Cat.No.C03E-4
Chip Monolithic
Ceramic Capacitors
for Automotive
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
for EU RoHS Compliant
• All the products in this catalog comply with EU RoHS.
• EU RoHS is "the European Directive 2002/95/EC on the Restriction of the Use
of Certain Hazardous Substances in Electrical and Electronic Equipment".
• For more details, please refer to our website 'Murata's Approach for EU RoHS'
(http://www.murata.com/info/rohs.html).
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
1
2
3
Part Numbering 2
Selection Guide of Chip Monolithic Ceramic Capacitors 4
for Automotive GCM Series 5
Capacitance Table 6
Temperature Compensating Type 8
High Dielectric Constant Type 10
Specifications and Test Methods 14
Package 19
!Caution (Storage and Operation Condition) 22
!Caution (Rating) 23
!Caution (Soldering and Mounting) 27
!Caution (Others) 33
Notice (Rating) 34
Notice (Soldering and Mounting) 35
Notice (Others) 38
Medium Voltage for Automotive GCM Series Low Dissipation Factor 39
Specifications and Test Methods 41
Medium Voltage for Automotive GCJ Series Soft Termination Type 45
Specifications and Test Methods 46
Medium Voltage Data (Typical Example) 50
Package 51
!Caution 53
Notice 61
CONTENTS
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
1
2
3
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
o Part Numbering
(Part Number)
w
qProduct ID
wSeries
Chip Monolithic Ceramic Capacitors
GC J
M
Soft Termination Type Power-train, Safety Equipment
Power-train, Safety Equipment
Product ID Code Series
GC
q
M
e
18
r
8
t
R7
y
1H
u
102
i
K
o
A37
eDimension (LgW)
!0
D
Code
0.6g0.3mm
1.0g0.5mm
1.6g0.8mm
2.0g1.25mm
3.2g1.6mm
3.2g2.5mm
4.5g3.2mm
5.7g5.0mm
Dimension (LgW)
0201
0402
0603
0805
1206
1210
1812
2220
EIA
03
15
18
21
31
32
43
55
B
C
D
E
M
N
Q
R
X
1.25mm
1.6mm
2.0mm
2.5mm
1.15mm
1.35mm
1.5mm
1.8mm
Depends on individual standards.
A1.0mm
rDimension (T)
Code
3
5
6
8
9
0.3mm
0.5mm
0.6mm
0.8mm
0.85mm
Dimension (T)
Continued on the following page.
uCapacitance
Expressed by three-digit alphanumerics. The unit is pico-farad
(pF). The first and second figures are significant digits, and the
third figure expresses the number of zeros which follow the two
numbers.
If there is a decimal point, it is expressed by the capital letter "R".
In this case, all figures are significant digits.
R50
1R0
100
103
Ex.)
0.5pF
1.0pF
10pF
10000pF
Code Capacitance
yRated Voltage
0J
1A
1C
1E
YA
1H
2A
2E
2J
DC6.3V
DC10V
DC16V
DC25V
DC35V
DC50V
DC100V
DC250V
DC630V
Code Rated Voltage
-55 to 125°C
-55 to 125°C
±22%
±15%
X7S
X7R
C7
R7
-55 to 125°C
-55 to 125°C
tTemperature Characteristics
Code
Temperature Characteristic Codes Temperature Characteristics
25 to 125°C25°C
Temperature
Range
Reference
Temperature
0±30ppm/°C
Capacitance Change or
Temperature Coefficient
C0G EIA
25°C
25°C
EIA
EIA
25 to 125°C -750±120ppm/°CU2J7U -55 to 125°C
25°CEIA
Public STD Code
5C -55 to 125°C
Operating
Temperature
Range
Murata Code
Capacitance Change from 25°C (%)
–55°C –30°C –10°C
Max. Min. Max. Min. Max. Min.
5C 0.58 –0.24 0.40 –0.17 0.25 –0.11
7U 8.78 5.04 6.04 3.47 3.84 2.21
oCapacitance Change from each temperature
2
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Continued from the preceding page.
!0Package
Code
L
D
K
J
B
C
ø180mm Embossed Taping
ø180mm Paper Taping
ø330mm Embossed Taping
ø330mm Paper Taping
Bulk
Bulk Case
Package
iCapacitance Tolerance
Code
C
D
J
K
M
GCM
GCM
GCM
GCM
GCJ/GCM
GCM
Series
C0G
C0G
C0G
U2J
X7S, X7R
X7S, X7R
TC
±0.25pF
±0.5pF
±5%
±10%
±20%
Capacitance Tolerance
V5pF
6.0 to 9.0pF
U10pF
E12, 1pF Step *
E12, 1pF Step *
E12 Step
Capacitance Step
E12 Step
E6 Step
E6 Step
* E24 series is also available.
Expressed by three figures.
oIndividual Specification Code
3
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Applications?
GRM (X5R, X7R, Y5V etc.)
68pF–100µF
GNM
10pF–2.2µF
GRM (C0G)
0.1pF–0.1µF
GRM (U2J etc.)
LLL
2200pF–10µF
LLA/LLM (From 1GHz)
0.01µF–4.7µF
ERB (1MHz to 1GHz)
0.5pF–1000pF
GJM (500MHz to 10GHz)
0.1pF–33pF
GQM (500MHz to 10GHz)
0.1pF–100pF
GMA 100pF–0.47µF
GMD 100pF–1µF
GRM (C0G, U2J)
10pF–10000pF
GRM (C0G)
5pF–47pF
GRM (X7R)
220pF–1µF
GR7
10000pF–47000pF
GR4
100pF–10000pF
Type GD 10pF–4700pF
Type GF 10pF–4700pF
Type GC 100pF–330pF
Type GF 470pF–4700pF
Type GB 10000pF–56000pF
GA2
470pF–0.1µF
GCM (X7R etc.)
100pF–47µF
GCM (C0G etc.)
1.0pF–56000pF
High Capacitance
Array (2 or 4 Elements)
Class 1 TC's
Low Inductance
(Reverse Geometry)
Low Inductance
(Multi Termination)
Low ESR (50V to 500V)
Low ESR, Ultra Small
Lowest ESR
Wire-Die-Bonding
250V/630V/1kV/2kV/3.15kV
Low Dissipation
3.15kV
Low Dissipation
250V/630V/1kV
High Capacitance
350V
High Capacitance
2kV
High Capacitance
Safety Standard
Certified
Safety Standard
Certified
AC250V which meet
Japanese Law
High Capacitance
Class 1 TC's
250V/630V
Low Dissipation
Medium Voltage
High Frequency Snubber
Optical Communications
High Frequency
High Speed Decoupling
Frequency Control/Tuning,
Impedance Matching
Decoupling, Smoothing
Automotive
(Powertrain,
Safety Equipment)
Medium Voltage
LCD Backlight Inverter
Medium Voltage
Decoupling, Smoothing
Medium Voltage
Only for Camera Flash Circuit
GCM (U2J)
10pF–10000pF
250V/630V
Soft Termination Type GCJ (X7R)
1000pF–0.47µF
Medium Voltage for Automotive
(Powertrain, Safety Equipment)
AC Lines Noise Removal
Medium Voltage
Only for
Information Devices
Function Type Series
Selection Guide of Chip Monolithic Ceramic Capacitors
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
4
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
5
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Chip Monolithic Ceramic Capacitors for Automotive
for Automotive GCM Series
■ Features
1. The GCM series meet AEC-Q200 requirements.
2. Higher resistance of solder-leaching due to
the Ni-barriered termination, applicable for
reflow-soldering, and flow-soldering
(GCM18/21/31 type only).
3. The operating temperature range of R7/C7/5C
series: -55 to 125 degree C.
4. A wide selection of sizes is available, from
miniature LxWxT:0.6x0.3x0.3mm to LxWxT:
3.2x2.5x2.5mm.
5. The GCM series is available in paper or embossed
tape and reel packaging for automatic placement.
6. The GCM series is lead free product.
■ Applications
Automotive electronic equipment (Power-train,
safety equipment)
L
T
W
e eg
* Bulk Case: 1.6 ±0.07(L)g0.8 ±0.07(W)g0.8 ±0.07(T)
The figure indicates typical specification.
Part Number LWT
Dimensions (mm) e g min.
GCM033
GCM155
GCM188*
GCM216
GCM219
GCM21B
GCM319
GCM31M
GCM31C
GCM32N
GCM32R
GCM32D
GCM32E
0.6 ±0.03
1.0 ±0.05
1.6 ±0.1
2.0 ±0.15
3.2 ±0.15
3.2 ±0.2
3.2 ±0.3
0.3 ±0.03
0.5 ±0.05
0.8 ±0.1
1.25 ±0.15
1.6 ±0.15
1.6 ±0.2
2.5 ±0.2
0.3 ±0.03
0.5 ±0.05
0.8 ±0.1
0.6 ±0.1
0.85 ±0.1
1.25 ±0.15
0.85 ±0.1
1.15 ±0.1
1.6 ±0.2
1.35 ±0.15
1.8 ±0.2
2.0 ±0.2
2.5 ±0.2
0.1 to 0.2
0.15 to 0.35
0.2 to 0.5
0.2 to 0.7
0.3 to 0.8
0.3 min.
0.2
0.3
0.5
0.7
1.5
1.0
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Capacitance Table
4
Temperature Compensating Type C0G(5C)
0.6x0.3
(03)
<0201>
1.0x0.5
(15)
<0402>
25
(1E)
50
(1H)
100
(2A)
1.6x0.8
(18)
<0603>
50
(1H)
100
(2A)
2.0x1.25
(21)
<0805>
3.2x1.6
(31)
<1206>
50
(1H)
100
(2A)
50
(1H)
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
9
9
9
9
9
9
B
B
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
9
M
M
6ex.6: T Dimension Part Number Code
LxW
[mm]
Rated Voltage
[Vdc]
Capacitance
1.0pF(1R0)
2.0pF(2R0)
3.0pF(3R0)
4.0pF(4R0)
5.0pF(5R0)
6.0pF(6R0)
7.0pF(7R0)
8.0pF(8R0)
9.0pF(9R0)
10pF(100)
12pF(120)
15pF(150)
18pF(180)
22pF(220)
27pF(270)
33pF(330)
39pF(390)
47pF(470)
56pF(560)
68pF(680)
82pF(820)
100pF(101)
120pF(121)
150pF(151)
180pF(181)
220pF(221)
270pF(271)
330pF(331)
390pF(391)
470pF(471)
560pF(561)
680pF(681)
820pF(821)
1000pF(102)
1200pF(122)
1500pF(152)
1800pF(182)
2200pF(222)
2700pF(272)
3300pF(332)
3900pF(392)
4700pF(472)
5600pF(562)
6800pF(682)
8200pF(822)
10000pF(103)
12000pF(123)
15000pF(153)
18000pF(183)
22000pF(223)
27000pF(273)
33000pF(333)
39000pF(393)
47000pF(473)
56000pF(563)
The part numbering code is shown in ( ) and Unit is shown in [ ]. < >: EIA [inch] Code
Capacitance Table
6
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Capacitance Table
5
High Dielectric Constant Type X7R(R7)/X7S(C7)
25
(1E)
0.6x0.3
(03)
<0201>
16
(1C)
10
(1A)
1.0x0.5
(15)
<0402>
100
(2A)
50
(1H)
25
(1E)
16
(1C)
100
(2A)
50
(1H)
1.6x0.8
(18)
<0603>
25
(1E)
16
(1C)
6.3
(0J)
100
(2A)
50
(1H)
35
(YA)
2.0x1.25
(21)
<0805>
25
(1E)
16
(1C)
10
(1A)
6.3
(0J)
100
(2A)
50
(1H)
3.2x1.6
(31)
<1206>
25
(1E)
16
(1C)
10
(1A)
6.3
(0J)
100
(2A)
50
(1H)
3.2x2.5
(32)
<1210>
25
(1E)
16
(1C)
10
(1A)
6.3
(0J)
6ex.6: T Dimension Part Number Code
3
3
3
3
3
3
3
3
3
3
3
3
3
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
B
6
6
6
6
9
B
B
B
9
B
B
B
B
B
9
B
B
B
B
9
B
B
B
B
B
9
9
B
B
B
B
9
M
M
M
M
M
M
C M
C C
C C
C
D
E
E
D
E
D
E
E
E
LxW
[mm]
Rated Voltage
[Vdc]
Capacitance
100pF(101)
150pF(151)
220pF(221)
330pF(331)
470pF(471)
680pF(681)
1000pF(102)
1500pF(152)
2200pF(222)
3300pF(332)
4700pF(472)
6800pF(682)
10000pF(103)
15000pF(153)
22000pF(223)
33000pF(333)
47000pF(473)
68000pF(683)
0.10µF(104)
0.15µF(154)
0.22µF(224)
0.33µF(334)
0.47µF(474)
0.68µF(684)
1.0µF(105)
2.2µF(225)
4.7µF(475)
10µF(106)
22µF(226)
47µF(476)
The part numbering code is shown in ( ) and Unit is shown in [ ]. < >: EIA [inch] Code
Capacitance Table
7
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
8
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Temperature Compensating Type
The part numbering code is shown in ( ) and Unit is shown in [ ]. < >: EIA [inch] Code
L x W [mm]
Rated Volt. [Vdc]
TC
Capacitance Tolerance Part Number
50(1H)
GCM1555C1H1R0CZ13D
GCM1555C1H2R0CZ13D
GCM1555C1H3R0CZ13D
GCM1555C1H4R0CZ13D
GCM1555C1H5R0CZ13D
GCM1555C1H6R0DZ13D
GCM1555C1H7R0DZ13D
GCM1555C1H8R0DZ13D
GCM1555C1H9R0DZ13D
GCM1555C1H100JZ13D
GCM1555C1H120JZ13D
GCM1555C1H150JZ13D
GCM1555C1H180JZ13D
GCM1555C1H220JZ13D
GCM1555C1H270JZ13D
GCM1555C1H330JZ13D
GCM1555C1H390JZ13D
GCM1555C1H470JZ13D
GCM1555C1H560JZ13D
GCM1555C1H680JZ13D
GCM1555C1H820JZ13D
GCM1555C1H101JZ13D
GCM1555C1H121JA16D
GCM1555C1H151JA16D
GCM1555C1H181JA16D
GCM1555C1H221JA16D
GCM1555C1H271JA16D
GCM1555C1H331JA16D
GCM1555C1H391JA16D
GCM1555C1H471JA16D
100(2A)
GCM1885C2A1R0CZ13D
GCM1885C2A2R0CZ13D
GCM1885C2A3R0CZ13D
GCM1885C2A4R0CZ13D
GCM1885C2A5R0CZ13D
GCM1885C2A6R0DZ13D
GCM1885C2A7R0DZ13D
GCM1885C2A8R0DZ13D
GCM1885C2A9R0DZ13D
GCM1885C2A100JA16D
GCM1885C2A120JA16D
GCM1885C2A150JA16D
GCM1885C2A180JA16D
GCM1885C2A220JA16D
GCM1885C2A270JA16D
GCM1885C2A330JA16D
GCM1885C2A390JA16D
GCM1885C2A470JA16D
GCM1885C2A560JA16D
GCM1885C2A680JA16D
GCM1885C2A820JA16D
GCM1885C2A101JA16D
GCM1885C2A121JA16D
GCM1885C2A151JA16D
GCM1885C2A181JA16D
GCM1885C2A221JA16D
GCM1885C2A271JA16D
GCM1885C2A331JA16D
GCM1885C2A391JA16D
GCM1885C2A471JA16D
GCM1885C2A561JA16D
GCM1885C2A681JA16D
GCM1885C2A821JA16D
GCM1885C2A102JA16D
GCM1885C2A122JA16D
GCM1885C2A152JA16D
50(1H)
GCM1885C1H1R0CZ13D
GCM1885C1H2R0CZ13D
GCM1885C1H3R0CZ13D
GCM1885C1H4R0CZ13D
GCM1885C1H5R0CZ13D
GCM1885C1H6R0DZ13D
GCM1885C1H7R0DZ13D
GCM1885C1H8R0DZ13D
GCM1885C1H9R0DZ13D
GCM1885C1H100JA16D
GCM1885C1H120JA16D
GCM1885C1H150JA16D
GCM1885C1H180JA16D
GCM1885C1H220JA16D
GCM1885C1H270JA16D
GCM1885C1H330JA16D
GCM1885C1H390JA16D
GCM1885C1H470JA16D
GCM1885C1H560JA16D
GCM1885C1H680JA16D
GCM1885C1H820JA16D
GCM1885C1H101JA16D
GCM1885C1H121JA16D
GCM1885C1H151JA16D
GCM1885C1H181JA16D
GCM1885C1H221JA16D
GCM1885C1H271JA16D
GCM1885C1H331JA16D
GCM1885C1H391JA16D
GCM1885C1H471JA16D
GCM1885C1H561JA16D
GCM1885C1H681JA16D
GCM1885C1H821JA16D
GCM1885C1H102JA16D
GCM1885C1H122JA16D
GCM1885C1H152JA16D
GCM1885C1H182JA16D
GCM1885C1H222JA16D
GCM1885C1H272JA16D
GCM1885C1H332JA16D
GCM1885C1H392JA16D
C0G(5C)
1.6x0.8(18)<0603>1.0x0.5(15)<0402>
1.0pF(1R0)
2.0pF(2R0)
3.0pF(3R0)
4.0pF(4R0)
5.0pF(5R0)
6.0pF(6R0)
7.0pF(7R0)
8.0pF(8R0)
9.0pF(9R0)
10pF(100)
12pF(120)
15pF(150)
18pF(180)
22pF(220)
27pF(270)
33pF(330)
39pF(390)
47pF(470)
56pF(560)
68pF(680)
82pF(820)
100pF(101)
120pF(121)
150pF(151)
180pF(181)
220pF(221)
270pF(271)
330pF(331)
390pF(391)
470pF(471)
560pF(561)
680pF(681)
820pF(821)
1000pF(102)
1200pF(122)
1500pF(152)
1800pF(182)
2200pF(222)
2700pF(272)
3300pF(332)
3900pF(392)
±0.25pF(C)
±0.25pF(C)
±0.25pF(C)
±0.25pF(C)
±0.25pF(C)
±0.5pF(D)
±0.5pF(D)
±0.5pF(D)
±0.5pF(D)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
25(1E)
GCM0335C1E1R0CD03D
GCM0335C1E2R0CD03D
GCM0335C1E3R0CD03D
GCM0335C1E4R0CD03D
GCM0335C1E5R0CD03D
GCM0335C1E6R0DD03D
GCM0335C1E7R0DD03D
GCM0335C1E8R0DD03D
GCM0335C1E9R0DD03D
GCM0335C1E100JD03D
GCM0335C1E120JD03D
GCM0335C1E150JD03D
GCM0335C1E180JD03D
GCM0335C1E220JD03D
GCM0335C1E270JD03D
GCM0335C1E330JD03D
GCM0335C1E390JD03D
GCM0335C1E470JD03D
GCM0335C1E560JD03D
GCM0335C1E680JD03D
GCM0335C1E820JD03D
GCM0335C1E101JD03D
0.6x0.3(03)<0201>
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Packaging Code in Part Number is a code shows STD 180mm Reel Taping.
qProduct ID wSeries eDimension (LgW) rDimension (T)
tTemperature Characteristics yRated Voltage uCapacitance
iCapacitance Tolerance oIndividual Specification Code !0Package
(Part Number)
w
GC
q
M
e
03
r
3
t
5C
y
1E
u
1R0
i
C
o
D03
!0
D
9
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Temperature Compensating Type
The part numbering code is shown in ( ) and Unit is shown in [ ]. < >: EIA [inch] Code
L x W [mm]
Rated Volt. [Vdc]
TC
Capacitance Tolerance Part Number
100(2A)
GCM2165C2A101JA16D
GCM2165C2A121JA16D
GCM2165C2A151JA16D
GCM2165C2A181JA16D
GCM2165C2A221JA16D
GCM2165C2A271JA16D
GCM2165C2A331JA16D
GCM2165C2A391JA16D
GCM2165C2A471JA16D
GCM2165C2A561JA16D
GCM2165C2A681JA16D
GCM2165C2A821JA16D
GCM2165C2A102JA16D
GCM2165C2A122JA16D
GCM2165C2A152JA16D
GCM2165C2A182JA16D
GCM2165C2A222JA16D
GCM2165C2A272JA16D
GCM2165C2A332JA16D
50(1H)
GCM2165C1H561JA16D
GCM2165C1H681JA16D
GCM2165C1H821JA16D
GCM2165C1H102JA16D
GCM2165C1H122JA16D
GCM2165C1H152JA16D
GCM2165C1H182JA16D
GCM2165C1H222JA16D
GCM2165C1H272JA16D
GCM2165C1H332JA16D
GCM2165C1H392JA16D
GCM2165C1H472JA16D
GCM2195C1H562JA16D
GCM2195C1H682JA16D
GCM2195C1H822JA16D
GCM2195C1H103JA16D
GCM2195C1H123JA16D
GCM2195C1H153JA16D
GCM21B5C1H183JA16L
GCM21B5C1H223JA16L
100(2A)
GCM3195C2A182JA16D
GCM3195C2A222JA16D
GCM3195C2A272JA16D
GCM3195C2A332JA16D
GCM3195C2A392JA16D
GCM3195C2A472JA16D
GCM3195C2A562JA16D
GCM3195C2A682JA16D
GCM3195C2A822JA16D
GCM3195C2A103JA16D
50(1H)
GCM3195C1H472JA16D
GCM3195C1H562JA16D
GCM3195C1H682JA16D
GCM3195C1H822JA16D
GCM3195C1H103JA16D
GCM3195C1H123JA16D
GCM3195C1H153JA16D
GCM3195C1H183JA16D
GCM3195C1H223JA16D
GCM3195C1H273JA16D
GCM3195C1H333JA16D
GCM3195C1H393JA16D
GCM31M5C1H473JA16L
GCM31M5C1H563JA16L
C0G(5C)
3.2x1.6(31)<1206>2.0x1.25(21)<0805>
100pF(101)
120pF(121)
150pF(151)
180pF(181)
220pF(221)
270pF(271)
330pF(331)
390pF(391)
470pF(471)
560pF(561)
680pF(681)
820pF(821)
1000pF(102)
1200pF(122)
1500pF(152)
1800pF(182)
2200pF(222)
2700pF(272)
3300pF(332)
3900pF(392)
4700pF(472)
5600pF(562)
6800pF(682)
8200pF(822)
10000pF(103)
12000pF(123)
15000pF(153)
18000pF(183)
22000pF(223)
27000pF(273)
33000pF(333)
39000pF(393)
47000pF(473)
56000pF(563)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
±5%(J)
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
10
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
High Dielectric Constant Type
The part numbering code is shown in ( ) and Unit is shown in [ ]. < >: EIA [inch] Code
L x W [mm]
Rated Volt. [Vdc]
TC
Capacitance Tolerance Part Number
25(1E)
GCM033R71E101KA03D
GCM033R71E151KA03D
GCM033R71E221KA03D
GCM033R71E331KA03D
GCM033R71E471KA03D
GCM033R71E681KA03D
GCM033R71E102KA03D
GCM033R71E152KA03D
16(1C)
GCM033R71C222KA55D
GCM033R71C332KA55D
10(1A)
GCM033R71A472KA03D
GCM033R71A682KA03D
GCM033R71A103KA03D
X7R(R7)
0.6x0.3(03)<0201>
100pF(101)
150pF(151)
220pF(221)
330pF(331)
470pF(471)
680pF(681)
1000pF(102)
1500pF(152)
2200pF(222)
3300pF(332)
4700pF(472)
6800pF(682)
10000pF(103)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
L x W [mm]
Rated Volt. [Vdc]
TC
Capacitance Tolerance Part Number
100(2A)
GCM155R72A221KA37D
GCM155R72A331KA37D
GCM155R72A471KA37D
GCM155R72A681KA37D
GCM155R72A102KA37D
GCM155R72A152KA37D
GCM155R72A222KA37D
GCM155R72A332KA37D
GCM155R72A472KA37D
50(1H)
GCM155R71H221KA37D
GCM155R71H331KA37D
GCM155R71H471KA37D
GCM155R71H681KA37D
GCM155R71H102KA37D
GCM155R71H152KA37D
GCM155R71H222KA37D
GCM155R71H332KA37D
GCM155R71H472KA37D
GCM155R71H682KA55D
GCM155R71H103KA55D
GCM155R71H153KA55D
GCM155R71H223KA55D
25(1E)
GCM155R71E103KA37D
GCM155R71E153KA55D
GCM155R71E223KA55D
GCM155R71E333KA55D
GCM155R71E473KA55D
16(1C)
GCM155R71C333KA37D
GCM155R71C473KA37D
GCM155R71C683KA55D
GCM155R71C104KA55D
X7R(R7)
1.0x0.5(15)<0402>
220pF(221)
330pF(331)
470pF(471)
680pF(681)
1000pF(102)
1500pF(152)
2200pF(222)
3300pF(332)
4700pF(472)
6800pF(682)
10000pF(103)
15000pF(153)
22000pF(223)
33000pF(333)
47000pF(473)
68000pF(683)
0.10µF(104)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Packaging Code in Part Number is a code shows STD 180mm Reel Taping.
qProduct ID wSeries eDimension (LgW) rDimension (T)
tTemperature Characteristics yRated Voltage uCapacitance
iCapacitance Tolerance oIndividual Specification Code !0Package
(Part Number)
w
GC
q
M
e
03
r
3
t
R7
y
1E
u
101
i
K
o
A03
!0
D
11
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
High Dielectric Constant Type
The part numbering code is shown in ( ) and Unit is shown in [ ]. < >: EIA [inch] Code
L x W [mm]
Rated Volt. [Vdc]
TC
Capacitance Tolerance Part Number
100(2A)
GCM188R72A102KA37D
GCM188R72A152KA37D
GCM188R72A222KA37D
GCM188R72A332KA37D
GCM188R72A472KA37D
GCM188R72A682KA37D
GCM188R72A103KA37D
GCM188R72A153KA37D
GCM188R72A223KA37D
GCM188R72A104KA64D
50(1H)
GCM188R71H102KA37D
GCM188R71H152KA37D
GCM188R71H222KA37D
GCM188R71H332KA37D
GCM188R71H472KA37D
GCM188R71H682KA37D
GCM188R71H103KA37D
GCM188R71H153KA37D
GCM188R71H223KA37D
GCM188R71H333KA55D
GCM188R71H473KA55D
GCM188R71H683KA57D
GCM188R71H104KA57D
GCM188R71H154KA64D
GCM188R71H224KA64D
25(1E)
GCM188R71E333KA37D
GCM188R71E473KA37D
GCM188R71E683KA57D
GCM188R71E104KA57D
GCM188R71E154KA37D
GCM188R71E224KA55D
GCM188R71E474KA64D
GCM188R71E105KA64D
16(1C)
GCM188R71C104KA37D
GCM188R71C334KA37D
GCM188R71C474KA55D
GCM188R71C105KA64D
X7R(R7)/X7S(C7)
1.6x0.8(18)<0603>
1000pF(102)
1500pF(152)
2200pF(222)
3300pF(332)
4700pF(472)
6800pF(682)
10000pF(103)
15000pF(153)
22000pF(223)
33000pF(333)
47000pF(473)
68000pF(683)
0.10µF(104)
0.15µF(154)
0.22µF(224)
0.33µF(334)
0.47µF(474)
1.0µF(105)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
L x W [mm]
Rated Volt. [Vdc]
TC
Capacitance Tolerance Part Number
6.3(0J)
GCM188R70J225KE22D
X7R(R7)
1.6x0.8(18)<0603>
2.2µF(225)±10%(K)
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
12
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
High Dielectric Constant Type
The part numbering code is shown in ( ) and Unit is shown in [ ]. < >: EIA [inch] Code
L x W [mm]
Rated Volt. [Vdc]
TC
Capacitance Tolerance Part Number
100(2A)
GCM319R72A104KA37D
GCM31MR72A154KA37L
GCM31MR72A224KA37L
50(1H)
GCM31MR71H334KA37L
GCM31MR71H474KA37L
GCM31MR71H684KA55L
GCM31MR71H105KA55L
GCM31CR71H225KA55L
25(1E)
GCM31MR71E225KA57L
GCM31CR71E475KA55L
16(1C)
GCM31CR71C475KA37L
GCM31CR71C106KA64L
X7R(R7)
3.2x1.6(31)<1206>
0.10µF(104)
0.15µF(154)
0.22µF(224)
0.33µF(334)
0.47µF(474)
0.68µF(684)
1.0µF(105)
2.2µF(225)
4.7µF(475)
10µF(106)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
L x W [mm]
Rated Volt. [Vdc]
TC
Capacitance Tolerance Part Number
10(1A)
GCM31CR71A106KA64L
6.3(0J)
GCM31CR70J226ME23L
X7R(R7)
3.2x1.6(31)<1206>
10µF(106)
22µF(226)
±10%(K)
±20%(M)
L x W [mm]
Rated Volt. [Vdc]
TC
Capacitance Tolerance Part Number
100(2A)
GCM216R72A682KA37D
GCM216R72A103KA37D
GCM216R72A153KA37D
GCM216R72A223KA37D
GCM219R72A333KA37D
GCM21BR72A473KA37L
GCM21BR72A683KA37L
GCM21BR72A104KA37L
50(1H)
GCM219R71H333KA37D
GCM21BR71H473KA37L
GCM21BR71H683KA37L
GCM21BR71H104KA37L
GCM21BR71H154KA37L
GCM21BR71H224KA37L
GCM219R71H334KA55D
GCM21BR71H474KA55L
35(YA)
GCM21BR7YA684KA55L
GCM21BR7YA105KA55L
25(1E)
GCM21BR71E154KA37L
GCM21BR71E224KA37L
GCM21BR71E334KA37L
GCM219R71E474KA55D
GCM21BR71E684KA55L
GCM21BR71E105KA56L
GCM21BR71E225KA73L
X7R(R7)
2.0x1.25(21)<0805>
6800pF(682)
10000pF(103)
15000pF(153)
22000pF(223)
33000pF(333)
47000pF(473)
68000pF(683)
0.10µF(104)
0.15µF(154)
0.22µF(224)
0.33µF(334)
0.47µF(474)
0.68µF(684)
1.0µF(105)
2.2µF(225)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
L x W [mm]
Rated Volt. [Vdc]
TC
Capacitance Tolerance Part Number
16(1C)
GCM219R71C684KA37D
GCM219R71C105KA37D
GCM21BR71C225KA64L
GCM21BR71C475KA73L
10(1A)
GCM21BR71A225KA37L
GCM21BC71A475KA73L
6.3(0J)
GCM21BR70J106KE22L
X7R(R7)/X7S(C7)
2.0x1.25(21)<0805>
0.68µF(684)
1.0µF(105)
2.2µF(225)
4.7µF(475)
10µF(106)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Packaging Code in Part Number is a code shows STD 180mm Reel Taping.
qProduct ID wSeries eDimension (LgW) rDimension (T)
tTemperature Characteristics yRated Voltage uCapacitance
iCapacitance Tolerance oIndividual Specification Code !0Package
(Part Number)
w
GC
q
M
e
21
r
6
t
R7
y
2A
u
682
i
K
o
A37
!0
D
13
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
High Dielectric Constant Type
The part numbering code is shown in ( ) and Unit is shown in [ ]. < >: EIA [inch] Code
L x W [mm]
Rated Volt. [Vdc]
TC
Capacitance Tolerance Part Number
100(2A)
GCM32DR72A225KA64L
50(1H)
GCM32ER71H105KA37L
GCM32ER71H475KA55L
25(1E)
GCM32DR71E475KA55L
GCM32ER71E106KA57L
16(1C)
GCM32DR71C106KA37L
GCM32ER71C226ME19L
X7R(R7)
3.2x2.5(32)<1210>
1.0µF(105)
2.2µF(225)
4.7µF(475)
10µF(106)
22µF(226)
±10%(K)
±10%(K)
±10%(K)
±10%(K)
±20%(M)
L x W [mm]
Rated Volt. [Vdc]
TC
Capacitance Tolerance Part Number
10(1A)
GCM32ER71A226ME12L
6.3(0J)
GCM32ER70J476ME19L
X7R(R7)
3.2x2.5(32)<1210>
22µF(226)
47µF(476)
±20%(M)
±20%(M)
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
GCM Series Specification and Test Methods
Step 1
-55+0/-3
15±3
2
Room
Temp.
1
3
125+3/-0 (∆C/R7/C7)
15±3
4
Room
Temp.
1
Temp. (°C)
Time (min.)
Continued on the following page.
Apply the rated voltage and 1.3+0.2/-0Vdc (add 6.8k Ω resistor)
at 85±3°C and 80 to 85% humidity for 1000±12 hours.
Remove and let sit for 24±2 hours at room temperature, then
measure.
The charge/discharge current is less than 50mA.
6
Biased Humidity The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±3.0% or ±0.30pF
(Whichever is larger) Within ±12.5%
Q/D.F. 30pF and over: QU200
30pF and below: QU100+
1
–
3
0
C
C: Nominal Capacitance (pF)
*1
W.V.: 25Vmin.: 0.035 max.
W.V.: 16V: 0.05 max.
I.R. More than 1,000MΩ or 50Ω · F
(Whichever is smaller) *1
Apply the 24-hour heat (25 to 65°C) and humidity (80 to 98%)
treatment shown below, 10 consecutive times.
Let sit for 24±2 hours at room temperature, then measure.
5
Moisture
Resistance The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±3.0% or ±0.30pF
(Whichever is larger) Within ±12.5%
Q/D.F.
30pFmin.: QU350
10pF and over, 30pF and below:
QU275+
5
–
2
C
10pFmax.: QU200+10C
C: Nominal Capacitance (pF)
W.V.: 25Vmin.: 0.03 max.
W.V.: 16V: 0.05 max.
*1
I.R. More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
*1
Per EIA-4694Destructive
Physical Analysis No defects or abnormalities
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (18). Perform the 1000 cycles
according to the four heat treatments listed in the following table.
Let sit for 24±2 hours at room temperature, then measure
• Initial measurement for high dielectric constant type
Perform a heat treatment at 150
W0
Y10
°C for one hour and then
let sit for 24±2 hours at room temperature.
Perform the initial measurement.
3
Temperature
Cycle The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±2.5% or ±0.25pF
(Whichever is larger) Within ±10.0%
Q/D.F. 30pFmin.: QU1000
30pFmax.: QU400+20C
C: Nominal Capacitance (pF)
*1
W.V.: 25Vmin.: 0.03 max.
W.V.: 16V: 0.05 max.
I.R. More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
*1
Sit the capacitor for 1000±12 hours at 150±3°C. Let sit for 24±2
hours at room temperature, then measure.
2
High Temperature
Exposure (Storage) The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±2.5% or ±0.25pF
(Whichever is larger) Within ±10.0%
Q/D.F. 30pFmin.: QU1000
30pFmax.: QU400+20C
C: Nominal Capacitance (pF)
*1
W.V.: 25Vmin.: 0.03 max.
W.V.: 16V: 0.05 max.
I.R. More than 10,000MΩ or 500Ω · F
(Whichever is smaller) *1
1
Pre-and Post-Stress
Electrical Test
–
No. AEC-Q200 Test Method
Specifications
Temperature Compensating Type
High Dielectric Type
AEC-Q200
Test Item
°C
70
65
60
65
50
45
40
35
30
25
20
15
10
5
0
-5
-10
Humidity
90-98% Humidity
80-98% Humidity
90-98% Humidity
80-98% Humidity
90-98%
+10
-2°C
Initial measurement
Temperature
One cycle 24 hours
0123456789
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Hours
*1: The figure indicates typical specification. Please refer to individual specifications.
Specifications and Test Methods
14
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
GCM Series Specification and Test Methods
Continued from the preceding page.
Immerse the capacitor in a eutectic solder solution at 260±5°C for
10±1 seconds. Let sit at room temperature for 24±2 hours, then
measure.
• Initial measurement for high dielectric constant type
Perform a heat treatment at 150
W0
Y10
°C for one hour and then let
sit for 24±2 hours at room temperature.
Perform the initial measurement.
13
Resistance to
Soldering Heat The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within the specified tolerance
Q/D.F. 30pFmin.: QU1000
30pFmax.: QU400+20C
C: Nominal Capacitance (pF)
*1
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
I.R. More than 10,000MΩ or 500Ω · F
(Whichever is smaller) *1
Solder the capacitor to the test jig (glass epoxy board) in the
same manner and under the same conditions as (19). The
capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 2000Hz. The
frequency range, from 10 to 2000Hz and return to 10Hz, should
be traversed in approximately 20 minutes. This motion should be
applied for 12 items in each 3 mutually perpendicular directions
(total of 36 times).
12
Vibration
Appearance
No defects or abnormalities
Capacitance
Change
Within the specified tolerance
Q/D.F. 30pFmin.: QU1000
30pFmax.: QU400+20C
C: Nominal Capacitance (pF)
*1
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
I.R. More than 10,000MΩ or 500Ω · F
(Whichever is smaller) *1
Three shocks in each direction should be applied along 3
mutually perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
duration: 0.5ms, peak value: 1500g and velocity change: 4.7m/s.
11
Mechanical
Shock
No marking defects
Appearance
Capacitance
Change
Within the specified tolerance
Q/D.F. 30pFmin.: QU1000
30pFmax.: QU400+20C
C: Nominal Capacitance (pF)
*1
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
I.R. More than 10,000MΩ or 500Ω · F
(Whichever is smaller) *1
Per MIL-STD-202 Method 215
Solvent 1: 1 part (by volume) of isopropyl alcohol
3 parts (by volume) of mineral spirits
Solvent 2: Terpene defluxer
Solvent 3: 42 parts (by volume) of water
1 part (by volume) of propylene glycol
monomethyl ether
1 part (by volume) of monoethanolamine
10
Resistance
to Solvents
No marking defects
Appearance
Capacitance
Change
Within the specified tolerance
Q/D.F. 30pFmin.: QU1000
30pFmax.: QU400+20C
C: Nominal Capacitance (pF)
*1
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
I.R. More than 10,000MΩ or 500Ω · F
(Whichever is smaller) *1
Using calipers9
Physical Dimension
Within the specified dimensions
Visual inspection8 External Visual No defects or abnormalities
Apply 200% of the rated voltage for 1000±12 hours at
125±3°C. Let sit for 24±2 hours at room temperature, then
measure. *2
The charge/discharge current is less than 50mA.
• Initial measurement for high dielectric constant type.
Apply 200% of the rated DC voltage for one hour at the maximum
operating temperature ±3°C. Remove and let sit for 24±2 hours
at room temperature. Perform initial measurement. *2
7
Operational Life The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±3.0% or ±0.30pF
(Whichever is larger) Within ±12.5%
Q/D.F.
30pFmin.: QU350
10pF and over, 30pF and below:
QU275+
5
–
2
C
10pFmax.: QU200+10C
C: Nominal Capacitance (pF)
*1
W.V.: 25Vmin.: 0.035 max.
W.V.: 16V: 0.05 max.
I.R. More than 1,000MΩ or 50Ω · F
(Whichever is smaller) *1
No. AEC-Q200 Test Method
Specifications
Temperature Compensating Type
High Dielectric Type
AEC-Q200
Test Item
Continued on the following page.
*1: The figure indicates typical specification. Please refer to individual specifications.
*2: Some of the parts are applicable in rated voltage x 150%. Please refer to individual specifications.
Specifications and Test Methods
15
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
GCM Series Specification and Test Methods
Continued from the preceding page.
Capacitance Frequency
1±0.1MHz
1±0.1kHz
Voltage
0.5 to 5Vrms
1±0.2Vrms
CV1000pF
CG1000pF
Capacitance Frequency
1±0.1kHz
120±24Hz
Voltage
1±0.2Vrms
0.5±0.1Vrms
CV10µF
CG10µF
Visual inspection.
17
Electrical
Characteri-
zation
Appearance
No defects or abnormalities
Capacitance
Change
Within the specified tolerance The capacitance/Q/D.F. should be measured at 25°C at the
frequency and voltage shown in the table.
(1) Temperature Compensating Type
(2) High Dielectric Type
Q/D.F. 30pF min.: QU1000
30pF max.: QU400+20C
C: Nominal Capacitance (pF)
*1
W.V.: 25V min.: 0.025 max.
W.V.: 16V: 0.035 max
I.R.
25°C
More than 100,000MΩ or 1,000Ω · F
(Whichever is smaller)
Max. Operating Temperature···125°C
More than 10,000MΩ or 100Ω · F
(Whichever is smaller)
25°C
More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
Max. Operating Temperature···125°C
More than 1,000MΩ or 10Ω · F
(Whichever is smaller)
*1
The insulation resistance should be measured with a DC voltage
not exceeding the rated voltage at 25°C and 125°C and within 2
minutes of charging.
Dielectric
Strength
No failure No failure should be observed when 250% of the rated voltage is
applied between the terminations for 1 to 5 seconds, provided the
charge/discharge current is less than 50mA.
(a) Preheat at 155°C for 4 hours. After preheating, immerse the
capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-
K-5902) (25% rosin in weight proportion). Immerse in eutectic
solder solution for 5+0/-0.5 seconds at 235±5°C.
(b) Should be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in
weight proportion). Immerse in eutectic solder solution for
5+0/-0.5 seconds at 235±5°C.
(c) Should be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in
weight proportion). Immerse in eutectic solder solution for 120
±5 seconds at 260±5°C.
16 Solderability 95% of the terminations is to be soldered evenly and
continuously.
Per AEC-Q200-00215 ESD
Appearance
No marking defects
Capacitance
Change
Within the specified tolerance
Q/D.F. 30pF min.: QU1000
30pF max.: QU400+20C
C: Nominal Capacitance (pF) W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
*1
I.R. More than 10,000MΩ or 500Ω · F
(Whichever is smaller) *1
Step 1
-55+0/-3
15±3
2
125+3/-0 (5C, C7, R7)
15±3
Temp. (°C)
Time (min.)
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (18). Perform the 300 cycles
according to the two heat treatments listed in the following table
(Maximum transfer time is 20 seconds). Let sit for 24±2 hours at
room temperature, then measure.
• Initial measurement for high dielectric constant type
Perform a heat treatment at 150
W0
Y10
°C for one hour and then
let sit for 24±2 hours at room temperature.
Perform the initial measurement.
14
Thermal Shock The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±2.5% or ±0.25pF
(Whichever is larger) Within ±10.0%
Q/D.F. 30pF min.: QU1000
30pF max.: QU400+20C
C: Nominal Capacitance (pF)
*1
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
I.R. More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
*1
No. AEC-Q200 Test Method
Specifications
Temperature Compensating Type
High Dielectric Type
AEC-Q200
Test Item
Continued on the following page.
*1: The figure indicates typical specification. Please refer to individual specifications.
Specifications and Test Methods
16
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
GCM Series Specification and Test Methods
Continued from the preceding page.
Type a
0.3
0.5
0.6
0.8
2.0
2.0
b
0.9
1.5
2.2
3.0
4.4
4.4
c
0.3
0.6
0.9
1.3
1.7
2.6
(in mm)
GCM03
GCM15
GCM18
GCM21
GCM31
GCM32
Type a
0.3
0.4
1.0
1.2
2.2
2.2
b
0.9
1.5
3.0
4.0
5.0
5.0
c
0.3
0.5
1.2
1.65
2.0
2.9
(in mm)
GCM03
GCM15
GCM18
GCM21
GCM31
GCM32
40
b
C
100
a
t: 1.6mm
(GCM03/15: 0.8mm)
45 45
R4
20 114 Pressunzing
speed: 1.0mm/sec
Pressurize
Capacitance meter Flexure: V2
(High Dielectric Type)
Flexure: V3
(Temperature
Compensating Type)
c
Baked electrode or
copper foil
Solder resist
(t=1.6mm
GCM03/15: 0.8mm)
a
b
Iron Board
0.6
L
Place the capacitor in the beam load fixture as Fig. 4.
Apply a force.
< Chip Length: 2.5mm max. >
Speed supplied the Stress Load: 0.5mm / sec.
< Chip Length: 3.2mm min. >
Speed supplied the Stress Load: 2.5mm / sec.
Fig. 4
20 Beam Load Test
The chip endure following force.
< Chip L dimension: 2.5mm max. >
Chip thickness G 0.5mm rank: 20N
Chip thickness V 0.5mm rank: 8N
< Chip L dimension: 3.2mm min. >
Chip thickness F 1.25mm rank: 15N
Chip thickness U 1.25mm rank: 54.5N
Solder the capacitor to the test jig (glass epoxy board) shown in
Fig. 3 using a eutectic solder. Then apply *18N force in parallel
with the test jig for 60sec.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
*2N (GCM03/15)
Fig. 3
19
Terminal
Strength
Appearance
No marking defects
Capacitance
Change
Within the specified tolerance
Q/D.F. 30pF min.: QU1000
30pF max.: QU400+20C
C: Nominal Capacitance (pF)
*1
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
I.R. More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
*1
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig. 1 using a eutectic solder. Then apply a force in the direction
shown in Fig. 2 for 5±1sec. The soldering should be done by the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
Fig. 2
18 Board
Flex
Appearance
No marking defects
Capacitance
Change
Within ±5.0% or ±0.5pF
(Whichever is larger) Within ±10.0%
Q/D.F. 30pF min.: QU1000
30pF max.: QU400+20C
C: Nominal Capacitance (pF)
*1
W.V.: 25Vmin.: 0.025 max.
W.V.: 16V: 0.035 max.
I.R.
More than 10,000MΩ or 500Ω · F
(Whichever is smaller)
*1
Fig. 1
No. AEC-Q200 Test Method
Specifications
Temperature Compensating Type
High Dielectric Type
AEC-Q200
Test Item
Continued on the following page.
*1: The figure indicates typical specification. Please refer to individual specifications.
Specifications and Test Methods
17
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
GCM Series Specification and Test Methods
Continued from the preceding page.
Char. Nominal Values (ppm/°C) Note1
0T305C Max.
0.58 Min.
-0.24 Max.
0.40 Min.
-0.17 Max.
-55 Capacitance Change from 25°C (%)
-30 -10
0.25 Min.
-0.11
Note 1: Nominal values denote the temperature coefficient within a range of 25°C to 125°C (for 5C).
*1: The figure indicates typical specification. Please refer to individual specifications.
Table A
The capacitance change should be measured after 5 min. at
each specified temperature stage.
(1) Temperature Compensating Type
The temperature coefficient is determined using the capacitance
measured in step 3 as a reference. When cycling the
temperature sequentially from step1 through 5 (∆C: +25°C to
+125°C: other temp. coeffs.: +25°C to +85°C) the capacitance
should be within the specified tolerance for the temperature
coefficient and capacitance change as shown in Table A. The
capacitance drift is calculated by dividing the differences
between the maximum and minimum measured values in steps
1, 3 and 5 by the capacitance value in step 3.
(2) High Dielectric Constant Type
The ranges of capacitance change compared with the above
25°C value over the temperature ranges shown in the table
should be within the specified ranges.
· Initial measurement for high dielectric constant type.
Perform a heat treatment at 150+0/-10°C for one hour and then
set for 24±2 hours at room temperature.
Perform the initial measurement.
21
Capacitance
Temperature
Character-
istics
Capacitance
Change
Within the specified tolerance
(Table A)
C7: Within ±22%
(-55°C to +125°C)
R7: Within ±15%
(-55°C to +125°C)
Temperature
Coefficient
Within the specified tolerance
(Table A)
Capacitance
Drift
Within ±0.2% or ±0.05 pF
(Whichever is larger)
* Do not apply to 1X/25V
Step Temperature (°C)
25±2
-55±3
25±2
125±3
25±2
1
2
3
4
5
No. AEC-Q200 Test Method
Specifications
Temperature Compensating Type
High Dielectric Type
AEC-Q200
Test Item
Specifications and Test Methods
18
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Part Number
Dimensions (mm)
W T
Bulk Bag
Packaging Code: B
Bulk Case
Packaging Code: C
ø180mm reel
Paper Tape
Packaging Code: D
Embossed Tape
Packaging Code: L
Paper Tape
Packaging Code: J
Embossed Tape
Packaging Code: K
ø330mm reel
L
Quantity (pcs.)
Minimum Quantity Guide
Continued on the following page.
Tape Carrier Packaging
1. Dimensions of Reel
2.0±0.5
ø180mm Reel
10±1.5 for 8mm wide tape
14±1.5 for 12mm wide tape
ø180+0
ø50 min.
ø13.0±0.5
ø21.0±0.8
(in mm)
ø330mm Reel
2.0±0.5
10±1.5 for 8mm wide tape
14±1.5 for 12mm wide tape
ø330±2.0
ø50 min.
ø13.0±0.5
ø21.0±0.8
1) There are parts number without bulk case.
-3.0
GCM03
GCM15
GCM18
GCM21
GCM31
GCM32
0.6
1.0
1.6
2.0
3.2
3.2
0.3
0.5
0.8
1.25
1.6
2.5
0.3
0.5
0.8
0.6
0.85
1.25
0.85
1.15
1.6
1.15
1.35
1.6
1.8/2.0/2.5
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
1,000
-
50,000
15,000 1)
10,000
-
5,000 1)
-
-
-
-
-
-
-
50,000
50,000
10,000
10,000
10,000
-
10,000
-
-
-
-
-
-
-
-
-
-
-
10,000
-
10,000
6,000
10,000
8,000
6,000
4,000
15,000
10,000
4,000
4,000
4,000
-
4,000
-
-
-
-
-
-
-
-
-
-
-
3,000
-
3,000
2,000
3,000
2,000
2,000
1,000
Package
19
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
2. Dimensions of Paper Tape
4.0±0.1
8mm width 4mm pitch Tape 8mm width 2mm pitch Tape
ø1.5+0.1
-0
4.0±0.1
1.75±0.1 1.1 max.
8.0±0.3
Direction of Feed
A
B
3.5±0.05
2.0±0.05
APart Number B
GCM18
GCM32
(T=0.85mm)
GCM31
(TV0.85mm)
GCM21
(TV0.85mm)
1.05±0.1
2.0±0.2
2.8±0.2
1.55±0.15
1.85±0.1
3.6±0.2
3.6±0.2
2.3±0.15
A*Part Number B*
GCM15 0.65 1.15
GCM03 0.37 0.67
*Nominal Value
(in mm)
(in mm)
2.0±0.05 ø1.5+0.1
-
0
A
3.5±0.05
4.0±0.1
2.0±0.05
8.0±0.3
1.75±0.1 0.8 max.
Direction of Feed
B
Continued on the following page.
Continued from the preceding page.
3. Dimensions of Embossed Tape
8mm width 4mm pitch Tape
APart Number B
GCM21
(T=1.25mm)
GCM31
(TU1.15mm)
GCM32
(TU1.15mm)
1.45±0.2
2.8±0.2
1.9±0.2
2.25±0.2
3.5±0.2
3.5±0.2
*Nominal Value
4.0±0.1
4.0±0.1
1.75±0.1
8.0±0.3
Direction of feed
A
B
2.0±0.1 0.2±0.1
2.5 max.
ø1.5+0.1
-0
3.5±0.05
(3.0 max. T=1.8mm/2.0mm)
Package
20
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
4. Taping Method
(1) Tapes for capacitors are wound clockwise. The
sprocket holes are to the right as the tape is pulled
toward the user.
(2) Part of the leader and part of the empty tape should
be attached to the end of the tape as follows.
(3) The top tape and base tape are not attached at the
end of the tape for a minimum of 5 pitches.
(4) Missing capacitors number within 0.1% of the number
per reel or 1 pc, whichever is greater, and are not
continuous.
(5) The top tape and bottom tape should not protrude
beyond the edges of the tape and should not cover
sprocket holes.
(6) Cumulative tolerance of sprocket holes, 10 pitches:
±0.3mm.
(7) Peeling off force: 0.1 to 0.6N* in the direction shown
below. *GCM03: 0.05 to 0.5N
165 to 180˚
Base Tape
Top Tape
Direction of Feed
160 min. 190 min. 210 min.
(Top Tape alone)
(in mm)
Vacant Section Chip-mounting Unit Vacant Section
Leader unit
Continued from the preceding page.
Dimensions of Bulk Case Packaging
The bulk case uses antistatic materials. Please contact
Murata for details.
6.8
8.8
12.0
2.0
3.0
1.5
110 (in mm)
36.0
31.5
Package
21
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
!Caution
1. The performance of chip monolithic ceramic capacitors
may be affected by the storage conditions.
1-1. Store capacitors in the following conditions:
Temperature of +5°C to +40°C and a Relative
Humidity of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes,
corrosive gas atmosphere or high temperature
and humidity conditions during storage may affect
the solderability and the packaging performance.
Please use product within six months of receipt.
(2) Please confirm solderability before using after
six months. Store the capacitors without opening
the original bag. Even if the storage period is
short, do not exceed the specified atmospheric
conditions.
1-2. Corrosive gas can react with the termination
(external) electrodes or lead wires of capacitors, and
result in poor solderability. Do not store the
capacitors in an atmosphere consisting of corrosive
gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine,
ammonia gas, etc.).
1-3. Due to moisture condensation caused by rapid
humidity changes, or the photochemical change
caused by direct sunlight on the terminal electrodes
and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store
capacitors under direct sunlight or in high humidity
conditions.
■ Storage and Operation condition
!Caution (Storage and Operation Condition)
22
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
!Caution
■ Rating
1. Temperature Dependent Characteristics
2. Measurement of Capacitance
1. The electrical characteristics of the capacitor can change
with temperature.
1-1. For capacitors having larger temperature
dependency, the capacitance may change with
temperature changes.
The following actions are recommended in order to
insure suitable capacitance values.
(1) Select a suitable capacitance for the operating
temperature range.
(2) The capacitance may change within the rated
temperature.
When you use a high dielectric constant type
capacitors in a circuit that needs a tight (narrow)
capacitance tolerance. Example: a time constant
circuit., please carefully consider the
characteristics of these capacitors, such as their
aging, voltage, and temperature characteristics.
And check capacitors using your actual
appliances at the intended environment and
operating conditions.
1. Measure capacitance with the voltage and the frequency
specified in the product specifications.
1-1. The output voltage of the measuring equipment may
decrease when capacitance is high occasionally.
Please confirm whether a prescribed measured
voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant
type capacitors change depending on the AC voltage
applied. Please consider the AC voltage
characteristics when selecting a capacitor to be used
in a AC circuit.
Continued on the following page.
-20
-15
-10
-5
0
5
10
15
20
-75 -50 -25 0 25 50 75 100
Capacitance Change (%)
Temperature (°C)
Typical Temperature Characteristics Char. R6(X5R)
Capacitance Change (%)
Temperature (°C)
Typical Temperature Characteristics Char. F5(Y5V)
Typical Temperature Characteristics Char. R7(X7R)
-20
-15
-10
-5
0
5
10
15
20
-75 -50 -25 0 25 50 75 100 125 150
Capacitance Change (%)
Temperature (°C)
-100
-80
-60
-40
-20
0
20
40
-50 -25 0 25 50 75 100
!Caution (Rating)
23
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
!Caution
3. Applied Voltage
4. Applied Voltage and Self-heating Temperature
1. Do not apply a voltage to the capacitor that exceeds the
rated voltage as called-out in the specifications.
1-1. Applied voltage between the terminals of a capacitor
shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage,
the zero-to-peak voltage shall not exceed the
rated DC voltage.
When AC voltage or pulse voltage is applied, the
peak-to-peak voltage shall not exceed the rated
DC voltage.
(2) Abnormal voltages (surge voltage, static
electricity, pulse voltage, etc.) shall not exceed
the rated DC voltage.
1. When the capacitor is used in a high-frequency voltage,
pulse voltage, application, be sure to take into account
self-heating may be caused by resistant factors of the
capacitor.
1-1. The load should be contained to the level such that
when measuring at atmospheric temperature of 25°C,
the product's self-heating remains below 20°C and
surface temperature of the capacitor in the actual
circuit remains within the maximum operating
temperature.
1-2. Influence of overvoltage
Overvoltage that is applied to the capacitor may
result in an electrical short circuit caused by the
breakdown of the internal dielectric layers .
The time duration until breakdown depends on the
applied voltage and the ambient temperature.
Continued on the following page.
Continued from the preceding page.
Typical Voltage Applied to the DC Capacitor
(E: Maximum possible applied voltage.)
DC Voltage DC Voltage+AC AC Voltage Pulse Voltage
E
0
E
0
E0E
0
!Caution (Rating)
24
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
!Caution
5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type
capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a
capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change
sharply depending on the applied voltage. (See
figure)
Please confirm the following in order to secure the
capacitance.
(1) Whether the capacitance change caused by the
applied voltage is within the range allowed or not.
(2) In the DC voltage characteristics, the rate of
capacitance change becomes larger as voltage
increases. Even if the applied voltage is below
the rated voltage. When a high dielectric constant
type capacitor is in a circuit that needs a tight
(narrow) capacitance tolerance. Example: a time
constant circuit., please carefully consider the
characteristics of these capacitors, such as their
aging, voltage, and temperature characteristics.
And check capacitors using your actual
appliances at the intended environment and
operating conditions.
2. The capacitance values of high dielectric constant type
capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when
selecting a capacitor to be used in a AC circuit.
Continued on the following page.
Continued from the preceding page.
-60
-50
-40
-30
-20
-10
0
10
20
30
0.0 0.5 1.0 1.5 2.0 2.5
AC Voltage (Vr.m.s.)
6. Capacitance Aging
1. The high dielectric constant type capacitors have the
characteristic in which the capacitance value decreases
with passage of time.
When you use a high dielectric constant type capacitors
in a circuit that needs a tight (narrow) capacitance
tolerance. Example: a time constant circuit., please
carefully consider the characteristics of these capacitors,
such as their aging, voltage, and temperature
characteristics. And check capacitors using your actual
appliances at the intended environment and operating
conditions.
-100
-80
-60
-40
-20
0
20
01234567
DC Voltage (VDC)
[DC Voltage Characteristics]
[AC Voltage Characteristics]
Capacitance Change (%)Capacitance Change (%)
-40
-30
-20
-10
0
10
20
10 100 1000 10000
5C
R∆
Time (Hr)
Capacitor Change (%)
!Caution (Rating)
25
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
!Caution
7. Vibration and Shock
1. The capacitors mechanical actress (vibration and shock)
shall be specified for the use environment.
Please confirm the kind of vibration and/or shock, its
condition, and any generation of resonance.
Please mount the capacitor so as not to generate
resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to falling may cause damage or a
crack in the dielectric material of the capacitor.
Do not use a fallen capacitor because the quality and
reliability may be deteriorated.
3. When printed circuit boards are piled up or handled, the
corners of another printed circuit board should not be
allowed to hit the capacitor in order to avoid a crack or
other damage to the capacitor.
Continued from the preceding page.
Floor
Crack
Crack
Mounting printed circuit board
!Caution (Rating)
26
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
!Caution
■ Soldering and Mounting
1. Confirm the best mounting position and direction that
minimizes the stress imposed on the capacitor during
flexing or bending the printed circuit board.
1-1. Choose a mounting position that minimizes the
stress imposed on the chip during flexing or bending
of the board.
1. Mounting Position
Locate chip
horizontal to the
direction in
which stress
acts.
Chip arrangement
Worst A-C-(B~D) Best
[Component Direction]
[Chip Mounting Close to Board Separation Point]
A
B
D
C
Perforation
Slit
2. Information before Mounting
1. Do not re-use capacitors that were removed from the
equipment.
2. Confirm capacitance characteristics under actual applied
voltage.
3. Confirm the mechanical stress under actual process and
equipment use.
4. Confirm the rated capacitance, rated voltage and other
electrical characteristics before assembly.
5. Prior to use, confirm the Solderability for the capacitors
that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat
treatment for capacitors that were in long-term storage.
7. The use of Sn-Zn based solder will deteriorate the
reliability of the MLCC.
Please contact our sales representative or product
engineers on the use of Sn-Zn based solder in advance.
Continued on the following page.
3. Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not
applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit
board, any bending force against them shall be kept
to a minimum to prevent them from any bending
damage or cracking. Please take into account the
following precautions and recommendations for use
in your process.
(1) Adjust the lowest position of the pickup nozzle so
as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of
1N to 3N during mounting.
2. Dirt particles and dust accumulated between the suction
nozzle and the cylinder inner wall prevent the nozzle from
moving smoothly. This imposes greater force upon the
chip during mounting, causing cracked chips. Also the
locating claw, when worn out, imposes uneven forces on
the chip when positioning, causing cracked chips. The
suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
Board Guide
[Correct]
Suction Nozzle
Board
Support Pin
[Incorrect]
Deflection
!Caution (Soldering and Mounting)
27
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
!Caution
4-1. Reflow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB board.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (∆T) as small as possible.
2. Solderability of Tin plating termination chips might be
deteriorated when a low temperature soldering profile
where the peak solder temperature is below the melting
point of Tin is used. Please confirm the Solderability of Tin
plated termination chips before use.
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (∆T)
between the component and the solvent within the range
shown in the table 1.
GRM03/15/18/21/31
GCM32
∆TV190°C
∆TV130°C
Part Number Temperature Differential
Table 1
Recommended Conditions
[Standard Conditions for Reflow Soldering]
[Allowable Reflow Soldering Temperature and Time]
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
,,,
,,,
,,,
Soldering Time (sec.)
260
270
280
250
240
230
2200 30 60 90 120
Soldering Temperature (D)
Inverting the PCB
Make sure not to impose any abnormal mechanical shocks
to the PCB.
Continued from the preceding page.
Continued on the following page.
Peak Temperature
Atmosphere
Pb-Sn Solder
Infrared Reflow
230 to 250°C
Air
Vapor Reflow
230 to 240°C
Air
Lead Free Solder
240 to 260°C
Air or N2
Infrared Reflow
Vapor Reflow
60-120 seconds 30-60 seconds
,,,
,,,
,,,
∆T
Gradual
Cooling
Soldering
Preheating
200°C
170°C
150°C
130°C
Time
Temperature (D)
Peak Temperature
60-120 seconds 20 seconds max.
∆T
Gradual
Cooling
Soldering
Preheating
170°C
150°C
130°C
Time
Temperature (D)
Peak Temperature
,,,
,,,
,,,
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a
excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause the
chips to crack.
4-2. Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
4-3. Make sure the solder has been applied smoothly to
the end surface to a height of 0.2mm* min.
0.2mm∗ min.
∗ GRM03: 1/3 of Chip Thickness min. in section
!Caution (Soldering and Mounting)
28
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
!Caution
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessive, the risk of cracking is higher during board
bending or any other stressful condition.
GCM18/21/31 ∆TV150°C
Part Number Temperature Differential
Table 2
[Standard Conditions for Flow Soldering]
[Allowable Flow Soldering Temperature and Time]
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
,,,
,,,
Soldering Time (sec.)
260
270
280
250
240
230
2200 10 20 30 40
Soldering Temperature (D)
Up to Chip Thickness
Adhesive
Continued from the preceding page.
Continued on the following page.
Recommended Conditions
Soldering Peak Temperature
Atmosphere
Pb-Sn Solder
240 to 250°C
Air
Lead Free Solder
250 to 260°C
Preheating Peak Temperature 90 to 110°C 100 to 120°C
N2
30-90 seconds 5 seconds max.
∆T
Gradual
Cooling
Soldering
Preheating
Preheating
Peak
Temperature
Time
Temperature (D)
Soldering
Peak
Temperature
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
4-2. Flow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage in the components, preheating
should be required for both of the components and the
PCB board.
Preheating conditions are shown in table 2. It is required
to keep temperature differential between the solder and
the components surface (∆T) as small as possible.
2. Excessively long soldering time or high soldering
temperature can result in leaching of the outer electrodes,
causing poor adhesion or a reduction in capacitance
value due to loss of contact between electrodes and end
termination.
3. When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
(∆T) between the component and solvent within the range
shown in the table 2.
4. Do not apply flow soldering to chips not listed in table 2.
,,,,
,,,,
,,,,
in section
!Caution (Soldering and Mounting)
29
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
!Caution
Solder Amount
in section
4-3. Correction with a Soldering Iron
1. When sudden heat is applied to the components when
using a soldering iron, the mechanical strength of the
components will decrease because the extreme
temperature change can cause deformations inside the
components. In order to prevent mechanical damage to
the components, preheating is required for both the
components and the PCB board. Preheating conditions,
(The "Temperature of the Soldering Iron Tip", "Preheating
Temperature", "Temperature Differential" between the
iron tip and the components and the PCB), should be
within the conditions of table 3. It is required to keep the
temperature differential between the soldering iron and
the component surfaces (∆T) as small as possible.
2. After soldering, do not allow the component/PCB to
rapidly cool down.
3. The operating time for the re-working should be as short
as possible. When re-working time is too long, it may
cause solder leaching, and that will cause a reduction in
the adhesive strength of the terminations.
4. Optimum Solder amount when re-working with a
Soldering lron
4-1. In case of sizes smaller than 0603, (GCM03/15/18),
the top of the solder fillet should be lower than 2/3's
of the thickness of the component or 0.5mm
whichever is smaller. In case of 0805 and larger
sizes, (GCM21/31/32), the top of the solder fillet
should be lower than 2/3's of the thickness of the
component. If the solder amount is excessive, the
risk of cracking is higher during board bending or
under any other stressful condition.
4-2. A soldering iron with a tip of ø3mm or smaller should
be used. It is also necessary to keep the soldering
iron from touching the components during the
re-work.
4-3. Solder wire with ø0.5mm or smaller is required for
soldering.
GCM03/15/18/21/31
GCM32
∆TV190°C
∆TV130°C
Part Number
Temperature
Differential
(∆T)
Table 3
Continued from the preceding page.
4-4. Leaded Component Insertion
1. If the PCB is flexed when leaded components (such as
transformers and ICs) are being mounted, chips may
crack and solder joints may break.
Before mounting leaded components, support the PCB
using backup pins or special jigs to prevent warping.
5. Washing
Excessive ultrasonic oscillation during cleaning can cause
the PCBs to resonate, resulting in cracked chips or broken
solder joints. Take note not to vibrate PCBs.
Air
Air
Atmosphere
350°C max.
280°C max.
Temperature
of Soldering
Iron Tip
150°C min.
150°C min.
Preheating
Temperature
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Continued on the following page.
!Caution (Soldering and Mounting)
30
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
!Caution
6. Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when
inspecting the electrical performance of a capacitor after
mounting on the printed circuit board.
1-1. Avoid bending printed circuit board by the pressure
of a test pin, etc.
The thrusting force of the test probe can flex the PCB,
resulting in cracked chips or open solder joints.
Provide support pins on the back side of the PCB to
prevent warping or flexing.
1-2. Avoid vibration of the board by shock when a test pin
contacts a printed circuit board.
7. Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do
not apply any stress to the capacitor that is caused by
bending or twisting the board.
1-1. In cropping the board, the stress as shown right may
cause the capacitor to crack.
Try not to apply this type of stress to a capacitor.
2. Check of the cropping method for the printed circuit
board in advance.
2-1. Printed circuit board cropping shall be carried out by
using a jig or an apparatus to prevent the mechanical
stress which can occur to the board.
(1) Example of a suitable jig
Recommended example: the board should be
pushed as close to the near the cropping jig as
possible and from the back side of board in order
to minimize the compressive stress applied to
capacitor.
Not recommended example* when the board is
pushed at a point far from the cropping jig and
from the front side of board as below, the
capacitor may form a crack caused by the tensile
stress applied to capacitor.
Continued from the preceding page.
Continued on the following page.
[Not Recommended]
[Recommended]
Peeling
Test-pin
Support Pin
Test-pin
[Bending]
[Twisting]
[Outline of Jig]
Load Point
Load Point
Boad Cropping Jig
V-groove
Printed Circuit Board
Components
Components
Printed Circuit Board
Direction of Load Direction of Load
Printed Circuit Board
Not recommendedRecommended
!Caution (Soldering and Mounting)
31
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
!Caution
(2) Example of a suitable machine
An outline of a printed circuit board cropping
machine is shown as follows. Along the lines with
the V-grooves on printed circuit board, the top
and bottom blades are aligned to one another
when cropping the board.
The misalignment of the position between top and
bottom blades may cause the capacitor to crack.
Continued from the preceding page.
V-groove
Printed Circuit Board
[Outline of Machine]
[Principle of Operation]
[Cross-section Diagram]
Top Blade
Top Blade
Bottom Blade
Bottom Blade
Top Blade
Bottom Blade
Top Blade
Bottom Blade
Top Blade
Bottom Blade
Top Blade
Printed Circuit Board
V-groove
Recommended Not Recommended
Top-bottom Misalignment Left-right Misalignment Front-rear Misalignment
!Caution (Soldering and Mounting)
32
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
!Caution
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands
during operation in order to avoid the danger of a
electric shock.
1-2. Do not allow the terminals of a capacitor to come in
contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid,
inducing any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will
operation is under the specified conditions.
Do not use the equipment under the following
environment.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to Ozone, ultraviolet rays or
radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide,
sulfur dioxide, chlorine, ammonia gas, etc.)
(5) Any vibrations or mechanical shocks exceeding
the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any
conditions that can cause condensation.
2. Others
2-1. In an Emergency
(1) If the equipment should generate smoke, fire or
smell, immediately turn off or unplug the
equipment.
If the equipment is not turned off or unplugged,
the hazards may be worsened by supplying
continuous power.
(2) In this type of situation, do not allow face and
hands to come in contact with the capacitor or
burns may be caused by the capacitors high
temperature.
2-2. Disposal of Waste
When capacitors are disposed, they must be burned
or buried by the industrial waste vender with the
appropriate licenses.
2-3. Circuit Design
GRM, GCM, GMA/D, LLL/A/M, ERB, GQM, GJM,
GNM Series capacitors in this catalog are not safety
certified products.
2-4. Remarks
Failure to follow the cautions may result, worst case,
in a short circuit and smoking when the product is
used.
The above notices are for standard applications and
conditions. Contact us when the products are used in
special mounting conditions.
Select optimum conditions for operation as they
determine the reliability of the product after assembly.
The data herein are given in typical values, not
guaranteed ratings.
■ Others
!Caution (Others)
33
1
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Notice
1. Operating Temperature
1. The operating temperature limit depends on the
capacitor.
1-1. Do not apply temperatures exceeding the upper
operating temperature.
It is necessary to select a capacitor with a suitable
rated temperature which will cover the operating
temperature range.
Also it is necessary to consider the temperature
distribution in equipment and the seasonal
temperature variable factor.
1-2. Consider the self-heating of the capacitor
The surface temperature of the capacitor shall be
the upper operating temperature or less when
including the self-heating factors.
2. Atmosphere Surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. The capacitor, when used in the above, unsuitable,
operating environments may deteriorate due to
the corrosion of the terminations and the
penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur
when the electrodes or terminals of the capacitor
are subject to moisture condensation.
1-3. The deterioration of characteristics and insulation
resistance due to the oxidization or corrosion of
terminal electrodes may result in breakdown when
the capacitor is exposed to corrosive or volatile
gases or solvents for long periods of time.
3. Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in
AC or pulse circuits, the capacitor itself vibrates at
specific frequencies and noise may be generated.
Moreover, when the mechanical vibration or shock is
added to capacitor, noise may occur.
■ Rating
Notice (Rating)
34
1
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Notice
■ Soldering and Mounting
1. PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are
susceptible to flexing stresses since they are
mounted directly on the substrate.
They are also more sensitive to mechanical and
thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses
and cause chip cracking. When designing substrates,
take land patterns and dimensions into consideration
to eliminate the possibility of excess solder fillet
height.
1-2. It is possible for the chip to crack by the expansion
and shrinkage of a metal board. Please contact us if
you want to use our ceramic capacitors on a metal
board such as Aluminum.
Chassis
Solder (ground)
Electrode Pattern
Solder Resist
Solder Resist
Solder Resist
Lead Wire
Soldering Iron
Lead Wire
Solder Resist
Continued on the following page.
Pattern Forms
Placing Close to Chassis
Placing
of Chip Components
and Leaded Components
Placing
of Leaded Components
after Chip Component
Lateral Mounting
Prohibited Correct
Notice (Soldering and Mounting)
35
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Notice
GCM18
GCM21
GCM31
1.6g0.8
2.0g1.25
3.2g1.6
0.6 to 1.0
1.0 to 1.2
2.2 to 2.6
0.8 to 0.9
0.9 to 1.0
1.0 to 1.1
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4 (in mm)
Part Number Dimensions Chip (LgW) a b c
Table 1 Flow Soldering Method
GCM03
GCM15
GCM18
GCM21
GCM31
GCM32
0.6g0.3
1.0g0.5
1.6g0.8
2.0g1.25
3.2g1.6
3.2g2.5
0.2 to 0.3
0.3 to 0.5
0.6 to 0.8
1.0 to 1.2
2.2 to 2.4
2.0 to 2.4
0.2 to 0.35
0.35 to 0.45
0.6 to 0.7
0.6 to 0.7
0.8 to 0.9
1.0 to 1.2
0.2 to 0.4
0.4 to 0.6
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
1.8 to 2.3 (in mm)
Part Number Dimensions Chip (LgW) a b c
Table 2 Reflow Soldering Method
Chip Capacitor
Continued from the preceding page.
Continued on the following page.
2. Land Dimensions
2-1. Chip capacitor can be cracked due to the stress of
PCB bending / etc if the land area is larger than
needed and has an excess amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering.
Please confirm the suitable land dimension by
evaluating of the actual SET / PCB. Solder Resist
ab
c
Land
2. Adhesive Application
1. Thin or insufficient adhesive can cause the chips to
loosen or become disconnected during flow soldering.
The amount of adhesive must be more than dimension c,
shown in the drawing at right, to obtain the correct
bonding strength.
The chip's electrode thickness and land thickness must
also be taken into consideration.
2. Low viscosity adhesive can cause chips to slip after
mounting. The adhesive must have a viscosity of
5000Pa • s (500ps) min. (at 25°C).
3. Adhesive Coverage
Land
Adhesive
Board
Chip Capacitor
a
b
c
c=50 to 105µm
b=30 to 35µm
a=20 to 70µm
GCM18
GCM21
GCM31
0.05mg min.
0.1mg min.
0.15mg min.
Part Number Adhesive Coverage*
*Nominal Value
3. Adhesive Curing
1. Insufficient curing of the adhesive can cause chips to
disconnect during flow soldering and causes deterioration
in the insulation resistance between the outer electrodes
due to moisture absorption.
Control curing temperature and time in order to prevent
insufficient hardening.
Notice (Soldering and Mounting)
36
1
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Notice
1. Please evaluate a capacitor by actual cleaning equipment
and condition surely for confirming the quality and select
the applicable solvent.
2. Unsuitable cleaning solvent may leave residual flux, other
foreign substances, causing deterioration of electrical
characteristics and the reliability of the capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or
insufficient) may result in the deterioration of the
performance of the capacitors.
6. Washing
Continued from the preceding page.
4. Flux Application
1. An excessive amount of flux generates a large quantity of
flux gas, which can cause a deterioration of Solderability.
So apply flux thinly and evenly throughout. (A foaming
system is generally used for flow soldering).
2. Flux containing too a high percentage of halide may
cause corrosion of the outer electrodes unless there is
sufficient cleaning. Use flux with a halide content of 0.1%
max.
3. Do not use strong acidic flux.
4. Do not use water-soluble flux.
(*Water-soluble flux can be defined as non rosin type flux
including wash-type flux and non-wash-type flux.)
o Set temperature and time to ensure that leaching of the
outer electrode does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown right) and 25% of the length A-B shown below as
mounted on substrate.
[As a Single Chip]
[As Mounted on Substrate]
5. Flow Soldering
A
B
C
D
Outer Electrode
A
B
1. A crack may be caused in the capacitor due to the stress
of the thermal contraction of the resin during curing
process.
The stress is affected by the amount of resin and curing
contraction.
Select a resin with small curing contraction.
The difference in the thermal expansion coefficient
between a coating resin or a molding resin and capacitor
may cause the destruction and deterioration of the
capacitor such as a crack or peeling, and lead to the
deterioration of insulation resistance or dielectric
breakdown.
Select a resin for which the thermal expansion coefficient
is as close to that of capacitor as possible.
A silicone resin can be used as an under-coating to buffer
against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions
may cause the deterioration of the insulation resistance of
a capacitor.
An epoxy resin can be used as a less hygroscopic resin.
7. Coating
Notice (Soldering and Mounting)
37
1
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Notice
1. Transportation
1. The performance of a capacitor may be affected by the
conditions during transportation.
1-1. The capacitors shall be protected against
excessive temperature, humidity and mechanical
force during transportation.
(1) Climatic condition
• low air temperature: -40°C
• change of temperature air/air: -25°C/+25°C
• low air pressure: 30 kPa
• change of air pressure: 6 kPa/min.
(2) Mechanical condition
Transportation shall be done in such a way that
the boxes are not deformed and forces are not
directly passed on to the inner packaging.
1-2. Do not apply excessive vibration, shock, and
pressure to the capacitor.
(1) When excessive mechanical shock or pressure
is applied to a capacitor, chipping or cracking
may occur in the ceramic body of the capacitor.
(2) When a sharp edge of an air driver, a soldering
iron, tweezers, a chassis, etc. impacts strongly
on the surface of capacitor, the capacitor may
crack and short-circuit.
1-3. Do not use a capacitor to which excessive shock
was applied by dropping, etc.
The capacitor dropped accidentally during
processing may be damaged.
■ Others
Notice (Others)
38
1
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
39
2
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Chip Monolithic Ceramic Capacitors for Automotive
Medium Voltage for Automotive GCM Series Low Dissipation Factor
■ Features
1. The GCM series meet AEC-Q200 requirements.
2. Low-loss and suitable for high frequency circuits
3. Murata's original internal electrode structure
realizes high flash-over voltage.
4. A new monolithic structure for small, surface-
mountable devices capable of operating at high
voltage levels.
5. Sn-plated external electrodes realize good
solderability.
6. Use the GCM21/31 type with flow or reflow soldering,
and other types with reflow soldering only.
■ Applications
Ideal for use on high frequency pulse circuits such
as snubber circuits for DC-DC converters.
L
T
W
e eg
Part Number Dimensions (mm) g min.e min.TWL
GCM21A 2.0 ±0.2 1.25 ±0.2
GCM31A 3.2 ±0.2 1.6 ±0.2
1.0 +0,-0.3
GCM21B 1.25 ±0.2
1.0 +0,-0.3
GCM31B 1.25 +0,-0.3
GCM32A 3.2 ±0.2 2.5 ±0.2 1.0 +0,-0.3
0.7
1.5
0.3
Part Number Rated Voltage
(V) TC Code
(Standard) Capacitance
(pF) Length L
(mm) Width W
(mm) Thickness T
(mm)
Electrode g
min.
(mm)
Electrode e
(mm)
GCM21A7U2E101JX01D DC250 U2J (EIA) 100 ±5% 2.0 1.25 1.0 0.7 0.3 min.
GCM21A7U2E121JX01D DC250 U2J (EIA) 120 ±5% 2.0 1.25 1.0 0.7 0.3 min.
GCM21A7U2E151JX01D DC250 U2J (EIA) 150 ±5% 2.0 1.25 1.0 0.7 0.3 min.
GCM21A7U2E181JX01D DC250 U2J (EIA) 180 ±5% 2.0 1.25 1.0 0.7 0.3 min.
GCM21A7U2E221JX01D DC250 U2J (EIA) 220 ±5% 2.0 1.25 1.0 0.7 0.3 min.
GCM21A7U2E271JX01D DC250 U2J (EIA) 270 ±5% 2.0 1.25 1.0 0.7 0.3 min.
GCM21A7U2E331JX01D DC250 U2J (EIA) 330 ±5% 2.0 1.25 1.0 0.7 0.3 min.
GCM21A7U2E391JX01D DC250 U2J (EIA) 390 ±5% 2.0 1.25 1.0 0.7 0.3 min.
GCM21A7U2E471JX01D DC250 U2J (EIA) 470 ±5% 2.0 1.25 1.0 0.7 0.3 min.
GCM21A7U2E561JX01D DC250 U2J (EIA) 560 ±5% 2.0 1.25 1.0 0.7 0.3 min.
GCM21A7U2E681JX01D DC250 U2J (EIA) 680 ±5% 2.0 1.25 1.0 0.7 0.3 min.
GCM21A7U2E821JX01D DC250 U2J (EIA) 820 ±5% 2.0 1.25 1.0 0.7 0.3 min.
GCM21A7U2E102JX01D DC250 U2J (EIA) 1000 ±5% 2.0 1.25 1.0 0.7 0.3 min.
GCM21A7U2E122JX01D DC250 U2J (EIA) 1200 ±5% 2.0 1.25 1.0 0.7 0.3 min.
GCM21A7U2E152JX01D DC250 U2J (EIA) 1500 ±5% 2.0 1.25 1.0 0.7 0.3 min.
GCM21A7U2E182JX01D DC250 U2J (EIA) 1800 ±5% 2.0 1.25 1.0 0.7 0.3 min.
GCM21A7U2E222JX01D DC250 U2J (EIA) 2200 ±5% 2.0 1.25 1.0 0.7 0.3 min.
GCM21B7U2E272JX03L DC250 U2J (EIA) 2700 ±5% 2.0 1.25 1.25 0.7 0.3 min.
GCM31A7U2E272JX01D DC250 U2J (EIA) 2700 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM21B7U2E332JX03L DC250 U2J (EIA) 3300 ±5% 2.0 1.25 1.25 0.7 0.3 min.
GCM31A7U2E332JX01D DC250 U2J (EIA) 3300 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM21B7U2E392JX03L DC250 U2J (EIA) 3900 ±5% 2.0 1.25 1.25 0.7 0.3 min.
GCM31A7U2E392JX01D DC250 U2J (EIA) 3900 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM21B7U2E472JX03L DC250 U2J (EIA) 4700 ±5% 2.0 1.25 1.25 0.7 0.3 min.
GCM31A7U2E472JX01D DC250 U2J (EIA) 4700 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM21B7U2E562JX03L DC250 U2J (EIA) 5600 ±5% 2.0 1.25 1.25 0.7 0.3 min.
GCM31A7U2E562JX01D DC250 U2J (EIA) 5600 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31B7U2E682JX01L DC250 U2J (EIA) 6800 ±5% 3.2 1.6 1.25 1.5 0.3 min.
GCM31B7U2E822JX01L DC250 U2J (EIA) 8200 ±5% 3.2 1.6 1.25 1.5 0.3 min.
GCM31B7U2E103JX01L DC250 U2J (EIA) 10000 ±5% 3.2 1.6 1.25 1.5 0.3 min.
GCM31A7U2J100JX01D DC630 U2J (EIA) 10 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J120JX01D DC630 U2J (EIA) 12 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J150JX01D DC630 U2J (EIA) 15 ±5% 3.2 1.6 1.0 1.5 0.3 min.
Continued on the following page.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
40
2
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Part Number Rated Voltage
(V) TC Code
(Standard) Capacitance
(pF) Length L
(mm) Width W
(mm) Thickness T
(mm)
Electrode g
min.
(mm)
Electrode e
(mm)
Continued from the preceding page.
GCM31A7U2J180JX01D DC630 U2J (EIA) 18 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J220JX01D DC630 U2J (EIA) 22 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J270JX01D DC630 U2J (EIA) 27 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J330JX01D DC630 U2J (EIA) 33 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J390JX01D DC630 U2J (EIA) 39 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J470JX01D DC630 U2J (EIA) 47 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J560JX01D DC630 U2J (EIA) 56 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J680JX01D DC630 U2J (EIA) 68 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J820JX01D DC630 U2J (EIA) 82 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J101JX01D DC630 U2J (EIA) 100 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J121JX01D DC630 U2J (EIA) 120 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J151JX01D DC630 U2J (EIA) 150 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J181JX01D DC630 U2J (EIA) 180 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J221JX01D DC630 U2J (EIA) 220 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J271JX01D DC630 U2J (EIA) 270 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J331JX01D DC630 U2J (EIA) 330 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J391JX01D DC630 U2J (EIA) 390 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J471JX01D DC630 U2J (EIA) 470 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J561JX01D DC630 U2J (EIA) 560 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J681JX01D DC630 U2J (EIA) 680 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J821JX01D DC630 U2J (EIA) 820 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM31A7U2J102JX01D DC630 U2J (EIA) 1000 ±5% 3.2 1.6 1.0 1.5 0.3 min.
GCM32A7U2J122JX01D DC630 U2J (EIA) 1200 ±5% 3.2 2.5 1.0 1.5 0.3 min.
GCM32A7U2J152JX01D DC630 U2J (EIA) 1500 ±5% 3.2 2.5 1.0 1.5 0.3 min.
GCM32A7U2J182JX01D DC630 U2J (EIA) 1800 ±5% 3.2 2.5 1.0 1.5 0.3 min.
GCM32A7U2J222JX01D DC630 U2J (EIA) 2200 ±5% 3.2 2.5 1.0 1.5 0.3 min.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Continued on the following page.
Using calipers and micrometers9
Physical Dimension
Within the specified dimensions
Visual inspection8 External Visual No defects or abnormalities
Apply voltage as Table for 1000±12 hours at 125±3°C. Let sit
for 24±2 hours at room temperature, then measure.
The charge/discharge current is less than 50mA.
7
Operational Life The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±3.0% or ±0.3pF
(Whichever is larger)
QQU350
I.R. More than 1,000MΩ or 50MΩ · µF
(Whichever is smaller)
Apply the rated voltage and DC1.3+0.2/-0V (add 6.8kΩ
resistor) at 85±3°C and 80 to 85% humidity for 1000±12 hours.
Remove and let sit for 24±2 hours at room temperature, then
measure.
The charge/discharge current is less than 50mA.
6
Biased Humidity The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±3.0% or ±0.3pF
(Whichever is larger)
QQU200
I.R. More than 1,000MΩ or 50MΩ · µF
(Whichever is smaller)
Apply the 24 hour heat (25 to 65°C) and humidity (80 to 98%)
treatment shown below, 10 consecutive times.
Let sit for 24±2 hours at room temperature, then measure.
5
Moisture
Resistance The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±3.0% or ±0.3pF
(Whichever is larger)
QQU350
I.R. More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
Per EIA-4694Destructive
Physical Analysis No defects or abnormalities
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (19). Perform the 1000 cycles
according to the 4 heat treatments listed in the following table.
Let sit for 24±2 hours at room temperature, then measure.3
Temperature
Cycle The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±2.5% or ±0.25pF
(Whichever is larger)
QQU1000
I.R. More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
Sit the capacitor for 1000±12 hours at 150±3°C. Let sit for 24±2
hours at room temperature, then measure.
2
High Temperature
Exposure (Storage) The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±2.5% or ±0.25pF
(Whichever is larger)
QQU1000
I.R. More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
1
Pre-and Post-Stress
Electrical Test
–
No. AEC-Q200 Test MethodSpecifications
AEC-Q200
Test Item
°C
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-5
-10
Humidity
90-98% Humidity
80-98% Humidity
90-98% Humidity
80-98% Humidity
90-98%
+10
-2°C
Initial measurement
Temperature
One cycle 24 hours
0123456789
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Hours
Step 1
-55+0/-3
15±3
2
Room Temp.
1
3
125+3/-0
15±3
4
Room Temp.
1
Temp. (°C)
Time (min.)
Medium Voltage for Automotive GCM Series Low Disspation Factor Specifications and Test Methods
Rated Voltage Applied Voltage
150% of the rated voltage
120% of the rated voltage
DC250V
DC630V
Specifications and Test Methods
41
2
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Continued from the preceding page.
Continued on the following page.
(a) Preheat at 155°C for 4 hours. After preheating, immerse the
capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-
K-5902) (25% rosin in weight proportion). Immerse in eutectic
solder solution for 5+0/-0.5 seconds at 235±5°C.
(b) Should be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in
weight proportion). Immerse in eutectic solder solution for
5+0/-0.5 seconds at 235±5°C.
(c) Should be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in
weight proportion). Immerse in eutectic solder solution for 120
±5 seconds at 260±5°C.
16 Solderability 95% of the terminations is to be soldered evenly and
continuously.
Per AEC-Q200-00215 ESD
Appearance
No marking defects
Capacitance
Change
Within the specified tolerance
QQU1000
I.R. More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (19). Perform the 300 cycles
according to the two heat treatments listed in the following table
(Maximum transfer time is 20 seconds). Let sit for 24±2 hours at
room temperature, then measure.
14
Thermal Shock The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±2.5% or ±0.25pF
(Whichever is larger)
QQU1000
I.R. More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
Immerse the capacitor in a eutectic solder solution at 260±5°C for
10±1 seconds. Let sit at room temperature for 24±2 hours, then
measure.
13
Resistance to
Soldering Heat The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within the specified tolerance
QQU1000
I.R. More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
Solder the capacitor to the test jig (glass epoxy board) in the
same manner and under the same conditions as (19). The
capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 2000Hz. The
frequency range, from 10 to 2000Hz and return to 10Hz, should
be traversed in approximately 20 minutes. This motion should be
applied for 12 items in each 3 mutually perpendicular directions
(total of 36 times).
12
Vibration
Appearance
No defects or abnormalities
Capacitance
Change
Within the specified tolerance
QQU1000
I.R. More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
Three shocks in each direction should be applied along 3
mutually perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
duration: 0.5ms, peak value: 1500g and velocity change: 4.7m/s.
11
Mechanical
Shock
Appearance
No marking defects
Capacitance
Change
Within the specified tolerance
QQU1000
I.R. More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
Per MIL-STD-202 Method 215
Solvent 1: 1 part (by volume) of isopropyl alcohol
3 parts (by volume) of mineral spirits
Solvent 2: Terpene defluxer
Solvent 3: 42 parts (by volume) of water
1 part (by volume) of propylene glycol
monomethyl ether
1 part (by volume) of monoethanolomine
10
Resistance
to Solvents
Appearance
No marking defects
Capacitance
Change
Within the specified tolerance
QQU1000
I.R. More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
No. AEC-Q200 Test MethodSpecifications
AEC-Q200
Test Item
Step 1
-55+0/-3
15±3
2
125+3/-0
15±3
Temp. (°C)
Time (min.)
Medium Voltage for Automotive GCM Series Low Disspation Factor Specifications and Test Methods
Specifications and Test Methods
42
2
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Continued from the preceding page.
Continued on the following page.
Solder the capacitor to the test jig (glass epoxy board) shown in
Fig. 3 using a eutectic solder. Then apply 18N force in parallel
with the test jig for 60 seconds.
The soldering should be done by the reflow method and should
be conducted with care so that the soldering is uniform and free
of defects such as heat shock.
(in mm)
Fig. 3
19
Terminal
Strength
Appearance
No marking defects
Capacitance
Change
Within the specified tolerance
QQU1000
I.R. More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig. 1 using a eutectic solder. Then apply a force in the direction
shown in Fig. 2 for 5±1 seconds. The soldering should be done
by the reflow method and should be conducted with care so that
the soldering is uniform and free of defects such as heat shock.
(in mm)
Fig. 2
Fig. 1
18 Board
Flex
Appearance
No marking defects
Capacitance
Change
Within ±5.0% or ±0.5pF
(Whichever is larger)
Visual inspection.
17
Electrical
Characteri-
zation
Appearance
No defects or abnormalities
Capacitance
Change
Within the specified tolerance The capacitance/Q should be measured at 25°C at the frequency
and voltage shown in the table.
QQU1000
I.R.
25°C
More than 100,000MΩ or 1,000MΩ · µF
(Whichever is smaller)
Max. Operating Temperature···125°C
More than 10,000MΩ or 100MΩ · µF
(Whichever is smaller)
The insulation resistance should be measured with a DC voltage
not exceeding the rated voltage at 25°C and 125°C and within 2
minutes of charging.
Dielectric
Strength
No failure
No failure should be observed when voltage in Table is applied
between the terminations for 1 to 5 seconds, provided the
charge/discharge current is less than 50mA.
No. AEC-Q200 Test MethodSpecifications
AEC-Q200
Test Item
Capacitance Frequency
1±0.2MHz
1±0.2kHz
Voltage
AC0.5 to 5V(r.m.s.)
AC1±0.2V(r.m.s.)
CF1000pF
CU1000pF
Rated Voltage Test Voltage
200% of the rated voltage
150% of the rated voltage
DC250V
DC630V
Type a
0.8
2.0
2.0
b
3.0
4.4
4.4
c
1.3
1.7
2.6
GCM21
GCM31
GCM32
Type a
1.2
2.2
2.2
b
4.0
5.0
5.0
c
1.65
2.0
2.9
GCM21
GCM31
GCM32
40
b
C
100
a
t: 1.6mm
45 45
R4
20 50 Pressunzing
speed: 1.0mm/s
Pressurize
Capacitance meter Flexure: V3
c
Baked electrode or
copper foil
Solder resist
t: 1.6mm
a
b
Medium Voltage for Automotive GCM Series Low Disspation Factor Specifications and Test Methods
Specifications and Test Methods
43
2
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Continued from the preceding page.
The capacitance change should be measured after 5 minutes
at each specified temperature stage.
The temperature coefficient is determined using the capacitance
measured in step 3 as a reference. When cycling the
temperature sequentially from step1 through 5 the capacitance
should be within the specified tolerance for the temperature
coefficient. The capacitance drift is calculated by dividing the
differences between the maximum and minimum measured
values in steps 1, 3 and 5 by the capacitance value in step 3.
21
Capacitance
Temperature
Character-
istics
Capacitance
Change
-750±120 ppm/°C
(Temp. Range: +25 to +125°C)
-750±120, -347 ppm/°C
(Temp. Range: -55 to +25°C)
Capacitance
Drift
Within ±0.5% or ±0.05 pF
(Whichever is larger)
Place the capacitor in the beam load fixture as Fig. 4.
Apply a force.
< Chip L dimension: 2.5mm max. >
< Chip L dimension: 3.2mm min. >
Fig. 4
Speed supplied the Stress Load: 2.5mm / s
20 Beam Load Test
The chip endure following force.
< Chip L dimension: 2.5mm max. >
Chip thickness G 0.5mm rank: 20N
Chip thickness V 0.5mm rank: 8N
< Chip L dimension: 3.2mm min. >
Chip thickness F 1.25mm rank: 15N
Chip thickness U 1.25mm rank: 54.5N
No. AEC-Q200 Test MethodSpecifications
AEC-Q200
Test Item
0.6 L
L
Iron Board
Step Temperature (°C)
25±2
-55±3
25±2
125±3
25±2
1
2
3
4
5
Medium Voltage for Automotive GCM Series Low Disspation Factor Specifications and Test Methods
Specifications and Test Methods
44
2
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
45
3
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Chip Monolithic Ceramic Capacitors for Automotive
■ Features
1. The GCJ series meet AEC-Q200 requirements.
2. Improve the endurance against Board Bending Stress.
3. Reduce the board bending stress by the conductive
polymer termination.
4. Use the GCJ31 type with flow or reflow soldering,
and other types with reflow soldering only.
■ Applications
Automotive electronic equipment (Power-train,
safety equipment)
L
T
W
e eg
Part Number L W T
Dimensions (mm) g min.
3.2 ±0.2 1.6 ±0.2 1.25 +0,-0.3
1.2
2.2
3.2
1.6 ±0.2
1.5 +0,-0.3
1.5 +0,-0.3
2.0 +0,-0.3
2.0 +0,-0.3
2.0 +0,-0.3
3.2 ±0.3 2.5 ±0.2
4.5 ±0.4 3.2 ±0.3
5.7 ±0.4 5.0 ±0.4
e
0.3 min.
GCJ31B
GCJ31C
GCJ32Q
GCJ32D
GCJ43Q
GCJ43D
GCJ55D
Part Number Rated Voltage
(V) TC Code
(Standard) Capacitance Length L
(mm) Width W
(mm) Thickness T
(mm)
Electrode g
min.
(mm)
Electrode e
(mm)
GCJ31BR72E153KXJ1L DC250 X7R (EIA) 15000pF ±10% 3.2 1.6 1.25 1.2 0.3 min.
GCJ31BR72E223KXJ1L DC250 X7R (EIA) 22000pF ±10% 3.2 1.6 1.25 1.2 0.3 min.
GCJ31CR72E333KXJ3L DC250 X7R (EIA) 33000pF ±10% 3.2 1.6 1.6 1.2 0.3 min.
GCJ31CR72E473KXJ3L DC250 X7R (EIA) 47000pF ±10% 3.2 1.6 1.6 1.2 0.3 min.
GCJ32QR72E683KXJ1L DC250 X7R (EIA) 68000pF ±10% 3.2 2.5 1.5 1.2 0.3 min.
GCJ32DR72E104KXJ1L DC250 X7R (EIA) 0.10µF ±10% 3.2 2.5 2.0 1.2 0.3 min.
GCJ43QR72E154KXJ1L DC250 X7R (EIA) 0.15µF ±10% 4.5 3.2 1.5 2.2 0.3 min.
GCJ43DR72E224KXJ1L DC250 X7R (EIA) 0.22µF ±10% 4.5 3.2 2.0 2.2 0.3 min.
GCJ55DR72E334KXJ1L DC250 X7R (EIA) 0.33µF ±10% 5.7 5.0 2.0 3.2 0.3 min.
GCJ55DR72E474KXJ1L DC250 X7R (EIA) 0.47µF ±10% 5.7 5.0 2.0 3.2 0.3 min.
GCJ31BR72J102KXJ1L DC630 X7R (EIA) 1000pF ±10% 3.2 1.6 1.25 1.2 0.3 min.
GCJ31BR72J152KXJ1L DC630 X7R (EIA) 1500pF ±10% 3.2 1.6 1.25 1.2 0.3 min.
GCJ31BR72J222KXJ1L DC630 X7R (EIA) 2200pF ±10% 3.2 1.6 1.25 1.2 0.3 min.
GCJ31BR72J332KXJ1L DC630 X7R (EIA) 3300pF ±10% 3.2 1.6 1.25 1.2 0.3 min.
GCJ31BR72J472KXJ1L DC630 X7R (EIA) 4700pF ±10% 3.2 1.6 1.25 1.2 0.3 min.
GCJ32QR72J682KXJ1L DC630 X7R (EIA) 6800pF ±10% 3.2 2.5 1.5 1.2 0.3 min.
GCJ32QR72J103KXJ1L DC630 X7R (EIA) 10000pF ±10% 3.2 2.5 1.5 1.2 0.3 min.
GCJ32DR72J153KXJ1L DC630 X7R (EIA) 15000pF ±10% 3.2 2.5 2.0 1.2 0.3 min.
GCJ32DR72J223KXJ1L DC630 X7R (EIA) 22000pF ±10% 3.2 2.5 2.0 1.2 0.3 min.
GCJ43DR72J333KXJ1L DC630 X7R (EIA) 33000pF ±10% 4.5 3.2 2.0 2.2 0.3 min.
GCJ43DR72J473KXJ1L DC630 X7R (EIA) 47000pF ±10% 4.5 3.2 2.0 2.2 0.3 min.
GCJ55DR72J104KXJ1L DC630 X7R (EIA) 0.10µF ±10% 5.7 5.0 2.0 3.2 0.3 min.
Medium Voltage for Automotive GCJ Series Soft Termination Type
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Continued on the following page.
Using calipers and micrometers9
Physical Dimension
Within the specified dimensions
Visual inspection8 External Visual No defects or abnormalities
Apply voltage in Table for 1000±12 hours at 125±3°C. Let sit
for 24±2 hours at room temperature, then measure.
The charge/discharge current is less than 50mA.
•Pretreatment
Apply test voltage for 60±5 minutes at test temperature.
Remove and let sit for 24±2 hours at room temperature.
7
Operational Life The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±12.5%
D.F. 0.05 max.
I.R. More than 1,000MΩ or 10MΩ · µF
(Whichever is smaller)
Apply the rated voltage and DC1.3+0.2/-0V (add 6.8kΩ
resistor) at 85±3°C and 80 to 85% humidity for 1000±12 hours.
Remove and let sit for 24±2 hours at room temperature, then
measure.
The charge/discharge current is less than 50mA.
•Pretreatment
Perform the heat treatment at 150+0/-10°C for 60±5 minutes
and then let sit for 24±2 hours at room temperature.
6
Biased Humidity The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±12.5%
D.F. 0.05 max.
I.R. More than 1,000MΩ or 10MΩ · µF
(Whichever is smaller)
Apply the 24 hour heat (25 to 65°C) and humidity (80 to 98%)
treatment shown below, 10 consecutive times.
Let sit for 24±2 hours at room temperature, then measure.
5
Moisture
Resistance The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±12.5%
D.F. 0.05 max.
I.R. More than 10,000MΩ or 100MΩ · µF
(Whichever is smaller)
Per EIA-4694Destructive
Physical Analysis No defects or abnormalities
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (19). Perform the 1000 cycles
according to the 4 heat treatments listed in the following table.
Let sit for 24±2 hours at room temperature, then measure.
•Pretreatment
Perform the heat treatment at 150+0/-10°C for 60±5 minutes
and then let sit for 24±2 hours at room temperature.
3
Temperature
Cycle The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±10%
D.F. 0.05 max.
I.R. More than 10,000MΩ or 100MΩ · µF
(Whichever is smaller)
Sit the capacitor for 1000±12 hours at 150±3°C. Let sit for 24±2
hours at room temperature, then measure.
2
High Temperature
Exposure (Storage) The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±10%
D.F. 0.05 max.
I.R. More than 10,000MΩ or 100MΩ · µF
(Whichever is smaller)
1
Pre-and Post-Stress
Electrical Test
–
No. AEC-Q200 Test MethodSpecifications
AEC-Q200
Test Item
°C
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-5
-10
Humidity
90-98% Humidity
80-98% Humidity
90-98% Humidity
80-98% Humidity
90-98%
+10
-2°C
Initial measurement
Temperature
One cycle 24 hours
0123456789
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Hours
Step 1
-55+0/-3
15±3
2
Room Temp.
1
3
125+3/-0
15±3
4
Room Temp.
1
Temp. (°C)
Time (min.)
Rated Voltage Applied Voltage
150% of the rated voltage
120% of the rated voltage
DC250V
DC630V
Medium Voltage for Automotive Soft Termination Type GCJ Series Specifications and Test Methods
Specifications and Test Methods
46
3
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Continued from the preceding page.
Continued on the following page.
(a) Preheat at 155°C for 4 hours. After preheating, immerse the
capacitor in a solution of ethanol (JIS-K-8101) and rosin (JIS-
K-5902) (25% rosin in weight proportion). Immerse in eutectic
solder solution for 5+0/-0.5 seconds at 235±5°C.
(b) Should be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in
weight proportion). Immerse in eutectic solder solution for
5+0/-0.5 seconds at 235±5°C.
(c) Should be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol (JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in
weight proportion). Immerse in eutectic solder solution for 120
±5 seconds at 260±5°C.
16 Solderability 95% of the terminations is to be soldered evenly and
continuously.
Per AEC-Q200-00215 ESD
Appearance
No marking defects
Capacitance
Change
Within the specified tolerance
D.F. 0.025 max.
I.R. More than 10,000MΩ or 100MΩ · µF
(Whichever is smaller)
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (19). Perform the 300 cycles
according to the two heat treatments listed in the following table
(Maximum transfer time is 20 seconds). Let sit for 24±2 hours at
room temperature, then measure.
•Pretreatment
Perform the heat treatment at 150+0/-10°C for 60±5 minutes
and then let sit for 24±2 hours at room temperature.
14
Thermal Shock The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±10%
D.F. 0.025 max.
I.R. More than 10,000MΩ or 100MΩ · µF
(Whichever is smaller)
Immerse the capacitor in a eutectic solder solution at 260±5°C for
10±1 seconds. Let sit at room temperature for 24±2 hours, then
measure.
•Pretreatment
Perform the heat treatment at 150+0/-10°C for 60±5 minutes
and then let sit for 24±2 hours at room temperature.
13
Resistance to
Soldering Heat The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
No marking defects
Capacitance
Change
Within ±10%
D.F. 0.025 max.
I.R. More than 10,000MΩ or 100MΩ · µF
(Whichever is smaller)
Solder the capacitor to the test jig (glass epoxy board) in the
same manner and under the same conditions as (19). The
capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 2000Hz. The
frequency range, from 10 to 2000Hz and return to 10Hz, should
be traversed in approximately 20 minutes. This motion should be
applied for 12 items in each 3 mutually perpendicular directions
(total of 36 times).
12
Vibration
Appearance
No defects or abnormalities
Capacitance
Change
Within the specified tolerance
D.F. 0.025 max.
I.R. More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
Three shocks in each direction should be applied along 3
mutually perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
duration: 0.5ms, peak value: 1500g and velocity change: 4.7m/s.
11
Mechanical
Shock
Appearance
No marking defects
Capacitance
Change
Within the specified tolerance
D.F. 0.025 max.
I.R. More than 10,000MΩ or 500MΩ · µF
(Whichever is smaller)
Per MIL-STD-202 Method 215
Solvent 1: 1 part (by volume) of isopropyl alcohol
3 parts (by volume) of mineral spirits
Solvent 2: Terpene defluxer
Solvent 3: 42 parts (by volume) of water
1 part (by volume) of propylene glycol
monomethyl ether
1 part (by volume) of monoethanolomine
10
Resistance
to Solvents
Appearance
No marking defects
Capacitance
Change
Within the specified tolerance
D.F. 0.025 max.
I.R. More than 10,000MΩ or 100MΩ · µF
(Whichever is smaller)
No. AEC-Q200 Test MethodSpecifications
AEC-Q200
Test Item
Step 1
-55+0/-3
15±3
2
125+3/-0
15±3
Temp. (°C)
Time (min.)
Medium Voltage for Automotive Soft Termination Type GCJ Series Specifications and Test Methods
Specifications and Test Methods
47
3
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Continued from the preceding page.
Continued on the following page.
Solder the capacitor to the test jig (glass epoxy board) shown in
Fig. 3 using a eutectic solder. Then apply 18N force in parallel
with the test jig for 60 seconds.
The soldering should be done by the reflow method and should
be conducted with care so that the soldering is uniform and free
of defects such as heat shock.
(in mm)
Fig. 3
19
Terminal
Strength
Appearance
No marking defects
Capacitance
Change
Within the specified tolerance
D.F. 0.025 max.
I.R. More than 10,000MΩ or 100MΩ · µF
(Whichever is smaller)
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig. 1 using a eutectic solder. Then apply a force in the direction
shown in Fig. 2 for 5±1 seconds. The soldering should be done
by the reflow method and should be conducted with care so that
the soldering is uniform and free of defects such as heat shock.
(in mm)
Fig. 2
Fig. 1
18 Board
Flex
Appearance
No marking defects
Capacitance
Change
Within ±12.5%
Visual inspection.
17
Electrical
Characteri-
zation
Appearance
No defects or abnormalities
Capacitance
Change
Within the specified tolerance The capacitance/Q should be measured at 25°C at the frequency
and voltage shown in the table.
D.F. 0.025 max.
I.R.
25°C
More than 10,000MΩ or 100MΩ · µF
(Whichever is smaller)
Max. Operating Temperature···125°C
More than 1,000MΩ or 10MΩ · µF
(Whichever is smaller)
The insulation resistance should be measured with a DC voltage
not exceeding the rated voltage at 25°C and 125°C and within 2
minutes of charging.
Dielectric
Strength
No failure
No failure should be observed when voltage in Table is applied
between the terminations for 1 to 5 seconds, provided the
charge/discharge current is less than 50mA.
No. AEC-Q200 Test MethodSpecifications
AEC-Q200
Test Item
Capacitance Frequency
1±0.2MHz
1±0.2kHz
Voltage
AC0.5 to 5V(r.m.s.)
AC1±0.2V(r.m.s.)
CF1000pF
CU1000pF
Rated Voltage Test Voltage
200% of the rated voltage
150% of the rated voltage
DC250V
DC630V
Type a
2.0
2.0
3.0
4.2
b
4.4
4.4
6.0
7.2
c
1.7
2.6
3.3
5.1
GCJ31
GCJ32
GCJ43
GCJ55
Type a
2.2
2.2
3.5
4.5
b
5.0
5.0
7.0
8.0
c
2.0
2.9
3.7
5.6
GCJ31
GCJ32
GCJ43
GCJ55
40
b
C
100
a
t: 1.6mm
45 45
R4
20 50 Pressunzing
speed: 1.0mm/s
Pressurize
Capacitance meter Flexure: V3
c
Baked electrode or
copper foil
Solder resist
t: 1.6mm
a
b
Medium Voltage for Automotive Soft Termination Type GCJ Series Specifications and Test Methods
Specifications and Test Methods
48
3
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Continued from the preceding page.
The capacitance change should be measured after 5 minutes
at each specified temperature stage.
The ranges of capacitance change compared with the above
25°C value over the temperature ranges shown in the table
should be within the specified ranges.
•Pretreatment
Perform the heat treatment at 150+0/-10°C for 60±5 minutes
and then let sit for 24±2 hours at room temperature.
Perform the initial measurement.
21
Capacitance
Temperature
Character-
istics
Capacitance
Change
Within ±15%
Place the capacitor in the beam load fixture as Fig. 4.
Apply a force.
Fig. 4
Speed supplied the Stress Load: 2.5mm / s
20 Beam Load Test The chip endure following force.
Chip thickness F 1.25mm rank: 15N
Chip thickness U 1.25mm rank: 54.5N
No. AEC-Q200 Test MethodSpecifications
AEC-Q200
Test Item
0.6 L
L
Step Temperature (°C)
25±2
-55±3
25±2
125±3
25±2
1
2
3
4
5
Medium Voltage for Automotive Soft Termination Type GCJ Series Specifications and Test Methods
Specifications and Test Methods
49
3
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Medium Voltage Data (Typical Example)
50
3
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
■ Capacitance - Temperature Characteristics
U2J Characteristics
Cap. Change (%)
Temperature (°C)
−20
0
5
10
−60 −40 −20 0 20 40 60 80 100 120 140
−15
−10
−5
15
20
X7R Characteristics
Cap. Change (%)
Temperature (°C)
–20
0
5
10
–60 –40 –20 0 20 40 60 80 100 120 140
–15
–10
-5
15
20
■ Impedance - Frequency Characteristics
X7R Characteristics DC250V
0.01
0.1
1
10
100
1M 10M 100M 1G
Frequency (Hz)
(1) GCJ31BR72E223KXJ1L
(2) GCJ31CR72E473KXJ3L
(3) GCJ32DR72E104KXJ1L
(4) GCJ43DR72E224KXJ1L
(5) GCJ55DR72E474KXJ1L
Z (Ω)
(1)
(2)
(3)
(4)
(5)
X7R Characteristics DC630V
0.01
0.1
1
10
100
1k
1M 10M 100M 1G
Frequency (Hz)
(1) GCJ31BR72J102KXJ1L
(2) GCJ31BR72J222KXJ1L
(3) GCJ31BR72J472KXJ1L
(4) GCJ32QR72J103KXJ1L
(5) GCJ32DR72J223KXJ1L
(6) GCJ43DR72J473KXJ1L
(7) GCJ55DR72J104KXJ1L
Z (Ω)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Taping is standard packaging method.
Part Number Dimensions (mm)
W T
ø180mm Reel
Paper Tape Embossed Tape
L
Quantity (pcs.)
Medium Voltage
GCM21
GCJ31/GCM31
GCJ32/GCM32
GCJ43
GCJ55
2.0
3.2
3.2
4.5
5.7
1.25
1.6
2.5
3.2
5.0
1.0
1.25
1.0
1.25
1.6
1.0
1.5
2.0
1.5
2.0
2.0
4,000
-
4,000
-
-
4,000
-
-
-
-
-
-
3,000
-
3,000
2,000
-
2,000
1,000
1,000
1,000
1,000
c Minimum Quantity Guide
c Tape Carrier Packaging
(1) Appearance of Taping
qEmbossed Tape wPaper Tape
Top Tape: 0.05mm in thickness
Sprocket Hole: As specified in (2)
Cavity for Chip: As specified in (2)
Base Tape: As specified in (2)
Bottom Tape: 0.05mm in thickness
ChipPacked Chips
Cover Tape: 0.06mm in thickness
Sprocket Hole: As specified in (2)
Cavity for Chip: As specified in (2)
Base Tape: As specified in (2)
ChipPacked Chips
Continued on the following page.
(2) Dimensions of Tape
q Embossed Tape
8mm width 4mm pitch Tape
A*Part Number B*
GCJ31/GCM31 (TU1.25mm) 2.0 3.6
GCM21 (TU1.25mm) 1.45 2.25
GCJ32 (TU1.25mm) 2.9 3.6
*Nominal Value
4.0T0.1
4.0T0.05
1.75T0.1
8.0T0.3
Direction of Feed
A
B
2.0T0.05 0.25T0.1
2.5 max.
3.5T0.05
φ1.5W0.1
Y0
12mm width 8mm/4mm pitch Tape
A*Part Number B*
3.6 4.9
GCJ43
GCJ55 5.4 6.1
*Nominal Value
(in mm)
8.0T0.1*1
4.0
T
0.1 1.75
T
0.1
12.0T0.3
Direction of Feed
5.5T0.05
2.0T0.05 0.3T0.1
3.7 max.
B
A
φ1.5W0.1
Y0
Package
51
3
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
(4) Taping Method
q Tapes for capacitors are wound clockwise. The
sprocket holes are to the right as the tape is pulled
toward the user.
w Part of the leader and part of the empty tape should be
attached to the end of the tape as shown at right.
e The top tape or cover tape and base tape are not
attached at the end of the tape for a minimum of 5
pitches.
r Missing capacitors number within 0.1% of the number
per reel or 1 pc, whichever is greater, and are not
continuous.
t The top tape or cover tape and bottom tape should not
protrude beyond the edges of the tape and should not
cover sprocket holes.
y Cumulative tolerance of sprocket holes, 10 pitches:
T0.3mm.
u Peeling off force: 0.1 to 0.6N in the direction shown at
right.
(in mm)
165 to 180°
Base Tape
Top Tape or Cover Tape
Direction of feed
160 min. 160 min.
400 to 560
(Top Tape or Cover Tape alone)
Vacant section Chip mounting unit Vacant section
Continued from the preceding page.
(3) Dimensions of Reel
(in mm)
2.0T0.5
9.0 (Tape width 8mm)
13.0 (Tape width 12mm)
φ13T0.2
φ21T0.8
60 +1
-
0
-
1.5
180+0
-
0
+1.0
-
0
+1.0
13.0T1.0 (Tape width 8mm)
17.0T1.0 (Tape width 12mm)
w Paper Tape
8mm width 4mm pitch Tape
A*Part Number B*
GCM21
(T=1.0mm) 1.45 2.25
GCM31
(T=1.0mm) 2.0 3.6
GCM32
(T=1.0mm) 2.9 3.6
*Nominal Value
(in mm)
4.0T0.1 φ1.5W0.1
Y0
4.0T0.1
1.75T0.1 1.1 max.
8.0T0.3
Direction of Feed
A
B
3.5T0.05
2.0T0.05
Package
52
3
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
!Caution
53
3
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
■ Storage and Operating Conditions
■ Handling
1. Vibration and impact
Do not expose a capacitor to excessive shock or
vibration during use.
2. Do not directly touch the chip capacitor, especially
the ceramic body. Residue from hands/fingers may
create a short circuit environment.
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT
AND CAUSE FUMING OR PARTIAL DISPERSION
WHEN THE PRODUCT IS USED.
Operating and storage environment
Do not use or store capacitors in a corrosive
atmosphere, especially where chloride gas, sulfide
gas, acid, alkali, salt or the like are present. And
avoid exposure to moisture. Before cleaning, bonding
or molding this product, verify that these processes
do not affect product quality by testing the
performance of a cleaned, bonded or molded product
in the intended equipment. Store the capacitors
where the temperature and relative humidity do not
exceed 5 to 40 degrees centigrade and 20 to 70%.
Use capacitors within 6 months after delivered.
Check the solderability after 6 months or more.
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT
AND CAUSE FUMING OR PARTIAL DISPERSION
WHEN THE PRODUCT IS USED.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
When DC-rated capacitors are to be used in AC or ripple
current circuits, be sure to maintain the Vp-p value of the
applied voltage or the Vo-p which contains DC bias within
the rated voltage range.
When the voltage is applied to the circuit, starting or
stopping may generate irregular voltage for a transit
period because of resonance or switching. Be sure to use
a capacitor with a rated voltage range that includes these
irregular voltages.
When DC-rated capacitors are to be used in input circuits
from commercial power source (AC filter), be sure to use
Safety Recognized Capacitors because various
regulations on withstand voltage or impulse withstand
established for each equipment should be taken into
considerations.
Voltage
Positional
Measurement
DC Voltage DC+AC Voltage AC Voltage Pulse Voltage (1) Pulse Voltage (2)
V0-p V0-p Vp-p Vp-p Vp-p
1. Operating Voltage
2. Operating Temperature, Self-generated Heat, and
Load Reduction at High-frequency Voltage Condition
Keep the surface temperature of a capacitor below the
upper limit of its rated operating temperature range.
Be sure to take into account the heat generated by the
capacitor itself. When the capacitor is used in a high-
frequency voltage, pulse voltage, it may self-generate
heat due to dielectric loss.
(1) In case of X7R char.
Applied voltage should be the load such as self-
generated heat is within 20°C on the condition of
atmosphere temperature 25°C. When measuring, use a
thermocouple of small thermal capacity -K of ø0.1mm
in conditions where the capacitor is not affected by
radiant heat from other components or surrounding
ambient fluctuations. Excessive heat may lead to
deterioration of the capacitor's characteristics and
reliability. (Never attempt to perform measurement
with the cooling fan running. Otherwise, accurate
measurement cannot be ensured.)
Continued on the following page.
■ Rating
!Caution
54
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
(2) In case of U2J char.
Due to the low self-heating characteristics of low-
dissipation capacitors, the allowable electric power of
these capacitors is generally much higher than that of
X7R characteristic capacitors.
When a high frequency voltage which cause 20°C self
heating to the capacitor is applied, it will exceed
capacitor's allowable electric power.
The frequency of the applied sine wave voltage should be
less than 500kHz. The applied voltage should be less
than the value shown in figure below.
In case of non-sine wave which includes a harmonic
frequency, please contact our sales representatives or
product engineers. Excessive heat may lead to
deterioration of the capacitor's characteristics and
reliability. (Never attempt to perform measurement with
the cooling fan running.
Otherwise, accurate measurement cannot be ensured.)
<Capacitor Selection Tool>
We are also offering free software the "capacitor
selection tool: Murata Medium Voltage Capacitors
Selection Tool by Voltage Form (*)" which will assist you
in selecting a suitable capacitor.
The software can be downloaded from Murata's Internet
Web site.
(http://www.murata.com/designlib/mmcsv_e.html)
By inputting capacitance values and applied voltage
waveform of the specific capacitor series, this software
will calculate the capacitor's power consumption and list
suitable capacitors. (non-sine wave is also available).
* Subject series are below.
· Temperature Characteristics U2J
Continued on the following page.
The sine-wave frequency VS allowable voltage
The temperature of the surface
of capacitor: 125˚C or less (including self-heating)
U2J char., Rated Voltage: DC630V
Frequency [kHz] 1000(500)100101
100
(630)
Allowable voltage [Vp-p]
1000 to 680pF
1,000pF
2,200pF
U2J char., Rated Voltage: DC250V
Frequency [kHz] 1000(500)100101
100
(250)
Allowable voltage [Vp-p]
1000
to 4,700pF
10,000pF
Continued from the preceding page.
Failure of a capacitor may result in a short circuit. Be sure
to provide an appropriate fail-safe function such as a fuse
on your product to help eliminate possible electric shock,
fire, or fumes.
Please consider using fuses on each AC line if the
capacitors are used between the AC input lines and earth
(line bypass capacitors), to prepare for the worst case,
such as a short circuit.
3. Fail-safe
AC IN
FUSE
!Caution
55
3
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Continued from the preceding page.
Tests for AC withstanding voltage should be made with
equipment capable of creating a wave similar to a
50/60 Hz sine wave.
If the distorted sine wave or overload exceeding the
specified voltage value is applied, a defect may be
caused.
4. Test Condition for AC Withstanding Voltage
(1) Test Equipment
The capacitor's leads or terminals should be firmly
connected to the output of the withstanding voltage test
equipment, and then the voltage should be raised from
near zero to the test voltage. If the test voltage is applied
directly to the capacitor without raising it from near zero,
it should be applied with the zero cross*. At the end of the
test time, the test voltage should be reduced to near zero,
and then the capacitor's leads or terminals should be
taken off the output of the withstanding voltage test
equipment. If the test voltage is applied directly to the
capacitor without raising it from near zero, surge voltage
may occur and cause a defect.
*ZERO CROSS is the point where voltage sine wave
pass 0V.
- See the figure at right -
(2) Voltage Applied Method
0V
zero cross
Voltage sine wave
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT AND
CAUSE FUMING OR PARTIAL DISPERSION WHEN THE
PRODUCT IS USED.
!Caution
56
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
[Chip Mounting Close to Board Separation Point]
A
B
D
C
Perforation
Slit
Locate chip
horizontal to the
direction in which
stress acts.
Chip arrangement
Worst AGCGB~D Best
[Component Direction]
1. Vibration and Impact
Do not expose a capacitor to excessive shock or vibration
during use.
2. Circuit Board Material
In case that ceramic chip capacitor is soldered on the
metal board, such as Aluminum board, the stress of heat
expansion and contraction might cause the crack of
ceramic capacitor, due to the difference of thermal
expansion coefficient between metal board and ceramic
chip.
3. Land Layout for Cropping PC Board
Continued on the following page.
Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
<Examples to be avoided> <Examples of improvements>
■ Solder and Mounting
!Caution
57
3
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
,,,
,,,
,,,
4. Reflow Soldering
When the sudden heat is given to the components, the
mechanical strength of the components should go down
because remarkable temperature change causes
deformity of components inside. In order to prevent
mechanical damage in the components, preheating
should be required for both of the components and the
PCB board. Preheating conditions are shown in Table 1.
It is required to keep temperature differential between the
soldering and the components surface (∆T) as small as
possible.
Solderability of Tin plating termination chip might be
deteriorated when low temperature soldering profile
where peak solder temperature is below the Tin melting
point is used. Please confirm the solderability of Tin
plating termination chip before use.
When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
(∆T) between the component and solvent within the
range shown in the Table 1.
G--21/31
G--32/43/55
∆TV190D
∆TV130D
Part Number Temperature Differential
Table 1
Recommended Conditions
[Standard Conditions for Reflow Soldering]
[Allowable Soldering Temperature and Time]
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
,,,
,,,
,,,
Soldering Time (sec.)
260
270
250
240
230
0 30 60 90
Soldering Temperature (D)
Inverting the PCB
Make sure not to impose an abnormal mechanical shock on
the PCB.
Continued from the preceding page.
Peak Temperature
Atmosphere
Pb-Sn Solder
Infrared Reflow
230-250°C
Air
Vapor Reflow
230-240°C
Air
Lead Free Solder
240-260°C
Air or N2
Infrared Reflow
Vapor Reflow
60-120 seconds 30-60 seconds
,,,
,,,
,,,
∆T
Gradual
Cooling
Soldering
Preheating
200°C
170°C
150°C
130°C
Time
Temperature (D)
Peak Temperature
60-120 seconds 20 seconds max.
∆T
Gradual
Cooling
Soldering
Preheating
170°C
150°C
130°C
Time
Temperature (D)
Peak Temperature
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Continued on the following page.
Optimum Solder Amount for Reflow Soldering
Overly thick application of solder paste results in
excessive fillet height solder.
This makes the chip more susceptible to mechanical and
thermal stress on the board and may cause cracked
chips.
Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in chips
breaking loose from the PCB.
Make sure the solder has been applied smoothly to the
end surface to a height of 0.2mm min.
[Optimum Solder Amount for Reflow Soldering]
0.2mm min.
in section
!Caution
58
3
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessively big, the risk of cracking is higher during
board bending or under any other stressful conditions.
Continued from the preceding page.
Optimum Solder Amount for Flow Soldering
5. Flow Soldering
When the sudden heat is given to the components, the
mechanical strength of the components should go down
because remarkable temperature change causes
deformity of components inside. And an excessively long
soldering time or high soldering temperature results in
leaching by the outer electrodes, causing poor adhesion
or a reduction in capacitance value due to loss of contact
between electrodes and end termination.
In order to prevent mechanical damage in the
components, preheating should be required for both of
the components and the PCB board. Preheating
conditions are shown in Table 2. It is required to keep
temperature differential between the soldering and the
components surface (∆T) as small as possible.
When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
between the component and solvent within the range
shown in Table 2.
Do not apply flow soldering to chips not listed in Table 2.
G--21/31 ∆TV150D
Part Number Temperature Differential
Table 2
[Standard Conditions for Flow Soldering]
[Allowable Soldering Temperature and Time]
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
,,,
,,,
,,,
Soldering Time (sec.)
260
270
250
240
230
0 10 20 30
Soldering Temperature (D)
Up to Chip Thickness
Adhesive
Recommended Conditions
Peak Temperature
Atmosphere
Pb-Sn Solder
240-250°C
Air
Lead Free Solder
250-260°C
N2
60-120 seconds 5 seconds max.
∆T
Gradual
Cooling
Soldering
Preheating
170°C
150°C
130°C
Time
Temperature (D)
Peak Temperature
,,,
,,,
,,,
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Continued on the following page.
in section
!Caution
59
3
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
Optimum Solder Amount when re-working Using a
Soldering Iron
Solder Amount
6. Correction with a Soldering Iron
When sudden heat is applied to the components by use
of a soldering iron, the mechanical strength of the
components will go down because the extreme
temperature change causes deformations inside the
components.
In order to prevent mechanical damage to the
components, preheating is required for both the
components and the PCB board.
Preheating conditions, (The "Temperature of the
Soldering Iron tip", "Preheating Temperature",
"Temperature Differential" between iron tip and the
components and the PCB), should be within the
conditions of table 3.
It is required to keep the temperature differential between
the soldering Iron and the components surface (∆T) as
small as possible.
After soldering, do not allow the component/PCB to cool
down rapidly.
The operating time for the re-working should be as short
as possible. When re-working time is too long, it may
cause solder leaching, and that will cause a reduction of
the adhesive strength of the terminations.
Table 3
Continued from the preceding page.
7. Washing
Excessive output of ultrasonic oscillation during cleaning
causes PCBs to resonate, resulting in cracked chips or
broken solder. Take note not to vibrate PCBs.
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT AND
FUMING WHEN THE PRODUCT IS USED.
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
In case of larger sizes than Gpp21, the top of the solder
fillet should be lower than 2/3's of the thickness of the
component.
If the solder amount is excessive, the risk of cracking is
higher during board bending or under any other stressful
conditions.
A Soldering iron ø3mm or smaller should be used.
It is also necessary to keep the soldering iron from
touching the components during the re-work.
Solder wire with ø0.5mm or smaller is required for
soldering.
in section
G--21/31
G--32/43/55 ∆TV190D
∆TV130D
Part Number
Temperature
Differential
(∆T)
air
air
Atmosphere
150°C min.
150°C min.
Preheating
Temperature
350°C max.
280°C max.
Temperature
of Soldering
Iron tip
!Caution
60
3
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
1. Construction of Board Pattern
After installing chips, if solder is excessively applied to
the circuit board, mechanical stress will cause destruction
resistance characteristics to lower. To prevent this, be
extremely careful in determining shape and dimension
before designing the circuit board diagram.
Construction and Dimensions of Pattern (Example)
Flow soldering : 3.2g1.6 or less available.
LgW a b c
2.0g1.25 1.0-1.2 0.9-1.0 0.8-1.1
2.2-2.6 1.0-1.1 1.0-1.43.2g1.6
Flow Soldering
LgW a b c
2.0g1.25 1.0-1.2 0.6-0.7 0.8-1.1
2.2-2.4 0.8-0.9 1.0-1.43.2g1.6
2.0-2.4 1.0-1.2 1.8-2.33.2g2.5
2.8-3.4 1.2-1.4 2.3-3.04.5g3.2
4.0-4.6 1.4-1.6 3.5-4.85.7g5.0
(in mm)
Reflow Soldering
Land
Chip Capacitor
cSolder Resist
ab
L
W
Dimensions of Slit (Example)
LgW d e
2.0g1.25 -
1.0-2.0
-
3.2-3.73.2g1.6
1.0-2.0 4.1-4.63.2g2.5
(in mm)
Land
Chip Capacitor SlitSolder Resist
deL
W
Continued on the following page.
in section
in section
in section in section
in section
in section
Land Layout to Prevent Excessive Solder
Mounting Close to a Chassis Mounting with Leaded Components Mounting Leaded Components Later
Examples of
Prohibition
Examples of
Improvements
by the Land
Division
Lead Wire Connected
to a Part Provided
with Lead Wires.
ChassisSolder (Ground solder)
Adhesive
Base board
Land Pattern
d1Soldering Iron
Lead Wire of
Component to be
Connected Later.
Solder Resist
Solder Resist
d2d1<d2Solder Resist
Preparing slit helps flux cleaning and resin coating on the back of the capacitor.
But, the length of slit design should be shorter enough as much as possible to prevent the mechanical damage in the capacitor.
The longer slit design might receive more severe mechanical stress from the PCB.
Recommendable slit design is shown in the Table.
c Notice (Soldering and Mounting)
Notice
61
3
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
3. Soldering
(1) Limit of losing effective area of the terminations and
conditions needed for soldering.
(2) Flux Application
An excessive amount of flux generates a large quantity of
flux gas, causing deteriorated solderability.
So apply flux thinly and evenly throughout.
(A foaming system is generally used for flow soldering.)
Flux containing too high percentage of halide may cause
corrosion of the outer electrodes unless sufficient
cleaning. Use flux with a halide content of 0.2% max.
Do not use strong acidic flux.
Do not use water-soluble flux*.
(*Water-soluble flux can be defined as non rosin type flux
including wash-type flux and non-wash-type flux.)
(3) Solder
The use of Sn-Zn based solder will deteriorate the
reliability of the MLCC.
Please contact our sales representative or product
engineers on the use of Sn-Zn based solder in advance.
A
B
C
D
Termination
Continued from the preceding page.
2. Mounting of Chips
Mechanical shock of the chip placer
When the positioning claws and pick-up nozzle are worn,
the load is applied to the chip while positioning is
concentrated in one position, thus causing cracks,
breakage, faulty positioning accuracy, etc.
Careful checking and maintenance are necessary to
prevent unexpected trouble.
An excessively low bottom dead point of the suction
nozzle imposes great force on the chip during mounting,
causing cracked chips. Please set the suction nozzle's
bottom dead point on the upper surface of the board.
Thickness of adhesives applied
Keep thickness of adhesives applied (50-105µm or more)
to reinforce the adhesive contact considering the
thickness of the termination or capacitor (20-70µm) and
the land pattern (30-35µm).
Continued on the following page.
Depending on the conditions of the soldering
temperature and/or immersion (melting time),
effective areas may be lost in some part of the
terminations.
To prevent this, be careful in soldering so that any
possible loss of the effective area on the terminations
will securely remain at a maximum of 25% on all
edge length A-B-C-D-A of part with A, B, C, D, shown
in the Figure below.
Notice
62
3
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
4. Cleaning
Please confirm there is no problem in the reliability of the
product beforehand when cleaning it with the intended
equipment.
The residue after cleaning it might cause the decrease in
the surface resistance of the chip and the corrosion of the
electrode part, etc. As a result it might cause reliability to
deteriorate. Please confirm beforehand that there is no
problem with the intended equipment in ultrasonic
cleansing.
5. Resin Coating
Please use it after confirming there is no influence on the
product with a intended equipment beforehand when the
resin coating and molding.
A cracked chip might be caused at the cooling/heating
cycle by the amount of resin spreading and/or bias
thickness.
The resin for coating and molding must be selected as
the stress is small when stiffening and the hygroscopic is
low as possible.
Continued from the preceding page.
Notice
63
3
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• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
■ Rating
1. Capacitance change of capacitor
(1) In case of X7R char.
Capacitors have an aging characteristic, whereby
the capacitor continually decreases its
capacitance slightly if the capacitor is left on
for a long time. Moreover, capacitance might change
greatly depending on the surrounding temperature
or an applied voltage. So, it is not likely to be
suitable for use in a time constant circuit.
Please contact us if you need detailed information.
(2) In case of U2J char.
Capacitance might change a little depending on the
surrounding temperature or an applied voltage.
Please contact us if you intend to use this product
in a strict time constant circuit.
2. Performance check by equipment
Before using a capacitor, check that there is no
problem in the equipment's performance and the
specifications.
Moreover, check the surge-proof ability of a
capacitor in the equipment, if needed, because the
surge voltage may exceed specific value by the
inductance of the circuit.
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
sales representatives or product engineers before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Note C03E.pdf
10.5.20
