SN54251, SN54LS251 SN54S251,
SN74251, SN74LS251, (TIM9905), SN74S251
DATA SELECTORS/MULTIPLEXERS WITH 3-STATE OUTPUTS
SDLS085 – DECEMBER 1972 – REVISED MARCH 1988
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1988, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
SN54251, SN54LS251 SN54S251,
SN74251, SN74LS251, (TIM9905), SN74S251
DATA SELECTORS/MULTIPLEXERS WITH 3-STATE OUTPUTS
SDLS085 – DECEMBER 1972 – REVISED MARCH 1988
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54251 SN74251,
DATA SELECTORS/MULTIPLEXERS WITH 3-STATE OUTPUTS
SDLS085 – DECEMBER 1972 – REVISED MARCH 1988
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54251 SN74251,
DATA SELECTORS/MULTIPLEXERS WITH 3-STATE OUTPUTS
SDLS085 – DECEMBER 1972 – REVISED MARCH 1988
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS251 SN74LS251,
DATA SELECTORS/MULTIPLEXERS WITH 3-STATE OUTPUTS
SDLS085 – DECEMBER 1972 – REVISED MARCH 1988
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54LS251 SN74LS251, (TIM9905),
DATA SELECTORS/MULTIPLEXERS WITH 3-STATE OUTPUTS
SDLS085 – DECEMBER 1972 – REVISED MARCH 1988
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54S251 SN74S251,
DATA SELECTORS/MULTIPLEXERS WITH 3-STATE OUTPUTS
SDLS085 – DECEMBER 1972 – REVISED MARCH 1988
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN54S251 SN74S251,
DATA SELECTORS/MULTIPLEXERS WITH 3-STATE OUTPUTS
SDLS085 – DECEMBER 1972 – REVISED MARCH 1988
8POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
7601601EA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type
7601601FA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type
7601601FA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type
80022012A OBSOLETE LCCC FK 20 TBD Call TI Call TI
80022012A OBSOLETE LCCC FK 20 TBD Call TI Call TI
8002201EA OBSOLETE CDIP J 16 TBD Call TI Call TI
8002201EA OBSOLETE CDIP J 16 TBD Call TI Call TI
8002201FA OBSOLETE CFP W 16 TBD Call TI Call TI
8002201FA OBSOLETE CFP W 16 TBD Call TI Call TI
JM38510/07905BEA OBSOLETE CDIP J 16 TBD Call TI Call TI
JM38510/07905BEA OBSOLETE CDIP J 16 TBD Call TI Call TI
JM38510/30905B2A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type
JM38510/30905B2A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type
JM38510/30905BEA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type
JM38510/30905BEA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type
JM38510/30905BFA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type
JM38510/30905BFA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type
SN54251J OBSOLETE CDIP J 16 TBD Call TI Call TI
SN54251J OBSOLETE CDIP J 16 TBD Call TI Call TI
SN54LS251J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type
SN54LS251J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type
SN54S251J OBSOLETE CDIP J 16 TBD Call TI Call TI
SN54S251J OBSOLETE CDIP J 16 TBD Call TI Call TI
SN74251N OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74251N OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74251N3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74251N3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS251D ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS251D ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS251DE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS251DE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS251DR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS251DR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS251DRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS251DRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS251N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 12-Jan-2006
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74LS251N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS251N3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS251N3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74LS251NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS251NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS251NSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS251NSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS251NSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS251NSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S251D OBSOLETE SOIC D 16 TBD Call TI Call TI
SN74S251D OBSOLETE SOIC D 16 TBD Call TI Call TI
SN74S251N OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74S251N OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74S251N3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SN74S251N3 OBSOLETE PDIP N 16 TBD Call TI Call TI
SNJ54251J OBSOLETE CDIP J 16 TBD Call TI Call TI
SNJ54251J OBSOLETE CDIP J 16 TBD Call TI Call TI
SNJ54LS251FK ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type
SNJ54LS251FK ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type
SNJ54LS251J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type
SNJ54LS251J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type
SNJ54LS251W ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type
SNJ54LS251W ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type
SNJ54S251FK OBSOLETE LCCC FK 20 TBD Call TI Call TI
SNJ54S251FK OBSOLETE LCCC FK 20 TBD Call TI Call TI
SNJ54S251J OBSOLETE CDIP J 16 TBD Call TI Call TI
SNJ54S251J OBSOLETE CDIP J 16 TBD Call TI Call TI
SNJ54S251W OBSOLETE CFP W 16 TBD Call TI Call TI
SNJ54S251W OBSOLETE CFP W 16 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
PACKAGE OPTION ADDENDUM
www.ti.com 12-Jan-2006
Addendum-Page 2
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 12-Jan-2006
Addendum-Page 3
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
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