MAX14979E
High-Bandwidth, ±15kV ESD Protection
LVDS Switch
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
(Voltages referenced to GND.)
V+ .........................................................................-0.3V to +4.0V
All Other Pins ...............................................-0.3V to (V+ + 0.3V)
Continuous Current (COM_ _ to NC_ _/NO_ _) ............ Q120mA
Continuous Current (AUX0_ to AUX1_/AUX2_) ............... Q40mA
Peak Current (COM_ _ to NC_ _/NO_ _)
(pulsed at 1ms, 10% duty cycle) ............................... Q240mA
Current into Any Other Pin .............................................. Q20mA
Continuous Power Dissipation (TA = +70NC)
36-Pin TQFN (derate 35.7mW/NC above +70NC) .......2.85mW
Operating Temperature Range ........................ -40NC to +85NC
Junction Temperature .................................................. +150NC
Storage Temperature Range ......................... -65NC to +150NC
Lead Temperature (soldering 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
ELECTRICAL CHARACTERISTICS
(V+ = +3.0V to +3.6V, TA = TJ = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +3.3V, TA = +25NC.) (Note 2)
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
TQFN
Junction-to-Ambient Thermal Resistance (BJA) ............8NC/W
Junction-to-Case Thermal Resistance (BJC) .................1NC/W
PACKAGE THERMAL CHARACTERISTICS (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLIES
Operating Power-Supply Range V+ +3.0 +3.6 V
ANALOG SWITCH
On-Resistance RON V+ = 3V, ICOM_ _ = -40mA,
VCOM_ _ = 0V, 1.5V, 3V
TA = +25NC4 5.5 I
TMIN to TMAX 6.5
On-Resistance AUX Switches RONAUX V+ = 3V, IAUX0_ = -40mA, VAUX0_ = 0V,
1.5V, 3V 40 I
On-Resistance Match
Between Channels DRON V+ = 3V, ICOM_ _ = -40mA,
VCOM_ _ = 0V, 3V (Note 3)
TA = +25NC0.5 1.5 I
TMIN to TMAX 2
On-Resistance Flatness RFLAT(ON) V+ = 3V, ICOM_ _ = -40mA,
VCOM_ _ = 0V, 1.5V 0.01 I
Off-Leakage Current ILCOM_
_(OFF)
V+ = 3.6V, VCOM_ _ = 0.3V, 3.3V;
VNC_ _ or VNO_ _ = 3.3V, 0.3V -1 +1 FA
On-Leakage Current ILCOM_
_(ON)
V+ = 3.6V, VCOM_ _ = 0.3V, 3.3V; VNC_ _
or VNO_ _ = 3.3V, 0.3V or unconnected -1 +1 FA
SWITCH AC PERFORMANCE
Insertion Loss ILOS RS = RL = 50I, unbalanced, f = 1MHz,
(Note 3) 0.6 dB
Return Loss RLOS f = 100MHz -23 dB
Crosstalk
VCT1 Any switch to any switch;
RS = RL = 50I,
unbalanced, Figure 1
f = 25MHz -50
dB
VCT2 f = 125MHz -26
SWITCH AC CHARACTERISTICS
-3dB Bandwidth BW RS = RL = 50I, unbalanced 650 MHz
Off-Capacitance COFF f = 1MHz, COM_ _ 3.5 pF
On-Capacitance CON f = 1MHz, COM_ _ 8 pF