PICOCONNECT 914 - Pico Technology

XS1-L8A-128-QF124 Datasheet

2015/04/14 Document Number: X5358,

XS1-L8A-128-QF124 Datasheet 1

Table of Contents

1 xCORE Multicore Microcontrollers .............................. 2

2 XS1-L8A-128-QF124 Features ................................ 4

3 Pin Conﬁguration ....................................... 5

4 Signal Description ....................................... 6

5 Product Overview ....................................... 10

6 PLL ................................................ 13

7 Boot Procedure ......................................... 14

8 Memory ............................................. 16

9 JTAG ............................................... 17

10 Board Integration ....................................... 19

11 DC and Switching Characteristics .............................. 24

12 Package Information ..................................... 28

13 Ordering Information ..................................... 29

Appendices .............................................. 30

A Conﬁguration of the XS1 ................................... 30

B Processor Status Conﬁguration ............................... 32

C Tile Conﬁguration ....................................... 41

D Node Conﬁguration ...................................... 47

E XMOS USB Interface ...................................... 54

F Device Errata .......................................... 54

G JTAG, xSCOPE and Debugging ................................ 55

H Schematics Design Check List ................................ 57

I PCB Layout Design Check List ................................ 60

J Associated Design Documentation ............................. 61

K Related Documentation .................................... 61

L Revision History ........................................ 62

TO OUR VALUED CUSTOMERS

It is our intention to provide you with accurate and comprehensive documentation for the hardware and

software components used in this product. To subscribe to receive updates, visit http://www.xmos.com/.

XMOS Ltd. is the owner or licensee of the information in this document and is providing it to you “AS IS” with

no warranty of any kind, express or implied and shall have no liability in relation to its use. XMOS Ltd. makes

no representation that the information, or any particular implementation thereof, is or will be free from any

claims of infringement and again, shall have no liability in relation to any such claims.

XMOS and the XMOS logo are registered trademarks of XMOS Ltd in the United Kingdom and other countries,

and may not be used without written permission. Company and product names mentioned in this document

are the trademarks or registered trademarks of their respective owners.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 2

1 xCORE Multicore Microcontrollers

The XS1-L Series is a comprehensive range of 32-bit multicore microcontrollers

that brings the low latency and timing determinism of the xCORE architecture to

mainstream embedded applications. Unlike conventional microcontrollers, xCORE

multicore microcontrollers execute multiple real-time tasks simultaneously and

communicate between tasks using a high speed network. Because xCORE multicore

microcontrollers are completely deterministic, you can write software to implement

functions that traditionally require dedicated hardware.

SRAM

64KB

Security

OTP ROM

JTAG

debug

I/O Pins

Hardware

response

ports

xCORE logical core

xTIME: schedulers

timers, clocks

xCONNECT

channels, links

PLL

PLL SRAM

64KB

Security

OTP ROM

JTAG

debug

I/O Pins

Hardware

response

ports

xCORE logical core

xTIME: schedulers

timers, clocks

xCONNECT

channels, links

Figure 1:

XS1-L Series:

4-16 core

devices

Key features of the XS1-L8A-128-QF124 include:

·Tiles

: Devices consist of one or more xCORE tiles. Each tile contains between

four and eight 32-bit xCOREs with highly integrated I/O and on-chip memory.

·Logical cores

Each logical core can execute tasks such as computational code,

DSP code, control software (including logic decisions and executing a state

machine) or software that handles I/O. Section 5.1

·xTIME scheduler

The xTIME scheduler performs functions similar to an RTOS,

in hardware. It services and synchronizes events in a core, so there is no

requirement for interrupt handler routines. The xTIME scheduler triggers cores

on events generated by hardware resources such as the I/O pins, communication

channels and timers. Once triggered, a core runs independently and concurrently

to other cores, until it pauses to wait for more events. Section 5.2

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 3

·Channels and channel ends

Tasks running on logical cores communicate using

channels formed between two channel ends. Data can be passed synchronously

or asynchronously between the channel ends assigned to the communicating

tasks. Section 5.5

·xCONNECT Switch and Links

Between tiles, channel communications are im-

plemented over a high performance network of xCONNECT Links and routed

through a hardware xCONNECT Switch. Section 5.6

·Ports

The I/O pins are connected to the processing cores by Hardware Response

ports. The port logic can drive its pins high and low, or it can sample the value

on its pins optionally waiting for a particular condition. Section 5.3

·Clock blocks

xCORE devices include a set of programmable clock blocks that

can be used to govern the rate at which ports execute. Section 5.4

·Memory

Each xCORE Tile integrates a bank of SRAM for instructions and data,

and a block of one-time programmable (OTP) memory that can be conﬁgured for

system wide security features. Section 8

·PLL

The PLL is used to create a high-speed processor clock given a low speed

external oscillator. Section 6

·JTAG

The JTAG module can be used for loading programs, boundary scan testing,

in-circuit source-level debugging and programming the OTP memory. Section 9

1.1 Software

Devices are programmed using C, C++ or xC (C with multicore extensions). XMOS

provides tested and proven software libraries, which allow you to quickly add

interface and processor functionality such as USB, Ethernet, PWM, graphics driver,

and audio EQ to your applications.

1.2 xTIMEcomposer Studio

The xTIMEcomposer Studio development environment provides all the tools you

need to write and debug your programs, proﬁle your application, and write images

into ﬂash memory or OTP memory on the device. Because xCORE devices oper-

ate deterministically, they can be simulated like hardware within xTIMEcomposer:

uniquely in the embedded world, xTIMEcomposer Studio therefore includes a static

timing analyzer, cycle-accurate simulator, and high-speed in-circuit instrumenta-

tion.

xTIMEcomposer can be driven from either a graphical development environment,

or the command line. The tools are supported on Windows, Linux and MacOS X

and available at no cost from xmos.com/downloads. Information on using the

tools is provided in the xTIMEcomposer User Guide, X3766.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 4

2 XS1-L8A-128-QF124 Features

·Multicore Microcontroller with Advanced Multi-Core RISC Architecture

•Eight real-time logical cores on 2 xCORE tiles

•Cores share up to 500 MIPS

•Each logical core has:

— Guaranteed throughput of 1

/4of tile MIPS

— 16x32bit dedicated registers

•159 high-density 16/32-bit instructions

— All have single clock-cycle execution (except for divide)

—

32x32

→

64-bit MAC instructions for DSP, arithmetic and user-deﬁnable cryptographic

functions

·Programmable I/O

•28 general-purpose I/O pins, conﬁgurable as input or output

— Up to 32 x 1bit port, 12 x 4bit port, 7 x 8bit port, 3 x 16bit port

— 4 xCONNECT links

•Port sampling rates of up to 60 MHz with respect to an external clock

•64 channel ends for communication with other cores, on or oﬀ-chip

·Memory

•128KB internal single-cycle SRAM (max 64KB per tile) for code and data storage

•8KB internal OTP (max 8KB per tile) for application boot code

·Hardware resources

•12 clock blocks (6 per tile)

•20 timers (10 per tile)

•8 locks (4 per tile)

·JTAG Module for On-Chip Debug

·Security Features

•Programming lock disables debug and prevents read-back of memory contents

•AES bootloader ensures secrecy of IP held on external ﬂash memory

·Ambient Temperature Range

•Commercial qualiﬁcation: 0 °C to 70 °C

•Industrial qualiﬁcation: -40 °C to 85 °C

·Speed Grade

•10: 1000 MIPS

•8: 800 MIPS

·Power Consumption

•Active Mode

— 400 mA at 500 MHz (typical)

— 320 mA at 400 MHz (typical)

•Standby Mode

— 28 mA

·124-pin QF124 package 0.5 mm pitch

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 5

3 Pin Conﬁguration

GND

VDDIO

X0D35

X0D34

X0D02

X0D03

X0D04

X0D05

X0D06

A10

X0D07

A11

X0D08

A12

X0D09

A13

X0D10

A14

X0D11

A15

X0D00

A16

X0D01

A17

VDDIO

A18

GND

VDDIO

PCU_

WAKE

PCU_

GATE

PCU_

VDDIO

PCU_

VDD

PCU_

CLK

RST_N

TDO

B10

TCK

B11

TMS

B12

TDI

B13

TRST_

B14

VDDIO

A52

GND

A51

VDDIO

A50

X1D11

A49

X1D10

A48

X1D09

A47

X1D08

A46

X1D07

A45

X1D06

A44

X1D05

A43

X1D04

A42

X1D03

A41

X1D02

A40

X1D01

A39

X1D00

A38

PLL_

AVDD

A37

PLL_

AGND

A36

VDDIO

A35

MODE[4]

B42

VDDIO

B41

X0D29

B40

X0D28

B39

X0D27

B38

X0D26

B37

DEBUG_

B36

MODE[3]

B35

MODE[2]

B34

MODE[1]

B33

MODE[0]

B32

OTP_

VCC

B31

X1D39

B30

X1D38

B29

VDDIO

A19

VDD

A20

X1D24

A21

X1D12

A22

X1D22

A23

X1D13

A24

X1D14

A25

X1D15

A26

X1D16

A27

X1D17

A28

X1D23

A29

X1D18

A30

X1D19

A31

X1D20

A32

X1D21

A33

X1D25

A34

VDD

B15

VDD

B16

X1D26

B17

X1D27

B18

X1D28

B19

X1D29

B20

X1D30

B21

X1D31

B22

X1D32

B23

X1D33

B24

X1D34

B25

X1D35

B26

X1D36

B27

X1D37

B28

VDD

A68

VDD

A67

X0D25

A66

X0D21

A65

X0D20

A64

X0D19

A63

X0D18

A62

X0D23

A61

X0D17

A60

X0D16

A59

X0D15

A58

X0D14

A57

X0D13

A56

X0D22

A55

X0D12

A54

X0D24

A53

VDD

B56

VDD

B55

X0D43

B54

X0D42

B53

X0D41

B52

X0D40

B51

X0D39

B50

X0D38

B49

X0D37

B48

X0D36

B47

X0D33

B46

X0D32

B45

X0D31

B44

X0D30

B43

VDD

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 6

4 Signal Description

This section lists the signals and I/O pins available on the XS1-L8A-128-QF124.

The device provides a combination of 1bit, 4bit, 8bit and 16bit ports, as well as

wider ports that are fully or partially (gray) bonded out. All pins of a port provide

either output or input, but signals in diﬀerent directions cannot be mapped onto

the same port.

Pins may have one or more of the following properties:

PD/PU: The IO pin a weak pull-down or pull-up resistor. On GPIO pins this

resistor can be enabled.

·ST: The IO pin has a Schmitt Trigger on its input.

Power pins (6)

Signal Function Type Properties

GND Digital ground GND

OTP_VCC OTP power supply PWR

PLL_AGND Analog ground for PLL GND

PLL_AVDD Analog PLL power PWR

VDD Digital tile power PWR

VDDIO Digital I/O power PWR

Clocks pins (2)

Signal Function Type Properties

CLK PLL reference clock Input PD, ST

MODE[4:0] Boot mode select Input PU, ST

JTAG pins (7)

Signal Function Type Properties

DEBUG_N Multi-chip debug I/O PU

RST_N Global reset input Input PU, ST

TCK Test clock Input PU, ST

TDI Test data input Input PU, ST

TDO Test data output Output PD, OT

TMS Test mode select Input PU, ST

TRST_N Test reset input Input PU, ST

I/O pins (84)

Signal Function Type Properties

X0D00 1A0I/O PDS, RS

(continued)

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 7

Signal Function Type Properties

X0D01 XLA4

out 1B0I/O PDS, RS

X0D02 XLA3

out 4A08A016A032A20 I/O PDS, RU

X0D03 XLA2

out 4A18A116A132A21 I/O PDS, RU

X0D04 XLA1

out 4B08A216A232A22 I/O PDS, RU

X0D05 XLA0

out 4B18A316A332A23 I/O PDS, RU

X0D06 XLA0

in 4B28A416A432A24 I/O PDS, RU

X0D07 XLA1

in 4B38A516A532A25 I/O PDS, RU

X0D08 XLA2

in 4A28A616A632A26 I/O PDS, RU

X0D09 XLA3

in 4A38A716A732A27 I/O PDS, RU

X0D10 XLA4

in 1C0I/O PDS, RS

X0D11 1D0I/O PDS, RS

X0D12 1E0I/O PDS, RU

X0D13 XLB4

out 1F0I/O PDS, RU

X0D14 XLB3

out 4C08B016A832A28 I/O PDS, RU

X0D15 XLB2

out 4C18B116A932A29 I/O PDS, RU

X0D16 XLB1

out 4D08B216A10 I/O PDS, RU

X0D17 XLB0

out 4D18B316A11 I/O PDS, RU

X0D18 XLB0

in 4D28B416A12 I/O PDS, RU

X0D19 XLB1

in 4D38B516A13 I/O PDS, RU

X0D20 XLB2

in 4C28B616A14 32A30 I/O PDS, RU

X0D21 XLB3

in 4C38B716A15 32A31 I/O PDS, RU

X0D22 XLB4

in 1G0I/O PDS, RU

X0D23 1H0I/O PDS, RU

X0D24 1I0I/O PDS

X0D25 1J0I/O PDS

X0D26 4E08C016B0I/O PDS, RU

X0D27 4E18C116B1I/O PDS, RU

X0D28 4F08C216B2I/O PDS, RU

X0D29 4F18C316B3I/O PDS, RU

X0D30 4F28C416B4I/O PDS, RU

X0D31 4F38C516B5I/O PDS, RU

X0D32 4E28C616B6I/O PDS, RU

X0D33 4E38C716B7I/O PDS, RU

X0D34 1K0I/O PDS

X0D35 1L0I/O PDS

X0D36 1M08D016B8I/O PDS

X0D37 1N08D116B9I/O PDS, RU

X0D38 1O08D216B10 I/O PDS, RU

X0D39 1P08D316B11 I/O PDS, RU

X0D40 8D416B12 I/O PDS, RU

X0D41 8D516B13 I/O PDS, RU

X0D42 8D616B14 I/O PDS, RU

X0D43 8D716B15 I/O PUS, RU

(continued)

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 8

Signal Function Type Properties

X1D00 1A0I/O PDS, RS

X1D01 XLA4

out 1B0I/O PDS, RS

X1D02 XLA3

out 4A08A016A032A20 I/O PDS, RU

X1D03 XLA2

out 4A18A116A132A21 I/O PDS, RU

X1D04 XLA1

out 4B08A216A232A22 I/O PDS, RU

X1D05 XLA0

out 4B18A316A332A23 I/O PDS, RU

X1D06 XLA0

in 4B28A416A432A24 I/O PDS, RU

X1D07 XLA1

in 4B38A516A532A25 I/O PDS, RU

X1D08 XLA2

in 4A28A616A632A26 I/O PDS, RU

X1D09 XLA3

in 4A38A716A732A27 I/O PDS, RU

X1D10 XLA4

in 1C0I/O PDS, RS

X1D11 1D0I/O PDS, RS

X1D12 1E0I/O PDS, RU

X1D13 XLB4

out 1F0I/O PDS, RU

X1D14 XLB3

out 4C08B016A832A28 I/O PDS, RU

X1D15 XLB2

out 4C18B116A932A29 I/O PDS, RU

X1D16 XLB1

out 4D08B216A10 I/O PDS, RU

X1D17 XLB0

out 4D18B316A11 I/O PDS, RU

X1D18 XLB0

in 4D28B416A12 I/O PDS, RU

X1D19 XLB1

in 4D38B516A13 I/O PDS, RU

X1D20 XLB2

in 4C28B616A14 32A30 I/O PDS, RU

X1D21 XLB3

in 4C38B716A15 32A31 I/O PDS, RU

X1D22 XLB4

in 1G0I/O PDS, RU

X1D23 1H0I/O PDS, RU

X1D24 1I0I/O PDS

X1D25 1J0I/O PDS

X1D26 4E08C016B0I/O PDS, RU

X1D27 4E18C116B1I/O PDS, RU

X1D28 4F08C216B2I/O PDS, RU

X1D29 4F18C316B3I/O PDS, RU

X1D30 4F28C416B4I/O PDS, RU

X1D31 4F38C516B5I/O PDS, RU

X1D32 4E28C616B6I/O PDS, RU

X1D33 4E38C716B7I/O PDS, RU

X1D34 1K0I/O PDS

X1D35 1L0I/O PDS

X1D36 1M08D016B8I/O PDS

X1D37 1N08D116B9I/O PDS, RU

X1D38 1O08D216B10 I/O PDS, RU

X1D39 1P08D316B11 I/O PDS, RU

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 9

pins (5)

Signal Function Type Properties

PCU_CLK Clock input

PCU_GATE Power control gate control

PCU_VDD PCU tile power

PCU_VDDIO PCU I/O supply

PCU_WAKE Wakeup reset

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 10

5 Product Overview

The XS1-L8A-128-QF124 is a powerful device that consists of two xCORE Tiles,

each comprising a ﬂexible logical processing cores with tightly integrated I/O and

on-chip memory.

5.1 Logical cores

Each tile has up to 4 active logical cores, which issue instructions down a shared

four-stage pipeline. Instructions from the active cores are issued round-robin. Each

core is allocated a quarter of the processing cycles. Figure 2shows the guaranteed

core performance.

Speed MIPS Frequency MIPS per

grade logical core

8 800 MIPS 400 MHz 100

10 1000 MIPS 500 MHz 125

Figure 2:

Logical core

performance

There is no way that the performance of a logical core can be reduced below these

predicted levels.

The logical cores are triggered by events instead of interrupts and run to completion.

A logical core can be paused to wait for an event.

5.2 xTIME scheduler

The xTIME scheduler handles the events generated by xCORE Tile resources, such

as channel ends, timers and I/O pins. It ensures that all events are serviced and

synchronized, without the need for an RTOS. Events that occur at the I/O pins are

handled by the Hardware-Response ports and fed directly to the appropriate xCORE

Tile. An xCORE Tile can also choose to wait for a speciﬁed time to elapse, or for

data to become available on a channel.

Tasks do not need to be prioritised as each of them runs on their own logical

xCORE. It is possible to share a set of low priority tasks on a single core using

cooperative multitasking.

5.3 Hardware Response Ports

Hardware Response ports connect an xCORE tile to one or more physical pins and

as such deﬁne the interface between hardware attached to the XS1-L8A-128-QF124,

and the software running on it. A combination of 1bit, 4bit, 8bit, 16bit and 32bit

ports are available. All pins of a port provide either output or input. Signals in

diﬀerent directions cannot be mapped onto the same port.

The port logic can drive its pins high or low, or it can sample the value on its pins,

optionally waiting for a particular condition. Ports are accessed using dedicated

instructions that are executed in a single processor cycle.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 11

PINS

readyIn port

CORE

PORT

SERDES

FIFO

clock

block

transfer

port counter

port

value

clock port

reference clock

stamp/time

port

logic

output (drive) input (sample)

conditional

value

readyOut

Figure 3:

Port block

diagram

Data is transferred between the pins and core using a FIFO that comprises a SERDES

and transfer register, providing options for serialization and buﬀered data.

Each port has a 16-bit counter that can be used to control the time at which data is

transferred between the port value and transfer register. The counter values can

be obtained at any time to ﬁnd out when data was obtained, or used to delay I/O

until some time in the future. The port counter value is automatically saved as a

timestamp, that can be used to provide precise control of response times.

The ports and xCONNECT links are multiplexed onto the physical pins. If an

xConnect Link is enabled, the pins of the underlying ports are disabled. If a port

is enabled, it overrules ports with higher widths that share the same pins. The pins

on the wider port that are not shared remain available for use when the narrower

port is enabled. Ports always operate at their speciﬁed width, even if they share

pins with another port.

5.4 Clock blocks

xCORE devices include a set of programmable clocks called clock blocks that can

be used to govern the rate at which ports execute. Each xCORE tile has six clock

blocks: the ﬁrst clock block provides the tile reference clock and runs at a default

frequency of 100MHz; the remaining clock blocks can be set to run at diﬀerent

frequencies.

A clock block can use a 1-bit port as its clock source allowing external application

clocks to be used to drive the input and output interfaces.

In many cases I/O signals are accompanied by strobing signals. The xCORE ports

can input and interpret strobe (known as readyIn and readyOut) signals generated

by external sources, and ports can generate strobe signals to accompany output

data.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 12

readyIn

... ...

clock block

port counter

1-bit portdivider

100MHz

reference

clock

Figure 4:

Clock block

diagram

On reset, each port is connected to clock block 0, which runs from the xCORE Tile

reference clock.

5.5 Channels and Channel Ends

Logical cores communicate using point-to-point connections, formed between two

channel ends. A channel-end is a resource on an xCORE tile, that is allocated by

the program. Each channel-end has a unique system-wide identiﬁer that comprises

a unique number and their tile identiﬁer. Data is transmitted to a channel-end by

an output-instruction; and the other side executes an input-instruction. Data can

be passed synchronously or asynchronously between the channel ends.

5.6 xCONNECT Switch and Links

XMOS devices provide a scalable architecture, where multiple xCORE devices can

be connected together to form one system. Each xCORE device has an xCONNECT

interconnect that provides a communication infrastructure for all tasks that run on

the various xCORE tiles on the system.

The interconnect relies on a collection of switches and XMOS links. Each xCORE

device has an on-chip switch that can set up circuits or route data. The switches

are connected by xConnect Links. An XMOS link provides a physical connection

between two switches. The switch has a routing algorithm that supports many

diﬀerent topologies, including lines, meshes, trees, and hypercubes.

The links operate in either 2 wires per direction or 5 wires per direction mode,

depending on the amount of bandwidth required. Circuit switched, streaming

and packet switched data can both be supported eﬃciently. Streams provide the

fastest possible data rates between xCORE Tiles (up to 250 MBit/s), but each stream

requires a single link to be reserved between switches on two tiles. All packet

communications can be multiplexed onto a single link.

Information on the supported routing topologies that can be used to connect

multiple devices together can be found in the XS1-L Link Performance and Design

Guide, X2999.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 13

CORE CORE

CORE

CORE CORE

CORE

xCONNECT Link to another device switch

CORE

CORE CORE

xCORE Tile xCORE Tile

xCONNECT

switch

Figure 5:

Switch, links

and channel

ends

6 PLL

The PLL creates a high-speed clock that is used for the switch, tile, and reference

clock.

The PLL multiplication value is selected through the two MODE pins, and can be

changed by software to speed up the tile or use less power. The MODE pins are set

as shown in Figure 6:

Oscillator MODE Tile PLL Ratio PLL settings

Frequency 1 0 Frequency OD F R

5-13 MHz 0 0 130-399.75 MHz 30.75 1 122 0

13-20 MHz 1 1 260-400.00 MHz 20 2 119 0

20-48 MHz 1 0 167-400.00 MHz 8.33 2 49 0

48-100 MHz 0 1 196-400.00 MHz 4 2 23 0

Figure 6:

PLL multiplier

values and

MODE pins

Figure 6also lists the values of

and

, which are the registers that deﬁne

the ratio of the tile frequency to the oscillator frequency:

Fcor e =Fosc ×F+1

2×

R+1×

OD +1

and

must be chosen so that 0

≤R≤

63,0

≤F≤

4095,0

≤OD ≤

7, and

260

MHz ≤Fosc ×F+1

2×1

R+1≤

GHz

. The

, and

values can be modiﬁed

by writing to the digital node PLL conﬁguration register.

The MODE pins must be held at a static value during and after deassertion of the

system reset.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 14

If a diﬀerent tile frequency is required (eg, 500 MHz), then the PLL must be

reprogrammed after boot to provide the required tile frequency. The XMOS tools

perform this operation by default. Further details on conﬁguring the clock can be

found in the XS1-L Clock Frequency Control document, X1433.

7 Boot Procedure

The device is kept in reset by driving RST_N low. When in reset, all GPIO pins are

high impedance. When the device is taken out of reset by releasing RST_N the

processor starts its internal reset process. After 15-150

s (depending on the input

clock), all GPIO pins have their internal pull-resistor enabled, and the processor

boots at a clock speed that depends on MODE0 and MODE1.

The xCORE Tile boot procedure is illustrated in Figure 7. In normal usage,

MODE[4:2] controls the boot source according to the table in Figure 8. If bit

5 of the security register (see §8.1) is set, the device boots from OTP.

Start

Execute program

Primary boot

Bit [5] set

Boot according to

boot source pins

Copy OTP contents

to base of SRAM

Boot ROM

Yes

Security Register

OTP

Figure 7:

Boot

procedure

MODE MODE MODE Boot Source

[4] [3] [2]

X 0 0 None: Device waits to be booted via JTAG

X 0 1 Reserved

0 1 0 Tile0 boots from link B, Tile1 from channel end 0 via Tile0

0 1 1 Tile0 boots from SPI, Tile1 from channel end 0 via Tile0

1 1 0

Tile0 and Tile1 independently enable link B and internal links

(E, F, G, H), and boot from channel end 0

1 1 1 Tile0 and Tile 1 boot from SPI independently

Figure 8:

Boot source

pins

The boot image has the following format:

·A 32-bit program size sin words.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 15

·Program consisting of s×4bytes.

A 32-bit CRC, or the value 0x0D15AB1E to indicate that no CRC check should be

performed.

The program size and CRC are stored least signiﬁcant byte ﬁrst. The program

is loaded into the lowest memory address of RAM, and the program is started

from that address. The CRC is calculated over the byte stream represented by the

program size and the program itself. The polynomial used is 0xEDB88320 (IEEE

802.3); the CRC register is initialized with 0xFFFFFFFF and the residue is inverted

to produce the CRC.

7.1 Boot from SPI master

If set to boot from SPI master, the processor enables the four pins speciﬁed in

Figure 9, and drives the SPI clock at 2.5 MHz (assuming a 400 MHz core clock). A

READ command is issued with a 24-bit address 0x000000. The clock polarity and

phase are 0 / 0.

Pin Signal Description

X0D00 MISO Master In Slave Out (Data)

X0D01 SS Slave Select

X0D10 SCLK Clock

X0D11 MOSI Master Out Slave In (Data)

Figure 9:

SPI master

pins

The xCORE Tile expects each byte to be transferred with the least-signiﬁcant bit

ﬁrst. Programmers who write bytes into an SPI interface using the most signiﬁcant

bit ﬁrst may have to reverse the bits in each byte of the image stored in the SPI

device.

If a large boot image is to be read in, it is faster to ﬁrst load a small boot-loader

that reads the large image using a faster SPI clock, for example 50 MHz or as fast

as the ﬂash device supports.

The pins used for SPI boot are hardcoded in the boot ROM and cannot be changed.

If required, an SPI boot program can be burned into OTP that uses diﬀerent pins.

7.2 Boot from xConnect Link

If set to boot from an xConnect Link, the processor enables Link B around 200

ns after the boot process starts. Enabling the Link switches oﬀ the pull-down on

resistors X0D16..X0D19, drives X0D16 and X0D17 low (the initial state for the

Link), and monitors pins X0D18 and X0D19 for boot-traﬃc. X0D18 and X0D19

must be low at this stage. If the internal pull-down is too weak to drain any residual

charge, external pull-downs of 10K may be required on those pins.

The boot-rom on the core will then:

1. Allocate channel-end 0.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 16

Input a word on channel-end 0. It will use this word as a channel to acknowledge

the boot. Provide the null-channel-end 0x0000FF02 if no acknowledgment is

required.

3. Input the boot image speciﬁed above, including the CRC.

4. Input an END control token.

5. Output an END control token to the channel-end received in step 2.

6. Free channel-end 0.

7. Jump to the loaded code.

7.3 Boot from OTP

If an xCORE tile is set to use secure boot (see Figure 7), the boot image is read

from address 0 of the OTP memory in the tile’s security module.

This feature can be used to implement a secure bootloader which loads an en-

crypted image from external ﬂash, decrypts and CRC checks it with the processor,

and discontinues the boot process if the decryption or CRC check fails. XMOS

provides a default secure bootloader that can be written to the OTP along with

secret decryption keys.

Each tile has its own individual OTP memory, and hence some tiles can be booted

from OTP while others are booted from SPI or the channel interface. This enables

systems to be partially programmed, dedicating one or more tiles to perform a

particular function, leaving the other tiles user-programmable.

7.4 Security register

The security register enables security features on the xCORE tile. The features

shown in Figure 10 provide a strong level of protection and are suﬃcient for

providing strong IP security.

8 Memory

8.1 OTP

Each xCORE Tile integrates 8 KB one-time programmable (OTP) memory along with

a security register that conﬁgures system wide security features. The OTP holds

data in four sectors each containing 512 rows of 32 bits which can be used to

implement secure bootloaders and store encryption keys. Data for the security

from the OTP to SRAM and executed ﬁrst on the processor.

The OTP memory is programmed using three special I/O ports: the OTP address

port is a 16-bit port with resource ID 0x100200, the OTP data is written via a 32-bit

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 17

Feature Bit Description

Disable JTAG 0

The JTAG interface is disabled, making it impossible

for the tile state or memory content to be accessed

via the JTAG interface.

Disable Link access 1

Other tiles are forbidden access to the processor state

via the system switch. Disabling both JTAG and Link

access transforms an xCORE Tile into a “secure island”

with other tiles free for non-secure user application

code.

Secure Boot 5

The xCORE Tile is forced to boot from address 0 of

the OTP, allowing the xCORE Tile boot ROM to be

bypassed (see §7).

Redundant rows 7 Enables redundant rows in OTP.

Sector Lock 0 8 Disable programming of OTP sector 0.

Sector Lock 1 9 Disable programming of OTP sector 1.

Sector Lock 2 10 Disable programming of OTP sector 2.

Sector Lock 3 11 Disable programming of OTP sector 3.

OTP Master Lock 12

Disable OTP programming completely: disables up-

dates to all sectors and security register.

Disable JTAG-OTP 13

Disable all (read & write) access from the JTAG inter-

face to this OTP.

Disable Global Debug 14 Disables access to the DEBUG_N pin.

21..15

General purpose software accessable security register

available to end-users.

31..22

General purpose user programmable JTAG UserID

code extension.

Figure 10:

Security

features

port with resource ID 0x200100, and the OTP control is on a 16-bit port with ID

0x100300. Programming is performed through libotp and xburn.

8.2 SRAM

Each xCORE Tile integrates a single 64KB SRAM bank for both instructions and

data. All internal memory is 32 bits wide, and instructions are either 16-bit or

32-bit. Byte (8-bit), half-word (16-bit) or word (32-bit) accesses are supported and

are executed within one tile clock cycle. There is no dedicated external memory

interface, although data memory can be expanded through appropriate use of the

ports.

9 JTAG

The JTAG module can be used for loading programs, boundary scan testing, in-

circuit source-level debugging and programming the OTP memory.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 18

X0 X1

TDI TDO

TCK

TMS

TRST_N

DEBUG_N

BS TAP BS TAP CHIP TAPCHIP TAP

TDITDI TDI TDI TDOTDOTDOTDO

Figure 11:

JTAG chain

structure

The JTAG chain structure is illustrated in Figure 11. Directly after reset, two TAP

controllers are present in the JTAG chain for each xCORE Tile: the boundary scan

TAP and the chip TAP. The boundary scan TAP is a standard 1149.1 compliant TAP

that can be used for boundary scan of the I/O pins. The chip TAP provides access

into the xCORE Tile, switch and OTP for loading code and debugging.

The TRST_N pin must be asserted low during and after power up for 100 ns. If JTAG

is not required, the TRST_N pin can be tied to ground to hold the JTAG module in

reset.

The DEBUG_N pin is used to synchronize the debugging of multiple xCORE Tiles.

This pin can operate in both output and input mode. In output mode and when

conﬁgured to do so, DEBUG_N is driven low by the device when the processor hits

a debug break point. Prior to this point the pin will be tri-stated. In input mode

and when conﬁgured to do so, driving this pin low will put the xCORE Tile into

debug mode. Software can set the behavior of the xCORE Tile based on this pin.

This pin should have an external pull up of 4K7-47K

Ω

or left not connected in

single core applications.

The JTAG device identiﬁcation register can be read by using the IDCODE instruction.

Its contents are speciﬁed in Figure 12.

Bit31 Device Identiﬁcation Register Bit0

Version Part Number Manufacturer Identity 1

00000000000000000010011000110011

0 0 0 0 2 6 3 3

Figure 12:

IDCODE

return value

The JTAG usercode register can be read by using the USERCODE instruction. Its

contents are speciﬁed in Figure 13. The OTP User ID ﬁeld is read from bits [22:31]

of the security register on xCORE Tile 0, see §8.1 (all zero on unprogrammed

devices).

Bit31 Usercode Register Bit0

OTP User ID Unused Silicon Revision

00000000000000101000000000000000

0 0 0 2 8 0 0 0

Figure 13:

USERCODE

return value

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 19

9.1 PCU

PCU_WAKE should be left unconnected, PCU_GATE should be left unconnected and

PCU_CLK must be tied to CLK.

10 Board Integration

The device has the following power supply pins:

·VDD pins for the xCORE Tile

·VDDIO pins for the I/O lines

·PLL_AVDD pins for the PLL

·PCU_VDD and PCU_VDDIO pins for the PCU

·OTP_VCC pins for the OTP

Several pins of each type are provided to minimize the eﬀect of inductance within

the package, all of which must be connected. The power supplies must be brought

up monotonically and input voltages must not exceed speciﬁcation at any time.

The VDD supply must ramp from 0 V to its ﬁnal value within 10 ms to ensure

correct startup.

The VDDIO and OTP_VCC supply must ramp to its ﬁnal value before VDD reaches

0.4 V.

The PLL_AVDD supply should be separated from the other noisier supplies on

the board. The PLL requires a very clean power supply, and a low pass ﬁlter (for

example, a 2.2

Ω

resistor and 100 nF multi-layer ceramic capacitor) is recommended

on this pin.

The PCU_VDD supply must be connected to the VDD supply.

The PCU_VDDIO supply must be connected to the VDDIO supply.

The OTP_VCC supply should be connected to the VDDIO supply.

The following ground pins are provided:

·PLL_AGND for PLL_AVDD

·GND for all other supplies

All ground pins must be connected directly to the board ground.

The VDD and VDDIO supplies should be decoupled close to the chip by several

100 nF low inductance multi-layer ceramic capacitors between the supplies and

GND (for example, 4x100nF 0402 low inductance MLCCs per supply rail). The

ground side of the decoupling capacitors should have as short a path back to the

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 20

GND pins as possible. A bulk decoupling capacitor of at least 10 uF should be

placed on each of these supplies.

RST_N is an active-low asynchronous-assertion global reset signal. Following a

reset, the PLL re-establishes lock after which the device boots up according to the

boot mode (see §7). RST_N and must be asserted low during and after power up

for 100 ns.

10.1 Land patterns and solder stencils

The land pattern recommendations in this document are based on a RoHS compliant

process and derived, where possible, from the nominal Generic Requirements for

Surface Mount Design and Land Pattern Standards

IPC-7351B

speciﬁcations. This

standard aims to achieve desired targets of heel, toe and side ﬁllets for solder-

joints.

Solder paste and ground via recommendations are based on our engineering and

development kit board production. They have been found to work and optimized

as appropriate to achieve a high yield. The size, type and number of vias used in

the center pad aﬀects how much solder wicks down the vias during reﬂow. This in

turn, along with solder paster coverage, aﬀects the ﬁnal assembled package height.

These factors should be taken into account during design and manufacturing of

the PCB.

The following land patterns and solder paste contains recommendations. Final land

pattern and solder paste decisions are the responsibility of the customer. These

should be tuned during manufacture to suit the manufacturing process.

The package is a 124 pin dual row Quad Flat No lead package with exposed heat

slug on a 0.5mm pitch. An example land pattern is shown in Figure 14.

Pad widths and spacings are such that solder mask can still be applied between the

pads using standard design rules. This is highly recommended to reduce solder

shorts between pads. See the recommended PCB solder mask diagram in Figure

15.

10.2 Solder Stencil

The solder joints in the QFN package are formed exclusively from the solder paste

deposited from the solder stencil. At the small aperture sizes required, the design

of the stencil becomes important to ensure a reliable ﬁnal solder joint volume and

reliable solder joints.

The solder stencil recommendations here are based on those suggested in the IPC

speciﬁcation IPC-7525A "Stencil Design Guidelines".

As the aperture size in the stencil becomes very small, the amount of solder which

remains on the PCB pad after printing is reduced. This occurs due to friction

between the walls of the stencil and the solder paste dragging the paste from the

pad when the stencil is removed. This eﬀect is minimized as the thickness of the

stencil is reduced.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 21

9.50

1.000.75

4.00

1.00

0.500.30x0.30

2.80

2.80 7.50

Figure 14:

Example land

pattern

0.5mm

0.4mm

0.3mm

0.1mm

0.75mmSOLDERMASK

PAD PAD PAD

Figure 15:

Detail of

outer pads

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 22

For the 124 pin QFN package, our recommendations are to use a 4mil thick laser

cut stencil. The solder stencil apertures for the pads should be 0.3mm square with

0.06mm radiused corners. This is the same size as the pads themselves apart from

radiused corners to aid in paste transfer. This can be seen in the Figure 16.

0.3mm

Soldermask

Copper Pad

Solderpaste

Figure 16:

Solder stencil

for outer

pads

These dimensions should be the ﬁnal aperture sizes used on the stencil, this should

be agreed with the stencil makers or assembly house. It is common for assembly

houses to subject the paste mask data to a global undersize before cutting the

stencil. If this undersize is applied to these small apertures the paste transfer is

likely to be poor and open solder joints may result.

For the center pad of this package, four squares of solder paste is recommended,

1mm on a side as shown in Figure 17. This gives a paste to pad area ratio of 51%.

Copper Pad

Solderpaste

Soldermask

0.3mm

1.0mm

2.8mm

Figure 17:

Solder stencil

for centre

pad

10.3 Ground and Thermal Vias

Vias under the heat slug into the ground plane of the PCB are recommended for a

low inductance ground connection and good thermal performance. A 3 x 3 grid of

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 23

vias, with a 0.6mm diameter annular ring and a 0.3mm drill, equally spaced across

the heat slug, would be suitable.

10.4 Moisture Sensitivity

XMOS devices are, like all semiconductor devices, susceptible to moisture absorp-

tion. When removed from the sealed packaging, the devices slowly absorb moisture

from the surrounding environment. If the level of moisture present in the device

is too high during reﬂow, damage can occur due to the increased internal vapour

pressure of moisture. Example damage can include bond wire damage, die lifting,

internal or external package cracks and/or delamination.

All XMOS devices are Moisture Sensitivity Level (MSL) 3 - devices have a shelf life

of 168 hours between removal from the packaging and reﬂow, provided they

are stored below 30C and 60% RH. If devices have exceeded these values or an

included moisture indicator card shows excessive levels of moisture, then the parts

should be baked as appropriate before use. This is based on information from Joint

IPC/JEDEC Standard For Moisture/Reﬂow Sensitivity Classiﬁcation For Nonhermetic

Solid State Surface-Mount Devices J-STD-020 Revision D.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 24

11 DC and Switching Characteristics

11.1 Operating Conditions

Symbol Parameter MIN TYP MAX UNITS Notes

VDD Tile DC supply voltage 0.95 1.00 1.05 V

VDDIO I/O supply voltage 3.00 3.30 3.60 V

PLL_AVDD PLL analog supply 0.95 1.00 1.05 V

PCU_VDD PCU tile DC supply voltage 0.95 1.00 1.05 V

PCU_VDDIO PCU I/O DC supply voltage 3.00 3.30 3.60 V

OTP_VCC OTP supply voltage 3.00 3.30 3.60 V

Cl xCORE Tile I/O load

capacitance

25 pF

Ta Ambient operating

temperature (Commercial)

0 70 °C

Ambient operating

temperature (Industrial)

-40 85 °C

Tj Junction temperature 125 °C

Tstg Storage temperature -65 150 °C

Figure 18:

Operating

conditions

11.2 DC Characteristics

Symbol Parameter MIN TYP MAX UNITS Notes

V(IH) Input high voltage 2.00 3.60 V A

V(IL) Input low voltage -0.30 0.70 V A

V(OH) Output high voltage 2.00 V B, C

V(OL) Output low voltage 0.60 V B, C

R(PU) Pull-up resistance 35K Ω D

R(PD) Pull-down resistance 35K Ω D

Figure 19:

DC character-

istics

A All pins except power supply pins.

B Ports 1A, 1D, 1E, 1H, 1I, 1J, 1K and 1L are nominal 8 mA drivers, the remainder of the

general-purpose I/Os are 4 mA.

C Measured with 4 mA drivers sourcing 4 mA, 8 mA drivers sourcing 8 mA.

D Used to guarantee logic state for an I/O when high impedance. The internal pull-ups/pull-downs

should not be used to pull external circuitry.

11.3 ESD Stress Voltage

Symbol Parameter MIN TYP MAX UNITS Notes

HBM Human body model -2.00 2.00 KV

MM Machine model -200 200 V

Figure 20:

ESD stress

voltage

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 25

11.4 Reset Timing

Symbol Parameters MIN TYP MAX UNITS Notes

T(RST) Reset pulse width 5 us

T(INIT) Initialization time 150 µs A

Figure 21:

Reset timing

A Shows the time taken to start booting after RST_N has gone high.

11.5 Power Consumption

Symbol Parameter MIN TYP MAX UNITS Notes

I(DDCQ) Quiescent VDD current 28 mA A, B, C

PD Tile power dissipation 450 µW/MIPS A, D, E, F

IDD

Active VDD current (Speed Grade

320 600 mA A, G

Active VDD current (Speed Grade

10)

400 750 mA A, H

I(ADDPLL) PLL_AVDD current 14 mA I

Figure 22:

xCORE Tile

currents

A Use for budgetary purposes only.

B Assumes typical tile and I/O voltages with no switching activity.

C Includes PLL current.

D Assumes typical tile and I/O voltages with nominal switching activity.

E Assumes 1 MHz = 1 MIPS.

F PD(TYP) value is the usage power consumption under typical operating conditions.

G Measurement conditions: VDD = 1.0 V, VDDIO = 3.3 V, 25 °C, 400 MHz, average device resource

usage.

H Measurement conditions: VDD = 1.0 V, VDDIO = 3.3 V, 25 °C, 500 MHz, average device resource

usage.

I PLL_AVDD = 1.0 V

The tile power consumption of the device is highly application dependent and

should be used for budgetary purposes only.

More detailed power analysis can be found in the XS1-L Power Consumption

document, X2999.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 26

11.6 Clock

Symbol Parameter MIN TYP MAX UNITS Notes

f Frequency 4.22 20 100 MHz

SR Slew rate 0.10 V/ns

TJ(LT) Long term jitter (pk-pk) 2 % A

f(MAX) Processor clock frequency (Speed

Grade 8)

400 MHz B

Processor clock frequency (Speed

Grade 10)

500 MHz B

Figure 23:

Clock

A Percentage of CLK period.

B Assumes typical tile and I/O voltages with nominal activity.

Further details can be found in the XS1-L Clock Frequency Control document,

X1433.

11.7 xCORE Tile I/O AC Characteristics

Symbol Parameter MIN TYP MAX UNITS Notes

T(XOVALID) Input data valid window 8 ns

T(XOINVALID) Output data invalid window 9 ns

T(XIFMAX) Rate at which data can be sampled

with respect to an external clock

60 MHz

Figure 24:

I/O AC char-

acteristics

The input valid window parameter relates to the capability of the device to capture

data input to the chip with respect to an external clock source. It is calculated as the

sum of the input setup time and input hold time with respect to the external clock

as measured at the pins. The output invalid window speciﬁes the time for which

an output is invalid with respect to the external clock. Note that these parameters

are speciﬁed as a window rather than absolute numbers since the device provides

functionality to delay the incoming clock with respect to the incoming data.

Information on interfacing to high-speed synchronous interfaces can be found in

the XS1 Port I/O Timing document, X5821.

11.8 xConnect Link Performance

Symbol Parameter MIN TYP MAX UNITS Notes

B(2blinkP) 2b link bandwidth (packetized) 87 MBit/s A, B

B(5blinkP) 5b link bandwidth (packetized) 217 MBit/s A, B

B(2blinkS) 2b link bandwidth (streaming) 100 MBit/s B

B(5blinkS) 5b link bandwidth (streaming) 250 MBit/s B

Figure 25:

Link

performance

Assumes 32-byte packet in 3-byte header mode. Actual performance depends on size of the header

and payload.

B 7.5 ns symbol time.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 27

The asynchronous nature of links means that the relative phasing of CLK clocks is

not important in a multi-clock system, providing each meets the required stability

criteria.

11.9 JTAG Timing

Symbol Parameter MIN TYP MAX UNITS Notes

f(TCK_D) TCK frequency (debug) 18 MHz

f(TCK_B) TCK frequency (boundary scan) 10 MHz

T(SETUP) TDO to TCK setup time 5 ns A

T(HOLD) TDO to TCK hold time 5 ns A

T(DELAY) TCK to output delay 15 ns B

Figure 26:

JTAG timing

A Timing applies to TMS and TDI inputs.

B Timing applies to TDO output from negative edge of TCK.

All JTAG operations are synchronous to TCK apart from the global asynchronous

reset TRST_N.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 28

12 Package Information

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 29

12.1 Part Marking

Wafer lot code

CC - Number of logical cores

F - Product family

R - RAM (in log-2)

T - Temperature grade

M - MIPS grade

MC - Manufacturer

YYWW - Date

XX - Reserved

CCFRTM

MCYYWWXX

LLLLLL.LL

Figure 27:

Part marking

scheme

13 Ordering Information

Product Code Marking Qualiﬁcation Speed Grade

XS1–L8A–128–QF124–C8 8L7C8 Commercial 800 MIPS

XS1–L8A–128–QF124–C10 8L7C10 Commercial 1000 MIPS

XS1–L8A–128–QF124–I8 8L7I8 Industrial 800 MIPS

XS1–L8A–128–QF124–I10 8L7I10 Industrial 1000 MIPS

Figure 28:

Orderable

part numbers

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 30

Appendices

A Conﬁguration of the XS1

The device is conﬁgured through three banks of registers, as shown in Figure 29.

xCORE logical core 0

xCORE logical core 1

xCORE logical core 2

xCORE logical core 3

xCORE logical core 0

xCORE logical core 1

xCORE logical core 2

xCORE logical core 3

SRAM

64KB

JTAG

debug

Hardware

response

ports

xTIME: schedulers

timers, clocks

PLL

SRAM

64KB

Security

OTP ROM

JTAG

debug

I/O pins

Hardware

response

ports

xTIME: schedulers

timers, clocks

Security

OTP ROM

I/O pins

xCONNECT links

Channels

xCONNECT links

Channels

Processor status

registers

Processor status

registers

xCORE

tile

registers

Node

registers

xCORE

tile

registers

Node

registers

Figure 29:

Registers

The following communication sequences specify how to access those registers.

Any messages transmitted contain the most signiﬁcant 24 bits of the channel-end

to which a response is to be sent. This comprises the node-identiﬁer and the

channel number within the node. if no response is required on a write operation,

supply 24-bits with the last 8-bits set, which suppresses the reply message. Any

multi-byte data is sent most signiﬁcant byte ﬁrst.

A.1 Accessing a processor status register

The processor status registers are accessed directly from the processor instruction

set. The instructions GETPS and SETPS read and write a word. The register number

should be translated into a processor-status resource identiﬁer by shifting the

getps(reg) and setps(reg,value) can be used from XC.

A.2 Accessing an xCORE Tile conﬁguration register

xCORE Tile conﬁguration registers can be accessed through the interconnect using

the functions

write_tile_config_reg(tileref, ...)

and

read_tile_config_reg(tile

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 31

>ref, ...)

, where

tileref

is the name of the xCORE Tile, e.g.

tile[1]

. These

functions implement the protocols described below.

Instead of using the functions above, a channel-end can be allocated to communi-

cate with the xCORE tile conﬁguration registers. The destination of the channel-end

should be set to 0xnnnnC20C where nnnnnn is the tile-identiﬁer.

A write message comprises the following:

control-token 24-bit response 16-bit 32-bit control-token

192 channel-end identiﬁer register number data 1

The response to a write message comprises either control tokens 3 and 1 (for

success), or control tokens 4 and 1 (for failure).

A read message comprises the following:

control-token 24-bit response 16-bit control-token

193 channel-end identiﬁer register number 1

The response to the read message comprises either control token 3, 32-bit of data,

and control-token 1 (for success), or control tokens 4 and 1 (for failure).

A.3 Accessing node conﬁguration

Node conﬁguration registers can be accessed through the interconnect using

the functions

write_node_config_reg(device, ...)

and

read_node_config_reg(device,

>...)

, where

device

is the name of the node. These functions implement the

protocols described below.

Instead of using the functions above, a channel-end can be allocated to commu-

nicate with the node conﬁguration registers. The destination of the channel-end

should be set to 0xnnnnC30C where nnnn is the node-identiﬁer.

A write message comprises the following:

control-token 24-bit response 16-bit 32-bit control-token

192 channel-end identiﬁer register number data 1

The response to a write message comprises either control tokens 3 and 1 (for

success), or control tokens 4 and 1 (for failure).

A read message comprises the following:

control-token 24-bit response 16-bit control-token

193 channel-end identiﬁer register number 1

The response to a read message comprises either control token 3, 32-bit of data,

and control-token 1 (for success), or control tokens 4 and 1 (for failure).

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 32

B Processor Status Conﬁguration

The processor status control registers can be accessed directly by the processor

using processor status reads and writes (use

getps(reg)

and

setps(reg,value)

for

reads and writes).

Number Perm Description

0x00 RW RAM base address

0x01 RW Vector base address

0x02 RW xCORE Tile control

0x03 RO xCORE Tile boot status

0x05 RO Security conﬁguration

0x06 RW Ring Oscillator Control

0x07 RO Ring Oscillator Value

0x08 RO Ring Oscillator Value

0x09 RO Ring Oscillator Value

0x0A RO Ring Oscillator Value

0x10 DRW Debug SSR

0x11 DRW Debug SPC

0x12 DRW Debug SSP

0x13 DRW DGETREG operand 1

0x14 DRW DGETREG operand 2

0x15 DRW Debug interrupt type

0x16 DRW Debug interrupt data

0x18 DRW Debug core control

0x20 .. 0x27 DRW Debug scratch

0x30 .. 0x33 DRW Instruction breakpoint address

0x40 .. 0x43 DRW Instruction breakpoint control

0x50 .. 0x53 DRW Data watchpoint address 1

0x60 .. 0x63 DRW Data watchpoint address 2

0x70 .. 0x73 DRW Data breakpoint control register

0x80 .. 0x83 DRW Resources breakpoint mask

0x90 .. 0x93 DRW Resources breakpoint value

0x9C .. 0x9F DRW Resources breakpoint control register

Figure 30:

Summary

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 33

B.1 RAM base address: 0x00

This register contains the base address of the RAM. It is initialized to 0x00010000.

Bits Perm Init Description

31:2 RW Most signiﬁcant 16 bits of all addresses.

1:0 RO - Reserved

0x00:

RAM base

address

B.2 Vector base address: 0x01

Base address of event vectors in each resource. On an interrupt or event, the 16

most signiﬁcant bits of the destination address are provided by this register; the

least signiﬁcant 16 bits come from the event vector.

Bits Perm Init Description

31:16 RW The most signiﬁcant bits for all event and interrupt vectors.

15:0 RO - Reserved

0x01:

Vector base

address

B.3 xCORE Tile control: 0x02

Bits Perm Init Description

31:6 RO - Reserved

5 RW 0

Set to 1 to select the dynamic mode for the clock divider when

the clock divider is enabled. In dynamic mode the clock divider is

only activated when all active logical cores are paused. In static

mode the clock divider is always enabled.

4 RW 0

Set to 1 to enable the clock divider. This slows down the xCORE

tile clock in order to use less power.

3:0 RO - Reserved

0x02:

xCORE Tile

control

B.4 xCORE Tile boot status: 0x03

This read-only register describes the boot status of the xCORE tile.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 34

Bits Perm Init Description

31:24 RO - Reserved

23:16 RO xCORE tile number on the switch.

15:9 RO - Reserved

8 RO Set to 1 if boot from OTP is enabled.

7:0 RO

The boot mode pins MODE0, MODE1, ..., specifying the boot

frequency, boot source, etc.

0x03:

xCORE Tile

boot status

B.5 Security conﬁguration: 0x05

Copy of the security register as read from OTP.

Bits Perm Init Description

31:0 RO Value.

0x05:

Security

conﬁguration

B.6 Ring Oscillator Control: 0x06

There are four free-running oscillators that clock four counters. The oscillators

can be started and stopped using this register. The counters should only be read

when the ring oscillator is stopped. The counter values can be read using four

subsequent registers. The ring oscillators are asynchronous to the xCORE tile clock

and can be used as a source of random bits.

Bits Perm Init Description

31:2 RO - Reserved

1 RW 0 Set to 1 to enable the xCORE tile ring oscillators

0 RW 0 Set to 1 to enable the peripheral ring oscillators

0x06:

Ring

Oscillator

Control

B.7 Ring Oscillator Value: 0x07

This register contains the current count of the xCORE Tile Cell ring oscillator. This

value is not reset on a system reset.

Bits Perm Init Description

31:16 RO - Reserved

15:0 RO - Ring oscillator counter data.

0x07:

Ring

Oscillator

Value

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 35

B.8 Ring Oscillator Value: 0x08

This register contains the current count of the xCORE Tile Wire ring oscillator. This

value is not reset on a system reset.

Bits Perm Init Description

31:16 RO - Reserved

15:0 RO - Ring oscillator counter data.

0x08:

Ring

Oscillator

Value

B.9 Ring Oscillator Value: 0x09

This register contains the current count of the Peripheral Cell ring oscillator. This

value is not reset on a system reset.

Bits Perm Init Description

31:16 RO - Reserved

15:0 RO - Ring oscillator counter data.

0x09:

Ring

Oscillator

Value

B.10 Ring Oscillator Value: 0x0A

This register contains the current count of the Peripheral Wire ring oscillator. This

value is not reset on a system reset.

Bits Perm Init Description

31:16 RO - Reserved

15:0 RO - Ring oscillator counter data.

0x0A:

Ring

Oscillator

Value

B.11 Debug SSR: 0x10

This register contains the value of the SSR register when the debugger was called.

Bits Perm Init Description

31:0 RO - Reserved

0x10:

Debug SSR

B.12 Debug SPC: 0x11

This register contains the value of the SPC register when the debugger was called.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 36

Bits Perm Init Description

31:0 DRW Value.

0x11:

Debug SPC

B.13 Debug SSP: 0x12

This register contains the value of the SSP register when the debugger was called.

Bits Perm Init Description

31:0 DRW Value.

0x12:

Debug SSP

B.14 DGETREG operand 1: 0x13

The resource ID of the logical core whose state is to be read.

Bits Perm Init Description

31:8 RO - Reserved

7:0 DRW Thread number to be read

0x13:

DGETREG

operand 1

B.15 DGETREG operand 2: 0x14

Bits Perm Init Description

31:5 RO - Reserved

4:0 DRW Register number to be read

0x14:

DGETREG

operand 2

B.16 Debug interrupt type: 0x15

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 37

Bits Perm Init Description

31:18 RO - Reserved

17:16 DRW

If the debug interrupt was caused by a hardware breakpoint

or hardware watchpoint, this ﬁeld contains the number of the

breakpoint or watchpoint. If multiple breakpoints or watch-

points trigger at once, the lowest number is taken.

15:8 DRW

If the debug interrupt was caused by a logical core, this ﬁeld

contains the number of that core. Otherwise this ﬁeld is 0.

7:3 RO - Reserved

2:0 DRW 0 Indicates the cause of the debug interrupt

1: Host initiated a debug interrupt through JTAG

2: Program executed a DCALL instruction

3: Instruction breakpoint

4: Data watch point

5: Resource watch point

0x15:

Debug

interrupt type

B.17 Debug interrupt data: 0x16

On a data watchpoint, this register contains the eﬀective address of the memory

operation that triggered the debugger. On a resource watchpoint, it countains the

resource identiﬁer.

Bits Perm Init Description

31:0 DRW Value.

0x16:

Debug

interrupt data

B.18 Debug core control: 0x18

This register enables the debugger to temporarily disable logical cores. When

returning from the debug interrupts, the cores set in this register will not execute.

This enables single stepping to be implemented.

Bits Perm Init Description

31:8 RO - Reserved

7:0 DRW

1-hot vector deﬁning which logical cores are stopped when not

in debug mode. Every bit which is set prevents the respective

logical core from running.

0x18:

Debug core

control

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 38

B.19 Debug scratch: 0x20 .. 0x27

A set of registers used by the debug ROM to communicate with an external

debugger, for example over JTAG. This is the same set of registers as the Debug

Scratch registers in the xCORE tile conﬁguration.

Bits Perm Init Description

31:0 DRW Value.

0x20 .. 0x27:

Debug

scratch

B.20 Instruction breakpoint address: 0x30 .. 0x33

This register contains the address of the instruction breakpoint. If the PC matches

this address, then a debug interrupt will be taken. There are four instruction

breakpoints that are controlled individually.

Bits Perm Init Description

31:0 DRW Value.

0x30 .. 0x33:

Instruction

breakpoint

address

B.21 Instruction breakpoint control: 0x40 .. 0x43

This register controls which logical cores may take an instruction breakpoint, and

under which condition.

Bits Perm Init Description

31:24 RO - Reserved

23:16 DRW 0

A bit for each logical core in the tile allowing the breakpoint to

be enabled individually for each logical core.

15:2 RO - Reserved

1 DRW 0

Set to 1 to cause an instruction breakpoint if the PC is not

equal to the breakpoint address. By default, the breakpoint is

triggered when the PC is equal to the breakpoint address.

0 DRW 0 When 1 the instruction breakpoint is enabled.

0x40 .. 0x43:

Instruction

breakpoint

control

B.22 Data watchpoint address 1: 0x50 .. 0x53

This set of registers contains the ﬁrst address for the four data watchpoints.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 39

Bits Perm Init Description

31:0 DRW Value.

0x50 .. 0x53:

Data

watchpoint

address 1

B.23 Data watchpoint address 2: 0x60 .. 0x63

This set of registers contains the second address for the four data watchpoints.

Bits Perm Init Description

31:0 DRW Value.

0x60 .. 0x63:

Data

watchpoint

address 2

B.24 Data breakpoint control register: 0x70 .. 0x73

This set of registers controls each of the four data watchpoints.

Bits Perm Init Description

31:24 RO - Reserved

23:16 DRW 0

A bit for each logical core in the tile allowing the breakpoint to

be enabled individually for each logical core.

15:3 RO - Reserved

2 DRW 0

Set to 1 to enable breakpoints to be triggered on loads. Break-

points always trigger on stores.

1 DRW 0

By default, data watchpoints trigger if memory in the range

[Address1..Address2] is accessed (the range is inclusive of Ad-

dress1 and Address2). If set to 1, data watchpoints trigger if

memory outside the range (Address2..Address1) is accessed

(the range is exclusive of Address2 and Address1).

0 DRW 0 When 1 the instruction breakpoint is enabled.

0x70 .. 0x73:

Data

breakpoint

control

B.25 Resources breakpoint mask: 0x80 .. 0x83

This set of registers contains the mask for the four resource watchpoints.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 40

Bits Perm Init Description

31:0 DRW Value.

0x80 .. 0x83:

Resources

breakpoint

mask

B.26 Resources breakpoint value: 0x90 .. 0x93

This set of registers contains the value for the four resource watchpoints.

Bits Perm Init Description

31:0 DRW Value.

0x90 .. 0x93:

Resources

breakpoint

value

B.27 Resources breakpoint control register: 0x9C .. 0x9F

This set of registers controls each of the four resource watchpoints.

Bits Perm Init Description

31:24 RO - Reserved

23:16 DRW 0

A bit for each logical core in the tile allowing the breakpoint to

be enabled individually for each logical core.

15:2 RO - Reserved

1 DRW 0

By default, resource watchpoints trigger when the resource id

masked with the set Mask equals the Value. If set to 1, resource

watchpoints trigger when the resource id masked with the set

Mask is not equal to the Value.

0 DRW 0 When 1 the instruction breakpoint is enabled.

0x9C .. 0x9F:

Resources

breakpoint

control

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 41

C Tile Conﬁguration

The xCORE Tile control registers can be accessed using conﬁguration reads and

writes (use

write_tile_config_reg(tileref, ...)

and

read_tile_config_reg(tileref,

>...) for reads and writes).

Number Perm Description

0x00 RO Device identiﬁcation

0x01 RO xCORE Tile description 1

0x02 RO xCORE Tile description 2

0x04 CRW Control PSwitch permissions to debug registers

0x05 CRW Cause debug interrupts

0x06 RW xCORE Tile clock divider

0x07 RO Security conﬁguration

0x10 .. 0x13 RO PLink status

0x20 .. 0x27 CRW Debug scratch

0x40 RO PC of logical core 0

0x41 RO PC of logical core 1

0x42 RO PC of logical core 2

0x43 RO PC of logical core 3

0x60 RO SR of logical core 0

0x61 RO SR of logical core 1

0x62 RO SR of logical core 2

0x63 RO SR of logical core 3

0x80 .. 0x9F RO Chanend status

Figure 31:

Summary

C.1 Device identiﬁcation: 0x00

Bits Perm Init Description

31:24 RO Processor ID of this xCORE tile.

23:16 RO Number of the node in which this xCORE tile is located.

15:8 RO xCORE tile revision.

7:0 RO xCORE tile version.

0x00:

Device

identiﬁcation

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 42

C.2 xCORE Tile description 1: 0x01

This register describes the number of logical cores, synchronisers, locks and

channel ends available on this xCORE tile.

Bits Perm Init Description

31:24 RO Number of channel ends.

23:16 RO Number of locks.

15:8 RO Number of synchronisers.

7:0 RO - Reserved

0x01:

xCORE Tile

description 1

C.3 xCORE Tile description 2: 0x02

This register describes the number of timers and clock blocks available on this

xCORE tile.

Bits Perm Init Description

31:16 RO - Reserved

15:8 RO Number of clock blocks.

7:0 RO Number of timers.

0x02:

xCORE Tile

description 2

C.4 Control PSwitch permissions to debug registers: 0x04

This register can be used to control whether the debug registers (marked with

permission CRW) are accessible through the tile conﬁguration registers. When this

bit is set, write -access to those registers is disabled, preventing debugging of the

xCORE tile over the interconnect.

Bits Perm Init Description

31:1 RO - Reserved

0 CRW

Set to 1 to restrict PSwitch access to all CRW marked registers to

become read-only rather than read-write.

0x04:

Control

PSwitch

permissions

to debug

registers

C.5 Cause debug interrupts: 0x05

This register can be used to raise a debug interrupt in this xCORE tile.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 43

Bits Perm Init Description

31:2 RO - Reserved

1 RO 0 Set to 1 when the processor is in debug mode.

0 CRW 0 Set to 1 to request a debug interrupt on the processor.

0x05:

Cause debug

interrupts

C.6 xCORE Tile clock divider: 0x06

This register contains the value used to divide the PLL clock to create the xCORE

tile clock. The divider is enabled under control of the tile control register

Bits Perm Init Description

31:8 RO - Reserved

7:0 RW Value of the clock divider minus one.

0x06:

xCORE Tile

clock divider

C.7 Security conﬁguration: 0x07

Copy of the security register as read from OTP.

Bits Perm Init Description

31:0 RO Value.

0x07:

Security

conﬁguration

C.8 PLink status: 0x10 .. 0x13

Status of each of the four processor links; connecting the xCORE tile to the switch.

X5358, XS1-L8A-128-QF124

XS1-L8A-128-QF124 Datasheet 44

Bits Perm Init Description

31:26 RO - Reserved

25:24 RO 00 - ChannelEnd, 01 - ERROR, 10 - PSCTL, 11 - Idle.

23:1