1. Product profile
1.1 General description
General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic
packages.
BAS40 series;
1PSxxSB4x series
General-purpose Schottky diodes
Rev. 08 — 13 January 2010 Product data sheet
Table 1. Product overview
Type number Package Configuration
NXP JEITA
1PS70SB40 SOT323 SC-70 single diode
1PS76SB40 SOD323 SC-76 single diode
1PS79SB40 SOD523 SC-79 single diode
BAS40 SOT23 - single diode
BAS40H SOD123F - single diode
BAS40L SOD882 - single diode
BAS40W SOT323 SC-70 single diode
1PS70SB44 SOT323 SC-70 dual series
BAS40-04 SOT23 - dual series
BAS40-04W SOT323 SC-70 dual series
1PS70SB45 SOT323 SC-70 dual common cathode
1PS75SB45 SOT416 SC-75 dual common cathode
BAS40-05 SOT23 - dual common cathode
BAS40-05W SOT323 SC-70 dual common cathode
1PS70SB46 SOT323 SC-70 dual common anode
BAS40-06 SOT23 - dual common anode
BAS40-06W SOT323 SC-70 dual common anode
BAS40-07 SOT143B - dual isolated
BAS40-07V SOT666 - dual isolated
BAS40-05V SOT666 - quadruple commo n cathode/
common cathode
1PS88SB48 SOT363 SC-88 quadruple common cathode/
common cathode
BAS40XY SOT363 SC-88 quadruple; 2 series
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 2 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
1.2 Features
1.3 Applications
1.4 Quick reference data
[1] Pulse test: tp≤300 μs; δ≤0.02.
2. Pinning information
High switching speed Low leakage current
High breakdo wn vo ltage Low capacitance
Ultra high-speed switching Voltage clamping
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
Per diode
IFforward current - - 120 mA
VFforward voltage IF=1mA [1] --380mV
VRreverse voltage - - 40 V
Table 3. Pinning
Pin Description Simplified outline Symbol
BAS40H; 1PS76SB40; 1PS79SB40
1 cathode [1]
2 anode
BAS40L
1 cathode [1]
2 anode
BAS40; BAS40W; 1PS70SB40
1 anode
2 not connected
3 cathode
001aab540
12
sym00
1
12
21
Transparent
top view
sym00
1
12
006aaa14
4
12
3
006aaa436
1
3
2
n.c.
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 3 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
BAS40-04; BAS40-04W; 1PS70SB44
1 anode (diode 1)
2 cathode (diode 2)
3 cathode (diode 1),
anode (diode 2)
BAS40-05; BAS40-05W; 1PS70SB45; 1PS75SB45
1 anode (diode 1)
2 anode (diode 2)
3 cathode (diode 1),
cathode (diode 2)
BAS40-06; BAS40-06W; 1PS70SB46
1 cathode (diode 1)
2 cathode (diode 2)
3 anode (diode 1),
anode (diode 2)
BAS40-07
1 cathode (diode 1)
2 cathode (diode 2)
3 anode (diode 2)
4 anode (diode 1)
BAS40-07V
1 anode (diode 1)
2 not connected
3 cathode (diode 2)
4 anode (diode 2)
5 not connected
6 cathode (diode 1)
Table 3. Pinning …continued
Pin Description Simplified outline Symbol
006aaa14
4
12
3
006aaa43
7
12
3
006aaa14
4
12
3
006aaa43
8
12
3
006aaa14
4
12
3
006aaa43
9
12
3
21
34
006aaa4
34
2
34
1
123
456
006aaa44
0
654
123
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 4 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
[1] The marking bar indicates the cathode.
BAS40-05V; 1PS88SB48
1 anode (diode 1)
2 anode (diode 2)
3 cathode (diode 3),
cathode (diode 4)
4 anode (diode 3)
5 anode (diode 4)
6 cathode (diode 1),
cathode (diode 2)
BAS40XY
1 anode (diode 1)
2 cathode (diode 2)
3 anode (diode 3),
cathode (diode 4)
4 anode (diode 4)
5 cathode (diode 3)
6 cathode (diode 1),
anode (diode 2)
Table 3. Pinning …continued
Pin Description Simplified outline Symbol
001aab55
5
6 45
1 32
006aaa44
6
654
123
132
4
56
006aaa25
654
123
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 5 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
3. Ordering information
Table 4. Ordering information
Type number Package
Name Description Version
1PS70SB40 SC-70 plastic surface-mounted package; 3 leads SOT323
1PS76SB40 SC-76 plastic surface-mounted package; 2 leads SOD323
1PS79SB40 SC-79 plastic surface-mounted package; 2 leads SOD523
BAS40 - plastic surface-mounted package; 3 leads SOT2 3
BAS40H - plastic surface-mounted package; 2 leads SOD123F
BAS40L - leadless ultra small plastic package; 2 terminals;
body 1.0 ×0.6 ×0.5 mm SOD882
BAS40W SC-70 plastic surface-mounted package; 3 leads SOT323
1PS70SB44 SC-70 plastic surface-mounted package; 3 leads SOT323
BAS40-04 - plastic surface-mounted package; 3 leads SOT23
BAS40-04W SC-70 plastic surface-mounted package; 3 leads SOT323
1PS70SB45 SC-70 plastic surface-mounted package; 3 leads SOT323
1PS75SB45 SC-75 plastic surface-mounted package; 3 leads SOT416
BAS40-05 - plastic surface-mounted package; 3 leads SOT23
BAS40-05W SC-70 plastic surface-mounted package; 3 leads SOT323
1PS70SB46 SC-70 plastic surface-mounted package; 3 leads SOT323
BAS40-06 - plastic surface-mounted package; 3 leads SOT23
BAS40-06W SC-70 plastic surface-mounted package; 3 leads SOT323
BAS40-07 - plastic surface-mounted package; 4 leads SOT1 43B
BAS40-07V - plastic surface-mounted package; 6 leads SOT666
BAS40-05V - plastic surface-mounted package; 6 leads SOT666
1PS88SB48 SC-88 plastic surface-mounted package; 6 leads SOT363
BAS40XY SC-88 plastic surface-mounted package; 6 leads SOT363
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 6 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
[1] Tj=25°C prior to surge.
Table 5. Marking codes
Type number Marking code[1] Type number Marking code[1]
1PS70SB40 6*3 1PS75SB45 45
1PS76SB40 S4 BAS40-05 45*
1PS79SB40 T BAS40-05W 65*
BAS40 43* 1PS70SB46 6*6
BAS40H AJ BAS40-06 46*
BAS40L S6 BAS40-06W 66*
BAS40W 63* BAS40-07 47*
1PS70SB44 6*4 BAS40-07V 67
BAS40-04 44* BAS40-05V 65
BAS40-04W 64* 1PS88SB48 8*5
1PS70SB45 6*5 BAS40XY 40*
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
VRreverse voltage - 40 V
IFforward current - 120 mA
IFRM repetitive peak forward
current tp≤1s; δ≤0.5 - 120 mA
IFSM non-repetitive peak forward
current tp≤10 ms [1] -200mA
Tjjunction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °C
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 7 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
6. Thermal characteristics
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
[1] Pulse test: tp≤300 μs; δ≤0.02.
Table 7. Thermal characteris tics
Symbol Parameter Conditions Min Typ Max Unit
Per device
Rth(j-a) thermal resistance from
junction to ambient in free air [1]
SOT23 - - 500 K/W
SOT143B - - 500 K/W
SOT363 (1PS88SB48) - - 416 K/W
SOT416 - - 833 K/W
SOT666 (BAS40-05V) [2] --225K/W
SOT666 (BAS40-07V) [2] --416K/W
SOD123F [2] --330K/W
SOD323 - - 450 K/W
SOD523 [2] --450K/W
SOD882 [2] --500K/W
SOT323 - - 625 K/W
Rth(j-sp) thermal resistance from
junction to solder point
SOT363 (BAS40XY) [3] --260K/W
Table 8. Characteristics
Tamb =25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per diode
VFforward voltage [1]
IF= 1 mA - - 380 mV
IF= 10 mA - - 500 mV
IF=40mA - - 1 V
IRreverse current VR=30V - - 1 μA
VR=40V - - 10 μA
Cddiode capacitance VR=0V; f=1MHz - - 5 pF
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 8 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
(1) Tamb = 125 °C
(2) Tamb =85°C
(3) Tamb =25°C
(4) Tamb =−40 °C
(1) Tamb = 125 °C
(2) Tamb =85°C
(3) Tamb =25°C
Fig 1. Forward current as a function of forward
voltage; typical values Fig 2. Reverse current as a function of reverse
voltage; typical values
f=10kHz T
amb =25°C; f = 1 MHz
Fig 3. Differential resist ance as a function of forward
current; typical values Fig 4. Dio de ca pacitance as a function of reverse
voltage; typical values
102
10−1
10−2
10
1
0
mlc361
0.6 0.80.40.2 1
VF (V)
IF
(mA)
(1) (2) (3) (4)
103
102
10−1
10−2
10
1
0
mlc362
2010 4030 VR (V)
IR
(μA)
(1)
(2)
(3)
mlc364
1
103
10−1102
110
102
10
rdif
(Ω)
IF (mA) 01020 4030
5
0
4
mlc363
3
2
1
VR (V)
C
d
(pF)
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 9 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
8. Package outline
Fig 5. Pac kage outline SOD323 (SC-76) Fig 6. Package outline SOD523 (SC -7 9)
Fig 7. Pac kage outline SOT23 (TO-236AB) Fig 8. Package outline SOD123F
Fig 9. Pac kage outline SOD882 Fig 10. Package outline SOT323 (SC-70)
03-12-17Dimensions in mm
0.25
0.10
0.45
0.15
2.7
2.3
1.8
1.6
0.40
0.25
1.1
0.8
1.35
1.15
1
2
02-12-13Dimensions in mm
1.65
1.55
1.25
1.15
0.17
0.11
0.34
0.26
0.65
0.58
0.85
0.75
1
2
04-11-04Dimensions in mm
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1
1.4
1.2
0.48
0.38
0.15
0.09
12
3
04-11-29Dimensions in mm
1.2
1.0
0.25
0.10
3.6
3.4
2.7
2.5
0.55
0.35
0.70
0.55
1.7
1.5
1
2
03-04-17Dimensions in mm
0.55
0.47
0.65
0.62
0.55
0.50
0.46
cathode marking on top side
1.02
0.95
0.30
0.22
0.30
0.22
2
1
04-11-04Dimensions in mm
0.45
0.15
1.1
0.8
2.2
1.8
2.2
2.0
1.35
1.15
1.3
0.4
0.3
0.25
0.10
12
3
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 10 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
Fig 11. Package outline SOT143B Fig 12. Package outline SOT363 (SC-88)
Fig 13. Package outline SOT416 (SC-75) Fig 14. Package outline SOT666
04-11-16Dimensions in mm
3.0
2.8 1.1
0.9
2.5
2.1
1.4
1.2
1.7
1.9
0.48
0.38
0.15
0.09
0.45
0.15
0.88
0.78
21
34
06-03-16Dimensions in mm
0.25
0.10
0.3
0.2
pin 1
index
1.3
0.65
2.2
2.0
1.35
1.15
2.2
1.8
1.1
0.8
0.45
0.15
132
465
04-11-04Dimensions in mm
0.95
0.60
1.8
1.4
1.75
1.45
0.9
0.7
0.25
0.10
1
0.30
0.15
12
30.45
0.15
Dimensions in mm 04-11-08
1.7
1.5
1.7
1.5
1.3
1.1
1
0.18
0.08
0.27
0.17
0.5
pin 1 index
123
456
0.6
0.5
0.3
0.1
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 11 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
9. Packing information
[1] For further information and the availability of packing methods, see Section 13.
[2] T1: normal taping
[3] T2: reverse taping
Table 9. Packing methods
The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000 4000 8000 10000
1PS70SB40 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
1PS76SB40 SOD323 4 mm pitch, 8 mm tape and reel -115 - - -135
1PS79SB40 SOD523 2 mm pitch, 8 mm tape and reel - - -315 -
4 mm pitch, 8 mm tape and reel -115 - - -135
BAS40 SOT23 4 mm pitch, 8 mm tape and reel -215 - - -235
BAS40H SOD123F 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS40L SOD8 82 2 mm pitch, 8 mm tape and reel - - - -315
BAS40W SOT323 4 mm pitch , 8 mm tape and reel -115 - - -135
1PS70SB44 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS40-04 SOT23 4 mm pitch , 8 mm tape and reel -215 - - -2 35
BAS40-04W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
1PS70SB45 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
1PS75SB45 SOT416 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS40-05 SOT23 4 mm pitch , 8 mm tape and reel -215 - - -2 35
BAS40-05W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
1PS70SB46 SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS40-06 SOT23 4 mm pitch , 8 mm tape and reel -215 - - -2 35
BAS40-06W SOT323 4 mm pitch, 8 mm tape and reel -115 - - -135
BAS40-07 SOT143B 4 mm pitch, 8 mm tape and reel -215 - - -235
BAS40-07V SOT666 2 mm pitch, 8 mm tape and reel - - -315 -
4 mm pitch, 8 mm tape and reel - -115 - -
BAS40-05V SOT666 2 mm pitch, 8 mm tape and reel - - -315 -
4 mm pitch, 8 mm tape and reel - -115 - -
1PS88SB48 SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165
BAS40XY SOT363 4 mm pitch, 8 mm tape and reel; T1 [2] -115 - - -135
4 mm pitch, 8 mm tape and reel; T2 [3] -125 - - -165
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 12 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
10. Soldering
Dimensions in mm
Fig 15. Reflow soldering footprint SOD323 (SC-76)
Dimensions in mm
Fig 16. Wave soldering footprint SOD323 (SC-76)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 17. Reflow soldering footprint SOD523 (SC-79)
msa433
1.65
0.50
(2×)
2.10
1.60
2.80
0.60
3.05
0.500.95
solder lands
solder resist
occupied area
solder paste
msa415
1.40
4.40
5.00
1.202.75
preferred transport direction during soldering
solder lands
solder resist
occupied area
mgs34
3
1.80
1.90
0.30
0.40
0.50
1.20 0.60
2.15
solder lands
solder resist
occupied area
solder paste
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 13 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
Dimensions in mm
Fig 18. Reflow soldering footprint SOT23 (TO-236AB)
Dimensions in mm
Fig 19. Wave soldering footprint SOT23 (TO-236AB)
MSA439
1.00
0.60
(3x)
1.30
12
3
2.50
3.00
0.85
2.70
2.90
0.50 (3x)
0.60 (3x)
3.30
0.85
solder lands
solder resist
occupied area
solder paste
MSA427
4.00
4.60
2.80
4.50
1.20
3.40
3
21
1.20 (2x)
preferred transport direction during soldering
solder lands
solder resist
occupied area
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 14 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 20. Reflow soldering footprint SOD123F
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 21. Reflow soldering foo tprin t SOD882
1.6
1.6
2.9
4
4.4
1.1 1.22.1
1.1
(2×)
solder lands
solder resist
occupied area
solder paste
mbl87
2
1.30
0.30R = 0.05 (8×) R = 0.05 (8×)
0.60
(2×)
0.70
(2×)
0.80
(2×)
0.90
0.30
(2×)
0.40
(2×)
0.50
(2×)
solder lands
solder resist
occupied area
solder paste
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 15 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
Fig 22. Reflow soldering footprint SOT323 (SC-70)
Fig 23. W ave soldering footprint SOT323 (SC-70)
msa429
0.852.35
0.55
(3×)
1.3250.75
2.40
2.65
1.30
3
2
1
0.60
(3×)
0.50
(3×)1.90
solder lands
solder resist
occupied area
solder paste
Dimensions in mm
msa41
9
4.00
4.60
2.103.65
1.15
2.70
3
2
10.90
(2×)
preferred transport direction during soldering
solder lands
solder resist
occupied area
Dimensions in mm
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 16 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
Dimensions in mm
Fig 24. Reflow soldering footprint SOT143B
Fig 25. Wave soldering footprint SOT143B
msa441
0.60
(4x)
1.30
2.50
3.00
2.70
0.50 (3x)
0.60 (3x)
3.25
43
21
0.90
1.00
solder lands
solder resist
occupied area
solder paste
msa422
4.00 4.60
1.20 (3×)
4.45
12
34
1.15
3.40
1.00 preferred transport direction during soldering
solder lands
solder resist
occupied area
Dimensions in mm
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 17 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
Fig 26. Reflow soldering footprint SOT363 (SC-88)
Fig 27. W ave soldering footprint SOT363 (SC-88)
solder lands
solder resist
occupied area
solder paste
sot363_
fr
2.65
2.35 0.4 (2×)
0.6
(2×)
0.5
(4×)
0.5
(4×)
0.6
(4×)
0.6
(4×)
1.5
1.8
Dimensions in mm
sot363_
fw
solder lands
solder resist
occupied area
preferred transport
direction during soldering
5.3
1.3 1.3
1.5
0.3
1.5
4.5
2.45
2.5
Dimensions in mm
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 18 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
Fig 28. Reflow soldering footprint SOT416
Reflow soldering is the only recommended soldering method.
Fig 29. Reflow soldering footprint SOT666
solder resist occupied area
solder lands solder pasteDimensions in mm
msa438
2.0
0.6
(3x)
0.7
1.5
1
2
3
1.1
2.2
0.5
(3x)
0.85
0.6
1.9
solder lands
placement area
occupied area
solder paste
sot666_
fr
2.75
2.45
2.1
1.6
0.4
(6×)
0.55
(2×)
0.25
(2×)
0.6
(2×)
0.65
(2×)
0.3
(2×)
0.325
(4×)
0.45
(4×)
0.5
(4×)
0.375
(4×)
1.72
1.7
1.075
0.538
Dimensions in mm
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 19 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
11. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BAS40_1PSXXSB4X_SER_8 20100113 Product data sheet - BAS40_1PSXXSB4X_SER_7
Modifications: •This data sheet was changed to reflec t the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
•Figure 12 “Package outline SOT363 (SC-88)”: updated
•Figure 16 “Wave soldering footprint SOD323 (SC-76)”: updated
•Figure 17 “Reflow soldering footprint SOD523 (SC-79)”: updated
•Figure 21 “Reflow soldering footprint SOD882 ”: updated
•Figure 22 “Reflow soldering footprint SOT323 (SC-70)”: updated
•Figure 23 “Wave soldering footprint SOT323 (SC-70)”: updated
•Figure 25 “Wave soldering footprint SOT143B”: updated
•Figure 26 “Reflow soldering footprint SOT363 (SC-88)”: updated
•Figure 27 “Wave soldering footprint SOT363 (SC-88)”: updated
•Figure 28 “Reflow soldering footprint SOT416”: updated
•Figure 29 “Reflow soldering footprint SOT666”: updated
BAS40_1PSXXSB4X_SER_7 20060512 Product data sheet - BAS40_1PSXXSB4X_SER_6
BAS40_1PSXXSB4X_SER_6 20050809 Product data sheet - 1PS70SB40_3
1PS75SB45_2
1PS76SB40_3
1PS79SB40_2
1PS88SB48_3 BAS4 0H_1
BAS40L_1 BAS40-05V_1
BAS40-07V_1 BAS40W_3
BAS40_SERIES_5
1PS70SB40_3 19990426 Product specification - 1PS70SB40_2
1PS75SB45_2 19990426 Product specification - 1PS75SB45_1
1PS76SB40_3 20040126 Product specification - 1PS76SB40_2
1PS79SB40_2 19990426 Product specification - 1PS79SB40_1
1PS88SB48_3 20021107 Product specification - 1PS88SB48_2
BAS40H_1 20050425 Product data sheet - -
BAS40L_1 20030520 Product specification - -
BAS40-05V_1 20021121 Product specification - -
BAS40-07V_1 20020327 Product specification - -
BAS40W_3 19990426 Product specification - BAS40W_2
BAS40_SERIES_5 20011010 Product specification - BAS40_4
BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 08 — 13 January 2010 20 of 21
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
12. Legal information
12.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warrant ies as to t he accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short dat a sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre va il.
12.3 Disclaimers
General — In formation in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give an y represent ations or
warranties, expressed or impli ed, as to the accuracy or completeness of such
information and shall have no liability for th e co nsequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for il lustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ra tings System of IEC 60134) may cause pe rmanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other co nditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may af fect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pert aining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between inf ormation in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Not hing in this document may be interpret ed or
construed as an of fer t o sell product s that is open for accept ance or the gr ant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulatio ns. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All refe renced brands, produc t names, service names and trademarks
are the property of their respective ow ners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contain s data from the objective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors BAS40 series; 1PSxxSB4x series
General-p u rpo s e Sc ho t tk y di od e s
© NXP B.V. 2010. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 January 2010
Document identifier: BAS40_1PSXXSB4X_SER_8
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 2
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 5
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 7
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
9 Packing information . . . . . . . . . . . . . . . . . . . . 11
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19
12 Le gal information. . . . . . . . . . . . . . . . . . . . . . . 20
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
13 Contact information. . . . . . . . . . . . . . . . . . . . . 20
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21