. Single-ended output levels are 400 mVP-P into AC-coupled 100Ω
differential cable (with RVO = 953Ω) or into AC-coupled 50Ωcoaxial cable (with RVO = 487Ω). Output level is
controlled by the value of the RVO resistor connected between the RVO and VCC.
The RVO resistor should be placed as close as possible to the RVO pin. In addition, the copper in the plane layers
below the RVO network should be removed to minimize parasitic capacitance. The following figure illustrates
typical DC-coupled interface to common differential receivers and assumes that the receivers have high
impedance inputs. While most receivers have a common mode input range that can accomodate CML signals, it
is recommended to check respective receiver's datasheet prior to implementing the suggested interface
implementation.
4Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: DS15BA101
DS15BA101
OUT-
IN+
IN-
OUT+
0.1 PF
50:
50:
487:
100:
1 PF1 PF
1 PFDS15EA101
IN+
IN-
50:
1 PF
OUT+
OUT-
CAP+ CAP-
0.1 PF
VCC
VCC
25:
50: Coaxial Cable
RVO
DS15BA101
OUT-
IN+
IN-
OUT+
0.1 PF
50:
50:
953:
100:
1 PF
1 PF
1 PF
1 PFDS15EA101
IN+
IN-
100:
1 PF
OUT+
OUT-
CAP+ CAP-
0.1 PF
VCC
VCC
100: Differential TP Cable
RVO
OUT+
OUT-
CML or
LVPECL or
LVDS
IN+
IN-
50:
50:
VCC
100:
100: Differential T-Line
DS15BA101
DS15BA101
www.ti.com
SNLS234J –OCTOBER 2006–REVISED APRIL 2013
Figure 5. Typical DS15BA101 Output DC-Coupled Interface to an LVDS, CML or LVPECL Receiver
CABLE EXTENDER APPLICATION
The DS15BA101 together with the DS15EA101 form a cable extender chipset optimized for extending serial data
streams from serializer/deserializer (SerDes) pairs and field programmable gate arrays (FPGAs) over 100Ω
differential (i.e. CAT5e/6/7 and twinax) and 50Ωcoaxial cables. Setting correct DS15BA101 output amplitude and
proper cable termination are keys for optimal operation. The following two figures show recommended chipset
configuration for 100Ωdifferential and 50Ωcoaxial cables.
Figure 6. Cable Extender Chipset Connection Diagram for 100ΩDifferential Cables
Figure 7. Cable Extender Chipset Connection Diagram for 50ΩCoaxial Cables
Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: DS15BA101
DS15BA101
SNLS234J –OCTOBER 2006–REVISED APRIL 2013
www.ti.com
REFERENCE DESIGN
There is a complete reference design (P/N: DriveCable02EVK) available for evaluation of the cable extender
chipset (DS15BA101 and DS15EA101). For more information, visit http://www.ti.com/tool/drivecable02evk.
Typical Performance
Figure 8. 1.5 Gbps Differential DS15BA101 Output Figure 9. 1.5 Gbps Single-ended DS15BA101 Output
RVO = 953Ω, H:100 ps / DIV, V:100 mV / DIV RVO = 487Ω, H:100 ps / DIV, V:100 mV / DIV
Figure 10. 2.0 Gbps Differential DS15BA101 Output Figure 11. 2.0 Gbps Single-ended DS15BA101 Output
RVO = 953Ω, H:100 ps / DIV, V:100 mV / DIV RVO = 487Ω, H:100 ps / DIV, V:100 mV / DIV
6Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated
Product Folder Links: DS15BA101
DS15BA101
www.ti.com
SNLS234J –OCTOBER 2006–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision I (April 2013) to Revision J Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 6
Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: DS15BA101
PACKAGE OPTION ADDENDUM
www.ti.com 12-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
DS15BA101SD/NOPB ACTIVE WSON NGQ 8 1000 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 BA101
DS15BA101SDE/NOPB ACTIVE WSON NGQ 8 250 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 BA101
DS15BA101SDX/NOPB ACTIVE WSON NGQ 8 4500 Green (RoHS
& no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 BA101
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DS15BA101SD/NOPB WSON NGQ 8 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
DS15BA101SDE/NOPB WSON NGQ 8 250 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
DS15BA101SDX/NOPB WSON NGQ 8 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Sep-2016
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS15BA101SD/NOPB WSON NGQ 8 1000 210.0 185.0 35.0
DS15BA101SDE/NOPB WSON NGQ 8 250 210.0 185.0 35.0
DS15BA101SDX/NOPB WSON NGQ 8 4500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Sep-2016
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
8X 0.3
0.2
2 0.1
8X 0.5
0.3
2X
1.5
1.6 0.1
6X 0.5
0.8
0.7
0.05
0.00
B3.1
2.9 A
3.1
2.9
(0.1) TYP
WSON - 0.8 mm max heightNGQ0008A
PLASTIC SMALL OUTLINE - NO LEAD
4214922/A 03/2018
PIN 1 INDEX AREA
SEATING PLANE
0.08 C
1
45
8
PIN 1 ID 0.1 C A B
0.05 C
THERMAL PAD
EXPOSED
9
SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
(1.6)
6X (0.5)
(2.8)
8X (0.25)
8X (0.6)
(2)
(R0.05) TYP ( 0.2) VIA
TYP
(0.75)
WSON - 0.8 mm max heightNGQ0008A
PLASTIC SMALL OUTLINE - NO LEAD
4214922/A 03/2018
SYMM
1
45
8
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:20X
9
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASK
OPENING
SOLDER MASK
METAL UNDER
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
8X (0.25)
8X (0.6)
6X (0.5)
(1.79)
(1.47)
(2.8)
(R0.05) TYP
WSON - 0.8 mm max heightNGQ0008A
PLASTIC SMALL OUTLINE - NO LEAD
4214922/A 03/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
EXPOSED PAD 9:
82% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
SYMM
1
45
8
SYMM
METAL
TYP
9
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
