®
RGP10A thru RGP10M
Vishay Semiconductors
for merly General Semiconductor
Document Number 88700 www.vishay.com
28-Feb-02 1
Glass Passivated Junction
Fast Switching Rectifier Rever se V oltage 50 to 1000V
Forward Current 1.0A
Patented*
0.107 (2.7)
0.080 (2.0)
0.034 (0.86)
0.028 (0.71)
DIA.
1.0 (25.4)
MIN.
1.0 (25.4)
MIN.
0.205 (5.2)
0.160 (4.1)
DIA.
NOTE:
Lead diameter is for suffix "E" part numbers
0.026 (0.66)
0.023 (0.58)
Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
RGP RGP RGP RGP RGP RGP RGP
Parameter Symbol 10A 10B 10D 10G 10J 10K 10M Unit
Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V
Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V
Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V
Maximum average forward rectified current
0.375" (9.5mm) lead length at TA=55°CIF(AV) 1.0 A
Peak forward surge current 8.3ms single halfsine-wave
superimposed on rated load (JEDEC Method) IFSM 30 A
Maximum full load reverse current, full cycle
average 0.375" (9.5mm) lead length TA=55°CIR(AV) 100 µA
Typical ther mal resistance (NOTE 1) RΘJA 55 °C/W
Operating junction and storage temperature range TJ,TSTG -65 to +175 °C
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
RGP RGP RGP RGP RGP RGP RGP
Parameter Symbol 10A 10B 10D 10G 10J 10K 10M Unit
Maximum instantaneous forward voltage at 1.0A VF1.3 V
Maximum DC reverse current TA=25°C 5.0
at rated DC blocking voltage TA=150°CIR200 µA
Maximum reverse recovery time
IF=0.5A, IR=1.0A, Irr=0.25A trr 150 250 500 ns
Typical junction capacitance at 4.0V, 1MHz CJ15 pF
Notes:
(1) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, P.C.B. mounted
DO-204AL (DO-41) Features
• Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
• High temperature metallurgically bonded construction
• Cavity-free glass passivated junction
• Capable of meeting environmental standards of
MIL-S-19500
• For use in high frequency rectifier circuits
• Fast switching for high efficiency
• 1.0 Ampere operation at TA=55°C with no thermal runaway
• Typical IRless than 0.1µA
• High temperature soldering guaranteed: 350°C/10 seconds,
0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
Mechanical Data
Case: JEDEC DO-204AL molded plastic over glass body
Terminals: Plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.012 oz., 0.3 g
*Glass-plastic encap-
sulation technique is
covered by
Patent No. 3,996,602,
and brazed-lead
assembly by Patent
No. 3,930,306
Dimensions in
inches and
(millimeters)
RGP10A thru RGP10M
Vishay Semiconductors
for merly General Semiconductor
www.vishay.com Document Number 88700
228-Feb-02
Ambient Temperature (°C)
Fig. 1 – Forward Current
Derating Curve
Average Forward Rectified Current (A)
Fig. 3 – Typical Instantaneous
Forward Characteristics
Instantaneous Forward Voltage (V)
Instantaneous Forward Current (A)
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Reverse Current (µA)
Fig. 4 – Typical Reverse
Characteristics
Fig. 6 – Typical Transient
Thermal Impedance
Number of Cycles at 60 HZ
t, Pulse Duration (sec.)
Fig. 2 – Maximum Non-Repetitive
Peak Forward Surge Current
Forward Surge Current (A)
Reverse Voltage (V)
Junction Capacitance (pF)
Transient Thermal Impedance (°CW)
Fig. 5 – Typical Junction
Capacitance
25 50 75 100 125 150 175
0
0.25
0.5
0.75
1.0
Resistive or Inductive Load
0.375" (9.5mm) Lead Length
110 100
0
10
20
30
TJ = TJ max.
8.3ms Single Half Sine-Wave
(JEDEC Method)
0.4 0.6 0.8 1.0 1.2 1.4 1.6
0.01
0.1
1
10
TJ = 25°C
Pulse Width = 300µs
1% Duty Cycle
020 40 60 80 100
0.01
0.1
1
10
20
110 100
1
10
100
TJ = 25°C
f = 1.0MHZ
Vsig = 50mVp-p
0.01 0.1 110 100
0.1
1
10
100
TJ = 25°C
TJ = 75°C
TJ = 125°C
Ratings and
Characteristic Curves(TA= 25°C unless otherwise noted)
