MIL SPECS YUE D MM 0000125 OO3454? 274 MEMILS | INCH-POUND | MIL-S-19500/127H 14 March 1994 SUPERSEDING MIL-S-19500/727L 8 September 1992 ' E | The documentation and process conversion | measures necessary to comply with this } revision shall be completed by 14 June 1994 MILITARY SPECIFICATION SEMICONDUCTOR DEVICES, DIODE, SILICON, VOLTAGE REGULATOR, TYPES 1N4370A-1 THROUGH 1N4372A-1, AND 1N746A-1 THROUGH 1N759A-1, 1N4370AUR-1 THROUGH 4NG372AUR-1 AND IN746AUR~-1 THROUGH 1N759AUR-1, 1N4370C-1 THROUGH 1N4372C-1, AND 4N746C-1 THROUGH 1N759C-1, IN437OCUR-1 THROUGH IN4372CUR-1 AND 1N746CUR-1 THROUGH 1N759CUR-1, 1N4370D-1 THROUGH 4N4372D-1, ANO 1N746D-1 THROUGH 1N759D-1, AN4370DUR-1 THROUGH 1N4372DUR-1 AND 1N7460UR-1 THRGNGH 4N759DUR-1, JAN, JANTX, JANTXV, AND JANHC ot | JANS Level (see 6.3). | Lo This specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for 500 milliwatt, silicon, voltage regulator diodes with voltage tolerances of 5, 2, and 1 percent. Three levels of product assurance are provided for each device type as specified in MIL~S-19500. One Level of product assurance is provided for die. 1.2 Physical dimensions. See 3.3 (similar to DO-35 and DO-213AA). 1.3 Maximum ratings. Maximum ratings are as shown in column 4 of table IV herein and as follows: Py = 500 mW, (00-35) at TL = 450C, L = .375 inch (9.53 mm); both ends of case or diode body to heat sink at L = .375 inch (9.53 mm). Derate Iz to 0.0 mA de at 175C, Py = 500 mW (DO-213AA) at Tec = +125C, derate to 0 at #175C. -65C s Top = +175C; -65C < Tstg = +175C. 1.4 Primary electrical characteristics. Primary electrical characteristic are as shown in columns 2, 9, 12, and 14 of table IV herein and as follows: 2.4 V de = Vz = 12 V de AN4370A-1 through 1N4372A-1 and 1N746A-1 through 1N759A-1 are 5 percent voltage tolerance. 4N4370C-1 through 1N4372C-1 and 1N746C-1 through 1N759C-1 are 2 percent voltage tolerance. 4N43700-1 through 1N4372D-1 and 1N746D-1 through 1N759D-1 are 1 percent voltage tolerance. Thermal resistance: RojL = 250C/W maximum at L = .375 inch (9.53 mm) (00-35). Rejec = 1O0C/W maximum. Junction to end-caps (00-213AA). j; Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of { | use in improving this document should be addressed to: Commander, Defense Electronics Supply Center, | | ATTN: DESC-ELDT, 1507 Wilmington Pike, Dayton, OH 45444-5765, by using the self-addressed Standardization | Document Improvement Proposal (00 Form 1426) appearing at the end of this document or by letter. | AMSC N/A FSC 5961 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.MIL SPECS HUE D MM 0000325 0034548 100 MMILS MIL-S-19500/127M poor ap tO Dimensions are Metric equivale Package contour this cylinder b Tar | | | | | | Dimensions \ | | Ltr | | Notes | | | Inches | Millimeters | | | | | | | | | [| _Min | Max | Min | Max__| _ | | | | | | | | gD | 055 | 090 | 1.40 | 2.29 | 3 [ | | | | | | | 8 | .018 | 3 | 0.46 0.58 | L | | | | | | { G | -120 | 0] 3.05 | 5.08 3 | | | | { | Lt | 4.000 | 1.500 | 25,40 38.10 | | | | | | Jt, | }.050 | {| 1.27 | 4 | i | | | | | _ in inches. nts are given for general information only. optional within 0 and length G. Heat slugs, if any, shall be included within ut shall not be subject to minimum Limit of gD. Within this zone, lead diameter may vary to allow for lead finishes and irregularities other than heat slugs. FIGURE 1. Semiconductor device, diode, types 1N4370A-1 through 1N4372A-1, 14N4370C-1 through 4N4372C-1, 1N4370D-1 through 1N4372D-1, IN746A-1 through 1N759A-1, 1N746C-1 through 1N759C-1, and 1N746C-1 through 1N759C-1 (00-35).MIL SPECS HOE D MM 0000325 00345495 O47 MMILS MIL-S-19500/127M GO so m~] F __ G4 __. G | Dimensions | | Ler | | | Inches | _Millimeters L | | | | _ Min Max Min | Max | { | [ gD .063 .067 1.60 | 1.70 | | [ | | F .016 | .022 | 0.41 | 0.55 | { | | | G | -130 | -146 | 3.30 | 3.70 | | { | | | G | .100 ref | 2.54 ref | | | | _t | | { | Ls] .001 min | _0.03 min | NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. FIGURE 2. Physical dimensions types 1N4370AUR-1 through 1N4372AUR-1, 1N4370CUR-1 through 4N4372CUR-1, 1N4370DUR-1 through 1N4372DUR-1, IN746AUR-1 through 1N759AUR-1, AN746CUR-1 through 1N759CUR-1, and 1N746DUR-1 through 1IN759RUR-1 (D0-213AA).MIL SPECS WUE D MM 0000325 0034550 469 MENILS MIL-S-19500/127M L > MELE a ~ ; Ui | Y \ a y LQ .. Ure. BACKSIDE IS CATHODE (A-version) | | | | I Dimensions L | I | I | Inches [| __ Millimeters L | | | | | | | | Min | Max | Min | Max | ! | | | { | | L.A | .021 | 025 _| 0.53 | 0.63 L | | | | | | |B | O13 | .017 | 0.33 | 0.43 | NOTES: 4. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. The physical characteristics of the die thickness are .010 +.002 (0.25 mm). Metallization is top = (anode)-AL, back: (cathode)-AU. AL thickness = 25000 A minimum, AU thickness = 4000 A minimum. 4. Circuit layout data: for zener operation, cathode must be operated positive with respect to anode. 5. Requirements in accordance with MIL-S-15000 (appendix H) are performed in a TO-5 package (see 6,5). FIGURE 3. Physical dimensions JANHCA die dimensions.MIL SPECS NOTES: 4HE D MM 0000225 0034551 77S MMMILS MIL-S-19500/127H 4 > WLLL ANODE SENN y | MILL BACKSIDE IS CATHODE MQXEEW (B-version) { | | | { Dimensions [ } Ler | | | | Inches | Millimeters | [ | I | i | { | Min | Max | Min | Max | | | | | i | [A | .024 | .028 | 0.61 | 0.71 L | | | | i | {B | .017 | 021 | 0.43 | 0.53 | Dimensions are in inches. Metric equivalents are given for general information only. The physical characteristics of the die thickness are .010 #.002 (0.25 mm). Metallization is top = (anode)-AL, back: (cathode)-AU. AL thickness = 40000 A minimum, AU thickness = 5000 A minimum. Circuit layout data: For zener operation, cathode must be operated positive with respect to anode. Requirements in accordance with MIL-S-19500 (appendix H) are performed in a TO-5 package (see 6.5). FIGURE 4. Physical dimensions JANHCB die dimensions.MIL SPECS WHE D MM O0001e5 0034552 631 MENILS MIL-S-19500/127M 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those Listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in this solicitation (see 6.2). SPECIFICATION MILITARY MIL-S-19500 - Semiconductor Devices, General Specification for. STANDARD MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the Standardization Documents Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094. ) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Associated detail specification. The individual item requirements shall be in accordance with MIL-S-19500, and as specified herein. 3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-S-19500, and herein. ee 77 TTT TTT tt end-caps. 3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-S-19500, and figures 1 (D0~35), 2 (D0-213), 3 and 4 (die) herein. 3.3.1 Lead finish. Lead finish shall be solderable as defined in MIL-S-19500, MIL-STD-750, and herein. Where a choice of lead finish is desired, it shall be specified in the acquisition document. 3.3.2 Dash one construction. Dash one (-1) devices shall be metallurgically bonded double plug construction in accordance with the requirements of category I, II, or III (see MIL-S-19500, paragraph 30.14 and subparagraphs). 3.4 Marking. Marking shall be in accordance with MIL-S-19500, except at the option of the manufacturer, the DO-35 versions may leave off "-" portion of type designation (example: JANTX1N4370A1) . 3.4.1 Marking of UR-1 version devices. For UR-1 version devices only, all marking (except polarity) may be omitted from the body, but shall be retained on the initial container. 3.5 Selection of tight tolerance devices. The and D suffix devices shall be selected from JAN, JANTX, JANTXV, or JANS devices, which have successfully completed all applicable screening, and groups A, B, and C testing as 5 percent tolerance devices. All sublots of C and D suffix devices shall pass group A, subgroup 2, at tightened tolerances. Tighter tolerances for mounting clip temperature shall be maintained for reference purpose to establish correlation. For C and D tolerance levels, Ty = 425C #2C at 0.375 inch from body or equivalent.NIL SPECS 44E D MM 0000125 0034553 578 MEMILS MIL-S-19500/127H 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection shall be in accordance with MIL-S-19500, and as specified herein. 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL~S-19500, and as specified herein. 4.2.1 JANHC devices. JANHC devices shall be qualified in accordance with appendix H of MIL-S-19500. 4.2.2 Construction verification. Cross sectional photos from three devices shall be submitted in the qualification report. 4.3 Screening (JAN, JANTXV, and JANTX levels only). Screening shall be in accordance with MIL-S-19500 (table II) and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the Limits of table 1 herein shall not be acceptable. { | | l Screen | Measurement L |(see table II of | | { | MIL-S-19500) | JANTX and JANTXV | JAN Level [ | | [ | | 3a |Temperature cycling | Temperature cycling [ | Vu | | | 3c |Thermal impedance, see 4.5.5. [Thermal impedance, see 4.5.5. | | { | { | 9 iNot_ applicable. [Not applicable | | 11 [Ipq and Vz | | | | | | | | | | 12 |See 4.3.2, t = 48 hrs I | | | | | | 13 2/ [Alpy = 100% of initial reading | | | Jor 50 nA dc, whichever is greater; | | | | AVz = #2% initial reading | | | [Subgroup 2 of table IL herein. | 1 1/ Thermal impedance shall be performed any time after sealing provided temperature cycling is performed in accordance with MIL-S-19500, screen 3 prior to this thermal test. 2/ PDA =5 percent for screen 13 applies to Alpy, AVz, and subgroup 2 of table I herein. Thermal impedance (Zg)y) is not required in screen 13. 4.3.1 Screening (JANHC). Screening of JANHC die shall be in accordance with MIL-S-19500, appendix H. As a minimum, die shall be 100 percent probed to ensure compliance with group A, subgroup 2 herein (with exception to thermal impedance). 4.3.2 Power burn-in conditions. Power burn-in conditions are as follows: Iz = column 8 of table IV minimum; mounting conditions in accordance with MIL-STD-750, method 1038, test condition B, Tec = +75C to +125C for surface mount devices. To better utilize burn-in equipment, higher values of 17 shalt be permitted provided: a. The junction temperature does not exceed #175C. b. The power dissipation does not exceed 500 mW (see figure 5). 4.4 Quality conformance inspection. Quality conformance inspection shall be in accordance with MIL-S-19500, and as specified herein. 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-S-19500, and table I herein.MIL SPECS HUE D MM O0002e5 0034554 404 MENILS MIL-S-19500/127M a L=.125 =z 400 |- =z cr et tot am L=.375 az 300 | =. L=0 (SURFACE rz x MOUNT) 29 Be L=.250 x= 200) [- =. =H wn n & 100 [ { | 25 73 125 175 LEAD TEMPERATURE-DEGREES CELSIUS AT DESCRIBEO LEAD LENGTH FIGURE 5. Maximum power versus lead temperature and lead length (see 6.4).MIL SPECS 44HE D MM 00001325 0034555 340 MMMILS MIL-S-19500/127H 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in table IVb (JAN, JANTX, and JANTXV) of MIL-S-19500, and as follows. Electrical measurements (end-points) shall be in accordance with the applicable steps of table III herein. Subgroup Method Condition B2 4066 See 4.5.1 B3 1027 I7 = column 8 of table IV; (see 4.3.2). B4 2075 See 4.5.7 BS sooo Not applicable B 1032 Ta = +175C. 4.4.3 Group inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in table V of MIL-S-19500, and as follows. Electrical measurements (end-points) shall be in accordance with the applicable footnotes and steps of table III herein. Subgroup Method Condition c2 2036 Tension: Test condition A; weight = 4 lbs; t = 15 seconds. Lead fatigue: Test condition E. (Tension and lead fatigue are not required for UR-1 suffix devices). C3 ---- Not applicable. C6 1026 Iz = column 8 of table IV; See 4.3.2. C7 4071 Iz = 7.5 mA de; Ty = #25C 5C;7 To = Tq 4#125C 45C. (Max Limit per column 14 of table IV.) 4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows: 4.5.1 Surge current (1754). The peak currents shown in column 10 of table IV shalt be applied in the reverse direction and these shall be superimposed on the current (17 = 20 mA dc) a total of 5 surges at 1-minute intervals. Each individual surge shall be one-half square-wave-pulse of one one-hundred twenth second duration or an equivalent one-half sine wave with the same effective rms current. Ta = #25C #5C. 4.5.2 Regulator voltage measurements. The test current shall be applied until thermal equilibrium is attained (20 2 seconds) prior to reading the breakdown voltage. For this test, the diode shall be suspended by its leads with mounting clips whose inside edge is located at 0.375 inch (9.53 mm) from the body and the mounting clips shall be maintained at a temperature of +25C +8C, and -2C. This measurement may be performed after a shorter time following application of the test current than that which provides thermal equilibrium if correlation to stabilized readings can be established to the satisfaction of the Government. 4.5.3 Voltage regulation Vz (reg). Voltage regulation shall be determined by the difference of the regulator voltage measured at different currents as specified in table 1, group A, subgroup 7. Both test shall be performed at thermal equilibrium. This AV7 shall not exceed column 7 of table IV. 4.5.4 Temperature coefficient of regulator voltage (aVz). The device shall be temperature stabilized with current applied prior to reading regulator voltage at the specified ambient temperature as specified in paragraph 4.4.3, group C, subgroup 7.MIL SPECS WHE D MM O000125 OO3455L 287 MEMILS MIL-S-19500/127M 4.5.5 Thermal impedance (Zgjxy- The Zgjy measurements shall be performed in accordance with MIL-STD-750C, method 3101. The maximum Limit for ZoJX in screening (table Ii of MIL-S~19500) shall be derived by each vendor by means of process control. When three lot date codes have exhibited control, the data from these three lots will be used to establish a fixed screening limit, (not to exceed the group A, subgroup 2 Limit). Once a fixed Limit has been established, monitor all future sealing lots using a five piece sample from each lot to be plotted on the applicable X and R chart. a. I measurement current - - ---~->-->-----7- 1 mA - 10 mA. b. Iy forward heating current - - ----------- 5 A- 1.0 A. c, ty heating time ------------------ 10 ms. d. typ measurement delay time - ----------- 70 ps maximum. 4.5.5.1 For initial qualification or requalification. Read and record data (Zgjy) shall be supplied to the qualifying activity on one lot (random sample of 500 devices minimum). Twenty-two serialized devices shall be sent to the qualifying activity for test correlation. 4.5.6 Thermal resistance. Thermal resistance measurement shall be performed in accordance with MIL-STD-750, method 3101 or 4081. Forced moving air or draft shall not be permitted across the device during test. The maximum Limit for Roy, under these test conditions shall be Roy (max) = 250C/W or RoJEC(max) = 100C/W The following conditions shall apply when using method 3101: a Ip -- ee ot tr tr rr rr rt rr ttt ree 1 mA to 10 mA bo oy rr te tt tr tr rr tr rt rrr ee 200 mA to 400 mA Cc. ty --- oe ee er er rr rr ttre 25 seconds minimum d.tup-- - ee ce rt rr ttt rc 70 ps maximum LS = Lead spacing = .375 inch as defined on figure 6 below: LS = 0 inch for "UR" suffix devices. COPPER LEAD ] COPPER LEAD CLAMP INFINITE HEAT~DISSIPATOR NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. FIGURE 6. Mounting conditions. 4.5.6.1 For initial qualification and requalification. Read and record data in accordance with group E herein and shall be included in the qualification report. 4.5.7 Oecap internal visual scribe and break. Scratch glass at cavity area with diamond scribe. Carefully snap open. Using 30X magnification examine the area where die (or bonding material) are in contact with the plugs, verify metallurgical bonding area. If the verification of the metallurgical bonding area is in question, the test method 3101 and test condition; and Limits herein (Z,jy) shall be used to determine suitability for use. 10WYE D MM 0000125 0034557? 113 MENILS MIL SPECS MIL-S-19500/127M Group A_inspection. TABLE I. c 9 D> o a 9 = ;G o GT a uv ~ G TD < o < > 3 > > = _ _ _ 2 N cos st st wn so ~ ~ x . in nl 0 2 7 Ss J < nn < < < aaa ~ o o o o oO o Fm ma ae a a a a A I a a I Se SE a - 4 on c = . = ~ ad 9 wo o g -o e ~< ~ - Le NW = AN 2 wn uo a ~ oO a N > mn > > N 4 NI > - - ~ 7 Cc Cc Ee E s 3 = ~ o a % oO c 8 o wn 9 Rl n 9 tt m - o a o o a aa To xe> vo e> oe ot e uu > < > Hy 3 Oo uu wn c <= on <= is) < I 9 ~ oO = ~~ @ ams < & a oO 3 = oO wn So B =O on) 4 a uy oO . Ww 2 - Oo = 8 WN wn - =o G Oo AN a vy P . + we Qn o It u wr wv uot i eX wW Ew nh wo - N o Lad nm st uh o wv < oOo NY NON o a oI 4 wn - a et a ee 3 - 7 Oo N N = so - aon f > = N N o = wn v Oo Oo Oo Qo a = Oo Qo 2 N wr wT st sw my wt wT ~ wo oo oO oc i so Cc ~ s a wo vo o 3 o =! ao no eo vo > ZG ca << v ve < Cc v oa Cc v o o Cc Saal vr a = Cc we a a oO e vo o vo oN InN Oo a oY - ~ oN (e] - ec N oad oe on on v o wt ~ wn ae] 2M Q = u > + > 8 a . oe ec mo - + Cire o 3 w w = vo 2 c = ow o ou o 2 cr 3 > [a mo 8 on 3 Qc o 3 mo _ > cf v Bo ow ot ce] ev 3 - To = = 3 sr Qo oe o o 77 o ca v ~ (5 ow oY = oO x oO a a ov a ~ OL a a ow o wv Po 1 9 co Q. mw c oO o o ~ O ~~ OD & o o wv o on wu he = 3 c 3 = ov 27 OW 3M a 2 a o 3 ~ = ~~ wn Qe 77) is > mw mw a n noe > wn g 2 = Cd _ - oO a oO o Rel -_ o n So o > Ww oe ao ~ ee = oe wn = > For sampling plan, see MIL-S-19500. 2/ Column references are to table IV. V/ 11MIL SPECS 4Y4E D MM 00003e5 0034558 OST MENILS MIL-S-19500/127M TABLE II. Group E inspection (all quality levels). i { | | | Inspection \ MIL-STO-750 | Qualification | i i | | conformance | t [Method ; Conditions | inspection | i i \ I l i ! { | | Subgroup 4 | | | [Temperature cycling { 1051 {500 cycles | 22 devices, | | i | =0 | lElectrical measurements | |See table III, steps 1, 3, 4, and 5 | | { | | | | Subgroup 2 | | | | | | | | | |Steady-state intermittent | 1037 [6,000 cycles, I74 = Col. 8 | 22 devices, | | operating Life { | c=0 | | | | | {Electrical measurements [ |See table III, steps 2, 3, 4, and 5 | | | | | | ! Subgroup 3 | | | |Not applicable | | | | | | [ | | Subgroup 4 | | [Thermal resistance 3101 |Rayec = 100C/W (max) at zero Lead | 22 devices, | | surface mount Jor 4081 | length. +25c < Tec = +35C; | c=0 | { | (see 4.5.6) | | | | | |Thermal resistance 3101 [Roy_ = 250C/W (maximum) at .375 inches. | 22 devices, | | leaded |or 4081 |Lead length at +25C s TL = 435C | c=0 | | [ (see 4.5.6). | | i | | 12MIL SPECS MIL-S-19500/127M TABLE Ill. Groups B, C, and E electrical measurements. 1/2/ 4HE D M@M@ 0000325 0034559 T5b MENILS wn et o ou | | | 3/ | | Inspection I MIL-STD-750 _| Symbol | Limits |. Unit I | | | { | ! [Method ]} Conditions | {Min | Max | l | | | | jReverse current | 4016 {DC method; Vp = column 11 of |Ip4 | [col. |pA de | | table IV | | }12 | | | | | | jReverse current | 4016 [DC method; Vp = column 11 of [Ipz | {Col. [pA de | | | table IV { | 13 | | | | | | | { jRegulator voltage { 4022 [172 = 20 mA de [Vz Col. Icol. | V de } (see 4.5.2) | | | | 3 | 4 | | | | | | | Small-signal | 4051 |Iza = 20 mA de, [Zz | |cot. | a | reverse breakdown | lIstg = 10% of 12 pms | | {| 6 | | impedance | | | I | | i | | | [ | . {Thermal impedance | 3101 [See 4.5.5 lZoux | } 35 | C/W | | | | | | | | | | I i | | J The electrical measurements for table IVb of MIL~S-19500 are as follows: a. Subgroup 2, see table III herein, steps 1, 3, 4, and 5. b. Subgroups 3 and 6, see table III herein, steps 2, 3, and 4. The electrical measurements for table V of MIL-S-19500 are as follows: a. Subgroup 2, see table III herein, steps 1, 3, 4, and 5. b. Subgroup 6, see table III herein, steps 2, 3, and 4. 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S oz | 0% | gel se fso | % | os | 202s | R667 | ug | LHoEsenul s70'0- | oo. | S ct | og 6d 2 | se (Cf ok |) Ost | Oost eee | 9097 | ety | L-D0S2N1 | gso'o- | 9 | 2 o'L | 066 | yz}o [orl er! os | 99671] 277 | ety | L-o6y2NL! 0900- | 5 zZ | O'l | QOOL | ov2 | COL | OvL | 02 | os | B6'E | Z29' | 6S | -2872NI| | s900- | 9 | or | ooo | otf ow jou | 2 | of | ease | ses's | ge | b-O2zenel oZo7o- =| OL | S oL | ooo | stl oe | ovr | ve | of | goers | vez | eve | L-o9ventl szo'o- | ot of ot | gor | st] seu tou | 62 | oo | se! wwe | ove | t-ozegene| ogoo- si oo. | 09 | ov | oop | eel om jour | oc | ost | gse2 | gvo'z | 2'2 | Leobesenel $80 O- | OSL | OOL OL | o00L | LL | ssl | OL | og | 002 | eyy2 | ese'2 | 72 | 204E7NL| | of % | yi | yi [ S2]0Aj Wu Tsaion| va | savoaT suo [ wt [ S310A | S2)0A T S2}OA{ ] | | | | | | | | | | | | | | [ [ | { i | | T Lb 109] | T vi 02} | | 3,Sz+ = Yul LL ae | | | | | ww] = Hal | | = @r| | aiwt, | s3uLod-pus | val | [| cuewy | | oz=l 9,08L+| | I 2e| | Bau | ysaa ali] 2.$z+ = Vil | | | | (Bas) | Zr] = Vy] xew | uw | wou | | Zap | eur | ae bey | Ya | WSZy | 2a | Wey | Zl ae Zz] ae 247] 2m fA Zq| adhy | | | | | | | | | | | | | | 51 10) | eb 109 | 2b 199 | tL a aU a 6 a g a 2197] 9 193] $101 9 7] 10)] 2 100, L109 | | MIL SPECS panul1uo} - (Sepolp eouesa]Oy WedJed Z) Solastvazoeseys Jeolsj0973 AT J18VL 45nee wan ne Veta ae | I ] | [ I [ | [ I | 1 | 4 | g0+ | Q | 2 | L | o6 | OOF | ote] se | ov | ov | aos Zb2ze| ee tL} ove@L| L-asant| oR | 9207+ | 0 2 | L | os | ovs |} vel or | 270 | 2 | 0s OLOL | 066 | or0H bagsent! = | | | a | 990+ | 0 | 2 | L | oz | os9 | wel so | 9 | os 066 | 6006 | L6 | L-dZS2NL| | 290+ | | Zz L | o9 | ove | sz | os go | | os zez2 | SLLs | 2'8 | L-agsantl o | gsov+ | oo. (| 7 | Z | os | os {| 99! 45 yo | + | os ses-2 | ser-2 | S72 | L-assent| | un | oso'+ | 0.) | 9 | 2 | oy | o2e | a9 | 09 so | | os g989 | 22"9 | 89 | L-aySZ2NL| | svo+ | Q | OL | S | ss | OL6 | zs | $9 90 | | Os 2929 | BEL9 | z9 | L-aesZNLl Mu | | | | | in , . . . | wys7 | 97s | L-a2seNL 90+ | gzoO- | oL | S | gs2 | os | 4 | Oe go | @ | os 959 " = | + "0- OL S i oe | 09% | gel se go | wt | os | uses | 6yovs | us | t-atsantl | ogo'+ | ogo , & | szo7+ | eyoo- | OL | S { sb | 086 | gal sg ol | sb | os dyt-y | =594 | 9 | -L-aoszntl : S | ozo+ | ssoo- | 9 | 2 | ov | o6 | v2 06 ol | gt | os sey | 2s2"9 | g7 | L-d642NL | o | os0'0- | 9 | Z | OL | O00L | oz | oo. | OL | 02 | og | 66 | L98" | 67 | L-d872NL ru | | | i - | o | s900- | 9 | | ov | coor | etl ow [ou }] 2 | of | oso | 995 | os | L-Q2972NL a < | 0 | ceoo- | oOo. | S | ot | goor | st] oz | or | ve | o | seers | 292" | ee | L-O972NL oa 8 | o | szoo- | oC Of | ot | coor | etl see jour |} 6e | oor | oso | ozez | ove | L-d22E4NL o & | o | ogoo- | oor | 09 | om | ooo | aul ov or | os | ost | deere | 292 | 22 | L-GLZEYNL 3 | o | sgoo- | osL | oo [ OL | DOOL | Lib | SSL | OvL | of | 002 | 927-2 | 92E2 | 92 | L-GOZE7NL | | | i = | 30/% | 3o/% | yi | yi | SI]OA yu | SL]OA | yu | STOR swyo | yi | SLIOA ! SLIOA : aa | | | | | a | | | | | TW 769] co oz | Lg | | | aosz+ = Vil LL 109] | | | | wu] = 3a] | | = 41] = | anmey | atwry | saurod-pua| = Yal | | cuiwy| | ozs 3,0st+] | 2e| | > | -sod | Bau | usar asta] 2,S2+ = 2| | | | (624) | Zz] = Va] xew | uu | wou | | | Zao | ZAv cay | ae LYy | IN | WSZy ! Za | WZy a ie 2 ie a ZA | A | "| add, | | | | | Tsp yoo | yb 107 1 eb 10> | eb 19 tL ves] OL real 6) i 81%) 2191 9 199) $191. 9 a t ia @ 100. b 19) | | | | | | | | | panuljuo) (Sapolp eslese}0} jUadded |) SoLjsluayoeseyo yeotyiseyg AT 318vL MIL SPECS 16MIL SPECS UE D MM 0000125 0034563 417 MEMILS MIL~S-19500/127M 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-S-19500. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory. ) 6.1 Notes. The notes specified in MIL~S-19500 are applicable to this specification. 6.2 Acquisition requirements. Acquisition documents shall specify the following: a. Issue of DODISS to be cited in the solicitation. b. Lead finish (see 3.3.1). c. for die acquisition, the JANHC letter version should be specified (see figures 3 and 4). d. Type designation and product assurance Level. 6.3 Cross reference substitution List. JANS level will no longer be built to this specification. Devices in stock are acceptable provided the date code does not exceed the date of implementation of this specification. Devices required for space high reliability applications shall meet requirements of MIL-S-19500/533. Existing supplies of the superseded parts may be used until exhausted. A PIN for PIN replacement table follows, and these devices are directly interchangeable: | JANS | JANS | |. superseded PIN [_ superseding PIN | { | | | 1N4370A-1, C-1 or D-1 | 4N6309, C, D | 1N4371A-1, C-1 or 0-1 | 1N6310, C, D | | 1N4372A-1, C-1 or D-1 | 1N6311, C, D | | IN746A-1, C-1 or D-1 | 1N6312, C, D | | IN747A-1, C-1 or D-1 | 1N6313, C, D | | IN748A-1, C-1 or 0-1 | 1N6314, C, D | | IN749A-1, C-1 or D-1 | 1N6315, C, D | 1N750A-1, C-1 or 0-1 | 1N6316, C, D | | IN751A~-1, C-1 or 0-1 | 1N6317, C, D | | N752A-1, C-1 or 0-1 | 1N6318, C, D | | 1N753A-1, C-1 or 0-1 | 1N6319, C, D | | 1N754A-1, C-1 or D-1 | 1N6320, C, 0 | | IN755A-1, C-1 or 0-1 | 4N6321, C, D | | 4N756A-1, C-1 or D-1_ | 1N6322, C, D | | IN7S7A-1, C-1 or 0-1 | 1N6323, C, D | | 1N758A-1, C-1 or D-1 | 1N6324, C, D IN7S9A-1, C-1 or D-1 | 1N6326, C, D | 17MIL SPECS WHE D MM O000125 0034564 353 MEMILS MIL~S-19500/127M 6.4 Maximum power versus lead temperature. Typical maximum power rating as a function of lead temperature for various lead lengths is shown on figure 6. 6.5 Suppliers of JANHC die. The qualified JANHC die suppliers with the applicable letter version (example JANHCA1N4370A) will be identified on the QPL. JANHC ordering information 1/ | 4/ Suffixes can be "A", "C", or "D". | | | | | | | PIN Manufacture CAGE | | | | 55801 | 12954 | | | | | | 1N4370 | JANHCA1N4370 | JANHCB1N4370 | | 1N43711 | JANHCA1N4371 | JANHCB1N4371_ | | 1N4372 | JANHCA1N4372 JANHCBING372 | { 4N746 | JANHCA1N746 JANHCBIN746 | | IN747 | JANHCA1N?747 JANHCBIN747 | | 1N748 | JANHCA1N748 JANHCBIN748 | | IN749 | JANHCA1N749 JANHCBIN749 | | 1N750 | JANHCAIN75O | JANHCB1N750 = | | 1N751 [ JANHCAIN751 | JANHCB1N751_ | | IN752 | JANHCA1N752 JANHCBIN752 | | AN753_ | JANHCAIN753 JANHCBIN753 | | 1N754 | JANHCAIN754 | JANHCBIN754_ | | 1N755 | JANHCAIN755 | JANHCB1N755 | | 1N756 | JANHCA1N756 JANHCBIN756 | | IN757 | JANHCA1N757 JANHCBIN757 | | 4N758 | JANHCAIN758 | JANHCBIN758 | | N59 | JANHCAIN759 | JANHCB1N759 | | 6.6 Changes from previous issue. Asterisks are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes. CONCLUDING MATERIAL Custodians: Preparing activity: Army - ER DLA - ES Navy - EC Air Force - 17 Agent: NASA ~- NA DLA - ES Review activities: (Project 5961-1631) Army - AR, AV, MI, SM Navy - AS, CG, MC Air Force - 13, 19, 85, 99 18