TDA8551T_N1 - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 1997 May 07

File under Integrated Circuits, IC01

1998 Feb 23

INTEGRATED CIRCUITS

TDA8551

1 W BTL audio amplifier with digital

volume control

1998 Feb 23 2

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

FEATURES

•One pin digital volume control

•Volume setting with UP/DOWN pulses

•Flexibility in use

•Few external components

•Low saturation voltage of output stage

•standby mode controlled by CMOS compatible levels

•Low standby current

•No switch-on/switch-off plops

•High supply voltage ripple rejection

•Protected against electrostatic discharge

•Outputs short circuit safe to ground, VP and across the

load

•Thermally protected.

GENERAL DESCRIPTION

The TDA8551; TDA8551T is a one channel 1 W

Bridge-Tied Load (BTL) audio power amplifier capable of

delivering 1 W output power to an 8 Ω load at THD = 10%

using a 5 V power supply. The circuit contains a BTL

power amplifier, a digital volume control and standby/mute

logic. The TDA8551T comes in an 8 pin SO package and

the TDA8551 in a 8 pin DIP package.

APPLICATIONS

•Portable consumer products

•Personal computers

•Telephony.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VPsupply voltage 2.7 5 5.5 V

Iqquiescent current VP=5V −610mA

stb standby current −−10 µA

Pooutput power THD = 10%; RL=8Ω; VP= 5 V 1 1.4 −W

Gvvoltage gain −60 −+20 dB

nvol number of volume steps −64 −

THD total harmonic distortion Po= 0.5 W −0.15 −%

SVRR supply voltage ripple rejection 48 −−dB

TYPE

NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA8551T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

TDA8551 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

1998 Feb 23 3

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MGK363

20 kΩ

TDA8551

5 kΩ

15 kΩ

STANDBY/

MUTE/

OPERATING

VOLUME

CONTROL

UP/DOWN

COUNTER

INTERFACE

downup

SLAVE

MASTER

OUT+

GND

MODE

OUT−

SVR

UP/DOWN

PINNING

SYMBOL PIN DESCRIPTION

UP/DOWN 1 digital trinary input for volume

control

MODE 2 digital trinary input for mode

selection (standby, mute, operating)

SVR 3 half supply voltage, decoupling

ripple rejection

IN 4 audio input

OUT−5 negative loudspeaker output

terminal

VP6 supply voltage

GND 7 ground

OUT+ 8 positive loudspeaker output

terminal Fig.2 Pin configuration.

handbook, halfpage

MGK362

TDA8551

OUT+

GNDMODE

OUT−

SVR

UP/DOWN

1998 Feb 23 4

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

FUNCTIONAL DESCRIPTION

The TDA8551; TDA8551T is a 1 W BTL audio power

amplifier capable of delivering 1 W output power to an 8 Ω

load at THD = 10% using a 5 V power supply. The gain of

the amplifier can be set by the digital volume control. In the

maximum volume setting the gain is 20 dB. Using the

MODE pin the device can be switched to the standby

condition, the mute condition and the normal operating

condition. The device is protected by an internal thermal

shutdown protection mechanism.

Power ampliﬁer

The power amplifier is a Bridge Tied Load (BTL) amplifier

with a complementary CMOS output stage. The total

voltage loss for both output power MOS transistors is

within 1 V and with a 5 V supply and an 8 Ω loudspeaker

an output power of 1 W can be delivered. The total gain of

this power amplifier is internally fixed at 20 dB.

Volume control

The volume control operates as a digital controlled

attenuator between the audio input pin and the power

amplifier. In the maximum volume control setting the

attenuation is 0 dB and in the minimum volume control

setting the typical attenuation is 80 dB. The attenuation

can be set in 64 steps by the UP/DOWN pin.

This UP/DOWN pin is a trinary input:

•Floating UP/DOWN pin: volume remains unchanged

•Negative pulses: setting volume towards minimum

•Positive pulses: setting volume towards maximum.

Each pulse on the UP/DOWN pin results in a change in

gain of 80/64 = 1.25 dB (typical value). In the basic

application the UP/DOWN pin is switched to ground or VP

by a double push-button. When the supply voltage is

initially connected, after a complete removal of the supply,

the initial state of the volume control is an attenuation of

40 dB (low volume), so the gain of the total amplifier is

−20 dB. After powering-up, some positive pulses have to

be applied to the UP/DOWN pin for turning up to listening

volume. When the device is switched with the MODE

select pin to the mute or the standby condition, the volume

control attenuation setting remains on its value, assumed

that the voltage on pin VP does not fall below the minimum

supply voltage. After switching the device back to the

operation mode, the previous volume setting is

maintained.

Mode select pin

The device is in the standby mode (with a very low current

consumption) if the voltage at the MODE pin is between VP

and VP−0.5 V. At a mode select voltage level of less than

0.5 V the amplifier is fully operational. In the range

between 1 V and VP−1.4 V the amplifier is in the mute

condition. The mute condition is useful for using it as a ‘fast

mute’; in this mode output signal is suppressed, while the

volume setting remains at its value. It is advised to keep

the device in the mute condition while the input capacitor

is being charged. This can be done by holding the MODE

pin at a level of 0.5VP, or by waiting approximately 100 ms

before giving the first volume-UP pulses.

1998 Feb 23 5

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

QUALITY SPECIFICATION

Quality according to

“SNW-FQ-611 part E”

, if this type is used as an audio amplifier. Quality specifications are listed in

the

“Quality reference handbook”

, order number 9397 750 00192.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VPsupply voltage −0.3 +5.5 V

VIinput voltage −0.3 VP+ 0.3 V

IORM repetitive peak output current −1A

stg storage temperature −55 +150 °C

Tamb operating temperature −40 +85 °C

Vsc AC and DC short-circuit safe voltage −5.5 V

Ptot maximum power dissipation SO8 −0.8 W

DIP8 −1.2 W

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth j-a thermal resistance from junction to ambient in free air

SO8 160 K/W

DIP8 100 K/W

1998 Feb 23 6

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

CHARACTERISTICS

VP=5V; T

amb =25°C; RL=8Ω; VMODE = 0 V; total gain setting at +7 dB (unless otherwise speciﬁed); measured in

test circuit of Fig.4.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

DC characteristics

VPsupply voltage 2.7 5 5.5 V

Iqquiescent current RL=∞; note 1 −610 mA

stb standby current VMODE =V

P−−10 µA

VODC output voltage note 2 −2.5 −V

VOUT+ −VOUT−differential output offset −−50 mV

Mode select pin

VMODE input voltage standby mode VP−0.5 −VPV

mute mode 1 −VP−1.4 V

operating mode 0 −0.5 V

IMODE input current 0 < VMODE <V

P−−100 nA

αmute attenuation note 3 80 90 −dB

Volume control

trep pulse repetition time 100 −− ns

Vth(UP) UP/DOWN pin up threshold level 4.2 −VPV

Vﬂoat(max) UP/DOWN pin ﬂoating high level −−3.4 V

Vﬂoat(min) UP/DOWN pin ﬂoating low level 1.0 −− V

th(DOWN) UP/DOWN pin down threshold level 0 −0.6 V

IUP/DOWN input current UP/DOWN pin 0 < VUP/DOWN <V

P−−200 µA

Gv(max) maximum voltage gain (including

power ampliﬁer) 19 20 21 dB

Gv(min) minimum voltage gain (including

power ampliﬁer) −62 −60 −58 dB

nvol number of volume steps −64 −

∆Gvvoltage gain variation per step −1.25 −dB

Ziinput impedance 14 20 −kΩ

Vi(rms)(max) maximum input voltage (RMS value) −−2.0 V

AC characteristics (f = 1 kHz)

Pooutput power THD = 10% 1 1.4 −W

THD = 0.5% 0.6 1.0 −W

THD total harmonic distortion Po= 0.5 W; note 4 −0.15 0.5 %

Vn(o) noise output voltage note 5 −60 100 µV

SVRR supply voltage ripple rejection note 6 48 53 −dB

Vi(IN)(max) maximum input voltage on pin IN THD = 1%;

Gv=−50 dB

to 0 dB

−−2.0 V

1998 Feb 23 7

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

Notes to the Characteristics

1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal

to the DC output offset voltage divided by RL.

2. The DC output voltage with respect to ground is approximately 0.5VP.

3. Output voltage in mute position is measured with an input of 1 V (RMS), including noise, in a bandwidth of 20 kHz.

4. Total gain setting at +20 dB.

5. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), input

source impedance Rsource =0Ω.

6. Supply voltage ripple rejection is measured at the output, with a source impedance of Rsource =0Ω at the input.

The ripple voltage is a sine wave with frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive

supply rail.

Fig.3 Timing UP/DOWN pin.

The rise time (tr) and the width of the pulse (tw) are not critical.

handbook, full pagewidth

MGK365

VUP/DOWN

Vth(UP)

Vth(DOWN)

Vfloat(max)

Vfloat(min)

increasing volume

decreasing volume

floating

trep

ttw

trep

1998 Feb 23 8

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

TEST AND APPLICATION INFORMATION

Fig.4 Test and application circuit.

handbook, full pagewidth

MGM560

20 kΩ

TDA8551 5 kΩ

8 Ω

15 kΩ

100

µF

220

µF

330 nF

C5 100 nF

100

2.2 kΩ

STANDBY/

MUTE/

OPERATING

VOLUME

CONTROL

operating

standby

mute

DOWN

volume

control

VPVP = 5 V

SLAVE

MASTER

OUT+

GND

MODE

OUT−

SVR

UP/DOWN

Reduction of the value of capacitor C2 results in a

decrease of the SVRR performance at low frequencies

(see Fig.9).

The UP/DOWN pin can be driven by a 3-state logic output

stage (microcontroller) without extra external components.

If the UP/DOWN pin is driven by push-buttons, then it is

advised to have an RC filter between the buttons and the

UP/DOWN pin. Advised values for the RC filter are 2.2 kΩ

and 100 nF.

The volume control circuit responds to the trailing edge of

the pulse on the volume pin; connecting to VP results in a

one step (1.25 dB) higher gain; connecting to ground

results in a one step lower gain.

To avoid audible plops while switching the supply voltage

on and off pin MODE has to be connected to VP (standby

condition) during charge or discharge of the input and

SVRR capacitors.

The measured thermal resistance of the IC package is

highly dependent on the configuration and size of the

application board. Data may not be comparable between

different semiconductor manufacturers because the

application boards and test methods are not standardized

yet. In addition, the thermal performance of packages for a

specific application may be different than presented here,

because the configuration of the application boards

(copper area) may be different. Philips Semiconductors

uses FR-4 type application boards with 1 oz. copper traces

with solder coating. The measurements have been carried

out with vertical placed boards.

1998 Feb 23 9

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

When a practical PCB layout is used with wider copper

tracks and some extra copper added both to the IC pin

connections and underneath the IC, the thermal resistance

from junction to ambient can be reduced. Without these

measures Rth j-a = 160 K/W for the SO8 package; see

Chapter “Thermal characteristics”. The power dissipation

can be calculated as follows:

For a maximum ambient temperature of 50 °C, VP=5V

and RL=8Ω this results in a worst case sine wave

dissipation of 0.63 W.

Figures 5 to 15 represent test results obtained while using

the test circuit given in Fig.4. The following test conditions

apply: Tamb =25°C; VP= 5 V; f = 1 kHz; RL=8Ω;

v= 20 dB; audio bandwidth from 22 Hz to 22 kHz

(except for Figs 8 and 9); unless otherwise specified.

PTamb

Rth j-a

--------------

Fig.5 Supply current as a function of supply

voltage.

handbook, halfpage

0246

MGM554

VP (V)

(mA)

Fig.6 Total harmonic distortion as a function of

output power at different frequencies.

(1) f = 10 kHz.

(2) f = 1 kHz.

(3) f = 100 Hz.

handbook, halfpage

10−1

10−2

MGM551

10−210−1110

(W)

THD

(%)

(3)

(2)

(1)

Fig.7 Total harmonic distortion as a function of

output power at different gains.

f = 1 kHz.

(1) Gv= 0 dB.

(2) Gv= 7 dB.

(3) Gv=20dB.

handbook, halfpage

10−1

10−2

MGM552

10−210−1110

(W)

THD

(%)

(1)

(2)

(3)

1998 Feb 23 10

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

Fig.8 Total harmonic distortion as a function of

frequency at different gains.

Po= 0.1 W.

(1) Gv= 0 dB. (2) Gv= 7 dB.

(3) Gv=20dB.

handbook, halfpage

10−1

10−2

MGM550

10 102103104105

(3)

(2)

(1)

f (Hz)

THD

(%)

Fig.9 Supply voltage ripple rejection as a function

of frequency.

(3) C2 = 100 µF; Gv= 20 dB.

(4) C2 = 10 µF; Gv=−10 dB.

(5) C2 = 100 µF; Gv= 7 dB.

(6) C2 = 100 µF; Gv=−10 dB.

Vripple = 100 mV.

Rsource =0Ω.

(1) C2 = 10 µF; Gv=20dB.

(2) C2 = 10 µF; Gv= 7 dB.

handbook, halfpage

−60

−40

−20

MGM549

10 102103104105

f (Hz)

SVRR

(dB) (1)

(2)

(3)

(4)

(5)

(6)

Fig.10 Input voltage as a function of voltage gain.

THD = 1 %.

handbook, halfpage

−60 0−20 20

2.4

0.8

1.6

2.0

0.4

1.2

MGM559

Gv (dB)

(V)

−40

Fig.11 Output voltage as a function of mode select

input voltage at different supply voltages.

(1) VP=3V.

(2) VP=5V.

handbook, halfpage

513240

10−1

10−2

10−3

10−4

10−5

MGM555

VMODE

(V)

(1) (2)

1998 Feb 23 11

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

Fig.14 Power dissipation as a function of supply

voltage.

(1) RL=4Ω.

(2) RL=8Ω.

(3) RL=16Ω.

handbook, halfpage

002 6

1.5

0.5

MGM556

(W)

VP (V)

(1)

(2)

(3)

Fig.12 Volume gain as a function of volume steps.

handbook, halfpage

02040 80

vol

(dB)

−80

−20

−40

−60

MGM553

Fig.13 Output power as a function of supply

voltage.

THD = 10 %.

(1) RL=4Ω.

(2) RL=8Ω.

handbook, halfpage

0264

MGM558

(W)

VP (V)

(1)

(2)

Po(max) is limited by Ptot and a

maximum available repetitive

peak output current of 1 A.

Fig.15 Power dissipation as a function of output

power.

(1) VP= 5 V; RL=4Ω.

(2) VP= 5 V; RL=8Ω.

(3) VP= 3.3 V; RL=4Ω.

(4) VP= 5 V; RL=16Ω.

(5) VP= 3.3 V; RL=8Ω.

handbook, halfpage

0 2.0

1.5

0.5

0.4 0.8 1.2 1.6

MGM557

(W)

Po (W)

(5)

(4)

(3)

(2)

(1)

1998 Feb 23 12

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

Fig.16 Layout of printed-circuit board.

Dimensions in mm.

handbook, full pagewidth

bottom viewtop view

MGM561

OUT−

OUT+

+VPGND

51.2

51.1

UPDOWN

VOLUME

CONTROL

S1 S2

stand-by operating

mute

TDA

8551

AUDIO POWER

CIC NIJMEGEN

TDA8551

1998 Feb 23 13

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

PACKAGE OUTLINES

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 5.0

4.8 4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6 0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03S MS-012AA

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.20

0.19 0.16

0.15 0.050 0.244

0.228 0.028

0.024 0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

95-02-04

97-05-22

1998 Feb 23 14

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

SOT97-1 92-11-17

95-02-04

UNIT A

max. 12 b

1(1) (1) (1)

b2cD E e M Z

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min. A

max. bmax.

1.73

1.14 0.53

0.38 0.36

0.23 9.8

9.2 6.48

6.20 3.60

3.05 0.2542.54 7.62 8.25

7.80 10.0

8.3 1.154.2 0.51 3.2

inches 0.068

0.045 0.021

0.015 0.014

0.009

1.07

0.89

0.042

0.035 0.39

0.36 0.26

0.24 0.14

0.12 0.010.10 0.30 0.32

0.31 0.39

0.33 0.0450.17 0.020 0.13

050G01 MO-001AN

(e )

seating plane

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

pin 1 index

DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1

1998 Feb 23 15

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our

“IC Package Databook”

(order code 9398 652 90011).

DIP

SOLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg max). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

REPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400 °C, contact may be up to 5 seconds.

REFLOW SOLDERING

Reflow soldering techniques are suitable for all SO

packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heating

method. Typical reflow temperatures range from

215 to 250 °C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 minutes at

45 °C.

WAVE SOLDERING

Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

•A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering

technique should be used.

•The longitudinal axis of the package footprint must be

parallel to the solder flow.

•The package footprint must incorporate solder thieves at

the downstream end.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Maximum permissible solder temperature is 260 °C, and

maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150 °C within

6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

REPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320 °C.

1998 Feb 23 16

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

1998 Feb 23 17

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

NOTES

1998 Feb 23 18

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

NOTES

1998 Feb 23 19

Philips Semiconductors Product speciﬁcation

1 W BTL audio ampliﬁer with digital volume control TDA8551

NOTES

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Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,

Tel. +27 11 470 5911, Fax. +27 11 470 5494

South America: Al. Vicente Pinzon, 173, 6th floor,

04547-130 SÃO PAULO, SP, Brazil,

Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 3 301 6312, Fax. +34 3 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 632 2000, Fax. +46 8 632 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2686, Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,

TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. +66 2 745 4090, Fax. +66 2 398 0793

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

Tel. +90 212 279 2770, Fax. +90 212 282 6707

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 625 344, Fax.+381 11 635 777

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications, Building BE-p, P.O. Box 218,

5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

Argentina: see South America

Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. +61 2 9805 4455, Fax. +61 2 9805 4466

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,

Fax. +43 160 101 1210

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,

Tel. +359 2 689 211, Fax. +359 2 689 102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,

Tel. +1 800 234 7381

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,

Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America

Czech Republic: see Austria

Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. +45 32 88 2636, Fax. +45 31 57 0044

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615800, Fax. +358 9 61580920

France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 23 53 60, Fax. +49 40 23 536 300

Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. +30 1 4894 339/239, Fax. +30 1 4814 240

Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,

Tel. +91 22 493 8541, Fax. +91 22 493 0966

Indonesia: see Singapore

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. +81 3 3740 5130, Fax. +81 3 3740 5077

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381

Middle East: see Italy

Printed in The Netherlands 545102/25/02/pp20 Date of release: 1998 Feb 23 Document order number: 9397 750 03173