HCS08
Microcontrollers
freescale.com
MC9S08JM60
MC9S08JM32
Data Sheet
MC9S08JM60
Rev. 3
1/2009
MC9S08JM60 Series Features
8-Bit HCS08 Central Processor Unit (CPU)
• 48-MHz HCS08 CPU (central processor unit)
• 24-MHz internal bus frequency
• HC08 instruction set with added BGND instruction
• Background debugging system
• Breakpoint capability to allow single breakpoint
setting during in-circuit debugging (plus two more
breakpoints in on-chip debug module)
• In-circuit emulator (ICE) debug module containing
two comparators and nine trigger modes. Eight
deep FIFO for storing change-of-flow addresses
and event-only data. Debug module supports both
tag and force breakpoints.
• Support for up to 32 interrupt/reset sources
Memory Options
• Up to 60 KB of on-chip in-circuit programmable
flash memory with block protection and security
options
• Up to 4 KB of on-chip RAM
• 256 bytes of USB RAM
Clock Source Options
• Clock source options include crystal, resonator,
external clock
• MCG (multi-purpose clock generator) — PLL and
FLL; internal reference clock with trim adjustment
System Protection
• Optional computer operating properly (COP) reset
with option to run from independent 1-kHz internal
clock source or the bus clock
• Low-voltage detection with reset or interrupt
• Illegal opcode detection with reset
• Illegal address detection with reset
Power-Saving Modes
• Wait plus two stops
Peripherals
•USB — USB 2.0 full-speed (12 Mbps) device
controller with dedicated on-chip USB transceiver,
3.3-V regulator and USBDP pull-up resister;
supports control, interrupt, isochronous, and bulk
transfers; supports endpoint 0 and up to 6
additional endpoints; endpoints 5 and 6 can be
combined to provide double buffering capability
•ADC — 12-channel, 12-bit analog-to-digital
converter with automatic compare function;
internal temperature sensor
•ACMP — Analog comparator with option to
compare to internal reference; operation in stop3
mode
•SCI — Two serial communications interface
modules with optional 13-bit break LIN extensions
•SPI — Two 8- or 16-bit selectable serial peripheral
interface modules with a receive data buffer
hardware match function
•IIC — Inter-integrated circuit bus module to
operate at up to 100 kbps with maximum bus
loading; multi-master operation; programmable
slave address; interrupt-driven byte-by-byte data
transfer; 10-bit addressing and broadcast modes
support
•Timers — One 2-channel and one 6-channel
16-bit timer/pulse-width modulator (TPM)
modules: Selectable input capture, output
compare, and edge-aligned PWM capability on
each channel. Each timer module may be
configured for buffered, centered PWM (CPWM)
on all channels
•KBI — 8-pin keyboard interrupt module
•RTC — Real-time counter with binary- or
decimal-based prescaler
Input/Output
• Up to 51 general-purpose input/output pins
• Software selectable pullups on ports when used
as inputs
• Software selectable slew rate control on ports
when used as outputs
• Software selectable drive strength on ports when
used as outputs
• Master reset pin and power-on reset (POR)
• Internal pullup on RESET, IRQ, and BKGD/MS
pins to reduce customer system cost
Package Options
• 64-pin quad flat package (QFP)
• 64-pin low-profile quad flat package (LQFP)
• 48-pin quad flat no-lead (QFN)
• 44-pin low-profile quad flat package (LQFP)
MC9S08JM60 Series Data Sheet
Covers MC9S08JM60
MC9S08JM32
MC9S08JM60
Rev. 3
1/2009
Revision History
To provide the most up-to-date information, the revision of our documents on the World Wide Web will be
the most current. Your printed copy may be an earlier revision. To verify you have the latest information
available, refer to:
http://freescale.com/
The following revision history table summarizes changes contained in this document.
Revision
Number
Revision
Date Description of Changes
1 11/27/2007 Initial release
2 3/4/2008
Changed the location of RS to connect to EXTAL in Figure 2-4.
Changed port rise and fall time in Table A-13 .
Added DC injection current and RAM retention voltage in Ta ble A- 6 .
Deleted note on 625 ns of item 17 in Ta ble A - 1 2 .
Moved Bandgap Voltage Reference item from Table A-8 to Ta b l e A - 6 .
Added one paragraph on how to improve accuracy to Section 10.1.1.5,
“Temperature Sensor.”
3 1/21/2009
Changed the VTEMP25 from 1.396 mV to 1.396 V in Ta b l e A - 1 0 .
Complete the EMC data in Section A.15, “EMC Performance.”
Revised the Typo in Table 11-4.
This product incorporates SuperFlash® technology licensed from SST.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
© Freescale Semiconductor, Inc., 2007-2009. All rights reserved.
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 7
List of Chapters
Chapter Number Title Page
Chapter 1 Device Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Chapter 2 Pins and Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Chapter 3 Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Chapter 4 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
Chapter 5 Resets, Interrupts, and System Configuration . . . . . . . . . . . . . . . 65
Chapter 6 Parallel Input/Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Chapter 7 Central Processor Unit (S08CPUV2) . . . . . . . . . . . . . . . . . . . . . . . 99
Chapter 8 5 V Analog Comparator (S08ACMPV2) . . . . . . . . . . . . . . . . . . . . 119
Chapter 9 Keyboard Interrupt (S08KBIV2) . . . . . . . . . . . . . . . . . . . . . . . . . .127
Chapter 10 Analog-to-Digital Converter (S08ADC12V1) . . . . . . . . . . . . . . . 135
Chapter 11 Inter-Integrated Circuit (S08IICV2) . . . . . . . . . . . . . . . . . . . . . . .161
Chapter 12 Multi-Purpose Clock Generator (S08MCGV1) . . . . . . . . . . . . . .181
Chapter 13 Real-Time Counter (S08RTCV1) . . . . . . . . . . . . . . . . . . . . . . . . . 213
Chapter 14 Serial Communications Interface (S08SCIV4). . . . . . . . . . . . . . 223
Chapter 15 16-Bit Serial Peripheral Interface (S08SPI16V1) . . . . . . . . . . . . 243
Chapter 16 Timer/Pulse-Width Modulator (S08TPMV3) . . . . . . . . . . . . . . . . 271
Chapter 17 Universal Serial Bus Device Controller (S08USBV1) . . . . . . . . 295
Chapter 18 Development Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 327
Appendix A Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 349
Appendix B Ordering Information and Mechanical Drawings. . . . . . . . . . 373
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 9
Contents
Section Number Title Page
Chapter 1
Device Overview
1.1 Introduction .....................................................................................................................................19
1.2 MCU Block Diagram ......................................................................................................................19
1.3 System Clock Distribution ..............................................................................................................21
Chapter 2
Pins and Connections
2.1 Introduction .....................................................................................................................................25
2.2 Device Pin Assignment ...................................................................................................................26
2.3 Recommended System Connections ...............................................................................................28
2.3.1 Power (VDD, VSS, VSSOSC, VDDAD, VSSAD, VUSB33) ....................................................30
2.3.2 Oscillator (XTAL, EXTAL) ..............................................................................................30
2.3.3 RESET Pin ........................................................................................................................31
2.3.4 Background/Mode Select (BKGD/MS) ............................................................................31
2.3.5 ADC Reference Pins (VREFH, VREFL) .............................................................................31
2.3.6 External Interrupt Pin (IRQ) .............................................................................................31
2.3.7 USB Data Pins (USBDP, USBDN) ...................................................................................32
2.3.8 General-Purpose I/O and Peripheral Ports ........................................................................32
Chapter 3
Modes of Operation
3.1 Introduction .....................................................................................................................................35
3.2 Features ...........................................................................................................................................35
3.3 Run Mode ........................................................................................................................................35
3.4 Active Background Mode ...............................................................................................................35
3.5 Wait Mode .......................................................................................................................................36
3.6 Stop Modes ......................................................................................................................................37
3.6.1 Stop3 Mode .......................................................................................................................37
3.6.2 Stop2 Mode .......................................................................................................................38
3.6.3 On-Chip Peripheral Modules in Stop Modes ....................................................................39
Chapter 4
Memory
4.1 MC9S08JM60 Series Memory Map ...............................................................................................41
4.1.1 Reset and Interrupt Vector Assignments ...........................................................................42
4.2 Register Addresses and Bit Assignments ........................................................................................43
4.3 RAM (System RAM) ......................................................................................................................50
4.4 USB RAM .......................................................................................................................................51
MC9S08JM60 Series Data Sheet, Rev. 3
10 Freescale Semiconductor
4.5 Flash ................................................................................................................................................51
4.5.1 Features .............................................................................................................................51
4.5.2 Program and Erase Times .................................................................................................52
4.5.3 Program and Erase Command Execution .........................................................................52
4.5.4 Burst Program Execution ..................................................................................................54
4.5.5 Access Errors ....................................................................................................................55
4.5.6 Flash Block Protection ......................................................................................................56
4.5.7 Vector Redirection ............................................................................................................57
4.6 Security ............................................................................................................................................57
4.7 Flash Registers and Control Bits .....................................................................................................58
4.7.1 Flash Clock Divider Register (FCDIV) ............................................................................59
4.7.2 Flash Options Register (FOPT and NVOPT) ....................................................................60
4.7.3 Flash Configuration Register (FCNFG) ...........................................................................61
4.7.4 Flash Protection Register (FPROT and NVPROT) ..........................................................61
4.7.5 Flash Status Register (FSTAT) ..........................................................................................62
4.7.6 Flash Command Register (FCMD) ...................................................................................63
Chapter 5
Resets, Interrupts, and System Configuration
5.1 Introduction .....................................................................................................................................65
5.2 Features ...........................................................................................................................................65
5.3 MCU Reset ......................................................................................................................................65
5.4 Computer Operating Properly (COP) Watchdog .............................................................................66
5.5 Interrupts .........................................................................................................................................67
5.5.1 Interrupt Stack Frame .......................................................................................................68
5.5.2 External Interrupt Request (IRQ) Pin ...............................................................................68
5.5.3 Interrupt Vectors, Sources, and Local Masks ...................................................................69
5.6 Low-Voltage Detect (LVD) System ................................................................................................71
5.6.1 Power-On Reset Operation ...............................................................................................71
5.6.2 Low-Voltage Detection (LVD) Reset Operation ...............................................................71
5.6.3 Low-Voltage Warning (LVW) Interrupt Operation ...........................................................71
5.7 Reset, Interrupt, and System Control Registers and Control Bits ...................................................72
5.7.1 Interrupt Pin Request Status and Control Register (IRQSC) ............................................72
5.7.2 System Reset Status Register (SRS) .................................................................................73
5.7.3 System Background Debug Force Reset Register (SBDFR) ............................................74
5.7.4 System Options Register 1 (SOPT1) ................................................................................74
5.7.5 System Options Register 2 (SOPT2) ................................................................................76
5.7.6 System Device Identification Register (SDIDH, SDIDL) ................................................76
5.7.7 System Power Management Status and Control 1 Register (SPMSC1) ...........................77
5.7.8 System Power Management Status and Control 2 Register (SPMSC2) ...........................78
Chapter 6
Parallel Input/Output
6.1 Introduction .....................................................................................................................................81
6.2 Port Data and Data Direction ..........................................................................................................81
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 11
6.3 Pin Control ......................................................................................................................................82
6.3.1 Internal Pullup Enable ......................................................................................................83
6.3.2 Output Slew Rate Control Enable .....................................................................................83
6.3.3 Output Drive Strength Select ............................................................................................83
6.4 Pin Behavior in Stop Modes ............................................................................................................83
6.5 Parallel I/O and Pin Control Registers ............................................................................................83
6.5.1 Port A I/O Registers (PTAD and PTADD) ........................................................................84
6.5.2 Port A Pin Control Registers (PTAPE, PTASE, PTADS) .................................................84
6.5.3 Port B I/O Registers (PTBD and PTBDD) ........................................................................86
6.5.4 Port B Pin Control Registers (PTBPE, PTBSE, PTBDS) .................................................86
6.5.5 Port C I/O Registers (PTCD and PTCDD) ........................................................................88
6.5.6 Port C Pin Control Registers (PTCPE, PTCSE, PTCDS) .................................................88
6.5.7 Port D I/O Registers (PTDD and PTDDD) .......................................................................90
6.5.8 Port D Pin Control Registers (PTDPE, PTDSE, PTDDS) ................................................90
6.5.9 Port E I/O Registers (PTED and PTEDD) ........................................................................92
6.5.10 Port E Pin Control Registers (PTEPE, PTESE, PTEDS) ..................................................92
6.5.11 Port F I/O Registers (PTFD and PTFDD) .........................................................................94
6.5.12 Port F Pin Control Registers (PTFPE, PTFSE, PTFDS) ...................................................94
6.5.13 Port G I/O Registers (PTGD and PTGDD) .......................................................................96
6.5.14 Port G Pin Control Registers (PTGPE, PTGSE, PTGDS) ................................................96
Chapter 7
Central Processor Unit (S08CPUV2)
7.1 Introduction .....................................................................................................................................99
7.1.1 Features .............................................................................................................................99
7.2 Programmer’s Model and CPU Registers .....................................................................................100
7.2.1 Accumulator (A) .............................................................................................................100
7.2.2 Index Register (H:X) ......................................................................................................100
7.2.3 Stack Pointer (SP) ...........................................................................................................101
7.2.4 Program Counter (PC) ....................................................................................................101
7.2.5 Condition Code Register (CCR) .....................................................................................101
7.3 Addressing Modes .........................................................................................................................103
7.3.1 Inherent Addressing Mode (INH) ...................................................................................103
7.3.2 Relative Addressing Mode (REL) ..................................................................................103
7.3.3 Immediate Addressing Mode (IMM) ..............................................................................103
7.3.4 Direct Addressing Mode (DIR) ......................................................................................103
7.3.5 Extended Addressing Mode (EXT) ................................................................................104
7.3.6 Indexed Addressing Mode ..............................................................................................104
7.4 Special Operations .........................................................................................................................105
7.4.1 Reset Sequence ...............................................................................................................105
7.4.2 Interrupt Sequence ..........................................................................................................105
7.4.3 Wait Mode Operation ......................................................................................................106
7.4.4 Stop Mode Operation ......................................................................................................106
7.4.5 BGND Instruction ...........................................................................................................107
7.5 HCS08 Instruction Set Summary ..................................................................................................108
MC9S08JM60 Series Data Sheet, Rev. 3
12 Freescale Semiconductor
Chapter 8
5 V Analog Comparator (S08ACMPV2)
8.1 Introduction ...................................................................................................................................119
8.1.1 ACMP Configuration Information ..................................................................................119
8.1.2 ACMP/TPM Configuration Information ........................................................................119
8.1.3 Features ...........................................................................................................................121
8.1.4 Modes of Operation ........................................................................................................121
8.1.5 Block Diagram ................................................................................................................121
8.2 External Signal Description ..........................................................................................................123
8.3 Memory Map ................................................................................................................................123
8.3.1 Register Descriptions ......................................................................................................123
8.4 Functional Description ..................................................................................................................125
Chapter 9
Keyboard Interrupt (S08KBIV2)
9.1 Introduction ...................................................................................................................................127
9.1.1 Features ...........................................................................................................................129
9.1.2 Modes of Operation ........................................................................................................129
9.1.3 Block Diagram ................................................................................................................129
9.2 External Signal Description ..........................................................................................................130
9.3 Register Definition ........................................................................................................................130
9.3.1 KBI Status and Control Register (KBISC) .....................................................................130
9.3.2 KBI Pin Enable Register (KBIPE) ..................................................................................131
9.3.3 KBI Edge Select Register (KBIES) ................................................................................131
9.4 Functional Description ..................................................................................................................132
9.4.1 Edge Only Sensitivity .....................................................................................................132
9.4.2 Edge and Level Sensitivity .............................................................................................132
9.4.3 KBI Pullup/Pulldown Resistors ......................................................................................133
9.4.4 KBI Initialization ............................................................................................................133
Chapter 10
Analog-to-Digital Converter (S08ADC12V1)
10.1 Overview .......................................................................................................................................135
10.1.1 Module Configurations ...................................................................................................135
10.1.2 Low-Power Mode Operation ..........................................................................................137
10.1.3 Features ...........................................................................................................................139
10.1.4 ADC Module Block Diagram .........................................................................................139
10.2 External Signal Description ..........................................................................................................140
10.2.1 Analog Power (VDDAD) ..................................................................................................141
10.2.2 Analog Ground (VSSAD) .................................................................................................141
10.2.3 Voltage Reference High (VREFH) ...................................................................................141
10.2.4 Voltage Reference Low (VREFL) ....................................................................................141
10.2.5 Analog Channel Inputs (ADx) ........................................................................................141
10.3 Register Definition ........................................................................................................................141
10.3.1 Status and Control Register 1 (ADCSC1) ......................................................................141
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 13
10.3.2 Status and Control Register 2 (ADCSC2) ......................................................................143
10.3.3 Data Result High Register (ADCRH) .............................................................................143
10.3.4 Data Result Low Register (ADCRL) ..............................................................................144
10.3.5 Compare Value High Register (ADCCVH) ....................................................................144
10.3.6 Compare Value Low Register (ADCCVL) .....................................................................145
10.3.7 Configuration Register (ADCCFG) ................................................................................145
10.3.8 Pin Control 1 Register (APCTL1) ..................................................................................146
10.3.9 Pin Control 2 Register (APCTL2) ..................................................................................147
10.3.10Pin Control 3 Register (APCTL3) ..................................................................................148
10.4 Functional Description ..................................................................................................................149
10.4.1 Clock Select and Divide Control ....................................................................................150
10.4.2 Input Select and Pin Control ...........................................................................................150
10.4.3 Hardware Trigger ............................................................................................................150
10.4.4 Conversion Control .........................................................................................................150
10.4.5 Automatic Compare Function .........................................................................................153
10.4.6 MCU Wait Mode Operation ............................................................................................153
10.4.7 MCU Stop3 Mode Operation ..........................................................................................154
10.4.8 MCU Stop2 Mode Operation ..........................................................................................154
10.5 Initialization Information ..............................................................................................................154
10.5.1 ADC Module Initialization Example .............................................................................155
10.6 Application Information ................................................................................................................156
10.6.1 External Pins and Routing ..............................................................................................156
10.6.2 Sources of Error ..............................................................................................................158
Chapter 11
Inter-Integrated Circuit (S08IICV2)
11.1 Introduction ...................................................................................................................................161
11.1.1 Features ...........................................................................................................................163
11.1.2 Modes of Operation ........................................................................................................163
11.1.3 Block Diagram ................................................................................................................163
11.2 External Signal Description ..........................................................................................................164
11.2.1 SCL — Serial Clock Line ...............................................................................................164
11.2.2 SDA — Serial Data Line ................................................................................................164
11.3 Register Definition ........................................................................................................................164
11.3.1 IIC Address Register (IICA) ...........................................................................................165
11.3.2 IIC Frequency Divider Register (IICF) ..........................................................................165
11.3.3 IIC Control Register (IICC1) ..........................................................................................168
11.3.4 IIC Status Register (IICS) ...............................................................................................168
11.3.5 IIC Data I/O Register (IICD) ..........................................................................................169
11.3.6 IIC Control Register 2 (IICC2) .......................................................................................170
11.4 Functional Description ..................................................................................................................171
11.4.1 IIC Protocol .....................................................................................................................171
11.4.2 10-bit Address .................................................................................................................174
11.4.3 General Call Address ......................................................................................................175
11.5 Resets ............................................................................................................................................175
MC9S08JM60 Series Data Sheet, Rev. 3
14 Freescale Semiconductor
11.6 Interrupts .......................................................................................................................................175
11.6.1 Byte Transfer Interrupt ....................................................................................................175
11.6.2 Address Detect Interrupt .................................................................................................176
11.6.3 Arbitration Lost Interrupt ................................................................................................176
11.7 Initialization/Application Information ..........................................................................................177
Chapter 12
Multi-Purpose Clock Generator (S08MCGV1)
12.1 Introduction ...................................................................................................................................181
12.1.1 Features ...........................................................................................................................183
12.1.2 Modes of Operation ........................................................................................................185
12.2 External Signal Description ..........................................................................................................185
12.3 Register Definition ........................................................................................................................186
12.3.1 MCG Control Register 1 (MCGC1) ...............................................................................186
12.3.2 MCG Control Register 2 (MCGC2) ...............................................................................187
12.3.3 MCG Trim Register (MCGTRM) ...................................................................................188
12.3.4 MCG Status and Control Register (MCGSC) .................................................................189
12.3.5 MCG Control Register 3 (MCGC3) ...............................................................................190
12.4 Functional Description ..................................................................................................................192
12.4.1 Operational Modes ..........................................................................................................192
12.4.2 Mode Switching ..............................................................................................................196
12.4.3 Bus Frequency Divider ...................................................................................................196
12.4.4 Low Power Bit Usage .....................................................................................................197
12.4.5 Internal Reference Clock ................................................................................................197
12.4.6 External Reference Clock ...............................................................................................197
12.4.7 Fixed Frequency Clock ...................................................................................................197
12.5 Initialization / Application Information ........................................................................................198
12.5.1 MCG Module Initialization Sequence ............................................................................198
12.5.2 MCG Mode Switching ....................................................................................................199
12.5.3 Calibrating the Internal Reference Clock (IRC) .............................................................210
Chapter 13
Real-Time Counter (S08RTCV1)
13.1 Introduction ...................................................................................................................................213
13.1.1 Features ...........................................................................................................................215
13.1.2 Modes of Operation ........................................................................................................215
13.1.3 Block Diagram ................................................................................................................216
13.2 External Signal Description ..........................................................................................................216
13.3 Register Definition ........................................................................................................................216
13.3.1 RTC Status and Control Register (RTCSC) ....................................................................217
13.3.2 RTC Counter Register (RTCCNT) ..................................................................................218
13.3.3 RTC Modulo Register (RTCMOD) ................................................................................218
13.4 Functional Description ..................................................................................................................218
13.4.1 RTC Operation Example .................................................................................................219
13.5 Initialization/Application Information ..........................................................................................220
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 15
Chapter 14
Serial Communications Interface (S08SCIV4)
14.1 Introduction ...................................................................................................................................223
14.1.1 Features ...........................................................................................................................225
14.1.2 Modes of Operation ........................................................................................................225
14.1.3 Block Diagram ................................................................................................................226
14.2 Register Definition ........................................................................................................................228
14.2.1 SCI Baud Rate Registers (SCIxBDH, SCIxBDL) ..........................................................228
14.2.2 SCI Control Register 1 (SCIxC1) ...................................................................................229
14.2.3 SCI Control Register 2 (SCIxC2) ...................................................................................230
14.2.4 SCI Status Register 1 (SCIxS1) ......................................................................................231
14.2.5 SCI Status Register 2 (SCIxS2) ......................................................................................233
14.2.6 SCI Control Register 3 (SCIxC3) ...................................................................................234
14.2.7 SCI Data Register (SCIxD) .............................................................................................235
14.3 Functional Description ..................................................................................................................235
14.3.1 Baud Rate Generation .....................................................................................................235
14.3.2 Transmitter Functional Description ................................................................................236
14.3.3 Receiver Functional Description ....................................................................................237
14.3.4 Interrupts and Status Flags ..............................................................................................239
14.3.5 Additional SCI Functions ...............................................................................................240
Chapter 15
16-Bit Serial Peripheral Interface (S08SPI16V1)
15.1 Introduction ...................................................................................................................................243
15.1.1 SPI Port Configuration Information ...............................................................................243
15.1.2 Features ...........................................................................................................................246
15.1.3 Modes of Operation ........................................................................................................246
15.1.4 Block Diagrams ..............................................................................................................246
15.2 External Signal Description ..........................................................................................................248
15.2.1 SPSCK — SPI Serial Clock ............................................................................................248
15.2.2 MOSI — Master Data Out, Slave Data In ......................................................................249
15.2.3 MISO — Master Data In, Slave Data Out ......................................................................249
15.2.4 SS — Slave Select ..........................................................................................................249
15.3 Register Definition ........................................................................................................................249
15.3.1 SPI Control Register 1 (SPIxC1) ....................................................................................249
15.3.2 SPI Control Register 2 (SPIxC2) ....................................................................................250
15.3.3 SPI Baud Rate Register (SPIxBR) ..................................................................................252
15.3.4 SPI Status Register (SPIxS) ............................................................................................253
15.3.5 SPI Data Registers (SPIxDH:SPIxDL) ...........................................................................254
15.3.6 SPI Match Registers (SPIxMH:SPIxML) .......................................................................255
15.4 Functional Description ..................................................................................................................256
15.4.1 General ............................................................................................................................256
15.4.2 Master Mode ...................................................................................................................256
15.4.3 Slave Mode .....................................................................................................................257
15.4.4 Data Transmission Length ..............................................................................................258
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16 Freescale Semiconductor
15.4.5 SPI Clock Formats ..........................................................................................................259
15.4.6 SPI Baud Rate Generation ..............................................................................................261
15.4.7 Special Features ..............................................................................................................262
15.4.8 Error Conditions .............................................................................................................263
15.4.9 Low Power Mode Options ..............................................................................................264
15.4.10SPI Interrupts ..................................................................................................................265
15.5 Initialization/Application Information ..........................................................................................267
15.5.1 SPI Module Initialization Example .................................................................................267
Chapter 16
Timer/Pulse-Width Modulator (S08TPMV3)
16.1 Introduction ...................................................................................................................................271
16.1.1 Features ...........................................................................................................................273
16.1.2 Modes of Operation ........................................................................................................273
16.1.3 Block Diagram ................................................................................................................274
16.2 Signal Description .........................................................................................................................276
16.2.1 Detailed Signal Descriptions ..........................................................................................276
16.3 Register Definition ........................................................................................................................280
16.3.1 TPM Status and Control Register (TPMxSC) ................................................................280
16.3.2 TPM-Counter Registers (TPMxCNTH:TPMxCNTL) ....................................................281
16.3.3 TPM Counter Modulo Registers (TPMxMODH:TPMxMODL) ....................................282
16.3.4 TPM Channel n Status and Control Register (TPMxCnSC) ..........................................283
16.3.5 TPM Channel Value Registers (TPMxCnVH:TPMxCnVL) ..........................................285
16.4 Functional Description ..................................................................................................................286
16.4.1 Counter ............................................................................................................................287
16.4.2 Channel Mode Selection .................................................................................................288
16.5 Reset Overview .............................................................................................................................292
16.5.1 General ............................................................................................................................292
16.5.2 Description of Reset Operation .......................................................................................292
16.6 Interrupts .......................................................................................................................................292
16.6.1 General ............................................................................................................................292
16.6.2 Description of Interrupt Operation .................................................................................292
Chapter 17
Universal Serial Bus Device Controller (S08USBV1)
17.1 Introduction ...................................................................................................................................295
17.1.1 Clocking Requirements ...................................................................................................295
17.1.2 Current Consumption in USB Suspend ..........................................................................295
17.1.3 3.3 V Regulator ...............................................................................................................295
17.1.4 Features ...........................................................................................................................298
17.1.5 Modes of Operation ........................................................................................................298
17.1.6 Block Diagram ................................................................................................................299
17.2 External Signal Description ..........................................................................................................300
17.2.1 USBDP ............................................................................................................................300
17.2.2 USBDN ...........................................................................................................................300
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 17
17.2.3 VUSB33 ............................................................................................................................................................. 300
17.3 Register Definition ........................................................................................................................300
17.3.1 USB Control Register 0 (USBCTL0) .............................................................................301
17.3.2 Peripheral ID Register (PERID) .....................................................................................301
17.3.3 Peripheral ID Complement Register (IDCOMP) ............................................................302
17.3.4 Peripheral Revision Register (REV) ...............................................................................302
17.3.5 Interrupt Status Register (INTSTAT) ..............................................................................303
17.3.6 Interrupt Enable Register (INTENB) ..............................................................................304
17.3.7 Error Interrupt Status Register (ERRSTAT) ...................................................................305
17.3.8 Error Interrupt Enable Register (ERRENB) ...................................................................306
17.3.9 Status Register (STAT) ....................................................................................................307
17.3.10Control Register (CTL) ...................................................................................................308
17.3.11Address Register (ADDR) ..............................................................................................309
17.3.12Frame Number Register (FRMNUML, FRMNUMH) ...................................................309
17.3.13Endpoint Control Register (EPCTLn, n=0-6) .................................................................310
17.4 Functional Description ..................................................................................................................311
17.4.1 Block Descriptions ..........................................................................................................311
17.4.2 Buffer Descriptor Table (BDT) .......................................................................................316
17.4.3 USB Transactions ...........................................................................................................319
17.4.4 USB Packet Processing ...................................................................................................321
17.4.5 Start of Frame Processing ...............................................................................................322
17.4.6 Suspend/Resume .............................................................................................................323
17.4.7 Resets ..............................................................................................................................324
17.4.8 Interrupts .........................................................................................................................325
Chapter 18
Development Support
18.1 Introduction ...................................................................................................................................327
18.1.1 Features ...........................................................................................................................328
18.2 Background Debug Controller (BDC) ..........................................................................................328
18.2.1 BKGD Pin Description ...................................................................................................329
18.2.2 Communication Details ..................................................................................................330
18.2.3 BDC Commands .............................................................................................................334
18.2.4 BDC Hardware Breakpoint .............................................................................................336
18.3 On-Chip Debug System (DBG) ....................................................................................................337
18.3.1 Comparators A and B .....................................................................................................337
18.3.2 Bus Capture Information and FIFO Operation ...............................................................337
18.3.3 Change-of-Flow Information ..........................................................................................338
18.3.4 Tag vs. Force Breakpoints and Triggers .........................................................................338
18.3.5 Trigger Modes .................................................................................................................339
18.3.6 Hardware Breakpoints ....................................................................................................341
18.4 Register Definition ........................................................................................................................341
18.4.1 BDC Registers and Control Bits .....................................................................................341
18.4.2 System Background Debug Force Reset Register (SBDFR) ..........................................343
18.4.3 DBG Registers and Control Bits .....................................................................................344
MC9S08JM60 Series Data Sheet, Rev. 3
18 Freescale Semiconductor
Appendix A
Electrical Characteristics
A.1 Introduction ....................................................................................................................................349
A.2 Parameter Classification.................................................................................................................349
A.3 Absolute Maximum Ratings...........................................................................................................349
A.4 Thermal Characteristics..................................................................................................................350
A.5 ESD Protection and Latch-Up Immunity .......................................................................................351
A.6 DC Characteristics..........................................................................................................................352
A.7 Supply Current Characteristics.......................................................................................................357
A.8 Analog Comparator (ACMP) Electricals .......................................................................................358
A.9 ADC Characteristics.......................................................................................................................358
A.10 External Oscillator (XOSC) Characteristics ..................................................................................362
A.11 MCG Specifications .......................................................................................................................363
A.12 AC Characteristics..........................................................................................................................364
A.12.1 Control Timing ................................................................................................................364
A.12.2 Timer/PWM (TPM) Module Timing...............................................................................365
A.12.3 SPI Characteristics...........................................................................................................366
A.13 Flash Specifications........................................................................................................................369
A.14 USB Electricals ..............................................................................................................................370
A.15 EMC Performance..........................................................................................................................370
A.15.1 Radiated Emissions..........................................................................................................370
Appendix B
Ordering Information and Mechanical Drawings
B.1 Ordering Information .....................................................................................................................373
B.2 Orderable Part Numbering System ................................................................................................373
B.3 Mechanical Drawings.....................................................................................................................373
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 19
Chapter 1
Device Overview
1.1 Introduction
MC9S08JM60 series MCUs are members of the low-cost, high-performance HCS08 Family of 8-bit
microcontroller units (MCUs). All MCUs in the family use the enhanced HCS08 core and are available
with a variety of modules, memory sizes, memory types, and package types.
Table 1-1 summarizes the peripheral availability per package type for the devices available in the
MC9S08JM60 series.
1.2 MCU Block Diagram
The block diagram in Figure 1-1 shows the structure of the MC9S08JM60 series MCU.
Table 1-1. Devices in the MC9S08JM60 Series
Feature
Device
MC9S08JM60 MC9S08JM32
Package 64-pin 48-pin 44-pin 64-pin 48-pin 44-pin
Flash 60,912 32,768
RAM 4096 2048
USB RAM 256 256
ACMP yes yes
ADC 12-ch 8-ch 8-ch 12-ch 8-ch 8-ch
IIC yes yes
IRQ yes yes
KBI 877877
SCI1 yes yes
SCI2 yes yes
SPI1 yes yes
SPI2 yes yes
TPM1 6-ch 4-ch 4-ch 6-ch 4-ch 4-ch
TPM2 2-ch 2-ch
USB yes yes
I/O pins 51 37 33 51 37 33
Package types 64 QFP
64 LQFP 48 QFN 44 LQFP 64 QFP
64 LQFP 48 QFN 44 LQFP
Chapter 1 Device Overview
MC9S08JM60 Series Data Sheet, Rev. 3
20 Freescale Semiconductor
Figure 1-1. MC9S08JM60 Series Block Diagram
PTD4/ADP11
PTD5
PTD6
PTC1/SDA
PTC0/SCL
VSS
VDD
PTE3/TPM1CH1
PTE2/TPM1CH0
PTA5– PTA0
PTE0/TxD1
PTE1/RxD1
PTD1/ADP9/ACMP–
PTD0/ADP8/ACMP+
PTC6
PTC5/RxD2
PTC4
PTC3/TxD2
PTC2
PORT A
PORT C
PORT D
PORT E
8-BIT KEYBOARD
INTERRUPT MODULE (KBI)
IIC MODULE (IIC)
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
USER Flash (IN BYTES)
USER RAM (IN BYTES)
ON-CHIP ICE AND
DEBUG MODULE (DBG)
MC9S08JM60 = 60,912
HCS08 CORE
CPUBDC
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pull-down device if IRQ is enabled
(IRQPE = 1). Pull-down is enabled if rising edge detect is selected (IRQEDG = 1)
3. IRQ does not have a clamp diode to VDD. IRQ must not be driven above VDD.
4. Pin contains integrated pullup device.
5. When pin functions as KBI (KBIPEn = 1) and associated pin is configured to enable the
pullup device, KBEDGn can be used to reconfigure the pullup as a pull-down device.
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTB5/KBIP5/ADP5
PORT B
PTE5/MOSI1
PTE4/MISO1
PTE6/SPSCK1
PTE7/SS1
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
VOLTAGE
REGULATOR
COP IRQ LVD
LOW-POWER OSCILLATOR
MULTI-PURPOSE CLOCK
GENERATOR (MCG)
RESET
VSSAD
VDDAD
VREFH
ANALOG-TO-DIGITAL
CONVERTER (ADC)
6-CHANNEL TIMER/PWM
MODULE (TPM1)
PTD7
6
PTB4/KBIP4/ADP4
PTG3/KBIP7
PTG2/KBIP6
PORT G
12-CHANNEL, 12-BIT
BKGD/MS
PTF3/TPM1CH5
PTF2/TPM1CH4
PTF0/TPM1CH2
PTF1/TPM1CH3
PORT F
PTF5/TPM2CH1
PTF4/TPM2CH0
PTF6
PTF7
INTERFACE MODULE (SCI1)
SERIAL COMMUNICATIONS
INTERFACE MODULE (SCI2)
SERIAL COMMUNICATIONS
PTG0/KBIP0
PTG1/KBIP1
MC9S08JM32 = 32,768
VREFL
PTG4/XTAL
PTG5/EXTAL
IRQ/TPMCLK RxD2
TxD2
SDA
SCL
8
KBIPx
KBIPx
TPMCLK
SPSCK1
SS1
MISO1
MOSI1
TPMCLK
TPM1CH1
TPM1CH0
RxD1
TxD1
EXTAL
XTAL
4
4
USB SIE
USB ENDPOINT
RAM
FULL SPEED
USB
TRANSCEIVER
USBDP
USBDN
MISO2
SS2
SPSCK2
MOSI2 PTB1/MOSI2/ADP1
PTB0/MISO2/ADP0
PTB7/ADP7
PTB6/ADP6
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI2)
REAL-TIME COUNTER
(RTC)
PTB3/SS2/ADP3
PTB2/SPSCK2/ADP2
TPM1CHx
4
TPM2CH1
TPM2CH0
4
ANALOG COMPARATOR
(ACMP)
SYSTEM
USB 3.3-V VOLTAGE REGULATOR
VUSB33
MC9S08JM60 = 4096
MC9S08JM32 = 2048
ACMPO
ACMP+
ACMP–
PTD3/KBIP3/ADP10
PTD2/KBIP2/ACMPO
V
SSOSC
Chapter 1 Device Overview
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 21
Table 1-2 lists the functional versions of the on-chip modules.
1.3 System Clock Distribution
Figure 1-2 shows a simplified clock connection diagram. Some modules in the MCU have selectable clock
inputs as shown. The clock inputs to the modules indicate the clock(s) that are used to drive the module
function. All memory mapped registers associated with the modules are clocked with BUSCLK.
Table 1-2. Versions of On-Chip Modules
Module Version
Analog Comparator (ACMP) 2
Analog-to-Digital Converter (ADC) 1
Central Processing Unit (CPU) 2
IIC Module (IIC) 2
Keyboard Interrupt (KBI) 2
Multi-Purpose Clock Generator (MCG) 1
Real-Time Counter (RTC) 1
Serial Communications Interface (SCI) 4
16-bit Serial Peripheral Interface (SPI16) 1
Timer Pulse-Width Modulator (TPM) 3
Universal Serial Bus (USB) 1
Debug Module (DBG) 2
Chapter 1 Device Overview
MC9S08JM60 Series Data Sheet, Rev. 3
22 Freescale Semiconductor
Figure 1-2. System Clock Distribution Diagram
The MCG supplies the following clock sources:
• MCGOUT — This clock source is used as the CPU, USB RAM and USB module clock, and is
divided by two to generate the peripheral bus clock (BUSCLK). Control bits in the MCG control
registers determine which of the three clock sources is connected:
— Internal reference clock
— External reference clock
— Frequency-locked loop (FLL) or Phase-locked loop (PLL) output
See Chapter 12, “Multi-Purpose Clock Generator (S08MCGV1),” for details on configuring the
MCGOUT clock.
• MCGLCLK — This clock source is derived from the digitally controlled oscillator (DCO) of the
MCG. Development tools can select this internal self-clocked source to speed up BDC
communications in systems where the bus clock is slow.
• MCGIRCLK — This is the internal reference clock and can be selected as the real-time counter
clock source. Chapter 12, “Multi-Purpose Clock Generator (S08MCGV1),” explains the
MCGIRCLK in more detail. See Chapter 13, “Real-Time Counter (S08RTCV1),” for more
information regarding the use of MCGIRCLK.
• MCGERCLK — This is the external reference clock and can be selected as the clock source of
real-time counter and ADC module. Section 12.4.6, “External Reference Clock,” explains the
MCGERCLK in more detail. See Chapter 13, “Real-Time Counter (S08RTCV1),” and Chapter 10,
TPM1 TPM2 IIC SCI1 SCI2
BDC
CPU ADC2RAM Flash3
MCG
MCGOUT ÷2 BUSCLK
MCGLCLK
MCGERCLK
COP
1. The FFCLK is internally synchronized to the bus clock and must not exceed one half of the bus clock frequency.
3. Flash has the frequency requirements for program and erase operation. See the Appendix A, “Electrical Characteristics,” for
details.
2. ADC has min. and max. frequency requirements. See Chapter 10, “Analog-to-Digital Converter (S08ADC12V1),”
and Appendix A, “Electrical Characteristics,” for det ail s.
XOSC
EXTAL XTAL
SPI1
FFCLK1
MCGFFCLK
RTC
1 kHz
LPO
TPMCLK
MCGIRCLK
÷2
SPI2
USB
USB RAM
LPO clock
Chapter 1 Device Overview
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 23
“Analog-to-Digital Converter (S08ADC12V1),” for more information regarding the use of
MCGERCLK with these modules.
• MCGFFCLK — This clock source is divided by 2 to generate FFCLK after being synchronized to
the BUSCLK. It can be selected as clock source for the TPM modules. The frequency of the
MCGFFCLK is determined by the settings of the MCG. See the Section 12.4.7, “Fixed Frequency
Clock,” for details.
• LPO clock— This clock is generated from an internal Low Power Oscillator that is completely
independent of the MCG module. The LPO clock can be selected as the clock source to the RTC
or COP modules. See Chapter 13, “Real-Time Counter (S08RTCV1),” and Section 5.4, “Computer
Operating Properly (COP) Watchdog,” for details on using the LPO clock with these modules.
• TPMCLK — TPMCLK is the optional external clock source for the TPM modules. The TPMCLK
must be limited to 1/4th the frequency of the BUSCLK for synchronization. See Chapter 16,
“Timer/Pulse-Width Modulator (S08TPMV3),” for more details.
Chapter 1 Device Overview
MC9S08JM60 Series Data Sheet, Rev. 3
24 Freescale Semiconductor
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 25
Chapter 2
Pins and Connections
2.1 Introduction
This chapter describes signals that connect to package pins. It includes pinout diagrams, a table of signal
properties, and detailed discussion of signals.
Chapter 2 Pins and Connections
MC9S08JM60 Series Data Sheet, Rev. 3
26 Freescale Semiconductor
2.2 Device Pin Assignment
Figure 2-1. MC9S08JM60 in 64-Pin QFP/LQFP Package
PTF2/TPM1CH4
1
2
3
4
5
6
7
8
RESET
PTF0/TPM1CH2
PTF3/TPM1CH5
PTF4/TPM2CH0
PTC6
PTF7
VUSB33
USBDP
USBDN
VSS
VDD
PTE7/SS1
PTE6/SPSCK1
PTB7/ADP7
PTD0/ADP8/ACMP+
PTD1/ADP9/ACMP–
VDDAD
VREFH
PTB1/MOSI2/ADP1
PTB6/ADP6
PTD5
PTG2/KBIP6
PTC5/RxD2
PTG4/XTAL
BKGD/MS
PTG3/KBIP7
PTD2/KBIP2/ACMPO
PTD6
PTD7
43
42
41
40
39
38
18 19 20 21 22 23
505152535455
17 32
33
49
48
64
9
PTF5/TPM2CH1
10
PTF6
11
PTE0/TxD1
16
PTE3/TPM1CH1
PTG0/KBIP0
24
PTG1/KBIP1
25
PTA0
26
PTA1
27
PTB5/KBIP5/ADP5
37
PTB4/KBIP4/ADP4
36
PTB3/SS2/ADP3
35
PTB2/SPSCK2/ADP2
34
PTG5/EXTAL
56
VSSOSC
57
PTC0/SCL
58
PTC1/SDA
59
PTF1/TPM1CH3
12
PTE1/RxD1
13
14
15
PTE2/TPM1CH0
PTA2
28 29 30 31
VREFL
44
45
46
VSSAD
47
PTC3/TxD2
63 62 61
PTC2
60
PTC4
IRQ/TPMCLK
PTE4/MISO1
PTE5/MOSI1
PTA3
PTA4
PTB0/MISO2/ADP0
PTA5
PTD4/ADP11
PTD3/KBIP3/ADP10
64-Pin QFP/LQFP
Chapter 2 Pins and Connections
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 27
Figure 2-2. MC9S08JM60 Series in 48-Pin QFN Package
PTF4/TPM2CH0
1
2
3
4
5
6
7
8
RESET
PTF0/TPM1CH2
VUSB33
USBDP
USBDN
VSS
VDD
PTE7/SS1
PTE6/SPSCK1
PTB4/KBIP4/ADP4
PTB5/KBIP5/ADP5
PTD0/ADP8/ACMP+
PTD1/ADP9/ACMP–
PTB1/MOSI2/ADP1
PTG2/KBIP6
PTC5/RxD2
PTG4/XTAL
BKGD/MS
PTG3/KBIP7
PTD2/KBIP2/ACMPO
31
30
29
28
27
26
14 15 16 17 18 19
37
3839
13 24
25
36
48
9
PTF5/TPM2CH1
10
PTF6
11
PTE0/TxD1
12
PTE3/TPM1CH1
PTG0/KBIP0
20
PTG1/KBIP1
21
PTA0
22 23
PTB3/SS2/ADP3
PTB2/SPSCK2/ADP2
PTG5/EXTAL
40
VSSOSC
41
PTC0/SCL
42
PTC1/SDA
43
PTF1/TPM1CH3
PTE1/RxD1
PTE2/TPM1CH0
VDDAD/VREFH
32
33
34
VSSAD/VREFL
35
PTC3/TxD2
47 46 45
PTC2
44
PTC4
IRQ/TPMCLK
PTE4/MISO1
PTE5/MOSI1
PTB0/MISO2/ADP0
PTA5
PTD7
48-Pin QFN
Chapter 2 Pins and Connections
MC9S08JM60 Series Data Sheet, Rev. 3
28 Freescale Semiconductor
Figure 2-3. MC9S08JM60 Series in 44-Pin LQFP Package
2.3 Recommended System Connections
Figure 2-4 shows pin connections that are common to almost all MC9S08JM60 series application systems.
PTF4/TPM2CH0
1
2
3
4
5
6
7
8
RESET
PTF0/TPM1CH2
VUSB33
USBDP
USBDN
VSS
VDD
PTE7/SS1
PTE6/SPSCK1
PTB4/KBIP4/ADP4
PTB5/KBIP5/ADP5
PTD0/ADP8/ACMP+
PTD1/ADP9/ACMP–
PTB1/MOSI2/ADP1
PTG2/KBIP6
PTC5/RxD2
PTG4/XTAL
BKGD/MS
PTG3/KBIP7
PTD2/KBIP2/ACMPO
31
30
29
28
27
26
13 14 15 16 17 18
34
35
12 22
23
33
44
9
PTF5/TPM2CH1
10
PTE0/TxD1
11
PTE3/TPM1CH1
PTG0/KBIP0
19
PTG1/KBIP1
20 21
PTB3/SS2/ADP3
PTB2/SPSCK2/ADP2
PTG5/EXTAL
36
VSSOSC
37
PTC0/SCL
38
PTC1/SDA
39
PTF1/TPM1CH3
PTE1/RxD1
PTE2/TPM1CH0
VDDAD/VREFH
32 VSSAD/VREFL
PTC3/TxD2
43 42 41
PTC2
40
PTC4
IRQ/TPMCLK
PTE4/MISO1
PTE5/MOSI1
PTB0/MISO2/ADP0
44-Pin LQFP
25
24
Chapter 2 Pins and Connections
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 29
Figure 2-4. Basic System Connections
MC9S08JM60
VDD
VSS
RESET
OPTIONAL
MANUAL
RESET
PORT
A
V
DD
1
BACKGROUND HEADER
CBY
0.1 μF
CBLK
10 μF
+
5 V
+
SYSTEM
POWER
I/O AND
PERIPHERAL
INTERFACE TO
SYSTEM
APPLICATION
PTA0–PTA5
VDD
PORT
B
PTB0/MISO2/ADP0
PTB1/MOSI2/ADP1
PTB2/SPSCK2/ADP2
PTB3/SS2/ADP3
PTB4/KBIP4/ADP4
PTB5/KBIP5/ADP5
PTB6/ADP6
PTB7/ADP7
PORT
C
PTC0/SCL
PTC1/SDA
PTC2
PTC3/TxD2
PTC4
PTC5/RxD2
PTC6
PORT
D
PTD0/ADP8/ACMP+
PTD1/ADP9/ACMP–
PTD4/ADP11
PTD5
PTD6
PTD7
PTE0/TxD1
PTE1/RxD1
PTE2/TPM1CH0
PTE3/TPM1CH1
PTE4/MISO1
PTE5/MOSI1
PTE6/SPSCK1
PTE7/SS1
PTG0/KBIP0
PTG1/KBIP1
PTG2/KBIP6
PTG3/KBIP7
PTF0/TPM1CH2
PTF1/TPM1CH3
PTF2/TPM1CH4
PTF3/TPM1CH5
PTF4/TPM2CH0
PTF5/TPM2CH1
PTF6
PTF7
IRQ
ASYNCHRONOUS
INTERRUPT
INPUT
NOTES:
1. External crystal circuity is not required if using the MCG internal clock option. For USB operation, an external crystal is required.
2. XTAL and EXTAL are the same pins as PTG4 and PTG5, respectively.
3. RC filters on RESET and IRQ are recommended for EMC-sensitive applications.
4. RPUDP is shown for full-speed USB only. The diagram shows a configuration where the on-chip regulator and RPUDP are enabled.
The voltage regulator output is used for RPUDP. RPUDP can optionally be disabled if using an external pullup resistor on USBDP
5. VBUS is a 5.0-V supply from upstream port that can be used for USB operation
6. USBDP and USBDN are powered by the 3.3-V regulator or external 3.3-V supply on VUSB33.
VDDAD
VSSAD
CBYAD
0.1 μF
VREFL
VREFH
PTG4/XTAL
PTG5/EXTAL
V
DD
4.7 k
Ω
–
0.1
μ
F
V
DD
4.7 k
Ω
–10 k
Ω
0.1
μ
F
10 k
Ω
2
43
USBDN
V
USB33
USBDP
V
Bus
PORT
E
PORT
F
PORT
G
USB SERIES-B CONNECTOR
VUSB33
3.3-V Reference
R
PUDP
PTD2/KBIP2/ACMPO
PTD3/KBIP3/ADP10
BKGD/MS
XTAL
EXTAL
C2
C1 X1
RF
RS
NOTE 1
VSSOSC
0.47
μ
F
+
4.7
μ
F
Chapter 2 Pins and Connections
MC9S08JM60 Series Data Sheet, Rev. 3
30 Freescale Semiconductor
2.3.1 Power (VDD, VSS, VSSOSC, VDDAD, VSSAD, VUSB33)
VDD and VSS are the primary power supply pins for the MCU. This voltage source supplies power to all
I/O buffer circuitry and to an internal voltage regulator. The internal voltage regulator provides regulated
lower-voltage source to the CPU and other internal circuitry of the MCU.
Typically, application systems have two separate capacitors across the power pins. In this case, there must
be a bulk electrolytic capacitor, such as a 10-μF tantalum capacitor, to provide bulk charge storage for the
overall system and a 0.1-μF ceramic bypass capacitor located as near to the paired VDD and VSS power
pins as practical to suppress high-frequency noise. The MC9S08JM60 series have a VSSOSC pin. This pin
must be connected to the system ground plane or to the primary VSS pin through a low-impedance
connection.
VDDAD and VSSAD are the analog power supply pins for the MCU. This voltage source supplies power to
the ADC module. A 0.1-μF ceramic bypass capacitor must be located as near to the analog power pins as
practical to suppress high-frequency noise.
VUSB33 is connected to the internal USB 3.3-V regulator. VUSB33 maintains an output voltage of 3.3 V and
can only source enough current for internal USB transceiver and USB pullup resistor. Two separate
capacitors (4.7-μF bulk electrolytic stability capacitor and 0.47-μF ceramic bypass capacitors) must be
connected across this pin to ground to decrease the output ripple of this voltage regulator when it is
enabled.
2.3.2 Oscillator (XTAL, EXTAL)
Immediately after reset, the MCU uses an internally generated clock provided by the multi-purpose clock
generator (MCG) module. For more information on the MCG, see Chapter 12, “Multi-Purpose Clock
Generator (S08MCGV1).”
The oscillator (XOSC) in this MCU is a Pierce oscillator that can accommodate a crystal or ceramic
resonator. Rather than a crystal or ceramic resonator, an external oscillator can be connected to the EXTAL
input pin.
RS (when used) and RF must be low-inductance resistors such as carbon composition resistors.
Wire-wound resistors, and some metal film resistors, have too much inductance. C1 and C2 normally must
be high-quality ceramic capacitors that are specifically designed for high-frequency applications.
RF is used to provide a bias path to keep the EXTAL input in its linear range during crystal startup; its value
is not generally critical. Typical systems use 1 MΩ to 10 MΩ. Higher values are sensitive to humidity and
lower values reduce gain and (in extreme cases) could prevent startup.
C1 and C2 are typically in the 5-pF to 25-pF range and are chosen to match the requirements of a specific
crystal or resonator. Be sure to take into account printed circuit board (PCB) capacitance and MCU pin
capacitance when selecting C1 and C2. The crystal manufacturer typically specifies a load capacitance
which is the series combination of C1 and C2 (which are usually the same size). As a first-order
approximation, use 10 pF as an estimate of combined pin and PCB capacitance for each oscillator pin
(EXTAL and XTAL).
Chapter 2 Pins and Connections
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 31
2.3.3 RESET Pin
RESET is a dedicated pin with a pullup device built in. It has input hysteresis, a high current output driver,
and no output slew rate control. Internal power-on reset and low-voltage reset circuitry typically make
external reset circuitry unnecessary. This pin is normally connected to the standard 6-pin background
debug connector, so a development system can directly reset the MCU system. If desired, a manual
external reset can be added by supplying a simple switch to ground (pull reset pin low to force a reset).
Whenever any reset is initiated (whether from an external source or from an internal source, the RESET
pin is driven low for approximately 66 bus cycles and released. The reset circuity decodes the cause of
reset and records it by setting a corresponding bit in the system control reset status register (SRS).
In EMC-sensitive applications, an external RC filter is recommended on the reset pin. See Figure 2-4 for
an example.
2.3.4 Background/Mode Select (BKGD/MS)
When in reset, the BKGD/MS pin functions as a mode select pin. Immediately after reset rises the pin
functions as the background pin and can be used for background debug communication. While functioning
as a background/mode select pin, the pin includes an internal pullup device, input hysteresis, a standard
output driver, and no output slew rate control.
If nothing is connected to this pin, the MCU will enter normal operating mode at the rising edge of reset.
If a debug system is connected to the 6-pin standard background debug header, it can hold BKGD/MS low
during the rising edge of reset which forces the MCU to active background mode.
The BKGD pin is used primarily for background debug controller (BDC) communications using a custom
protocol that uses 16 clock cycles of the target MCU’s BDC clock per bit time. The target MCU’s BDC
clock could be as fast as the bus clock rate, so there must never be any significant capacitance connected
to the BKGD/MS pin that could interfere with background serial communications.
Although the BKGD pin is a pseudo open-drain pin, the background debug communication protocol
provides brief, actively driven, high speedup pulses to ensure fast rise times. Small capacitances from
cables and the absolute value of the internal pullup device play almost no role in determining rise and fall
times on the BKGD pin.
2.3.5 ADC Reference Pins (VREFH, VREFL)
The VREFH and VREFL pins are the voltage reference high and voltage reference low inputs respectively
for the ADC module.
2.3.6 External Interrupt Pin (IRQ)
The IRQ pin is the input source for the IRQ interrupt and is also the input for the BIH and BIL instructions.
If the IRQ function is not enabled, this pin can be used for TPMCLK.
In EMC-sensitive applications, an external RC filter is recommended on the IRQ pin. See Figure 2-4 for
an example.
Chapter 2 Pins and Connections
MC9S08JM60 Series Data Sheet, Rev. 3
32 Freescale Semiconductor
2.3.7 USB Data Pins (USBDP, USBDN)
The USBDP (D+) and USBDN (D–) pins are the analog input/output lines to/from full-speed internal USB
transciever. An optional internal pullup resistor for the USBDP pin, RPUDP
, is available.
2.3.8 General-Purpose I/O and Peripheral Ports
The MC9S08JM60 series of MCUs support up to 51 general-purpose I/O pins, which are shared with
on-chip peripheral functions (timers, serial I/O, ADC, keyboard interrupts, etc.).
When a port pin is configured as a general-purpose output or a peripheral uses the port pin as an output,
software can select one of two drive strengths and enable or disable slew rate control. When a port pin is
configured as a general-purpose input or a peripheral uses the port pin as an input, software can enable a
pullup device.
For information about controlling these pins as general-purpose I/O pins, see the Chapter 6, “Parallel
Input/Output.” For information about how and when on-chip peripheral systems use these pins, see the
appropriate module chapter.
Immediately after reset, all pins are configured as high-impedance general-purpose inputs with internal
pullup devices disabled.
Chapter 2 Pins and Connections
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 33
Pin Number Lowest <--Priority--> Highest
64 48 44 Port Pin Alt1 Alt2
111PTC4
222 IRQ TPMCLK
3 3 3 RESET
444PTF0 TPM1CH2
555PTF1 TPM1CH3
6 — — PTF2 TPM1CH4
7 — — PTF3 TPM1CH5
866PTF4 TPM2CH0
9——PTC6
10 — — PTF7
11 7 7 PTF5 TPM2CH1
12 8 — PTF6
13 9 8 PTE0 TxD1
14 10 9 PTE1 RxD1
15 11 10 PTE2 TPM1CH0
16 12 11 PTE3 TPM1CH1
17 13 12 PTE4 MISO1
18 14 13 PTE5 MOSI1
19 15 14 PTE6 SPSCK1
20 16 15 PTE7 SS1
21 17 16 VDD
22 18 17 VSS
23 19 18 USBDN
24 20 19 USBDP
25 21 20 VUSB33
26 22 21 PTG0 KBIP0
27 23 22 PTG1 KBIP1
28 24 PTA0
29 PTA1
30 PTA2
31 PTA3
32 PTA4
33 25 PTA5
34 26 23 PTB0 MISO2 ADP0
35 27 24 PTB1 MOSI2 ADP1
36 28 25 PTB2 SPSCK2 ADP2
37 29 26 PTB3 SS2 ADP3
38 30 27 PTB4 KBIP4 ADP4
39 31 28 PTB5 KBIP5 ADP5
40 — — PTB6 ADP6
41 — — PTB7 ADP7
42 32 29 PTD0 ADP8 ACMP+
43 33 30 PTD1 ADP9 ACMP–
44 34 31 VDDAD
45 VREFH
46 35 32 VREFL
47 VSSAD
48 36 33 PTD2 KBIP2 ACMPO
49 — — PTD3 KBIP3 ADP10
50 — — PTD4 ADP11
51 — — PTD5
52 — — PTD6
53 37 — PTD7
54 38 34 PTG2 KBIP6
55 39 35 PTG3 KBIP7
56 40 36 BKGD MS
57 41 37 PTG4 XTAL
58 42 38 PTG5 EXTAL
59 43 39 VSSOSC
60 44 40 PTC0 SCL
61 45 41 PTC1 SDA
62 46 42 PTC2
63 47 43 PTC3 TxD2
64 48 44 PTC5 RxD2
Pin Number Lowest <--Priority--> Highest
64 48 44 Port Pin Alt1 Alt2
Table 2-1. Pin Availability by Package Pin-Count
Chapter 2 Pins and Connections
MC9S08JM60 Series Data Sheet, Rev. 3
34 Freescale Semiconductor
NOTE
When an alternative function is first enabled, it is possible to get a spurious
edge to the module, user software must clear out any associated flags before
interrupts are enabled. Table 2-1 illustrates the priority if multiple modules
are enabled. The highest priority module will have control over the pin.
Selecting a higher priority pin function with a lower priority function
already enabled can cause spurious edges to the lower priority module. It is
recommended that all modules that share a pin be disabled before enabling
another module.
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 35
Chapter 3
Modes of Operation
3.1 Introduction
The operating modes of the MC9S08JM60 series are described in this chapter. Entry into each mode, exit
from each mode, and functionality while in each mode are described.
3.2 Features
• Active background mode for code development
• Wait mode:
— CPU halts operation to conserve power
— System clocks running
— Full voltage regulation is maintained
• Stop modes: CPU and bus clocks stopped
— Stop2: Partial power down of internal circuits; RAM and USB RAM contents retained
— Stop3: All internal circuits powered for fast recovery; RAM, USB RAM, and register contents
are retained
3.3 Run Mode
Run is the normal operating mode for the MC9S08JM60 series. This mode is selected upon the MCU
exiting reset if the BKGD/MS pin is high. In this mode, the CPU executes code from internal memory with
execution beginning at the address fetched from memory at 0xFFFE:0xFFFF after reset.
3.4 Active Background Mode
The active background mode functions are managed through the background debug controller (BDC) in
the HCS08 core. The BDC, together with the on-chip in-circuit emulator (ICE) debug module (DBG),
provides the means for analyzing MCU operation during software development.
Active background mode is entered in any of five ways:
• When the BKGD/MS pin is low at the rising edge of reset
• When a BACKGROUND command is received through the BKGD pin
• When a BGND instruction is executed
• When encountering a BDC breakpoint
• When encountering a DBG breakpoint
Chapter 3 Modes of Operation
MC9S08JM60 Series Data Sheet, Rev. 3
36 Freescale Semiconductor
After entering active background mode, the CPU is held in a suspended state waiting for serial background
commands rather than executing instructions from the user application program.
Background commands are of two types:
• Non-intrusive commands, defined as commands that can be issued while the user program is
running. Non-intrusive commands can be issued through the BKGD pin while the MCU is in run
mode; non-intrusive commands can also be executed when the MCU is in the active background
mode. Non-intrusive commands include:
— Memory access commands
— Memory-access-with-status commands
— BDC register access commands
— The BACKGROUND command
• Active background commands, which can only be executed while the MCU is in active background
mode. Active background commands include commands to:
— Read or write CPU registers
— Trace one user program instruction at a time
— Leave active background mode to return to the user application program (GO)
The active background mode is used to program a bootloader or user application program into the flash
program memory before the MCU is operated in run mode for the first time. When the MC9S08JM60
series is shipped from the Freescale factory, the flash program memory is erased by default unless
specifically noted, so there is no program that could be executed in run mode until the flash memory is
initially programmed. The active background mode can also be used to erase and reprogram the flash
memory after it has been previously programmed.
For additional information about the active background mode, refer to Chapter 18, “Development
Support.”
3.5 Wait Mode
Wait mode is entered by executing a WAIT instruction. Upon execution of the WAIT instruction, the CPU
enters a low-power state in which it is not clocked. The I bit in the condition code register (CCR) is cleared
when the CPU enters wait mode, enabling interrupts. When an interrupt request occurs, the CPU exits wait
mode and resumes processing, beginning with the stacking operations leading to the interrupt service
routine.
While the MCU is in wait mode, there are some restrictions on which background debug commands can
be used.
• Only the BACKGROUND command and memory-access-with-status commands are available
while the MCU is in wait mode.
• The memory-access-with-status commands do not allow memory access, but they report an error
indicating that the MCU is in stop or wait mode.
• The BACKGROUND command can be used to wake the MCU from wait mode and enter active
background mode.
Chapter 3 Modes of Operation
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 37
3.6 Stop Modes
One of two stop modes is entered upon execution of a STOP instruction when STOPE in SOPT1 is set. In
any stop mode, the bus and CPU clocks are halted. The MCG module can be configured to leave the
reference clocks running. See Chapter 12, “Multi-Purpose Clock Generator (S08MCGV1),” for more
information.
Table 3-1 shows all of the control bits that affect stop mode selection and the mode selected under various
conditions. The selected mode is entered following the execution of a STOP instruction.
3.6.1 Stop3 Mode
Stop3 mode is entered by executing a STOP instruction under the conditions as shown in Table 3-1. The
states of all of the internal registers and logic, RAM contents, and I/O pin states are maintained.
Stop3 can be exited by asserting RESET, or by an interrupt from one of the following sources: the real-time
clock (RTC) interrupt, the USB resume interrupt, LVD, ADC, IRQ, KBI, SCI, or the ACMP.
If stop3 is exited by means of the RESET pin, then the MCU is reset and operation will resume after taking
the reset vector. Exit by means of one of the internal interrupt sources results in the MCU taking the
appropriate interrupt vector.
3.6.1.1 LVD Enabled in Stop Mode
The LVD system is capable of generating either an interrupt or a reset when the supply voltage drops below
the LVD voltage. If the LVD is enabled in stop (LVDE and LVDSE bits in SPMSC1 both set) at the time
the CPU executes a STOP instruction, then the voltage regulator remains active during stop mode. If the
user attempts to enter stop2 with the LVD enabled for stop, the MCU will enter stop3 instead.
For the ADC to operate, the LVD must be left enabled when entering stop3. For the ACMP to operate when
ACGBS in ACMPSC is set, the LVD must be left enabled when entering stop3.
For the XOSC to operate with an external reference when RANGE in MCGC2 is set, the LVD must be left
enabled when entering stop3.
Table 3-1. Stop Mode Selection
STOPE ENBDM 1
1ENBDM is located in the BDCSCR which is only accessible through BDC commands, see Section 18.4.1.1,
“BDC Status and Control Register (BDCSCR).”
LVD E LVD SE PP DC St op Mo de
0 x x x Stop modes disabled; illegal opcode reset if STOP
instruction executed
1 1 x x Stop3 with BDM enabled 2
2When in stop3 mode with BDM enabled, The SIDD will be near RIDD levels because internal clocks are
enabled.
1 0 Both bits must be 1 x Stop3 with voltage regulator active
1 0 Either bit a 0 0 Stop3
1 0 Either bit a 0 1 Stop2
Chapter 3 Modes of Operation
MC9S08JM60 Series Data Sheet, Rev. 3
38 Freescale Semiconductor
3.6.1.2 Active BDM Enabled in Stop Mode
Entry into the active background mode from run mode is enabled if ENBDM in BDCSCR is set. This
register is described in Chapter 18, “Development Support.” If ENBDM is set when the CPU executes a
STOP instruction, the system clocks to the background debug logic remain active when the MCU enters
stop mode. Because of this, background debug communication remains possible. In addition, the voltage
regulator does not enter its low-power standby state but maintains full internal regulation. If the user
attempts to enter stop2 with ENBDM set, the MCU will enter stop3 instead.
Most background commands are not available in stop mode. The memory-access-with-status commands
do not allow memory access, but they report an error indicating that the MCU is in stop or wait mode. The
BACKGROUND command can be used to wake the MCU from stop and enter active background mode
if the ENBDM bit is set. After entering background debug mode, all background commands are available.
3.6.2 Stop2 Mode
Stop2 mode is entered by executing a STOP instruction under the conditions as shown in Table 3-1. Most
of the internal circuitry of the MCU is powered off in stop2, with the exception of the RAM. Upon entering
stop2, all I/O pin control signals are latched so that the pins retain their states during stop2.
Exit from stop2 is performed by asserting either wake-up pin: RESET or IRQ/TPMCLK.
NOTE
IRQ/TPMCLK always functions as an active-low wakeup input when the
MCU is in stop2, regardless of how the pin is configured before entering
stop2. It must be configured as an input before executing a STOP instruction
to avoid an immediate exit from stop2. This pin must be driven or pulled
high externally while in stop2 mode.
In addition, the RTC interrupt can wake the MCU from stop2, if enabled.
Upon wake-up from stop2 mode, the MCU starts up as from a power-on reset (POR):
• All module control and status registers are reset
• The LVD reset function is enabled and the MCU remains in the reset state if VDD is below the LVD
trip point (low trip point selected due to POR)
• The CPU takes the reset vector
In addition to the above, upon waking up from stop2, the PPDF bit in SPMSC2 is set. This flag is used to
direct user code to go to a stop2 recovery routine. PPDF remains set and the I/O pin states remain latched
until a 1 is written to PPDACK in SPMSC2.
To maintain I/O states for pins that were configured as general-purpose I/O before entering stop2, the user
must restore the contents of the I/O port registers, which have been saved in RAM, to the port registers
before writing to the PPDACK bit. If the port registers are not restored from RAM before writing to
PPDACK, then the pins will switch to their reset states when PPDACK is written.
For pins that were configured as peripheral I/O, the user must reconfigure the peripheral module that
interfaces to the pin before writing to the PPDACK bit. If the peripheral module is not enabled before
Chapter 3 Modes of Operation
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 39
writing to PPDACK, the pins will be controlled by their associated port control registers when the I/O
latches are opened.
3.6.3 On-Chip Peripheral Modules in Stop Modes
When the MCU enters any stop mode, system clocks to the internal peripheral modules are stopped. Even
in the exception case (ENBDM = 1), where clocks to the background debug logic continue to operate,
clocks to the peripheral systems are halted to reduce power consumption. Refer to Section 3.6.2, “Stop2
Mode,” and Section 3.6.1, “Stop3 Mode,” for specific information on system behavior in stop modes.
Table 3-2. Stop Mode Behavior
Peripheral
Mode
Stop2 Stop3
CPU Off Standby
RAM Standby Standby
Flash Off Standby
Parallel Port Registers Off Standby
ADC Off Optionally On1
1Requires the asynchronous ADC clock and LVD to be enabled, else in standby.
ACMP Off Optionally On2
2If ACGBS in ACMPSC is set, LVD must be enabled, else in standby.
MCG Off Optionally On3
3IRCLKEN and IREFSTEN set in MCGC1, else in standby.
IIC Off Standby
RTC Optionally on4
4RTCPS[3:0] in RTCSC does not equal 0 before entering stop, else off.
Optionally on4
SCI Off Standby
SPI Off Standby
TPM Off Standby
System Voltage Regulator Off Standby
XOSC Off Optionally On5
5ERCLKEN and EREFSTEN set in MCGC2, else in standby. For high frequency range
(RANGE in MCGC2 set) requires the LVD to also be enabled in stop3.
I/O Pins States Held States Held
USB (SIE and Transceiver) Off Optionally On6
6USBEN in CTL is set and USBPHYEN in USBCTL0 is set, else off.
USB 3.3-V Regulator Off Standby
USB RAM Standby Standby
Chapter 3 Modes of Operation
MC9S08JM60 Series Data Sheet, Rev. 3
40 Freescale Semiconductor
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 41
Chapter 4
Memory
4.1 MC9S08JM60 Series Memory Map
Figure 4-1 shows the memory map for the MC9S08JM60 series. On-chip memory in the MC9S08JM60
series of MCUs consists of RAM, flash program memory for nonvolatile data storage, plus I/O and
control/status registers. The registers are divided into three groups:
• Direct-page registers (0x0000 through 0x00AF)
• High-page registers (0x1800 through 0x185F)
• Nonvolatile registers (0xFFB0 through 0xFFBF)
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
42 Freescale Semiconductor
Figure 4-1. MC9S08JM60 Series Memory Map
4.1.1 Reset and Interrupt Vector Assignments
Figure 4-1 shows address assignments for reset and interrupt vectors. The vector names shown in this table
are the labels used in the Freescale-provided equate file for the MC9S08JM60 series. For more details
about resets, interrupts, interrupt priority, and local interrupt mask controls, refer to Chapter 5, “Resets,
Interrupts, and System Configuration.”
Table 4-1. Reset and Interrupt Vectors
Address
(High/Low) Vector Vector Name
0xFFC0:0xFFC1
to
0xFFC2:FFC3
Unused Vector Space
0xFFC4:FFC5 RTC Vrtc
0xFFC6:FFC7 IIC Viic
0xFFC8:FFC9 ACMP Vacmp
DIRECT PAGE REGISTERS
RAM
FLASH
HIGH PAGE REGISTERS
4096 BYTES
1872 BYTES
0x0000
0x00AF
0x00B0
0x10AF
0x1800
0x17FF
0x185F
0xFFFF
0x10B0
MC9S08JM60
FLASH
59,088 BYTES
MC9S08JM32
DIRECT PAGE REGISTERS
RAM
UNIMPLEMENTED
HIGH PAGE REGISTERS
2048 BYTES
3936 BYTES
0xFFFF
FLASH
32,768 BYTES
0x7FFF
0x8000
0x1860
0x195F
0x1960
USB RAM — 256 BYTES USB RAM — 256 BYTES
UNIMPLEMENTED
0x08AF
0x08B0
0x185F
0x1860
0x195F
0x1960
0x0000
0x00AF
0x00B0
0x1800
0x17FF
96 BYTES 96 BYTES
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 43
4.2 Register Addresses and Bit Assignments
The registers in the MC9S08JM60 series are divided into these three groups:
• Direct-page registers are located in the first 176 locations in the memory map, so they are
accessible with efficient direct addressing mode instructions.
• High-page registers are used much less often, so they are located above 0x1800 in the memory
map. This leaves more room in the direct page for more frequently used registers and variables.
• The nonvolatile register area consists of a block of 16 locations in flash memory at
0xFFB0–0xFFBF.
Nonvolatile register locations include:
— Three values which are loaded into working registers at reset
0xFFCA:FFCB ADC Conversion Vadc
0xFFCC:FFCD KBI Vkeyboard
0xFFCE:FFCF SCI2 Transmit Vsci2tx
0xFFD0:FFD1 SCI2 Receive Vsci2rx
0xFFD2:FFD3 SCI2 Error Vsci2err
0xFFD4:FFD5 SCI1 Transmit Vsci1tx
0xFFD6:FFD7 SCI1 Receive Vsci1rx
0xFFD8:FFD9 SCI1 Error Vsci1err
0xFFDA:FFDB TPM2 Overflow Vtpm2ovf
0xFFDC:FFDD TPM2 Channel 1 Vtpm2ch1
0xFFDE:FFDF TPM2 Channel 0 Vtpm2ch0
0xFFE0:FFE1 TPM1 Overflow Vtpm1ovf
0xFFE2:FFE3 TPM1 Channel 5 Vtpm1ch5
0xFFE4:FFE5 TPM1 Channel 4 Vtpm1ch4
0xFFE6:FFE7 TPM1 Channel 3 Vtpm1ch3
0xFFE8:FFE9 TPM1 Channel 2 Vtpm1ch2
0xFFEA:FFEB TPM1 Channel 1 Vtpm1ch1
0xFFEC:FFED TPM1 Channel 0 Vtpm1ch0
0xFFEE:FFEF Reserved —
0xFFF0:FFF1 USB Status Vusb
0xFFF2:FFF3 SPI2 Vspi2
0xFFF4:FFF5 SPI1 Vspi1
0xFFF6:FFF7 MCG Loss of Lock Vlol
0xFFF8:FFF9 Low Voltage Detect Vlvd
0xFFFA:FFFB IRQ Virq
0xFFFC:FFFD SWI Vswi
0xFFFE:FFFF Reset Vreset
Table 4-1. Reset and Interrupt Vectors (continued)
Address
(High/Low) Vector Vector Name
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
44 Freescale Semiconductor
— An 8-byte backdoor comparison key which optionally allows a user to gain controlled access
to secure memory
Because the nonvolatile register locations are flash memory, they must be erased and
programmed like other flash memory locations.
Direct-page registers can be accessed with efficient direct addressing mode instructions. Bit manipulation
instructions can be used to access any bit in any direct-page register. Table 4-2 is a summary of all
user-accessible direct-page registers and control bits.
The direct page registers in Table 4-2 can use the more efficient direct addressing mode which only
requires the lower byte of the address. Because of this, the lower byte of the address in column one is
shown in bold text. In Table 4-3 and Table 4-4, the whole address in column one is shown in bold. In
Table 4-2, Table 4-3, and Table 4-4, the register names in column two are shown in bold to set them apart
from the bit names to the right. Cells that are not associated with named bits are shaded. A shaded cell with
a 0 indicates this unused bit always reads as a 0. Shaded cells with dashes indicate unused or reserved bit
locations that could read as 1s or 0s.
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 45
Table 4-2. Direct-Page Register Summary (Sheet 1 of 4)
Address Register
Name Bit 7 6 5 4 3 2 1 Bit 0
0x0000 PTAD —— PTAD5 PTAD4 PTAD3 PTAD2 PTAD1 PTAD0
0x0001 PTADD —— PTADD5 PTADD4 PTADD3 PTADD2 PTADD1 PTADD0
0x0002 PTBD PTBD7 PTBD6 PTBD5 PTBD4 PTBD3 PTBD2 PTBD1 PTBD0
0x0003 PTBDD PTBDD7 PTBDD6 PTBDD5 PTBDD4 PTBDD3 PTBDD2 PTBDD1 PTBDD0
0x0004 PTCD — PTCD6 PTCD5 PTCD4 PTCD3 PTCD2 PTCD1 PTCD0
0x0005 PTCDD — PTCDD6 PTCDD5 PTCDD4 PTCDD3 PTCDD2 PTCDD1 PTCDD0
0x0006 PTDD PTDD7 PTDD6 PTDD5 PTDD4 PTDD3 PTDD2 PTDD1 PTDD0
0x0007 PTDDD PTDDD7 PTDDD6 PTDDD5 PTDDD4 PTDDD3 PTDDD2 PTDDD1 PTDDD0
0x0008 PTED PTED7 PTED6 PTED5 PTED4 PTED3 PTED2 PTED1 PTED0
0x0009 PTEDD PTEDD7 PTEDD6 PTEDD5 PTEDD4 PTEDD3 PTEDD2 PTEDD1 PTEDD0
0x000A PTFD PTFD7 PTFD6 PTFD5 PTFD4 PTFD3 PTFD2 PTFD1 PTFD0
0x000B PTFDD PTFDD7 PTFDD6 PTFDD5 PTFDD4 PTFDD3 PTFDD2 PTFDD1 PTFDD0
0x000C PTGD —— PTGD5 PTGD4 PTGD3 PTGD2 PTGD1 PTGD0
0x000D PTGDD —— PTGDD5 PTGDD4 PTGDD3 PTGDD2 PTGDD1 PTGDD0
0x000E ACMPSC ACME ACBGS ACF ACIE ACO ACOPE ACMOD
0x000F Reserved — — — — — — — —
0x0010 ADCSC1 COCO AIEN ADCO ADCH
0x0011 ADCSC2 ADACT ADTRG ACFE ACFGT 0 0 R R
0x0012 ADCRH 0000 ADR11 ADR10 ADR9 ADR8
0x0013 ADCRL ADR7 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 ADR0
0x0014 ADCCVH 0000 ADCV11 ADCV10 ADCV9 ADCV8
0x0015 ADCCVL ADCV7 ADCV6 ADCV5 ADCV4 ADCV3 ADCV2 ADCV1 ADCV0
0x0016 ADCCFG ADLPC ADIV ADLSMP MODE ADICLK
0x0017 APCTL1 ADPC7 ADPC6 ADPC5 ADPC4 ADPC3 ADPC2 ADPC1 ADPC0
0x0018 APCTL2 — — — — ADPC11 ADPC10 ADPC9 ADPC8
0x0019–
0x001A
Reserved — — — — — — — —
0x001B IRQSC 0 IRQPDD IRQEDG IRQPE IRQF IRQACK IRQIE IRQMOD
0x001C KBISC 0 0 0 0 KBF KBACK KBIE KBMOD
0x001D KBIPE KBIPE7 KBIPE6 KBIPE5 KBIPE4 KBIPE3 KBIPE2 KBIPE1 KBIPE0
0x001E KBIES KBEDG7 KBEDG6 KBEDG5 KBEDG4 KBEDG3 KBEDG2 KBEDG1 KBEDG0
0x001F Reserved — — — — — — — —
0x0020 TPM1SC TOF TOIE CPWMS CLKSB CLKSA PS2 PS1 PS0
0x0021 TPM1CNTH Bit 15 14 13 12 11 10 9 Bit 8
0x0022 TPM1CNTL Bit 7 6 5 4 3 2 1 Bit 0
0x0023 TPM1MODH Bit 15 14 13 12 11 10 9 Bit 8
0x0024 TPM1MODL Bit 7 6 5 4 3 2 1 Bit 0
0x0025 TPM1C0SC CH0F CH0IE MS0B MS0A ELS0B ELS0A 0 0
0x0026 TPM1C0VH Bit 15 14 13 12 11 10 9 Bit 8
0x0027 TPM1C0VL Bit 7 6 5 4 3 2 1 Bit 0
0x0028 TPM1C1SC CH1F CH1IE MS1B MS1A ELS1B ELS1A 0 0
0x0029 TPM1C1VH Bit 15 14 13 12 11 10 9 Bit 8
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
46 Freescale Semiconductor
0x002A TPM1C1VL Bit 7 6 5 4 3 2 1 Bit 0
0x002B TPM1C2SC CH2F CH2IE MS2B MS2A ELS2B ELS2A 0 0
0x002C TPM1C2VH Bit 15 14 13 12 11 10 9 Bit 8
0x002D TPM1C2VL Bit 7 6 5 4 3 2 1 Bit 0
0x002E TPM1C3SC CH3F CH3IE MS3B MS3A ELS3B ELS3A 0 0
0x002F TPM1C3VH Bit 15 14 13 12 11 10 9 Bit 8
0x0030 TPM1C3VL Bit 7 6 5 4 3 2 1 Bit 0
0x0031 TPM1C4SC CH4F CH4IE MS4B MS4A ELS4B ELS4A 0 0
0x0032 TPM1C4VH Bit 15 14 13 12 11 10 9 Bit 8
0x0033 TPM1C4VL Bit 7 6 5 4 3 2 1 Bit 0
0x0034 TPM1C5SC CH5F CH5IE MS5B MS5A ELS5B ELS5A 0 0
0x0035 TPM1C5VH Bit 15 14 13 12 11 10 9 Bit 8
0x0036 TPM1C5VL Bit 7 6 5 4 3 2 1 Bit 0
0x0037 Reserved — — — — — — — —
0x0038 SCI1BDH LBKDIE RXEDGIE 0 SBR12 SBR11 SBR10 SBR9 SBR8
0x0039 SCI1BDL SBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0
0x003A SCI1C1 LOOPS SCISWAI RSRC M WAKE ILT PE PT
0x003B SCI1C2 TIE TCIE RIE ILIE TE RE RWU SBK
0x003C SCI1S1 TDRE TC RDRF IDLE OR NF FE PF
0x003D SCI1S2 LBKDIF RXEDGIF 0 RXINV RWUID BRK13 LBKDE RAF
0x003E SCI1C3 R8 T8 TXDIR TXINV ORIE NEIE FEIE PEIE
0x003F SCI1D Bit 7 6 5 4 3 2 1 Bit 0
0x0040 SCI2BDH LBKDIE RXEDGIE 0 SBR12 SBR11 SBR10 SBR9 SBR8
0x0041 SCI2BDL SBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0
0x0042 SCI2C1 LOOPS SCISWAI RSRC M WAKE ILT PE PT
0x0043 SCI2C2 TIE TCIE RIE ILIE TE RE RWU SBK
0x0044 SCI2S1 TDRE TC RDRF IDLE OR NF FE PF
0x0045 SCI2S2 LBKDIF RXEDGIF 0 RXINV RWUID BRK13 LBKDE RAF
0x0046 SCI2C3 R8 T8 TXDIR TXINV ORIE NEIE FEIE PEIE
0x0047 SCI2D Bit 7 6 5 4 3 2 1 Bit 0
0x0048 MCGC1 CLKS RDIV IREFS IRCLKEN IREFSTEN
0x0049 MCGC2 BDIV RANGE HGO LP EREFS ERCLKEN EREFSTEN
0x004A MCGTRM TRIM
0x004B MCGSC LOLS LOCK PLLST IREFST CLKST OSCINIT FTRIM
0x004C MCGC3 LOLIE PLLS CME 0VDIV
0x004D MCGT 00000000
0x004E–
0x004F
Reserved — — — — — — — —
0x0050 SPI1C1 SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE
0x0051 SPI1C2 SPMIE SPIMODE 0 MODFEN BIDIROE 0 SPISWAI SPC0
0x0052 SPI1BR 0 SPPR2 SPPR1 SPPR0 0 SPR2 SPR1 SPR0
0x0053 SPI1S SPRF SPMF SPTEF MODF 0000
Table 4-2. Direct-Page Register Summary (Sheet 2 of 4)
Address Register
Name Bit 7 6 5 4 3 2 1 Bit 0
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 47
0x0054 SPI1DH Bit 15 14 13 12 11 10 9 Bit 8
0x0055 SPI1DL Bit 7 6 5 4 3 2 1 Bit 0
0x0056 SPI1MH Bit 15 14 13 12 11 10 9 Bit 8
0x0057 SPI1ML Bit 7 6 5 4 3 2 1 Bit 0
0x0058 IICA AD7 AD6 AD5 AD4 AD3 AD2 AD1 0
0x0059 IICF MULT ICR
0x005A IICC1 IICEN IICIE MST TX TXAK RSTA 0 0
0x005B IICS TCF IAAS BUSY ARBL 0 SRW IICIF RXAK
0x005C IICD DATA
0x005D IICC2 GCAEN ADEXT 0 0 0 AD10 AD9 AD8
0x005E–
0x005F
Reserved — — — — — — — —
0x0060 TPM2SC TOF TOIE CPWMS CLKSB CLKSA PS2 PS1 PS0
0x0061 TPM2CNTH Bit 15 14 13 12 11 10 9 Bit 8
0x0062 TPM2CNTL Bit 7 6 5 4 3 2 1 Bit 0
0x0063 TPM2MODH Bit 15 14 13 12 11 10 9 Bit 8
0x0064 TPM2MODL Bit 7 6 5 4 3 2 1 Bit 0
0x0065 TPM2C0SC CH0F CH0IE MS0B MS0A ELS0B ELS0A 0 0
0x0066 TPM2C0VH Bit 15 14 13 12 11 10 9 Bit 8
0x0067 TPM2C0VL Bit 7 6 5 4 3 2 1 Bit 0
0x0068 TPM2C1SC CH1F CH1IE MS1B MS1A ELS1B ELS1A 0 0
0x0069 TPM2C1VH Bit 15 14 13 12 11 10 9 Bit 8
0x006A TPM2C1VL Bit 7 6 5 4 3 2 1 Bit 0
0x006B Reserved — — — — — — — —
0x006C RTCSC RTIF RTCLKS RTIE RTCPS
0x006D RTCCNT RTCCNT
0x006E RTCMOD RTCMOD
0x006F Reserved — — — — — — — —
0x0070 SPI2C1 SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE
0x0071 SPI2C2 SPMIE SPIMODE 0 MODFEN BIDIROE 0 SPISWAI SPC0
0x0072 SPI2BR 0 SPPR2 SPPR1 SPPR0 0 SPR2 SPR1 SPR0
0x0073 SPI2S SPRF SPMF SPTEF MODF 0000
0x0074 SPI2DH Bit 15 14 13 12 11 10 9 Bit 8
0x0075 SPI2DL Bit 7 6 5 4 3 2 1 Bit 0
0x0076 SPI2MH Bit 15 14 13 12 11 10 9 Bit 8
0x0077 SPI2ML Bit 7 6 5 4 3 2 1 Bit 0
0x0078–
0x007F
Reserved — — — — — — — —
0x0080 USBCTL0 USBRESET USBPU USBRESMEN LPRESF — USBVREN — USBPHYEN
0x0081–
0x0087
Reserved — — — — — — — —
0x0088 PERID 0 0 ID5 ID4 ID3 ID2 ID1 ID0
Table 4-2. Direct-Page Register Summary (Sheet 3 of 4)
Address Register
Name Bit 7 6 5 4 3 2 1 Bit 0
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
48 Freescale Semiconductor
High-page registers, shown in Table 4-3, are accessed much less often than other I/O and control registers
so they have been located outside the direct addressable memory space, starting at 0x1800.
0x0089 IDCOMP 1 1 NID5 NID4 NID3 NID2 NID1 NID0
0x008A REV REV7 REV6 REV5 REV4 REV3 REV2 REV1 REV0
0x008B–
0x008F
Reserved — — — — — — — —
0x0090 INTSTAT STALLF—RESUMEF SLEEPF TOKDNEF SOFTOKF ERRORF USBRSTF
0x0091 INTENB STALL —RESUME SLEEP TOKDNE SOFTOK ERROR USBRST
0x0092 ERRSTAT BTSERRF — BUFERRF BTOERRF DFN8F CRC16F CRC5F PIDERRF
0x0093 ERRENB BTSERR — BUFERR BTOERR DFN8 CRC16 CRC5 PIDERR
0x0094 STAT ENDP IN ODD 0 0
0x0095 CTL —— TSUSPEND —— CRESUME ODDRST USBEN
0x0096 ADDR — ADDR6 ADDR5 ADDR4 ADDR3 ADDR2 ADDR1 ADDR0
0x0097 FRMNUML FRM7 FRM6 FRM5 FRM4 FRM3 FRM2 FRM1 FRM0
0x0098 FRMNUMH 0 0 0 0 0 FRM10 FRM9 FRM8
0x0099–
0x009C
Reserved — — — — — — — —
0x009D EPCTL0 — — 0 EPCTLDIS EPRXEN EPTXEN EPSTALL EPHSHK
0x009E EPCTL1 — — 0 EPCTLDIS EPRXEN EPTXEN EPSTALL EPHSHK
0x009F EPCTL2 — — 0 EPCTLDIS EPRXEN EPTXEN EPSTALL EPHSHK
0x00A0 EPCTL3 — — 0 EPCTLDIS EPRXEN EPTXEN EPSTALL EPHSHK
0x00A1 EPCTL4 — — 0 EPCTLDIS EPRXEN EPTXEN EPSTALL EPHSHK
0x00A2 EPCTL5 — — 0 EPCTLDIS EPRXEN EPTXEN EPSTALL EPHSHK
0x00A3 EPCTL6 — — 0 EPCTLDIS EPRXEN EPTXEN EPSTALL EPHSHK
0x00A4–
0x00AF
Reserved — — — — — — — —
Table 4-3. High-Page Register Summary (Sheet 1 of 3)
AddressRegister NameBit 7654321Bit 0
0x1800 SRS POR PIN COP ILOP 0LOCLVD—
0x1801 SBDFR 0000000BDFR
0x1802 SOPT1 COPT STOPE — 0 0 — —
0x1803 SOPT2 COPCLKS COPW 000 SPI1FE SPI2FE ACIC
0x1804–
0x1805
Reserved ————————
0x1806 SDIDH ———— ID11 ID10 ID9 ID8
0x1807 SDIDL ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0
0x1808 Reserved ————————
0x1809 SPMSC1 LVWF LVWAC K LVWIE LVD RE LVD SE LVDE 01BGBE
0x180A SPMSC2 —— LVDV LVWV PPDF PPDACK — PPDC
0x180B–
0x180F
Reserved ————————
Table 4-2. Direct-Page Register Summary (Sheet 4 of 4)
Address Register
Name Bit 7 6 5 4 3 2 1 Bit 0
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 49
0x1810 DBGCAH Bit 15 14 13 12 11 10 9 Bit 8
0x1811 DBGCAL Bit 7654321Bit 0
0x1812 DBGCBH Bit 15 14 13 12 11 10 9 Bit 8
0x1813 DBGCBL Bit 7654321Bit 0
0x1814 DBGFH Bit 15 14 13 12 11 10 9 Bit 8
0x1815 DBGFL Bit 7654321Bit 0
0x1816 DBGC DBGEN ARM TAG BRKEN RWA RWAEN RWB RWBEN
0x1817 DBGT TRGSEL BEGIN 00 TRG3 TRG2 TRG1 TRG0
0x1818 DBGS AF BF ARMF 0 CNT3 CNT2 CNT1 CNT0
0x1819–
0x181F
Reserved ————————
0x1820 FCDIV DIVLD PRDIV8 DIV5 DIV4 DIV3 DIV2 DIV1 DIV0
0x1821 FOPT KEYEN FNORED 0000 SEC01 SEC00
0x1822 Reserved ————————
0x1823 FCNFG 00 KEYACC 00000
0x1824 FPROT FPS7 FPS6 FPS5 FPS4 FPS3 FPS2 FPS1 FPDIS
0x1825 FSTAT FCBEF FCCF FPVIOL FACCERR 0 FBLANK 0 0
0x1826 FCMD FCMD7 FCMD6 FCMD5 FCMD4 FCMD3 FCMD2 FCMD1 FCMD0
0x1827–
0x183F
Reserved ————————
0x1840 PTAPE —— PTAPE5 PTAPE4 PTAPE3 PTAPE2 PTAPE1 PTAPE0
0x1841 PTASE —— PTASE5 PTASE4 PTASE3 PTASE2 PTASE1 PTASE0
0x1842 PTADS —— PTADS5 PTADS4 PTADS3 PTADS2 PTADS1 PTADS0
0x1843 Reserved ————————
0x1844 PTBPE PTBPE7 PTBPE6 PTBPE5 PTBPE4 PTBPE3 PTBPE2 PTBPE1 PTBPE0
0x1845 PTBSE PTBSE7 PTBSE6 PTBSE5 PTBSE4 PTBSE3 PTBSE2 PTBSE1 PTBSE0
0x1846 PTBDS PTBDS7 PTBDS6 PTBDS5 PTBDS4 PTBDS3 PTBDS2 PTBDS1 PTBDS0
0x1847 Reserved ————————
0x1848 PTCPE — PTCPE6 PTCPE5 PTCPE4 PTCPE3 PTCPE2 PTCPE1 PTCPE0
0x1849 PTCSE — PTCSE6 PTCSE5 PTCSE4 PTCSE3 PTCSE2 PTCSE1 PTCSE0
0x184A PTCDS — PTCDS6 PTCDS5 PTCDS4 PTCDS3 PTCDS2 PTCDS1 PTCDS0
0x184B Reserved ————————
0x184C PTDPE PTDPE7 PTDPE6 PTDPE5 PTDPE4 PTDPE3 PTDPE2 PTDPE1 PTDPE0
0x184D PTDSE PTDSE7 PTDSE6 PTDSE5 PTDSE4 PTDSE3 PTDSE2 PTDSE1 PTDSE0
0x184E PTDDS PTDDS7 PTDDS6 PTDDS5 PTDDS4 PTDDS3 PTDDS2 PTDDS1 PTDDS0
0x184F Reserved ————————
0x1850 PTEPE PTEPE7 PTEPE6 PTEPE5 PTEPE4 PTEPE3 PTEPE2 PTEPE1 PTEPE0
0x1851 PTESE PTESE7 PTESE6 PTESE5 PTESE4 PTESE3 PTESE2 PTESE1 PTESE0
0x1852 PTEDS PTEDS7 PTEDS6 PTEDS5 PTEDS4 PTEDS3 PTEDS2 PTEDS1 PTEDS0
0x1853 Reserved ————————
0x1854 PTFPE PTFPE7 PTFPE6 PTFPE5 PTFPE4 PTFPE3 PTFPE2 PTFPE1 PTFPE0
0x1855 PTFSE PTFSE7 PTFSE6 PTFSE5 PTFSE4 PTFSE3 PTFSE2 PTFSE1 PTFSE0
0x1856 PTFDS PTFDS7 PTFDS6 PTFDS5 PTFDS4 PTFDS3 PTFDS2 PTFDS1 PTFDS0
Table 4-3. High-Page Register Summary (Sheet 2 of 3)
AddressRegister NameBit 7654321Bit 0
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
50 Freescale Semiconductor
Nonvolatile flash registers, shown in Table 4-4, are located in the flash memory. These registers include
an 8-byte backdoor key which optionally can be used to gain access to secure memory resources. During
reset events, the contents of NVPROT and NVOPT in the nonvolatile register area of the flash memory
are transferred into corresponding FPROT and FOPT working registers in the high-page registers to
control security and block protection options.
Provided the key enable (KEYEN) bit is 1, the 8-byte comparison key can be used to temporarily
disengage memory security. This key mechanism can be accessed only through user code running in secure
memory. (A security key cannot be entered directly through background debug commands.) This security
key can be disabled completely by programming the KEYEN bit to 0. If the security key is disabled, the
only way to disengage security is by mass erasing the flash if needed (normally through the background
debug interface) and verifying that flash is blank. To avoid returning to secure mode after the next reset,
program the security bits (SEC01:SEC00) to the unsecured state (1:0).
4.3 RAM (System RAM)
The MC9S08JM60 series includes static RAM. The locations in RAM below 0x0100 can be accessed
using the more efficient direct addressing mode, and any single bit in this area can be accessed with the bit
manipulation instructions (BCLR, BSET, BRCLR, and BRSET). Locating the most frequently accessed
program variables in this area of RAM is preferred.
0x1857 Reserved ————————
0x1858 PTGPE —— PTGPE5 PTGPE4 PTGPE3 PTGPE2 PTGPE1 PTGPE0
0x1859 PTGSE —— PTGSE5 PTGSE4 PTGSE3 PTGSE2 PTGSE1 PTGSE0
0x185A PTGDS —— PTGDS5 PTGDS4 PTGDS3 PTGDS2 PTGDS1 PTGDS0
0x185B–
0x185F
Reserved ————————
1This reserved bit must always be written to 0.
Table 4-4. Nonvolatile Register Summary
AddressRegister NameBit 7654321Bit 0
0xFFAE Reserved for
storage of FTRIM 0000000FTRIM
0xFFAF Res. for storage of
MCGTRIM TRIM
0xFFB0–
0xFFB7 NVBACKKEY 8-Byte Comparison Key
0xFFB8–
0xFFBC Reserved ————————
0xFFBD NVPROT FPS7 FPS6 FPS5 FPS4 FPS3 FPS2 FPS1 FPDIS
0xFFBE Reserved ————————
0xFFBF NVOPT KEYEN FNORED 0000 SEC01 SEC00
Table 4-3. High-Page Register Summary (Sheet 3 of 3)
AddressRegister NameBit 7654321Bit 0
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 51
The RAM retains data when the MCU is in low-power wait, stop2, or stop3 mode. At power-on, the
contents of RAM are uninitialized. RAM data is unaffected by any reset provided that the supply voltage
does not drop below the minimum value for RAM retention.
For compatibility with older M68HC05 MCUs, the HCS08 resets the stack pointer to 0x00FF. In the
MC9S08JM60 series, it is usually best to re-initialize the stack pointer to the top of the RAM so the direct
page RAM can be used for frequently accessed RAM variables and bit-addressable program variables.
Include the following 2-instruction sequence in your reset initialization routine (where RamLast is equated
to the highest address of the RAM in the Freescale-provided equate file).
LDHX #RamLast+1 ;point one past RAM
TXS ;SP<-(H:X-1)
When security is enabled, the RAM is considered a secure memory resource and is not accessible through
BDM or through code executing from non-secure memory. See Section 4.6, “Security,” for a detailed
description of the security feature.
4.4 USB RAM
USB RAM is discussed in detail in Chapter 17, “Universal Serial Bus Device Controller (S08USBV1).”
4.5 Flash
The flash memory is used for program storage. In-circuit programming allows the operating program to
be loaded into the flash memory after final assembly of the application product. It is possible to program
the entire array through the single-wire background debug interface. Because no special voltages are
needed for flash erase and programming operations, in-application programming is also possible through
other software-controlled communication paths. For a more detailed discussion of in-circuit and
in-application programming, refer to the HCS08 Family Reference Manual, Volume I, Freescale
Semiconductor document order number HCS08RMv1.
4.5.1 Features
Features of the flash memory include:
• Flash size
— MC9S08JM60 — 60,912 bytes (119 pages of 512 bytes each)
— MC9S08JM32 — 32,768 bytes (64 pages of 512 bytes each)
• Single power supply program and erase
• Command interface for fast program and erase operation
• Up to 100,000 program/erase cycles at typical voltage and temperature
• Flexible block protection
• Security feature for flash and RAM
• Auto power-down for low-frequency read accesses
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
52 Freescale Semiconductor
4.5.2 Program and Erase Times
Before any program or erase command can be accepted, the flash clock divider register (FCDIV) must be
written to set the internal clock for the flash module to a frequency (fFCLK) between 150 kHz and 200 kHz
(see Section 4.7.1, “Flash Clock Divider Register (FCDIV).”) This register can be written only once, so
normally this write is done during reset initialization. FCDIV cannot be written if the access error flag,
FACCERR in FSTAT, is set. The user must ensure that FACCERR is not set before writing to the FCDIV
register. One period of the resulting clock (1/fFCLK) is used by the command processor to time program
and erase pulses. An integer number of these timing pulses are used by the command processor to complete
a program or erase command.
Table 4-5 shows program and erase times. The bus clock frequency and FCDIV determine the frequency
of FCLK (fFCLK). The time for one cycle of FCLK is tFCLK =1/f
FCLK. The times are shown as a number
of cycles of FCLK and as an absolute time for the case where tFCLK =5μs. Program and erase times
shown include overhead for the command state machine and enabling and disabling of program and erase
voltages.
4.5.3 Program and Erase Command Execution
The steps for executing any of the commands are listed below. The FCDIV register must be initialized and
any error flags cleared before beginning command execution. The command execution steps are:
1. Write a data value to an address in the flash array. The address and data information from this write
is latched into the flash interface. This write is a required first step in any command sequence. For
erase and blank check commands, the value of the data is not important. For page erase commands,
the address may be any address in the 512-byte page of flash to be erased. For mass erase and blank
check commands, the address can be any address in the flash memory. Whole pages of 512 bytes
are the smallest block of flash that may be erased. In the 60K version, there are two instances where
the size of a block that is accessible to the user is less than 512 bytes: the first page following RAM,
and the first page following the high page registers. These pages are overlapped by the RAM and
high page registers respectively.
NOTE
Do not program any byte in the flash more than once after a successful erase
operation. Reprogramming bits to a byte which is already programmed is
not allowed without first erasing the page in which the byte resides or mass
erasing the entire flash memory. Programming without first erasing may
disturb data stored in the flash.
Table 4-5. Program and Erase Times
Parameter Cycles of FCLK Time if FCLK = 200 kHz
Byte program 9 45 μs
Byte program (burst) 4 20 μs1
1Excluding start/end overhead
Page erase 4000 20 ms
Mass erase 20,000 100 ms
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 53
2. Write the command code for the desired command to FCMD. The five valid commands are blank
check (0x05), byte program (0x20), burst program (0x25), page erase (0x40), and mass erase
(0x41). The command code is latched into the command buffer.
3. Write a 1 to the FCBEF bit in FSTAT to clear FCBEF and launch the command (including its
address and data information).
A partial command sequence can be aborted manually by writing a 0 to FCBEF any time after the write to
the memory array and before writing the 1 that clears FCBEF and launches the complete command.
Aborting a command in this way sets the FACCERR access error flag which must be cleared before
starting a new command.
A strictly monitored procedure must be obeyed or the command will not be accepted. This minimizes the
possibility of any unintended changes to the flash memory contents. The command complete flag (FCCF)
indicates when a command is complete. The command sequence must be completed by clearing FCBEF
to launch the command. Figure 4-2 is a flowchart for executing all of the commands except for burst
programming. The FCDIV register must be initialized before using any flash commands. This only must
be done once following a reset.
Figure 4-2. Flash Program and Erase Flowchart
START
WRITE TO FLASH
TO BUFFER ADDRESS AND DATA
WRITE COMMAND TO FCMD
NO
YES
FPVIOL OR
WRITE 1 TO FCBEF
TO LAUNCH COMMAND
AND CLEAR FCBEF (Note 2)
1
0FCCF ?
ERROR EXIT
DONE
Note 2: Wait at least four bus cycles
0
FACCERR ?
CLEAR ERROR
FACCERR ?
WRITE TO FCDIV (Note 1) Note 1: Required only once after reset.
1
before checking FCBEF or FCCF.
FLASH PROGRAM AND
ERASE FLOW
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
54 Freescale Semiconductor
4.5.4 Burst Program Execution
The burst program command is used to program sequential bytes of data in less time than would be
required using the standard program command. This is possible because the high voltage to the flash array
does not need to be disabled between program operations. Ordinarily, when a program or erase command
is issued, an internal charge pump associated with the flash memory must be enabled to supply high
voltage to the array. Upon completion of the command, the charge pump is turned off. When a burst
program command is issued, the charge pump is enabled and then remains enabled after completion of the
burst program operation if these two conditions are met:
• The next burst program command has been queued before the current program operation has
completed.
• The next sequential address selects a byte on the same physical row as the current byte being
programmed. A row of flash memory consists of 64 bytes. A byte within a row is selected by
addresses A5 through A0. A new row begins when addresses A5 through A0 are all zero.
The first byte of a series of sequential bytes being programmed in burst mode will take the same amount
of time to program as a byte programmed in standard mode. Subsequent bytes will program in the burst
program time provided that the conditions above are met. In the case the next sequential address is the
beginning of a new row, the program time for that byte will be the standard time instead of the burst time.
This is because the high voltage to the array must be disabled and then enabled again. If a new burst
command has not been queued before the current command completes, then the charge pump will be
disabled and high voltage removed from the array.
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 55
Figure 4-3. Flash Burst Program Flowchart
4.5.5 Access Errors
An access error occurs whenever the command execution protocol is violated.
Any of the following specific actions will cause the access error flag (FACCERR) in FSTAT to be set.
FACCERR must be cleared by writing a 1 to FACCERR in FSTAT before any command can be processed.
• Writing to a flash address before the internal flash clock frequency has been set by writing to the
FCDIV register
• Writing to a flash address while FCBEF is not set (A new command cannot be started until the
command buffer is empty.)
• Writing a second time to a flash address before launching the previous command (There is only
one write to flash for every command.)
1
0
FCBEF ?
START
WRITE TO FLASH
TO BUFFER ADDRESS AND DATA
WRITE COMMAND (0x25) TO FCMD
NO
YES
FPVIO OR
WRITE 1 TO FCBEF
TO LAUNCH COMMAND
AND CLEAR FCBEF (Note 2)
NO
YES NEW BURST COMMAND ?
1
0FCCF ?
ERROR EXIT
DONE
Note 2: Wait at least four bus cycles before
1
0
FACCERR ?
CLEAR ERROR
FACCERR ?
Note 1: Required only once after reset.
WRITE TO FCDIV (Note 1)
checking FCBEF or FCCF.
FLASH BURST
PROGRAM FLOW
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
56 Freescale Semiconductor
• Writing a second time to FCMD before launching the previous command (There is only one write
to FCMD for every command.)
• Writing to any flash control register other than FCMD after writing to a flash address
• Writing any command code other than the five allowed codes (0x05, 0x20, 0x25, 0x40, or 0x41)
to FCMD
• Writing any flash control register other than the write to FSTAT (to clear FCBEF and launch the
command) after writing the command to FCMD.
• The MCU enters stop mode while a program or erase command is in progress (The command is
aborted.)
• Writing the byte program, burst program, or page erase command code (0x20, 0x25, or 0x40) with
a background debug command while the MCU is secured (The background debug controller can
only do blank check and mass erase commands when the MCU is secure.)
• Writing 0 to FCBEF to cancel a partial command
4.5.6 Flash Block Protection
The block protection feature prevents the protected region of flash from program or erase changes. Block
protection is controlled through the flash protection register (FPROT). When enabled, block protection
begins at any 512 byte boundary below the last address of flash, 0xFFFF. (see Section 4.7.4, “Flash
Protection Register (FPROT and NVPROT).”)
After exit from reset, FPROT is loaded with the contents of the NVPROT location which is in the
nonvolatile register block of the flash memory. FPROT cannot be changed directly from application
software so a runaway program cannot alter the block protection settings. Since NVPROT is within the
last 512 bytes of flash, if any amount of memory is protected, NVPROT is itself protected and cannot be
altered (intentionally or unintentionally) by the application software. FPROT can be written through
background debug commands which allows a way to erase and reprogram a protected flash memory.
The block protection mechanism is illustrated below. The FPS bits are used as the upper bits of the last
address of unprotected memory. This address is formed by concatenating FPS7:FPS1 with logic 1 bits as
shown. For example, in order to protect the last 8192 bytes of memory (addresses 0xE000 through
0xFFFF), the FPS bits must be set to 1101 111 which results in the value 0xDFFF as the last address of
unprotected memory. In addition to programming the FPS bits to the appropriate value, FPDIS (bit 0 of
NVPROT) must be programmed to logic 0 to enable block protection. Therefore the value 0xDE must be
programmed into NVPROT to protect addresses 0xE000 through 0xFFFF.
Figure 4-4. Block Protection Mechanism
One use for block protection is to block protect an area of flash memory for a bootloader program. This
bootloader program then can be used to erase the rest of the flash memory and reprogram it. Because the
FPS7 FPS6 FPS5 FPS4 FPS3 FPS2 FPS1
A15 A14 A13 A12 A11 A10 A9 A8
1
A7 A6 A5 A4 A3 A2 A1 A0
11111111
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 57
bootloader is protected, it remains intact even if MCU power is lost in the middle of an erase and
reprogram operation.
4.5.7 Vector Redirection
Whenever any block protection is enabled, the reset and interrupt vectors will be protected. Vector
redirection allows users to modify interrupt vector information without unprotecting bootloader and reset
vector space. Vector redirection is enabled by programming the FNORED bit in the NVOPT register
located at address 0xFFBF to zero. For redirection to occur, at least some portion but not all of the flash
memory must be block protected by programming the NVPROT register located at address 0xFFBD. All
of the interrupt vectors (memory locations 0xFFC0–0xFFFD) are redirected, though the reset vector
(0xFFFE:FFFF) is not.
For example, if 512 bytes of flash are protected, the protected address region is from 0xFE00 through
0xFFFF. The interrupt vectors (0xFFC0–0xFFFD) are redirected to the locations 0xFDC0–0xFDFD. Now,
if a TPM1 overflow interrupt is taken for instance, the values in the locations 0xFDE0:FDE1 are used for
the vector instead of the values in the locations 0xFFE0:FFE1. This allows the user to reprogram the
unprotected portion of the flash with new program code including new interrupt vector values while
leaving the protected area, which includes the default vector locations, unchanged.
4.6 Security
The MC9S08JM60 Series includes circuitry to prevent unauthorized access to the contents of flash and
RAM memory. When security is engaged, flash and RAM are considered secure resources. Direct-page
registers, high-page registers, and the background debug controller are considered unsecured resources.
Programs executing within secure memory have normal access to any MCU memory locations and
resources. Attempts to access a secure memory location with a program executing from an unsecured
memory space or through the background debug interface are blocked (writes are ignored and reads return
all 0s).
Security is engaged or disengaged based on the state of two nonvolatile register bits (SEC01:SEC00) in
the FOPT register. During reset, the contents of the nonvolatile location NVOPT are copied from flash into
the working FOPT register in high-page register space. A user engages security by programming the
NVOPT location which can be done at the same time the flash memory is programmed. The 1:0 state
disengages security and the other three combinations engage security. Notice the erased state (1:1) makes
the MCU secure. During development, whenever the flash is erased, it is good practice to immediately
program the SEC00 bit to 0 in NVOPT so SEC01:SEC00 = 1:0. This would allow the MCU to remain
unsecured after a subsequent reset.
The on-chip debug module cannot be enabled while the MCU is secure. The separate background debug
controller can still be used for background memory access commands, but the MCU cannot enter active
background mode except by holding BKGD/MS low at the rising edge of reset.
A user can choose to allow or disallow a security unlocking mechanism through an 8-byte backdoor
security key. If the nonvolatile KEYEN bit in NVOPT/FOPT is 0, the backdoor key is disabled and there
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
58 Freescale Semiconductor
is no way to disengage security without completely erasing all flash locations. If KEYEN is 1, a secure
user program can temporarily disengage security by:
1. Writing 1 to KEYACC in the FCNFG register. This makes the flash module interpret writes to the
backdoor comparison key locations (NVBACKKEY through NVBACKKEY+7) as values to be
compared against the key rather than as the first step in a flash program or erase command.
2. Writing the user-entered key values to the NVBACKKEY through NVBACKKEY+7 locations.
These writes must be done in order starting with the value for NVBACKKEY and ending with
NVBACKKEY+7. STHX must not be used for these writes because these writes cannot be done
on adjacent bus cycles. User software normally would get the key codes from outside the MCU
system through a communication interface such as a serial I/O.
3. Writing 0 to KEYACC in the FCNFG register. If the 8-byte key that was just written matches the
key stored in the flash locations, SEC01:SEC00 are automatically changed to 1:0 and security will
be disengaged until the next reset.
The security key can be written only from secure memory (either RAM or flash), so it cannot be entered
through background commands without the cooperation of a secure user program.
The backdoor comparison key (NVBACKKEY through NVBACKKEY+7) is located in flash memory
locations in the nonvolatile register space so users can program these locations exactly as they would
program any other flash memory location. The nonvolatile registers are in the same 512-byte block of flash
as the reset and interrupt vectors, so block protecting that space also block protects the backdoor
comparison key. Block protects cannot be changed from user application programs, so if the vector space
is block protected, the backdoor security key mechanism cannot permanently change the block protect,
security settings, or the backdoor key.
Security can always be disengaged through the background debug interface by taking these steps:
1. Disable any block protections by writing FPROT. FPROT can be written only with background
debug commands, not from application software.
2. Mass erase flash if necessary.
3. Blank check flash. Provided flash is completely erased, security is disengaged until the next reset.
To avoid returning to secure mode after the next reset, program NVOPT so SEC01:SEC00 = 1:0.
4.7 Flash Registers and Control Bits
The flash module has nine 8-bit registers in the high-page register space, three locations in the nonvolatile
register space in flash memory which are copied into three corresponding high-page control registers at
reset. There is also an 8-byte comparison key in flash memory. Refer to Table 4-3 and Table 4-4 for the
absolute address assignments for all flash registers. This section refers to registers and control bits only by
their names. A Freescale-provided equate or header file normally is used to translate these names into the
appropriate absolute addresses.
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 59
4.7.1 Flash Clock Divider Register (FCDIV)
Bit 7 of this register is a read-only status flag. Bits 6 through 0 may be read at any time but can be written
only one time. Before any erase or programming operations are possible, write to this register to set the
frequency of the clock for the nonvolatile memory system within acceptable limits.
if PRDIV8 = 0 — fFCLK = fBus ÷ ([DIV5:DIV0] + 1) Eqn. 4-1
if PRDIV8 = 1 — fFCLK = fBus ÷ (8 × ([DIV5:DIV0] + 1)) Eqn. 4-2
Table 4-7 shows the appropriate values for PRDIV8 and DIV5:DIV0 for selected bus frequencies.
76543210
RDIVLD
PRDIV8 DIV5 DIV4 DIV3 DIV2 DIV1 DIV0
W
Reset00000000
= Unimplemented or Reserved
Figure 4-5. Flash Clock Divider Register (FCDIV)
Table 4-6. FCDIV Register Field Descriptions
Field Description
7
DIVLD
Divisor Loaded Status Flag — When set, this read-only status flag indicates that the FCDIV register has been
written since reset. Reset clears this bit and the first write to this register causes this bit to become set regardless
of the data written.
0 FCDIV has not been written since reset; erase and program operations disabled for flash.
1 FCDIV has been written since reset; erase and program operations enabled for flash.
6
PRDIV8
Prescale (Divide) Flash Clock by 8
0 Clock input to the flash clock divider is the bus rate clock.
1 Clock input to the flash clock divider is the bus rate clock divided by 8.
5:0
DIV[5:0]
Divisor for Flash Clock Divider — The flash clock divider divides the bus rate clock (or the bus rate clock
divided by 8 if PRDIV8 = 1) by the value in the 6-bit DIV5:DIV0 field plus one. The resulting frequency of the
internal flash clock must fall within the range of 200 kHz to 150 kHz for proper flash operations. Program/Erase
timing pulses are one cycle of this internal flash clock which corresponds to a range of 5 μs to 6.7 μs. The
automated programming logic uses an integer number of these pulses to complete an erase or program
operation. See Equation 4-1, Equation 4-2, and Ta ble 4- 6 .
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
60 Freescale Semiconductor
4.7.2 Flash Options Register (FOPT and NVOPT)
During reset, the contents of the nonvolatile location NVOPT are copied from flash into FOPT. Bits 5
through 2 are not used and always read 0. This register may be read at any time, but writes have no meaning
or effect. To change the value in this register, erase and reprogram the NVOPT location in flash memory
as usual and then issue a new MCU reset.
Table 4-7. Flash Clock Divider Settings
fBus
PRDIV8
(Binary)
DIV5:DIV0
(Decimal) fFCLK
Program/Erase Timing Pulse
(5 μs Min, 6.7 μs Max)
24 MHz 1 14 200 kHz 5 μs
20 MHz 1 12 192.3 kHz 5.2 μs
10 MHz 0 49 200 kHz 5 μs
8 MHz 0 39 200 kHz 5 μs
4 MHz 0 19 200 kHz 5 μs
2 MHz 0 9 200 kHz 5 μs
1 MHz 0 4 200 kHz 5 μs
200 kHz 0 0 200 kHz 5 μs
150 kHz 0 0 150 kHz 6.7 μs
76543210
R KEYEN FNORED 0 0 0 0 SEC01 SEC00
W
Reset This register is loaded from nonvolatile location NVOPT during reset.
= Unimplemented or Reserved
Figure 4-6. Flash Options Register (FOPT)
Table 4-8. FOPT Register Field Descriptions
Field Description
7
KEYEN
Backdoor Key Mechanism Enable — When this bit is 0, the backdoor key mechanism cannot be used to
disengage security. The backdoor key mechanism is accessible only from user (secured) firmware. BDM
commands cannot be used to write key comparison values that would unlock the backdoor key. For more detailed
information about the backdoor key mechanism, refer to Section 4.6, “Security.”
0 No backdoor key access allowed.
1 If user firmware writes an 8-byte value that matches the nonvolatile backdoor key (NVBACKKEY through
NVBACKKEY+7 in that order), security is temporarily disengaged until the next MCU reset.
6
FNORED
Vector Redirection Disable — When this bit is 1, then vector redirection is disabled.
0 Vector redirection enabled.
1 Vector redirection disabled.
1:0
SEC0[1:0]
Security State Code — This 2-bit field determines the security state of the MCU as shown in Tabl e 4 - 9. When
the MCU is secure, the contents of RAM and flash memory cannot be accessed by instructions from any
unsecured source including the background debug interface. For more detailed information about security, refer
to Section 4.6, “Security.”
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 61
SEC01:SEC00 changes to 1:0 after successful backdoor key entry or a successful blank check of flash.
4.7.3 Flash Configuration Register (FCNFG)
Bits 7 through 5 may be read or written at any time. Bits 4 through 0 always read 0 and cannot be written.
4.7.4 Flash Protection Register (FPROT and NVPROT)
During reset, the contents of the nonvolatile location NVPROT is copied from flash into FPROT. This
register may be read at any time, but user program writes have no meaning or effect. Background debug
commands can write to FPROT.
Table 4-9. Security States
SEC01:SEC00 Description
0:0 secure
0:1 secure
1:0 unsecured
1:1 secure
76543210
R0 0
KEYACC
00000
W
Reset00000000
= Unimplemented or Reserved
Figure 4-7. Flash Configuration Register (FCNFG)
Table 4-10. FCNFG Register Field Descriptions
Field Description
5
KEYACC
Enable Writing of Access Key — This bit enables writing of the backdoor comparison key. For more detailed
information about the backdoor key mechanism, refer to Section 4.6, “Security.”
0 Writes to 0xFFB0–0xFFB7 are interpreted as the start of a flash programming or erase command.
1 Writes to NVBACKKEY (0xFFB0–0xFFB7) are interpreted as comparison key writes.
76543210
R FPS7 FPS6 FPS5 FPS4 FPS3 FPS2 FPS1 FPDIS
W(1) (1) (1) (1) (1) (1) (1) (1)
Reset This register is loaded from nonvolatile location NVPROT during reset.
1Background commands can be used to change the contents of these bits in FPROT.
Figure 4-8. Flash Protection Register (FPROT)
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
62 Freescale Semiconductor
4.7.5 Flash Status Register (FSTAT)
Bits 3, 1, and 0 always read 0 and writes have no meaning or effect. The remaining five bits are status bits
that can be read at any time. Writes to these bits have special meanings that are discussed in the bit
descriptions.
Table 4-11. FPROT Register Field Descriptions
Field Description
7:1
FPS[7:1]
Flash Protect Select Bits — When FPDIS = 0, this 7-bit field determines the ending address of unprotected
flash locations at the high address end of the flash. Protected flash locations cannot be erased or programmed.
0
FPDIS
Flash Protection Disable
0 Flash block specified by FPS[7:1] is block protected (program and erase not allowed).
1 No flash block is protected.
76543210
R
FCBEF
FCCF
FPVIOL FACCERR
0FBLANK0 0
W
Reset11000000
= Unimplemented or Reserved
Figure 4-9. Flash Status Register (FSTAT)
Table 4-12. FSTAT Register Field Descriptions
Field Description
7
FCBEF
Flash Command Buffer Empty Flag — The FCBEF bit is used to launch commands. It also indicates that the
command buffer is empty so that a new command sequence can be executed when performing burst
programming. The FCBEF bit is cleared by writing a one to it or when a burst program command is transferred
to the array for programming. Only burst program commands can be buffered.
0 Command buffer is full (not ready for additional commands).
1 A new burst program command may be written to the command buffer.
6
FCCF
Flash Command Complete Flag — FCCF is set automatically when the command buffer is empty and no
command is being processed. FCCF is cleared automatically when a new command is started (by writing 1 to
FCBEF to register a command). Writing to FCCF has no meaning or effect.
0 Command in progress
1 All commands complete
5
FPVIOL
Protection Violation Flag — FPVIOL is set automatically when FCBEF is cleared to register a command that
attempts to erase or program a location in a protected block (the erroneous command is ignored). FPVIOL is
cleared by writing a 1 to FPVIOL.
0 No protection violation.
1 An attempt was made to erase or program a protected location.
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 63
4.7.6 Flash Command Register (FCMD)
Only five command codes are recognized in normal user modes as shown in Table 4-14. Refer to
Section 4.5.3, “Program and Erase Command Execution,” for a detailed discussion of flash programming
and erase operations.
All other command codes are illegal and generate an access error.
4
FACCERR
Access Error Flag — FACCERR is set automatically when the proper command sequence is not obeyed exactly
(the erroneous command is ignored), if a program or erase operation is attempted before the FCDIV register has
been initialized, or if the MCU enters stop while a command was in progress. For a more detailed discussion of
the exact actions that are considered access errors, see Section 4.5.5, “Access Errors.” FACCERR is cleared by
writing a 1 to FACCERR. Writing a 0 to FACCERR has no meaning or effect.
0 No access error.
1 An access error has occurred.
2
FBLANK
Flash Verified as All Blank (erased) Flag — FBLANK is set automatically at the conclusion of a blank check
command if the entire flash array was verified to be erased. FBLANK is cleared by clearing FCBEF to write a new
valid command. Writing to FBLANK has no meaning or effect.
0 After a blank check command is completed and FCCF = 1, FBLANK = 0 indicates the flash array is not
completely erased.
1 After a blank check command is completed and FCCF = 1, FBLANK = 1 indicates the flash array is completely
erased (all 0xFF).
76543210
R00000000
W FCMD7 FCMD6 FCMD5 FCMD4 FCMD3 FCMD2 FCMD1 FCMD0
Reset00000000
Figure 4-10. Flash Command Register (FCMD)
Table 4-13. FCMD Register Field Descriptions
Field Description
FCMD[7:0] Flash Command Bits — See Ta b l e 4 - 1 4
Table 4-14. Flash Commands
Command FCMD Equate File Label
Blank check 0x05 mBlank
Byte program 0x20 mByteProg
Byte program — burst mode 0x25 mBurstProg
Page erase (512 bytes/page) 0x40 mPageErase
Mass erase (all flash) 0x41 mMassErase
Table 4-12. FSTAT Register Field Descriptions (continued)
Field Description
Chapter 4 Memory
MC9S08JM60 Series Data Sheet, Rev. 3
64 Freescale Semiconductor
It is not necessary to perform a blank check command after a mass erase operation. Only blank check is
required as part of the security unlocking mechanism.
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 65
Chapter 5
Resets, Interrupts, and System Configuration
5.1 Introduction
This chapter discusses basic reset and interrupt mechanisms and the various sources of reset and interrupts
in the MC9S08JM60 series. Some interrupt sources from peripheral modules are discussed in greater detail
within other chapters of this data manual. This chapter gathers basic information about all reset and
interrupt sources in one place for easy reference. A few reset and interrupt sources, including the computer
operating properly (COP) watchdog, are not part of on-chip peripheral systems with their own sections but
are part of the system control logic.
5.2 Features
Reset and interrupt features include:
• Multiple sources of reset for flexible system configuration and reliable operation
• Reset status register (SRS) to indicate source of most recent reset
• Separate interrupt vectors for each module (reduces polling overhead) (see Table 5-1)
5.3 MCU Reset
Resetting the MCU provides a way to start processing from a known set of initial conditions. During reset,
most control and status registers are forced to initial values and the program counter is loaded from the
reset vector (0xFFFE:0xFFFF). On-chip peripheral modules are disabled and I/O pins are initially
configured as general-purpose high-impedance inputs with pullup devices disabled. The I bit in the
condition code register (CCR) is set to block maskable interrupts so the user program has a chance to
initialize the stack pointer (SP) and system control settings. SP is forced to 0x00FF at reset.
The MC9S08JM60 series has seven sources for reset:
• Power-on reset (POR)
• Low-voltage detect (LVD)
• Computer operating properly (COP) timer
• Illegal opcode detect (ILOP)
• Background debug forced reset
• External reset pin (RESET)
• Clock generator loss of lock and loss of clock reset (LOC)
Chapter 5 Resets, Interrupts, and System Configuration
MC9S08JM60 Series Data Sheet, Rev. 3
66 Freescale Semiconductor
Each of these sources, with the exception of the background debug forced reset, has an associated bit in
the system reset status (SRS) register.
5.4 Computer Operating Properly (COP) Watchdog
The COP watchdog is intended to force a system reset when the application software fails to execute as
expected. To prevent a system reset from the COP timer (when it is enabled), application software must
reset the COP counter periodically. If the application program gets lost and fails to reset the COP counter
before it times out, a system reset is generated to force the system back to a known starting point.
After any reset, the COP watchdog is enabled (see Section 5.7.4, “System Options Register 1 (SOPT1),”
for additional information). If the COP watchdog is not used in an application, it can be disabled by
clearing COPT bits in SOPT1.
The COP counter is reset by writing 0x55 and 0xAA (in this order) to the address of SRS during the
selected timeout period. Writes do not affect the data in the read-only SRS. As soon as the write sequence
is done, the COP timeout period is restarted. If the program fails to do this during the time-out period, the
MCU will reset. Also, if any value other than 0x55 or 0xAA is written to SRS, the MCU is immediately
reset.
The COPCLKS bit in SOPT2 (see Section 5.7.5, “System Options Register 2 (SOPT2),” for additional
information) selects the clock source used for the COP timer. The clock source options are either the bus
clock or an internal 1 kHz LPO clock source. With each clock source, there are three associated time-outs
controlled by the COPT bits in SOPT1. Table 5-6 summaries the control functions of the COPCLKS and
COPT bits. The COP watchdog defaults to operation from the 1 kHz LPO clock source and the longest
time-out (210 cycles).
When the bus clock source is selected, windowed COP operation is available by setting COPW in the
SOPT2 register. In this mode, writes to the SRS register to clear the COP timer must occur in the last 25%
of the selected timeout period. A premature write immediately resets the MCU. When the 1 kHz LPO clock
source is selected, windowed COP operation is not available.
The COP counter is initialized by the first writes to the SOPT1 and SOPT2 registers and after any system
reset. Subsequent writes to SOPT1 and SOPT2 have no effect on COP operation. Even if the application
will use the reset default settings of COPT, COPCLKS, and COPW bits, the user must write to the
write-once SOPT1 and SOPT2 registers during reset initialization to lock in the settings. This will prevent
accidental changes if the application program gets lost.
The write to SRS that services (clears) the COP counter must not be placed in an interrupt service routine
(ISR) because the ISR could continue to be executed periodically even if the main application program
fails.
If the bus clock source is selected, the COP counter does not increment while the MCU is in background
debug mode or while the system is in stop mode. The COP counter resumes when the MCU exits
background debug mode or stop mode.
If the 1 kHz LPO clock source is selected, the COP counter is re-initialized to zero upon entry to either
background debug mode or stop mode and begins from zero upon exit from background debug mode or
stop mode.
Chapter 5 Resets, Interrupts, and System Configuration
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 67
5.5 Interrupts
Interrupts provide a way to save the current CPU status and registers, execute an interrupt service routine
(ISR), and then restore the CPU status so processing resumes where it left off before the interrupt. Other
than the software interrupt (SWI), which is a program instruction, interrupts are caused by hardware events
such as an edge on the IRQ pin or a timer-overflow event. The debug module can also generate an SWI
under certain circumstances.
If an event occurs in an enabled interrupt source, an associated read-only status flag will become set. The
CPU will not respond until and unless the local interrupt enable is a logic 1 to enable the interrupt. The
I bit in the CCR is 0 to allow interrupts. The global interrupt mask (I bit) in the CCR is initially set after
reset which masks (prevents) all maskable interrupt sources. The user program initializes the stack pointer
and performs other system setup before clearing the I bit to allow the CPU to respond to interrupts.
When the CPU receives a qualified interrupt request, it completes the current instruction before responding
to the interrupt. The interrupt sequence obeys the same cycle-by-cycle sequence as the SWI instruction
and consists of:
• Saving the CPU registers on the stack
• Setting the I bit in the CCR to mask further interrupts
• Fetching the interrupt vector for the highest-priority interrupt that is currently pending
• Filling the instruction queue with the first three bytes of program information starting from the
address fetched from the interrupt vector locations
While the CPU is responding to the interrupt, the I bit is automatically set to avoid the possibility of
another interrupt interrupting the ISR itself (this is called nesting of interrupts). Normally, the I bit is
restored to 0 when the CCR is restored from the value stacked on entry to the ISR. In rare cases, the I bit
may be cleared inside an ISR (after clearing the status flag that generated the interrupt) so that other
interrupts can be serviced without waiting for the first service routine to finish. This practice is not
recommended for anyone other than the most experienced programmers because it can lead to subtle
program errors that are difficult to debug.
The interrupt service routine ends with a return-from-interrupt (RTI) instruction which restores the CCR,
A, X, and PC registers to their pre-interrupt values by reading the previously saved information off the
stack.
NOTE
For compatibility with the M68HC08, the H register is not automatically
saved and restored. It is good programming practice to push H onto the stack
at the start of the interrupt service routine (ISR) and restore it immediately
before the RTI that is used to return from the ISR.
When two or more interrupts are pending when the I bit is cleared, the highest priority source is serviced
first (see Table 5-1).
Chapter 5 Resets, Interrupts, and System Configuration
MC9S08JM60 Series Data Sheet, Rev. 3
68 Freescale Semiconductor
5.5.1 Interrupt Stack Frame
Figure 5-1 shows the contents and organization of a stack frame. Before the interrupt, the stack pointer
(SP) points at the next available byte location on the stack. The current values of CPU registers are stored
on the stack starting with the low-order byte of the program counter (PCL) and ending with the CCR. After
stacking, the SP points at the next available location on the stack which is the address that is one less than
the address where the CCR was saved. The PC value that is stacked is the address of the instruction in the
main program that would have executed next if the interrupt had not occurred.
Figure 5-1. Interrupt Stack Frame
When an RTI instruction is executed, these values are recovered from the stack in reverse order. As part
of the RTI sequence, the CPU fills the instruction pipeline by reading three bytes of program information,
starting from the PC address recovered from the stack.
The status flag causing the interrupt must be acknowledged (cleared) before returning from the ISR.
Typically, the flag must be cleared at the beginning of the ISR so that if another interrupt is generated by
this same source, it will be registered so it can be serviced after completion of the current ISR.
5.5.2 External Interrupt Request (IRQ) Pin
External interrupts are managed by the IRQSC status and control register. When the IRQ function is
enabled, synchronous logic monitors the pin for edge-only or edge-and-level events. When the MCU is in
stop mode and system clocks are shut down, a separate asynchronous path is used so the IRQ (if enabled)
can wake the MCU.
5.5.2.1 Pin Configuration Options
The IRQ pin enable (IRQPE) control bit in IRQSC must be 1 in order for the IRQ pin to act as the interrupt
request (IRQ) input. As an IRQ input, the user can choose the polarity of edges or levels detected
(IRQEDG), whether the pin detects edges-only or edges and levels (IRQMOD), and whether an event
causes an interrupt or only sets the IRQF flag which can be polled by software.
CONDITION CODE REGISTER
ACCUMULATOR
INDEX REGISTER (LOW BYTE X)
PROGRAM COUNTER HIGH
* High byte (H) of index register is not automatically stacked.
*
PROGRAM COUNTER LOW
70
UNSTACKING
ORDER
STACKING
ORDER
5
4
3
2
1
1
2
3
4
5
TOWARD LOWER ADDRESSES
TOWARD HIGHER ADDRESSES
SP BEFORE
SP AFTER
INTERRUPT STACKING
THE INTERRUPT
Chapter 5 Resets, Interrupts, and System Configuration
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 69
The IRQ pin, when enabled, defaults to use an internal pull device (IRQPDD = 0), the device is a pullup
or pull-down depending on the polarity chosen. If the user desires to use an external pullup or pull-down,
the IRQPDD can be written to a 1 to turn off the internal device.
BIH and BIL instructions may be used to detect the level on the IRQ pin when the pin is configured to act
as the IRQ input.
NOTE
This pin does not contain a clamp diode to VDD and must not be driven
above VDD. The voltage measured on the internally pulled up IRQ pin may
be as low as VDD – 0.7 V. The internal gates connected to this pin are pulled
all the way to VDD.
5.5.2.2 Edge and Level Sensitivity
The IRQMOD control bit re-configure the detection logic so it detects edge events and pin levels. In this
edge detection mode, the IRQF status flag becomes set when an edge is detected (when the IRQ pin
changes from the deasserted to the asserted level), but the flag is continuously set (and cannot be cleared)
as long as the IRQ pin remains at the asserted level.
5.5.3 Interrupt Vectors, Sources, and Local Masks
Table 5-1 provides a summary of all interrupt sources. Higher-priority sources are located toward the
bottom of the table. The high-order byte of the address for the interrupt service routine is located at the
first address in the vector address column, and the low-order byte of the address for the interrupt service
routine is located at the next higher address.
When an interrupt condition occurs, an associated flag bit becomes set. If the associated local interrupt
enable is 1, an interrupt request is sent to the CPU. Within the CPU, if the global interrupt mask (I bit in
the CCR) is 0, the CPU will finish the current instruction, stack the PCL, PCH, X, A, and CCR CPU
registers, set the I bit, and then fetch the interrupt vector for the highest priority pending interrupt.
Processing then continues in the interrupt service routine.
Table 5-1. Vector Summary (from Lowest to Highest Priority)
Vector
Number
Address
(High/Low) Vector Name Module Source Enable Description
31 to 30 0xFFC0:FFC1
0xFFC2:FFC3
Unused vector space (available for user program)
29 0xFFC4:FFC5 Vrtc System
control
RTIF RTIE RTC real-time interrupt
28 0xFFC6:FFC7 Viic IIC IICIF IICIE IIC
27 0xFFC8:FFC9 Vacmp ACMP ACF ACIE ACMP
26 0xFFCA:FFCB Vadc ADC COCO AIEN ADC
25 0xFFCC:FFCD Vkeyboard KBI KBF KBIE Keyboard pins
24 0xFFCE:FFCF Vsci2tx SCI2 TDRE
TC
T I E
TCIE
SCI2 transmit
Chapter 5 Resets, Interrupts, and System Configuration
MC9S08JM60 Series Data Sheet, Rev. 3
70 Freescale Semiconductor
23 0xFFD0:FFD1 Vsci2rx SCI2 IDLE
RDRF
I L I E
RI E
SCI2 receive
22 0xFFD2:FFD3 Vsci2err SCI2 OR
NF
FE
PF
O R I E
N F I E
F E I E
PFIE
SCI2 error
21 0xFFD4:FFD5 Vsci1tx SCI1 TDRE
TC
T I E
TCIE
SCI1 transmit
20 0xFFD6:FFD7 Vsci1rx SCI1 IDLE
RDRF
I L I E
RI E
SCI1 receive
19 0xFFD8:FFD9 Vsci1err SCI1 OR
NF
FE
PF
O R I E
N F I E
F E I E
PFIE
SCI1 error
18 0xFFDA:FFDB Vtpm2ovf TPM2 TOF TOIE TPM2 overflow
17 0xFFDC:FFDD Vtpm2ch1 TPM2 CH1F CH1IE TPM2 channel 1
16 0xFFDE:FFDF Vtpm2ch0 TPM2 CH0F CH0IE TPM2 channel 0
15 0xFFE0:FFE1 Vtpm1ovf TPM1 TOF TOIE TPM1 overflow
14 0xFFE2:FFE3 Vtpm1ch5 TPM1 CH5F CH5IE TPM1 channel 5
13 0xFFE4:FFE5 Vtpm1ch4 TPM1 CH4F CH4IE TPM1 channel 4
12 0xFFE6:FFE7 Vtpm1ch3 TPM1 CH3F CH3IE TPM1 channel 3
11 0xFFE8:FFE9 Vtpm1ch2 TPM1 CH2F CH2IE TPM1 channel 2
10 0xFFEA:FFEB Vtpm1ch1 TPM1 CH1F CH1IE TPM1 channel 1
9 0xFFEC:FFED Vtpm1ch0 TPM1 CH0F CH0IE TPM1 channel 0
8 0xFFEE:FFEF Reserved — — — —
7 0xFFF0:FFF1 Vusb USB STALLF
RESUMEF
SLEEPF
TOKDNEF
SOFTOKF
ERRORF
USBRSTF
STALL
RESUME
SLEEP
TOKDNE
SOFTOK
ERROR
USBRST
USB Status
6 0xFFF2:FFF3 Vspi2 SPI2 SPRF
MODF
SPTEF
SPMF
S P I E
SP IE
S PTI E
SPMIE
SPI2
5 0xFFF4:FFF5 Vspi1 SPI1 SPRF
MODF
SPTEF
SPMF
S P I E
SP IE
S PTI E
SPMIE
SPI1
4 0xFFF6:FFF7 Vlol MCG LOLS LOLIE MCG loss of lock
3 0xFFF8:FFF9 Vlvd System
control
LVWF LVWIE Low-voltage detect
2 0xFFFA:FFFB Virq IRQ IRQF IRQIE IRQ pin
Table 5-1. Vector Summary (from Lowest to Highest Priority) (continued)
Vector
Number
Address
(High/Low) Vector Name Module Source Enable Description
Chapter 5 Resets, Interrupts, and System Configuration
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 71
5.6 Low-Voltage Detect (LVD) System
The MC9S08JM60 series includes a system to protect against low-voltage conditions in order to protect
memory contents and control MCU system states during supply voltage variations. The system is
comprised of a power-on reset (POR) circuit and a LVD circuit with trip voltages for warning and
detection. The LVD circuit is enabled when LVDE in SPMSC1 is set to 1. The LVD is disabled upon
entering any of the stop modes unless LVDSE is set in SPMSC1. If LVDSE and LVDE are both set, then
the MCU cannot enter stop2 (it will enter stop3 instead), and the current consumption in stop3 with the
LVD enabled will be higher.
5.6.1 Power-On Reset Operation
When power is initially applied to the MCU, or when the supply voltage drops below the power-on reset
rearm voltage level, VPOR, the POR circuit will cause a reset condition. As the supply voltage rises, the
LVD circuit will hold the MCU in reset until the supply has risen above the low voltage detection low
threshold, VLVDL. Both the POR bit and the LVD bit in SRS are set following a POR.
5.6.2 Low-Voltage Detection (LVD) Reset Operation
The LVD can be configured to generate a reset upon detection of a low voltage condition by setting
LVDRE to 1. The low voltage detection threshold is determined by the LVDV bit. After an LVD reset has
occurred, the LVD system will hold the MCU in reset until the supply voltage has risen above the low
voltage detection threshold. The LVD bit in the SRS register is set following either an LVD reset or POR.
5.6.3 Low-Voltage Warning (LVW) Interrupt Operation
The LVD system has a low voltage warning flag to indicate to the user that the supply voltage is
approaching the low voltage condition. When a low voltage warning condition is detected and is
configured for interrupt operation (LVWIE set to 1), LVWF in SPMSC1 will be set and an LVW interrupt
request will occur.
1 0xFFFC:FFFD Vswi Core SWI Instruction — Software interrupt
0 0xFFFE:FFFF Vreset System
control
COP
LVD
RESET pin
Illegal opcode
LOC
POR
BDFR
C O P E
LVDRE
—
ILOP
C ME
POR
BDFR
Watchdog timer
Low-voltage detect
Exter nal pin
Illegal opcode
Loss of clock
Power-on-reset
BDM-forced reset
Table 5-1. Vector Summary (from Lowest to Highest Priority) (continued)
Vector
Number
Address
(High/Low) Vector Name Module Source Enable Description
Chapter 5 Resets, Interrupts, and System Configuration
MC9S08JM60 Series Data Sheet, Rev. 3
72 Freescale Semiconductor
5.7 Reset, Interrupt, and System Control Registers and Control Bits
One 8-bit register in the direct page register space and eight 8-bit registers in the high-page register space
are related to reset and interrupt systems.
Refer to the direct-page register summary in Chapter 4, “Memory,” of this data sheet for the absolute
address assignments for all registers. This section refers to registers and control bits only by their names.
A Freescale-provided equate or header file is used to translate these names into the appropriate absolute
addresses.
Some control bits in the SOPT1 and SPMSC2 registers are related to modes of operation. Although brief
descriptions of these bits are provided here, the related functions are discussed in greater detail in
Chapter 3, “Modes of Operation.”
5.7.1 Interrupt Pin Request Status and Control Register (IRQSC)
This direct page register includes status and control bits, which are used to configure the IRQ function,
report status, and acknowledge IRQ events.
76543210
R0
IRQPDD IRQEDG IRQPE
IRQF 0
IRQIE IRQMOD
W IRQACK
Reset00000000
= Unimplemented or Reserved
Figure 5-2. Interrupt Request Status and Control Register (IRQSC)
Table 5-2. IRQSC Register Field Descriptions
Field Description
6
IRQPDD
Interrupt Request (IRQ) Pull Device Disable — This read/write control bit is used to disable the internal pullup
device when the IRQ pin is enabled (IRQPE = 1) allowing for an external device to be used.
0 IRQ pull device enabled if IRQPE = 1.
1 IRQ pull device disabled if IRQPE = 1.
5
IRQEDG
Interrupt Request (IRQ) Edge Select — This read/write control bit is used to select the polarity of edges or
levels on the IRQ pin that cause IRQF to be set. The IRQMOD control bit determines whether the IRQ pin is
sensitive to both edges and levels or only edges. When the IRQ pin is enabled as the IRQ input and is configured
to detect rising edges, the optional pullup resistor is re-configured as an optional pulldown resistor.
0 IRQ is falling edge or falling edge/low-level sensitive.
1 IRQ is rising edge or rising edge/high-level sensitive.
4
IRQPE
IRQ Pin Enable — This read/write control bit enables the IRQ pin function. When this bit is set the IRQ pin can
be used as an interrupt request.
0 IRQ pin function is disabled.
1 IRQ pin function is enabled.
3
IRQF
IRQ Flag — This read-only status bit indicates when an interrupt request event has occurred.
0 No IRQ request.
1 IRQ event detected.
Chapter 5 Resets, Interrupts, and System Configuration
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 73
5.7.2 System Reset Status Register (SRS)
This register includes seven read-only status flags to indicate the source of the most recent reset. When a
debug host forces reset by writing 1 to BDFR in the SBDFR register, none of the status bits in SRS will
be set. Writing any value except 0x55 and 0xAA in sequence to this register address causes the MCU reset
with the source of COP. The reset state of these bits depends on what caused the MCU to reset.
2
IRQACK
IRQ Acknowledge — This write-only bit is used to acknowledge interrupt request events (write 1 to clear IRQF).
Writing 0 has no meaning or effect. Reads always return 0. If edge-and-level detection is selected (IRQMOD = 1),
IRQF cannot be cleared while the IRQ pin remains at its asserted level.
1
IRQIE
IRQ Interrupt Enable — This read/write control bit determines whether IRQ events generate an interrupt
request.
0 Interrupt request when IRQF set is disabled (use polling).
1 Interrupt requested whenever IRQF = 1.
0
IRQMOD
IRQ Detection Mode — This read/write control bit selects either edge-only detection or edge-and-level
detection. See Section 5.5.2.2, “Edge and Level Sensitivity,” for more details.
0 IRQ event on falling/rising edges only.
1 IRQ event on falling/rising edges and low/high levels.
76543210
R POR PIN COP ILOP 0 LOC LVD —
W Writing any value to SRS address clears COP watchdog timer.
POR10000010
LVR:U0000010
Any other
reset:
0(1) (1) (1) 0(1) 00
U = Unaffected by reset
1Any of these reset sources that are active at the time of reset will cause the corresponding bit(s) to be set; bits corresponding
to sources that are not active at the time of reset will be cleared.
Figure 5-3. System Reset Status (SRS)
Table 5-3. SRS Register Field Descriptions
Field Description
7
POR
Power-On Reset — Reset was caused by the power-on detection logic. Because the internal supply voltage was
ramping up at the time, the low-voltage reset (LVR) status bit is also set to indicate that the reset occurred while
the internal supply was below the LVR threshold.
0 Reset not caused by POR.
1 POR caused reset.
6
PIN
External Reset Pin — Reset was caused by an active-low level on the external reset pin.
0 Reset not caused by external reset pin.
1 Reset came from external reset pin.
Table 5-2. IRQSC Register Field Descriptions (continued)
Field Description
Chapter 5 Resets, Interrupts, and System Configuration
MC9S08JM60 Series Data Sheet, Rev. 3
74 Freescale Semiconductor
5.7.3 System Background Debug Force Reset Register (SBDFR)
This register contains a single write-only control bit. A serial background command such as
WRITE_BYTE must be used to write to SBDFR. Attempts to write this register from a user program are
ignored. Reads always return 0x00.
5.7.4 System Options Register 1 (SOPT1)
This register may be read at any time. Bits 3 and 2 are unimplemented and always read 0. This is a
write-once register so only the first write after reset is honored. Any subsequent attempt to write to SOPT
(intentionally or unintentionally) is ignored to avoid accidental changes to these sensitive settings. SOPT
5
COP
Computer Operating Properly (COP) Watchdog — Reset was caused by the COP watchdog timer timing out.
This reset source may be blocked by COPE = 0.
0 Reset not caused by COP timeout.
1 Reset caused by COP timeout.
4
ILOP
Illegal Opcode — Reset was caused by an attempt to execute an unimplemented or illegal opcode. The STOP
instruction is considered illegal if stop is disabled by STOPE = 0 in the SOPT register. The BGND instruction is
considered illegal if active background mode is disabled by ENBDM = 0 in the BDCSC register.
0 Reset not caused by an illegal opcode.
1 Reset caused by an illegal opcode.
2
LOC
Loss-of-Clock Reset — Reset was caused by a loss of external clock.
0 Reset not caused by a loss of external clock.
1 Reset caused by a loss of external clock.
1
LVD
Low Voltage Detect — If the LVD is enable with the LVDRE or LVDSE bit is set, and the supply drops below the
LVD trip voltage, an LVD reset will occur. This bit is also set by POR.
0 Reset not caused by LVD trip or POR.
1 Reset caused by LVD trip or POR.
76543210
R00000000
WBDFR1
Reset00000000
= Unimplemented or Reserved
1BDFR is writable only through serial background debug commands, not from user programs.
Figure 5-4. System Background Debug Force Reset Register (SBDFR)
Table 5-4. SBDFR Register Field Descriptions
Field Description
0
BDFR
Background Debug Force Reset — A serial background command such as WRITE_BYTE may be used to
allow an external debug host to force a target system reset. Writing logic 1 to this bit forces an MCU reset. This
bit cannot be written from a user program.
Table 5-3. SRS Register Field Descriptions (continued)
Field Description
Chapter 5 Resets, Interrupts, and System Configuration
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 75
must be written during the user’s reset initialization program to set the desired controls even if the desired
settings are the same as the reset settings.
76543210
R
COPT STOPE
00
W
Reset11010011
= Unimplemented or Reserved
Figure 5-5. System Options Register (SOPT1)
Table 5-5. SOPT1 Register Field Descriptions
Field Description
7:6
COPT[1:0]
COP Watchdog Timeout — These write-once bits select the timeout period of the COP. COPT along with
COPCLKS in SOPT2 defines the COP timeout period. See Ta b l e 5 - 6 .
5
STOPE
Stop Mode Enable — This write-once bit defaults to 0 after reset, which disables stop mode. If stop mode is
disabled and a user program attempts to execute a STOP instruction, an illegal opcode reset is forced.
0 Stop mode disabled.
1 Stop mode enabled.
Table 5-6. COP Configuration Options
Control Bits
Clock Source COP Window1 Opens
(COPW = 1)
1Windowed COP operation requires the user to clear the COP timer in the last 25% of the selected timeout period. This column
displays the minimum number of clock counts required before the COP timer can be reset when in windowed COP mode
(COPW = 1).
COP Overflow Count
COPCLKS COPT[1:0]
N/A 0:0 N/A N/A COP is disabled
0 0:1 1 kHz LPO
clock N/A 25 cycles (32 ms2)
2Values shown in milliseconds based on tLPO = 1 ms. See tLPO in the appendix Section A.12.1, “Control Timing,” for the
tolerance of this value.
0 1:0 1 kHz LPO
clock N/A 28 cycles (256 ms1)
0 1:1 1 kHz LPO
clock N/A 210 cycles (1.024 s1)
10:1
BUSCLK 6144 cycles 213 cycles
11:0
BUSCLK 49,152 cycles 216 cycles
11:1
BUSCLK 196,608 cycles 218 cycles
Chapter 5 Resets, Interrupts, and System Configuration
MC9S08JM60 Series Data Sheet, Rev. 3
76 Freescale Semiconductor
5.7.5 System Options Register 2 (SOPT2)
5.7.6 System Device Identification Register (SDIDH, SDIDL)
This read-only register is included so host development systems can identify the HCS08 derivative and
revision number. This allows the development software to recognize where specific memory blocks,
registers, and control bits are located in a target MCU.
76543210
R
COPCLKS1COPW1000
SPI1FE SPI2FE ACIC
W
Reset00000110
= Unimplemented or Reserved
1This bit can be written only one time after reset. Additional writes are ignored.
Figure 5-6. System Options Register 2 (SOPT2)
Table 5-7. SOPT2 Register Field Descriptions
Field Description
7
COPCLKS
COP Watchdog Clock Select — This write-once bit selects the clock source of the COP watchdog.
0 Internal 1 kHz LPO clock is source to COP.
1 Bus clock is source to COP.
6
COPW
COP Window — This write-once bit selects the COP operation mode. When set, the 0x55-0xAA write sequence
to the SRS register must occur in the last 25% of the selected period. Any write to the SRS register during the
first 75% of the selected period will reset the MCU.
0 Normal COP operation.
1 Window COP operation.
2
SPI1FE
SPI1 Ports Input Filter Enable
0 Disable input filter on SPI1 port pins to allow for higher maximum SPI baud rate.
1 Enable input filter on SPI1 port pins to eliminate noise and restrict maximum SPI baud rate.
1
SPI2FE
SPI2 Ports Input Filter Enable
0 Disable input filter on SPI2 port pins to allow for higher maximum SPI baud rate.
1 Enable input filter on SPI2 port pins to eliminate noise and restrict maximum SPI baud rate.
0
ACIC
Analog Comparator to Input Capture Enable— This bit connects the output of ACMP to TPM input channel 0.
0 ACMP output not connected to TPM input channel 0.
1 ACMP output connected to TPM input channel 0.
76543210
RID11 ID10 ID9 ID8
W
Reset ———— 0000
= Unimplemented or Reserved
Figure 5-7. System Device Identification Register — High (SDIDH)
Chapter 5 Resets, Interrupts, and System Configuration
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 77
5.7.7 System Power Management Status and Control 1 Register
(SPMSC1)
This high page register contains status and control bits to support the low-voltage detect function, and to
enable the bandgap voltage reference for use by the ADC module. This register must be written during the
user’s reset initialization program to set the desired controls even if the desired settings are the same as the
reset settings.
Table 5-8. SDIDH Register Field Descriptions
Field Description
7:4
Reserved
Bits 7:4 are reserved. Reading these bits will result in an indeterminate value; writes have no effect.
3:0
ID[11:8]
Part Identification Number — Each derivative in the HCS08 Family has a unique identification number. The
MC9S08JM60 Series is hard coded to the value 0x016. See also ID bits in Tabl e 5- 9 .
76543210
R ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0
W
Reset00010110
= Unimplemented or Reserved
Figure 5-8. System Device Identification Register — Low (SDIDL)
Table 5-9. SDIDL Register Field Descriptions
Field Description
7:0
ID[7:0]
Part Identification Number — Each derivative in the HCS08 Family has a unique identification number. The
MC9S08JM60 Series is hard coded to the value 0x016. See also ID bits in Tabl e 5- 8 .
76543210
RLVWF
10
LVWI E LVD RE 2LVD SE LV DE20
BGBE
WLVWAC K
Reset:00011100
= Unimplemented or Reserved
1LVWF will be set in the case when VSupply transitions below the trip point or after reset and VSupply is already below VLVW.
2This bit can be written only one time after reset. Additional writes are ignored.
Figure 5-9. System Power Management Status and Control 1 Register (SPMSC1)
Chapter 5 Resets, Interrupts, and System Configuration
MC9S08JM60 Series Data Sheet, Rev. 3
78 Freescale Semiconductor
5.7.8 System Power Management Status and Control 2 Register
(SPMSC2)
This register is used to report the status of the low voltage warning function, and to configure the stop
mode behavior of the MCU.
Table 5-10. SPMSC1 Register Field Descriptions
Field Description
7
LVWF
Low-Voltage Warning Flag — The LVWF bit indicates the low-voltage warning status.
0 low-voltage warning is not present.
1 low-voltage warning is present or was present.
6
LVWAC K
Low-Voltage Warning Acknowledge — If LVWF = 1, a low-voltage condition has occurred. To acknowledge this
low-voltage warning, write 1 to LVWACK, which will automatically clear LVWF to 0 if the low-voltage warning is
no longer present.
5
LVWI E
Low-Voltage Warning Interrupt Enable — This bit enables hardware interrupt requests for LVWF.
0 Hardware interrupt disabled (use polling).
1 Request a hardware interrupt when LVWF = 1.
4
LVDRE
Low-Voltage Detect Reset Enable — This write-once bit enables LVD events to generate a hardware reset
(provided LVDE = 1).
0 LVD events do not generate hardware resets.
1 Force an MCU reset when an enabled low-voltage detect event occurs.
3
LVDSE
Low-Voltage Detect Stop Enable — Provided LVDE = 1, this read/write bit determines whether the low-voltage
detect function operates when the MCU is in stop mode.
0 Low-voltage detect disabled during stop mode.
1 Low-voltage detect enabled during stop mode.
2
LVDE
Low-Voltage Detect Enable — This write-once bit enables low-voltage detect logic and qualifies the operation
of other bits in this register.
0 LVD logic disabled.
1 LVD logic enabled.
0
BGBE
Bandgap Buffer Enable — This bit enables an internal buffer for the bandgap voltage reference for use by
ACMP or ADC module on one of its internal channels.
0 Bandgap buffer disabled.
1 Bandgap buffer enabled.
76543 210
R0 0
LVDV LV WV
PPDF 0 0
PPDC1
WPPDACK
Power-on Reset:00000 000
LVD Reset:00uu0 000
Any other Reset: 0 0 u u 0 0 0 0
= Unimplemented or Reserved u = Unaffected by reset
1This bit can be written only one time after reset. Additional writes are ignored.
Figure 5-10. System Power Management Status and Control 2 Register (SPMSC2)
Chapter 5 Resets, Interrupts, and System Configuration
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 79
Table 5-11. SPMSC2 Register Field Descriptions
Field Description
5
LVDV
Low-Voltage Detect Voltage Select — This bit selects the low voltage detect (LVD) trip point setting.It also
selects the warning voltage range. See Ta b le 5 - 1 2 .
4
LVWV
Low-Voltage Warning Voltage Select — This bit selects the low voltage warning (LVW) trip point voltage. See
Ta b le 5 - 1 2.
3
PPDF
Partial Power Down Flag — This read-only status bit indicates that the MCU has recovered from stop2 mode.
0 MCU has not recovered from stop2 mode.
1 MCU recovered from stop2 mode.
2
PPDACK
Partial Power Down Acknowledge — Writing a 1 to PPDACK clears the PPDF bit
0
PPDC
Partial Power Down Control — This write-once bit controls whether stop2 or stop3 mode is selected.
0 Stop3 mode enabled.
1 Stop2, partial power down, mode enabled.
Table 5-12. LVD and LVW trip point typical values1
1See Appendix A, “Electrical Characteristics,” for minimum and maximum values.
LVDV:LVWV LVW Trip Point LVD Trip Point
0:0 VLVW 0 = 2.74 V VLVD 0 = 2.56 V
0:1 VLVW 1 = 2.92 V
1:0 VLVW 2 = 4.3 V VLVD1 = 4.0 V
1:1 VLVW 3 = 4.6 V
Chapter 5 Resets, Interrupts, and System Configuration
MC9S08JM60 Series Data Sheet, Rev. 3
80 Freescale Semiconductor
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 81
Chapter 6
Parallel Input/Output
6.1 Introduction
This chapter explains software controls related to parallel input/output (I/O). The MC9S08JM60 has seven
I/O ports which include a total of 51 general-purpose I/O pins. See Chapter 2, “Pins and Connections,” for
more information about the logic and hardware aspects of these pins.
Not all pins are available on all devices. See Table 2-1 to determine which functions are available for a
specific device.
Many of the I/O pins are shared with on-chip peripheral functions, as shown in Table 2-1. The peripheral
modules have priority over the I/Os, so when a peripheral is enabled, the I/O functions are disabled.
After reset, the shared peripheral functions are disabled so that the pins are controlled by the parallel I/O.
All of the parallel I/O are configured as inputs (PTxDDn = 0). The pin control functions for each pin are
configured as follows: slew rate control enabled (PTxSEn = 1), low drive strength selected (PTxDSn = 0),
and internal pullups disabled (PTxPEn = 0).
NOTE
Not all general-purpose I/O pins are available on all packages. To avoid
extra current drain from floating input pins, the user’s reset initialization
routine in the application program must either enable on-chip pullup devices
or change the direction of unconnected pins to outputs so the pins do not
float.
6.2 Port Data and Data Direction
Reading and writing of parallel I/O is done through the port data registers. The direction, input or output,
is controlled through the port data direction registers. The parallel I/O port function for an individual pin
is illustrated in the block diagram below.
Chapter 6 Parallel Input/Output
MC9S08JM60 Series Data Sheet, Rev. 3
82 Freescale Semiconductor
Figure 6-1. Parallel I/O Block Diagram
The data direction control bits determine whether the pin output driver is enabled, and they control what
is read for port data register reads. Each port pin has a data direction register bit. When PTxDDn = 0, the
corresponding pin is an input and reads of PTxD return the pin value. When PTxDDn = 1, the
corresponding pin is an output and reads of PTxD return the last value written to the port data register.
When a peripheral module or system function is in control of a port pin, the data direction register bit still
controls what is returned for reads of the port data register, even though the peripheral system has
overriding control of the actual pin direction.
When a shared analog function is enabled for a pin, all digital pin functions are disabled. A read of the port
data register returns a value of 0 for any bits which have shared analog functions enabled. In general,
whenever a pin is shared with both an alternate digital function and an analog function, the analog function
has priority such that if both the digital and analog functions are enabled, the analog function controls the
pin.
It is a good programming practice to write to the port data register before changing the direction of a port
pin to become an output. This ensures that the pin will not be driven momentarily with an old data value
that happened to be in the port data register.
6.3 Pin Control
The pin control registers are located in the high page register block of the memory. These registers are used
to control pullups, slew rate, and drive strength for the I/O pins. The pin control registers operate
independently of the parallel I/O registers.
QD
QD
1
0
Port Read
PTxDDn
PTxDn
Output Enable
Output Data
Input Data
Synchronizer
Data
BUSCLK
Chapter 6 Parallel Input/Output
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 83
6.3.1 Internal Pullup Enable
An internal pullup device can be enabled for each port pin by setting the corresponding bit in one of the
pullup enable registers (PTxPEn). The pullup device is disabled if the pin is configured as an output by the
parallel I/O control logic or any shared peripheral function regardless of the state of the corresponding
pullup enable register bit. The pullup device is also disabled if the pin is controlled by an analog function.
6.3.2 Output Slew Rate Control Enable
Slew rate control can be enabled for each port pin by setting the corresponding bit in one of the slew rate
control registers (PTxSEn). When enabled, slew control limits the rate at which an output can transition in
order to reduce EMC emissions. Slew rate control has no effect on pins which are configured as inputs.
6.3.3 Output Drive Strength Select
An output pin can be selected to have high output drive strength by setting the corresponding bit in one of
the drive strength select registers (PTxDSn). When high drive is selected a pin is capable of sourcing and
sinking greater current. Even though every I/O pin can be selected as high drive, the user must ensure that
the total current source and sink limits for the chip are not exceeded. Drive strength selection is intended
to affect the DC behavior of I/O pins. However, the AC behavior is also affected. High drive allows a pin
to drive a greater load with the same switching speed as a low drive enabled pin into a smaller load.
Because of this the EMC emissions may be affected by enabling pins as high drive.
6.4 Pin Behavior in Stop Modes
Depending on the stop mode, I/O functions differently as the result of executing a STOP instruction. An
explanation of I/O behavior for the various stop modes follows:
• Stop2 mode is a partial power-down mode, whereby I/O latches are maintained in their state as
before the STOP instruction was executed. CPU register status and the state of I/O registers must
be saved in RAM before the STOP instruction is executed to place the MCU in stop2 mode. Upon
recovery from stop2 mode, before accessing any I/O, the user must examine the state of the PPDF
bit in the SPMSC2 register. If the PPDF bit is 0, I/O must be initialized as if a power on reset had
occurred. If the PPDF bit is 1, I/O data previously stored in RAM, before the STOP instruction was
executed, peripherals may require being initialized and restored to their pre-stop condition. The
user must then write a 1 to the PPDACK bit in the SPMSC2 register. Access to I/O is now permitted
again in the user’s application program.
• In stop3 mode, all I/O is maintained because internal logic circuity stays powered up. Upon
recovery, normal I/O function is available to the user.
6.5 Parallel I/O and Pin Control Registers
This section provides information about the registers associated with the parallel I/O ports and pin control
functions. These parallel I/O registers are located in page zero of the memory map and the pin control
registers are located in the high page register section of memory.
Chapter 6 Parallel Input/Output
MC9S08JM60 Series Data Sheet, Rev. 3
84 Freescale Semiconductor
Refer to tables in Chapter 4, “Memory,” for the absolute address assignments for all parallel I/O and pin
control registers. This section refers to registers and control bits only by their names. A Freescale-provided
equate or header file normally is used to translate these names into the appropriate absolute addresses.
6.5.1 Port A I/O Registers (PTAD and PTADD)
Port A parallel I/O function is controlled by the registers listed below.
6.5.2 Port A Pin Control Registers (PTAPE, PTASE, PTADS)
In addition to the I/O control, port A pins are controlled by the registers listed below.
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PTAD5 PTAD4 PTAD3 PTAD2 PTAD1 PTAD0
W
Reset00000000
Figure 6-2. Port A Data Register (PTAD)
Table 6-1. PTAD Register Field Descriptions
Field Description
5:0
PTAD[5:0]
Port A Data Register Bits — For port A pins that are inputs, reads return the logic level on the pin. For port A
pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port A pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTAD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures
all port pins as high-impedance inputs with pullups disabled.
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PTADD5 PTADD4 PTADD3 PTADD2 PTADD1 PTADD0
W
Reset00000000
Figure 6-3. Data Direction for Port A Register (PTADD)
Table 6-2. PTADD Register Field Descriptions
Field Description
5:0
PTADD[5:0]
Data Direction for Port A Bits — These read/write bits control the direction of port A pins and what is read for
PTAD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port A bit n and PTAD reads return the contents of PTADn.
Chapter 6 Parallel Input/Output
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 85
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PTAPE5 PTAPE4 PTAPE3 PTAPE2 PTAPE1 PTAPE0
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Reset00000000
Figure 6-4. Internal Pullup Enable for Port A (PTAPE)
Table 6-3. PTADD Register Field Descriptions
Field Description
[5:0]
PTAPE[5:0]
Internal Pullup Enable for Port A Bits — Each of these control bits determines if the internal pullup device is
enabled for the associated PTA pin. For port A pins that are configured as outputs, these bits have no effect and
the internal pullup devices are disabled.
0 Internal pullup device disabled for port A bit n.
1 Internal pullup device enabled for port A bit n.
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PTASE5 PTASE4 PTASE3 PTASE2 PTASE1 PTASE0
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Reset00111111
Figure 6-5. Output Slew Rate Control Enable for Port A (PTASE)
Table 6-4. PTASE Register Field Descriptions
Field Description
5:0
PTASE[5:0]
Output Slew Rate Control Enable for Port A Bits — Each of these control bits determine whether output slew
rate control is enabled for the associated PTA pin. For port A pins that are configured as inputs, these bits have
no effect.
0 Output slew rate control disabled for port A bit n.
1 Output slew rate control enabled for port A bit n.
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PTADS5 PTADS4 PTADS3 PTADS2 PTADS1 PTADS0
W
Reset00000000
Figure 6-6. Output Drive Strength Selection for Port A (PTASE)
Table 6-5. PTASE Register Field Descriptions
Field Description
5:0
PTADS[5:0]
Output Drive Strength Selection for Port A Bits — Each of these control bits selects between low and high
output drive for the associated PTA pin.
0 Low output drive enabled for port A bit n.
1 High output drive enabled for port A bit n.
Chapter 6 Parallel Input/Output
MC9S08JM60 Series Data Sheet, Rev. 3
86 Freescale Semiconductor
6.5.3 Port B I/O Registers (PTBD and PTBDD)
Port B parallel I/O function is controlled by the registers listed below.
6.5.4 Port B Pin Control Registers (PTBPE, PTBSE, PTBDS)
In addition to the I/O control, port B pins are controlled by the registers listed below.
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PTBD7 PTBD6 PTBD5 PTBD4 PTBD3 PTBD2 PTBD1 PTBD0
W
Reset00000000
Figure 6-7. Port B Data Register (PTBD)
Table 6-6. PTBD Register Field Descriptions
Field Description
7:0
PTBD[7:0]
Port B Data Register Bits — For port B pins that are inputs, reads return the logic level on the pin. For port B
pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port B pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTBD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures
all port pins as high-impedance inputs with pullups disabled.
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PTBDD7 PTBDD6 PTBDD5 PTBDD4 PTBDD3 PTBDD2 PTBDD1 PTBDD0
W
Reset00000000
Figure 6-8. Data Direction for Port B (PTBDD)
Table 6-7. PTBDD Register Field Descriptions
Field Description
7:0
PTBDD[7:0]
Data Direction for Port B Bits — These read/write bits control the direction of port B pins and what is read for
PTBD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port B bit n and PTBD reads return the contents of PTBDn.
Chapter 6 Parallel Input/Output
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 87
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PTBPE7 PTBPE6 PTBPE5 PTBPE4 PTBPE3 PTBPE2 PTBPE1 PTBPE0
W
Reset00000000
Figure 6-9. Internal Pullup Enable for Port B (PTBPE)
Table 6-8. PTBPE Register Field Descriptions
Field Description
7:0
PTBPE[7:0]
Internal Pullup Enable for Port B Bits — Each of these control bits determines if the internal pullup device is
enabled for the associated PTB pin. For port B pins that are configured as outputs, these bits have no effect and
the internal pullup devices are disabled.
0 Internal pullup device disabled for port B bit n.
1 Internal pullup device enabled for port B bit n.
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PTBSE7 PTBSE6 PTBSE5 PTBSE4 PTBSE3 PTBSE2 PTBSE1 PTBSE0
W
Reset11111111
Figure 6-10. Output Slew Rate Control Enable (PTBSE)
Table 6-9. PTBSE Register Field Descriptions
Field Description
7:0
PTBSE[7:0]
Output Slew Rate Control Enable for Port B Bits— Each of these control bits determine whether output slew
rate control is enabled for the associated PTB pin. For port B pins that are configured as inputs, these bits have
no effect.
0 Output slew rate control disabled for port B bit n.
1 Output slew rate control enabled for port B bit n.
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PTBDS7 PTBDS6 PTBDS5 PTBDS4 PTBDS3 PTBDS2 PTBDS1 PTBDS0
W
Reset 00000000
Figure 6-11. Output Drive Strength Selection for Port B (PTBDS)
Table 6-10. PTBDS Register Field Descriptions
Field Description
7:0
PTBDS[7:0]
Output Drive Strength Selection for Port B Bits — Each of these control bits selects between low and high
output drive for the associated PTB pin.
0 Low output drive enabled for port B bit n.
1 High output drive enabled for port B bit n.
Chapter 6 Parallel Input/Output
MC9S08JM60 Series Data Sheet, Rev. 3
88 Freescale Semiconductor
6.5.5 Port C I/O Registers (PTCD and PTCDD)
Port C parallel I/O function is controlled by the registers listed below.
6.5.6 Port C Pin Control Registers (PTCPE, PTCSE, PTCDS)
In addition to the I/O control, port C pins are controlled by the registers listed below.
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PTCD6 PTCD5 PTCD4 PTCD3 PTCD2 PTCD1 PTCD0
W
Reset00000000
Figure 6-12. Port C Data Register (PTCD)
Table 6-11. PTCD Register Field Descriptions
Field Description
6:0
PTCD[6:0]
Port C Data Register Bits — For port C pins that are inputs, reads return the logic level on the pin. For port C
pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port C pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTCD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures
all port pins as high-impedance inputs with pullups disabled.
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PTCDD6 PTCDD5 PTCDD4 PTCDD3 PTCDD2 PTCDD1 PTCDD0
W
Reset00000000
Figure 6-13. Data Direction for Port C (PTCDD)
Table 6-12. PTCDD Register Field Descriptions
Field Description
6:0
PTCDD[6:0]
Data Direction for Port C Bits — These read/write bits control the direction of port C pins and what is read for
PTCD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port C bit n and PTCD reads return the contents of PTCDn.
Chapter 6 Parallel Input/Output
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 89
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PTCPE6 PTCPE5 PTCPE4 PTCPE3 PTCPE2 PTCPE1 PTCPE0
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Reset00000000
Figure 6-14. Internal Pullup Enable for Port C (PTCPE)
Table 6-13. PTCPE Register Field Descriptions
Field Description
6:0
PTCPE[6:0]
Internal Pullup Enable for Port C Bits — Each of these control bits determines if the internal pullup device is
enabled for the associated PTC pin. For port C pins that are configured as outputs, these bits have no effect and
the internal pullup devices are disabled.
0 Internal pullup device disabled for port C bit n.
1 Internal pullup device enabled for port C bit n.
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PTCSE6 PTCSE5 PTCSE4 PTCSE3 PTCSE2 PTCSE1 PTCSE0
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Reset01111111
Figure 6-15. Output Slew Rate Control Enable for Port C (PTCSE)
Table 6-14. PTCSE Register Field Descriptions
Field Description
6:0
PTCSE[6:0]
Output Slew Rate Control Enable for Port C Bits — Each of these control bits determine whether output slew
rate control is enabled for the associated PTC pin. For port C pins that are configured as inputs, these bits have
no effect.
0 Output slew rate control disabled for port C bit n.
1 Output slew rate control enabled for port C bit n.
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PTCDS6 PTCDS5 PTCDS4 PTCDS3 PTCDS2 PTCDS1 PTCDS0
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Reset00000000
Figure 6-16. Output Drive Strength Selection for Port C (PTCDS)
Table 6-15. PTCDS Register Field Descriptions
Field Description
6:0
PTCDS[6:0]
Output Drive Strength Selection for Port C Bits — Each of these control bits selects between low and high
output drive for the associated PTC pin.
0 Low output drive enabled for port C bit n.
1 High output drive enabled for port C bit n.
Chapter 6 Parallel Input/Output
MC9S08JM60 Series Data Sheet, Rev. 3
90 Freescale Semiconductor
6.5.7 Port D I/O Registers (PTDD and PTDDD)
Port D parallel I/O function is controlled by the registers listed below.
6.5.8 Port D Pin Control Registers (PTDPE, PTDSE, PTDDS)
In addition to the I/O control, port D pins are controlled by the registers listed below.
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PTDD7 PTDD6 PTDD5 PTDD4 PTDD3 PTDD2 PTDD1 PTDD0
W
Reset00000000
Figure 6-17. Port D Data Register (PTDD)
Table 6-16. PTDD Register Field Descriptions
Field Description
7:0
PTDD[7:0]
Port D Data Register Bits — For port D pins that are inputs, reads return the logic level on the pin. For port D
pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port D pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTDD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures
all port pins as high-impedance inputs with pullups disabled.
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PTDDD7 PTDDD6 PTDDD5 PTDDD4 PTDDD3 PTDDD2 PTDDD1 PTDDD0
W
Reset00000000
Figure 6-18. Data Direction for Port D (PTDDD)
Table 6-17. PTDDD Register Field Descriptions
Field Description
7:0
PTDDD[7:0]
Data Direction for Port D Bits — These read/write bits control the direction of port D pins and what is read for
PTDD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port D bit n and PTDD reads return the contents of PTDDn.
Chapter 6 Parallel Input/Output
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 91
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PTDPE7 PTDPE6 PTDPE5 PTDPE4 PTDPE3 PTDPE2 PTDPE1 PTDPE0
W
Reset00000000
Figure 6-19. Internal Pullup Enable for Port D (PTDPE)
Table 6-18. PTDPE Register Field Descriptions
Field Description
7:0
PTDPE[7:0]
Internal Pullup Enable for Port D Bits — Each of these control bits determines if the internal pullup device is
enabled for the associated PTD pin. For port D pins that are configured as outputs, these bits have no effect and
the internal pullup devices are disabled.
0 Internal pullup device disabled for port D bit n.
1 Internal pullup device enabled for port D bit n.
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PTDSE7 PTDSE6 PTDSE5 PTDSE4 PTDSE3 PTDSE2 PTDSE1 PTDSE0
W
Reset11111111
Figure 6-20. Output Slew Rate Control Enable for Port D (PTDSE)
Table 6-19. PTDSE Register Field Descriptions
Field Description
7:0
PTDSE[7:0]
Output Slew Rate Control Enable for Port D Bits — Each of these control bits determine whether output slew
rate control is enabled for the associated PTD pin. For port D pins that are configured as inputs, these bits have
no effect.
0 Output slew rate control disabled for port D bit n.
1 Output slew rate control enabled for port D bit n.
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PTDDS7 PTDDS6 PTDDS5 PTDDS4 PTDDS3 PTDDS2 PTDDS1 PTDDS0
W
Reset00000000
Figure 6-21. Output Drive Strength Selection for Port D (PTDDS)
Table 6-20. PTDDS Register Field Descriptions
Field Description
7:0
PTDDS[7:0]
Output Drive Strength Selection for Port D Bits — Each of these control bits selects between low and high
output drive for the associated PTD pin.
0 Low output drive enabled for port D bit n.
1 High output drive enabled for port D bit n.
Chapter 6 Parallel Input/Output
MC9S08JM60 Series Data Sheet, Rev. 3
92 Freescale Semiconductor
6.5.9 Port E I/O Registers (PTED and PTEDD)
Port E parallel I/O function is controlled by the registers listed below.
6.5.10 Port E Pin Control Registers (PTEPE, PTESE, PTEDS)
In addition to the I/O control, port E pins are controlled by the registers listed below.
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PTED7 PTED6 PTED5 PTED4 PTED3 PTED2 PTED1 PTED0
W
Reset00000000
Figure 6-22. Port E Data Register (PTED)
Table 6-21. PTED Register Field Descriptions
Field Description
7:0
PTED[7:0]
Port E Data Register Bits — For port E pins that are inputs, reads return the logic level on the pin. For port E
pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port E pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTED to all 0s, but these 0s are not driven out the corresponding pins because reset also configures
all port pins as high-impedance inputs with pullups disabled.
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PTEDD7 PTEDD6 PTEDD5 PTEDD4 PTEDD3 PTEDD2 PTEDD1 PTEDD0
W
Reset00000000
Figure 6-23. Data Direction for Port E (PTEDD)
Table 6-22. PTEDD Register Field Descriptions
Field Description
7:0
PTEDD[7:0]
Data Direction for Port E Bits — These read/write bits control the direction of port E pins and what is read for
PTED reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port E bit n and PTED reads return the contents of PTEDn.
Chapter 6 Parallel Input/Output
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 93
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PTEPE7 PTEPE6 PTEPE5 PTEPE4 PTEPE3 PTEPE2 PTEPE1 PTEPE0
W
Reset00000000
Figure 6-24. Internal Pullup Enable for Port E (PTEPE)
Table 6-23. PTEPE Register Field Descriptions
Field Description
7:0
PTEPE[7:0]
Internal Pullup Enable for Port E Bits— Each of these control bits determines if the internal pullup device is
enabled for the associated PTE pin. For port E pins that are configured as outputs, these bits have no effect and
the internal pullup devices are disabled.
0 Internal pullup device disabled for port E bit n.
1 Internal pullup device enabled for port E bit n.
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PTESE7 PTESE6 PTESE5 PTESE4 PTESE3 PTESE2 PTESE1 PTESE0
W
Reset11111111
Figure 6-25. Output Slew Rate Control Enable for Port E (PTESE)
Table 6-24. PTESE Register Field Descriptions
Field Description
7:0
PTESE[7:0]
Output Slew Rate Control Enable for Port E Bits — Each of these control bits determine whether output slew
rate control is enabled for the associated PTE pin. For port E pins that are configured as inputs, these bits have
no effect.
0 Output slew rate control disabled for port E bit n.
1 Output slew rate control enabled for port E bit n.
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PTEDS7 PTEDS6 PTEDS5 PTEDS4 PTEDS3 PTEDS2 PTEDS1 PTEDS0
W
Reset00000000
Figure 6-26. Output Drive Strength Selection for Port E (PTEDS)
Table 6-25. PTEDS Register Field Descriptions
Field Description
7:0
PTEDS[7:0]
Output Drive Strength Selection for Port E Bits — Each of these control bits selects between low and high
output drive for the associated PTE pin.
0 Low output drive enabled for port E bit n.
1 High output drive enabled for port E bit n.
Chapter 6 Parallel Input/Output
MC9S08JM60 Series Data Sheet, Rev. 3
94 Freescale Semiconductor
6.5.11 Port F I/O Registers (PTFD and PTFDD)
Port F parallel I/O function is controlled by the registers listed below.
6.5.12 Port F Pin Control Registers (PTFPE, PTFSE, PTFDS)
In addition to the I/O control, port F pins are controlled by the registers listed below.
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PTFD7 PTFD6 PTFD5 PTFD4 PTFD3 PTFD2 PTFD1 PTFD0
W
Reset00000000
Figure 6-27. Port F Data Register (PTFD)
Table 6-26. PTFD Register Field Descriptions
Field Description
7:0
PTFD[7:0]
Port F Data Register Bits— For port F pins that are inputs, reads return the logic level on the pin. For port F
pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port F pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTFD to all 0s, but these 0s are not driven out the corresponding pins because reset also configures
all port pins as high-impedance inputs with pullups disabled.
76543210
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PTFDD7 PTFDD6 PTFDD5 PTFDD4 PTFDD3 PTFDD2 PTFDD1 PTFDD0
W
Reset00000000
Figure 6-28. Data Direction for Port F (PTFDD)
Table 6-27. PTFDD Register Field Descriptions
Field Description
7:0
PTFDD[7:0]
Data Direction for Port F Bits — These read/write bits control the direction of port F pins and what is read for
PTFD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port F bit n and PTFD reads return the contents of PTFDn.
Chapter 6 Parallel Input/Output
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 95
76543210
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PTFPE7 PTFPE6 PTFPE5 PTFPE4 PTFPE3 PTFPE2 PTFPE1 PTFPE0
W
Reset00000000
Figure 6-29. Internal Pullup Enable for Port F (PTFPE)
Table 6-28. PTFPE Register Field Descriptions
Field Description
7:0
PTFPE[7:0]
Internal Pullup Enable for Port F Bits — Each of these control bits determines if the internal pullup device is
enabled for the associated PTF pin. For port F pins that are configured as outputs, these bits have no effect and
the internal pullup devices are disabled.
0 Internal pullup device disabled for port F bit n.
1 Internal pullup device enabled for port F bit n.
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PTFSE7 PTFSE6 PTFSE5 PTFSE4 PTFSE3 PTFSE2 PTFSE1 PTFSE0
W
Reset11111111
Figure 6-30. Output Slew Rate Control Enable for Port F (PTFSE)
Table 6-29. PTFSE Register Field Descriptions
Field Description
7:0
PTFSE[7:0]
Output Slew Rate Control Enable for Port F Bits — Each of these control bits determine whether output slew
rate control is enabled for the associated PTF pin. For port F pins that are configured as inputs, these bits have
no effect.
0 Output slew rate control disabled for port F bit n.
1 Output slew rate control enabled for port F bit n.
76543210
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PTFDS7 PTFDS6 PTFDS5 PTFDS4 PTFDS3 PTFDS2 PTFDS1 PTFDS0
W
Reset00000000
Figure 6-31. Output Drive Strength Selection for Port F (PTFDS)
Table 6-30. PTFDS Register Field Descriptions
Field Description
7:0
PTFDS[7:0]
Output Drive Strength Selection for Port F Bits — Each of these control bits selects between low and high
output drive for the associated PTF pin.
0 Low output drive enabled for port F bit n.
1 High output drive enabled for port F bit n.
Chapter 6 Parallel Input/Output
MC9S08JM60 Series Data Sheet, Rev. 3
96 Freescale Semiconductor
6.5.13 Port G I/O Registers (PTGD and PTGDD)
Port G parallel I/O function is controlled by the registers listed below.
6.5.14 Port G Pin Control Registers (PTGPE, PTGSE, PTGDS)
In addition to the I/O control, port G pins are controlled by the registers listed below.
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PTGD5 PTGD4 PTGD3 PTGD2 PTGD1 PTGD0
W
Reset00000000
Figure 6-32. Port G Data Register (PTGD)
Table 6-31. PTGD Register Field Descriptions
Field Description
5:0
PTGD[5:0]
Port G Data Register Bits — For port G pins that are inputs, reads return the logic level on the pin. For port G
pins that are configured as outputs, reads return the last value written to this register.
Writes are latched into all bits of this register. For port G pins that are configured as outputs, the logic level is
driven out the corresponding MCU pin.
Reset forces PTGD to all 0s, but these 0s are not driven out the corresponding pins because reset also
configures all port pins as high-impedance inputs with pullups disabled.
76543210
R
PTGDD5 PTGDD4 PTGDD3 PTGDD2 PTGDD1 PTGDD0
W
Reset00000000
Figure 6-33. Data Direction for Port G (PTGDD)
Table 6-32. PTGDD Register Field Descriptions
Field Description
5:0
PTGDD[5:0]
Data Direction for Port G Bits — These read/write bits control the direction of port G pins and what is read for
PTGD reads.
0 Input (output driver disabled) and reads return the pin value.
1 Output driver enabled for port G bit n and PTGD reads return the contents of PTGDn.
Chapter 6 Parallel Input/Output
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 97
76543210
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PTGPE5 PTGPE4 PTGPE3 PTGPE2 PTGPE1 PTGPE0
W
Reset00000000
Figure 6-34. Internal Pullup Enable for Port G Bits (PTGPE)
Table 6-33. PTGPE Register Field Descriptions
Field Description
5:0
PTGPEn
Internal Pullup Enable for Port G Bits — Each of these control bits determines if the internal pullup device is
enabled for the associated PTG pin. For port G pins that are configured as outputs, these bits have no effect and
the internal pullup devices are disabled.
0 Internal pullup device disabled for port G bit n.
1 Internal pullup device enabled for port G bit n.
76543210
R
PTGSE5 PTGSE4 PTGSE3 PTGSE2 PTGSE1 PTGSE0
W
Reset01111111
Figure 6-35. Output Slew Rate Control Enable for Port G Bits (PTGSE)
Table 6-34. PTGSE Register Field Descriptions
Field Description
5:0
PTGSEn
Output Slew Rate Control Enable for Port G Bits— Each of these control bits determine whether output slew
rate control is enabled for the associated PTG pin. For port G pins that are configured as inputs, these bits have
no effect.
0 Output slew rate control disabled for port G bit n.
1 Output slew rate control enabled for port G bit n.
76543210
R
PTGDS5 PTGDS4 PTGDS3 PTGDS2 PTGDS1 PTGDS0
W
Reset00000000
Figure 6-36. Output Drive Strength Selection for Port G (PTGDS)
Table 6-35. PTGDS Register Field Descriptions
Field Description
5:0
PTGDSn
Output Drive Strength Selection for Port G Bits — Each of these control bits selects between low and high
output drive for the associated PTG pin.
0 Low output drive enabled for port G bit n.
1 High output drive enabled for port G bit n.
Chapter 6 Parallel Input/Output
MC9S08JM60 Series Data Sheet, Rev. 3
98 Freescale Semiconductor
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 99
Chapter 7
Central Processor Unit (S08CPUV2)
7.1 Introduction
This section provides summary information about the registers, addressing modes, and instruction set of
the CPU of the HCS08 Family. For a more detailed discussion, refer to the HCS08 Family Reference
Manual, volume 1, Freescale Semiconductor document order number HCS08RMV1/D.
The HCS08 CPU is fully source- and object-code-compatible with the M68HC08 CPU. Several
instructions and enhanced addressing modes were added to improve C compiler efficiency and to support
a new background debug system which replaces the monitor mode of earlier M68HC08 microcontrollers
(MCU).
7.1.1 Features
Features of the HCS08 CPU include:
• Object code fully upward-compatible with M68HC05 and M68HC08 Families
• All registers and memory are mapped to a single 64-Kbyte address space
• 16-bit stack pointer (any size stack anywhere in 64-Kbyte address space)
• 16-bit index register (H:X) with powerful indexed addressing modes
• 8-bit accumulator (A)
• Many instructions treat X as a second general-purpose 8-bit register
• Seven addressing modes:
— Inherent — Operands in internal registers
— Relative — 8-bit signed offset to branch destination
— Immediate — Operand in next object code byte(s)
— Direct — Operand in memory at 0x0000–0x00FF
— Extended — Operand anywhere in 64-Kbyte address space
— Indexed relative to H:X — Five submodes including auto increment
— Indexed relative to SP — Improves C efficiency dramatically
• Memory-to-memory data move instructions with four address mode combinations
• Overflow, half-carry, negative, zero, and carry condition codes support conditional branching on
the results of signed, unsigned, and binary-coded decimal (BCD) operations
• Efficient bit manipulation instructions
• Fast 8-bit by 8-bit multiply and 16-bit by 8-bit divide instructions
• STOP and WAIT instructions to invoke low-power operating modes
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7.2 Programmer’s Model and CPU Registers
Figure 7-1 shows the five CPU registers. CPU registers are not part of the memory map.
Figure 7-1. CPU Registers
7.2.1 Accumulator (A)
The A accumulator is a general-purpose 8-bit register. One operand input to the arithmetic logic unit
(ALU) is connected to the accumulator and the ALU results are often stored into the A accumulator after
arithmetic and logical operations. The accumulator can be loaded from memory using various addressing
modes to specify the address where the loaded data comes from, or the contents of A can be stored to
memory using various addressing modes to specify the address where data from A will be stored.
Reset has no effect on the contents of the A accumulator.
7.2.2 Index Register (H:X)
This 16-bit register is actually two separate 8-bit registers (H and X), which often work together as a 16-bit
address pointer where H holds the upper byte of an address and X holds the lower byte of the address. All
indexed addressing mode instructions use the full 16-bit value in H:X as an index reference pointer;
however, for compatibility with the earlier M68HC05 Family, some instructions operate only on the
low-order 8-bit half (X).
Many instructions treat X as a second general-purpose 8-bit register that can be used to hold 8-bit data
values. X can be cleared, incremented, decremented, complemented, negated, shifted, or rotated. Transfer
instructions allow data to be transferred from A or transferred to A where arithmetic and logical operations
can then be performed.
For compatibility with the earlier M68HC05 Family, H is forced to 0x00 during reset. Reset has no effect
on the contents of X.
SP
PC
CONDITION CODE REGISTER
CARRY
ZERO
NEGATIVE
INTERRUPT MASK
HALF-CARRY (FROM BIT 3)
TWO’S COMPLEMENT OVERFLOW
H X
0
0
0
7
15
15
70
ACCUMULATOR A
INDEX REGISTER (LOW)INDEX REGISTER (HIGH)
STACK POINTER
87
PROGRAM COUNTER
16-BIT INDEX REGISTER H:X
CCR
CV11HINZ
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7.2.3 Stack Pointer (SP)
This 16-bit address pointer register points at the next available location on the automatic last-in-first-out
(LIFO) stack. The stack may be located anywhere in the 64-Kbyte address space that has RAM and can
be any size up to the amount of available RAM. The stack is used to automatically save the return address
for subroutine calls, the return address and CPU registers during interrupts, and for local variables. The
AIS (add immediate to stack pointer) instruction adds an 8-bit signed immediate value to SP. This is most
often used to allocate or deallocate space for local variables on the stack.
SP is forced to 0x00FF at reset for compatibility with the earlier M68HC05 Family. HCS08 programs
normally change the value in SP to the address of the last location (highest address) in on-chip RAM
during reset initialization to free up direct page RAM (from the end of the on-chip registers to 0x00FF).
The RSP (reset stack pointer) instruction was included for compatibility with the M68HC05 Family and
is seldom used in new HCS08 programs because it only affects the low-order half of the stack pointer.
7.2.4 Program Counter (PC)
The program counter is a 16-bit register that contains the address of the next instruction or operand to be
fetched.
During normal program execution, the program counter automatically increments to the next sequential
memory location every time an instruction or operand is fetched. Jump, branch, interrupt, and return
operations load the program counter with an address other than that of the next sequential location. This
is called a change-of-flow.
During reset, the program counter is loaded with the reset vector that is located at 0xFFFE and 0xFFFF.
The vector stored there is the address of the first instruction that will be executed after exiting the reset
state.
7.2.5 Condition Code Register (CCR)
The 8-bit condition code register contains the interrupt mask (I) and five flags that indicate the results of
the instruction just executed. Bits 6 and 5 are set permanently to 1. The following paragraphs describe the
functions of the condition code bits in general terms. For a more detailed explanation of how each
instruction sets the CCR bits, refer to the HCS08 Family Reference Manual, volume 1, Freescale
Semiconductor document order number HCS08RMv1.
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Figure 7-2. Condition Code Register
Table 7-1. CCR Register Field Descriptions
Field Description
7
V
Two’s Complement Overflow Flag — The CPU sets the overflow flag when a two’s complement overflow occurs.
The signed branch instructions BGT, BGE, BLE, and BLT use the overflow flag.
0 No overflow
1Overflow
4
H
Half-Carry Flag — The CPU sets the half-carry flag when a carry occurs between accumulator bits 3 and 4 during
an add-without-carry (ADD) or add-with-carry (ADC) operation. The half-carry flag is required for binary-coded
decimal (BCD) arithmetic operations. The DAA instruction uses the states of the H and C condition code bits to
automatically add a correction value to the result from a previous ADD or ADC on BCD operands to correct the
result to a valid BCD value.
0 No carry between bits 3 and 4
1 Carry between bits 3 and 4
3
I
Interrupt Mask Bit — When the interrupt mask is set, all maskable CPU interrupts are disabled. CPU interrupts
are enabled when the interrupt mask is cleared. When a CPU interrupt occurs, the interrupt mask is set
automatically after the CPU registers are saved on the stack, but before the first instruction of the interrupt service
routine is executed.
Interrupts are not recognized at the instruction boundary after any instruction that clears I (CLI or TAP). This
ensures that the next instruction after a CLI or TAP will always be executed without the possibility of an intervening
interrupt, provided I was set.
0 Interrupts enabled
1 Interrupts disabled
2
N
Negative Flag — The CPU sets the negative flag when an arithmetic operation, logic operation, or data
manipulation produces a negative result, setting bit 7 of the result. Simply loading or storing an 8-bit or 16-bit value
causes N to be set if the most significant bit of the loaded or stored value was 1.
0 Non-negative result
1 Negative result
1
Z
Zero Flag — The CPU sets the zero flag when an arithmetic operation, logic operation, or data manipulation
produces a result of 0x00 or 0x0000. Simply loading or storing an 8-bit or 16-bit value causes Z to be set if the
loaded or stored value was all 0s.
0 Non-zero result
1Zero result
0
C
Carry/Borrow Flag — The CPU sets the carry/borrow flag when an addition operation produces a carry out of bit
7 of the accumulator or when a subtraction operation requires a borrow. Some instructions — such as bit test and
branch, shift, and rotate — also clear or set the carry/borrow flag.
0 No carry out of bit 7
1 Carry out of bit 7
CONDITION CODE REGISTER
CARRY
ZERO
NEGATIVE
INTERRUPT MASK
HALF-CARRY (FROM BIT 3)
TWO’S COMPLEMENT OVERFLOW
70
CCR
CV11HINZ
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7.3 Addressing Modes
Addressing modes define the way the CPU accesses operands and data. In the HCS08, all memory, status
and control registers, and input/output (I/O) ports share a single 64-Kbyte linear address space so a 16-bit
binary address can uniquely identify any memory location. This arrangement means that the same
instructions that access variables in RAM can also be used to access I/O and control registers or nonvolatile
program space.
Some instructions use more than one addressing mode. For instance, move instructions use one addressing
mode to specify the source operand and a second addressing mode to specify the destination address.
Instructions such as BRCLR, BRSET, CBEQ, and DBNZ use one addressing mode to specify the location
of an operand for a test and then use relative addressing mode to specify the branch destination address
when the tested condition is true. For BRCLR, BRSET, CBEQ, and DBNZ, the addressing mode listed in
the instruction set tables is the addressing mode needed to access the operand to be tested, and relative
addressing mode is implied for the branch destination.
7.3.1 Inherent Addressing Mode (INH)
In this addressing mode, operands needed to complete the instruction (if any) are located within CPU
registers so the CPU does not need to access memory to get any operands.
7.3.2 Relative Addressing Mode (REL)
Relative addressing mode is used to specify the destination location for branch instructions. A signed 8-bit
offset value is located in the memory location immediately following the opcode. During execution, if the
branch condition is true, the signed offset is sign-extended to a 16-bit value and is added to the current
contents of the program counter, which causes program execution to continue at the branch destination
address.
7.3.3 Immediate Addressing Mode (IMM)
In immediate addressing mode, the operand needed to complete the instruction is included in the object
code immediately following the instruction opcode in memory. In the case of a 16-bit immediate operand,
the high-order byte is located in the next memory location after the opcode, and the low-order byte is
located in the next memory location after that.
7.3.4 Direct Addressing Mode (DIR)
In direct addressing mode, the instruction includes the low-order eight bits of an address in the direct page
(0x0000–0x00FF). During execution a 16-bit address is formed by concatenating an implied 0x00 for the
high-order half of the address and the direct address from the instruction to get the 16-bit address where
the desired operand is located. This is faster and more memory efficient than specifying a complete 16-bit
address for the operand.
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7.3.5 Extended Addressing Mode (EXT)
In extended addressing mode, the full 16-bit address of the operand is located in the next two bytes of
program memory after the opcode (high byte first).
7.3.6 Indexed Addressing Mode
Indexed addressing mode has seven variations including five that use the 16-bit H:X index register pair
and two that use the stack pointer as the base reference.
7.3.6.1 Indexed, No Offset (IX)
This variation of indexed addressing uses the 16-bit value in the H:X index register pair as the address of
the operand needed to complete the instruction.
7.3.6.2 Indexed, No Offset with Post Increment (IX+)
This variation of indexed addressing uses the 16-bit value in the H:X index register pair as the address of
the operand needed to complete the instruction. The index register pair is then incremented
(H:X = H:X + 0x0001) after the operand has been fetched. This addressing mode is only used for MOV
and CBEQ instructions.
7.3.6.3 Indexed, 8-Bit Offset (IX1)
This variation of indexed addressing uses the 16-bit value in the H:X index register pair plus an unsigned
8-bit offset included in the instruction as the address of the operand needed to complete the instruction.
7.3.6.4 Indexed, 8-Bit Offset with Post Increment (IX1+)
This variation of indexed addressing uses the 16-bit value in the H:X index register pair plus an unsigned
8-bit offset included in the instruction as the address of the operand needed to complete the instruction.
The index register pair is then incremented (H:X = H:X + 0x0001) after the operand has been fetched. This
addressing mode is used only for the CBEQ instruction.
7.3.6.5 Indexed, 16-Bit Offset (IX2)
This variation of indexed addressing uses the 16-bit value in the H:X index register pair plus a 16-bit offset
included in the instruction as the address of the operand needed to complete the instruction.
7.3.6.6 SP-Relative, 8-Bit Offset (SP1)
This variation of indexed addressing uses the 16-bit value in the stack pointer (SP) plus an unsigned 8-bit
offset included in the instruction as the address of the operand needed to complete the instruction.
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7.3.6.7 SP-Relative, 16-Bit Offset (SP2)
This variation of indexed addressing uses the 16-bit value in the stack pointer (SP) plus a 16-bit offset
included in the instruction as the address of the operand needed to complete the instruction.
7.4 Special Operations
The CPU performs a few special operations that are similar to instructions but do not have opcodes like
other CPU instructions. In addition, a few instructions such as STOP and WAIT directly affect other MCU
circuitry. This section provides additional information about these operations.
7.4.1 Reset Sequence
Reset can be caused by a power-on-reset (POR) event, internal conditions such as the COP (computer
operating properly) watchdog, or by assertion of an external active-low reset pin. When a reset event
occurs, the CPU immediately stops whatever it is doing (the MCU does not wait for an instruction
boundary before responding to a reset event). For a more detailed discussion about how the MCU
recognizes resets and determines the source, refer to the Resets, Interrupts, and System Configuration
chapter.
The reset event is considered concluded when the sequence to determine whether the reset came from an
internal source is done and when the reset pin is no longer asserted. At the conclusion of a reset event, the
CPU performs a 6-cycle sequence to fetch the reset vector from 0xFFFE and 0xFFFF and to fill the
instruction queue in preparation for execution of the first program instruction.
7.4.2 Interrupt Sequence
When an interrupt is requested, the CPU completes the current instruction before responding to the
interrupt. At this point, the program counter is pointing at the start of the next instruction, which is where
the CPU should return after servicing the interrupt. The CPU responds to an interrupt by performing the
same sequence of operations as for a software interrupt (SWI) instruction, except the address used for the
vector fetch is determined by the highest priority interrupt that is pending when the interrupt sequence
started.
The CPU sequence for an interrupt is:
1. Store the contents of PCL, PCH, X, A, and CCR on the stack, in that order.
2. Set the I bit in the CCR.
3. Fetch the high-order half of the interrupt vector.
4. Fetch the low-order half of the interrupt vector.
5. Delay for one free bus cycle.
6. Fetch three bytes of program information starting at the address indicated by the interrupt vector
to fill the instruction queue in preparation for execution of the first instruction in the interrupt
service routine.
After the CCR contents are pushed onto the stack, the I bit in the CCR is set to prevent other interrupts
while in the interrupt service routine. Although it is possible to clear the I bit with an instruction in the
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interrupt service routine, this would allow nesting of interrupts (which is not recommended because it
leads to programs that are difficult to debug and maintain).
For compatibility with the earlier M68HC05 MCUs, the high-order half of the H:X index register pair (H)
is not saved on the stack as part of the interrupt sequence. The user must use a PSHH instruction at the
beginning of the service routine to save H and then use a PULH instruction just before the RTI that ends
the interrupt service routine. It is not necessary to save H if you are certain that the interrupt service routine
does not use any instructions or auto-increment addressing modes that might change the value of H.
The software interrupt (SWI) instruction is like a hardware interrupt except that it is not masked by the
global I bit in the CCR and it is associated with an instruction opcode within the program so it is not
asynchronous to program execution.
7.4.3 Wait Mode Operation
The WAIT instruction enables interrupts by clearing the I bit in the CCR. It then halts the clocks to the
CPU to reduce overall power consumption while the CPU is waiting for the interrupt or reset event that
will wake the CPU from wait mode. When an interrupt or reset event occurs, the CPU clocks will resume
and the interrupt or reset event will be processed normally.
If a serial BACKGROUND command is issued to the MCU through the background debug interface while
the CPU is in wait mode, CPU clocks will resume and the CPU will enter active background mode where
other serial background commands can be processed. This ensures that a host development system can still
gain access to a target MCU even if it is in wait mode.
7.4.4 Stop Mode Operation
Usually, all system clocks, including the crystal oscillator (when used), are halted during stop mode to
minimize power consumption. In such systems, external circuitry is needed to control the time spent in
stop mode and to issue a signal to wake up the target MCU when it is time to resume processing. Unlike
the earlier M68HC05 and M68HC08 MCUs, the HCS08 can be configured to keep a minimum set of
clocks running in stop mode. This optionally allows an internal periodic signal to wake the target MCU
from stop mode.
When a host debug system is connected to the background debug pin (BKGD) and the ENBDM control
bit has been set by a serial command through the background interface (or because the MCU was reset into
active background mode), the oscillator is forced to remain active when the MCU enters stop mode. In this
case, if a serial BACKGROUND command is issued to the MCU through the background debug interface
while the CPU is in stop mode, CPU clocks will resume and the CPU will enter active background mode
where other serial background commands can be processed. This ensures that a host development system
can still gain access to a target MCU even if it is in stop mode.
Recovery from stop mode depends on the particular HCS08 and whether the oscillator was stopped in stop
mode. Refer to the Modes of Operation chapter for more details.
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Freescale Semiconductor 107
7.4.5 BGND Instruction
The BGND instruction is new to the HCS08 compared to the M68HC08. BGND would not be used in
normal user programs because it forces the CPU to stop processing user instructions and enter the active
background mode. The only way to resume execution of the user program is through reset or by a host
debug system issuing a GO, TRACE1, or TAGGO serial command through the background debug
interface.
Software-based breakpoints can be set by replacing an opcode at the desired breakpoint address with the
BGND opcode. When the program reaches this breakpoint address, the CPU is forced to active
background mode rather than continuing the user program.
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7.5 HCS08 Instruction Set Summary
Table 7-2 provides a summary of the HCS08 instruction set in all possible addressing modes. The table
shows operand construction, execution time in internal bus clock cycles, and cycle-by-cycle details for
each addressing mode variation of each instruction.
Table 7-2. . Instruction Set Summary (Sheet 1 of 9)
Source
Form Operation
Address
Mode
Object Code
Cycles
Cyc-by-Cyc
Details
Affect
on CCR
VH I N Z C
ADC #opr8i
ADC opr8a
ADC opr16a
ADC oprx16,X
ADC oprx8,X
ADC ,X
ADC oprx16,SP
ADC oprx8,SP
Add with Carry
A ← (A) + (M) + (C)
IMM
DIR
EXT
IX2
IX1
IX
SP2
SP1
A9
B9
C9
D9
E9
F9
9E D9
9E E9
ii
dd
hh ll
ee ff
ff
ee ff
ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
–
ADD #opr8i
ADD opr8a
ADD opr16a
ADD oprx16,X
ADD oprx8,X
ADD ,X
ADD oprx16,SP
ADD oprx8,SP
Add without Carry
A ← (A) + (M)
IMM
DIR
EXT
IX2
IX1
IX
SP2
SP1
AB
BB
CB
DB
EB
FB
9E DB
9E EB
ii
dd
hh ll
ee ff
ff
ee ff
ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
–
AIS #opr8i
Add Immediate Value (Signed) to
Stack Pointer
SP ← (SP) + (M)
IMM A7 ii 2pp – – – – – –
AIX #opr8i
Add Immediate Value (Signed) to
Index Register (H:X)
H:X ← (H:X) + (M)
IMM AF ii 2pp – – – – – –
AND #opr8i
AND opr8a
AND opr16a
AND oprx16,X
AND oprx8,X
AND ,X
AND oprx16,SP
AND oprx8,SP
Logical AND
A ← (A) & (M)
IMM
DIR
EXT
IX2
IX1
IX
SP2
SP1
A4
B4
C4
D4
E4
F4
9E D4
9E E4
ii
dd
hh ll
ee ff
ff
ee ff
ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
0 – – –
ASL opr8a
ASLA
ASLX
ASL oprx8,X
ASL ,X
ASL oprx8,SP
Arithmetic Shift Left
(Same as LSL)
DIR
INH
INH
IX1
IX
SP1
38
48
58
68
78
9E 68
dd
ff
ff
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
––
ASR opr8a
ASRA
ASRX
ASR oprx8,X
ASR ,X
ASR oprx8,SP
Arithmetic Shift Right DIR
INH
INH
IX1
IX
SP1
37
47
57
67
77
9E 67
dd
ff
ff
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
––
BCC rel Branch if Carry Bit Clear
(if C = 0) REL 24 rr 3ppp – – – – – –
C
b0
b7
0
b0
b7
C
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Freescale Semiconductor 109
BCLR n,opr8a Clear Bit n in Memory
(Mn ← 0)
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
11
13
15
17
19
1B
1D
1F
dd
dd
dd
dd
dd
dd
dd
dd
5
5
5
5
5
5
5
5
rfwpp
rfwpp
rfwpp
rfwpp
rfwpp
rfwpp
rfwpp
rfwpp
– – – – – –
BCS rel Branch if Carry Bit Set (if C = 1)
(Same as BLO) REL 25 rr 3ppp – – – – – –
BEQ rel Branch if Equal (if Z = 1) REL 27 rr 3ppp – – – – – –
BGE rel Branch if Greater Than or Equal To
(if N ⊕ V = 0) (Signed) REL 90 rr 3ppp – – – – – –
BGND
Enter active background if ENBDM=1
Waits for and processes BDM commands
until GO, TRACE1, or TAGGO
INH 82 5+ fp...ppp – – – – – –
BGT rel Branch if Greater Than (if Z | (N ⊕ V) = 0)
(Signed) REL 92 rr 3ppp – – – – – –
BHCC rel Branch if Half Carry Bit Clear (if H = 0) REL 28 rr 3ppp – – – – – –
BHCS rel Branch if Half Carry Bit Set (if H = 1) REL 29 rr 3ppp – – – – – –
BHI rel Branch if Higher (if C | Z = 0) REL 22 rr 3ppp – – – – – –
BHS rel Branch if Higher or Same (if C = 0)
(Same as BCC) REL 24 rr 3ppp – – – – – –
BIH rel Branch if IRQ Pin High (if IRQ pin = 1) REL 2F rr 3ppp – – – – – –
BIL rel Branch if IRQ Pin Low (if IRQ pin = 0) REL 2E rr 3ppp – – – – – –
BIT #opr8i
BIT opr8a
BIT opr16a
BIT oprx16,X
BIT oprx8,X
BIT ,X
BIT oprx16,SP
BIT oprx8,SP
Bit Test
(A) & (M)
(CCR Updated but Operands Not Changed)
IMM
DIR
EXT
IX2
IX1
IX
SP2
SP1
A5
B5
C5
D5
E5
F5
9E D5
9E E5
ii
dd
hh ll
ee ff
ff
ee ff
ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
0 – – –
BLE rel Branch if Less Than or Equal To
(if Z | (N ⊕ V) = 1) (Signed) REL 93 rr 3ppp – – – – – –
BLO rel Branch if Lower (if C = 1) (Same as BCS) REL 25 rr 3ppp – – – – – –
BLS rel Branch if Lower or Same (if C | Z = 1) REL 23 rr 3ppp – – – – – –
BLT rel Branch if Less Than (if N ⊕ V = 1) (Signed) REL 91 rr 3ppp – – – – – –
BMC rel Branch if Interrupt Mask Clear (if I = 0) REL 2C rr 3ppp – – – – – –
BMI rel Branch if Minus (if N = 1) REL 2B rr 3ppp – – – – – –
BMS rel Branch if Interrupt Mask Set (if I = 1) REL 2D rr 3ppp – – – – – –
BNE rel Branch if Not Equal (if Z = 0) REL 26 rr 3ppp – – – – – –
BPL rel Branch if Plus (if N = 0) REL 2A rr 3ppp – – – – – –
Table 7-2. . Instruction Set Summary (Sheet 2 of 9)
Source
Form Operation
Address
Mode
Object Code
Cycles
Cyc-by-Cyc
Details
Affect
on CCR
VH I N Z C
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BRA rel Branch Always (if I = 1) REL 20 rr 3ppp – – – – – –
BRCLR n,opr8a,rel Branch if Bit n in Memory Clear (if (Mn) = 0)
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
01
03
05
07
09
0B
0D
0F
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
5
5
5
5
5
5
5
5
rpppp
rpppp
rpppp
rpppp
rpppp
rpppp
rpppp
rpppp
– – – – –
BRN rel Branch Never (if I = 0) REL 21 rr 3ppp – – – – – –
BRSET n,opr8a,rel Branch if Bit n in Memory Set (if (Mn) = 1)
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
00
02
04
06
08
0A
0C
0E
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
5
5
5
5
5
5
5
5
rpppp
rpppp
rpppp
rpppp
rpppp
rpppp
rpppp
rpppp
– – – – –
BSET n,opr8a Set Bit n in Memory (Mn ← 1)
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
10
12
14
16
18
1A
1C
1E
dd
dd
dd
dd
dd
dd
dd
dd
5
5
5
5
5
5
5
5
rfwpp
rfwpp
rfwpp
rfwpp
rfwpp
rfwpp
rfwpp
rfwpp
– – – – – –
BSR rel
Branch to Subroutine
PC ← (PC) + $0002
push (PCL); SP ← (SP) – $0001
push (PCH); SP ← (SP) – $0001
PC ← (PC) + rel
REL AD rr 5ssppp – – – – – –
CBEQ opr8a,rel
CBEQA #opr8i,rel
CBEQX #opr8i,rel
CBEQ oprx8,X+,rel
CBEQ ,X+,rel
CBEQ oprx8,SP,rel
Compare and... Branch if (A) = (M)
Branch if (A) = (M)
Branch if (X) = (M)
Branch if (A) = (M)
Branch if (A) = (M)
Branch if (A) = (M)
DIR
IMM
IMM
IX1+
IX+
SP1
31
41
51
61
71
9E 61
dd rr
ii rr
ii rr
ff rr
rr
ff rr
5
4
4
5
5
6
rpppp
pppp
pppp
rpppp
rfppp
prpppp
– – – – – –
CLC Clear Carry Bit (C ← 0) INH 98 1p– – – – – 0
CLI Clear Interrupt Mask Bit (I ← 0) INH 9A 1p– – 0 – – –
CLR opr8a
CLRA
CLRX
CLRH
CLR oprx8,X
CLR ,X
CLR oprx8,SP
Clear M ← $00
A ← $00
X ← $00
H ← $00
M ← $00
M ← $00
M ← $00
DIR
INH
INH
INH
IX1
IX
SP1
3F
4F
5F
8C
6F
7F
9E 6F
dd
ff
ff
5
1
1
1
5
4
6
rfwpp
p
p
p
rfwpp
rfwp
prfwpp
0 – – 0 1 –
Table 7-2. . Instruction Set Summary (Sheet 3 of 9)
Source
Form Operation
Address
Mode
Object Code
Cycles
Cyc-by-Cyc
Details
Affect
on CCR
VH I N Z C
Chapter 7 Central Processor Unit (S08CPUV2)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 111
CMP #opr8i
CMP opr8a
CMP opr16a
CMP oprx16,X
CMP oprx8,X
CMP ,X
CMP oprx16,SP
CMP oprx8,SP
Compare Accumulator with Memory
A – M
(CCR Updated But Operands Not Changed)
IMM
DIR
EXT
IX2
IX1
IX
SP2
SP1
A1
B1
C1
D1
E1
F1
9E D1
9E E1
ii
dd
hh ll
ee ff
ff
ee ff
ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
––
COM opr8a
COMA
COMX
COM oprx8,X
COM ,X
COM oprx8,SP
Complement M ← (M)= $FF – (M)
(One’s Complement) A ← (A) = $FF – (A)
X ← (X) = $FF – (X)
M ← (M) = $FF – (M)
M ← (M) = $FF – (M)
M ← (M) = $FF – (M)
DIR
INH
INH
IX1
IX
SP1
33
43
53
63
73
9E 63
dd
ff
ff
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
0 – – 1
CPHX opr16a
CPHX #opr16i
CPHX opr8a
CPHX oprx8,SP
Compare Index Register (H:X) with Memory
(H:X) – (M:M + $0001)
(CCR Updated But Operands Not Changed)
EXT
IMM
DIR
SP1
3E
65
75
9E F3
hh ll
jj kk
dd
ff
6
3
5
6
prrfpp
ppp
rrfpp
prrfpp
––
CPX #opr8i
CPX opr8a
CPX opr16a
CPX oprx16,X
CPX oprx8,X
CPX ,X
CPX oprx16,SP
CPX oprx8,SP
Compare X (Index Register Low) with
Memory
X – M
(CCR Updated But Operands Not Changed)
IMM
DIR
EXT
IX2
IX1
IX
SP2
SP1
A3
B3
C3
D3
E3
F3
9E D3
9E E3
ii
dd
hh ll
ee ff
ff
ee ff
ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
––
DAA Decimal Adjust Accumulator
After ADD or ADC of BCD Values INH 72 1pU – –
DBNZ opr8a,rel
DBNZA rel
DBNZX rel
DBNZ oprx8,X,rel
DBNZ ,X,rel
DBNZ oprx8,SP,rel
Decrement A, X, or M and Branch if Not Zero
(if (result) ≠ 0)
DBNZX Affects X Not H
DIR
INH
INH
IX1
IX
SP1
3B
4B
5B
6B
7B
9E 6B
dd rr
rr
rr
ff rr
rr
ff rr
7
4
4
7
6
8
rfwpppp
fppp
fppp
rfwpppp
rfwppp
prfwpppp
– – – – – –
DEC opr8a
DECA
DECX
DEC oprx8,X
DEC ,X
DEC oprx8,SP
Decrement M ← (M) – $01
A ← (A) – $01
X ← (X) – $01
M ← (M) – $01
M ← (M) – $01
M ← (M) – $01
DIR
INH
INH
IX1
IX
SP1
3A
4A
5A
6A
7A
9E 6A
dd
ff
ff
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
–– –
DIV Divide
A ← (H:A)÷(X); H ← Remainder INH 52 6fffffp – – – –
EOR #opr8i
EOR opr8a
EOR opr16a
EOR oprx16,X
EOR oprx8,X
EOR ,X
EOR oprx16,SP
EOR oprx8,SP
Exclusive OR Memory with Accumulator
A ← (A ⊕ M)
IMM
DIR
EXT
IX2
IX1
IX
SP2
SP1
A8
B8
C8
D8
E8
F8
9E D8
9E E8
ii
dd
hh ll
ee ff
ff
ee ff
ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
0 – – –
Table 7-2. . Instruction Set Summary (Sheet 4 of 9)
Source
Form Operation
Address
Mode
Object Code
Cycles
Cyc-by-Cyc
Details
Affect
on CCR
VH I N Z C
Chapter 7 Central Processor Unit (S08CPUV2)
MC9S08JM60 Series Data Sheet, Rev. 3
112 Freescale Semiconductor
INC opr8a
INCA
INCX
INC oprx8,X
INC ,X
INC oprx8,SP
Increment M ← (M) + $01
A ← (A) + $01
X ← (X) + $01
M ← (M) + $01
M ← (M) + $01
M ← (M) + $01
DIR
INH
INH
IX1
IX
SP1
3C
4C
5C
6C
7C
9E 6C
dd
ff
ff
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
–– –
JMP opr8a
JMP opr16a
JMP oprx16,X
JMP oprx8,X
JMP ,X
Jump
PC ← Jump Address
DIR
EXT
IX2
IX1
IX
BC
CC
DC
EC
FC
dd
hh ll
ee ff
ff
3
4
4
3
3
ppp
pppp
pppp
ppp
ppp
– – – – – –
JSR opr8a
JSR opr16a
JSR oprx16,X
JSR oprx8,X
JSR ,X
Jump to Subroutine
PC ← (PC) + n (n = 1, 2, or 3)
Push (PCL); SP ← (SP) – $0001
Push (PCH); SP ← (SP) – $0001
PC ← Unconditional Address
DIR
EXT
IX2
IX1
IX
BD
CD
DD
ED
FD
dd
hh ll
ee ff
ff
5
6
6
5
5
ssppp
pssppp
pssppp
ssppp
ssppp
– – – – – –
LDA #opr8i
LDA opr8a
LDA opr16a
LDA oprx16,X
LDA oprx8,X
LDA ,X
LDA oprx16,SP
LDA oprx8,SP
Load Accumulator from Memory
A ← (M)
IMM
DIR
EXT
IX2
IX1
IX
SP2
SP1
A6
B6
C6
D6
E6
F6
9E D6
9E E6
ii
dd
hh ll
ee ff
ff
ee ff
ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
0 – – –
LDHX #opr16i
LDHX opr8a
LDHX opr16a
LDHX ,X
LDHX oprx16,X
LDHX oprx8,X
LDHX oprx8,SP
Load Index Register (H:X)
H:X ← (M:M + $0001)
IMM
DIR
EXT
IX
IX2
IX1
SP1
45
55
32
9E AE
9E BE
9E CE
9E FE
jj kk
dd
hh ll
ee ff
ff
ff
3
4
5
5
6
5
5
ppp
rrpp
prrpp
prrfp
pprrpp
prrpp
prrpp
0 – – –
LDX #opr8i
LDX opr8a
LDX opr16a
LDX oprx16,X
LDX oprx8,X
LDX ,X
LDX oprx16,SP
LDX oprx8,SP
Load X (Index Register Low) from Memory
X ← (M)
IMM
DIR
EXT
IX2
IX1
IX
SP2
SP1
AE
BE
CE
DE
EE
FE
9E DE
9E EE
ii
dd
hh ll
ee ff
ff
ee ff
ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
0 – – –
LSL opr8a
LSLA
LSLX
LSL oprx8,X
LSL ,X
LSL oprx8,SP
Logical Shift Left
(Same as ASL)
DIR
INH
INH
IX1
IX
SP1
38
48
58
68
78
9E 68
dd
ff
ff
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
––
LSR opr8a
LSRA
LSRX
LSR oprx8,X
LSR ,X
LSR oprx8,SP
Logical Shift Right DIR
INH
INH
IX1
IX
SP1
34
44
54
64
74
9E 64
dd
ff
ff
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
–– 0
Table 7-2. . Instruction Set Summary (Sheet 5 of 9)
Source
Form Operation
Address
Mode
Object Code
Cycles
Cyc-by-Cyc
Details
Affect
on CCR
VH I N Z C
C
b0
b7
0
b0
b7
C0
Chapter 7 Central Processor Unit (S08CPUV2)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 113
MOV opr8a,opr8a
MOV opr8a,X+
MOV #opr8i,opr8a
MOV ,X+,opr8a
Move
(M)destination ← (M)source
In IX+/DIR and DIR/IX+ Modes,
H:X ← (H:X) + $0001
DIR/DIR
DIR/IX+
IMM/DIR
IX+/DIR
4E
5E
6E
7E
dd dd
dd
ii dd
dd
5
5
4
5
rpwpp
rfwpp
pwpp
rfwpp
0 – – –
MUL Unsigned multiply
X:A ← (X) × (A) INH 42 5ffffp – 0– – – 0
NEG opr8a
NEGA
NEGX
NEG oprx8,X
NEG ,X
NEG oprx8,SP
Negate M ← – (M) = $00 – (M)
(Two’s Complement) A ← – (A) = $00 – (A)
X ← – (X) = $00 – (X)
M ← – (M) = $00 – (M)
M ← – (M) = $00 – (M)
M ← – (M) = $00 – (M)
DIR
INH
INH
IX1
IX
SP1
30
40
50
60
70
9E 60
dd
ff
ff
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
––
NOP No Operation — Uses 1 Bus Cycle INH 9D 1p– – – – – –
NSA Nibble Swap Accumulator
A ← (A[3:0]:A[7:4]) INH 62 1p– – – – – –
ORA #opr8i
ORA opr8a
ORA opr16a
ORA oprx16,X
ORA oprx8,X
ORA ,X
ORA oprx16,SP
ORA oprx8,SP
Inclusive OR Accumulator and Memory
A ← (A) | (M)
IMM
DIR
EXT
IX2
IX1
IX
SP2
SP1
AA
BA
CA
DA
EA
FA
9E DA
9E EA
ii
dd
hh ll
ee ff
ff
ee ff
ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
0 – – –
PSHA Push Accumulator onto Stack
Push (A); SP ← (SP) – $0001 INH 87 2sp – – – – – –
PSHH Push H (Index Register High) onto Stack
Push (H); SP ← (SP) – $0001 INH 8B 2sp – – – – – –
PSHX Push X (Index Register Low) onto Stack
Push (X); SP ← (SP) – $0001 INH 89 2sp – – – – – –
PULA Pull Accumulator from Stack
SP ← (SP + $0001); Pull (A)INH 86 3ufp – – – – – –
PULH Pull H (Index Register High) from Stack
SP ← (SP + $0001); Pull (H)INH 8A 3ufp – – – – – –
PULX Pull X (Index Register Low) from Stack
SP ← (SP + $0001); Pull (X)INH 88 3ufp – – – – – –
ROL opr8a
ROLA
ROLX
ROL oprx8,X
ROL ,X
ROL oprx8,SP
Rotate Left through Carry DIR
INH
INH
IX1
IX
SP1
39
49
59
69
79
9E 69
dd
ff
ff
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
––
ROR opr8a
RORA
RORX
ROR oprx8,X
ROR ,X
ROR oprx8,SP
Rotate Right through Carry DIR
INH
INH
IX1
IX
SP1
36
46
56
66
76
9E 66
dd
ff
ff
5
1
1
5
4
6
rfwpp
p
p
rfwpp
rfwp
prfwpp
––
Table 7-2. . Instruction Set Summary (Sheet 6 of 9)
Source
Form Operation
Address
Mode
Object Code
Cycles
Cyc-by-Cyc
Details
Affect
on CCR
VH I N Z C
C
b0
b7
b0
b7
C
Chapter 7 Central Processor Unit (S08CPUV2)
MC9S08JM60 Series Data Sheet, Rev. 3
114 Freescale Semiconductor
RSP
Reset Stack Pointer (Low Byte)
SPL ← $FF
(High Byte Not Affected)
INH 9C 1p– – – – – –
RTI
Return from Interrupt
SP ← (SP) + $0001; Pull (CCR)
SP ← (SP) + $0001; Pull (A)
SP ← (SP) + $0001; Pull (X)
SP ← (SP) + $0001; Pull (PCH)
SP ← (SP) + $0001; Pull (PCL)
INH 80 9uuuuufppp
RTS
Return from Subroutine
SP ← SP + $0001; Pull (PCH)
SP ← SP + $0001; Pull (PCL)
INH 81 5ufppp – – – – – –
SBC #opr8i
SBC opr8a
SBC opr16a
SBC oprx16,X
SBC oprx8,X
SBC ,X
SBC oprx16,SP
SBC oprx8,SP
Subtract with Carry
A ← (A) – (M) – (C)
IMM
DIR
EXT
IX2
IX1
IX
SP2
SP1
A2
B2
C2
D2
E2
F2
9E D2
9E E2
ii
dd
hh ll
ee ff
ff
ee ff
ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
––
SEC Set Carry Bit
(C ← 1) INH 99 1p– – – – – 1
SEI Set Interrupt Mask Bit
(I ← 1) INH 9B 1p– – 1 – – –
STA opr8a
STA opr16a
STA oprx16,X
STA oprx8,X
STA ,X
STA oprx16,SP
STA oprx8,SP
Store Accumulator in Memory
M ← (A)
DIR
EXT
IX2
IX1
IX
SP2
SP1
B7
C7
D7
E7
F7
9E D7
9E E7
dd
hh ll
ee ff
ff
ee ff
ff
3
4
4
3
2
5
4
wpp
pwpp
pwpp
wpp
wp
ppwpp
pwpp
0 – – –
STHX opr8a
STHX opr16a
STHX oprx8,SP
Store H:X (Index Reg.)
(M:M + $0001) ← (H:X)
DIR
EXT
SP1
35
96
9E FF
dd
hh ll
ff
4
5
5
wwpp
pwwpp
pwwpp
0 – – –
STOP
Enable Interrupts: Stop Processing
Refer to MCU Documentation
I bit ← 0; Stop Processing
INH 8E 2fp... – – 0 – – –
STX opr8a
STX opr16a
STX oprx16,X
STX oprx8,X
STX ,X
STX oprx16,SP
STX oprx8,SP
Store X (Low 8 Bits of Index Register)
in Memory
M ← (X)
DIR
EXT
IX2
IX1
IX
SP2
SP1
BF
CF
DF
EF
FF
9E DF
9E EF
dd
hh ll
ee ff
ff
ee ff
ff
3
4
4
3
2
5
4
wpp
pwpp
pwpp
wpp
wp
ppwpp
pwpp
0 – – –
Table 7-2. . Instruction Set Summary (Sheet 7 of 9)
Source
Form Operation
Address
Mode
Object Code
Cycles
Cyc-by-Cyc
Details
Affect
on CCR
VH I N Z C
Chapter 7 Central Processor Unit (S08CPUV2)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 115
SUB #opr8i
SUB opr8a
SUB opr16a
SUB oprx16,X
SUB oprx8,X
SUB ,X
SUB oprx16,SP
SUB oprx8,SP
Subtract
A ← (A) – (M)
IMM
DIR
EXT
IX2
IX1
IX
SP2
SP1
A0
B0
C0
D0
E0
F0
9E D0
9E E0
ii
dd
hh ll
ee ff
ff
ee ff
ff
2
3
4
4
3
3
5
4
pp
rpp
prpp
prpp
rpp
rfp
pprpp
prpp
––
SWI
Software Interrupt
PC ← (PC) + $0001
Push (PCL); SP ← (SP) – $0001
Push (PCH); SP ← (SP) – $0001
Push (X); SP ← (SP) – $0001
Push (A); SP ← (SP) – $0001
Push (CCR); SP ← (SP) – $0001
I ← 1;
PCH ← Interrupt Vector High Byte
PCL ← Interrupt Vector Low Byte
INH 83 11 sssssvvfppp – – 1 – – –
TAP Transfer Accumulator to CCR
CCR ← (A) INH 84 1p
TAX
Transfer Accumulator to X (Index Register
Low)
X ← (A)
INH 97 1p– – – – – –
TPA Transfer CCR to Accumulator
A ← (CCR) INH 85 1p– – – – – –
TST opr8a
TSTA
TSTX
TST oprx8,X
TST ,X
TST oprx8,SP
Test for Negative or Zero (M) – $00
(A) – $00
(X) – $00
(M) – $00
(M) – $00
(M) – $00
DIR
INH
INH
IX1
IX
SP1
3D
4D
5D
6D
7D
9E 6D
dd
ff
ff
4
1
1
4
3
5
rfpp
p
p
rfpp
rfp
prfpp
0 – – –
TSX Transfer SP to Index Reg.
H:X ← (SP) + $0001 INH 95 2fp – – – – – –
TXA Transfer X (Index Reg. Low) to Accumulator
A ← (X) INH 9F 1p– – – – – –
Table 7-2. . Instruction Set Summary (Sheet 8 of 9)
Source
Form Operation
Address
Mode
Object Code
Cycles
Cyc-by-Cyc
Details
Affect
on CCR
VH I N Z C
Chapter 7 Central Processor Unit (S08CPUV2)
MC9S08JM60 Series Data Sheet, Rev. 3
116 Freescale Semiconductor
TXS Transfer Index Reg. to SP
SP ← (H:X) – $0001 INH 94 2fp – – – – – –
WAIT Enable Interrupts; Wait for Interrupt
I bit ← 0; Halt CPU INH 8F 2+ fp... – – 0 – – –
Source Form: Everything in the source forms columns, except expressions in italic characters, is literal information which must appear in
the assembly source file exactly as shown. The initial 3- to 5-letter mnemonic and the characters (# , ( ) and +) are always a literal
characters.
nAny label or expression that evaluates to a single integer in the range 0-7.
opr8i Any label or expression that evaluates to an 8-bit immediate value.
opr16i Any label or expression that evaluates to a 16-bit immediate value.
opr8a Any label or expression that evaluates to an 8-bit direct-page address ($00xx).
opr16a Any label or expression that evaluates to a 16-bit address.
oprx8 Any label or expression that evaluates to an unsigned 8-bit value, used for indexed addressing.
oprx16 Any label or expression that evaluates to a 16-bit value, used for indexed addressing.
rel Any label or expression that refers to an address that is within –128 to +127 locations from the start of the next instruction.
Operation Symbols:
A Accumulator
CCR Condition code register
H Index register high byte
M Memory location
nAny bit
opr Operand (one or two bytes)
PC Program counter
PCH Program counter high byte
PCL Program counter low byte
rel Relative program counter offset byte
SP Stack pointer
SPL Stack pointer low byte
X Index register low byte
& Logical AND
| Logical OR
⊕Logical EXCLUSIVE OR
( ) Contents of
+Add
– Subtract, Negation (two’s complement)
×Multiply
÷Divide
# Immediate value
←Loaded with
: Concatenated with
Addressing Modes:
DIR Direct addressing mode
EXT Extended addressing mode
IMM Immediate addressing mode
INH Inherent addressing mode
IX Indexed, no offset addressing mode
IX1 Indexed, 8-bit offset addressing mode
IX2 Indexed, 16-bit offset addressing mode
IX+ Indexed, no offset, post increment addressing mode
IX1+ Indexed, 8-bit offset, post increment addressing mode
REL Relative addressing mode
SP1 Stack pointer, 8-bit offset addressing mode
SP2 Stack pointer 16-bit offset addressing mode
Cycle-by-Cycle Codes:
fFree cycle. This indicates a cycle where the CPU
does not require use of the system buses. An f
cycle is always one cycle of the system bus clock
and is always a read cycle.
pProgryam fetch; read from next consecutive
location in program memory
rRead 8-bit operand
s Push (write) one byte onto stack
uPop (read) one byte from stack
vRead vector from $FFxx (high byte first)
wWrite 8-bit operand
CCR Bits:
VOverflow bit
H Half-carry bit
I Interrupt mask
N Negative bit
Z Zero bit
C Carry/borrow bit
CCR Effects:
Set or cleared
– Not affected
U Undefined
Table 7-2. . Instruction Set Summary (Sheet 9 of 9)
Source
Form Operation
Address
Mode
Object Code
Cycles
Cyc-by-Cyc
Details
Affect
on CCR
VH I N Z C
Chapter 7 Central Processor Unit (S08CPUV2)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 117
Table 7-3. Opcode Map (Sheet 1 of 2)
Bit-Manipulation Branch Read-Modify-Write Control Register/Memory
00 5
BRSET0
3DIR
10 5
BSET0
2DIR
20 3
BRA
2REL
30 5
NEG
2DIR
40 1
NEGA
1INH
50 1
NEGX
1INH
60 5
NEG
2IX1
70 4
NEG
1IX
80 9
RTI
1INH
90 3
BGE
2REL
A0 2
SUB
2IMM
B0 3
SUB
2DIR
C0 4
SUB
3 EXT
D0 4
SUB
3IX2
E0 3
SUB
2IX1
F0 3
SUB
1IX
01 5
BRCLR0
3DIR
11 5
BCLR0
2DIR
21 3
BRN
2REL
31 5
CBEQ
3DIR
41 4
CBEQA
3IMM
51 4
CBEQX
3IMM
61 5
CBEQ
3IX1+
71 5
CBEQ
2IX+
81 6
RTS
1INH
91 3
BLT
2REL
A1 2
CMP
2IMM
B1 3
CMP
2DIR
C1 4
CMP
3 EXT
D1 4
CMP
3IX2
E1 3
CMP
2IX1
F1 3
CMP
1IX
02 5
BRSET1
3DIR
12 5
BSET1
2DIR
22 3
BHI
2REL
32 5
LDHX
3EXT
42 5
MUL
1INH
52 6
DIV
1INH
62 1
NSA
1INH
72 1
DAA
1INH
82 5+
BGND
1INH
92 3
BGT
2REL
A2 2
SBC
2IMM
B2 3
SBC
2DIR
C2 4
SBC
3 EXT
D2 4
SBC
3IX2
E2 3
SBC
2IX1
F2 3
SBC
1IX
03 5
BRCLR1
3DIR
13 5
BCLR1
2DIR
23 3
BLS
2REL
33 5
COM
2DIR
43 1
COMA
1INH
53 1
COMX
1INH
63 5
COM
2IX1
73 4
COM
1IX
83 11
SWI
1INH
93 3
BLE
2REL
A3 2
CPX
2IMM
B3 3
CPX
2DIR
C3 4
CPX
3 EXT
D3 4
CPX
3IX2
E3 3
CPX
2IX1
F3 3
CPX
1IX
04 5
BRSET2
3DIR
14 5
BSET2
2DIR
24 3
BCC
2REL
34 5
LSR
2DIR
44 1
LSRA
1INH
54 1
LSRX
1INH
64 5
LSR
2IX1
74 4
LSR
1IX
84 1
TA P
1INH
94 2
TXS
1INH
A4 2
AND
2IMM
B4 3
AND
2DIR
C4 4
AND
3 EXT
D4 4
AND
3IX2
E4 3
AND
2IX1
F4 3
AND
1IX
05 5
BRCLR2
3DIR
15 5
BCLR2
2DIR
25 3
BCS
2REL
35 4
STHX
2DIR
45 3
LDHX
3IMM
55 4
LDHX
2DIR
65 3
CPHX
3IMM
75 5
CPHX
2DIR
85 1
TPA
1INH
95 2
TSX
1INH
A5 2
BIT
2IMM
B5 3
BIT
2DIR
C5 4
BIT
3 EXT
D5 4
BIT
3IX2
E5 3
BIT
2IX1
F5 3
BIT
1IX
06 5
BRSET3
3DIR
16 5
BSET3
2DIR
26 3
BNE
2REL
36 5
ROR
2DIR
46 1
RORA
1INH
56 1
RORX
1INH
66 5
ROR
2IX1
76 4
ROR
1IX
86 3
PULA
1INH
96 5
STHX
3EXT
A6 2
LDA
2IMM
B6 3
LDA
2DIR
C6 4
LDA
3 EXT
D6 4
LDA
3IX2
E6 3
LDA
2IX1
F6 3
LDA
1IX
07 5
BRCLR3
3DIR
17 5
BCLR3
2DIR
27 3
BEQ
2REL
37 5
ASR
2DIR
47 1
ASRA
1INH
57 1
ASRX
1INH
67 5
ASR
2IX1
77 4
ASR
1IX
87 2
PSHA
1INH
97 1
TA X
1INH
A7 2
AIS
2IMM
B7 3
STA
2DIR
C7 4
STA
3 EXT
D7 4
STA
3IX2
E7 3
STA
2IX1
F7 2
STA
1IX
08 5
BRSET4
3DIR
18 5
BSET4
2DIR
28 3
BHCC
2REL
38 5
LSL
2DIR
48 1
LSLA
1INH
58 1
LSLX
1INH
68 5
LSL
2IX1
78 4
LSL
1IX
88 3
PULX
1INH
98 1
CLC
1INH
A8 2
EOR
2IMM
B8 3
EOR
2DIR
C8 4
EOR
3 EXT
D8 4
EOR
3IX2
E8 3
EOR
2IX1
F8 3
EOR
1IX
09 5
BRCLR4
3DIR
19 5
BCLR4
2DIR
29 3
BHCS
2REL
39 5
ROL
2DIR
49 1
ROLA
1INH
59 1
ROLX
1INH
69 5
ROL
2IX1
79 4
ROL
1IX
89 2
PSHX
1INH
99 1
SEC
1INH
A9 2
ADC
2IMM
B9 3
ADC
2DIR
C9 4
ADC
3 EXT
D9 4
ADC
3IX2
E9 3
ADC
2IX1
F9 3
ADC
1IX
0A 5
BRSET5
3DIR
1A 5
BSET5
2DIR
2A 3
BPL
2REL
3A 5
DEC
2DIR
4A 1
DECA
1INH
5A 1
DECX
1INH
6A 5
DEC
2IX1
7A 4
DEC
1IX
8A 3
PULH
1INH
9A 1
CLI
1INH
AA 2
ORA
2IMM
BA 3
ORA
2DIR
CA 4
ORA
3 EXT
DA 4
ORA
3IX2
EA 3
ORA
2IX1
FA 3
ORA
1IX
0B 5
BRCLR5
3DIR
1B 5
BCLR5
2DIR
2B 3
BMI
2REL
3B 7
DBNZ
3DIR
4B 4
DBNZA
2INH
5B 4
DBNZX
2INH
6B 7
DBNZ
3IX1
7B 6
DBNZ
2IX
8B 2
PSHH
1INH
9B 1
SEI
1INH
AB 2
ADD
2IMM
BB 3
ADD
2DIR
CB 4
ADD
3 EXT
DB 4
ADD
3IX2
EB 3
ADD
2IX1
FB 3
ADD
1IX
0C 5
BRSET6
3DIR
1C 5
BSET6
2DIR
2C 3
BMC
2REL
3C 5
INC
2DIR
4C 1
INCA
1INH
5C 1
INCX
1INH
6C 5
INC
2IX1
7C 4
INC
1IX
8C 1
CLRH
1INH
9C 1
RSP
1INH
BC 3
JMP
2DIR
CC 4
JMP
3 EXT
DC 4
JMP
3IX2
EC 3
JMP
2IX1
FC 3
JMP
1IX
0D 5
BRCLR6
3DIR
1D 5
BCLR6
2DIR
2D 3
BMS
2REL
3D 4
TST
2DIR
4D 1
TSTA
1INH
5D 1
TSTX
1INH
6D 4
TST
2IX1
7D 3
TST
1IX
9D 1
NOP
1INH
AD 5
BSR
2REL
BD 5
JSR
2DIR
CD 6
JSR
3 EXT
DD 6
JSR
3IX2
ED 5
JSR
2IX1
FD 5
JSR
1IX
0E 5
BRSET7
3DIR
1E 5
BSET7
2DIR
2E 3
BIL
2REL
3E 6
CPHX
3EXT
4E 5
MOV
3DD
5E 5
MOV
2DIX+
6E 4
MOV
3IMD
7E 5
MOV
2IX+D
8E 2+
STOP
1INH
9E
Page 2 AE 2
LDX
2IMM
BE 3
LDX
2DIR
CE 4
LDX
3 EXT
DE 4
LDX
3IX2
EE 3
LDX
2IX1
FE 3
LDX
1IX
0F 5
BRCLR7
3DIR
1F 5
BCLR7
2DIR
2F 3
BIH
2REL
3F 5
CLR
2DIR
4F 1
CLRA
1INH
5F 1
CLRX
1INH
6F 5
CLR
2IX1
7F 4
CLR
1IX
8F 2+
WAIT
1INH
9F 1
TXA
1INH
AF 2
AIX
2IMM
BF 3
STX
2DIR
CF 4
STX
3 EXT
DF 4
STX
3IX2
EF 3
STX
2IX1
FF 2
STX
1IX
INH Inherent REL Relative SP1 Stack Pointer, 8-Bit Offset
IMM Immediate IX Indexed, No Offset SP2 Stack Pointer, 16-Bit Offset
DIR Direct IX1 Indexed, 8-Bit Offset IX+ Indexed, No Offset with
EXT Extended IX2 Indexed, 16-Bit Offset Post Increment
DD DIR to DIR IMD IMM to DIR IX1+ Indexed, 1-Byte Offset with
IX+D IX+ to DIR DIX+ DIR to IX+ Post Increment Opcode in
Hexadecimal
Number of Bytes
F0 3
SUB
1IX
HCS08 Cycles
Instruction Mnemonic
Addressing Mode
Chapter 7 Central Processor Unit (S08CPUV2)
MC9S08JM60 Series Data Sheet, Rev. 3
118 Freescale Semiconductor
Bit-Manipulation Branch Read-Modify-Write Control Register/Memory
9E60 6
NEG
3SP1
9ED0 5
SUB
4SP2
9EE0 4
SUB
3SP1
9E61 6
CBEQ
4SP1
9ED1 5
CMP
4SP2
9EE1 4
CMP
3SP1
9ED2 5
SBC
4SP2
9EE2 4
SBC
3SP1
9E63 6
COM
3SP1
9ED3 5
CPX
4SP2
9EE3 4
CPX
3SP1
9EF3 6
CPHX
3SP1
9E64 6
LSR
3SP1
9ED4 5
AND
4SP2
9EE4 4
AND
3SP1
9ED5 5
BIT
4SP2
9EE5 4
BIT
3SP1
9E66 6
ROR
3SP1
9ED6 5
LDA
4SP2
9EE6 4
LDA
3SP1
9E67 6
ASR
3SP1
9ED7 5
STA
4SP2
9EE7 4
STA
3SP1
9E68 6
LSL
3SP1
9ED8 5
EOR
4SP2
9EE8 4
EOR
3SP1
9E69 6
ROL
3SP1
9ED9 5
ADC
4SP2
9EE9 4
ADC
3SP1
9E6A 6
DEC
3SP1
9EDA 5
ORA
4SP2
9EEA 4
ORA
3SP1
9E6B 8
DBNZ
4SP1
9EDB 5
ADD
4SP2
9EEB 4
ADD
3SP1
9E6C 6
INC
3SP1
9E6D 5
TST
3SP1
9EAE 5
LDHX
2IX
9EBE 6
LDHX
4IX2
9ECE 5
LDHX
3IX1
9EDE 5
LDX
4SP2
9EEE 4
LDX
3SP1
9EFE 5
LDHX
3SP1
9E6F 6
CLR
3SP1
9EDF 5
STX
4SP2
9EEF 4
STX
3SP1
9EFF 5
STHX
3SP1
INH Inherent REL Relative SP1 Stack Pointer, 8-Bit Offset
IMM Immediate IX Indexed, No Offset SP2 Stack Pointer, 16-Bit Offset
DIR Direct IX1 Indexed, 8-Bit Offset IX+ Indexed, No Offset with
EXT Extended IX2 Indexed, 16-Bit Offset Post Increment
DD DIR to DIR IMD IMM to DIR IX1+ Indexed, 1-Byte Offset with
IX+D IX+ to DIR DIX+ DIR to IX+ Post Increment
Note: All Sheet 2 Opcodes are Preceded by the Page 2 Prebyte (9E) Prebyte (9E) and Opcode in
Hexadecimal
Number of Bytes
9E60 6
NEG
3SP1
HCS08 Cycles
Instruction Mnemonic
Addressing Mode
Table 7-3. Opcode Map (Sheet 2 of 2)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 119
Chapter 8
5 V Analog Comparator (S08ACMPV2)
8.1 Introduction
The analog comparator module (ACMP) provides a circuit for comparing two analog input voltages or for
comparing one analog input voltage to an internal reference voltage. The comparator circuit is designed to
operate across the full range of the supply voltage (rail to rail operation).
NOTE
MC9S08JM60 series devices operate at a higher voltage range (2.7 V to
5.5 V) and do not include stop1 mode. Therefore, please disregard
references to stop1.
8.1.1 ACMP Configuration Information
When using the bandgap reference voltage for input to ACMP+, the user must enable the bandgap buffer
by setting BGBE =1 in SPMSC1 see Section 5.7.7, “System Power Management Status and Control 1
Register (SPMSC1).” For value of bandgap voltage reference see Appendix A.6, “DC Characteristics.”
8.1.2 ACMP/TPM Configuration Information
The ACMP module can be configured to connect the output of the analog comparator to TPM input capture
channel 0 by setting ACIC in SOPT2. With ACIC set, the TPM1CH0 pin is not available externally
regardless of the configuration of the TPM module.
Chapter 8 5 V Analog Comparator (S08ACMPV2)
MC9S08JM60 Series Data Sheet, Rev. 3
120 Freescale Semiconductor
Figure 8-1. MC9S08JM60 Series Block Diagram Highlighting ACMP Block and Pins
PTD4/ADP11
PTD5
PTD6
PTC1/SDA
PTC0/SCL
VSS
VDD
PTE3/TPM1CH1
PTE2/TPM1CH0
PTA5– PTA0
PTE0/TxD1
PTE1/RxD1
PTD1/ADP9/ACMP–
PTD0/ADP8/ACMP+
PTC6
PTC5/RxD2
PTC4
PTC3/TxD2
PTC2
PORT A
PORT C
PORT D
PORT E
8-BIT KEYBOARD
INTERRUPT MODULE (KBI)
IIC MODULE (IIC)
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
USER Flash (IN BYTES)
USER RAM (IN BYTES)
ON-CHIP ICE AND
DEBUG MODULE (DBG)
MC9S08JM60 = 60,912
HCS08 CORE
CPUBDC
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pull-down device if IRQ is enabled
(IRQPE = 1). Pull-down is enabled if rising edge detect is selected (IRQEDG = 1)
3. IRQ does not have a clamp diode to VDD. IRQ must not be driven above VDD.
4. Pin contains integrated pullup device.
5. When pin functions as KBI (KBIPEn = 1) and associated pin is configured to enable the
pullup device, KBEDGn can be used to reconfigure the pullup as a pull-down device.
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTB5/KBIP5/ADP5
PORT B
PTE5/MOSI1
PTE4/MISO1
PTE6/SPSCK1
PTE7/SS1
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
VOLTAGE
REGULATOR
COP IRQ LVD
LOW-POWER OSCILLATOR
MULTI-PURPOSE CLOCK
GENERATOR (MCG)
RESET
VSSAD
VDDAD
VREFH
ANALOG-TO-DIGITAL
CONVERTER (ADC)
6-CHANNEL TIMER/PWM
MODULE (TPM1)
PTD7
6
PTB4/KBIP4/ADP4
PTG3/KBIP7
PTG2/KBIP6
PORT G
12-CHANNEL, 12-BIT
BKGD/MS
PTF3/TPM1CH5
PTF2/TPM1CH4
PTF0/TPM1CH2
PTF1/TPM1CH3
PORT F
PTF5/TPM2CH1
PTF4/TPM2CH0
PTF6
PTF7
INTERFACE MODULE (SCI1)
SERIAL COMMUNICATIONS
INTERFACE MODULE (SCI2)
SERIAL COMMUNICATIONS
PTG0/KBIP0
PTG1/KBIP1
MC9S08JM32 = 32,768
VREFL
PTG4/XTAL
PTG5/EXTAL
IRQ/TPMCLK RxD2
TxD2
SDA
SCL
8
KBIPx
KBIPx
TPMCLK
SPSCK1
SS1
MISO1
MOSI1
TPMCLK
TPM1CH1
TPM1CH0
RxD1
TxD1
EXTAL
XTAL
4
4
USB SIE
USB ENDPOINT
RAM
FULL SPEED
USB
TRANSCEIVER
USBDP
USBDN
MISO2
SS2
SPSCK2
MOSI2 PTB1/MOSI2/ADP1
PTB0/MISO2/ADP0
PTB7/ADP7
PTB6/ADP6
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI2)
REAL-TIME COUNTER
(RTC)
PTB3/SS2/ADP3
PTB2/SPSCK2/ADP2
TPM1CHx
4
TPM2CH1
TPM2CH0
4
ANALOG COMPARATOR
(ACMP)
SYSTEM
USB 3.3-V VOLTAGE REGULATOR
VUSB33
MC9S08JM60 = 4096
MC9S08JM32 = 2048
ACMPO
ACMP+
ACMP–
PTD3/KBIP3/ADP10
PTD2/KBIP2/ACMPO
V
SSOSC
Analog Comparator (S08ACMPV2)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 121
8.1.3 Features
The ACMP has the following features:
• Full rail to rail supply operation.
• Selectable interrupt on rising edge, falling edge, or either rising or falling edges of comparator
output.
• Option to compare to fixed internal bandgap reference voltage.
• Option to allow comparator output to be visible on a pin, ACMPO.
• Can operate in stop3 mode
8.1.4 Modes of Operation
This section defines the ACMP operation in wait, stop and background debug modes.
8.1.4.1 ACMP in Wait Mode
The ACMP continues to run in wait mode if enabled before executing the WAIT instruction. Therefore,
the ACMP can be used to bring the MCU out of wait mode if the ACMP interrupt, ACIE is enabled. For
lowest possible current consumption, the ACMP should be disabled by software if not required as an
interrupt source during wait mode.
8.1.4.2 ACMP in Stop Modes
8.1.4.2.1 Stop3 Mode Operation
The ACMP continues to operate in stop3 mode if enabled and compare operation remains active. If
ACOPE is enabled, comparator output operates as in the normal operating mode and comparator output is
placed onto the external pin. The MCU is brought out of stop when a compare event occurs and ACIE is
enabled; ACF flag sets accordingly.
If stop is exited with a reset, the ACMP will be put into its reset state.
8.1.4.2.2 Stop2 and Stop1 Mode Operation
During either stop2 and stop1 mode, the ACMP module will be fully powered down. Upon wake-up from
stop2 or stop1 mode, the ACMP module will be in the reset state.
8.1.4.3 ACMP in Active Background Mode
When the microcontroller is in active background mode, the ACMP will continue to operate normally.
8.1.5 Block Diagram
The block diagram for the Analog Comparator module is shown Figure 8-2.
Analog Comparator (S08ACMPV2)
MC9S08JM60 Series Data Sheet, Rev. 3
122 Freescale Semiconductor
Figure 8-2. Analog Comparator 5V (ACMP5) Block Diagram
+
-
Interrupt
Control
Internal
Reference
ACBGS
Internal Bus
Status & Control
Register
ACMOD
set ACF
ACME ACF
ACIE
ACOPE
Comparator
ACMP
INTERRUPT
REQUEST
ACMP+
ACMP-
ACMPO
Analog Comparator (S08ACMPV2)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 123
8.2 External Signal Description
The ACMP has two analog input pins, ACMP+ and ACMP- and one digital output pin ACMPO. Each of
these pins can accept an input voltage that varies across the full operating voltage range of the MCU. As
shown in Figure 8-2, the ACMP- pin is connected to the inverting input of the comparator, and the ACMP+
pin is connected to the comparator non-inverting input if ACBGS is a 0. As shown in Figure 8-2, the
ACMPO pin can be enabled to drive an external pin.
The signal properties of ACMP are shown in Table 8-1.
8.3 Memory Map
8.3.1 Register Descriptions
The ACMP includes one register:
• An 8-bit status and control register
Refer to the direct-page register summary in the memory section of this data sheet for the absolute address
assignments for all ACMP registers.This section refers to registers and control bits only by their names.
Some MCUs may have more than one ACMP, so register names include placeholder characters to identify
which ACMP is being referenced.
Table 8-1. Signal Properties
Signal Function I/O
ACMP- Inverting analog input to the ACMP.
(Minus input)
I
ACMP+ Non-inverting analog input to the ACMP.
(Positive input)
I
ACMPO Digital output of the ACMP. O
Analog Comparator (S08ACMPV2)
MC9S08JM60 Series Data Sheet, Rev. 3
124 Freescale Semiconductor
8.3.1.1 ACMP Status and Control Register (ACMPSC)
ACMPSC contains the status flag and control bits which are used to enable and configure the ACMP.
76543210
R
ACME ACBGS ACF ACIE
ACO
ACOPE ACMOD
W
Reset:00000000
= Unimplemented
Figure 8-3. ACMP Status and Control Register
Table 8-2. ACMP Status and Control Register Field Descriptions
Field Description
7
ACME
Analog Comparator Module Enable — ACME enables the ACMP module.
0 ACMP not enabled
1 ACMP is enabled
6
ACBGS
Analog Comparator Bandgap Select — ACBGS is used to select between the bandgap reference voltage or
the ACMP+ pin as the input to the non-inverting input of the analog comparatorr.
0 External pin ACMP+ selected as non-inverting input to comparator
1 Internal reference select as non-inverting input to comparator
Note: refer to this chapter introduction to verify if any other config bits are necessary to enable the bandgap
reference in the chip level.
5
ACF
Analog Comparator Flag — ACF is set when a compare event occurs. Compare events are defined by ACMOD.
ACF is cleared by writing a one to ACF.
0 Compare event has not occurred
1 Compare event has occurred
4
ACIE
Analog Comparator Interrupt Enable — ACIE enables the interrupt from the ACMP. When ACIE is set, an
interrupt will be asserted when ACF is set.
0 Interrupt disabled
1 Interrupt enabled
3
ACO
Analog Comparator Output — Reading ACO will return the current value of the analog comparator output. ACO
is reset to a 0 and will read as a 0 when the ACMP is disabled (ACME = 0).
2
ACOPE
Analog Comparator Output Pin Enable — ACOPE is used to enable the comparator output to be placed onto
the external pin, ACMPO.
0 Analog comparator output not available on ACMPO
1 Analog comparator output is driven out on ACMPO
1:0
ACMOD
Analog Comparator Mode — ACMOD selects the type of compare event which sets ACF.
00 Encoding 0 — Comparator output falling edge
01 Encoding 1 — Comparator output rising edge
10 Encoding 2 — Comparator output falling edge
11 Encoding 3 — Comparator output rising or falling edge
Analog Comparator (S08ACMPV2)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 125
8.4 Functional Description
The analog comparator can be used to compare two analog input voltages applied to ACMP+ and ACMP-;
or it can be used to compare an analog input voltage applied to ACMP- with an internal bandgap reference
voltage. ACBGS is used to select between the bandgap reference voltage or the ACMP+ pin as the input
to the non-inverting input of the analog comparator. The comparator output is high when the non-inverting
input is greater than the inverting input, and is low when the non-inverting input is less than the inverting
input. ACMOD is used to select the condition which will cause ACF to be set. ACF can be set on a rising
edge of the comparator output, a falling edge of the comparator output, or either a rising or a falling edge
(toggle). The comparator output can be read directly through ACO. The comparator output can be driven
onto the ACMPO pin using ACOPE.
Analog Comparator (S08ACMPV2)
MC9S08JM60 Series Data Sheet, Rev. 3
126 Freescale Semiconductor
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 127
Chapter 9
Keyboard Interrupt (S08KBIV2)
9.1 Introduction
The MC9S08JM60 series have one KBI module with eight keyboard interrupt inputs. See Chapter 2, “Pins
and Connections,” for more information about the logic and hardware aspects of these pins.
NOTE
MC9S08JM60 series devices operate at a higher voltage range (2.7 V to
5.5 V) and do not include stop1 mode. Therefore, please disregard
references to stop1.
Keyboard Interrupt (KBI) ModuleChapter 9 Keyboard Interrupt (S08KBIV2)
MC9S08JM60 Series Data Sheet, Rev. 3
128 Freescale Semiconductor
Figure 9-1. MC9S08JM60 Series Block Diagram Highlighting KBI Block and Pins
PTD4/ADP11
PTD5
PTD6
PTC1/SDA
PTC0/SCL
VSS
VDD
PTE3/TPM1CH1
PTE2/TPM1CH0
PTA5– PTA0
PTE0/TxD1
PTE1/RxD1
PTD1/ADP9/ACMP–
PTD0/ADP8/ACMP+
PTC6
PTC5/RxD2
PTC4
PTC3/TxD2
PTC2
PORT A
PORT C
PORT D
PORT E
8-BIT KEYBOARD
INTERRUPT MODULE (KBI)
IIC MODULE (IIC)
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
USER Flash (IN BYTES)
USER RAM (IN BYTES)
ON-CHIP ICE AND
DEBUG MODULE (DBG)
MC9S08JM60 = 60,912
HCS08 CORE
CPUBDC
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pull-down device if IRQ is enabled
(IRQPE = 1). Pull-down is enabled if rising edge detect is selected (IRQEDG = 1)
3. IRQ does not have a clamp diode to VDD. IRQ must not be driven above VDD.
4. Pin contains integrated pullup device.
5. When pin functions as KBI (KBIPEn = 1) and associated pin is configured to enable the
pullup device, KBEDGn can be used to reconfigure the pullup as a pull-down device.
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTB5/KBIP5/ADP5
PORT B
PTE5/MOSI1
PTE4/MISO1
PTE6/SPSCK1
PTE7/SS1
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
VOLTAGE
REGULATOR
COP IRQ LVD
LOW-POWER OSCILLATOR
MULTI-PURPOSE CLOCK
GENERATOR (MCG)
RESET
VSSAD
VDDAD
VREFH
ANALOG-TO-DIGITAL
CONVERTER (ADC)
6-CHANNEL TIMER/PWM
MODULE (TPM1)
PTD7
6
PTB4/KBIP4/ADP4
PTG3/KBIP7
PTG2/KBIP6
PORT G
12-CHANNEL, 12-BIT
BKGD/MS
PTF3/TPM1CH5
PTF2/TPM1CH4
PTF0/TPM1CH2
PTF1/TPM1CH3
PORT F
PTF5/TPM2CH1
PTF4/TPM2CH0
PTF6
PTF7
INTERFACE MODULE (SCI1)
SERIAL COMMUNICATIONS
INTERFACE MODULE (SCI2)
SERIAL COMMUNICATIONS
PTG0/KBIP0
PTG1/KBIP1
MC9S08JM32 = 32,768
VREFL
PTG4/XTAL
PTG5/EXTAL
IRQ/TPMCLK RxD2
TxD2
SDA
SCL
8
KBIPx
KBIPx
TPMCLK
SPSCK1
SS1
MISO1
MOSI1
TPMCLK
TPM1CH1
TPM1CH0
RxD1
TxD1
EXTAL
XTAL
4
4
USB SIE
USB ENDPOINT
RAM
FULL SPEED
USB
TRANSCEIVER
USBDP
USBDN
MISO2
SS2
SPSCK2
MOSI2 PTB1/MOSI2/ADP1
PTB0/MISO2/ADP0
PTB7/ADP7
PTB6/ADP6
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI2)
REAL-TIME COUNTER
(RTC)
PTB3/SS2/ADP3
PTB2/SPSCK2/ADP2
TPM1CHx
4
TPM2CH1
TPM2CH0
4
ANALOG COMPARATOR
(ACMP)
SYSTEM
USB 3.3-V VOLTAGE REGULATOR
VUSB33
MC9S08JM60 = 4096
MC9S08JM32 = 2048
ACMPO
ACMP+
ACMP–
PTD3/KBIP3/ADP10
PTD2/KBIP2/ACMPO
V
SSOSC
Keyboard Interrupts (S08KBIV2)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 129
9.1.1 Features
The KBI features include:
• Up to eight keyboard interrupt pins with individual pin enable bits.
• Each keyboard interrupt pin is programmable as falling edge (or rising edge) only, or both falling
edge and low level (or both rising edge and high level) interrupt sensitivity.
• One software enabled keyboard interrupt.
• Exit from low-power modes.
9.1.2 Modes of Operation
This section defines the KBI operation in wait, stop, and background debug modes.
9.1.2.1 KBI in Wait Mode
The KBI continues to operate in wait mode if enabled before executing the WAIT instruction. Therefore,
an enabled KBI pin (KBPEx = 1) can be used to bring the MCU out of wait mode if the KBI interrupt is
enabled (KBIE = 1).
9.1.2.2 KBI in Stop Modes
The KBI operates asynchronously in stop3 mode if enabled before executing the STOP instruction.
Therefore, an enabled KBI pin (KBPEx = 1) can be used to bring the MCU out of stop3 mode if the KBI
interrupt is enabled (KBIE = 1).
During either stop1 or stop2 mode, the KBI is disabled. In some systems, the pins associated with the KBI
may be sources of wakeup from stop1 or stop2, see the stop modes section in the Modes of Operation
chapter. Upon wake-up from stop1 or stop2 mode, the KBI module will be in the reset state.
9.1.2.3 KBI in Active Background Mode
When the microcontroller is in active background mode, the KBI will continue to operate normally.
9.1.3 Block Diagram
The block diagram for the keyboard interrupt module is shown Figure 9-2.
Keyboard Interrupts (S08KBIV2)
MC9S08JM60 Series Data Sheet, Rev. 3
130 Freescale Semiconductor
Figure 9-2. KBI Block Diagram
9.2 External Signal Description
The KBI input pins can be used to detect either falling edges, or both falling edge and low level interrupt
requests. The KBI input pins can also be used to detect either rising edges, or both rising edge and high
level interrupt requests.
The signal properties of KBI are shown in Table 9-1.
9.3 Register Definition
The KBI includes three registers:
• An 8-bit pin status and control register.
• An 8-bit pin enable register.
• An 8-bit edge select register.
Refer to the direct-page register summary in the Memory chapter for the absolute address assignments for
all KBI registers. This section refers to registers and control bits only by their names.
Some MCUs may have more than one KBI, so register names include placeholder characters to identify
which KBI is being referenced.
9.3.1 KBI Status and Control Register (KBISC)
KBISC contains the status flag and control bits, which are used to configure the KBI.
Table 9-1. Signal Properties
Signal Function I/O
KBIPn Keyboard interrupt pins I
DQ
CK
CLR
V
DD
KBMOD
KBIE
KEYBOARD
INTERRUPT FF
KBACK
RESET
SYNCHRONIZER
KBF
STOP BYPASS
STOP
BUSCLK
KBIPEn
0
1
S
KBEDGn
KBIPE0
0
1
S
KBEDG0
KBIP0
KBIPn
KBI
INTERRUPT
REQUEST
Keyboard Interrupts (S08KBIV2)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 131
9.3.2 KBI Pin Enable Register (KBIPE)
KBIPE contains the pin enable control bits.
9.3.3 KBI Edge Select Register (KBIES)
KBIES contains the edge select control bits.
76543210
R 0 0 0 0 KBF 0
KBIE KBMOD
WKBACK
Reset:00000000
= Unimplemented
Figure 9-3. KBI Status and Control Register
Table 9-2. KBISC Register Field Descriptions
Field Description
7:4 Unused register bits, always read 0.
3
KBF
Keyboard Interrupt Flag — KBF indicates when a keyboard interrupt is detected. Writes have no effect on KBF.
0 No keyboard interrupt detected.
1 Keyboard interrupt detected.
2
KBACK
Keyboard Acknowledge — Writing a 1 to KBACK is part of the flag clearing mechanism. KBACK always reads
as 0.
1
KBIE
Keyboard Interrupt Enable — KBIE determines whether a keyboard interrupt is requested.
0 Keyboard interrupt request not enabled.
1 Keyboard interrupt request enabled.
0
KBMOD
Keyboard Detection Mode — KBMOD (along with the KBEDG bits) controls the detection mode of the keyboard
interrupt pins.0Keyboard detects edges only.
1 Keyboard detects both edges and levels.
76543210
R
KBIPE7 KBIPE6 KBIPE5 KBIPE4 KBIPE3 KBIPE2 KBIPE1 KBIPE0
W
Reset:00000000
Figure 9-4. KBI Pin Enable Register
Table 9-3. KBIPE Register Field Descriptions
Field Description
7:0
KBIPEn
Keyboard Pin Enables — Each of the KBIPEn bits enable the corresponding keyboard interrupt pin.
0 Pin not enabled as keyboard interrupt.
1 Pin enabled as keyboard interrupt.
Keyboard Interrupts (S08KBIV2)
MC9S08JM60 Series Data Sheet, Rev. 3
132 Freescale Semiconductor
9.4 Functional Description
This on-chip peripheral module is called a keyboard interrupt (KBI) module because originally it was
designed to simplify the connection and use of row-column matrices of keyboard switches. However, these
inputs are also useful as extra external interrupt inputs and as an external means of waking the MCU from
stop or wait low-power modes.
The KBI module allows up to eight pins to act as additional interrupt sources. Writing to the KBIPEn bits
in the keyboard interrupt pin enable register (KBIPE) independently enables or disables each KBI pin.
Each KBI pin can be configured as edge sensitive or edge and level sensitive based on the KBMOD bit in
the keyboard interrupt status and control register (KBISC). Edge sensitive can be software programmed to
be either falling or rising; the level can be either low or high. The polarity of the edge or edge and level
sensitivity is selected using the KBEDGn bits in the keyboard interrupt edge select register (KBIES).
9.4.1 Edge Only Sensitivity
Synchronous logic is used to detect edges. A falling edge is detected when an enabled keyboard interrupt
(KBIPEn=1) input signal is seen as a logic 1 (the deasserted level) during one bus cycle and then a logic 0
(the asserted level) during the next cycle. A rising edge is detected when the input signal is seen as a logic
0 (the deasserted level) during one bus cycle and then a logic 1 (the asserted level) during the next
cycle.Before the first edge is detected, all enabled keyboard interrupt input signals must be at the
deasserted logic levels. After any edge is detected, all enabled keyboard interrupt input signals must return
to the deasserted level before any new edge can be detected.
A valid edge on an enabled KBI pin will set KBF in KBISC. If KBIE in KBISC is set, an interrupt request
will be presented to the CPU. Clearing of KBF is accomplished by writing a 1 to KBACK in KBISC.
9.4.2 Edge and Level Sensitivity
A valid edge or level on an enabled KBI pin will set KBF in KBISC. If KBIE in KBISC is set, an interrupt
request will be presented to the CPU. Clearing of KBF is accomplished by writing a 1 to KBACK in
76543210
R
KBEDG7 KBEDG6 KBEDG5 KBEDG4 KBEDG3 KBEDG2 KBEDG1 KBEDG0
W
Reset:00000000
Figure 9-5. KBI Edge Select Register
Table 9-4. KBIES Register Field Descriptions
Field Description
7:0
KBEDGn
Keyboard Edge Selects — Each of the KBEDGn bits selects the falling edge/low level or rising edge/high level
function of the corresponding pin).
0 Falling edge/low level.
1 Rising edge/high level.
Keyboard Interrupts (S08KBIV2)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 133
KBISC provided all enabled keyboard inputs are at their deasserted levels. KBF will remain set if any
enabled KBI pin is asserted while attempting to clear by writing a 1 to KBACK.
9.4.3 KBI Pullup/Pulldown Resistors
The KBI pins can be configured to use an internal pullup/pulldown resistor using the associated I/O port
pullup enable register. If an internal resistor is enabled, the KBIES register is used to select whether the
resistor is a pullup (KBEDGn = 0) or a pulldown (KBEDGn = 1).
9.4.4 KBI Initialization
When a keyboard interrupt pin is first enabled it is possible to get a false keyboard interrupt flag. To
prevent a false interrupt request during keyboard initialization, the user should do the following:
1. Mask keyboard interrupts by clearing KBIE in KBISC.
2. Enable the KBI polarity by setting the appropriate KBEDGn bits in KBIES.
3. If using internal pullup/pulldown device, configure the associated pullup enable bits in PTxPE.
4. Enable the KBI pins by setting the appropriate KBIPEn bits in KBIPE.
5. Write to KBACK in KBISC to clear any false interrupts.
6. Set KBIE in KBISC to enable interrupts.
Keyboard Interrupts (S08KBIV2)
MC9S08JM60 Series Data Sheet, Rev. 3
134 Freescale Semiconductor
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 135
Chapter 10
Analog-to-Digital Converter (S08ADC12V1)
10.1 Overview
The 12-bit analog-to-digital converter (ADC) is a successive approximation ADC designed for operation
within an integrated microcontroller system-on-chip.
NOTE
MC9S08JM60 series devices operate at a higher voltage range (2.7 V to
5.5 V) and do not include stop1 mode. Therefore, please disregard
references to stop1.
10.1.1 Module Configurations
This section provides information for configuring the ADC on this device.
10.1.1.1 Channel Assignments
The ADC channel assignments for the MC9S08JM60 Series devices are shown in the table below.
Reserved channels convert to an unknown value.
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
136 Freescale Semiconductor
NOTE
Selecting the internal bandgap channel requires BGBE =1 in SPMSC1 see
Section 5.7.7, “System Power Management Status and Control 1 Register
(SPMSC1).” For value of bandgap voltage reference see Appendix A.8,
“Analog Comparator (ACMP) Electricals.”
10.1.1.2 Alternate Clock
The ADC is capable of performing conversions using the MCU bus clock, the bus clock divided by two,
the local asynchronous clock (ADACK) within the module, or the alternate clock (ALTCLK). The
ALTCLK on this device is the MCGERCLK.
The selected clock source must run at a frequency such that the ADC conversion clock (ADCK) runs at a
frequency within its specified range (fADCK) after being divided down from the ALTCLK input as
determined by the ADIV bits.
ALTCLK is active while the MCU is in wait mode provided the conditions described above are met. This
allows ALTCLK to be used as the conversion clock source for the ADC while the MCU is in wait mode.
ALTCLK cannot be used as the ADC conversion clock source while the MCU is in stop3.
10.1.1.3 Hardware Trigger
The RTC on this device can be enabled as a hardware trigger for the ADC module by setting the
Table 10-1. ADC Channel Assignment
ADCH Channel Input Pin Control ADCH Channel Input Pin Control
00000 AD0 PTB0/MISO2/ADP0 ADPC0 10000 AD16 VREFL N/A
00001 AD1 PTB1/MOSI2/ADP1 ADPC1 10001 AD17 VREFL N/A
00010 AD2 PTB2/SPSCK2/ADP2 ADPC2 10010 AD18 VREFL N/A
00011 AD3 PTB3/SS2/ADP3 ADPC3 10011 AD19 VREFL N/A
00100 AD4 PTB4/KBIP4/ADP4 ADPC4 10100 AD20 VREFL N/A
00101 AD5 PTB5/KBIP5/ADP5 ADPC5 10101 AD21 Reserved N/A
00110 AD6 PTB6/ADP6 ADPC6 10110 AD22 Reserved N/A
00111 AD7 PTB7/ADP7 ADPC7 10111 AD23 Reserved N/A
01000 AD8 PTD0/ADP8/ACMP+ ADPC8 11000 AD24 Reserved N/A
01001 AD9 PTD1/ADP9/ACMP- ADPC9 11001 AD25 Reserved N/A
01010 AD10 PTD3/KBIP3/ADP10 ADPC10 11010 AD26 Temperature
Sensor1
1For more information, see Section 10.1.1.5, “Temperature Sensor.”
N/A
01011 AD11 PTD4/ADP11 ADPC11 11011 AD27 Internal Bandgap N/A
01100 AD12 VREFL ADPC12 11100 Reserved N/A
01101 AD13 VREFL ADPC13 11101 VREFH VREFH N/A
01110 AD14 VREFL ADPC14 11110 VREFL VREFL N/A
01111 AD15 VREFL ADPC15 11111 module
disabled
None N/A
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 137
ADCSC2[ADTRG] bit. When enabled, the ADC will be triggered every time RTCINT matches
RTCMOD. The RTC interrupt does not have to be enabled to trigger the ADC.
The RTC can be configured to cause a hardware trigger in MCU run, wait, and stop3.
10.1.1.4 Analog Pin Enables
The ADC on MC9S08JM60 series contains only two analog pin enable registers, APCTL1 and APCTL2.
10.1.1.5 Temperature Sensor
The ADC module includes a temperature sensor whose output is connected to one of the ADC analog
channel inputs. Equation 10-1 provides an approximate transfer function of the temperature sensor.
Temp = 25 – ((VTEMP – VTEMP25) ÷ m) Eqn. 10-1
where:
—V
TEMP is the voltage of the temperature sensor channel at the ambient temperature.
—V
TEMP25 is the voltage of the temperature sensor channel at 25°C.
— m is the hot or cold voltage versus temperature slope in V/°C.
For temperature calculations, use the VTEMP25 and m values from the ADC Electricals table.
In application code, the user reads the temperature sensor channel, calculates VTEMP
, and compares to
VTEMP25. If VTEMP is greater than VTEMP25, the cold slope value is applied in Equation 10-1. If VTEMP
is less than VTEMP25 the hot slope value is applied in Equation 10-1.
To improve accuracy, calibrate the bandgap voltage reference and temperature sensor. Calibrating at
25 °C will improve accuracy to ±4.5°C. Calibration at 3 points, –40°C, 25°C, and 125°C will improve
accuracy to ±2.5°C. Once calibration has been completed, the user will need to calculate the slope for both
hot and cold. In application code, the user would then calculate the temperature using Equation 10-1 as
detailed above and then determine if the temperature is above or below 25°C. Once determined, if the
temperature is above or below 25°C, the user can recalculate the temperature using the hot or cold slope
value obtained during calibration.
10.1.2 Low-Power Mode Operation
The ADC is capable of running in stop3 mode but requires LVDSE and LVDE in SPMSC1 to be set.
Chapter 10 Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
138 Freescale Semiconductor
Figure 10-1. MC9S08JM60 Series Block Diagram Highlighting ADC Block and Pins
PTD4/ADP11
PTD5
PTD6
PTC1/SDA
PTC0/SCL
VSS
VDD
PTE3/TPM1CH1
PTE2/TPM1CH0
PTA5– PTA0
PTE0/TxD1
PTE1/RxD1
PTD1/ADP9/ACMP–
PTD0/ADP8/ACMP+
PTC6
PTC5/RxD2
PTC4
PTC3/TxD2
PTC2
PORT A
PORT C
PORT D
PORT E
8-BIT KEYBOARD
INTERRUPT MODULE (KBI)
IIC MODULE (IIC)
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
USER Flash (IN BYTES)
USER RAM (IN BYTES)
ON-CHIP ICE AND
DEBUG MODULE (DBG)
MC9S08JM60 = 60,912
HCS08 CORE
CPUBDC
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pull-down device if IRQ is enabled
(IRQPE = 1). Pull-down is enabled if rising edge detect is selected (IRQEDG = 1)
3. IRQ does not have a clamp diode to VDD. IRQ must not be driven above VDD.
4. Pin contains integrated pullup device.
5. When pin functions as KBI (KBIPEn = 1) and associated pin is configured to enable the
pullup device, KBEDGn can be used to reconfigure the pullup as a pull-down device.
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTE5/MOSI1
PTE4/MISO1
PTE6/SPSCK1
PTE7/SS1
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
VOLTAGE
REGULATOR
COP IRQ LVD
LOW-POWER OSCILLATOR
MULTI-PURPOSE CLOCK
GENERATOR (MCG)
RESET
VSSAD
VDDAD
VREFH
6-CHANNEL TIMER/PWM
MODULE (TPM1)
PTD7
6
PTG3/KBIP7
PTG2/KBIP6
PORT G
BKGD/MS
PTF3/TPM1CH5
PTF2/TPM1CH4
PTF0/TPM1CH2
PTF1/TPM1CH3
PORT F
PTF5/TPM2CH1
PTF4/TPM2CH0
PTF6
PTF7
INTERFACE MODULE (SCI1)
SERIAL COMMUNICATIONS
INTERFACE MODULE (SCI2)
SERIAL COMMUNICATIONS
PTG0/KBIP0
PTG1/KBIP1
MC9S08JM32 = 32,768
VREFL
PTG4/XTAL
PTG5/EXTAL
IRQ/TPMCLK RxD2
TxD2
SDA
SCL
KBIPx
KBIPx
TPMCLK
SPSCK1
SS1
MISO1
MOSI1
TPMCLK
TPM1CH1
TPM1CH0
RxD1
TxD1
EXTAL
XTAL
4
USB SIE
USB ENDPOINT
RAM
FULL SPEED
USB
TRANSCEIVER
USBDP
USBDN
MISO2
SS2
SPSCK2
MOSI2
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI2)
REAL-TIME COUNTER
(RTC)
TPM1CHx
4
TPM2CH1
TPM2CH0
4
ANALOG COMPARATOR
(ACMP)
SYSTEM
USB 3.3-V VOLTAGE REGULATOR
VUSB33
MC9S08JM60 = 4096
MC9S08JM32 = 2048
ACMPO
ACMP+
ACMP–
PTD3/KBIP3/ADP10
PTD2/KBIP2/ACMPO
V
SSOSC
PTB5/KBIP5/ADP5
PORT B
ANALOG-TO-DIGITAL
CONVERTER (ADC)
PTB4/KBIP4/ADP4
12-CHANNEL, 12-BIT 8
4
PTB1/MOSI2/ADP1
PTB0/MISO2/ADP0
PTB7/ADP7
PTB6/ADP6
PTB3/SS2/ADP3
PTB2/SPSCK2/ADP2
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 139
10.1.3 Features
Features of the ADC module include:
• Linear successive approximation algorithm with 12-bit resolution
• Up to 28 analog inputs
• Output formatted in 12-, 10-, or 8-bit right-justified unsigned format
• Single or continuous conversion (automatic return to idle after single conversion)
• Configurable sample time and conversion speed/power
• Conversion complete flag and interrupt
• Input clock selectable from up to four sources
• Operation in wait or stop3 modes for lower noise operation
• Asynchronous clock source for lower noise operation
• Selectable asynchronous hardware conversion trigger
• Automatic compare with interrupt for less-than, or greater-than or equal-to, programmable value
• Temperature sensor
10.1.4 ADC Module Block Diagram
Figure 10-2 provides a block diagram of the ADC module.
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
140 Freescale Semiconductor
Figure 10-2. ADC Block Diagram
10.2 External Signal Description
The ADC module supports up to 28 separate analog inputs. It also requires four supply/reference/ground
connections.
Table 10-2. Signal Properties
Name Function
AD27–AD0 Analog Channel inputs
VREFH High reference voltage
VREFL Low reference voltage
VDDAD Analog power supply
VSSAD Analog ground
AD0
• • •
AD27
VREFH
VREFL
ADVIN
ADCH
Control Sequencer
initialize
sample
convert
transfer
abort
Clock
Divide
ADCK
÷2
Async
Clock Gen
Bus Clock
ALTCLK
ADICLK
ADIV
ADACK
ADCO
ADLSMP
ADLPC
MODE
complete
Data Registers
SAR Converter
Compare Value Registers
Compare
Value
Sum
AIEN
COCO
Interrupt
AIEN
COCO
ADTRG
1
2
1 2
MCU STOP
ADHWT
Logic
ACFGT
3
Compare true
3Compare true ADCCFG
ADCSC1
ADCSC2
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 141
10.2.1 Analog Power (VDDAD)
The ADC analog portion uses VDDAD as its power connection. In some packages, VDDAD is connected
internally to VDD. If externally available, connect the VDDAD pin to the same voltage potential as VDD.
External filtering may be necessary to ensure clean VDDAD for good results.
10.2.2 Analog Ground (VSSAD)
The ADC analog portion uses VSSAD as its ground connection. In some packages, VSSAD is connected
internally to VSS. If externally available, connect the VSSAD pin to the same voltage potential as VSS.
10.2.3 Voltage Reference High (VREFH)
VREFH is the high reference voltage for the converter. In some packages, VREFH is connected internally to
VDDAD. If externally available, VREFH may be connected to the same potential as VDDAD or may be driven
by an external source between the minimum VDDAD spec and the VDDAD potential (VREFH must never
exceed VDDAD).
10.2.4 Voltage Reference Low (VREFL)
VREFL is the low-reference voltage for the converter. In some packages, VREFL is connected internally to
VSSAD. If externally available, connect the VREFL pin to the same voltage potential as VSSAD.
10.2.5 Analog Channel Inputs (ADx)
The ADC module supports up to 28 separate analog inputs. An input is selected for conversion through
the ADCH channel select bits.
10.3 Register Definition
These memory-mapped registers control and monitor operation of the ADC:
• Status and control register, ADCSC1
• Status and control register, ADCSC2
• Data result registers, ADCRH and ADCRL
• Compare value registers, ADCCVH and ADCCVL
• Configuration register, ADCCFG
• Pin control registers, APCTL1, APCTL2, APCTL3
10.3.1 Status and Control Register 1 (ADCSC1)
This section describes the function of the ADC status and control register (ADCSC1). Writing ADCSC1
aborts the current conversion and initiates a new conversion (if the ADCH bits are equal to a value other
than all 1s).
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
142 Freescale Semiconductor
7654 3 210
RCOCO
AIEN ADCO ADCH
W
Reset:0001 1 111
Figure 10-3. Status and Control Register (ADCSC1)
Table 10-3. ADCSC1 Field Descriptions
Field Description
7
COCO
Conversion Complete Flag. The COCO flag is a read-only bit set each time a conversion is completed when the
compare function is disabled (ACFE = 0). When the compare function is enabled (ACFE = 1), the COCO flag is
set upon completion of a conversion only if the compare result is true. This bit is cleared when ADCSC1 is written
or when ADCRL is read.
0 Conversion not completed
1 Conversion completed
6
AIEN
Interrupt Enable AIEN enables conversion complete interrupts. When COCO becomes set while AIEN is high,
an interrupt is asserted.
0 Conversion complete interrupt disabled
1 Conversion complete interrupt enabled
5
ADCO
Continuous Conversion Enable. ADCO enables continuous conversions.
0 One conversion following a write to the ADCSC1 when software triggered operation is selected, or one
conversion following assertion of ADHWT when hardware triggered operation is selected.
1 Continuous conversions initiated following a write to ADCSC1 when software triggered operation is selected.
Continuous conversions are initiated by an ADHWT event when hardware triggered operation is selected.
4:0
ADCH
Input Channel Select. The ADCH bits form a 5-bit field that selects one of the input channels. The input channels
are detailed in Table 10-4.
The successive approximation converter subsystem is turned off when the channel select bits are all set. This
feature allows for explicit disabling of the ADC and isolation of the input channel from all sources. Terminating
continuous conversions this way prevents an additional, single conversion from being performed. It is not
necessary to set the channel select bits to all ones to place the ADC in a low-power state when continuous
conversions are not enabled because the module automatically enters a low-power state when a conversion
completes.
Table 10-4. Input Channel Select
ADCH Input Select
00000–01111 AD0–15
10000–11011 AD16–27
11100 Reserved
11101 VREFH
11110 VREFL
11111 Module disabled
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 143
10.3.2 Status and Control Register 2 (ADCSC2)
The ADCSC2 register controls the compare function, conversion trigger, and conversion active of the
ADC module.
10.3.3 Data Result High Register (ADCRH)
In 12-bit operation, ADCRH contains the upper four bits of the result of a 12-bit conversion. In 10-bit
mode, ADCRH contains the upper two bits of the result of a 10-bit conversion. When configured for 10-bit
mode, ADR[11:10] are cleared. When configured for 8-bit mode, ADR[11:8] are cleared.
In 12-bit and 10-bit mode, ADCRH is updated each time a conversion completes except when automatic
compare is enabled and the compare condition is not met. When a compare event does occur, the value is
the addition of the conversion result and the two’s complement of the compare value. In 12-bit and 10-bit
mode, reading ADCRH prevents the ADC from transferring subsequent conversion results into the result
registers until ADCRL is read. If ADCRL is not read until after the next conversion is completed, the
intermediate conversion result is lost. In 8-bit mode, there is no interlocking with ADCRL.
7654 3 210
RADACT
ADTRG ACFE ACFGT
00
R1R1
W
Reset:0000 0 000
1Bits 1 and 0 are reserved bits that must always be written to 0.
Figure 10-4. Status and Control Register 2 (ADCSC2)
Table 10-5. ADCSC2 Register Field Descriptions
Field Description
7
ADACT
Conversion Active. Indicates that a conversion is in progress. ADACT is set when a conversion is initiated and
cleared when a conversion is completed or aborted.
0 Conversion not in progress
1 Conversion in progress
6
ADTRG
Conversion Trigger Select. Selects the type of trigger used for initiating a conversion. Two types of triggers are
selectable: software trigger and hardware trigger. When software trigger is selected, a conversion is initiated
following a write to ADCSC1. When hardware trigger is selected, a conversion is initiated following the assertion
of the ADHWT input.
0 Software trigger selected
1 Hardware trigger selected
5
ACFE
Compare Function Enable. Enables the compare function.
0 Compare function disabled
1 Compare function enabled
4
ACFGT
Compare Function Greater Than Enable. Configures the compare function to trigger when the result of the
conversion of the input being monitored is greater than or equal to the compare value. The compare function
defaults to triggering when the result of the compare of the input being monitored is less than the compare value.
0 Compare triggers when input is less than compare value
1 Compare triggers when input is greater than or equal to compare value
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
144 Freescale Semiconductor
If the MODE bits are changed, any data in ADCRH becomes invalid.
10.3.4 Data Result Low Register (ADCRL)
ADCRL contains the lower eight bits of the result of a 12-bit or 10-bit conversion, and all eight bits of an
8-bit conversion. This register is updated each time a conversion completes except when automatic
compare is enabled and the compare condition is not met. In 12-bit and 10-bit mode, reading ADCRH
prevents the ADC from transferring subsequent conversion results into the result registers until ADCRL
is read. If ADCRL is not read until the after next conversion is completed, the intermediate conversion
results are lost. In 8-bit mode, there is no interlocking with ADCRH. If the MODE bits are changed, any
data in ADCRL becomes invalid.
10.3.5 Compare Value High Register (ADCCVH)
In 12-bit mode, the ADCCVH register holds the upper four bits of the 12-bit compare value. When the
compare function is enabled, these bits are compared to the upper four bits of the result following a
conversion in 12-bit mode.
7654 3 210
R 0 0 0 0 ADR11 ADR10 ADR9 ADR8
W
Reset:0000 0 000
Figure 10-5. Data Result High Register (ADCRH)
7654 3 210
R ADR7 ADR6 ADR5 ADR4 ADR3 ADR2 ADR1 ADR0
W
Reset:0000 0 000
Figure 10-6. Data Result Low Register (ADCRL)
7654 3 210
R0 0 0 0
ADCV11 ADCV10 ADCV9 ADCV8
W
Reset:0000 0 000
Figure 10-7. Compare Value High Register (ADCCVH)
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 145
In 10-bit mode, the ADCCVH register holds the upper two bits of the 10-bit compare value (ADCV[9:8]).
These bits are compared to the upper two bits of the result following a conversion in 10-bit mode when the
compare function is enabled.
In 8-bit mode, ADCCVH is not used during compare.
10.3.6 Compare Value Low Register (ADCCVL)
This register holds the lower 8 bits of the 12-bit or 10-bit compare value or all 8 bits of the 8-bit compare
value. When the compare function is enabled, bits ADCV[7:0] are compared to the lower 8 bits of the
result following a conversion in 12-bit, 10-bit or 8-bit mode.
10.3.7 Configuration Register (ADCCFG)
ADCCFG selects the mode of operation, clock source, clock divide, and configures for low power and long
sample time.
7654 3 210
R
ADCV7 ADCV6 ADCV5 ADCV4 ADCV3 ADCV2 ADCV1 ADCV0
W
Reset:0000 0 000
Figure 10-8. Compare Value Low Register (ADCCVL)
7654 3 210
R
ADLPC ADIV ADLSMP MODE ADICLK
W
Reset:0000 0 000
Figure 10-9. Configuration Register (ADCCFG)
Table 10-6. ADCCFG Register Field Descriptions
Field Description
7
ADLPC
Low-Power Configuration. ADLPC controls the speed and power configuration of the successive approximation
converter. This optimizes power consumption when higher sample rates are not required.
0 High speed configuration
1 Low power configuration:The power is reduced at the expense of maximum clock speed.
6:5
ADIV
Clock Divide Select. ADIV selects the divide ratio used by the ADC to generate the internal clock ADCK.
Ta b le 1 0 - 7 shows the available clock configurations.
4
ADLSMP
Long Sample Time Configuration. ADLSMP selects between long and short sample time. This adjusts the
sample period to allow higher impedance inputs to be accurately sampled or to maximize conversion speed for
lower impedance inputs. Longer sample times can also be used to lower overall power consumption when
continuous conversions are enabled if high conversion rates are not required.
0 Short sample time
1 Long sample time
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
146 Freescale Semiconductor
10.3.8 Pin Control 1 Register (APCTL1)
The pin control registers disable the I/O port control of MCU pins used as analog inputs. APCTL1 is used
to control the pins associated with channels 0–7 of the ADC module.
3:2
MODE
Conversion Mode Selection. MODE bits are used to select between 12-, 10-, or 8-bit operation. See Table 10-8.
1:0
ADICLK
Input Clock Select. ADICLK bits select the input clock source to generate the internal clock ADCK. See
Ta b le 1 0 - 9.
Table 10-7. Clock Divide Select
ADIV Divide Ratio Clock Rate
00 1 Input clock
01 2 Input clock ÷ 2
10 4 Input clock ÷ 4
11 8 Input clock ÷ 8
Table 10-8. Conversion Modes
MODE Mode Description
00 8-bit conversion (N=8)
01 12-bit conversion (N=12)
10 10-bit conversion (N=10)
11 Reserved
Table 10-9. Input Clock Select
ADICLK Selected Clock Source
00 Bus clock
01 Bus clock divided by 2
10 Alternate clock (ALTCLK)
11 Asynchronous clock (ADACK)
7654 3 210
R
ADPC7 ADPC6 ADPC5 ADPC4 ADPC3 ADPC2 ADPC1 ADPC0
W
Reset:0000 0 000
Figure 10-10. Pin Control 1 Register (APCTL1)
Table 10-6. ADCCFG Register Field Descriptions (continued)
Field Description
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 147
10.3.9 Pin Control 2 Register (APCTL2)
APCTL2 controls channels 8–15 of the ADC module.
Table 10-10. APCTL1 Register Field Descriptions
Field Description
7
ADPC7
ADC Pin Control 7. ADPC7 controls the pin associated with channel AD7.
0 AD7 pin I/O control enabled
1 AD7 pin I/O control disabled
6
ADPC6
ADC Pin Control 6. ADPC6 controls the pin associated with channel AD6.
0 AD6 pin I/O control enabled
1 AD6 pin I/O control disabled
5
ADPC5
ADC Pin Control 5. ADPC5 controls the pin associated with channel AD5.
0 AD5 pin I/O control enabled
1 AD5 pin I/O control disabled
4
ADPC4
ADC Pin Control 4. ADPC4 controls the pin associated with channel AD4.
0 AD4 pin I/O control enabled
1 AD4 pin I/O control disabled
3
ADPC3
ADC Pin Control 3. ADPC3 controls the pin associated with channel AD3.
0 AD3 pin I/O control enabled
1 AD3 pin I/O control disabled
2
ADPC2
ADC Pin Control 2. ADPC2 controls the pin associated with channel AD2.
0 AD2 pin I/O control enabled
1 AD2 pin I/O control disabled
1
ADPC1
ADC Pin Control 1. ADPC1 controls the pin associated with channel AD1.
0 AD1 pin I/O control enabled
1 AD1 pin I/O control disabled
0
ADPC0
ADC Pin Control 0. ADPC0 controls the pin associated with channel AD0.
0 AD0 pin I/O control enabled
1 AD0 pin I/O control disabled
7654 3 210
R
ADPC15 ADPC14 ADPC13 ADPC12 ADPC11 ADPC10 ADPC9 ADPC8
W
Reset:0000 0 000
Figure 10-11. Pin Control 2 Register (APCTL2)
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
148 Freescale Semiconductor
10.3.10 Pin Control 3 Register (APCTL3)
APCTL3 controls channels 16–23 of the ADC module.
Table 10-11. APCTL2 Register Field Descriptions
Field Description
7
ADPC15
ADC Pin Control 15. ADPC15 controls the pin associated with channel AD15.
0 AD15 pin I/O control enabled
1 AD15 pin I/O control disabled
6
ADPC14
ADC Pin Control 14. ADPC14 controls the pin associated with channel AD14.
0 AD14 pin I/O control enabled
1 AD14 pin I/O control disabled
5
ADPC13
ADC Pin Control 13. ADPC13 controls the pin associated with channel AD13.
0 AD13 pin I/O control enabled
1 AD13 pin I/O control disabled
4
ADPC12
ADC Pin Control 12. ADPC12 controls the pin associated with channel AD12.
0 AD12 pin I/O control enabled
1 AD12 pin I/O control disabled
3
ADPC11
ADC Pin Control 11. ADPC11 controls the pin associated with channel AD11.
0 AD11 pin I/O control enabled
1 AD11 pin I/O control disabled
2
ADPC10
ADC Pin Control 10. ADPC10 controls the pin associated with channel AD10.
0 AD10 pin I/O control enabled
1 AD10 pin I/O control disabled
1
ADPC9
ADC Pin Control 9. ADPC9 controls the pin associated with channel AD9.
0 AD9 pin I/O control enabled
1 AD9 pin I/O control disabled
0
ADPC8
ADC Pin Control 8. ADPC8 controls the pin associated with channel AD8.
0 AD8 pin I/O control enabled
1 AD8 pin I/O control disabled
7654 3 210
R
ADPC23 ADPC22 ADPC21 ADPC20 ADPC19 ADPC18 ADPC17 ADPC16
W
Reset:0000 0 000
Figure 10-12. Pin Control 3 Register (APCTL3)
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 149
10.4 Functional Description
The ADC module is disabled during reset or when the ADCH bits are all high. The module is idle when a
conversion has completed and another conversion has not been initiated. When idle, the module is in its
lowest power state.
The ADC can perform an analog-to-digital conversion on any of the software selectable channels. In 12-bit
and 10-bit mode, the selected channel voltage is converted by a successive approximation algorithm into
a 12-bit digital result. In 8-bit mode, the selected channel voltage is converted by a successive
approximation algorithm into a 9-bit digital result.
When the conversion is completed, the result is placed in the data registers (ADCRH and ADCRL). In
10-bit mode, the result is rounded to 10 bits and placed in the data registers (ADCRH and ADCRL). In
8-bit mode, the result is rounded to 8 bits and placed in ADCRL. The conversion complete flag (COCO)
is then set and an interrupt is generated if the conversion complete interrupt has been enabled (AIEN = 1).
The ADC module has the capability of automatically comparing the result of a conversion with the
contents of its compare registers. The compare function is enabled by setting the ACFE bit and operates
with any of the conversion modes and configurations.
Table 10-12. APCTL3 Register Field Descriptions
Field Description
7
ADPC23
ADC Pin Control 23. ADPC23 controls the pin associated with channel AD23.
0 AD23 pin I/O control enabled
1 AD23 pin I/O control disabled
6
ADPC22
ADC Pin Control 22. ADPC22 controls the pin associated with channel AD22.
0 AD22 pin I/O control enabled
1 AD22 pin I/O control disabled
5
ADPC21
ADC Pin Control 21. ADPC21 controls the pin associated with channel AD21.
0 AD21 pin I/O control enabled
1 AD21 pin I/O control disabled
4
ADPC20
ADC Pin Control 20. ADPC20 controls the pin associated with channel AD20.
0 AD20 pin I/O control enabled
1 AD20 pin I/O control disabled
3
ADPC19
ADC Pin Control 19. ADPC19 controls the pin associated with channel AD19.
0 AD19 pin I/O control enabled
1 AD19 pin I/O control disabled
2
ADPC18
ADC Pin Control 18. ADPC18 controls the pin associated with channel AD18.
0 AD18 pin I/O control enabled
1 AD18 pin I/O control disabled
1
ADPC17
ADC Pin Control 17. ADPC17 controls the pin associated with channel AD17.
0 AD17 pin I/O control enabled
1 AD17 pin I/O control disabled
0
ADPC16
ADC Pin Control 16. ADPC16 controls the pin associated with channel AD16.
0 AD16 pin I/O control enabled
1 AD16 pin I/O control disabled
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
150 Freescale Semiconductor
10.4.1 Clock Select and Divide Control
One of four clock sources can be selected as the clock source for the ADC module. This clock source is
then divided by a configurable value to generate the input clock to the converter (ADCK). The clock is
selected from one of the following sources by means of the ADICLK bits.
• The bus clock, which is equal to the frequency at which software is executed. This is the default
selection following reset.
• The bus clock divided by two. For higher bus clock rates, this allows a maximum divide by 16 of
the bus clock.
• ALTCLK, as defined for this MCU (See module section introduction).
• The asynchronous clock (ADACK). This clock is generated from a clock source within the ADC
module. When selected as the clock source, this clock remains active while the MCU is in wait or
stop3 mode and allows conversions in these modes for lower noise operation.
Whichever clock is selected, its frequency must fall within the specified frequency range for ADCK. If the
available clocks are too slow, the ADC do not perform according to specifications. If the available clocks
are too fast, the clock must be divided to the appropriate frequency. This divider is specified by the ADIV
bits and can be divide-by 1, 2, 4, or 8.
10.4.2 Input Select and Pin Control
The pin control registers (APCTL3, APCTL2, and APCTL1) disable the I/O port control of the pins used
as analog inputs.When a pin control register bit is set, the following conditions are forced for the associated
MCU pin:
• The output buffer is forced to its high impedance state.
• The input buffer is disabled. A read of the I/O port returns a zero for any pin with its input buffer
disabled.
• The pullup is disabled.
10.4.3 Hardware Trigger
The ADC module has a selectable asynchronous hardware conversion trigger, ADHWT, that is enabled
when the ADTRG bit is set. This source is not available on all MCUs. Consult the module introduction for
information on the ADHWT source specific to this MCU.
When ADHWT source is available and hardware trigger is enabled (ADTRG=1), a conversion is initiated
on the rising edge of ADHWT. If a conversion is in progress when a rising edge occurs, the rising edge is
ignored. In continuous convert configuration, only the initial rising edge to launch continuous conversions
is observed. The hardware trigger function operates in conjunction with any of the conversion modes and
configurations.
10.4.4 Conversion Control
Conversions can be performed in 12-bit mode, 10-bit mode, or 8-bit mode as determined by the MODE
bits. Conversions can be initiated by a software or hardware trigger. In addition, the ADC module can be
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 151
configured for low power operation, long sample time, continuous conversion, and automatic compare of
the conversion result to a software determined compare value.
10.4.4.1 Initiating Conversions
A conversion is initiated:
• Following a write to ADCSC1 (with ADCH bits not all 1s) if software triggered operation is
selected.
• Following a hardware trigger (ADHWT) event if hardware triggered operation is selected.
• Following the transfer of the result to the data registers when continuous conversion is enabled.
If continuous conversions are enabled, a new conversion is automatically initiated after the completion of
the current conversion. In software triggered operation, continuous conversions begin after ADCSC1 is
written and continue until aborted. In hardware triggered operation, continuous conversions begin after a
hardware trigger event and continue until aborted.
10.4.4.2 Completing Conversions
A conversion is completed when the result of the conversion is transferred into the data result registers,
ADCRH and ADCRL. This is indicated by the setting of COCO. An interrupt is generated if AIEN is high
at the time that COCO is set.
A blocking mechanism prevents a new result from overwriting previous data in ADCRH and ADCRL if
the previous data is in the process of being read while in 12-bit or 10-bit MODE (the ADCRH register has
been read but the ADCRL register has not). When blocking is active, the data transfer is blocked, COCO
is not set, and the new result is lost. In the case of single conversions with the compare function enabled
and the compare condition false, blocking has no effect and ADC operation is terminated. In all other cases
of operation, when a data transfer is blocked, another conversion is initiated regardless of the state of
ADCO (single or continuous conversions enabled).
If single conversions are enabled, the blocking mechanism could result in several discarded conversions
and excess power consumption. To avoid this issue, the data registers must not be read after initiating a
single conversion until the conversion completes.
10.4.4.3 Aborting Conversions
Any conversion in progress is aborted when:
• A write to ADCSC1 occurs (the current conversion will be aborted and a new conversion will be
initiated, if ADCH are not all 1s).
• A write to ADCSC2, ADCCFG, ADCCVH, or ADCCVL occurs. This indicates a mode of
operation change has occurred and the current conversion is therefore invalid.
• The MCU is reset.
• The MCU enters stop mode with ADACK not enabled.
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
152 Freescale Semiconductor
When a conversion is aborted, the contents of the data registers, ADCRH and ADCRL, are not altered.
However, they continue to be the values transferred after the completion of the last successful conversion.
If the conversion was aborted by a reset, ADCRH and ADCRL return to their reset states.
10.4.4.4 Power Control
The ADC module remains in its idle state until a conversion is initiated. If ADACK is selected as the
conversion clock source, the ADACK clock generator is also enabled.
Power consumption when active can be reduced by setting ADLPC. This results in a lower maximum
value for fADCK (see the electrical specifications).
10.4.4.5 Sample Time and Total Conversion Time
The total conversion time depends on the sample time (as determined by ADLSMP), the MCU bus
frequency, the conversion mode (8-bit, 10-bit or 12-bit), and the frequency of the conversion clock (fADCK).
After the module becomes active, sampling of the input begins. ADLSMP selects between short (3.5
ADCK cycles) and long (23.5 ADCK cycles) sample times.When sampling is complete, the converter is
isolated from the input channel and a successive approximation algorithm is performed to determine the
digital value of the analog signal. The result of the conversion is transferred to ADCRH and ADCRL upon
completion of the conversion algorithm.
If the bus frequency is less than the fADCK frequency, precise sample time for continuous conversions
cannot be guaranteed when short sample is enabled (ADLSMP=0). If the bus frequency is less than 1/11th
of the fADCK frequency, precise sample time for continuous conversions cannot be guaranteed when long
sample is enabled (ADLSMP=1).
The maximum total conversion time for different conditions is summarized in Table 10-13.
Table 10-13. Total Conversion Time vs. Control Conditions
Conversion Type ADICLK ADLSMP Max Total Conversion Time
Single or first continuous 8-bit 0x, 10 0 20 ADCK cycles + 5 bus clock cycles
Single or first continuous 10-bit or 12-bit 0x, 10 0 23 ADCK cycles + 5 bus clock cycles
Single or first continuous 8-bit 0x, 10 1 40 ADCK cycles + 5 bus clock cycles
Single or first continuous 10-bit or 12-bit 0x, 10 1 43 ADCK cycles + 5 bus clock cycles
Single or first continuous 8-bit 11 0 5 μs + 20 ADCK + 5 bus clock cycles
Single or first continuous 10-bit or 12-bit 11 0 5 μs + 23 ADCK + 5 bus clock cycles
Single or first continuous 8-bit 11 1 5 μs + 40 ADCK + 5 bus clock cycles
Single or first continuous 10-bit or 12-bit 11 1 5 μs + 43 ADCK + 5 bus clock cycles
Subsequent continuous 8-bit;
fBUS > fADCK
xx 0 17 ADCK cycles
Subsequent continuous 10-bit or 12-bit;
fBUS > fADCK
xx 0 20 ADCK cycles
Subsequent continuous 8-bit;
fBUS > fADCK/11
xx 1 37 ADCK cycles
Subsequent continuous 10-bit or 12-bit;
fBUS > fADCK/11
xx 1 40 ADCK cycles
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 153
The maximum total conversion time is determined by the clock source chosen and the divide ratio selected.
The clock source is selectable by the ADICLK bits, and the divide ratio is specified by the ADIV bits. For
example, in 10-bit mode, with the bus clock selected as the input clock source, the input clock divide-by-1
ratio selected, and a bus frequency of 8 MHz, then the conversion time for a single conversion is:
NOTE
The ADCK frequency must be between fADCK minimum and fADCK
maximum to meet ADC specifications.
10.4.5 Automatic Compare Function
The compare function can be configured to check for an upper or lower limit. After the input is sampled
and converted, the result is added to the two’s complement of the compare value (ADCCVH and
ADCCVL). When comparing to an upper limit (ACFGT = 1), if the result is greater-than or equal-to the
compare value, COCO is set. When comparing to a lower limit (ACFGT = 0), if the result is less than the
compare value, COCO is set. The value generated by the addition of the conversion result and the two’s
complement of the compare value is transferred to ADCRH and ADCRL.
Upon completion of a conversion while the compare function is enabled, if the compare condition is not
true, COCO is not set and no data is transferred to the result registers. An ADC interrupt is generated upon
the setting of COCO if the ADC interrupt is enabled (AIEN = 1).
NOTE
The compare function can monitor the voltage on a channel while the MCU
is in wait or stop3 mode. The ADC interrupt wakes the MCU when the
compare condition is met.
10.4.6 MCU Wait Mode Operation
Wait mode is a lower power-consumption standby mode from which recovery is fast because the clock
sources remain active. If a conversion is in progress when the MCU enters wait mode, it continues until
completion. Conversions can be initiated while the MCU is in wait mode by means of the hardware trigger
or if continuous conversions are enabled.
The bus clock, bus clock divided by two, and ADACK are available as conversion clock sources while in
wait mode. The use of ALTCLK as the conversion clock source in wait is dependent on the definition of
ALTCLK for this MCU. Consult the module introduction for information on ALTCLK specific to this
MCU.
A conversion complete event sets the COCO and generates an ADC interrupt to wake the MCU from wait
mode if the ADC interrupt is enabled (AIEN = 1).
23 ADCK Cyc
Conversion time = 8 MHz/1
Number of bus cycles = 3.5 μs x 8 MHz = 28 cycles
5 bus Cyc
8 MHz
+= 3.5 μs
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
154 Freescale Semiconductor
10.4.7 MCU Stop3 Mode Operation
Stop mode is a low power-consumption standby mode during which most or all clock sources on the MCU
are disabled.
10.4.7.1 Stop3 Mode With ADACK Disabled
If the asynchronous clock, ADACK, is not selected as the conversion clock, executing a stop instruction
aborts the current conversion and places the ADC in its idle state. The contents of ADCRH and ADCRL
are unaffected by stop3 mode. After exiting from stop3 mode, a software or hardware trigger is required
to resume conversions.
10.4.7.2 Stop3 Mode With ADACK Enabled
If ADACK is selected as the conversion clock, the ADC continues operation during stop3 mode. For
guaranteed ADC operation, the MCU’s voltage regulator must remain active during stop3 mode. Consult
the module introduction for configuration information for this MCU.
If a conversion is in progress when the MCU enters stop3 mode, it continues until completion. Conversions
can be initiated while the MCU is in stop3 mode by means of the hardware trigger or if continuous
conversions are enabled.
A conversion complete event sets the COCO and generates an ADC interrupt to wake the MCU from stop3
mode if the ADC interrupt is enabled (AIEN = 1).
NOTE
The ADC module can wake the system from low-power stop and cause the
MCU to begin consuming run-level currents without generating a system
level interrupt. To prevent this scenario, software should ensure the data
transfer blocking mechanism (discussed in Section 10.4.4.2, “Completing
Conversions,”) is cleared when entering stop3 and continuing ADC
conversions.
10.4.8 MCU Stop2 Mode Operation
The ADC module is automatically disabled when the MCU enters stop2 mode. All module registers
contain their reset values following exit from stop2. Therefore, the module must be re-enabled and
re-configured following exit from stop2.
10.5 Initialization Information
This section gives an example that provides some basic direction on how to initialize and configure the
ADC module. You can configure the module for 8-, 10-, or 12-bit resolution, single or continuous
conversion, and a polled or interrupt approach, among many other options. Refer to Table 10-7,
Table 10-8, and Table 10-9 for information used in this example.
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 155
NOTE
Hexadecimal values designated by a preceding 0x, binary values designated
by a preceding %, and decimal values have no preceding character.
10.5.1 ADC Module Initialization Example
10.5.1.1 Initialization Sequence
Before the ADC module can be used to complete conversions, an initialization procedure must be
performed. A typical sequence is as follows:
1. Update the configuration register (ADCCFG) to select the input clock source and the divide ratio
used to generate the internal clock, ADCK. This register is also used for selecting sample time and
low-power configuration.
2. Update status and control register 2 (ADCSC2) to select the conversion trigger (hardware or
software) and compare function options, if enabled.
3. Update status and control register 1 (ADCSC1) to select whether conversions will be continuous
or completed only once, and to enable or disable conversion complete interrupts. The input channel
on which conversions will be performed is also selected here.
10.5.1.2 Pseudo-Code Example
In this example, the ADC module is set up with interrupts enabled to perform a single 10-bit conversion
at low power with a long sample time on input channel 1, where the internal ADCK clock is derived from
the bus clock divided by 1.
ADCCFG = 0x98 (%10011000)
Bit 7 ADLPC 1 Configures for low power (lowers maximum clock speed)
Bit 6:5 ADIV 00 Sets the ADCK to the input clock ÷ 1
Bit 4 ADLSMP 1 Configures for long sample time
Bit 3:2 MODE 10 Sets mode at 10-bit conversions
Bit 1:0 ADICLK 00 Selects bus clock as input clock source
ADCSC2 = 0x00 (%00000000)
Bit 7 ADACT 0 Flag indicates if a conversion is in progress
Bit 6 ADTRG 0 Software trigger selected
Bit 5 ACFE 0 Compare function disabled
Bit 4 ACFGT 0 Not used in this example
Bit 3:2 00 Reserved, always reads zero
Bit 1:0 00 Reserved for Freescale’s internal use; always write zero
ADCSC1 = 0x41 (%01000001)
Bit 7 COCO 0 Read-only flag which is set when a conversion completes
Bit 6 AIEN 1 Conversion complete interrupt enabled
Bit 5 ADCO 0 One conversion only (continuous conversions disabled)
Bit 4:0 ADCH 00001 Input channel 1 selected as ADC input channel
ADCRH/L = 0xxx
Holds results of conversion. Read high byte (ADCRH) before low byte (ADCRL) so that
conversion data cannot be overwritten with data from the next conversion.
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
156 Freescale Semiconductor
ADCCVH/L = 0xxx
Holds compare value when compare function enabled
APCTL1=0x02
AD1 pin I/O control disabled. All other AD pins remain general purpose I/O pins
APCTL2=0x00
All other AD pins remain general purpose I/O pins
Figure 10-13. Initialization Flowchart for Example
10.6 Application Information
This section contains information for using the ADC module in applications. The ADC has been designed
to be integrated into a microcontroller for use in embedded control applications requiring an A/D
converter.
10.6.1 External Pins and Routing
The following sections discuss the external pins associated with the ADC module and how they should be
used for best results.
Ye s
No
Reset
Initialize ADC
ADCCFG = 0x98
ADCSC1 = 0x41
ADCSC2 = 0x00
Check
COCO=1?
Read ADCRH
Then ADCRL To
Clear COCO Bit
Continue
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 157
10.6.1.1 Analog Supply Pins
The ADC module has analog power and ground supplies (VDDAD and VSSAD) available as separate pins
on some devices. VSSAD is shared on the same pin as the MCU digital VSS on some devices. On other
devices, VSSAD and VDDAD are shared with the MCU digital supply pins. In these cases, there are separate
pads for the analog supplies bonded to the same pin as the corresponding digital supply so that some degree
of isolation between the supplies is maintained.
When available on a separate pin, both VDDAD and VSSAD must be connected to the same voltage potential
as their corresponding MCU digital supply (VDD and VSS) and must be routed carefully for maximum
noise immunity and bypass capacitors placed as near as possible to the package.
If separate power supplies are used for analog and digital power, the ground connection between these
supplies must be at the VSSAD pin. This should be the only ground connection between these supplies if
possible. The VSSAD pin makes a good single point ground location.
10.6.1.2 Analog Reference Pins
In addition to the analog supplies, the ADC module has connections for two reference voltage inputs. The
high reference is VREFH, which may be shared on the same pin as VDDAD on some devices. The low
reference is VREFL, which may be shared on the same pin as VSSAD on some devices.
When available on a separate pin, VREFH may be connected to the same potential as VDDAD, or may be
driven by an external source between the minimum VDDAD spec and the VDDAD potential (VREFH must
never exceed VDDAD). When available on a separate pin, VREFL must be connected to the same voltage
potential as VSSAD. VREFH and VREFL must be routed carefully for maximum noise immunity and bypass
capacitors placed as near as possible to the package.
AC current in the form of current spikes required to supply charge to the capacitor array at each successive
approximation step is drawn through the VREFH and VREFL loop. The best external component to meet this
current demand is a 0.1 μF capacitor with good high frequency characteristics. This capacitor is connected
between VREFH and VREFL and must be placed as near as possible to the package pins. Resistance in the
path is not recommended because the current causes a voltage drop that could result in conversion errors.
Inductance in this path must be minimum (parasitic only).
10.6.1.3 Analog Input Pins
The external analog inputs are typically shared with digital I/O pins on MCU devices. The pin I/O control
is disabled by setting the appropriate control bit in one of the pin control registers. Conversions can be
performed on inputs without the associated pin control register bit set. It is recommended that the pin
control register bit always be set when using a pin as an analog input. This avoids problems with contention
because the output buffer is in its high impedance state and the pullup is disabled. Also, the input buffer
draws DC current when its input is not at VDD or VSS. Setting the pin control register bits for all pins used
as analog inputs should be done to achieve lowest operating current.
Empirical data shows that capacitors on the analog inputs improve performance in the presence of noise
or when the source impedance is high. Use of 0.01 μF capacitors with good high-frequency characteristics
is sufficient. These capacitors are not necessary in all cases, but when used they must be placed as near as
possible to the package pins and be referenced to VSSA.
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
158 Freescale Semiconductor
For proper conversion, the input voltage must fall between VREFH and VREFL. If the input is equal to or
exceeds VREFH, the converter circuit converts the signal to 0xFFF (full scale 12-bit representation), 0x3FF
(full scale 10-bit representation) or 0xFF (full scale 8-bit representation). If the input is equal to or less
than VREFL, the converter circuit converts it to 0x000. Input voltages between VREFH and VREFL are
straight-line linear conversions. There is a brief current associated with VREFL when the sampling
capacitor is charging. The input is sampled for 3.5 cycles of the ADCK source when ADLSMP is low, or
23.5 cycles when ADLSMP is high.
For minimal loss of accuracy due to current injection, pins adjacent to the analog input pins should not be
transitioning during conversions.
10.6.2 Sources of Error
Several sources of error exist for A/D conversions. These are discussed in the following sections.
10.6.2.1 Sampling Error
For proper conversions, the input must be sampled long enough to achieve the proper accuracy. Given the
maximum input resistance of approximately 7kΩ and input capacitance of approximately 5.5 pF, sampling
to within 1/4LSB (at 12-bit resolution) can be achieved within the minimum sample window (3.5 cycles @
8 MHz maximum ADCK frequency) provided the resistance of the external analog source (RAS) is kept
below 2 kΩ.
Higher source resistances or higher-accuracy sampling is possible by setting ADLSMP (to increase the
sample window to 23.5 cycles) or decreasing ADCK frequency to increase sample time.
10.6.2.2 Pin Leakage Error
Leakage on the I/O pins can cause conversion error if the external analog source resistance (RAS) is high.
If this error cannot be tolerated by the application, keep RAS lower than VDDAD /(2
N*ILEAK) for less than
1/4LSB leakage error (N = 8 in 8-bit, 10 in 10-bit or 12 in 12-bit mode).
10.6.2.3 Noise-Induced Errors
System noise that occurs during the sample or conversion process can affect the accuracy of the
conversion. The ADC accuracy numbers are guaranteed as specified only if the following conditions are
met:
• There is a 0.1 μF low-ESR capacitor from VREFH to VREFL.
• There is a 0.1 μF low-ESR capacitor from VDDAD to VSSAD.
• If inductive isolation is used from the primary supply, an additional 1 μF capacitor is placed from
VDDAD to VSSAD.
•V
SSAD (and VREFL, if connected) is connected to VSS at a quiet point in the ground plane.
• Operate the MCU in wait or stop3 mode before initiating (hardware triggered conversions) or
immediately after initiating (hardware or software triggered conversions) the ADC conversion.
— For software triggered conversions, immediately follow the write to ADCSC1 with a wait
instruction or stop instruction.
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 159
— For stop3 mode operation, select ADACK as the clock source. Operation in stop3 reduces VDD
noise but increases effective conversion time due to stop recovery.
• There is no I/O switching, input or output, on the MCU during the conversion.
There are some situations where external system activity causes radiated or conducted noise emissions or
excessive VDD noise is coupled into the ADC. In these situations, or when the MCU cannot be placed in
wait or stop3 or I/O activity cannot be halted, these recommended actions may reduce the effect of noise
on the accuracy:
• Place a 0.01 μF capacitor (CAS) on the selected input channel to VREFL or VSSAD (this improves
noise issues, but affects the sample rate based on the external analog source resistance).
• Average the result by converting the analog input many times in succession and dividing the sum
of the results. Four samples are required to eliminate the effect of a 1LSB, one-time error.
• Reduce the effect of synchronous noise by operating off the asynchronous clock (ADACK) and
averaging. Noise that is synchronous to ADCK cannot be averaged out.
10.6.2.4 Code Width and Quantization Error
The ADC quantizes the ideal straight-line transfer function into 4096 steps (in 12-bit mode). Each step
ideally has the same height (1 code) and width. The width is defined as the delta between the transition
points to one code and the next. The ideal code width for an N bit converter (in this case N can be 8, 10 or
12), defined as 1LSB, is:
1 lsb = (VREFH - VREFL) / 2NEqn. 10-2
There is an inherent quantization error due to the digitization of the result. For 8-bit or 10-bit conversions
the code transitions when the voltage is at the midpoint between the points where the straight line transfer
function is exactly represented by the actual transfer function. Therefore, the quantization error will be ±
1/2 lsb in 8- or 10-bit mode. As a consequence, however, the code width of the first (0x000) conversion is
only 1/2 lsb and the code width of the last (0xFF or 0x3FF) is 1.5 lsb.
For 12-bit conversions the code transitions only after the full code width is present, so the quantization
error is −1 lsb to 0 lsb and the code width of each step is 1 lsb.
10.6.2.5 Linearity Errors
The ADC may also exhibit non-linearity of several forms. Every effort has been made to reduce these
errors but the system should be aware of them because they affect overall accuracy. These errors are:
• Zero-scale error (EZS) (sometimes called offset) — This error is defined as the difference between
the actual code width of the first conversion and the ideal code width (1/2 lsb in 8-bit or 10-bit
modes and 1 lsb in 12-bit mode). If the first conversion is 0x001, the difference between the actual
0x001 code width and its ideal (1 lsb) is used.
• Full-scale error (EFS) — This error is defined as the difference between the actual code width of
the last conversion and the ideal code width (1.5 lsb in 8-bit or 10-bit modes and 1LSB in 12-bit
mode). If the last conversion is 0x3FE, the difference between the actual 0x3FE code width and its
ideal (1LSB) is used.
Analog-to-Digital Converter (S08ADC12V1)
MC9S08JM60 Series Data Sheet, Rev. 3
160 Freescale Semiconductor
• Differential non-linearity (DNL) — This error is defined as the worst-case difference between the
actual code width and the ideal code width for all conversions.
• Integral non-linearity (INL) — This error is defined as the highest-value the (absolute value of the)
running sum of DNL achieves. More simply, this is the worst-case difference of the actual
transition voltage to a given code and its corresponding ideal transition voltage, for all codes.
• Total unadjusted error (TUE) — This error is defined as the difference between the actual transfer
function and the ideal straight-line transfer function and includes all forms of error.
10.6.2.6 Code Jitter, Non-Monotonicity, and Missing Codes
Analog-to-digital converters are susceptible to three special forms of error. These are code jitter,
non-monotonicity, and missing codes.
Code jitter is when, at certain points, a given input voltage converts to one of two values when sampled
repeatedly. Ideally, when the input voltage is infinitesimally smaller than the transition voltage, the
converter yields the lower code (and vice-versa). However, even small amounts of system noise can cause
the converter to be indeterminate (between two codes) for a range of input voltages around the transition
voltage. This range is normally around ±1/2 lsb in 8-bit or 10-bit mode, or around 2 lsb in 12-bit mode,
and increases with noise.
This error may be reduced by repeatedly sampling the input and averaging the result. Additionally the
techniques discussed in Section 10.6.2.3 reduces this error.
Non-monotonicity is defined as when, except for code jitter, the converter converts to a lower code for a
higher input voltage. Missing codes are those values never converted for any input value.
In 8-bit or 10-bit mode, the ADC is guaranteed to be monotonic and have no missing codes.
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 161
Chapter 11
Inter-Integrated Circuit (S08IICV2)
11.1 Introduction
The MC9S08JM60 series of microcontrollers has an inter-integrated circuit (IIC) module for
communication with other integrated circuits. The two pins associated with this module, SCL and SDA,
are shared with PTC0 and PTC1, respectively.
NOTE
MC9S08JM60 series devices operate at a higher voltage range (2.7 V to
5.5 V) and do not include stop1 mode. Therefore, please disregard
references to stop1.
Chapter 11 Inter-Integrated Circuit (S08IICV2)
MC9S08JM60 Series Data Sheet, Rev. 3
162 Freescale Semiconductor
Figure 11-1. MC9S08JM60 Series Block Diagram Highlighting the IIC Block and Pins
PTD4/ADP11
PTD5
PTD6
PTC1/SDA
PTC0/SCL
VSS
VDD
PTE3/TPM1CH1
PTE2/TPM1CH0
PTA5– PTA0
PTE0/TxD1
PTE1/RxD1
PTD1/ADP9/ACMP–
PTD0/ADP8/ACMP+
PTC6
PTC5/RxD2
PTC4
PTC3/TxD2
PTC2
PORT A
PORT C
PORT D
PORT E
8-BIT KEYBOARD
INTERRUPT MODULE (KBI)
IIC MODULE (IIC)
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
USER Flash (IN BYTES)
USER RAM (IN BYTES)
ON-CHIP ICE AND
DEBUG MODULE (DBG)
MC9S08JM60 = 60,912
HCS08 CORE
CPUBDC
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pull-down device if IRQ is enabled
(IRQPE = 1). Pull-down is enabled if rising edge detect is selected (IRQEDG = 1)
3. IRQ does not have a clamp diode to VDD. IRQ must not be driven above VDD.
4. Pin contains integrated pullup device.
5. When pin functions as KBI (KBIPEn = 1) and associated pin is configured to enable the
pullup device, KBEDGn can be used to reconfigure the pull-up as a pull-down device.
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTB5/KBIP5/ADP5
PORT B
PTE5/MOSI1
PTE4/MISO1
PTE6/SPSCK1
PTE7/SS1
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
VOLTAGE
REGULATOR
COP IRQ LVD
LOW-POWER OSCILLATOR
MULTI-PURPOSE CLOCK
GENERATOR (MCG)
RESET
VSSAD
VDDAD
VREFH
ANALOG-TO-DIGITAL
CONVERTER (ADC)
6-CHANNEL TIMER/PWM
MODULE (TPM1)
PTD7
6
PTB4/KBIP4/ADP4
PTG3/KBIP7
PTG2/KBIP6
PORT G
12-CHANNEL, 12-BIT
BKGD/MS
PTF3/TPM1CH5
PTF2/TPM1CH4
PTF0/TPM1CH2
PTF1/TPM1CH3
PORT F
PTF5/TPM2CH1
PTF4/TPM2CH0
PTF6
PTF7
INTERFACE MODULE (SCI1)
SERIAL COMMUNICATIONS
INTERFACE MODULE (SCI2)
SERIAL COMMUNICATIONS
PTG0/KBIP0
PTG1/KBIP1
MC9S08JM32 = 32,768
VREFL
PTG4/XTAL
PTG5/EXTAL
IRQ/TPMCLK RxD2
TxD2
SDA
SCL
8
KBIPx
KBIPx
TPMCLK
SPSCK1
SS1
MISO1
MOSI1
TPMCLK
TPM1CH1
TPM1CH0
RxD1
TxD1
EXTAL
XTAL
4
4
USB SIE
USB ENDPOINT
RAM
FULL SPEED
USB
TRANSCEIVER
USBDP
USBDN
MISO2
SS2
SPSCK2
MOSI2 PTB1/MOSI2/ADP1
PTB0/MISO2/ADP0
PTB7/ADP7
PTB6/ADP6
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI2)
REAL-TIME COUNTER
(RTC)
PTB3/SS2/ADP3
PTB2/SPSCK2/ADP2
TPM1CHx
4
TPM2CH1
TPM2CH0
4
ANALOG COMPARATOR
(ACMP)
SYSTEM
USB 3.3-V VOLTAGE REGULATOR
VUSB33
MC9S08JM60 = 4096
MC9S08JM32 = 2048
ACMPO
ACMP+
ACMP–
PTD3/KBIP3/ADP10
PTD2/KBIP2/ACMPO
V
SSOSC
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 163
11.1.1 Features
The IIC includes these distinctive features:
• Compatible with IIC bus standard
• Multi-master operation
• Software programmable for one of 64 different serial clock frequencies
• Software selectable acknowledge bit
• Interrupt driven byte-by-byte data transfer
• Arbitration lost interrupt with automatic mode switching from master to slave
• Calling address identification interrupt
• Start and stop signal generation/detection
• Repeated start signal generation
• Acknowledge bit generation/detection
• Bus busy detection
• General call recognition
• 10-bit address extension
11.1.2 Modes of Operation
A brief description of the IIC in the various MCU modes is given here.
•Run mode — This is the basic mode of operation. To conserve power in this mode, disable the
module.
•Wait mode — The module continues to operate while the MCU is in wait mode and can provide
a wake-up interrupt.
•Stop mode — The IIC is inactive in stop3 mode for reduced power consumption. The stop
instruction does not affect IIC register states. Stop2 resets the register contents.
11.1.3 Block Diagram
Figure 11-2 is a block diagram of the IIC.
MC9S08JM60 Series Data Sheet, Rev. 3
164 Freescale Semiconductor
Figure 11-2. IIC Functional Block Diagram
11.2 External Signal Description
This section describes each user-accessible pin signal.
11.2.1 SCL — Serial Clock Line
The bidirectional SCL is the serial clock line of the IIC system.
11.2.2 SDA — Serial Data Line
The bidirectional SDA is the serial data line of the IIC system.
11.3 Register Definition
This section consists of the IIC register descriptions in address order.
Refer to the direct-page register summary in the memory chapter of this document for the absolute address
assignments for all IIC registers. This section refers to registers and control bits only by their names. A
Input
Sync
In/Out
Data
Shift
Register
Address
Compare
Interrupt
Clock
Control
Start
Stop
Arbitration
Control
CTRL_REG FREQ_REG ADDR_REG STATUS_REG DATA_REG
ADDR_DECODE DATA_MUX
Data Bus
SCL SDA
Address
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 165
Freescale-provided equate or header file is used to translate these names into the appropriate absolute
addresses.
11.3.1 IIC Address Register (IICA)
11.3.2 IIC Frequency Divider Register (IICF)
76543210
R
AD7 AD6 AD5 AD4 AD3 AD2 AD1
0
W
Reset00000000
= Unimplemented or Reserved
Figure 11-3. IIC Address Register (IICA)
Table 11-1. IICA Field Descriptions
Field Description
7–1
AD[7:1]
Slave Address. The AD[7:1] field contains the slave address to be used by the IIC module. This field is used on
the 7-bit address scheme and the lower seven bits of the 10-bit address scheme.
76543210
R
MULT ICR
W
Reset00000000
Figure 11-4. IIC Frequency Divider Register (IICF)
MC9S08JM60 Series Data Sheet, Rev. 3
166 Freescale Semiconductor
For example, if the bus speed is 8 MHz, the table below shows the possible hold time values with different
ICR and MULT selections to achieve an IIC baud rate of 100kbps.
Table 11-2. IICF Field Descriptions
Field Description
7–6
MULT
IIC Multiplier Factor. The MULT bits define the multiplier factor, mul. This factor, along with the SCL divider,
generates the IIC baud rate. The multiplier factor mul as defined by the MULT bits is provided below.
00 mul = 01
01 mul = 02
10 mul = 04
11 Reserved
5–0
ICR
IIC Clock Rate. The ICR bits are used to prescale the bus clock for bit rate selection. These bits and the MULT
bits determine the IIC baud rate, the SDA hold time, the SCL Start hold time, and the SCL Stop hold time.
Ta b le 1 1 - 4 provides the SCL divider and hold values for corresponding values of the ICR.
The SCL divider multiplied by multiplier factor mul generates IIC baud rate.
Eqn. 11-1
SDA hold time is the delay from the falling edge of SCL (IIC clock) to the changing of SDA (IIC data).
SDA hold time = bus period (s) × mul × SDA hold value Eqn. 11-2
SCL start hold time is the delay from the falling edge of SDA (IIC data) while SCL is high (Start condition) to the
falling edge of SCL (IIC clock).
SCL Start hold time = bus period (s) × mul × SCL Start hold value Eqn. 11-3
SCL stop hold time is the delay from the rising edge of SCL (IIC clock) to the rising edge of SDA
SDA (IIC data) while SCL is high (Stop condition).
SCL Stop hold time = bus period (s) × mul × SCL Stop hold value Eqn. 11-4
Table 11-3. Hold Time Values for 8 MHz Bus Speed
MULT ICR
Hold Times (μs)
SDA SCL Start SCL Stop
0x2 0x00 3.500 3.000 5.500
0x1 0x07 2.500 4.000 5.250
0x1 0x0B 2.250 4.000 5.250
0x0 0x14 2.125 4.250 5.125
0x0 0x18 1.125 4.750 5.125
IIC baud rate bus speed (Hz)
mul SCLdivider×
---------------------------------------------=
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 167
Table 11-4. IIC Divider and Hold Values
ICR
(hex)
SCL
Divider
SDA Hold
Value
SCL Hold
(Start)
Value
SCL Hold
(Stop)
Value
ICR
(hex)
SCL
Divider
SDA Hold
Value
SCL Hold
(Start)
Value
SCL Hold
(Stop)
Value
00 20 7 6 11 20 160 17 78 81
01 22 7 7 12 21 192 17 94 97
02 24 8 8 13 22 224 33 110 113
03 26 8 9 14 23 256 33 126 129
04 28 9 10 15 24 288 49 142 145
05 30 9 11 16 25 320 49 158 161
06 34 10 13 18 26 384 65 190 193
07 40 10 16 21 27 480 65 238 241
08 28 7 10 15 28 320 33 158 161
09 32 7 12 17 29 384 33 190 193
0A 36 9 14 19 2A 448 65 222 225
0B 40 9 16 21 2B 512 65 254 257
0C 44 11 18 23 2C 576 97 286 289
0D 48 11 20 25 2D 640 97 318 321
0E 56 13 24 29 2E 768 129 382 385
0F 68 13 30 35 2F 960 129 478 481
10 48 9 18 25 30 640 65 318 321
11 56 9 22 29 31 768 65 382 385
12 64 13 26 33 32 896 129 446 449
13 72 13 30 37 33 1024 129 510 513
14 80 17 34 41 34 1152 193 574 577
15 88 17 38 45 35 1280 193 638 641
16 104 21 46 53 36 1536 257 766 769
17 128 21 58 65 37 1920 257 958 961
18 80 9 38 41 38 1280 129 638 641
19 96 9 46 49 39 1536 129 766 769
1A 112 17 54 57 3A 1792 257 894 897
1B 128 17 62 65 3B 2048 257 1022 1025
1C 144 25 70 73 3C 2304 385 1150 1153
1D 160 25 78 81 3D 2560 385 1278 1281
1E 192 33 94 97 3E 3072 513 1534 1537
1F 240 33 118 121 3F 3840 513 1918 1921
MC9S08JM60 Series Data Sheet, Rev. 3
168 Freescale Semiconductor
11.3.3 IIC Control Register (IICC1)
11.3.4 IIC Status Register (IICS)
76543210
R
IICEN IICIE MST TX TXAK
000
WRSTA
Reset00000000
= Unimplemented or Reserved
Figure 11-5. IIC Control Register (IICC1)
Table 11-5. IICC1 Field Descriptions
Field Description
7
IICEN
IIC Enable. The IICEN bit determines whether the IIC module is enabled.
0 IIC is not enabled
1 IIC is enabled
6
IICIE
IIC Interrupt Enable. The IICIE bit determines whether an IIC interrupt is requested.
0 IIC interrupt request not enabled
1 IIC interrupt request enabled
5
MST
Master Mode Select. The MST bit changes from a 0 to a 1 when a start signal is generated on the bus and
master mode is selected. When this bit changes from a 1 to a 0 a stop signal is generated and the mode of
operation changes from master to slave.
0Slave mode
1 Master mode
4
TX
Transmit Mode Select. The TX bit selects the direction of master and slave transfers. In master mode, this bit
should be set according to the type of transfer required. Therefore, for address cycles, this bit is always high.
When addressed as a slave, this bit should be set by software according to the SRW bit in the status register.
0 Receive
1 Transmit
3
TXAK
Transmit Acknowledge Enable. This bit specifies the value driven onto the SDA during data acknowledge
cycles for master and slave receivers.
0 An acknowledge signal is sent out to the bus after receiving one data byte
1 No acknowledge signal response is sent
2
RSTA
Repeat start. Writing a 1 to this bit generates a repeated start condition provided it is the current master. This
bit is always read as cleared. Attempting a repeat at the wrong time results in loss of arbitration.
76543210
RTCF
IAAS
BUSY
ARBL
0SRW
IICIF
RXAK
W
Reset10000000
= Unimplemented or Reserved
Figure 11-6. IIC Status Register (IICS)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 169
11.3.5 IIC Data I/O Register (IICD)
Table 11-6. IICS Field Descriptions
Field Description
7
TCF
Transfer Complete Flag. This bit is set on the completion of a byte transfer. This bit is only valid during or
immediately following a transfer to the IIC module or from the IIC module.The TCF bit is cleared by reading the
IICD register in receive mode or writing to the IICD in transmit mode.
0 Transfer in progress
1 Transfer complete
6
IAAS
Addressed as a Slave. The IAAS bit is set when the calling address matches the programmed slave address or
when the GCAEN bit is set and a general call is received. Writing the IICC register clears this bit.
0 Not addressed
1 Addressed as a slave
5
BUSY
Bus Busy. The BUSY bit indicates the status of the bus regardless of slave or master mode. The BUSY bit is set
when a start signal is detected and cleared when a stop signal is detected.
0 Bus is idle
1Bus is busy
4
ARBL
Arbitration Lost. This bit is set by hardware when the arbitration procedure is lost. The ARBL bit must be cleared
by software by writing a 1 to it.
0 Standard bus operation
1 Loss of arbitration
2
SRW
Slave Read/Write. When addressed as a slave, the SRW bit indicates the value of the R/W command bit of the
calling address sent to the master.
0 Slave receive, master writing to slave
1 Slave transmit, master reading from slave
1
IICIF
IIC Interrupt Flag. The IICIF bit is set when an interrupt is pending. This bit must be cleared by software, by
writing a 1 to it in the interrupt routine. One of the following events can set the IICIF bit:
• One byte transfer completes
• Match of slave address to calling address
• Arbitration lost
0 No interrupt pending
1 Interrupt pending
0
RXAK
Receive Acknowledge. When the RXAK bit is low, it indicates an acknowledge signal has been received after
the completion of one byte of data transmission on the bus. If the RXAK bit is high it means that no acknowledge
signal is detected.
0 Acknowledge received
1 No acknowledge received
76543210
R
DATA
W
Reset00000000
Figure 11-7. IIC Data I/O Register (IICD)
MC9S08JM60 Series Data Sheet, Rev. 3
170 Freescale Semiconductor
NOTE
When transitioning out of master receive mode, the IIC mode should be
switched before reading the IICD register to prevent an inadvertent
initiation of a master receive data transfer.
In slave mode, the same functions are available after an address match has occurred.
The TX bit in IICC must correctly reflect the desired direction of transfer in master and slave modes for
the transmission to begin. For instance, if the IIC is configured for master transmit but a master receive is
desired, reading the IICD does not initiate the receive.
Reading the IICD returns the last byte received while the IIC is configured in master receive or slave
receive modes. The IICD does not reflect every byte transmitted on the IIC bus, nor can software verify
that a byte has been written to the IICD correctly by reading it back.
In master transmit mode, the first byte of data written to IICD following assertion of MST is used for the
address transfer and should comprise of the calling address (in bit 7 to bit 1) concatenated with the required
R/W bit (in position bit 0).
11.3.6 IIC Control Register 2 (IICC2)
Table 11-7. IICD Field Descriptions
Field Description
7–0
DATA
Data — In master transmit mode, when data is written to the IICD, a data transfer is initiated. The most significant
bit is sent first. In master receive mode, reading this register initiates receiving of the next byte of data.
76543210
R
GCAEN ADEXT
000
AD10 AD9 AD8
W
Reset00000000
= Unimplemented or Reserved
Figure 11-8. IIC Control Register (IICC2)
Table 11-8. IICC2 Field Descriptions
Field Description
7
GCAEN
General Call Address Enable. The GCAEN bit enables or disables general call address.
0 General call address is disabled
1 General call address is enabled
6
ADEXT
Address Extension. The ADEXT bit controls the number of bits used for the slave address.
0 7-bit address scheme
1 10-bit address scheme
2–0
AD[10:8]
Slave Address. The AD[10:8] field contains the upper three bits of the slave address in the 10-bit address
scheme. This field is only valid when the ADEXT bit is set.
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 171
11.4 Functional Description
This section provides a complete functional description of the IIC module.
11.4.1 IIC Protocol
The IIC bus system uses a serial data line (SDA) and a serial clock line (SCL) for data transfer. All devices
connected to it must have open drain or open collector outputs. A logic AND function is exercised on both
lines with external pull-up resistors. The value of these resistors is system dependent.
Normally, a standard communication is composed of four parts:
• Start signal
• Slave address transmission
• Data transfer
• Stop signal
The stop signal should not be confused with the CPU stop instruction. The IIC bus system communication
is described briefly in the following sections and illustrated in Figure 11-9.
Figure 11-9. IIC Bus Transmission Signals
11.4.1.1 Start Signal
When the bus is free, no master device is engaging the bus (SCL and SDA lines are at logical high), a
master may initiate communication by sending a start signal. As shown in Figure 11-9, a start signal is
defined as a high-to-low transition of SDA while SCL is high. This signal denotes the beginning of a new
data transfer (each data transfer may contain several bytes of data) and brings all slaves out of their idle
states.
SCL
SDA
Start
Signal
Ack
Bit
12345678
msb lsb
12345678
msb lsb
Stop
Signal
No
SCL
SDA
12345678
msb lsb
12 5678
msb lsb
Repeated
34
9 9
AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W XXX D7 D6 D5 D4 D3 D2 D1 D0
Calling Address Read/ Data Byte
AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W AD7 AD6 AD5 AD4 AD3 AD2 AD1 R/W
New Calling Address
99
XX
Ack
Bit
Write
Start
Signal
Start
Signal
Ack
Bit
Calling Address Read/
Write
Stop
Signal
No
Ack
Bit
Read/
Write
MC9S08JM60 Series Data Sheet, Rev. 3
172 Freescale Semiconductor
11.4.1.2 Slave Address Transmission
The first byte of data transferred immediately after the start signal is the slave address transmitted by the
master. This is a seven-bit calling address followed by a R/W bit. The R/W bit tells the slave the desired
direction of data transfer.
1 = Read transfer, the slave transmits data to the master.
0 = Write transfer, the master transmits data to the slave.
Only the slave with a calling address that matches the one transmitted by the master responds by sending
back an acknowledge bit. This is done by pulling the SDA low at the ninth clock (see Figure 11-9).
No two slaves in the system may have the same address. If the IIC module is the master, it must not
transmit an address equal to its own slave address. The IIC cannot be master and slave at the same time.
However, if arbitration is lost during an address cycle, the IIC reverts to slave mode and operates correctly
even if it is being addressed by another master.
11.4.1.3 Data Transfer
Before successful slave addressing is achieved, the data transfer can proceed byte-by-byte in a direction
specified by the R/W bit sent by the calling master.
All transfers that come after an address cycle are referred to as data transfers, even if they carry sub-address
information for the slave device
Each data byte is 8 bits long. Data may be changed only while SCL is low and must be held stable while
SCL is high as shown in Figure 11-9. There is one clock pulse on SCL for each data bit, the msb being
transferred first. Each data byte is followed by a 9th (acknowledge) bit, which is signalled from the
receiving device. An acknowledge is signalled by pulling the SDA low at the ninth clock. In summary, one
complete data transfer needs nine clock pulses.
If the slave receiver does not acknowledge the master in the ninth bit time, the SDA line must be left high
by the slave. The master interprets the failed acknowledge as an unsuccessful data transfer.
If the master receiver does not acknowledge the slave transmitter after a data byte transmission, the slave
interprets this as an end of data transfer and releases the SDA line.
In either case, the data transfer is aborted and the master does one of two things:
• Relinquishes the bus by generating a stop signal.
• Commences a new calling by generating a repeated start signal.
11.4.1.4 Stop Signal
The master can terminate the communication by generating a stop signal to free the bus. However, the
master may generate a start signal followed by a calling command without generating a stop signal first.
This is called repeated start. A stop signal is defined as a low-to-high transition of SDA while SCL at
logical 1 (see Figure 11-9).
The master can generate a stop even if the slave has generated an acknowledge at which point the slave
must release the bus.
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 173
11.4.1.5 Repeated Start Signal
As shown in Figure 11-9, a repeated start signal is a start signal generated without first generating a stop
signal to terminate the communication. This is used by the master to communicate with another slave or
with the same slave in different mode (transmit/receive mode) without releasing the bus.
11.4.1.6 Arbitration Procedure
The IIC bus is a true multi-master bus that allows more than one master to be connected on it. If two or
more masters try to control the bus at the same time, a clock synchronization procedure determines the bus
clock, for which the low period is equal to the longest clock low period and the high is equal to the shortest
one among the masters. The relative priority of the contending masters is determined by a data arbitration
procedure, a bus master loses arbitration if it transmits logic 1 while another master transmits logic 0. The
losing masters immediately switch over to slave receive mode and stop driving SDA output. In this case,
the transition from master to slave mode does not generate a stop condition. Meanwhile, a status bit is set
by hardware to indicate loss of arbitration.
11.4.1.7 Clock Synchronization
Because wire-AND logic is performed on the SCL line, a high-to-low transition on the SCL line affects all
the devices connected on the bus. The devices start counting their low period and after a device’s clock has
gone low, it holds the SCL line low until the clock high state is reached. However, the change of low to
high in this device clock may not change the state of the SCL line if another device clock is still within its
low period. Therefore, synchronized clock SCL is held low by the device with the longest low period.
Devices with shorter low periods enter a high wait state during this time (see Figure 11-10). When all
devices concerned have counted off their low period, the synchronized clock SCL line is released and
pulled high. There is then no difference between the device clocks and the state of the SCL line and all the
devices start counting their high periods. The first device to complete its high period pulls the SCL line
low again.
Figure 11-10. IIC Clock Synchronization
SCL1
SCL2
SCL
Internal Counter Reset
Delay Start Counting High Period
MC9S08JM60 Series Data Sheet, Rev. 3
174 Freescale Semiconductor
11.4.1.8 Handshaking
The clock synchronization mechanism can be used as a handshake in data transfer. Slave devices may hold
the SCL low after completion of one byte transfer (9 bits). In such a case, it halts the bus clock and forces
the master clock into wait states until the slave releases the SCL line.
11.4.1.9 Clock Stretching
The clock synchronization mechanism can be used by slaves to slow down the bit rate of a transfer. After
the master has driven SCL low the slave can drive SCL low for the required period and then release it. If
the slave SCL low period is greater than the master SCL low period then the resulting SCL bus signal low
period is stretched.
11.4.2 10-bit Address
For 10-bit addressing, 0x11110 is used for the first 5 bits of the first address byte. Various combinations of
read/write formats are possible within a transfer that includes 10-bit addressing.
11.4.2.1 Master-Transmitter Addresses a Slave-Receiver
The transfer direction is not changed (see Table 11-9). When a 10-bit address follows a start condition,
each slave compares the first seven bits of the first byte of the slave address (11110XX) with its own
address and tests whether the eighth bit (R/W direction bit) is 0. More than one device can find a match
and generate an acknowledge (A1). Then, each slave that finds a match compares the eight bits of the
second byte of the slave address with its own address. Only one slave finds a match and generates an
acknowledge (A2). The matching slave remains addressed by the master until it receives a stop condition
(P) or a repeated start condition (Sr) followed by a different slave address.
After the master-transmitter has sent the first byte of the 10-bit address, the slave-receiver sees an IIC
interrupt. Software must ensure the contents of IICD are ignored and not treated as valid data for this
interrupt.
11.4.2.2 Master-Receiver Addresses a Slave-Transmitter
The transfer direction is changed after the second R/W bit (see Table 11-10). Up to and including
acknowledge bit A2, the procedure is the same as that described for a master-transmitter addressing a
slave-receiver. After the repeated start condition (Sr), a matching slave remembers that it was addressed
before. This slave then checks whether the first seven bits of the first byte of the slave address following
Sr are the same as they were after the start condition (S) and tests whether the eighth (R/W) bit is 1. If there
is a match, the slave considers that it has been addressed as a transmitter and generates acknowledge A3.
The slave-transmitter remains addressed until it receives a stop condition (P) or a repeated start condition
(Sr) followed by a different slave address.
SSlave Address 1st 7 bits R/W A1 Slave Address 2nd byte A2 Data A ... Data A/A P
11110 + AD10 + AD9 0 AD[8:1]
Table 11-9. Master-Transmitter Addresses Slave-Receiver with a 10-bit Address
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 175
After a repeated start condition (Sr), all other slave devices also compare the first seven bits of the first
byte of the slave address with their own addresses and test the eighth (R/W) bit. However, none of them
are addressed because R/W = 1 (for 10-bit devices) or the 11110XX slave address (for 7-bit devices) does
not match.
After the master-receiver has sent the first byte of the 10-bit address, the slave-transmitter sees an IIC
interrupt. Software must ensure the contents of IICD are ignored and not treated as valid data for this
interrupt.
11.4.3 General Call Address
General calls can be requested in 7-bit address or 10-bit address. If the GCAEN bit is set, the IIC matches
the general call address as well as its own slave address. When the IIC responds to a general call, it acts as
a slave-receiver and the IAAS bit is set after the address cycle. Software must read the IICD register after
the first byte transfer to determine whether the address matches is its own slave address or a general call.
If the value is 00, the match is a general call. If the GCAEN bit is clear, the IIC ignores any data supplied
from a general call address by not issuing an acknowledgement.
11.5 Resets
The IIC is disabled after reset. The IIC cannot cause an MCU reset.
11.6 Interrupts
The IIC generates a single interrupt.
An interrupt from the IIC is generated when any of the events in Table 11-11 occur, provided the IICIE bit
is set. The interrupt is driven by bit IICIF (of the IIC status register) and masked with bit IICIE (of the IIC
control register). The IICIF bit must be cleared by software by writing a 1 to it in the interrupt routine. You
can determine the interrupt type by reading the status register.
11.6.1 Byte Transfer Interrupt
The TCF (transfer complete flag) bit is set at the falling edge of the ninth clock to indicate the completion
of byte transfer.
S
Slave Address
1st 7 bits R/W A1
Slave Address
2nd byte A2 Sr
Slave Address
1st 7 bits R/W A3 Data A ... Data A P
11110 + AD10 + AD9 0 AD[8:1] 11110 + AD10 + AD9 1
Table 11-10. Master-Receiver Addresses a Slave-Transmitter with a 10-bit Address
Table 11-11. Interrupt Summary
Interrupt Source Status Flag Local Enable
Complete 1-byte transfer TCF IICIF IICIE
Match of received calling address IAAS IICIF IICIE
Arbitration Lost ARBL IICIF IICIE
MC9S08JM60 Series Data Sheet, Rev. 3
176 Freescale Semiconductor
11.6.2 Address Detect Interrupt
When the calling address matches the programmed slave address (IIC address register) or when the
GCAEN bit is set and a general call is received, the IAAS bit in the status register is set. The CPU is
interrupted, provided the IICIE is set. The CPU must check the SRW bit and set its Tx mode accordingly.
11.6.3 Arbitration Lost Interrupt
The IIC is a true multi-master bus that allows more than one master to be connected on it. If two or more
masters try to control the bus at the same time, the relative priority of the contending masters is determined
by a data arbitration procedure. The IIC module asserts this interrupt when it loses the data arbitration
process and the ARBL bit in the status register is set.
Arbitration is lost in the following circumstances:
• SDA sampled as a low when the master drives a high during an address or data transmit cycle.
• SDA sampled as a low when the master drives a high during the acknowledge bit of a data receive
cycle.
• A start cycle is attempted when the bus is busy.
• A repeated start cycle is requested in slave mode.
• A stop condition is detected when the master did not request it.
This bit must be cleared by software writing a 1 to it.
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 177
11.7 Initialization/Application Information
Figure 11-11. IIC Module Quick Start
Module Initialization (Slave)
1. Write: IICC2
— to enable or disable general call
— to select 10-bit or 7-bit addressing mode
2. Write: IICA
— to set the slave address
3. Write: IICC1
— to enable IIC and interrupts
4. Initialize RAM variables (IICEN = 1 and IICIE = 1) for transmit data
5. Initialize RAM variables used to achieve the routine shown in Figure 11-12
Module Initialization (Master)
1. Write: IICF
— to set the IIC baud rate (example provided in this chapter)
2. Write: IICC1
— to enable IIC and interrupts
3. Initialize RAM variables (IICEN = 1 and IICIE = 1) for transmit data
4. Initialize RAM variables used to achieve the routine shown in Figure 11-12
5. Write: IICC1
— to enable TX
0
IICF
IICA
Baud rate = BUSCLK / (2 x MULT x (SCL DIVIDER))
TX TXAK RSTA 0 0
IICC1 IICEN IICIE MST
Module configuration
ARBL 0 SRW IICIF RXAK
IICS TCF IAAS BUSY
Module status flags
Register Model
AD[7:1]
When addressed as a slave (in slave mode), the module responds to this address
MULT ICR
IICD DATA
Data register; Write to transmit IIC data read to read IIC data
0 AD10 AD9 AD8
IICC2 GCAEN ADEXT
Address configuration
0
0
MC9S08JM60 Series Data Sheet, Rev. 3
178 Freescale Semiconductor
Figure 11-12. Typical IIC Interrupt Routine
Clear
Master
Mode
?
Tx/Rx
?
Last Byte
Transmitted
?
RXAK=0
?
End of
Addr Cycle
(Master Rx)
?
Write Next
Byte to IICD
Switch to
Rx Mode
Dummy Read
from IICD
Generate
Stop Signal
Read Data
from IICD
and Store
Set TXACK =1
Generate
Stop Signal
2nd Last
Byte to Be Read
?
Last
Byte to Be Read
?
Arbitration
Lost
?
Clear ARBL
IAAS=1
?
IAAS=1
?
SRW=1
?
TX/RX
?
Set TX
Mode
Write Data
to IICD
Set RX
Mode
Dummy Read
from IICD
ACK from
Receiver
?
Tx Next
Byte
Read Data
from IICD
and Store
Switch to
Rx Mode
Dummy Read
from IICD
RTI
YN
Y
YY
Y
Y
Y
Y
Y
Y
N
N
N
N
N
N
N
N
N
Y
TX RX
RX
TX
(Write)
(Read)
N
IICIF
Address Transfer Data Transfer
(MST = 0)
(MST = 0)
See Note 1
NOTES:
1. If general call is enabled, a check must be done to determine whether the received address was a general call address (0x00). If the received address was a
general call address, then the general call must be handled by user software.
2. When 10-bit addressing is used to address a slave, the slave sees an interrupt following the first byte of the extended address.
See Note 2
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 179
MC9S08JM60 Series Data Sheet, Rev. 3
180 Freescale Semiconductor
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 181
Chapter 12
Multi-Purpose Clock Generator (S08MCGV1)
12.1 Introduction
The multi-purpose clock generator (MCG) module provides several clock source choices for the MCU.
which contains a frequency-locked loop (FLL) and a phase-locked loop (PLL). The module can select
either of the FLL or PLL clocks, or either of the internal or external reference clocks as a source for the
MCU system clock. Whichever clock source is chosen, it is passed through a reduced bus divider which
allows a lower output clock frequency to be derived. The MCG also controls an external oscillator (XOSC)
for the use of a crystal or resonator as the external reference clock.
For USB operation on the MC9S08JM60 series, the MCG must be configured for PLL engaged external
(PEE) mode in order to achieve a MCGOUT frequency of 48 MHz
Chapter 12 Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
182 Freescale Semiconductor
Figure 12-1. MC9S08JM60 Series Block Diagram Highlighting MCG Block and Pins
PTD4/ADP11
PTD5
PTD6
PTC1/SDA
PTC0/SCL
VSS
VDD
PTE3/TPM1CH1
PTE2/TPM1CH0
PTA5– PTA0
PTE0/TxD1
PTE1/RxD1
PTD1/ADP9/ACMP–
PTD0/ADP8/ACMP+
PTC6
PTC5/RxD2
PTC4
PTC3/TxD2
PTC2
PORT A
PORT C
PORT D
PORT E
8-BIT KEYBOARD
INTERRUPT MODULE (KBI)
IIC MODULE (IIC)
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
USER Flash (IN BYTES)
USER RAM (IN BYTES)
ON-CHIP ICE AND
DEBUG MODULE (DBG)
MC9S08JM60 = 60,912
HCS08 CORE
CPUBDC
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pull-down device if IRQ is enabled
(IRQPE = 1). Pull-down is enabled if rising edge detect is selected (IRQEDG = 1)
3. IRQ does not have a clamp diode to VDD. IRQ must not be driven above VDD.
4. Pin contains integrated pullup device.
5. When pin functions as KBI (KBIPEn = 1) and associated pin is configured to enable the
pullup device, KBEDGn can be used to reconfigure the pullup as a pull-down device.
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTB5/KBIP5/ADP5
PORT B
PTE5/MOSI1
PTE4/MISO1
PTE6/SPSCK1
PTE7/SS1
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
VOLTAGE
REGULATOR
COP IRQ LVD
LOW-POWER OSCILLATOR
MULTI-PURPOSE CLOCK
GENERATOR (MCG)
RESET
VSSAD
VDDAD
VREFH
ANALOG-TO-DIGITAL
CONVERTER (ADC)
6-CHANNEL TIMER/PWM
MODULE (TPM1)
PTD7
6
PTB4/KBIP4/ADP4
PTG3/KBIP7
PTG2/KBIP6
PORT G
12-CHANNEL, 12-BIT
BKGD/MS
PTF3/TPM1CH5
PTF2/TPM1CH4
PTF0/TPM1CH2
PTF1/TPM1CH3
PORT F
PTF5/TPM2CH1
PTF4/TPM2CH0
PTF6
PTF7
INTERFACE MODULE (SCI1)
SERIAL COMMUNICATIONS
INTERFACE MODULE (SCI2)
SERIAL COMMUNICATIONS
PTG0/KBIP0
PTG1/KBIP1
MC9S08JM32 = 32,768
VREFL
PTG4/XTAL
PTG5/EXTAL
IRQ/TPMCLK RxD2
TxD2
SDA
SCL
8
KBIPx
KBIPx
TPMCLK
SPSCK1
SS1
MISO1
MOSI1
TPMCLK
TPM1CH1
TPM1CH0
RxD1
TxD1
EXTAL
XTAL
4
4
USB SIE
USB ENDPOINT
RAM
FULL SPEED
USB
TRANSCEIVER
USBDP
USBDN
MISO2
SS2
SPSCK2
MOSI2 PTB1/MOSI2/ADP1
PTB0/MISO2/ADP0
PTB7/ADP7
PTB6/ADP6
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI2)
REAL-TIME COUNTER
(RTC)
PTB3/SS2/ADP3
PTB2/SPSCK2/ADP2
TPM1CHx
4
TPM2CH1
TPM2CH0
4
ANALOG COMPARATOR
(ACMP)
SYSTEM
USB 3.3-V VOLTAGE REGULATOR
VUSB33
MC9S08JM60 = 4096
MC9S08JM32 = 2048
ACMPO
ACMP+
ACMP–
PTD3/KBIP3/ADP10
PTD2/KBIP2/ACMPO
V
SSOSC
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 183
12.1.1 Features
Key features of the MCG module are:
• Frequency-locked loop (FLL)
— 0.2% resolution using internal 32-kHz reference
— 2% deviation over voltage and temperature using internal 32-kHz reference
— Internal or external reference can be used to control the FLL
• Phase-locked loop (PLL)
— Voltage-controlled oscillator (VCO)
— Modulo VCO frequency divider
— Phase/Frequency detector
— Integrated loop filter
— Lock detector with interrupt capability
• Internal reference clock
— Nine trim bits for accuracy
— Can be selected as the clock source for the MCU
• External reference clock
— Control for external oscillator
— Clock monitor with reset capability
— Can be selected as the clock source for the MCU
• Reference divider is provided
• Clock source selected can be divided down by 1, 2, 4, or 8
• BDC clock (MCGLCLK) is provided as a constant divide by 2 of the DCO output whether in an
FLL or PLL mode.
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
184 Freescale Semiconductor
Figure 12-2. Multi-Purpose Clock Generator (MCG) Block Diagram
DCO
Filter
RDIV
TRIM
External Oscillator
IREFS
(XOSC)
CLKS
n=0-7
/ 2n
n=0-3
/ 2n
Internal
Reference
Clock
BDIV
9
MCGLCLK
MCGOUT
MCGIRCLK
EREFS
RANGE
EREFSTEN
HGO
IREFSTEN
MCGERCLK
LP
MCGFFCLK
DCOOUT
FLL
RDIV_CLK
PLL
VDIV
/(4,8,12,...,40)
VCO
Phase
Detector
Charge
Pump
Internal
Filter
Lock
Detector
LOCK
Clock
Monitor
OSCINIT
VCOOUT
Multi-purpose Clock Generator (MCG)
LP
ERCLKEN
IRCLKEN
CME
LOC
/ 2
PLLS
LOLS
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 185
12.1.2 Modes of Operation
There are nine modes of operation for the MCG:
• FLL Engaged Internal (FEI)
• FLL Engaged External (FEE)
• FLL Bypassed Internal (FBI)
• FLL Bypassed External (FBE)
• PLL Engaged External (PEE)
• PLL Bypassed External (PBE)
• Bypassed Low Power Internal (BLPI)
• Bypassed Low Power External (BLPE)
•Stop
For details see Section 12.4.1, “Operational Modes.”
12.2 External Signal Description
There are no MCG signals that connect off chip.
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
186 Freescale Semiconductor
12.3 Register Definition
12.3.1 MCG Control Register 1 (MCGC1)
7 6543210
R
CLKS RDIV IREFS IRCLKEN IREFSTEN
W
Reset: 0 0 0 0 0 1 0 0
Figure 12-3. MCG Control Register 1 (MCGC1)
Table 12-1. MCG Control Register 1 Field Descriptions
Field Description
7:6
CLKS
Clock Source Select — Selects the system clock source.
00 Encoding 0 — Output of FLL or PLL is selected.
01 Encoding 1 — Internal reference clock is selected.
10 Encoding 2 — External reference clock is selected.
11 Encoding 3 — Reserved, defaults to 00.
5:3
RDIV
Reference Divider — Selects the amount to divide down the reference clock selected by the IREFS bit. If the
FLL is selected, the resulting frequency must be in the range 31.25 kHz to 39.0625 kHz. If the PLL is selected,
the resulting frequency must be in the range 1 MHz to 2 MHz.
000 Encoding 0 — Divides reference clock by 1 (reset default)
001 Encoding 1 — Divides reference clock by 2
010 Encoding 2 — Divides reference clock by 4
011 Encoding 3 — Divides reference clock by 8
100 Encoding 4 — Divides reference clock by 16
101 Encoding 5 — Divides reference clock by 32
110 Encoding 6 — Divides reference clock by 64
111 Encoding 7 — Divides reference clock by 128
2
IREFS
Internal Reference Select — Selects the reference clock source.
1 Internal reference clock selected
0 External reference clock selected
1
IRCLKEN
Internal Reference Clock Enable — Enables the internal reference clock for use as MCGIRCLK.
1 MCGIRCLK active
0 MCGIRCLK inactive
0
IREFSTEN
Internal Reference Stop Enable — Controls whether or not the internal reference clock remains enabled when
the MCG enters stop mode.
1 Internal reference clock stays enabled in stop if IRCLKEN is set or if MCG is in FEI, FBI, or BLPI mode before
entering stop
0 Internal reference clock is disabled in stop
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 187
12.3.2 MCG Control Register 2 (MCGC2)
7 6543210
R
BDIV RANGE HGO LP EREFS ERCLKEN EREFSTEN
W
Reset:0 1000000
Figure 12-4. MCG Control Register 2 (MCGC2)
Table 12-2. MCG Control Register 2 Field Descriptions
Field Description
7:6
BDIV
Bus Frequency Divider — Selects the amount to divide down the clock source selected by the CLKS bits in the
MCGC1 register. This controls the bus frequency.
00 Encoding 0 — Divides selected clock by 1
01 Encoding 1 — Divides selected clock by 2 (reset default)
10 Encoding 2 — Divides selected clock by 4
11 Encoding 3 — Divides selected clock by 8
5
RANGE
Frequency Range Select — Selects the frequency range for the external oscillator or external clock source.
1 High frequency range selected for the external oscillator of 1 MHz to 16 MHz (1 MHz to 40 MHz for external
clock source)
0 Low frequency range selected for the external oscillator of 32 kHz to 100 kHz (32 kHz to 1 MHz for external
clock source)
4
HGO
High Gain Oscillator Select — Controls the external oscillator mode of operation.
1 Configure external oscillator for high gain operation
0 Configure external oscillator for low power operation
3
LP
Low Power Select — Controls whether the FLL (or PLL) is disabled in bypassed modes.
1 FLL (or PLL) is disabled in bypass modes (lower power).
0 FLL (or PLL) is not disabled in bypass modes.
2
EREFS
External Reference Select — Selects the source for the external reference clock.
1 Oscillator requested
0 External Clock Source requested
1
ERCLKEN
External Reference Enable — Enables the external reference clock for use as MCGERCLK.
1 MCGERCLK active
0 MCGERCLK inactive
0
EREFSTEN
External Reference Stop Enable — Controls whether or not the external reference clock remains enabled when
the MCG enters stop mode.
1 External reference clock stays enabled in stop if ERCLKEN is set or if MCG is in FEE, FBE, PEE, PBE, or
BLPE mode before entering stop
0 External reference clock is disabled in stop
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
188 Freescale Semiconductor
12.3.3 MCG Trim Register (MCGTRM)
7 6543210
R
TRIM
W
POR: 1 0 0 0 0 0 0 0
Reset:U UUUUUUU
Figure 12-5. MCG Trim Register (MCGTRM)
Table 12-3. MCG Trim Register Field Descriptions
Field Description
7:0
TRIM
MCG Trim Setting — Controls the internal reference clock frequency by controlling the internal reference clock
period. The TRIM bits are binary weighted (i.e., bit 1 will adjust twice as much as bit 0). Increasing the binary
value in TRIM will increase the period, and decreasing the value will decrease the period.
An additional fine trim bit is available in MCGSC as the FTRIM bit.
If a TRIM[7:0] value stored in nonvolatile memory is to be used, it’s the user’s responsibility to copy that value
from the nonvolatile memory location to this register.
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 189
12.3.4 MCG Status and Control Register (MCGSC)
7 6543210
R LOLS LOCK PLLST IREFST CLKST OSCINIT
FTRIM
W
POR:
Reset:
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
U
Figure 12-6. MCG Status and Control Register (MCGSC)
Table 12-4. MCG Status and Control Register Field Descriptions
Field Description
7
LOLS
Loss of Lock Status — This bit is a sticky indication of lock status for the FLL or PLL. LOLS is set when lock
detection is enabled and after acquiring lock, the FLL or PLL output frequency has fallen outside the lock exit
frequency tolerance, Dunl. LOLIE determines whether an interrupt request is made when set. LOLS is cleared by
reset or by writing a logic 1 to LOLS when LOLS is set. Writing a logic 0 to LOLS has no effect.
0 FLL or PLL has not lost lock since LOLS was last cleared.
1 FLL or PLL has lost lock since LOLS was last cleared.
6
LOCK
Lock Status — Indicates whether the FLL or PLL has acquired lock. Lock detection is disabled when both the
FLL and PLL are disabled. If the lock status bit is set then changing the value of any of the following bits IREFS,
PLLS, RDIV[2:0], TRIM[7:0] (if in FEI or FBI modes), or VDIV[3:0] (if in PBE or PEE modes), will cause the lock
status bit to clear and stay cleared until the FLL or PLL has reacquired lock. Stop mode entry will also cause the
lock status bit to clear and stay cleared until the FLL or PLL has reacquired lock. Entry into BLPI or BLPE mode
will also cause the lock status bit to clear and stay cleared until the MCG has exited these modes and the FLL or
PLL has reacquired lock.
0 FLL or PLL is currently unlocked.
1 FLL or PLL is currently locked.
5
PLLST
PLL Select Status — The PLLST bit indicates the current source for the PLLS clock. The PLLST bit does not
update immediately after a write to the PLLS bit due to internal synchronization between clock domains.
0 Source of PLLS clock is FLL clock.
1 Source of PLLS clock is PLL clock.
4
IREFST
Internal Reference Status — The IREFST bit indicates the current source for the reference clock. The IREFST
bit does not update immediately after a write to the IREFS bit due to internal synchronization between clock
domains.
0 Source of reference clock is external reference clock (oscillator or external clock source as determined by the
EREFS bit in the MCGC2 register).
1 Source of reference clock is internal reference clock.
3:2
CLKST
Clock Mode Status — The CLKST bits indicate the current clock mode. The CLKST bits do not update
immediately after a write to the CLKS bits due to internal synchronization between clock domains.
00 Encoding 0 — Output of FLL is selected.
01 Encoding 1 — Internal reference clock is selected.
10 Encoding 2 — External reference clock is selected.
11 Encoding 3 — Output of PLL is selected.
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
190 Freescale Semiconductor
12.3.5 MCG Control Register 3 (MCGC3)
1
OSCINIT
OSC Initialization — If the external reference clock is selected by ERCLKEN or by the MCG being in FEE, FBE,
PEE, PBE, or BLPE mode, and if EREFS is set, then this bit is set after the initialization cycles of the external
oscillator clock have completed. This bit is only cleared when either EREFS is cleared or when the MCG is in
either FEI, FBI, or BLPI mode and ERCLKEN is cleared.
0
FTRIM
MCG Fine Trim — Controls the smallest adjustment of the internal reference clock frequency. Setting FTRIM will
increase the period and clearing FTRIM will decrease the period by the smallest amount possible.
If an FTRIM value stored in nonvolatile memory is to be used, it’s the user’s responsibility to copy that value from
the nonvolatile memory location to this register’s FTRIM bit.
7 6543210
R
LOLIE PLLS CME
0
VDIV
W
Reset: 0 0 0 0 0 0 0 1
Figure 12-7. MCG PLL Register (MCGPLL)
Table 12-5. MCG PLL Register Field Descriptions
Field Description
7
LOLIE
Loss of Lock Interrupt Enable — Determines if an interrupt request is made following a loss of lock indication.
The LOLIE bit only has an effect when LOLS is set.
0 No request on loss of lock.
1 Generate an interrupt request on loss of lock.
6
PLLS
PLL Select — Controls whether the PLL or FLL is selected. If the PLLS bit is clear, the PLL is disabled in all
modes. If the PLLS is set, the FLL is disabled in all modes.
1 PLL is selected
0 FLL is selected
Table 12-4. MCG Status and Control Register Field Descriptions (continued)
Field Description
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 191
5
CME
Clock Monitor Enable — Determines if a reset request is made following a loss of external clock indication. The
CME bit should only be set to a logic 1 when either the MCG is in an operational mode that uses the external
clock (FEE, FBE, PEE, PBE, or BLPE) or the external reference is enabled (ERCLKEN=1 in the MCGC2
register). Whenever the CME bit is set to a logic 1, the value of the RANGE bit in the MCGC2 register should not
be changed.
0 Clock monitor is disabled.
1 Generate a reset request on loss of external clock.
3:0
VDIV
VCO Divider — Selects the amount to divide down the VCO output of PLL. The VDIV bits establish the
multiplication factor (M) applied to the reference clock frequency.
0000 Encoding 0 — Reserved.
0001 Encoding 1 — Multiply by 4.
0010 Encoding 2 — Multiply by 8.
0011 Encoding 3 — Multiply by 12.
0100 Encoding 4 — Multiply by 16.
0101 Encoding 5 — Multiply by 20.
0110 Encoding 6 — Multiply by 24.
0111 Encoding 7 — Multiply by 28.
1000 Encoding 8 — Multiply by 32.
1001 Encoding 9 — Multiply by 36.
1010 Encoding 10 — Multiply by 40.
1011 Encoding 11 — Reserved (default to M=40).
11xx Encoding 12-15 — Reserved (default to M=40).
Table 12-5. MCG PLL Register Field Descriptions (continued)
Field Description
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
192 Freescale Semiconductor
12.4 Functional Description
12.4.1 Operational Modes
Figure 12-8. Clock Switching Modes
The nine states of the MCG are shown as a state diagram and are described below. The arrows indicate the
allowed movements between the states.
12.4.1.1 FLL Engaged Internal (FEI)
FLL engaged internal (FEI) is the default mode of operation and is entered when all the following
conditions occur:
• CLKS bits are written to 00
• IREFS bit is written to 1
• PLLS bit is written to 0
• RDIV bits are written to 000. Since the internal reference clock frequency should already be in the
range of 31.25 kHz to 39.0625 kHz after it is trimmed, no further frequency divide is necessary.
Entered from any state
when MCU enters stop
Returns to state that was active
before MCU entered stop, unless
RESET occurs while in stop.
Stop
PLL Bypassed
External (PBE)
PLL Engaged
External (PEE)
FLL Engaged
External (FEE)
FLL Engaged
Internal (FEI)
FLL Bypassed
External (FBE)
FLL Bypassed
Internal (FBI)
IREFS=1
CLKS=00
PLLS=0
IREFS=0
CLKS=00
PLLS=0
IREFS=1
CLKS=01
PLLS=0
IREFS=0
CLKS=10
PLLS=0
IREFS=0
CLKS=00
PLLS=1
IREFS=0
CLKS=10
PLLS=1
IREFS=0
CLKS=10
BDM Disabled
and LP=1
IREFS=1
CLKS=01
BDM Disabled
and LP=1
Bypassed
Low Power
Internal (BLPI)
Bypassed
Low Power
External (BLPE)
BDM Enabled
or LP=0
BDM Enabled
or LP=0 BDM Enabled
or LP=0
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 193
In FLL engaged internal mode, the MCGOUT clock is derived from the FLL clock, which is controlled by
the internal reference clock. The FLL clock frequency locks to 1024 times the reference frequency, as
selected by the RDIV bits. The MCGLCLK is derived from the FLL and the PLL is disabled in a low
power state.
12.4.1.2 FLL Engaged External (FEE)
The FLL engaged external (FEE) mode is entered when all the following conditions occur:
• CLKS bits are written to 00
• IREFS bit is written to 0
• PLLS bit is written to 0
• RDIV bits are written to divide reference clock to be within the range of 31.25 kHz to 39.0625 kHz
In FLL engaged external mode, the MCGOUT clock is derived from the FLL clock which is controlled by
the external reference clock. The external reference clock which is enabled can be an external
crystal/resonator or it can be another external clock source.The FLL clock frequency locks to 1024 times
the reference frequency, as selected by the RDIV bits. The MCGLCLK is derived from the FLL and the
PLL is disabled in a low power state.
12.4.1.3 FLL Bypassed Internal (FBI)
In FLL bypassed internal (FBI) mode, the MCGOUT clock is derived from the internal reference clock
and the FLL is operational but its output clock is not used. This mode is useful to allow the FLL to acquire
its target frequency while the MCGOUT clock is driven from the internal reference clock.
The FLL bypassed internal mode is entered when all the following conditions occur:
• CLKS bits are written to 01
• IREFS bit is written to 1
• PLLS bit is written to 0
• RDIV bits are written to 000. Since the internal reference clock frequency should already be in the
range of 31.25 kHz to 39.0625 kHz after it is trimmed, no further frequency divide is necessary.
• LP bit is written to 0
In FLL bypassed internal mode, the MCGOUT clock is derived from the internal reference clock. The FLL
clock is controlled by the internal reference clock, and the FLL clock frequency locks to 1024 times the
reference frequency, as selected by the RDIV bits. The MCGLCLK is derived from the FLL and the PLL
is disabled in a low power state.
12.4.1.4 FLL Bypassed External (FBE)
In FLL bypassed external (FBE) mode, the MCGOUT clock is derived from the external reference clock
and the FLL is operational but its output clock is not used. This mode is useful to allow the FLL to acquire
its target frequency while the MCGOUT clock is driven from the external reference clock.
The FLL bypassed external mode is entered when all the following conditions occur:
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
194 Freescale Semiconductor
• CLKS bits are written to 10
• IREFS bit is written to 0
• PLLS bit is written to 0
• RDIV bits are written to divide reference clock to be within the range of 31.25 kHz to 39.0625 kHz
• LP bit is written to 0
In FLL bypassed external mode, the MCGOUT clock is derived from the external reference clock. The
external reference clock which is enabled can be an external crystal/resonator or it can be another external
clock source.The FLL clock is controlled by the external reference clock, and the FLL clock frequency
locks to 1024 times the reference frequency, as selected by the RDIV bits. The MCGLCLK is derived from
the FLL and the PLL is disabled in a low power state.
NOTE
It is possible to briefly operate in FBE mode with an FLL reference clock
frequency that is greater than the specified maximum frequency. This can be
necessary in applications that operate in PEE mode using an external crystal
with a frequency above 5 MHz. Please see 12.5.2.4, “Example # 4: Moving
from FEI to PEE Mode: External Crystal = 8 MHz, Bus Frequency = 8 MHz
for a detailed example.
12.4.1.5 PLL Engaged External (PEE)
The PLL engaged external (PEE) mode is entered when all the following conditions occur:
• CLKS bits are written to 00
• IREFS bit is written to 0
• PLLS bit is written to 1
• RDIV bits are written to divide reference clock to be within the range of 1 MHz to 2 MHz
In PLL engaged external mode, the MCGOUT clock is derived from the PLL clock which is controlled by
the external reference clock. The external reference clock which is enabled can be an external
crystal/resonator or it can be another external clock source The PLL clock frequency locks to a
multiplication factor, as selected by the VDIV bits, times the reference frequency, as selected by the RDIV
bits. If BDM is enabled then the MCGLCLK is derived from the DCO (open-loop mode) divided by two.
If BDM is not enabled then the FLL is disabled in a low power state.
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 195
12.4.1.6 PLL Bypassed External (PBE)
In PLL bypassed external (PBE) mode, the MCGOUT clock is derived from the external reference clock
and the PLL is operational but its output clock is not used. This mode is useful to allow the PLL to acquire
its target frequency while the MCGOUT clock is driven from the external reference clock.
The PLL bypassed external mode is entered when all the following conditions occur:
• CLKS bits are written to 10
• IREFS bit is written to 0
• PLLS bit is written to 1
• RDIV bits are written to divide reference clock to be within the range of 1 MHz to 2 MHz
• LP bit is written to 0
In PLL bypassed external mode, the MCGOUT clock is derived from the external reference clock. The
external reference clock which is enabled can be an external crystal/resonator or it can be another external
clock source. The PLL clock frequency locks to a multiplication factor, as selected by the VDIV bits, times
the reference frequency, as selected by the RDIV bits. If BDM is enabled then the MCGLCLK is derived
from the DCO (open-loop mode) divided by two. If BDM is not enabled then the FLL is disabled in a low
power state.
12.4.1.7 Bypassed Low Power Internal (BLPI)
The bypassed low power internal (BLPI) mode is entered when all the following conditions occur:
• CLKS bits are written to 01
• IREFS bit is written to 1
• PLLS bit is written to 0 or 1
• LP bit is written to 1
• BDM mode is not active
In bypassed low power internal mode, the MCGOUT clock is derived from the internal reference clock.
The PLL and the FLL are disabled at all times in BLPI mode and the MCGLCLK will not be available for
BDC communications If the BDM becomes active the mode will switch to one of the bypassed internal
modes as determined by the state of the PLLS bit.
12.4.1.8 Bypassed Low Power External (BLPE)
The bypassed low power external (BLPE) mode is entered when all the following conditions occur:
• CLKS bits are written to 10
• IREFS bit is written to 0
• PLLS bit is written to 0 or 1
• LP bit is written to 1
• BDM mode is not active
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
196 Freescale Semiconductor
In bypassed low power external mode, the MCGOUT clock is derived from the external reference clock.
The external reference clock which is enabled can be an external crystal/resonator or it can be another
external clock source.
The PLL and the FLL are disabled at all times in BLPE mode and the MCGLCLK will not be available
for BDC communications. If the BDM becomes active the mode will switch to one of the bypassed
external modes as determined by the state of the PLLS bit.
12.4.1.9 Stop
Stop mode is entered whenever the MCU enters a STOP state. In this mode, the FLL and PLL are disabled
and all MCG clock signals are static except in the following cases:
MCGIRCLK will be active in stop mode when all the following conditions occur:
• IRCLKEN = 1
• IREFSTEN = 1
MCGERCLK will be active in stop mode when all the following conditions occur:
• ERCLKEN = 1
• EREFSTEN = 1
12.4.2 Mode Switching
When switching between engaged internal and engaged external modes the IREFS bit can be changed at
anytime, but the RDIV bits must be changed simultaneously so that the reference frequency stays in the
range required by the state of the PLLS bit (31.25 kHz to 39.0625 kHz if the FLL is selected, or 1 MHz to
2 MHz if the PLL is selected). After a change in the IREFS value the FLL or PLL will begin locking again
after the switch is completed. The completion of the switch is shown by the IREFST bit.
For the special case of entering stop mode immediately after switching to FBE mode, if the external clock
and the internal clock are disabled in stop mode, (EREFSTEN = 0 and IREFSTEN = 0), it is necessary to
allow 100us after the IREFST bit is cleared to allow the internal reference to shutdown. For most cases the
delay due to instruction execution times will be sufficient.
The CLKS bits can also be changed at anytime, but in order for the MCGLCLK to be configured correctly
the RDIV bits must be changed simultaneously so that the reference frequency stays in the range required
by the state of the PLLS bit (31.25 kHz to 39.0625 kHz if the FLL is selected, or 1 MHz to 2MHz if the
PLL is selected). The actual switch to the newly selected clock will be shown by the CLKST bits. If the
newly selected clock is not available, the previous clock will remain selected.
For details see Figure 12-8.
12.4.3 Bus Frequency Divider
The BDIV bits can be changed at anytime and the actual switch to the new frequency will occur
immediately.
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 197
12.4.4 Low Power Bit Usage
The low power bit (LP) is provided to allow the FLL or PLL to be disabled and thus conserve power when
these systems are not being used. However, in some applications it may be desirable to enable the FLL or
PLL and allow it to lock for maximum accuracy before switching to an engaged mode. Do this by writing
the LP bit to 0.
12.4.5 Internal Reference Clock
When IRCLKEN is set the internal reference clock signal will be presented as MCGIRCLK, which can be
used as an additional clock source. The MCGIRCLK frequency can be re-targeted by trimming the period
of the internal reference clock. This can be done by writing a new value to the TRIM bits in the MCGTRM
register. Writing a larger value will decrease the MCGIRCLK frequency, and writing a smaller value to
the MCGTRM register will increase the MCGIRCLK frequency. The TRIM bits will effect the MCGOUT
frequency if the MCG is in FLL engaged internal (FEI), FLL bypassed internal (FBI), or bypassed low
power internal (BLPI) mode. The TRIM and FTRIM value is initialized by POR but is not affected by
other resets.
Until MCGIRCLK is trimmed, programming low reference divider (RDIV) factors may result in
MCGOUT frequencies that exceed the maximum chip-level frequency and violate the chip-level clock
timing specifications (see the Device Overview chapter).
If IREFSTEN and IRCLKEN bits are both set, the internal reference clock will keep running during stop
mode in order to provide a fast recovery upon exiting stop.
12.4.6 External Reference Clock
The MCG module can support an external reference clock with frequencies between 31.25 kHz to 5 MHz
in FEE and FBE modes, 1 MHz to 16 MHz in PEE and PBE modes, and 0 to 40 MHz in BLPE mode.
When ERCLKEN is set, the external reference clock signal will be presented as MCGERCLK, which can
be used as an additional clock source. When IREFS = 1, the external reference clock will not be used by
the FLL or PLL and will only be used as MCGERCLK. In these modes, the frequency can be equal to the
maximum frequency the chip-level timing specifications will support (see the Device Overview chapter).
If EREFSTEN and ERCLKEN bits are both set or the MCG is in FEE, FBE, PEE, PBE or BLPE mode,
the external reference clock will keep running during stop mode in order to provide a fast recovery upon
exiting stop.
If CME bit is written to 1, the clock monitor is enabled. If the external reference falls below a certain
frequency (floc_high or floc_low depending on the RANGE bit in the MCGC2), the MCU will reset. The
LOC bit in the System Reset Status (SRS) register will be set to indicate the error.
12.4.7 Fixed Frequency Clock
The MCG presents the divided reference clock as MCGFFCLK for use as an additional clock source. The
MCGFFCLK frequency must be no more than 1/4 of the MCGOUT frequency to be valid. Because of this
requirement, the MCGFFCLK is not valid in bypass modes for the following combinations of BDIV and
RDIV values:
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
198 Freescale Semiconductor
• BDIV=00 (divide by 1), RDIV < 010
BDIV=01 (divide by 2), RDIV < 011
12.5 Initialization / Application Information
This section describes how to initialize and configure the MCG module in application. The following
sections include examples on how to initialize the MCG and properly switch between the various available
modes.
12.5.1 MCG Module Initialization Sequence
The MCG comes out of reset configured for FEI mode with the BDIV set for divide-by-2. The internal
reference will stabilize in tirefst microseconds before the FLL can acquire lock. As soon as the internal
reference is stable, the FLL will acquire lock in tfll_lock milliseconds.
Upon POR, the internal reference will require trimming to guarantee an accurate clock. Freescale
recommends using FLASH location 0xFFAE for storing the fine trim bit, FTRIM in the MCGSC register,
and 0xFFAF for storing the 8-bit trim value in the MCGTRM register. The MCU will not automatically
copy the values in these FLASH locations to the respective registers. Therefore, user code must copy these
values from FLASH to the registers.
NOTE
The BDIV value should not be changed to divide-by-1 without first
trimming the internal reference. Failure to do so could result in the MCU
running out of specification.
12.5.1.1 Initializing the MCG
Because the MCG comes out of reset in FEI mode, the only MCG modes which can be directly switched
to upon reset are FEE, FBE, and FBI modes (see Figure 12-8). Reaching any of the other modes requires
first configuring the MCG for one of these three initial modes. Care must be taken to check relevant status
bits in the MCGSC register reflecting all configuration changes within each mode.
To change from FEI mode to FEE or FBE modes, follow this procedure:
1. Enable the external clock source by setting the appropriate bits in MCGC2.
2. Write to MCGC1 to select the clock mode.
— If entering FEE, set RDIV appropriately, clear the IREFS bit to switch to the external reference,
and leave the CLKS bits at %00 so that the output of the FLL is selected as the system clock
source.
— If entering FBE, clear the IREFS bit to switch to the external reference and change the CLKS
bits to %10 so that the external reference clock is selected as the system clock source. The
RDIV bits should also be set appropriately here according to the external reference frequency
because although the FLL is bypassed, it is still on in FBE mode.
— The internal reference can optionally be kept running by setting the IRCLKEN bit. This is
useful if the application will switch back and forth between internal and external modes. For
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 199
minimum power consumption, leave the internal reference disabled while in an external clock
mode.
3. After the proper configuration bits have been set, wait for the affected bits in the MCGSC register
to be changed appropriately, reflecting that the MCG has moved into the proper mode.
— If ERCLKEN was set in step 1 or the MCG is in FEE, FBE, PEE, PBE, or BLPE mode, and
EREFS was also set in step 1, wait here for the OSCINIT bit to become set indicating that the
external clock source has finished its initialization cycles and stabilized. Typical crystal startup
times are given in Appendix A, “Electrical Characteristics”.
— If in FEE mode, check to make sure the IREFST bit is cleared and the LOCK bit is set before
moving on.
— If in FBE mode, check to make sure the IREFST bit is cleared, the LOCK bit is set, and the
CLKST bits have changed to %10 indicating the external reference clock has been
appropriately selected. Although the FLL is bypassed in FBE mode, it is still on and will lock
in FBE mode.
To change from FEI clock mode to FBI clock mode, follow this procedure:
1. Change the CLKS bits to %01 so that the internal reference clock is selected as the system clock
source.
2. Wait for the CLKST bits in the MCGSC register to change to %01, indicating that the internal
reference clock has been appropriately selected.
12.5.2 MCG Mode Switching
When switching between operational modes of the MCG, certain configuration bits must be changed in
order to properly move from one mode to another. Each time any of these bits are changed (PLLS, IREFS,
CLKS, or EREFS), the corresponding bits in the MCGSC register (PLLST, IREFST, CLKST, or
OSCINIT) must be checked before moving on in the application software.
Additionally, care must be taken to ensure that the reference clock divider (RDIV) is set properly for the
mode being switched to. For instance, in PEE mode, if using a 4 MHz crystal, RDIV must be set to %001
(divide-by-2) or %010 (divide -by-4) in order to divide the external reference down to the required
frequency between 1 and 2 MHz.
The RDIV and IREFS bits should always be set properly before changing the PLLS bit so that the FLL or
PLL clock has an appropriate reference clock frequency to switch to.
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
200 Freescale Semiconductor
The table below shows MCGOUT frequency calculations using RDIV, BDIV, and VDIV settings for each
clock mode. The bus frequency is equal to MCGOUT divided by 2.
1R is the reference divider selected by the RDIV bits, B is the bus frequency divider selected by the BDIV bits,
and M is the multiplier selected by the VDIV bits.
This section will include 3 mode switching examples using a 4 MHz external crystal. If using an external
clock source less than 1 MHz, the MCG should not be configured for any of the PLL modes (PEE and
PBE).
12.5.2.1 Example # 1: Moving from FEI to PEE Mode: External Crystal = 4 MHz,
Bus Frequency = 8 MHz
In this example, the MCG will move through the proper operational modes from FEI to PEE mode until
the 4 MHz crystal reference frequency is set to achieve a bus frequency of 8 MHz. Because the MCG is in
FEI mode out of reset, this example also shows how to initialize the MCG for PEE mode out of reset. First,
the code sequence will be described. Then a flowchart will be included which illustrates the sequence.
1. First, FEI must transition to FBE mode:
a) MCGC2 = 0x36 (%00110110)
– BDIV (bits 7 and 6) set to %00, or divide-by-1
– RANGE (bit 5) set to 1 because the frequency of 4 MHz is within the high frequency range
– HGO (bit 4) set to 1 to configure external oscillator for high gain operation
– EREFS (bit 2) set to 1, because a crystal is being used
– ERCLKEN (bit 1) set to 1 to ensure the external reference clock is active
b) Loop until OSCINIT (bit 1) in MCGSC is 1, indicating the crystal selected by the EREFS bit
has been initialized.
Table 12-6. MCGOUT Frequency Calculation Options
Clock Mode fMCGOUT1Note
FEI (FLL engaged internal) (fint * 1024) / B Typical fMCGOUT = 16 MHz
immediately after reset. RDIV
bits set to %000.
FEE (FLL engaged external) (fext / R *1024) / B fext / R must be in the range of
31.25 kHz to 39.0625 kHz
FBE (FLL bypassed external) fext / B fext / R must be in the range of
31.25 kHz to 39.0625 kHz
FBI (FLL bypassed internal) fint / B Typical fint = 32 kHz
PEE (PLL engaged external) [(fext / R) * M] / B fext / R must be in the range of 1
MHz to 2 MHz
PBE (PLL bypassed external) fext / B fext / R must be in the range of 1
MHz to 2 MHz
BLPI (Bypassed low power internal) fint / B
BLPE (Bypassed low power external) fext / B
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 201
c) MCGC1 = 0xB8 (%10111000)
– CLKS (bits 7 and 6) set to %10 in order to select external reference clock as system clock
source
– RDIV (bits 5-3) set to %111, or divide-by-128 because 4 MHz / 128 = 31.25 kHz which is
in the 31.25 kHz to 39.0625 kHz range required by the FLL
– IREFS (bit 2) cleared to 0, selecting the external reference clock
d) Loop until IREFST (bit 4) in MCGSC is 0, indicating the external reference is the current
source for the reference clock
e) Loop until CLKST (bits 3 and 2) in MCGSC are %10, indicating that the external reference
clock is selected to feed MCGOUT
2. Then, FBE must transition either directly to PBE mode or first through BLPE mode and then to
PBE mode:
a) BLPE: If a transition through BLPE mode is desired, first set LP (bit 3) in MCGC2 to 1.
b) BLPE/PBE: MCGC1 = 0x90 (%10010000)
– RDIV (bits 5-3) set to %010, or divide-by-4 because 4 MHz / 4 = 1 MHz which is in the 1
MHz to 2 MHz range required by the PLL. In BLPE mode, the configuration of the RDIV
does not matter because both the FLL and PLL are disabled. Changing them only sets up the
the dividers for PLL usage in PBE mode
c) BLPE/PBE: MCGC3 = 0x44 (%01000100)
– PLLS (bit 6) set to 1, selects the PLL. In BLPE mode, changing this bit only prepares the
MCG for PLL usage in PBE mode
– VDIV (bits 3-0) set to %0100, or multiply-by-16 because 1 MHz reference * 16 = 16 MHz.
In BLPE mode, the configuration of the VDIV bits does not matter because the PLL is
disabled. Changing them only sets up the multiply value for PLL usage in PBE mode
d) BLPE: If transitioning through BLPE mode, clear LP (bit 3) in MCGC2 to 0 here to switch to
PBE mode
e) PBE: Loop until PLLST (bit 5) in MCGSC is set, indicating that the current source for the
PLLS clock is the PLL
f) PBE: Then loop until LOCK (bit 6) in MCGSC is set, indicating that the PLL has acquired lock
3. Last, PBE mode transitions into PEE mode:
a) MCGC1 = 0x10 (%00010000)
– CLKS (bits7 and 6) in MCGSC1 set to %00 in order to select the output of the PLL as the
system clock source
– Loop until CLKST (bits 3 and 2) in MCGSC are %11, indicating that the PLL output is
selected to feed MCGOUT in the current clock mode
b) Now, With an RDIV of divide-by-4, a BDIV of divide-by-1, and a VDIV of multiply-by-16,
MCGOUT = [(4 MHz / 4) * 16] / 1 = 16 MHz, and the bus frequency is MCGOUT / 2, or 8 MHz
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
202 Freescale Semiconductor
Figure 12-9. Flowchart of FEI to PEE Mode Transition using a 4 MHz Crystal
MCGC2 = $36
CHECK
OSCINIT = 1 ?
MCGC1 = $B8
CHECK
IREFST = 0?
CHECK
CLKST = %10?
ENTER
BLPE MODE ?
MCGC2 = $3E
(LP = 1)
MCGC1 = $90
MCGC3 = $44
IN
BLPE MODE ?
(LP=1)
MCGC2 = $36
(LP = 0)
CHECK
PLLST = 1?
MCGC1 = $10
CHECK
LOCK = 1?
CHECK
CLKST = %11?
CONTINUE
IN PEE MODE
START
IN FEI MODE
YES
YES
YES
YES
YES
YES
YES
YES
NO
NO
NO
NO
NO
NO
NO
NO
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 203
12.5.2.2 Example # 2: Moving from PEE to BLPI Mode: External Crystal = 4 MHz,
Bus Frequency =16 kHz
In this example, the MCG will move through the proper operational modes from PEE mode with a 4 MHz
crystal configured for an 8 MHz bus frequency (see previous example) to BLPI mode with a 16 kHz bus
frequency.First, the code sequence will be described. Then a flowchart will be included which illustrates
the sequence.
1. First, PEE must transition to PBE mode:
a) MCGC1 = 0x90 (%10010000)
– CLKS (bits 7 and 6) set to %10 in order to switch the system clock source to the external
reference clock
b) Loop until CLKST (bits 3 and 2) in MCGSC are %10, indicating that the external reference
clock is selected to feed MCGOUT
2. Then, PBE must transition either directly to FBE mode or first through BLPE mode and then to
FBE mode:
a) BLPE: If a transition through BLPE mode is desired, first set LP (bit 3) in MCGC2 to 1
b) BLPE/FBE: MCGC1 = 0xB8 (%10111000)
– RDIV (bits 5-3) set to %111, or divide-by-128 because 4 MHz / 128 = 31.25 kHz which is
in the 31.25 kHz to 39.0625 kHz range required by the FLL. In BLPE mode, the
configuration of the RDIV does not matter because both the FLL and PLL are disabled.
Changing them only sets up the dividers for FLL usage in FBE mode
c) BLPE/FBE: MCGC3 = 0x04 (%00000100)
– PLLS (bit 6) clear to 0 to select the FLL. In BLPE mode, changing this bit only prepares the
MCG for FLL usage in FBE mode. With PLLS = 0, the VDIV value does not matter.
d) BLPE: If transitioning through BLPE mode, clear LP (bit 3) in MCGC2 to 0 here to switch to
FBE mode
e) FBE: Loop until PLLST (bit 5) in MCGSC is clear, indicating that the current source for the
PLLS clock is the FLL
f) FBE: Optionally, loop until LOCK (bit 6) in the MCGSC is set, indicating that the FLL has
acquired lock. Although the FLL is bypassed in FBE mode, it is still enabled and running.
3. Next, FBE mode transitions into FBI mode:
a) MCGC1 = 0x44 (%01000100)
– CLKS (bits7 and 6) in MCGSC1 set to %01 in order to switch the system clock to the
internal reference clock
– IREFS (bit 2) set to 1 to select the internal reference clock as the reference clock source
– RDIV (bits 5-3) set to %000, or divide-by-1 because the trimmed internal reference should
be within the 31.25 kHz to 39.0625 kHz range required by the FLL
b) Loop until IREFST (bit 4) in MCGSC is 1, indicating the internal reference clock has been
selected as the reference clock source
c) Loop until CLKST (bits 3 and 2) in MCGSC are %01, indicating that the internal reference
clock is selected to feed MCGOUT
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
204 Freescale Semiconductor
4. Lastly, FBI transitions into FBILP mode.
a) MCGC2 = 0x08 (%00001000)
– LP (bit 3) in MCGSC is 1
Figure 12-10. Flowchart of PEE to BLPI Mode Transition using a 4 MHz Crystal
MCGC1 = $90
CHECK
CLKST = %10 ?
MCGC2 = $3E
MCGC1 = $44
CHECK
IREFST = 0?
CHECK
CLKST = %01?
CONTINUE
IN BLPI MODE
START
IN PEE MODE
MCGC1 = $B8
MCGC3 = $04
ENTER
BLPE MODE ?
IN
BLPE MODE ?
(LP=1)
MCGC2 = $36
(LP = 0)
CHECK
PLLST = 0?
OPTIONAL:
= 1?
MCGC2 = $08
YES
YES
YES
YES
YES
YES
YES
NO
NO
NO
NO
NO
NO
NO
CHECK LOCK
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 205
12.5.2.3 Example #3: Moving from BLPI to FEE Mode: External Crystal = 4 MHz,
Bus Frequency = 16 MHz
In this example, the MCG will move through the proper operational modes from BLPI mode at a 16 kHz
bus frequency running off of the internal reference clock (see previous example) to FEE mode using a 4
MHz crystal configured for a 16 MHz bus frequency. First, the code sequence will be described. Then a
flowchart will be included which illustrates the sequence.
1. First, BLPI must transition to FBI mode.
a) MCGC2 = 0x00 (%00000000)
– LP (bit 3) in MCGSC is 0
b) Optionally, loop until LOCK (bit 6) in the MCGSC is set, indicating that the FLL has acquired
lock. Although the FLL is bypassed in FBI mode, it is still enabled and running.
2. Next, FBI will transition to FEE mode.
a) MCGC2 = 0x36 (%00110110)
– RANGE (bit 5) set to 1 because the frequency of 4 MHz is within the high frequency range
– HGO (bit 4) set to 1 to configure external oscillator for high gain operation
– EREFS (bit 2) set to 1, because a crystal is being used
– ERCLKEN (bit 1) set to 1 to ensure the external reference clock is active
b) Loop until OSCINIT (bit 1) in MCGSC is 1, indicating the crystal selected by the EREFS bit
has been initialized.
c) MCGC1 = 0x38 (%00111000)
– CLKS (bits 7 and 6) set to %00 in order to select the output of the FLL as system clock
source
– RDIV (bits 5-3) set to %111, or divide-by-128 because 4 MHz / 128 = 31.25 kHz which is
in the 31.25 kHz to 39.0625 kHz range required by the FLL
– IREFS (bit 1) cleared to 0, selecting the external reference clock
d) Loop until IREFST (bit 4) in MCGSC is 0, indicating the external reference clock is the current
source for the reference clock
e) Optionally, loop until LOCK (bit 6) in the MCGSC is set, indicating that the FLL has
reacquired lock.
f) Loop until CLKST (bits 3 and 2) in MCGSC are %00, indicating that the output of the FLL is
selected to feed MCGOUT
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
206 Freescale Semiconductor
Figure 12-11. Flowchart of BLPI to FEE Mode Transition using a 4 MHz Crystal
12.5.2.4 Example # 4: Moving from FEI to PEE Mode: External Crystal = 8 MHz,
Bus Frequency = 8 MHz
In this example, the MCG will move through the proper operational modes from FEI to PEE mode until
the 8 MHz crystal reference frequency is set to achieve a bus frequency of 8 MHz.
This example is similar to example number one except that in this case the frequency of the external crystal
is 8 MHz instead of 4 MHz. Special consideration must be taken with this case since there is a period of
time along the way from FEI mode to PEE mode where the FLL operates based on a reference clock with
a frequency that is greater than the maximum allowed for the FLL. This occurs because with an 8 MHz
MCGC2 = $36
CHECK
OSCINIT = 1 ?
MCGC1 = $38
CHECK
IREFST = 0?
CHECK
CLKST = %00?
CONTINUE
IN FEE MODE
START
IN BLPI MODE
YES
YES
NO
NO
NO
MCGC2 = $00
OPTIONAL:
CHECK LOCK
= 1?
YES
NO
YES
OPTIONAL:
CHECK LOCK
= 1?
YES
NO
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 207
external crystal and a maximum reference divider factor of 128, the resulting frequency of the reference
clock for the FLL is 62.5 kHz (greater than the 39.0625 kHz maximum allowed).
Care must be taken in the software to minimize the amount of time spent in this state where the FLL is
operating in this condition.
The following code sequence describes how to move from FEI mode to PEE mode until the 8 MHz crystal
reference frequency is set to achieve a bus frequency of 8 MHz. Because the MCG is in FEI mode out of
reset, this example also shows how to initialize the MCG for PEE mode out of reset. First, the code
sequence will be described. Then a flowchart will be included which illustrates the sequence.
1. First, FEI must transition to FBE mode:
a) MCGC2 = 0x36 (%00110110)
– BDIV (bits 7 and 6) set to %00, or divide-by-1
– RANGE (bit 5) set to 1 because the frequency of 8 MHz is within the high frequency range
– HGO (bit 4) set to 1 to configure external oscillator for high gain operation
– EREFS (bit 2) set to 1, because a crystal is being used
– ERCLKEN (bit 1) set to 1 to ensure the external reference clock is active
b) Loop until OSCINIT (bit 1) in MCGSC is 1, indicating the crystal selected by the EREFS bit
has been initialized.
c) Block Interrupts (If applicable by setting the interrupt bit in the CCR).
d) MCGC1 = 0xB8 (%10111000)
– CLKS (bits 7 and 6) set to %10 in order to select external reference clock as system clock
source
– RDIV (bits 5-3) set to %111, or divide-by-128.
NOTE
8 MHz / 128 = 62.5 kHz which is greater than the 31.25 kHz to 39.0625 kHz
range required by the FLL. Therefore after the transition to FBE is
complete, software must progress through to BLPE mode immediately by
setting the LP bit in MCGC2.
– IREFS (bit 2) cleared to 0, selecting the external reference clock
e) Loop until IREFST (bit 4) in MCGSC is 0, indicating the external reference is the current
source for the reference clock
f) Loop until CLKST (bits 3 and 2) in MCGSC are %10, indicating that the external reference
clock is selected to feed MCGOUT
2. Then, FBE mode transitions into BLPE mode:
a) MCGC2 = 0x3E (%00111110)
– LP (bit 3) in MCGC2 to 1 (BLPE mode entered)
NOTE
There must be no extra steps (including interrupts) between steps 1d and 2a.
b) Enable Interrupts (if applicable by clearing the interrupt bit in the CCR).
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
208 Freescale Semiconductor
c) MCGC1 = 0x98 (%10011000)
– RDIV (bits 5-3) set to %011, or divide-by-8 because 8 MHz / 8= 1 MHz which is in the 1
MHz to 2 MHz range required by the PLL. In BLPE mode, the configuration of the RDIV
does not matter because both the FLL and PLL are disabled. Changing them only sets up the
the dividers for PLL usage in PBE mode
d) MCGC3 = 0x44 (%01000100)
– PLLS (bit 6) set to 1, selects the PLL. In BLPE mode, changing this bit only prepares the
MCG for PLL usage in PBE mode
– VDIV (bits 3-0) set to %0100, or multiply-by-16 because 1 MHz reference * 16 = 16 MHz.
In BLPE mode, the configuration of the VDIV bits does not matter because the PLL is
disabled. Changing them only sets up the multiply value for PLL usage in PBE mode
e) Loop until PLLST (bit 5) in MCGSC is set, indicating that the current source for the PLLS
clock is the PLL
3. Then, BLPE mode transitions into PBE mode:
a) Clear LP (bit 3) in MCGC2 to 0 here to switch to PBE mode
b) Then loop until LOCK (bit 6) in MCGSC is set, indicating that the PLL has acquired lock
4. Last, PBE mode transitions into PEE mode:
a) MCGC1 = 0x18 (%00011000)
– CLKS (bits7 and 6) in MCGSC1 set to %00 in order to select the output of the PLL as the
system clock source
– Loop until CLKST (bits 3 and 2) in MCGSC are %11, indicating that the PLL output is
selected to feed MCGOUT in the current clock mode
b) Now, With an RDIV of divide-by-8, a BDIV of divide-by-1, and a VDIV of multiply-by-16,
MCGOUT = [(8 MHz / 8) * 16] / 1 = 16 MHz, and the bus frequency is MCGOUT / 2, or 8 MHz
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 209
Figure 12-12. Flowchart of FEI to PEE Mode Transition using a 8 MHz Crystal
MCGC2 = $36
CHECK
OSCINIT = 1 ?
MCGC1 = $B8
CHECK
IREFST = 0?
CHECK
CLKST = %10?
MCGC2 = $3E
(LP = 1)
MCGC1 = $98
MCGC3 = $44
MCGC2 = $36
(LP = 0)
CHECK
PLLST = 1?
MCGC1 = $18
CHECK
LOCK = 1?
CHECK
CLKST = %11?
CONTINUE
IN PEE MODE
START
IN FEI MODE
YES
YES
YES
YES
YES
YES
NO
NO
NO
NO
NO
NO
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
210 Freescale Semiconductor
12.5.3 Calibrating the Internal Reference Clock (IRC)
The IRC is calibrated by writing to the MCGTRM register first, then using the FTRIM bit to “fine tune”
the frequency. We will refer to this total 9-bit value as the trim value, ranging from 0x000 to 0x1FF, where
the FTRIM bit is the LSB.
The trim value after a POR is always 0x100 (MCGTRM = 0x80 and FTRIM = 0). Writing a larger value
will decrease the frequency and smaller values will increase the frequency. The trim value is linear with
the period, except that slight variations in wafer fab processing produce slight non-linearities between trim
value and period. These non-linearities are why an iterative trimming approach to search for the best trim
value is recommended. In example #4 later in this section, this approach will be demonstrated.
After a trim value has been found for a device, this value can be stored in FLASH memory to save the
value. If power is removed from the device, the IRC can easily be re-trimmed by copying the saved value
from FLASH to the MCG registers. Freescale identifies recommended FLASH locations for storing the
trim value for each MCU. Consult the memory map in the data sheet for these locations. On devices that
are factory trimmed, the factory trim value will be stored in these locations.
12.5.3.1 Example #5: Internal Reference Clock Trim
For applications that require a tight frequency tolerance, a trimming procedure is provided that will allow
a very accurate internal clock source. This section outlines one example of trimming the internal oscillator.
Many other possible trimming procedures are valid and can be used.
In the example below, the MCG trim will be calibrated for the 9-bit MCGTRM and FTRIM collective
value. This value will be referred to as TRMVAL.
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 211
Figure 12-13. Trim Procedure
In this particular case, the MCU has been attached to a PCB and the entire assembly is undergoing final
test with automated test equipment. A separate signal or message is provided to the MCU operating under
user provided software control. The MCU initiates a trim procedure as outlined in Figure 12-13 while the
tester supplies a precision reference signal.
If the intended bus frequency is near the maximum allowed for the device, it is recommended to trim using
a reference divider value (RDIV setting) of twice the final value. After the trim procedure is complete, the
reference divider can be restored. This will prevent accidental overshoot of the maximum clock frequency.
Initial conditions:
1) Clock supplied from ATE has 500 μs duty period
2) MCG configured for internal reference with 8MHz bus
START TRIM PROCEDURE
CONTINUE
CASE STATEMENT
COUNT > EXPECTED = 500
.
MEASURE
INCOMING CLOCK WIDTH
TRMVAL = $100
COUNT < EXPECTED = 500
COUNT = EXPECTED = 500
TRMVAL =
TRMVAL =
TRMVAL - 256/ (2**n) TRMVAL + 256/ (2**n)
n = n + 1
(COUNT = # OF BUS CLOCKS / 8)
(DECREASING TRMVAL
INCREASES THE FREQUENCY)
(INCREASING TRMVAL
DECREASES THE FREQUENCY)
NO
YES
IS n > 9?
(RUNNING TOO SLOW)
(RUNNING TOO FAST)
n=1
STORE MCGTRM AND
FTRIM VALUES IN
NON-VOLATILE MEMORY
Multi-Purpose Clock Generator (S08MCGV1)
MC9S08JM60 Series Data Sheet, Rev. 3
212 Freescale Semiconductor
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 213
Chapter 13
Real-Time Counter (S08RTCV1)
13.1 Introduction
The real-time counter (RTC) consists of one 8-bit counter, one 8-bit comparator, several binary-based and
decimal-based prescaler dividers, two clock sources, and one programmable periodic interrupt. This
module can be used for time-of-day, calendar or any task scheduling functions. It can also serve as a cyclic
wake up from low power modes without the need of external components.
Chapter 13 Real-Time Counter (S08RTCV1)
MC9S08JM60 Series Data Sheet, Rev. 3
214 Freescale Semiconductor
Figure 13-1. MC9S08JM60 Series Block Diagram Highlighting RTC Block
PTD4/ADP11
PTD5
PTD6
PTC1/SDA
PTC0/SCL
VSS
VDD
PTE3/TPM1CH1
PTE2/TPM1CH0
PTA5– PTA0
PTE0/TxD1
PTE1/RxD1
PTD1/ADP9/ACMP–
PTD0/ADP8/ACMP+
PTC6
PTC5/RxD2
PTC4
PTC3/TxD2
PTC2
PORT A
PORT C
PORT D
PORT E
8-BIT KEYBOARD
INTERRUPT MODULE (KBI)
IIC MODULE (IIC)
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
USER Flash (IN BYTES)
USER RAM (IN BYTES)
ON-CHIP ICE AND
DEBUG MODULE (DBG)
MC9S08JM60 = 60,912
HCS08 CORE
CPUBDC
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pull-down device if IRQ is enabled
(IRQPE = 1). Pull-down is enabled if rising edge detect is selected (IRQEDG = 1)
3. IRQ does not have a clamp diode to VDD. IRQ must not be driven above VDD.
4. Pin contains integrated pullup device.
5. When pin functions as KBI (KBIPEn = 1) and associated pin is configured to enable the
pullup device, KBEDGn can be used to reconfigure the pullup as a pull-down device.
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTB5/KBIP5/ADP5
PORT B
PTE5/MOSI1
PTE4/MISO1
PTE6/SPSCK1
PTE7/SS1
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
VOLTAGE
REGULATOR
COP IRQ LVD
LOW-POWER OSCILLATOR
MULTI-PURPOSE CLOCK
GENERATOR (MCG)
RESET
VSSAD
VDDAD
VREFH
ANALOG-TO-DIGITAL
CONVERTER (ADC)
6-CHANNEL TIMER/PWM
MODULE (TPM1)
PTD7
6
PTB4/KBIP4/ADP4
PTG3/KBIP7
PTG2/KBIP6
PORT G
12-CHANNEL, 12-BIT
BKGD/MS
PTF3/TPM1CH5
PTF2/TPM1CH4
PTF0/TPM1CH2
PTF1/TPM1CH3
PORT F
PTF5/TPM2CH1
PTF4/TPM2CH0
PTF6
PTF7
INTERFACE MODULE (SCI1)
SERIAL COMMUNICATIONS
INTERFACE MODULE (SCI2)
SERIAL COMMUNICATIONS
PTG0/KBIP0
PTG1/KBIP1
MC9S08JM32 = 32,768
VREFL
PTG4/XTAL
PTG5/EXTAL
IRQ/TPMCLK RxD2
TxD2
SDA
SCL
8
KBIPx
KBIPx
TPMCLK
SPSCK1
SS1
MISO1
MOSI1
TPMCLK
TPM1CH1
TPM1CH0
RxD1
TxD1
EXTAL
XTAL
4
4
USB SIE
USB ENDPOINT
RAM
FULL SPEED
USB
TRANSCEIVER
USBDP
USBDN
MISO2
SS2
SPSCK2
MOSI2 PTB1/MOSI2/ADP1
PTB0/MISO2/ADP0
PTB7/ADP7
PTB6/ADP6
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI2)
REAL-TIME COUNTER
(RTC)
PTB3/SS2/ADP3
PTB2/SPSCK2/ADP2
TPM1CHx
4
TPM2CH1
TPM2CH0
4
ANALOG COMPARATOR
(ACMP)
SYSTEM
USB 3.3-V VOLTAGE REGULATOR
VUSB33
MC9S08JM60 = 4096
MC9S08JM32 = 2048
ACMPO
ACMP+
ACMP–
PTD3/KBIP3/ADP10
PTD2/KBIP2/ACMPO
V
SSOSC
Real-Time Counter (S08RTCV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 215
13.1.1 Features
Features of the RTC module include:
• 8-bit up-counter
— 8-bit modulo match limit
— Software controllable periodic interrupt on match
• Three software selectable clock sources for input to prescaler with selectable binary-based and
decimal-based divider values
— 1 kHz internal low-power oscillator (LPO)
— External clock (ERCLK)
— 32 kHz internal clock (IRCLK)
13.1.2 Modes of Operation
This section defines the operation in stop, wait and background debug modes.
13.1.2.1 Wait Mode
The RTC continues to run in wait mode if enabled before executing the appropriate instruction. Therefore,
the RTC can bring the MCU out of wait mode if the real-time interrupt is enabled. For lowest possible
current consumption, the RTC should be stopped by software if not needed as an interrupt source during
wait mode.
13.1.2.2 Stop Modes
The RTC continues to run in stop2 or stop3 mode if the RTC is enabled before executing the STOP
instruction. Therefore, the RTC can bring the MCU out of stop modes with no external components, if the
real-time interrupt is enabled.
The LPO clock can be used in stop2 and stop3 modes. ERCLK and IRCLK clocks are only available in
stop3 mode.
Power consumption is lower when all clock sources are disabled, but in that case, the real-time interrupt
cannot wake up the MCU from stop modes.
13.1.2.3 Active Background Mode
The RTC suspends all counting during active background mode until the microcontroller returns to normal
user operating mode. Counting resumes from the suspended value as long as the RTCMOD register is not
written and the RTCPS and RTCLKS bits are not altered.
Real-Time Counter (S08RTCV1)
MC9S08JM60 Series Data Sheet, Rev. 3
216 Freescale Semiconductor
13.1.3 Block Diagram
The block diagram for the RTC module is shown in Figure 13-2.
Figure 13-2. Real-Time Counter (RTC) Block Diagram
13.2 External Signal Description
The RTC does not include any off-chip signals.
13.3 Register Definition
The RTC includes a status and control register, an 8-bit counter register, and an 8-bit modulo register.
Refer to the direct-page register summary in the memory section of this document for the absolute address
assignments for all RTC registers.This section refers to registers and control bits only by their names and
relative address offsets.
Table 13-1 is a summary of RTC registers.
Table 13-1. RTC Register Summary
Name 7 6 5 4 3210
RTCSC
R
RTIF RTCLKS RTIE RTCPS
W
RTCCNT
R RTCCNT
W
RTCMOD
R
RTCMOD
W
Clock
Source
Select
Prescaler
Divide-By
8-Bit Counter
(RTCCNT)
8-Bit Modulo
(RTCMOD)
8-Bit Comparator
RTIF
RTIE
Background
VDD
RTC
Interrupt
Request
DQ
R
E
LPO
RTC
Clock
Mode
ERCLK
IRCLK
RTCLKS
Write 1 to
RTIF
RTCPS
RTCLKS[0]
Real-Time Counter (S08RTCV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 217
13.3.1 RTC Status and Control Register (RTCSC)
RTCSC contains the real-time interrupt status flag (RTIF), the clock select bits (RTCLKS), the real-time
interrupt enable bit (RTIE), and the prescaler select bits (RTCPS).
7 6543210
R
RTIF RTCLKS RTIE RTCPS
W
Reset: 0 0 0 0 0 0 0 0
Figure 13-3. RTC Status and Control Register (RTCSC)
Table 13-2. RTCSC Field Descriptions
Field Description
7
RTIF
Real-Time Interrupt Flag This status bit indicates the RTC counter register reached the value in the RTC modulo
register. Writing a logic 0 has no effect. Writing a logic 1 clears the bit and the real-time interrupt request. Reset
clears RTIF.
0 RTC counter has not reached the value in the RTC modulo register.
1 RTC counter has reached the value in the RTC modulo register.
6–5
RTCLKS
Real-Time Clock Source Select. These two read/write bits select the clock source input to the RTC prescaler.
Changing the clock source clears the prescaler and RTCCNT counters. When selecting a clock source, ensure
that the clock source is properly enabled (if applicable) to ensure correct operation of the RTC. Reset clears
RTCLKS.
00 Real-time clock source is the 1-kHz low power oscillator (LPO)
01 Real-time clock source is the external clock (ERCLK)
1x Real-time clock source is the internal clock (IRCLK)
4
RTIE
Real-Time Interrupt Enable. This read/write bit enables real-time interrupts. If RTIE is set, then an interrupt is
generated when RTIF is set. Reset clears RTIE.
0 Real-time interrupt requests are disabled. Use software polling.
1 Real-time interrupt requests are enabled.
3–0
RTCPS
Real-Time Clock Prescaler Select. These four read/write bits select binary-based or decimal-based divide-by
values for the clock source. See Table 13-3. Changing the prescaler value clears the prescaler and RTCCNT
counters. Reset clears RTCPS.
Table 13-3. RTC Prescaler Divide-by values
RTCLKS[0]
RTCPS
0 1 2 3 4 5 6 7 8 9 101112 13 14 15
0Off 232526272829210 122
210 241025x102103
1Off 210 211 212 213 214 215 216 1032x1035x1031042x1045x1041052x105
Real-Time Counter (S08RTCV1)
MC9S08JM60 Series Data Sheet, Rev. 3
218 Freescale Semiconductor
13.3.2 RTC Counter Register (RTCCNT)
RTCCNT is the read-only value of the current RTC count of the 8-bit counter.
13.3.3 RTC Modulo Register (RTCMOD)
13.4 Functional Description
The RTC is composed of a main 8-bit up-counter with an 8-bit modulo register, a clock source selector,
and a prescaler block with binary-based and decimal-based selectable values. The module also contains
software selectable interrupt logic.
After any MCU reset, the counter is stopped and reset to 0x00, the modulus register is set to 0x00, and the
prescaler is off. The 1-kHz internal oscillator clock is selected as the default clock source. To start the
prescaler, write any value other than zero to the prescaler select bits (RTCPS).
Three clock sources are software selectable: the low power oscillator clock (LPO), the external clock
(ERCLK), and the internal clock (IRCLK). The RTC clock select bits (RTCLKS) select the desired clock
source. If a different value is written to RTCLKS, the prescaler and RTCCNT counters are reset to 0x00.
7 6543210
RRTCCNT
W
Reset: 0 0 0 0 0 0 0 0
Figure 13-4. RTC Counter Register (RTCCNT)
Table 13-4. RTCCNT Field Descriptions
Field Description
7:0
RTCCNT
RTC Count. These eight read-only bits contain the current value of the 8-bit counter. Writes have no effect to this
register. Reset, writing to RTCMOD, or writing different values to RTCLKS and RTCPS clear the count to 0x00.
7 6543210
R
RTCMOD
W
Reset: 0 0 0 0 0 0 0 0
Figure 13-5. RTC Modulo Register (RTCMOD)
Table 13-5. RTCMOD Field Descriptions
Field Description
7:0
RTCMOD
RTC Modulo. These eight read/write bits contain the modulo value used to reset the count to 0x00 upon a compare
match and set the RTIF status bit. A value of 0x00 sets the RTIF bit on each rising edge of the prescaler output.
Writing to RTCMOD resets the prescaler and the RTCCNT counters to 0x00. Reset sets the modulo to 0x00.
Real-Time Counter (S08RTCV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 219
RTCPS and the RTCLKS[0] bit select the desired divide-by value. If a different value is written to RTCPS,
the prescaler and RTCCNT counters are reset to 0x00. Table 13-6 shows different prescaler period values.
The RTC modulo register (RTCMOD) allows the compare value to be set to any value from 0x00 to 0xFF.
When the counter is active, the counter increments at the selected rate until the count matches the modulo
value. When these values match, the counter resets to 0x00 and continues counting. The real-time interrupt
flag (RTIF) is set when a match occurs. The flag sets on the transition from the modulo value to 0x00.
Writing to RTCMOD resets the prescaler and the RTCCNT counters to 0x00.
The RTC allows for an interrupt to be generated when RTIF is set. To enable the real-time interrupt, set
the real-time interrupt enable bit (RTIE) in RTCSC. RTIF is cleared by writing a 1 to RTIF.
13.4.1 RTC Operation Example
This section shows an example of the RTC operation as the counter reaches a matching value from the
modulo register.
Table 13-6. Prescaler Period
RTCPS 1-kHz Internal Clock
(RTCLKS = 00)
1-MHz External Clock
(RTCLKS = 01)
32-kHz Internal Clock
(RTCLKS = 10)
32-kHz Internal Clock
(RTCLKS = 11)
0000 Off Off Off Off
0001 8 ms 1.024 ms 250 μs32 ms
0010 32 ms 2.048 ms 1 ms 64 ms
0011 64 ms 4.096 ms 2 ms 128 ms
0100 128 ms 8.192 ms 4 ms 256 ms
0101 256 ms 16.4 ms 8 ms 512 ms
0110 512 ms 32.8 ms 16 ms 1.024 s
0111 1.024 s 65.5 ms 32 ms 2.048 s
1000 1 ms 1 ms 31.25 μs 31.25 ms
1001 2 ms 2 ms 62.5 μs62.5 ms
1010 4 ms 5 ms 125 μs 156.25 ms
1011 10 ms 10 ms 312.5 μs 312.5 ms
1100 16 ms 20 ms 0.5 ms 0.625 s
1101 0.1 s 50 ms 3.125 ms 1.5625 s
1110 0.5 s 0.1 s 15.625 ms 3.125 s
1111 1 s 0.2 s 31.25 ms 6.25 s
Real-Time Counter (S08RTCV1)
MC9S08JM60 Series Data Sheet, Rev. 3
220 Freescale Semiconductor
Figure 13-6. RTC Counter Overflow Example
In the example of Figure 13-6, the selected clock source is the 1-kHz internal oscillator clock source. The
prescaler (RTCPS) is set to 0xA or divide-by-4. The modulo value in the RTCMOD register is set to 0x55.
When the counter, RTCCNT, reaches the modulo value of 0x55, the counter overflows to 0x00 and
continues counting. The real-time interrupt flag, RTIF, sets when the counter value changes from 0x55 to
0x00. A real-time interrupt is generated when RTIF is set, if RTIE is set.
13.5 Initialization/Application Information
This section provides example code to give some basic direction to a user on how to initialize and
configure the RTC module. The example software is implemented in C language.
The example below shows how to implement time of day with the RTC using the 1-kHz clock source to
achieve the lowest possible power consumption. Because the 1-kHz clock source is not as accurate as a
crystal, software can be added for any adjustments. For accuracy without adjustments at the expense of
additional power consumption, the external clock (ERCLK) or the internal clock (IRCLK) can be selected
with appropriate prescaler and modulo values.
/* Initialize the elapsed time counters */
Seconds = 0;
Minutes = 0;
Hours = 0;
Days=0;
/* Configure RTC to interrupt every 1 second from 1-kHz clock source */
RTCMOD.byte = 0x00;
RTCSC.byte = 0x1F;
/**********************************************************************
Function Name : RTC_ISR
Notes : Interrupt service routine for RTC module.
**********************************************************************/
#pragma TRAP_PROC
void RTC_ISR(void)
{
/* Clear the interrupt flag */
0x55
0x550x540x530x52 0x00 0x01
RTCMOD
RTIF
RTCCNT
RTC Clock
(RTCPS = 0xA)
Internal 1-kHz
Clock Source
Real-Time Counter (S08RTCV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 221
RTCSC.byte = RTCSC.byte | 0x80;
/* RTC interrupts every 1 Second */
Seconds++;
/* 60 seconds in a minute */
if (Seconds > 59){
Minutes++;
Seconds = 0;
}
/* 60 minutes in an hour */
if (Minutes > 59){
Hours++;
Minutes = 0;
}
/* 24 hours in a day */
if (Hours > 23){
Days ++;
Hours = 0;
}
Real-Time Counter (S08RTCV1)
MC9S08JM60 Series Data Sheet, Rev. 3
222 Freescale Semiconductor
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 223
Chapter 14
Serial Communications Interface (S08SCIV4)
14.1 Introduction
The MC9S08JM60 series include two independent serial communications interface (SCI) modules which
are sometimes called universal asynchronous receiver/transmitters (UARTs). Typically, these systems are
used to connect to the RS232 serial input/output (I/O) port of a personal computer or workstation, but they
can also be used to communicate with other embedded controllers.
A flexible, 13-bit, modulo-based baud rate generator supports a broad range of standard baud rates beyond
115.2 kbaud. Transmit and receive within the same SCI use a common baud rate, and each SCI module
has a separate baud rate generator.
This SCI system offers many advanced features not commonly found on other asynchronous serial I/O
peripherals on other embedded controllers. The receiver employs an advanced data sampling technique
that ensures reliable communication and noise detection. Hardware parity, receiver wakeup, and double
buffering on transmit and receive are also included.
NOTE
MC9S08JM60 series devices operate at a higher voltage range (2.7 V to
5.5 V) and do not include stop1 mode. Therefore, please disregard
references to stop1.
Chapter 14 Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
224 Freescale Semiconductor
Figure 14-1. MC9S08JM60 Series Block Diagram Highlighting the SCI Blocks and Pins
PTD4/ADP11
PTD5
PTD6
PTC1/SDA
PTC0/SCL
VSS
VDD
PTE3/TPM1CH1
PTE2/TPM1CH0
PTA5– PTA0
PTE0/TxD1
PTE1/RxD1
PTD1/ADP9/ACMP–
PTD0/ADP8/ACMP+
PTC6
PTC5/RxD2
PTC4
PTC3/TxD2
PTC2
PORT A
PORT C
PORT D
PORT E
8-BIT KEYBOARD
INTERRUPT MODULE (KBI)
IIC MODULE (IIC)
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
USER Flash (IN BYTES)
USER RAM (IN BYTES)
ON-CHIP ICE AND
DEBUG MODULE (DBG)
MC9S08JM60 = 60,912
HCS08 CORE
CPUBDC
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pull-down device if IRQ is enabled
(IRQPE = 1). Pull-down is enabled if rising edge detect is selected (IRQEDG = 1)
3. IRQ does not have a clamp diode to VDD. IRQ must not be driven above VDD.
4. Pin contains integrated pullup device.
5. When pin functions as KBI (KBIPEn = 1) and associated pin is configured to enable the
pullup device, KBEDGn can be used to reconfigure the pullup as a pull-down device.
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTB5/KBIP5/ADP5
PORT B
PTE5/MOSI1
PTE4/MISO1
PTE6/SPSCK1
PTE7/SS1
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
VOLTAGE
REGULATOR
COP IRQ LVD
LOW-POWER OSCILLATOR
MULTI-PURPOSE CLOCK
GENERATOR (MCG)
RESET
VSSAD
VDDAD
VREFH
ANALOG-TO-DIGITAL
CONVERTER (ADC)
6-CHANNEL TIMER/PWM
MODULE (TPM1)
PTD7
6
PTB4/KBIP4/ADP4
PTG3/KBIP7
PTG2/KBIP6
PORT G
12-CHANNEL, 12-BIT
BKGD/MS
PTF3/TPM1CH5
PTF2/TPM1CH4
PTF0/TPM1CH2
PTF1/TPM1CH3
PORT F
PTF5/TPM2CH1
PTF4/TPM2CH0
PTF6
PTF7
INTERFACE MODULE (SCI1)
SERIAL COMMUNICATIONS
INTERFACE MODULE (SCI2)
SERIAL COMMUNICATIONS
PTG0/KBIP0
PTG1/KBIP1
MC9S08JM32 = 32,768
VREFL
PTG4/XTAL
PTG5/EXTAL
IRQ/TPMCLK RxD2
TxD2
SDA
SCL
8
KBIPx
KBIPx
TPMCLK
SPSCK1
SS1
MISO1
MOSI1
TPMCLK
TPM1CH1
TPM1CH0
RxD1
TxD1
EXTAL
XTAL
4
4
USB SIE
USB ENDPOINT
RAM
FULL SPEED
USB
TRANSCEIVER
USBDP
USBDN
MISO2
SS2
SPSCK2
MOSI2 PTB1/MOSI2/ADP1
PTB0/MISO2/ADP0
PTB7/ADP7
PTB6/ADP6
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI2)
REAL-TIME COUNTER
(RTC)
PTB3/SS2/ADP3
PTB2/SPSCK2/ADP2
TPM1CHx
4
TPM2CH1
TPM2CH0
4
ANALOG COMPARATOR
(ACMP)
SYSTEM
USB 3.3-V VOLTAGE REGULATOR
VUSB33
MC9S08JM60 = 4096
MC9S08JM32 = 2048
ACMPO
ACMP+
ACMP–
PTD3/KBIP3/ADP10
PTD2/KBIP2/ACMPO
V
SSOSC
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 225
14.1.1 Features
Features of SCI module include:
• Full-duplex, standard non-return-to-zero (NRZ) format
• Double-buffered transmitter and receiver with separate enables
• Programmable baud rates (13-bit modulo divider)
• Interrupt-driven or polled operation:
— Transmit data register empty and transmission complete
— Receive data register full
— Receive overrun, parity error, framing error, and noise error
— Idle receiver detect
— Active edge on receive pin
— Break detect supporting LIN
• Hardware parity generation and checking
• Programmable 8-bit or 9-bit character length
• Receiver wakeup by idle-line or address-mark
• Optional 13-bit break character generation / 11-bit break character detection
• Selectable transmitter output polarity
14.1.2 Modes of Operation
See Section 14.3, “Functional Description,” For details concerning SCI operation in these modes:
• 8- and 9-bit data modes
• Stop mode operation
• Loop mode
• Single-wire mode
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
226 Freescale Semiconductor
14.1.3 Block Diagram
Figure 14-2 shows the transmitter portion of the SCI.
Figure 14-2. SCI Transmitter Block Diagram
H876543210L
SCID – Tx BUFFER
(WRITE-ONLY)
INTERNAL BUS
STOP
11-BIT TRANSMIT SHIFT REGISTER
START
SHIFT DIRECTION
LSB
1 × BAUD
RATE CLOCK
PARITY
GENERATION
TRANSMIT CONTROL
SHIFT ENABLE
PREAMBLE (ALL 1s)
BREAK (ALL 0s)
SCI CONTROLS TxD
TxD DIRECTION
TO TxD
PIN LOGIC
LOOP
CONTROL TO RECEIVE
DATA IN
TO TxD PIN
Tx INTERRUPT
REQUEST
LOOPS
RSRC
TIE
TC
TDRE
M
PT
PE
TCIE
TE
SBK
T8
TXDIR
LOAD FROM SCIxD
TXINV
BRK13
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 227
Figure 14-3 shows the receiver portion of the SCI.
Figure 14-3. SCI Receiver Block Diagram
H876543210L
SCID – Rx BUFFER
(READ-ONLY)
INTERNAL BUS
STOP
11-BIT RECEIVE SHIFT REGISTER
START
SHIFT DIRECTION
LSB
FROM RxD PIN
RATE CLOCK
Rx INTERRUPT
REQUEST
DATA RECOVERY
DIVIDE
16 × BAUD
SINGLE-WIRE
LOOP CONTROL
WAKEUP
LOGIC
ALL 1s
MSB
FROM
TRANSMITTER
ERROR INTERRUPT
REQUEST
PARITY
CHECKING
BY 16
RDRF
RIE
IDLE
ILIE
OR
ORIE
FE
FEIE
NF
NEIE
PF
LOOPS
PEIE
PT
PE
RSRC
WAKE
ILT
RWU
M
LBKDIF
LBKDIE
RXEDGIF
RXEDGIE
ACTIVE EDGE
DETECT
RXINV
LBKDE
RWUID
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
228 Freescale Semiconductor
14.2 Register Definition
The SCI has eight 8-bit registers to control baud rate, select SCI options, report SCI status, and for
transmit/receive data.
Refer to the direct-page register summary in the Memory chapter of this data sheet for the absolute address
assignments for all SCI registers. This section refers to registers and control bits only by their names. A
Freescale-provided equate or header file is used to translate these names into the appropriate absolute
addresses.
14.2.1 SCI Baud Rate Registers (SCIxBDH, SCIxBDL)
This pair of registers controls the prescale divisor for SCI baud rate generation. To update the 13-bit baud
rate setting [SBR12:SBR0], first write to SCIxBDH to buffer the high half of the new value and then write
to SCIxBDL. The working value in SCIxBDH does not change until SCIxBDL is written.
SCIxBDL is reset to a non-zero value, so after reset the baud rate generator remains disabled until the first
time the receiver or transmitter is enabled (RE or TE bits in SCIxC2 are written to 1).
76543210
R
LBKDIE RXEDGIE
0
SBR12 SBR11 SBR10 SBR9 SBR8
W
Reset00000000
= Unimplemented or Reserved
Figure 14-4. SCI Baud Rate Register (SCIxBDH)
Table 14-1. SCIxBDH Field Descriptions
Field Description
7
LBKDIE
LIN Break Detect Interrupt Enable (for LBKDIF)
0 Hardware interrupts from LBKDIF disabled (use polling).
1 Hardware interrupt requested when LBKDIF flag is 1.
6
RXEDGIE
RxD Input Active Edge Interrupt Enable (for RXEDGIF)
0 Hardware interrupts from RXEDGIF disabled (use polling).
1 Hardware interrupt requested when RXEDGIF flag is 1.
4:0
SBR[12:8]
Baud Rate Modulo Divisor — The 13 bits in SBR[12:0] are referred to collectively as BR, and they set the
modulo divide rate for the SCI baud rate generator. When BR = 0, the SCI baud rate generator is disabled to
reduce supply current. When BR = 1 to 8191, the SCI baud rate = BUSCLK/(16×BR). See also BR bits in
Ta b le 1 4 - 2.
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 229
14.2.2 SCI Control Register 1 (SCIxC1)
This read/write register is used to control various optional features of the SCI system.
76543210
R
SBR7 SBR6 SBR5 SBR4 SBR3 SBR2 SBR1 SBR0
W
Reset00000100
Figure 14-5. SCI Baud Rate Register (SCIxBDL)
Table 14-2. SCIxBDL Field Descriptions
Field Description
7:0
SBR[7:0]
Baud Rate Modulo Divisor — These 13 bits in SBR[12:0] are referred to collectively as BR, and they set the
modulo divide rate for the SCI baud rate generator. When BR = 0, the SCI baud rate generator is disabled to
reduce supply current. When BR = 1 to 8191, the SCI baud rate = BUSCLK/(16×BR). See also BR bits in
Ta b le 1 4 - 1.
76543210
R
LOOPS SCISWAI RSRC M WAKE ILT PE PT
W
Reset00000000
Figure 14-6. SCI Control Register 1 (SCIxC1)
Table 14-3. SCIxC1 Field Descriptions
Field Description
7
LOOPS
Loop Mode Select — Selects between loop back modes and normal 2-pin full-duplex modes. When LOOPS = 1,
the transmitter output is internally connected to the receiver input.
0 Normal operation — RxD and TxD use separate pins.
1 Loop mode or single-wire mode where transmitter outputs are internally connected to receiver input. (See
RSRC bit.) RxD pin is not used by SCI.
6
SCISWAI
SCI Stops in Wait Mode
0 SCI clocks continue to run in wait mode so the SCI can be the source of an interrupt that wakes up the CPU.
1 SCI clocks freeze while CPU is in wait mode.
5
RSRC
Receiver Source Select — This bit has no meaning or effect unless the LOOPS bit is set to 1. When
LOOPS = 1, the receiver input is internally connected to the TxD pin and RSRC determines whether this
connection is also connected to the transmitter output.
0 Provided LOOPS = 1, RSRC = 0 selects internal loop back mode and the SCI does not use the RxD pins.
1 Single-wire SCI mode where the TxD pin is connected to the transmitter output and receiver input.
4
M
9-Bit or 8-Bit Mode Select
0 Normal — start + 8 data bits (LSB first) + stop.
1 Receiver and transmitter use 9-bit data characters
start + 8 data bits (LSB first) + 9th data bit + stop.
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
230 Freescale Semiconductor
14.2.3 SCI Control Register 2 (SCIxC2)
This register can be read or written at any time.
3
WAKE
Receiver Wakeup Method Select — Refer to Section 14.3.3.2, “Receiver Wakeup Operation” for more
information.
0 Idle-line wakeup.
1 Address-mark wakeup.
2
ILT
Idle Line Type Select — Setting this bit to 1 ensures that the stop bit and logic 1 bits at the end of a character
do not count toward the 10 or 11 bit times of logic high level needed by the idle line detection logic. Refer to
Section 14.3.3.2.1, “Idle-Line Wakeup” for more information.
0 Idle character bit count starts after start bit.
1 Idle character bit count starts after stop bit.
1
PE
Parity Enable — Enables hardware parity generation and checking. When parity is enabled, the most significant
bit (MSB) of the data character (eighth or ninth data bit) is treated as the parity bit.
0 No hardware parity generation or checking.
1 Parity enabled.
0
PT
Parity Type — Provided parity is enabled (PE = 1), this bit selects even or odd parity. Odd parity means the total
number of 1s in the data character, including the parity bit, is odd. Even parity means the total number of 1s in
the data character, including the parity bit, is even.
0 Even parity.
1 Odd parity.
76543210
R
TIE TCIE RIE ILIE TE RE RWU SBK
W
Reset00000000
Figure 14-7. SCI Control Register 2 (SCIxC2)
Table 14-4. SCIxC2 Field Descriptions
Field Description
7
TIE
Transmit Interrupt Enable (for TDRE)
0 Hardware interrupts from TDRE disabled (use polling).
1 Hardware interrupt requested when TDRE flag is 1.
6
TCIE
Transmission Complete Interrupt Enable (for TC)
0 Hardware interrupts from TC disabled (use polling).
1 Hardware interrupt requested when TC flag is 1.
5
RIE
Receiver Interrupt Enable (for RDRF)
0 Hardware interrupts from RDRF disabled (use polling).
1 Hardware interrupt requested when RDRF flag is 1.
4
ILIE
Idle Line Interrupt Enable (for IDLE)
0 Hardware interrupts from IDLE disabled (use polling).
1 Hardware interrupt requested when IDLE flag is 1.
Table 14-3. SCIxC1 Field Descriptions (continued)
Field Description
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 231
14.2.4 SCI Status Register 1 (SCIxS1)
This register has eight read-only status flags. Writes have no effect. Special software sequences (which do
not involve writing to this register) are used to clear these status flags.
3
TE
Transmitter Enable
0 Transmitter off.
1 Transmitter on.
TE must be 1 in order to use the SCI transmitter. When TE = 1, the SCI forces the TxD pin to act as an output
for the SCI system.
When the SCI is configured for single-wire operation (LOOPS = RSRC = 1), TXDIR controls the direction of
traffic on the single SCI communication line (TxD pin).
TE also can be used to queue an idle character by writing TE = 0 then TE = 1 while a transmission is in progress.
Refer to Section 14.3.2.1, “Send Break and Queued Idle” for more details.
When TE is written to 0, the transmitter keeps control of the port TxD pin until any data, queued idle, or queued
break character finishes transmitting before allowing the pin to revert to a general-purpose I/O pin.
2
RE
Receiver Enable — When the SCI receiver is off, the RxD pin reverts to being a general-purpose port I/O pin. If
LOOPS = 1 the RxD pin reverts to being a general-purpose I/O pin even if RE = 1.
0 Receiver off.
1 Receiver on.
1
RWU
Receiver Wakeup Control — This bit can be written to 1 to place the SCI receiver in a standby state where it
waits for automatic hardware detection of a selected wakeup condition. The wakeup condition is either an idle
line between messages (WAKE = 0, idle-line wakeup), or a logic 1 in the most significant data bit in a character
(WAKE = 1, address-mark wakeup). Application software sets RWU and (normally) a selected hardware
condition automatically clears RWU. Refer to Section 14.3.3.2, “Receiver Wakeup Operation” for more details.
0 Normal SCI receiver operation.
1 SCI receiver in standby waiting for wakeup condition.
0
SBK
Send Break — Writing a 1 and then a 0 to SBK queues a break character in the transmit data stream. Additional
break characters of 10 or 11 (13 or 14 if BRK13 = 1) bit times of logic 0 are queued as long as SBK = 1.
Depending on the timing of the set and clear of SBK relative to the information currently being transmitted, a
second break character may be queued before software clears SBK. Refer to Section 14.3.2.1, “Send Break and
Queued Idle” for more details.
0 Normal transmitter operation.
1 Queue break character(s) to be sent.
76543210
R TDRE TC RDRF IDLE OR NF FE PF
W
Reset11000000
= Unimplemented or Reserved
Figure 14-8. SCI Status Register 1 (SCIxS1)
Table 14-4. SCIxC2 Field Descriptions (continued)
Field Description
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
232 Freescale Semiconductor
Table 14-5. SCIxS1 Field Descriptions
Field Description
7
TDRE
Transmit Data Register Empty Flag — TDRE is set out of reset and when a transmit data value transfers from
the transmit data buffer to the transmit shifter, leaving room for a new character in the buffer. To clear TDRE, read
SCIxS1 with TDRE = 1 and then write to the SCI data register (SCIxD).
0 Transmit data register (buffer) full.
1 Transmit data register (buffer) empty.
6
TC
Transmission Complete Flag — TC is set out of reset and when TDRE = 1 and no data, preamble, or break
character is being transmitted.
0 Transmitter active (sending data, a preamble, or a break).
1 Transmitter idle (transmission activity complete).
TC is cleared automatically by reading SCIxS1 with TC = 1 and then doing one of the following three things:
• Write to the SCI data register (SCIxD) to transmit new data
• Queue a preamble by changing TE from 0 to 1
• Queue a break character by writing 1 to SBK in SCIxC2
5
RDRF
Receive Data Register Full Flag — RDRF becomes set when a character transfers from the receive shifter into
the receive data register (SCIxD). To clear RDRF, read SCIxS1 with RDRF = 1 and then read the SCI data
register (SCIxD).
0 Receive data register empty.
1 Receive data register full.
4
IDLE
Idle Line Flag — IDLE is set when the SCI receive line becomes idle for a full character time after a period of
activity. When ILT = 0, the receiver starts counting idle bit times after the start bit. So if the receive character is
all 1s, these bit times and the stop bit time count toward the full character time of logic high (10 or 11 bit times
depending on the M control bit) needed for the receiver to detect an idle line. When ILT = 1, the receiver doesn’t
start counting idle bit times until after the stop bit. So the stop bit and any logic high bit times at the end of the
previous character do not count toward the full character time of logic high needed for the receiver to detect an
idle line.
To clear IDLE, read SCIxS1 with IDLE = 1 and then read the SCI data register (SCIxD). After IDLE has been
cleared, it cannot become set again until after a new character has been received and RDRF has been set. IDLE
will get set only once even if the receive line remains idle for an extended period.
0 No idle line detected.
1 Idle line was detected.
3
OR
Receiver Overrun Flag — OR is set when a new serial character is ready to be transferred to the receive data
register (buffer), but the previously received character has not been read from SCIxD yet. In this case, the new
character (and all associated error information) is lost because there is no room to move it into SCIxD. To clear
OR, read SCIxS1 with OR = 1 and then read the SCI data register (SCIxD).
0 No overrun.
1 Receive overrun (new SCI data lost).
2
NF
Noise Flag — The advanced sampling technique used in the receiver takes seven samples during the start bit
and three samples in each data bit and the stop bit. If any of these samples disagrees with the rest of the samples
within any bit time in the frame, the flag NF will be set at the same time as the flag RDRF gets set for the character.
To clear NF, read SCIxS1 and then read the SCI data register (SCIxD).
0 No noise detected.
1 Noise detected in the received character in SCIxD.
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 233
14.2.5 SCI Status Register 2 (SCIxS2)
This register has one read-only status flag.
1
FE
Framing Error Flag — FE is set at the same time as RDRF when the receiver detects a logic 0 where the stop
bit was expected. This suggests the receiver was not properly aligned to a character frame. To clear FE, read
SCIxS1 with FE = 1 and then read the SCI data register (SCIxD).
0 No framing error detected. This does not guarantee the framing is correct.
1 Framing error.
0
PF
Parity Error Flag — PF is set at the same time as RDRF when parity is enabled (PE = 1) and the parity bit in
the received character does not agree with the expected parity value. To clear PF, read SCIxS1 and then read
the SCI data register (SCIxD).
0 No parity error.
1 Parity error.
76543210
R
LBKDIF RXEDGIF
0
RXINV RWUID BRK13 LBKDE
RAF
W
Reset00000000
= Unimplemented or Reserved
Figure 14-9. SCI Status Register 2 (SCIxS2)
Table 14-6. SCIxS2 Field Descriptions
Field Description
7
LBKDIF
LIN Break Detect Interrupt Flag — LBKDIF is set when the LIN break detect circuitry is enabled and a LIN break
character is detected. LBKDIF is cleared by writing a “1” to it.
0 No LIN break character has been detected.
1 LIN break character has been detected.
6
RXEDGIF
RxD Pin Active Edge Interrupt Flag — RXEDGIF is set when an active edge (falling if RXINV = 0, rising if
RXINV=1) on the RxD pin occurs. RXEDGIF is cleared by writing a “1” to it.
0 No active edge on the receive pin has occurred.
1 An active edge on the receive pin has occurred.
4
RXINV1Receive Data Inversion — Setting this bit reverses the polarity of the received data input.
0 Receive data not inverted
1 Receive data inverted
3
RWUID
Receive Wake Up Idle Detect— RWUID controls whether the idle character that wakes up the receiver sets the
IDLE bit.
0 During receive standby state (RWU = 1), the IDLE bit does not get set upon detection of an idle character.
1 During receive standby state (RWU = 1), the IDLE bit gets set upon detection of an idle character.
2
BRK13
Break Character Generation Length — BRK13 is used to select a longer transmitted break character length.
Detection of a framing error is not affected by the state of this bit.
0 Break character is transmitted with length of 10 bit times (11 if M = 1)
1 Break character is transmitted with length of 13 bit times (14 if M = 1)
Table 14-5. SCIxS1 Field Descriptions (continued)
Field Description
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
234 Freescale Semiconductor
When using an internal oscillator in a LIN system, it is necessary to raise the break detection threshold by
one bit time. Under the worst case timing conditions allowed in LIN, it is possible that a 0x00 data
character can appear to be 10.26 bit times long at a slave which is running 14% faster than the master. This
would trigger normal break detection circuitry which is designed to detect a 10 bit break symbol. When
the LBKDE bit is set, framing errors are inhibited and the break detection threshold changes from 10 bits
to 11 bits, preventing false detection of a 0x00 data character as a LIN break symbol.
14.2.6 SCI Control Register 3 (SCIxC3)
1
LBKDE
LIN Break Detection Enable— LBKDE is used to select a longer break character detection length. While LBKDE
is set, framing error (FE) and receive data register full (RDRF) flags are prevented from setting.
0 Break character is detected at length of 10 bit times (11 if M = 1).
1 Break character is detected at length of 11 bit times (12 if M = 1).
0
RAF
Receiver Active Flag — RAF is set when the SCI receiver detects the beginning of a valid start bit, and RAF is
cleared automatically when the receiver detects an idle line. This status flag can be used to check whether an
SCI character is being received before instructing the MCU to go to stop mode.
0 SCI receiver idle waiting for a start bit.
1 SCI receiver active (RxD input not idle).
1Setting RXINV inverts the RxD input for all cases: data bits, start and stop bits, break, and idle.
76543210
RR8
T8 TXDIR TXINV ORIE NEIE FEIE PEIE
W
Reset00000000
= Unimplemented or Reserved
Figure 14-10. SCI Control Register 3 (SCIxC3)
Table 14-7. SCIxC3 Field Descriptions
Field Description
7
R8
Ninth Data Bit for Receiver — When the SCI is configured for 9-bit data (M = 1), R8 can be thought of as a ninth
receive data bit to the left of the MSB of the buffered data in the SCIxD register. When reading 9-bit data, read
R8 before reading SCIxD because reading SCIxD completes automatic flag clearing sequences which could
allow R8 and SCIxD to be overwritten with new data.
6
T8
Ninth Data Bit for Transmitter — When the SCI is configured for 9-bit data (M = 1), T8 may be thought of as a
ninth transmit data bit to the left of the MSB of the data in the SCIxD register. When writing 9-bit data, the entire
9-bit value is transferred to the SCI shift register after SCIxD is written so T8 should be written (if it needs to
change from its previous value) before SCIxD is written. If T8 does not need to change in the new value (such
as when it is used to generate mark or space parity), it need not be written each time SCIxD is written.
5
TXDIR
TxD Pin Direction in Single-Wire Mode — When the SCI is configured for single-wire half-duplex operation
(LOOPS = RSRC = 1), this bit determines the direction of data at the TxD pin.
0 TxD pin is an input in single-wire mode.
1 TxD pin is an output in single-wire mode.
Table 14-6. SCIxS2 Field Descriptions (continued)
Field Description
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 235
14.2.7 SCI Data Register (SCIxD)
This register is actually two separate registers. Reads return the contents of the read-only receive data
buffer and writes go to the write-only transmit data buffer. Reads and writes of this register are also
involved in the automatic flag clearing mechanisms for the SCI status flags.
14.3 Functional Description
The SCI allows full-duplex, asynchronous, NRZ serial communication among the MCU and remote
devices, including other MCUs. The SCI comprises a baud rate generator, transmitter, and receiver block.
The transmitter and receiver operate independently, although they use the same baud rate generator.
During normal operation, the MCU monitors the status of the SCI, writes the data to be transmitted, and
processes received data. The following describes each of the blocks of the SCI.
14.3.1 Baud Rate Generation
As shown in Figure 14-12, the clock source for the SCI baud rate generator is the bus-rate clock.
4
TXINV1Transmit Data Inversion — Setting this bit reverses the polarity of the transmitted data output.
0 Transmit data not inverted
1 Transmit data inverted
3
ORIE
Overrun Interrupt Enable — This bit enables the overrun flag (OR) to generate hardware interrupt requests.
0 OR interrupts disabled (use polling).
1 Hardware interrupt requested when OR = 1.
2
NEIE
Noise Error Interrupt Enable — This bit enables the noise flag (NF) to generate hardware interrupt requests.
0 NF interrupts disabled (use polling).
1 Hardware interrupt requested when NF = 1.
1
FEIE
Framing Error Interrupt Enable — This bit enables the framing error flag (FE) to generate hardware interrupt
requests.
0 FE interrupts disabled (use polling).
1 Hardware interrupt requested when FE = 1.
0
PEIE
Parity Error Interrupt Enable — This bit enables the parity error flag (PF) to generate hardware interrupt
requests.
0 PF interrupts disabled (use polling).
1 Hardware interrupt requested when PF = 1.
1Setting TXINV inverts the TxD output for all cases: data bits, start and stop bits, break, and idle.
76543210
RR7R6R5R4R3R2R1R0
WT7T6T5T4T3T2T1T0
Reset00000000
Figure 14-11. SCI Data Register (SCIxD)
Table 14-7. SCIxC3 Field Descriptions (continued)
Field Description
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
236 Freescale Semiconductor
Figure 14-12. SCI Baud Rate Generation
SCI communications require the transmitter and receiver (which typically derive baud rates from
independent clock sources) to use the same baud rate. Allowed tolerance on this baud frequency depends
on the details of how the receiver synchronizes to the leading edge of the start bit and how bit sampling is
performed.
The MCU resynchronizes to bit boundaries on every high-to-low transition, but in the worst case, there are
no such transitions in the full 10- or 11-bit time character frame so any mismatch in baud rate is
accumulated for the whole character time. For a Freescale Semiconductor SCI system whose bus
frequency is driven by a crystal, the allowed baud rate mismatch is about ±4.5 percent for 8-bit data format
and about ±4 percent for 9-bit data format. Although baud rate modulo divider settings do not always
produce baud rates that exactly match standard rates, it is normally possible to get within a few percent,
which is acceptable for reliable communications.
14.3.2 Transmitter Functional Description
This section describes the overall block diagram for the SCI transmitter, as well as specialized functions
for sending break and idle characters. The transmitter block diagram is shown in Figure 14-2.
The transmitter output (TxD) idle state defaults to logic high (TXINV = 0 following reset). The transmitter
output is inverted by setting TXINV = 1. The transmitter is enabled by setting the TE bit in SCIxC2. This
queues a preamble character that is one full character frame of the idle state. The transmitter then remains
idle until data is available in the transmit data buffer. Programs store data into the transmit data buffer by
writing to the SCI data register (SCIxD).
The central element of the SCI transmitter is the transmit shift register that is either 10 or 11 bits long
depending on the setting in the M control bit. For the remainder of this section, we will assume M = 0,
selecting the normal 8-bit data mode. In 8-bit data mode, the shift register holds a start bit, eight data bits,
and a stop bit. When the transmit shift register is available for a new SCI character, the value waiting in
the transmit data register is transferred to the shift register (synchronized with the baud rate clock) and the
transmit data register empty (TDRE) status flag is set to indicate another character may be written to the
transmit data buffer at SCIxD.
If no new character is waiting in the transmit data buffer after a stop bit is shifted out the TxD pin, the
transmitter sets the transmit complete flag and enters an idle mode, with TxD high, waiting for more
characters to transmit.
SBR12:SBR0
DIVIDE BY Tx BAUD RATE
Rx SAMPLING CLOCK
(16 × BAUD RATE)
BAUD RATE GENERATOR
OFF IF [SBR12:SBR0] = 0
BUSCLK
BAUD RATE = BUSCLK
[SBR12:SBR0] × 16
16
MODULO DIVIDE BY
(1 THROUGH 8191)
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 237
Writing 0 to TE does not immediately release the pin to be a general-purpose I/O pin. Any transmit activity
that is in progress must first be completed. This includes data characters in progress, queued idle
characters, and queued break characters.
14.3.2.1 Send Break and Queued Idle
The SBK control bit in SCIxC2 is used to send break characters which were originally used to gain the
attention of old teletype receivers. Break characters are a full character time of logic 0 (10 bit times
including the start and stop bits). A longer break of 13 bit times can be enabled by setting BRK13 = 1.
Normally, a program would wait for TDRE to become set to indicate the last character of a message has
moved to the transmit shifter, then write 1 and then write 0 to the SBK bit. This action queues a break
character to be sent as soon as the shifter is available. If SBK is still 1 when the queued break moves into
the shifter (synchronized to the baud rate clock), an additional break character is queued. If the receiving
device is another Freescale Semiconductor SCI, the break characters will be received as 0s in all eight data
bits and a framing error (FE = 1) occurs.
When idle-line wakeup is used, a full character time of idle (logic 1) is needed between messages to wake
up any sleeping receivers. Normally, a program would wait for TDRE to become set to indicate the last
character of a message has moved to the transmit shifter, then write 0 and then write 1 to the TE bit. This
action queues an idle character to be sent as soon as the shifter is available. As long as the character in the
shifter does not finish while TE = 0, the SCI transmitter never actually releases control of the TxD pin. If
there is a possibility of the shifter finishing while TE = 0, set the general-purpose I/O controls so the pin
that is shared with TxD is an output driving a logic 1. This ensures that the TxD line will look like a normal
idle line even if the SCI loses control of the port pin between writing 0 and then 1 to TE.
The length of the break character is affected by the BRK13 and M bits as shown below.
14.3.3 Receiver Functional Description
In this section, the receiver block diagram (Figure 14-3) is used as a guide for the overall receiver
functional description. Next, the data sampling technique used to reconstruct receiver data is described in
more detail. Finally, two variations of the receiver wakeup function are explained.
The receiver input is inverted by setting RXINV = 1. The receiver is enabled by setting the RE bit in
SCIxC2. Character frames consist of a start bit of logic 0, eight (or nine) data bits (LSB first), and a stop
bit of logic 1. For information about 9-bit data mode, refer to Section 14.3.5.1, “8- and 9-Bit Data Modes.”
For the remainder of this discussion, we assume the SCI is configured for normal 8-bit data mode.
After receiving the stop bit into the receive shifter, and provided the receive data register is not already
full, the data character is transferred to the receive data register and the receive data register full (RDRF)
Table 14-8. Break Character Length
BRK13 M Break Character Length
0 0 10 bit times
0 1 11 bit times
1 0 13 bit times
1 1 14 bit times
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
238 Freescale Semiconductor
status flag is set. If RDRF was already set indicating the receive data register (buffer) was already full, the
overrun (OR) status flag is set and the new data is lost. Because the SCI receiver is double-buffered, the
program has one full character time after RDRF is set before the data in the receive data buffer must be
read to avoid a receiver overrun.
When a program detects that the receive data register is full (RDRF = 1), it gets the data from the receive
data register by reading SCIxD. The RDRF flag is cleared automatically by a 2-step sequence which is
normally satisfied in the course of the user’s program that handles receive data. Refer to Section 14.3.4,
“Interrupts and Status Flags,” for more details about flag clearing.
14.3.3.1 Data Sampling Technique
The SCI receiver uses a 16× baud rate clock for sampling. The receiver starts by taking logic level samples
at 16 times the baud rate to search for a falling edge on the RxD serial data input pin. A falling edge is
defined as a logic 0 sample after three consecutive logic 1 samples. The 16× baud rate clock is used to
divide the bit time into 16 segments labeled RT1 through RT16. When a falling edge is located, three more
samples are taken at RT3, RT5, and RT7 to make sure this was a real start bit and not merely noise. If at
least two of these three samples are 0, the receiver assumes it is synchronized to a receive character.
The receiver then samples each bit time, including the start and stop bits, at RT8, RT9, and RT10 to
determine the logic level for that bit. The logic level is interpreted to be that of the majority of the samples
taken during the bit time. In the case of the start bit, the bit is assumed to be 0 if at least two of the samples
at RT3, RT5, and RT7 are 0 even if one or all of the samples taken at RT8, RT9, and RT10 are 1s. If any
sample in any bit time (including the start and stop bits) in a character frame fails to agree with the logic
level for that bit, the noise flag (NF) will be set when the received character is transferred to the receive
data buffer.
The falling edge detection logic continuously looks for falling edges, and if an edge is detected, the sample
clock is resynchronized to bit times. This improves the reliability of the receiver in the presence of noise
or mismatched baud rates. It does not improve worst case analysis because some characters do not have
any extra falling edges anywhere in the character frame.
In the case of a framing error, provided the received character was not a break character, the sampling logic
that searches for a falling edge is filled with three logic 1 samples so that a new start bit can be detected
almost immediately.
In the case of a framing error, the receiver is inhibited from receiving any new characters until the framing
error flag is cleared. The receive shift register continues to function, but a complete character cannot
transfer to the receive data buffer if FE is still set.
14.3.3.2 Receiver Wakeup Operation
Receiver wakeup is a hardware mechanism that allows an SCI receiver to ignore the characters in a
message that is intended for a different SCI receiver. In such a system, all receivers evaluate the first
character(s) of each message, and as soon as they determine the message is intended for a different
receiver, they write logic 1 to the receiver wake up (RWU) control bit in SCIxC2. When RWU bit is set,
the status flags associated with the receiver (with the exception of the idle bit, IDLE, when RWUID bit is
set) are inhibited from setting, thus eliminating the software overhead for handling the unimportant
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 239
message characters. At the end of a message, or at the beginning of the next message, all receivers
automatically force RWU to 0 so all receivers wake up in time to look at the first character(s) of the next
message.
14.3.3.2.1 Idle-Line Wakeup
When WAKE = 0, the receiver is configured for idle-line wakeup. In this mode, RWU is cleared
automatically when the receiver detects a full character time of the idle-line level. The M control bit selects
8-bit or 9-bit data mode that determines how many bit times of idle are needed to constitute a full character
time (10 or 11 bit times because of the start and stop bits).
When RWU is one and RWUID is zero, the idle condition that wakes up the receiver does not set the IDLE
flag. The receiver wakes up and waits for the first data character of the next message which will set the
RDRF flag and generate an interrupt if enabled. When RWUID is one, any idle condition sets the IDLE
flag and generates an interrupt if enabled, regardless of whether RWU is zero or one.
The idle-line type (ILT) control bit selects one of two ways to detect an idle line. When ILT = 0, the idle
bit counter starts after the start bit so the stop bit and any logic 1s at the end of a character count toward
the full character time of idle. When ILT = 1, the idle bit counter does not start until after a stop bit time,
so the idle detection is not affected by the data in the last character of the previous message.
14.3.3.2.2 Address-Mark Wakeup
When WAKE = 1, the receiver is configured for address-mark wakeup. In this mode, RWU is cleared
automatically when the receiver detects a logic 1 in the most significant bit of a received character (eighth
bit in M = 0 mode and ninth bit in M = 1 mode).
Address-mark wakeup allows messages to contain idle characters but requires that the MSB be reserved
for use in address frames. The logic 1 MSB of an address frame clears the RWU bit before the stop bit is
received and sets the RDRF flag. In this case the character with the MSB set is received even though the
receiver was sleeping during most of this character time.
14.3.4 Interrupts and Status Flags
The SCI system has three separate interrupt vectors to reduce the amount of software needed to isolate the
cause of the interrupt. One interrupt vector is associated with the transmitter for TDRE and TC events.
Another interrupt vector is associated with the receiver for RDRF, IDLE, RXEDGIF and LBKDIF events,
and a third vector is used for OR, NF, FE, and PF error conditions. Each of these ten interrupt sources can
be separately masked by local interrupt enable masks. The flags can still be polled by software when the
local masks are cleared to disable generation of hardware interrupt requests.
The SCI transmitter has two status flags that optionally can generate hardware interrupt requests. Transmit
data register empty (TDRE) indicates when there is room in the transmit data buffer to write another
transmit character to SCIxD. If the transmit interrupt enable (TIE) bit is set, a hardware interrupt will be
requested whenever TDRE = 1. Transmit complete (TC) indicates that the transmitter is finished
transmitting all data, preamble, and break characters and is idle with TxD at the inactive level. This flag is
often used in systems with modems to determine when it is safe to turn off the modem. If the transmit
complete interrupt enable (TCIE) bit is set, a hardware interrupt will be requested whenever TC = 1.
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
240 Freescale Semiconductor
Instead of hardware interrupts, software polling may be used to monitor the TDRE and TC status flags if
the corresponding TIE or TCIE local interrupt masks are 0s.
When a program detects that the receive data register is full (RDRF = 1), it gets the data from the receive
data register by reading SCIxD. The RDRF flag is cleared by reading SCIxS1 while RDRF = 1 and then
reading SCIxD.
When polling is used, this sequence is naturally satisfied in the normal course of the user program. If
hardware interrupts are used, SCIxS1 must be read in the interrupt service routine (ISR). Normally, this is
done in the ISR anyway to check for receive errors, so the sequence is automatically satisfied.
The IDLE status flag includes logic that prevents it from getting set repeatedly when the RxD line remains
idle for an extended period of time. IDLE is cleared by reading SCIxS1 while IDLE = 1 and then reading
SCIxD. After IDLE has been cleared, it cannot become set again until the receiver has received at least
one new character and has set RDRF.
If the associated error was detected in the received character that caused RDRF to be set, the error flags
— noise flag (NF), framing error (FE), and parity error flag (PF) — get set at the same time as RDRF.
These flags are not set in overrun cases.
If RDRF was already set when a new character is ready to be transferred from the receive shifter to the
receive data buffer, the overrun (OR) flag gets set instead the data along with any associated NF, FE, or PF
condition is lost.
At any time, an active edge on the RxD serial data input pin causes the RXEDGIF flag to set. The
RXEDGIF flag is cleared by writing a “1” to it. This function does depend on the receiver being enabled
(RE = 1).
14.3.5 Additional SCI Functions
The following sections describe additional SCI functions.
14.3.5.1 8- and 9-Bit Data Modes
The SCI system (transmitter and receiver) can be configured to operate in 9-bit data mode by setting the
M control bit in SCIxC1. In 9-bit mode, there is a ninth data bit to the left of the MSB of the SCI data
register. For the transmit data buffer, this bit is stored in T8 in SCIxC3. For the receiver, the ninth bit is
held in R8 in SCIxC3.
For coherent writes to the transmit data buffer, write to the T8 bit before writing to SCIxD.
If the bit value to be transmitted as the ninth bit of a new character is the same as for the previous character,
it is not necessary to write to T8 again. When data is transferred from the transmit data buffer to the
transmit shifter, the value in T8 is copied at the same time data is transferred from SCIxD to the shifter.
9-bit data mode typically is used in conjunction with parity to allow eight bits of data plus the parity in the
ninth bit. Or it is used with address-mark wakeup so the ninth data bit can serve as the wakeup bit. In
custom protocols, the ninth bit can also serve as a software-controlled marker.
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 241
14.3.5.2 Stop Mode Operation
During all stop modes, clocks to the SCI module are halted.
In stop1 and stop2 modes, all SCI register data is lost and must be re-initialized upon recovery from these
two stop modes. No SCI module registers are affected in stop3 mode.
The receive input active edge detect circuit is still active in stop3 mode, but not in stop2.. An active edge
on the receive input brings the CPU out of stop3 mode if the interrupt is not masked (RXEDGIE = 1).
Note, because the clocks are halted, the SCI module will resume operation upon exit from stop (only in
stop3 mode). Software should ensure stop mode is not entered while there is a character being transmitted
out of or received into the SCI module.
14.3.5.3 Loop Mode
When LOOPS = 1, the RSRC bit in the same register chooses between loop mode (RSRC = 0) or
single-wire mode (RSRC = 1). Loop mode is sometimes used to check software, independent of
connections in the external system, to help isolate system problems. In this mode, the transmitter output is
internally connected to the receiver input and the RxD pin is not used by the SCI, so it reverts to a
general-purpose port I/O pin.
14.3.5.4 Single-Wire Operation
When LOOPS = 1, the RSRC bit in the same register chooses between loop mode (RSRC = 0) or
single-wire mode (RSRC = 1). Single-wire mode is used to implement a half-duplex serial connection.
The receiver is internally connected to the transmitter output and to the TxD pin. The RxD pin is not used
and reverts to a general-purpose port I/O pin.
In single-wire mode, the TXDIR bit in SCIxC3 controls the direction of serial data on the TxD pin. When
TXDIR = 0, the TxD pin is an input to the SCI receiver and the transmitter is temporarily disconnected
from the TxD pin so an external device can send serial data to the receiver. When TXDIR = 1, the TxD pin
is an output driven by the transmitter. In single-wire mode, the internal loop back connection from the
transmitter to the receiver causes the receiver to receive characters that are sent out by the transmitter.
Serial Communications Interface (S08SCIV4)
MC9S08JM60 Series Data Sheet, Rev. 3
242 Freescale Semiconductor
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 243
Chapter 15
16-Bit Serial Peripheral Interface (S08SPI16V1)
15.1 Introduction
The 8- or 16-bit selectable serial peripheral interface (SPI) module provides for full-duplex, synchronous,
serial communication between the MCU and peripheral devices. These peripheral devices can include
other microcontrollers, analog-to-digital converters, shift registers, sensors, memories, etc.
The SPI runs at a baud rate up to the bus clock divided by two in master mode and up to the bus clock
divided by four in slave mode. Software can poll the status flags, or SPI operation can be interrupt driven.
The SPI also supports a data length of 8 or 16 bits and includes a hardware match feature for the receive
data buffer.
The MC9S08JM60 series have two serial peripheral interface modules (SPI1 and SPI2). The four pins
associated with SPI functionality are shared with PTB[3:0] and PTE[7:4]. See Appendix A, “Electrical
Characteristics,” for SPI electrical parametric information.
15.1.1 SPI Port Configuration Information
By default, the input filters on the SPI port pins will be enabled (SPIxFE=1), which restricts the SPI data
rate to 6 MHz, but protects the SPI from noise during data transfers.To configure the SPI at a baud rate of
6MHz or greater, the input filters on the SPI port pins must be disabled by clearing the SPIxFE in SOPT2.
and also enable the high output drive strength selection on the affected SPI port pins.
Chapter 15 16-Bit Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
244 Freescale Semiconductor
Figure 15-1. MC9S08JM60 Series Block Diagram Highlighting the SPI Blocks and Pins
PTD4/ADP11
PTD5
PTD6
PTC1/SDA
PTC0/SCL
VSS
VDD
PTE3/TPM1CH1
PTE2/TPM1CH0
PTA5– PTA0
PTE0/TxD1
PTE1/RxD1
PTD1/ADP9/ACMP–
PTD0/ADP8/ACMP+
PTC6
PTC5/RxD2
PTC4
PTC3/TxD2
PTC2
PORT A
PORT C
PORT D
PORT E
8-BIT KEYBOARD
INTERRUPT MODULE (KBI)
IIC MODULE (IIC)
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
USER Flash (IN BYTES)
USER RAM (IN BYTES)
ON-CHIP ICE AND
DEBUG MODULE (DBG)
MC9S08JM60 = 60,912
HCS08 CORE
CPUBDC
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pull-down device if IRQ is enabled
(IRQPE = 1). Pull-down is enabled if rising edge detect is selected (IRQEDG = 1)
3. IRQ does not have a clamp diode to VDD. IRQ must not be driven above VDD.
4. Pin contains integrated pullup device.
5. When pin functions as KBI (KBIPEn = 1) and associated pin is configured to enable the
pullup device, KBEDGn can be used to reconfigure the pullup as a pull-down device.
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTB5/KBIP5/ADP5
PORT B
PTE5/MOSI1
PTE4/MISO1
PTE6/SPSCK1
PTE7/SS1
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
VOLTAGE
REGULATOR
COP IRQ LVD
LOW-POWER OSCILLATOR
MULTI-PURPOSE CLOCK
GENERATOR (MCG)
RESET
VSSAD
VDDAD
VREFH
ANALOG-TO-DIGITAL
CONVERTER (ADC)
6-CHANNEL TIMER/PWM
MODULE (TPM1)
PTD7
6
PTB4/KBIP4/ADP4
PTG3/KBIP7
PTG2/KBIP6
PORT G
12-CHANNEL, 12-BIT
BKGD/MS
PTF3/TPM1CH5
PTF2/TPM1CH4
PTF0/TPM1CH2
PTF1/TPM1CH3
PORT F
PTF5/TPM2CH1
PTF4/TPM2CH0
PTF6
PTF7
INTERFACE MODULE (SCI1)
SERIAL COMMUNICATIONS
INTERFACE MODULE (SCI2)
SERIAL COMMUNICATIONS
PTG0/KBIP0
PTG1/KBIP1
MC9S08JM32 = 32,768
VREFL
PTG4/XTAL
PTG5/EXTAL
IRQ/TPMCLK RxD2
TxD2
SDA
SCL
8
KBIPx
KBIPx
TPMCLK
SPSCK1
SS1
MISO1
MOSI1
TPMCLK
TPM1CH1
TPM1CH0
RxD1
TxD1
EXTAL
XTAL
4
4
USB SIE
USB ENDPOINT
RAM
FULL SPEED
USB
TRANSCEIVER
USBDP
USBDN
MISO2
SS2
SPSCK2
MOSI2 PTB1/MOSI2/ADP1
PTB0/MISO2/ADP0
PTB7/ADP7
PTB6/ADP6
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI2)
REAL-TIME COUNTER
(RTC)
PTB3/SS2/ADP3
PTB2/SPSCK2/ADP2
TPM1CHx
4
TPM2CH1
TPM2CH0
4
ANALOG COMPARATOR
(ACMP)
SYSTEM
USB 3.3-V VOLTAGE REGULATOR
VUSB33
MC9S08JM60 = 4096
MC9S08JM32 = 2048
ACMPO
ACMP+
ACMP–
PTD3/KBIP3/ADP10
PTD2/KBIP2/ACMPO
V
SSOSC
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 245
Figure 15-2. SPI Module Quick Start
MSTR CPOL CPHA SSOE LSBFE
MODFEN BIDIROE
SPIMODE SPISWAI SPC0SPMIE
Additional configuration options.
SPPR0 SPR2 SPR1 SPR0SPPR2 SPPR1
Baud rate = (BUSCLK/SPPR[2:0])/SPR2[2:0]
Bit 15
Bit 7
Module Initialization (Slave):
Write: SPIxC1 to configure interrupts, set primary SPI options, slave mode select, and
system enable.
Write: SPIxC2 to configure optional SPI features, hardware match interrupt enable,
and 8- or 16-bit data transmission length
Write: SPIxMH:SPIxML to set hardware compare value that triggers SPMF (optional)
when value in receive data buffer equals this value.
Module Initialization (Master):
Write: SPIxC1 to configure interrupts, set primary SPI options, master mode select,
and system enable.
Write: SPIxC2 to configure optional SPI features, hardware match interrupt enable,
and 8- or 16-bit data transmission length
Write: SPIxBR to set baud rate
Write: SPIxMH:SPIxML to set hardware compare value that triggers SPMF (optional)
when value in receive data buffer equals this value.
Module Use:
After SPI master initiates transfer by checking that SPTEF = 1 and then writing data to SPIDH/L:
Wait for SPRF, then read from SPIDH/L
Wait for SPTEF, then write to SPIDH/L
Data transmissions can be 8- or 16-bits long, and mode fault detection can be enabled for master mode in cases where
more than one SPI device might become a master at the same time. Also, some applications may utilize the receive data
buffer hardware match feature to trigger specific actions, such as when command data can be sent through the SPI or to
indicate the end of an SPI transmission.
SPIxC1
SPIxC2
SPIxBR
SPIxDH
SPIxDL
SPIE SPE SPTIE
Module/interrupt enables and configuration
Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
SPIxMH
Hardware Match Value
Bit 15
Bit 7
Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
MODFSPTEF
SPIxS SPRF SPMF
SPIxML
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
246 Freescale Semiconductor
15.1.2 Features
The SPI includes these distinctive features:
• Master mode or slave mode operation
• Full-duplex or single-wire bidirectional mode
• Programmable transmit bit rate
• Double-buffered transmit and receive data register
• Serial clock phase and polarity options
• Slave select output
• Mode fault error flag with CPU interrupt capability
• Control of SPI operation during wait mode
• Selectable MSB-first or LSB-first shifting
• Programmable 8- or 16-bit data transmission length
• Receive data buffer hardware match feature
15.1.3 Modes of Operation
The SPI functions in three modes, run, wait, and stop.
• Run Mode
This is the basic mode of operation.
• Wait Mode
SPI operation in wait mode is a configurable low power mode, controlled by the SPISWAI bit
located in the SPIxC2 register. In wait mode, if the SPISWAI bit is clear, the SPI operates like in
Run Mode. If the SPISWAI bit is set, the SPI goes into a power conservative state, with the SPI
clock generation turned off. If the SPI is configured as a master, any transmission in progress stops,
but is resumed after CPU goes into Run Mode. If the SPI is configured as a slave, reception and
transmission of a byte continues, so that the slave stays synchronized to the master.
• Stop Mode
The SPI is inactive in stop3 mode for reduced power consumption. If the SPI is configured as a
master, any transmission in progress stops, but is resumed after the CPU goes into Run Mode. If
the SPI is configured as a slave, reception and transmission of a data continues, so that the slave
stays synchronized to the master.
The SPI is completely disabled in all other stop modes. When the CPU wakes from these stop modes, all
SPI register content will be reset.
This is a high level description only, detailed descriptions of operating modes are contained in section
Section 15.4.9, “Low Power Mode Options.”
15.1.4 Block Diagrams
This section includes block diagrams showing SPI system connections, the internal organization of the SPI
module, and the SPI clock dividers that control the master mode bit rate.
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 247
15.1.4.1 SPI System Block Diagram
Figure 15-3 shows the SPI modules of two MCUs connected in a master-slave arrangement. The master
device initiates all SPI data transfers. During a transfer, the master shifts data out (on the MOSI pin) to the
slave while simultaneously shifting data in (on the MISO pin) from the slave. The transfer effectively
exchanges the data that was in the SPI shift registers of the two SPI systems. The SPSCK signal is a clock
output from the master and an input to the slave. The slave device must be selected by a low level on the
slave select input (SS pin). In this system, the master device has configured its SS pin as an optional slave
select output.
Figure 15-3. SPI System Connections
15.1.4.2 SPI Module Block Diagram
Figure 15-4 is a block diagram of the SPI module. The central element of the SPI is the SPI shift register.
Data is written to the double-buffered transmitter (write to SPIxDH:SPIxDL) and gets transferred to the
SPI shift register at the start of a data transfer. After shifting in 8 or 16 bits (as determined by SPIMODE
bit) of data, the data is transferred into the double-buffered receiver where it can be read (read from
SPIxDH:SPIxDL). Pin multiplexing logic controls connections between MCU pins and the SPI module.
When the SPI is configured as a master, the clock output is routed to the SPSCK pin, the shifter output is
routed to MOSI, and the shifter input is routed from the MISO pin.
When the SPI is configured as a slave, the SPSCK pin is routed to the clock input of the SPI, the shifter
output is routed to MISO, and the shifter input is routed from the MOSI pin.
In the external SPI system, simply connect all SPSCK pins to each other, all MISO pins together, and all
MOSI pins together. Peripheral devices often use slightly different names for these pins.
SPI SHIFTER
CLOCK
GENERATOR
SPI SHIFTER
SS
SPSCK
MISO
MOSI
SS
SPSCK
MISO
MOSI
MASTER SLAVE
8 OR 16 BITS8 OR 16 BITS
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
248 Freescale Semiconductor
Figure 15-4. SPI Module Block Diagram
15.2 External Signal Description
The SPI optionally shares four port pins. The function of these pins depends on the settings of SPI control
bits. When the SPI is disabled (SPE = 0), these four pins revert to being general-purpose port I/O pins that
are not controlled by the SPI.
15.2.1 SPSCK — SPI Serial Clock
When the SPI is enabled as a slave, this pin is the serial clock input. When the SPI is enabled as a master,
this pin is the serial clock output.
SPIE
SPI SHIFT REGISTER
SHIFT
CLOCK
SHIFT
DIRECTION
Rx BUFFER
FULL
Tx BUFFER
EMPTY
SHIFT
OUT
SHIFT
IN
ENABLE
SPI SYSTEM
CLOCK
LOGIC
CLOCK GENERATOR
BUS RATE
CLOCK
MASTER/SLAVE
MODE SELECT
MODE FAULT
DETECTION
MASTER CLOCK
SLAVE CLOCK
SPI
INTERRUPT
REQUEST
PIN CONTROL
M
S
MASTER/
SLAVE
MOSI
(MOMI)
MISO
(SISO)
SPSCK
SS
M
S
S
M
MODF
SPE
LSBFE
MSTR
SPRF SPTEF
SPTIE
MODFEN
SSOE
SPC0
BIDIROE
SPIBR
Tx BUFFER (WRITE SPIxDH:SPIxDL)
Rx BUFFER (READ SPIxDH:SPIxDL)
8 OR 16
BIT MODE
SPIMODE
16-BIT COMPARATOR SPMF
SPMIE
SPIxMH:SPIxML
16-BIT LATCH
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 249
15.2.2 MOSI — Master Data Out, Slave Data In
When the SPI is enabled as a master and SPI pin control zero (SPC0) is 0 (not bidirectional mode), this
pin is the serial data output. When the SPI is enabled as a slave and SPC0 = 0, this pin is the serial data
input. If SPC0 = 1 to select single-wire bidirectional mode, and master mode is selected, this pin becomes
the bidirectional data I/O pin (MOMI). Also, the bidirectional mode output enable bit determines whether
the pin acts as an input (BIDIROE = 0) or an output (BIDIROE = 1). If SPC0 = 1 and slave mode is
selected, this pin is not used by the SPI and reverts to being a general-purpose port I/O pin.
15.2.3 MISO — Master Data In, Slave Data Out
When the SPI is enabled as a master and SPI pin control zero (SPC0) is 0 (not bidirectional mode), this
pin is the serial data input. When the SPI is enabled as a slave and SPC0 = 0, this pin is the serial data
output. If SPC0 = 1 to select single-wire bidirectional mode, and slave mode is selected, this pin becomes
the bidirectional data I/O pin (SISO) and the bidirectional mode output enable bit determines whether the
pin acts as an input (BIDIROE = 0) or an output (BIDIROE = 1). If SPC0 = 1 and master mode is selected,
this pin is not used by the SPI and reverts to being a general-purpose port I/O pin.
15.2.4 SS — Slave Select
When the SPI is enabled as a slave, this pin is the low-true slave select input. When the SPI is enabled as
a master and mode fault enable is off (MODFEN = 0), this pin is not used by the SPI and reverts to being
a general-purpose port I/O pin. When the SPI is enabled as a master and MODFEN = 1, the slave select
output enable bit determines whether this pin acts as the mode fault input (SSOE = 0) or as the slave select
output (SSOE = 1).
15.3 Register Definition
The SPI has eight 8-bit registers to select SPI options, control baud rate, report SPI status, hold an SPI data
match value, and for transmit/receive data.
Refer to the direct-page register summary in the Memory chapter of this data sheet for the absolute address
assignments for all SPI registers. This section refers to registers and control bits only by their names, and
a Freescale-provided equate or header file is used to translate these names into the appropriate absolute
addresses.
15.3.1 SPI Control Register 1 (SPIxC1)
This read/write register includes the SPI enable control, interrupt enables, and configuration options.
76543210
R
SPIE SPE SPTIE MSTR CPOL CPHA SSOE LSBFE
W
Reset00000100
Figure 15-5. SPI Control Register 1 (SPIxC1)
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
250 Freescale Semiconductor
15.3.2 SPI Control Register 2 (SPIxC2)
This read/write register is used to control optional features of the SPI system. Bits 6 and 5 are not
implemented and always read 0.
Table 15-1. SPIxC1 Field Descriptions
Field Description
7
SPIE
SPI Interrupt Enable (for SPRF and MODF) — This is the interrupt enable for SPI receive buffer full (SPRF)
and mode fault (MODF) events.
0 Interrupts from SPRF and MODF inhibited (use polling)
1 When SPRF or MODF is 1, request a hardware interrupt
6
SPE
SPI System Enable — This bit enables the SPI system and dedicates the SPI port pins to SPI system functions.
If SPE is cleared, SPI is disabled and forced into idle state, and all status bits in the SPIxS register are reset.
0 SPI system inactive
1 SPI system enabled
5
SPTIE
SPI Transmit Interrupt Enable — This is the interrupt enable bit for SPI transmit buffer empty (SPTEF).
0 Interrupts from SPTEF inhibited (use polling)
1 When SPTEF is 1, hardware interrupt requested
4
MSTR
Master/Slave Mode Select — This bit selects master or slave mode operation.
0 SPI module configured as a slave SPI device
1 SPI module configured as a master SPI device
3
CPOL
Clock Polarity — This bit selects an inverted or non-inverted SPI clock. To transmit data between SPI modules,
the SPI modules must have identical CPOL values.
This bit effectively places an inverter in series with the clock signal from a master SPI or to a slave SPI device.
Refer to Section 15.4.5, “SPI Clock Formats” for more details.
0 Active-high SPI clock (idles low)
1 Active-low SPI clock (idles high)
2
CPHA
Clock Phase — This bit selects one of two clock formats for different kinds of synchronous serial peripheral
devices. Refer to Section 15.4.5, “SPI Clock Formats” for more details.
0 First edge on SPSCK occurs at the middle of the first cycle of a data transfer
1 First edge on SPSCK occurs at the start of the first cycle of a data transfer
1
SSOE
Slave Select Output Enable — This bit is used in combination with the mode fault enable (MODFEN) bit in
SPIxC2 and the master/slave (MSTR) control bit to determine the function of the SS pin as shown in Table 15-2.
0
LSBFE
LSB First (Shifter Direction) — This bit does not affect the position of the MSB and LSB in the data register.
Reads and writes of the data register always have the MSB in bit 7 (or bit 15 in 16-bit mode).
0 SPI serial data transfers start with most significant bit
1 SPI serial data transfers start with least significant bit
Table 15-2. SS Pin Function
MODFEN SSOE Master Mode Slave Mode
0 0 General-purpose I/O (not SPI) Slave select input
0 1 General-purpose I/O (not SPI) Slave select input
10SS
input for mode fault Slave select input
1 1 Automatic SS output Slave select input
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 251
76543210
R
SPMIE SPIMODE
0
MODFEN BIDIROE
0
SPISWAI SPC0
W
Reset00000000
= Unimplemented or Reserved
Figure 15-6. SPI Control Register 2 (SPIxC2)
Table 15-3. SPIxC2 Register Field Descriptions
Field Description
7
SPMIE
SPI Match Interrupt Enable — This is the interrupt enable for the SPI receive data buffer hardware match
(SPMF) function.
0 Interrupts from SPMF inhibited (use polling).
1 When SPMF = 1, requests a hardware interrupt.
6
SPIMODE
SPI 8- or 16-bit Mode — This bit allows the user to select either an 8-bit or 16-bit SPI data transmission length.
In master mode, a change of this bit will abort a transmission in progress, force the SPI system into idle state,
and reset all status bits in the SPIxS register. Refer to section Section 15.4.4, “Data Transmission Length,” for
details.
0 8-bit SPI shift register, match register, and buffers.
1 16-bit SPI shift register, match register, and buffers.
4
MODFEN
Master Mode-Fault Function Enable — When the SPI is configured for slave mode, this bit has no meaning or
effect. (The SS pin is the slave select input.) In master mode, this bit determines how the SS pin is used (refer to
Ta b le 1 5 - 2 for details)
0 Mode fault function disabled, master SS pin reverts to general-purpose I/O not controlled by SPI
1 Mode fault function enabled, master SS pin acts as the mode fault input or the slave select output
3
BIDIROE
Bidirectional Mode Output Enable — When bidirectional mode is enabled by SPI pin control 0 (SPC0) = 1,
BIDIROE determines whether the SPI data output driver is enabled to the single bidirectional SPI I/O pin.
Depending on whether the SPI is configured as a master or a slave, it uses either the MOSI (MOMI) or MISO
(SISO) pin, respectively, as the single SPI data I/O pin. When SPC0 = 0, BIDIROE has no meaning or effect.
0 Output driver disabled so SPI data I/O pin acts as an input
1 SPI I/O pin enabled as an output
1
SPISWAI
SPI Stop in Wait Mode — This bit is used for power conservation while in wait.
0 SPI clocks continue to operate in wait mode
1 SPI clocks stop when the MCU enters wait mode
0
SPC0
SPI Pin Control 0 — This bit enables bidirectional pin configurations as shown in Table 15 - 4.
0 SPI uses separate pins for data input and data output.
1 SPI configured for single-wire bidirectional operation.
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
252 Freescale Semiconductor
15.3.3 SPI Baud Rate Register (SPIxBR)
This register is used to set the prescaler and bit rate divisor for an SPI master. This register may be read or
written at any time.
Table 15-4. Bidirectional Pin Configurations
Pin Mode SPC0 BIDIROE MISO MOSI
Master Mode of Operation
Normal 0 X Master In Master Out
Bidirectional 1 0 MISO not used by SPI Master In
1 Master I/O
Slave Mode of Operation
Normal 0 X Slave Out Slave In
Bidirectional 1 0 Slave In MOSI not used by SPI
1Slave I/O
76543210
R0
SPPR2 SPPR1 SPPR0
0
SPR2 SPR1 SPR0
W
Reset00000000
= Unimplemented or Reserved
Figure 15-7. SPI Baud Rate Register (SPIxBR)
Table 15-5. SPIxBR Register Field Descriptions
Field Description
6:4
SPPR[2:0]
SPI Baud Rate Prescale Divisor — This 3-bit field selects one of eight divisors for the SPI baud rate prescaler
as shown in Ta b le 1 5 - 6. The input to this prescaler is the bus rate clock (BUSCLK). The output of this prescaler
drives the input of the SPI baud rate divider (see Figure 15-15). See Section 15.4.6, “SPI Baud Rate Generation,”
for details.
2:0
SPR[2:0]
SPI Baud Rate Divisor — This 3-bit field selects one of eight divisors for the SPI baud rate divider as shown in
Ta b le 1 5 - 7. The input to this divider comes from the SPI baud rate prescaler (see Figure 15-15). See
Section 15.4.6, “SPI Baud Rate Generation,” for details.
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 253
15.3.4 SPI Status Register (SPIxS)
This register has four read-only status bits. Bits 3 through 0 are not implemented and always read 0. Writes
have no meaning or effect.
Table 15-6. SPI Baud Rate Prescaler Divisor
SPPR2:SPPR1:SPPR0 Prescaler Divisor
0:0:0 1
0:0:1 2
0:1:0 3
0:1:1 4
1:0:0 5
1:0:1 6
1:1:0 7
1:1:1 8
Table 15-7. SPI Baud Rate Divisor
SPR2:SPR1:SPR0 Rate Divisor
0:0:0 2
0:0:1 4
0:1:0 8
0:1:1 16
1:0:0 32
1:0:1 64
1:1:0 128
1:1:1 256
76543210
R SPRF SPMF SPTEF MODF 0 0 0 0
W
Reset00100000
= Unimplemented or Reserved
Figure 15-8. SPI Status Register (SPIxS)
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
254 Freescale Semiconductor
15.3.5 SPI Data Registers (SPIxDH:SPIxDL)
The SPI data registers (SPIxDH:SPIxDL) are both the input and output register for SPI data. A write to
these registers writes to the transmit data buffer, allowing data to be queued and transmitted.
Table 15-8. SPIxS Register Field Descriptions
Field Description
7
SPRF
SPI Read Buffer Full Flag — SPRF is set at the completion of an SPI transfer to indicate that received data may
be read from the SPI data register (SPIxDH:SPIxDL). SPRF is cleared by reading SPRF while it is set, then
reading the SPI data register.
0 No data available in the receive data buffer.
1 Data available in the receive data buffer.
6
SPMF
SPI Match Flag — SPMF is set after SPRF = 1 when the value in the receive data buffer matches the value in
SPIMH:SPIML. To clear the flag, read SPMF when it is set, then write a 1 to it.
0 Value in the receive data buffer does not match the value in SPIxMH:SPIxML registers.
1 Value in the receive data buffer matches the value in SPIxMH:SPIxML registers.
5
SPTEF
SPI Transmit Buffer Empty Flag — This bit is set when the transmit data buffer is empty. It is cleared by reading
SPIxS with SPTEF set, followed by writing a data value to the transmit buffer at SPIxDH:SPIxDL. SPIxS must be
read with SPTEF = 1 before writing data to SPIxDH:SPIxDL or the SPIxDH:SPIxDL write will be ignored. SPTEF
is automatically set when all data from the transmit buffer transfers into the transmit shift register. For an idle SPI,
data written to SPIxDH:SPIxDL is transferred to the shifter almost immediately so SPTEF is set within two bus
cycles allowing a second data to be queued into the transmit buffer. After completion of the transfer of the data
in the shift register, the queued data from the transmit buffer will automatically move to the shifter and SPTEF will
be set to indicate there is room for new data in the transmit buffer. If no new data is waiting in the transmit buffer,
SPTEF simply remains set and no data moves from the buffer to the shifter.
0 SPI transmit buffer not empty
1 SPI transmit buffer empty
4
MODF
Master Mode Fault Flag — MODF is set if the SPI is configured as a master and the slave select input goes low,
indicating some other SPI device is also configured as a master. The SS pin acts as a mode fault error input only
when MSTR = 1, MODFEN = 1, and SSOE = 0; otherwise, MODF will never be set. MODF is cleared by reading
MODF while it is 1, then writing to SPI control register 1 (SPIxC1).
0 No mode fault error
1 Mode fault error detected
76543210
R
Bit 15 14 13 12 11 10 9 Bit 8
W
Reset00000000
Figure 15-9. SPI Data Register High (SPIxDH)
76543210
R
Bit 7654321Bit 0
W
Reset00000000
Figure 15-10. SPI Data Register Low (SPIxDL)
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 255
When the SPI is configured as a master, data queued in the transmit data buffer is transmitted immediately
after the previous transmission has completed.
The SPI transmit buffer empty flag (SPTEF) in the SPIxS register indicates when the transmit data buffer
is ready to accept new data. SPIxS must be read when SPTEF is set before writing to the SPI data registers,
or the write will be ignored.
Data may be read from SPIxDH:SPIxDL any time after SPRF is set and before another transfer is finished.
Failure to read the data out of the receive data buffer before a new transfer ends causes a receive overrun
condition and the data from the new transfer is lost.
In 8-bit mode, only SPIxDL is available. Reads of SPIxDH will return all 0s. Writes to SPIxDH will be
ignored.
In 16-bit mode, reading either byte (SPIxDH or SPIxDL) latches the contents of both bytes into a buffer
where they remain latched until the other byte is read. Writing to either byte (SPIxDH or SPIxDL) latches
the value into a buffer. When both bytes have been written, they are transferred as a coherent 16-bit value
into the transmit data buffer.
15.3.6 SPI Match Registers (SPIxMH:SPIxML)
These read/write registers contain the hardware compare value, which sets the SPI match flag (SPMF)
when the value received in the SPI receive data buffer equals the value in the SPIxMH:SPIxML registers.
In 8-bit mode, only SPIxML is available. Reads of SPIxMH will return all 0s. Writes to SPIxMH will be
ignored.
In 16-bit mode, reading either byte (SPIxMH or SPIxML) latches the contents of both bytes into a buffer
where they remain latched until the other byte is read. Writing to either byte (SPIxMH or SPIxML) latches
the value into a buffer. When both bytes have been written, they are transferred as a coherent value into
the SPI match registers.
76543210
R
Bit 15 14 13 12 11 10 9 Bit 8
W
Reset00000000
Figure 15-11. SPI Match Register High (SPIxMH)
76543210
R
Bit 7654321Bit 0
W
Reset00000000
Figure 15-12. SPI Match Register Low (SPIxML)
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
256 Freescale Semiconductor
15.4 Functional Description
15.4.1 General
The SPI system is enabled by setting the SPI enable (SPE) bit in SPI Control Register 1. While the SPE
bit is set, the four associated SPI port pins are dedicated to the SPI function as:
• Slave select (SS)
• Serial clock (SPSCK)
• Master out/slave in (MOSI)
• Master in/slave out (MISO)
An SPI transfer is initiated in the master SPI device by reading the SPI status register (SPIxS) when
SPTEF = 1 and then writing data to the transmit data buffer (write to SPIxDH:SPIxDL). When a transfer
is complete, received data is moved into the receive data buffer. The SPIxDH:SPIxDL registers act as the
SPI receive data buffer for reads and as the SPI transmit data buffer for writes.
The clock phase control bit (CPHA) and a clock polarity control bit (CPOL) in the SPI Control Register 1
(SPIxC1) select one of four possible clock formats to be used by the SPI system. The CPOL bit simply
selects a non-inverted or inverted clock. The CPHA bit is used to accommodate two fundamentally
different protocols by sampling data on odd numbered SPSCK edges or on even numbered SPSCK edges.
The SPI can be configured to operate as a master or as a slave. When the MSTR bit in SPI control register
1 is set, master mode is selected, when the MSTR bit is clear, slave mode is selected.
15.4.2 Master Mode
The SPI operates in master mode when the MSTR bit is set. Only a master SPI module can initiate
transmissions. A transmission begins by reading the SPIxS register while SPTEF = 1 and writing to the
master SPI data registers. If the shift register is empty, the byte immediately transfers to the shift register.
The data begins shifting out on the MOSI pin under the control of the serial clock.
• SPSCK
The SPR2, SPR1, and SPR0 baud rate selection bits in conjunction with the SPPR2, SPPR1, and SPPR0
baud rate preselection bits in the SPI Baud Rate register control the baud rate generator and determine the
speed of the transmission. The SPSCK pin is the SPI clock output. Through the SPSCK pin, the baud rate
generator of the master controls the shift register of the slave peripheral.
• MOSI, MISO pin
In master mode, the function of the serial data output pin (MOSI) and the serial data input pin (MISO) is
determined by the SPC0 and BIDIROE control bits.
•SS
pin
If MODFEN and SSOE bit are set, the SS pin is configured as slave select output. The SS output becomes
low during each transmission and is high when the SPI is in idle state.
If MODFEN is set and SSOE is cleared, the SS pin is configured as input for detecting mode fault error.
If the SS input becomes low this indicates a mode fault error where another master tries to drive the MOSI
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 257
and SPSCK lines. In this case, the SPI immediately switches to slave mode, by clearing the MSTR bit and
also disables the slave output buffer MISO (or SISO in bidirectional mode). So the result is that all outputs
are disabled and SPSCK, MOSI and MISO are inputs. If a transmission is in progress when the mode fault
occurs, the transmission is aborted and the SPI is forced into idle state.
This mode fault error also sets the mode fault (MODF) flag in the SPI Status Register (SPIxS). If the SPI
interrupt enable bit (SPIE) is set when the MODF flag gets set, then an SPI interrupt sequence is also
requested.
When a write to the SPI Data Register in the master occurs, there is a half SPSCK-cycle delay. After the
delay, SPSCK is started within the master. The rest of the transfer operation differs slightly, depending on
the clock format specified by the SPI clock phase bit, CPHA, in SPI Control Register 1 (see Section 15.4.5,
“SPI Clock Formats.”)
NOTE
A change of the bits CPOL, CPHA, SSOE, LSBFE, MODFEN, SPC0,
BIDIROE with SPC0 set, SPIMODE, SPPR2-SPPR0 and SPR2-SPR0 in
master mode will abort a transmission in progress and force the SPI into idle
state. The remote slave cannot detect this, therefore the master has to ensure
that the remote slave is set back to idle state.
15.4.3 Slave Mode
The SPI operates in slave mode when the MSTR bit in SPI Control Register1 is clear.
• SPSCK
In slave mode, SPSCK is the SPI clock input from the master.
• MISO, MOSI pin
In slave mode, the function of the serial data output pin (MISO) and serial data input pin (MOSI) is
determined by the SPC0 bit and BIDIROE bit in SPI Control Register 2.
•SS pin
The SS pin is the slave select input. Before a data transmission occurs, the SS pin of the slave SPI must
be low. SS must remain low until the transmission is complete. If SS goes high, the SPI is forced into idle
state.
The SS input also controls the serial data output pin, if SS is high (not selected), the serial data output pin
is high impedance, and, if SS is low the first bit in the SPI Data Register is driven out of the serial data
output pin. Also, if the slave is not selected (SS is high), then the SPSCK input is ignored and no internal
shifting of the SPI shift register takes place.
Although the SPI is capable of duplex operation, some SPI peripherals are capable of only receiving SPI
data in a slave mode. For these simpler devices, there is no serial data out pin.
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
258 Freescale Semiconductor
NOTE
When peripherals with duplex capability are used, take care not to
simultaneously enable two receivers whose serial outputs drive the same
system slave’s serial data output line.
As long as no more than one slave device drives the system slave’s serial data output line, it is possible for
several slaves to receive the same transmission from a master, although the master would not receive return
information from all of the receiving slaves.
If the CPHA bit in SPI Control Register 1 is clear, odd numbered edges on the SPSCK input cause the data
at the serial data input pin to be latched. Even numbered edges cause the value previously latched from the
serial data input pin to shift into the LSB or MSB of the SPI shift register, depending on the LSBFE bit.
If the CPHA bit is set, even numbered edges on the SPSCK input cause the data at the serial data input pin
to be latched. Odd numbered edges cause the value previously latched from the serial data input pin to shift
into the LSB or MSB of the SPI shift register, depending on the LSBFE bit.
When CPHA is set, the first edge is used to get the first data bit onto the serial data output pin. When CPHA
is clear and the SS input is low (slave selected), the first bit of the SPI data is driven out of the serial data
output pin. After the eighth (SPIMODE = 0) or sixteenth (SPIMODE = 1) shift, the transfer is considered
complete and the received data is transferred into the SPI data registers. To indicate transfer is complete,
the SPRF flag in the SPI Status Register is set.
NOTE
A change of the bits CPOL, CPHA, SSOE, LSBFE, MODFEN, SPC0 and
BIDIROE with SPC0 set and SPIMODE in slave mode will corrupt a
transmission in progress and has to be avoided.
15.4.4 Data Transmission Length
The SPI can support data lengths of 8 or 16 bits. The length can be configured with the SPIMODE bit in
the SPIxC2 register.
In 8-bit mode (SPIMODE = 0), the SPI Data Register is comprised of one byte: SPIxDL. The SPI Match
Register is also comprised of only one byte: SPIxML. Reads of SPIxDH and SPIxMH will return zero.
Writes to SPIxDH and SPIxMH will be ignored.
In 16-bit mode (SPIMODE = 1), the SPI Data Register is comprised of two bytes: SPIxDH and SPIxDL.
Reading either byte (SPIxDH or SPIxDL) latches the contents of both bytes into a buffer where they
remain latched until the other byte is read. Writing to either byte (SPIxDH or SPIxDL) latches the value
into a buffer. When both bytes have been written, they are transferred as a coherent 16-bit value into the
transmit data buffer.
In 16-bit mode, the SPI Match Register is also comprised of two bytes: SPIxMH and SPIxML. Reading
either byte (SPIxMH or SPIxML) latches the contents of both bytes into a buffer where they remain latched
until the other byte is read. Writing to either byte (SPIxMH or SPIxML) latches the value into a buffer.
When both bytes have been written, they are transferred as a coherent 16-bit value into the transmit data
buffer.
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 259
Any switching between 8- and 16-bit data transmission length (controlled by SPIMODE bit) in master
mode will abort a transmission in progress, force the SPI system into idle state, and reset all status bits in
the SPIxS register. To initiate a transfer after writing to SPIMODE, the SPIxS register must be read with
SPTEF = 1, and data must be written to SPIxDH:SPIxDL in 16-bit mode (SPIMODE = 1) or SPIxDL in
8-bit mode (SPIMODE = 0).
In slave mode, user software should write to SPIMODE only once to prevent corrupting a transmission in
progress.
NOTE
Data can be lost if the data length is not the same for both master and slave
devices.
15.4.5 SPI Clock Formats
To accommodate a wide variety of synchronous serial peripherals from different manufacturers, the SPI
system has a clock polarity (CPOL) bit and a clock phase (CPHA) control bit to select one of four clock
formats for data transfers. CPOL selectively inserts an inverter in series with the clock. CPHA chooses
between two different clock phase relationships between the clock and data.
Figure 15-13 shows the clock formats when SPIMODE = 0 (8-bit mode) and CPHA = 1. At the top of the
figure, the eight bit times are shown for reference with bit 1 starting at the first SPSCK edge and bit 8
ending one-half SPSCK cycle after the sixteenth SPSCK edge. The MSB first and LSB first lines show the
order of SPI data bits depending on the setting in LSBFE. Both variations of SPSCK polarity are shown,
but only one of these waveforms applies for a specific transfer, depending on the value in CPOL. The
SAMPLE IN waveform applies to the MOSI input of a slave or the MISO input of a master. The MOSI
waveform applies to the MOSI output pin from a master and the MISO waveform applies to the MISO
output from a slave. The SS OUT waveform applies to the slave select output from a master (provided
MODFEN and SSOE = 1). The master SS output goes to active low one-half SPSCK cycle before the start
of the transfer and goes back high at the end of the eighth bit time of the transfer. The SS IN waveform
applies to the slave select input of a slave.
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
260 Freescale Semiconductor
Figure 15-13. SPI Clock Formats (CPHA = 1)
When CPHA = 1, the slave begins to drive its MISO output when SS goes to active low, but the data is not
defined until the first SPSCK edge. The first SPSCK edge shifts the first bit of data from the shifter onto
the MOSI output of the master and the MISO output of the slave. The next SPSCK edge causes both the
master and the slave to sample the data bit values on their MISO and MOSI inputs, respectively. At the
third SPSCK edge, the SPI shifter shifts one bit position which shifts in the bit value that was just sampled,
and shifts the second data bit value out the other end of the shifter to the MOSI and MISO outputs of the
master and slave, respectively. When CPHA = 1, the slave’s SS input is not required to go to its inactive
high level between transfers.
Figure 15-14 shows the clock formats when SPIMODE = 0 and CPHA = 0. At the top of the figure, the
eight bit times are shown for reference with bit 1 starting as the slave is selected (SS IN goes low), and bit
8 ends at the last SPSCK edge. The MSB first and LSB first lines show the order of SPI data bits depending
on the setting in LSBFE. Both variations of SPSCK polarity are shown, but only one of these waveforms
applies for a specific transfer, depending on the value in CPOL. The SAMPLE IN waveform applies to the
MOSI input of a slave or the MISO input of a master. The MOSI waveform applies to the MOSI output
pin from a master and the MISO waveform applies to the MISO output from a slave. The SS OUT
waveform applies to the slave select output from a master (provided MODFEN and SSOE = 1). The master
SS output goes to active low at the start of the first bit time of the transfer and goes back high one-half
BIT TIME #
(REFERENCE)
MSB FIRST
LSB FIRST
SPSCK
(CPOL = 0)
SPSCK
(CPOL = 1)
SAMPLE IN
(MISO OR MOSI)
MOSI
(MASTER OUT)
MISO
(SLAVE OUT)
SS OUT
(MASTER)
SS IN
(SLAVE)
BIT 7
BIT 0
BIT 6
BIT 1
BIT 2
BIT 5
BIT 1
BIT 6
BIT 0
BIT 7
12 67 8
...
...
...
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 261
SPSCK cycle after the end of the eighth bit time of the transfer. The SS IN waveform applies to the slave
select input of a slave.
Figure 15-14. SPI Clock Formats (CPHA = 0)
When CPHA = 0, the slave begins to drive its MISO output with the first data bit value (MSB or LSB
depending on LSBFE) when SS goes to active low. The first SPSCK edge causes both the master and the
slave to sample the data bit values on their MISO and MOSI inputs, respectively. At the second SPSCK
edge, the SPI shifter shifts one bit position which shifts in the bit value that was just sampled and shifts the
second data bit value out the other end of the shifter to the MOSI and MISO outputs of the master and
slave, respectively. When CPHA = 0, the slave’s SS input must go to its inactive high level between
transfers.
15.4.6 SPI Baud Rate Generation
As shown in Figure 15-15, the clock source for the SPI baud rate generator is the bus clock. The three
prescale bits (SPPR2:SPPR1:SPPR0) choose a prescale divisor of 1, 2, 3, 4, 5, 6, 7, or 8. The three rate
select bits (SPR2:SPR1:SPR0) divide the output of the prescaler stage by 2, 4, 8, 16, 32, 64, 128, or 256
to get the internal SPI master mode bit-rate clock.
The baud rate generator is activated only when the SPI is in the master mode and a serial transfer is taking
place. In the other cases, the divider is disabled to decrease IDD current.
BIT TIME #
(REFERENCE)
MSB FIRST
LSB FIRST
SPSCK
(CPOL = 0)
SPSCK
(CPOL = 1)
SAMPLE IN
(MISO OR MOSI)
MOSI
(MASTER OUT)
MISO
(SLAVE OUT)
SS OUT
(MASTER)
SS IN
(SLAVE)
BIT 7
BIT 0
BIT 6
BIT 1
BIT 2
BIT 5
BIT 1
BIT 6
BIT 0
BIT 7
12 67 8...
...
...
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
262 Freescale Semiconductor
The baud rate divisor equation is as follows:
The baud rate can be calculated with the following equation:
Figure 15-15. SPI Baud Rate Generation
15.4.7 Special Features
15.4.7.1 SS Output
The SS output feature automatically drives the SS pin low during transmission to select external devices
and drives it high during idle to deselect external devices. When SS output is selected, the SS output pin
is connected to the SS input pin of the external device.
The SS output is available only in master mode during normal SPI operation by asserting the SSOE and
MODFEN bits as shown in Table 15-2.
The mode fault feature is disabled while SS output is enabled.
NOTE
Care must be taken when using the SS output feature in a multi-master
system since the mode fault feature is not available for detecting system
errors between masters.
15.4.7.2 Bidirectional Mode (MOMI or SISO)
The bidirectional mode is selected when the SPC0 bit is set in SPI Control Register 2 (see Table 15-9.) In
this mode, the SPI uses only one serial data pin for the interface with external device(s). The MSTR bit
decides which pin to use. The MOSI pin becomes the serial data I/O (MOMI) pin for the master mode, and
the MISO pin becomes serial data I/O (SISO) pin for the slave mode. The MISO pin in master mode and
MOSI pin in slave mode are not used by the SPI.
BaudRateDivisor SPPR 1+()2•SPR 1+()
=
Baud Rate BusClock BaudRateDivisor⁄=
DIVIDE BY
2, 4, 8, 16, 32, 64, 128, or 256
DIVIDE BY
1, 2, 3, 4, 5, 6, 7, or 8
PRESCALER BAUD RATE DIVIDER
SPPR2:SPPR1:SPPR0 SPR2:SPR1:SPR0
BUS CLOCK
MASTER
SPI
BIT RATE
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 263
The direction of each serial I/O pin depends on the BIDIROE bit. If the pin is configured as an output,
serial data from the shift register is driven out on the pin. The same pin is also the serial input to the shift
register.
The SPSCK is output for the master mode and input for the slave mode.
The SS is the input or output for the master mode, and it is always the input for the slave mode.
The bidirectional mode does not affect SPSCK and SS functions.
NOTE
In bidirectional master mode, with mode fault enabled, both data pins MISO
and MOSI can be occupied by the SPI, though MOSI is normally used for
transmissions in bidirectional mode and MISO is not used by the SPI. If a
mode fault occurs, the SPI is automatically switched to slave mode, in this
case MISO becomes occupied by the SPI and MOSI is not used. This has to
be considered, if the MISO pin is used for another purpose.
15.4.8 Error Conditions
The SPI has one error condition:
• Mode fault error
15.4.8.1 Mode Fault Error
If the SS input becomes low while the SPI is configured as a master, it indicates a system error where more
than one master may be trying to drive the MOSI and SPSCK lines simultaneously. This condition is not
permitted in normal operation, and the MODF bit in the SPI status register is set automatically provided
the MODFEN bit is set.
Table 15-9. Normal Mode and Bidirectional Mode
When SPE = 1 Master Mode MSTR = 1 Slave Mode MSTR = 0
Normal Mode
SPC0 = 0
Bidirectional Mode
SPC0 = 1
SPI
MOSI
MISO
Serial Out
Serial In
SPI
MOSI
MISO
Serial In
Serial Out
SPI
MOMI
Serial Out
Serial In
BIDIROE
SPI
SISO
Serial In
Serial Out
.
BIDIROE
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
264 Freescale Semiconductor
In the special case where the SPI is in master mode and MODFEN bit is cleared, the SS pin is not used by
the SPI. In this special case, the mode fault error function is inhibited and MODF remains cleared. In case
the SPI system is configured as a slave, the SS pin is a dedicated input pin. Mode fault error doesn’t occur
in slave mode.
If a mode fault error occurs the SPI is switched to slave mode, with the exception that the slave output
buffer is disabled. So SPSCK, MISO and MOSI pins are forced to be high impedance inputs to avoid any
possibility of conflict with another output driver. A transmission in progress is aborted and the SPI is
forced into idle state.
If the mode fault error occurs in the bidirectional mode for a SPI system configured in master mode, output
enable of the MOMI (MOSI in bidirectional mode) is cleared if it was set. No mode fault error occurs in
the bidirectional mode for the SPI system configured in slave mode.
The mode fault flag is cleared automatically by a read of the SPI Status Register (with MODF set) followed
by a write to SPI Control Register 1. If the mode fault flag is cleared, the SPI becomes a normal master or
slave again.
15.4.9 Low Power Mode Options
15.4.9.1 SPI in Run Mode
In run mode with the SPI system enable (SPE) bit in the SPI control register clear, the SPI system is in a
low-power, disabled state. SPI registers can still be accessed, but clocks to the core of this module are
disabled.
15.4.9.2 SPI in Wait Mode
SPI operation in wait mode depends upon the state of the SPISWAI bit in SPI Control Register 2.
• If SPISWAI is clear, the SPI operates normally when the CPU is in wait mode
• If SPISWAI is set, SPI clock generation ceases and the SPI module enters a power conservation
state when the CPU is in wait mode.
— If SPISWAI is set and the SPI is configured for master, any transmission and reception in
progress stops at wait mode entry. The transmission and reception resumes when the SPI exits
wait mode.
– If SPISWAI is set and the SPI is configured as a slave, any transmission and reception in
progress continues if the SPSCK continues to be driven from the master. This keeps the slave
synchronized to the master and the SPSCK.
If the master transmits data while the slave is in wait mode, the slave will continue to send out
data consistent with the operation mode at the start of wait mode (i.e., if the slave is currently
sending its SPIxDH:SPIxDL to the master, it will continue to send the same byte. Otherwise,
if the slave is currently sending the last data received byte from the master, it will continue to
send each previously receive data from the master byte).
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 265
NOTE
Care must be taken when expecting data from a master while the slave is in
wait or stop3 mode. Even though the shift register will continue to operate,
the rest of the SPI is shut down (i.e. a SPRF interrupt will not be generated
until exiting stop or wait mode). Also, the data from the shift register will
not be copied into the SPIxDH:SPIxDL registers until after the slave SPI has
exited wait or stop mode. A SPRF flag and SPIxDH:SPIxDL copy is only
generated if wait mode is entered or exited during a tranmission. If the slave
enters wait mode in idle mode and exits wait mode in idle mode, neither a
SPRF nor a SPIxDH:SPIxDL copy will occur.
15.4.9.3 SPI in Stop Mode
Stop3 mode is dependent on the SPI system. Upon entry to stop3 mode, the SPI module clock is disabled
(held high or low). If the SPI is in master mode and exchanging data when the CPU enters stop mode, the
transmission is frozen until the CPU exits stop mode. After stop, data to and from the external SPI is
exchanged correctly. In slave mode, the SPI will stay synchronized with the master.
The stop mode is not dependent on the SPISWAI bit.
In all other stop modes, the SPI module is completely disabled. After stop, all registers are reset to their
default values, and the SPI module must be re-initialized.
15.4.9.4 Reset
The reset values of registers and signals are described in Section 15.3, “Register Definition.” which details
the registers and their bit-fields.
• If a data transmission occurs in slave mode after reset without a write to SPIxDH:SPIxDL, it will
transmit garbage, or the data last received from the master before the reset.
• Reading from the SPIxDH:SPIxDL after reset will always read zeros.
15.4.9.5 Interrupts
The SPI only originates interrupt requests when the SPI is enabled (SPE bit in SPIxC1 set). The following
is a description of how the SPI makes a request and how the MCU should acknowledge that request. The
interrupt vector offset and interrupt priority are chip dependent.
15.4.10 SPI Interrupts
There are four flag bits, three interrupt mask bits, and one interrupt vector associated with the SPI system.
The SPI interrupt enable mask (SPIE) enables interrupts from the SPI receiver full flag (SPRF) and mode
fault flag (MODF). The SPI transmit interrupt enable mask (SPTIE) enables interrupts from the SPI
transmit buffer empty flag (SPTEF). The SPI match interrupt enable mask bit (SPIMIE) enables interrupts
from the SPI match flag (SPMF). When one of the flag bits is set, and the associated interrupt mask bit is
set, a hardware interrupt request is sent to the CPU. If the interrupt mask bits are cleared, software can poll
the associated flag bits instead of using interrupts. The SPI interrupt service routine (ISR) should check
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
266 Freescale Semiconductor
the flag bits to determine what event caused the interrupt. The service routine should also clear the flag
bit(s) before returning from the ISR (usually near the beginning of the ISR).
15.4.10.1 MODF
MODF occurs when the master detects an error on the SS pin. The master SPI must be configured for the
MODF feature (see Table 15-2). Once MODF is set, the current transfer is aborted and the following bit is
changed:
• MSTR=0, The master bit in SPIxC1 resets.
The MODF interrupt is reflected in the status register MODF flag. Clearing the flag will also clear the
interrupt. This interrupt will stay active while the MODF flag is set. MODF has an automatic clearing
process which is described in Section 15.3.4, “SPI Status Register (SPIxS).”
15.4.10.2 SPRF
SPRF occurs when new data has been received and copied to the SPI receive data buffer. In 8-bit mode,
SPRF is set only after all 8 bits have been shifted out of the shift register and into SPIxDL. In 16-bit mode,
SPRF is set only after all 16 bits have been shifted out of the shift register and into SPIxDH:SPIxDL.
Once SPRF is set, it does not clear until it is serviced. SPRF has an automatic clearing process which is
described in Section 15.3.4, “SPI Status Register (SPIxS).” In the event that the SPRF is not serviced
before the end of the next transfer (i.e. SPRF remains active throughout another transfer), the latter
transfers will be ignored and no new data will be copied into the SPIxDH:SPIxDL.
15.4.10.3 SPTEF
SPTEF occurs when the SPI transmit buffer is ready to accept new data. In 8-bit mode, SPTEF is set only
after all 8 bits have been moved from SPIxDL into the shifter. In 16-bit mode, SPTEF is set only after all
16 bits have been moved from SPIxDH:SPIxDL into the shifter.
Once SPTEF is set, it does not clear until it is serviced. SPTEF has an automatic clearing process which is
described in Section 15.3.4, “SPI Status Register (SPIxS).
15.4.10.4 SPMF
SPMF occurs when the data in the receive data buffer is equal to the data in the SPI match register. In 8-bit
mode, SPMF is set only after bits 8–0 in the receive data buffer are determined to be equivalent to the value
in SPIxML. In 16-bit mode, SPMF is set after bits 15–0 in the receive data buffer are determined to be
equivalent to the value in SPIxMH:SPIxML.
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 267
15.5 Initialization/Application Information
15.5.1 SPI Module Initialization Example
15.5.1.1 Initialization Sequence
Before the SPI module can be used for communication, an initialization procedure must be carried out, as
follows:
1. Update control register 1 (SPIxC1) to enable the SPI and to control interrupt enables. This register
also sets the SPI as master or slave, determines clock phase and polarity, and configures the main
SPI options.
2. Update control register 2 (SPIxC2) to enable additional SPI functions such as the SPI match
interrupt feature, the master mode-fault function, and bidirectional mode output. 8- or 16-bit mode
select and other optional features are controlled here as well.
3. Update the baud rate register (SPIxBR) to set the prescaler and bit rate divisor for an SPI master.
4. Update the hardware match register (SPIxMH:SPIxML) with the value to be compared to the
receive data register for triggering an interrupt if hardware match interrupts are enabled.
5. In the master, read SPIxS while SPTEF = 1, and then write to the transmit data register
(SPIxDH:SPIxDL) to begin transfer.
15.5.1.2 Pseudo—Code Example
In this example, the SPI module will be set up for master mode with only hardware match interrupts
enabled. The SPI will run in 16-bit mode at a maximum baud rate of bus clock divided by 2. Clock phase
and polarity will be set for an active-high SPI clock where the first edge on SPSCK occurs at the start of
the first cycle of a data transfer.
SPIxC1=0x54(%01010100)
Bit 7 SPIE = 0 Disables receive and mode fault interrupts
Bit 6 SPE = 1 Enables the SPI system
Bit 5 SPTIE = 0 Disables SPI transmit interrupts
Bit 4 MSTR = 1 Sets the SPI module as a master SPI device
Bit 3 CPOL = 0 Configures SPI clock as active-high
Bit 2 CPHA = 1 First edge on SPSCK at start of first data transfer cycle
Bit 1 SSOE = 0 Determines SS pin function when mode fault enabled
Bit 0 LSBFE = 0 SPI serial data transfers start with most significant bit
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
268 Freescale Semiconductor
SPIxC2 = 0xC0(%11000000)
Bit 7 SPMIE = 1 SPI hardware match interrupt enabled
Bit 6 SPIMODE = 1 Configures SPI for 16-bit mode
Bit 5 = 0 Unimplemented
Bit 4 MODFEN = 0 Disables mode fault function
Bit 3 BIDIROE = 0 SPI data I/O pin acts as input
Bit 2 = 0 Unimplemented
Bit 1 SPISWAI = 0 SPI clocks operate in wait mode
Bit 0 SPC0 = 0 uses separate pins for data input and output
SPIxBR = 0x00(%00000000)
Bit 7 = 0 Unimplemented
Bit 6:4 = 000 Sets prescale divisor to 1
Bit 3 = 0 Unimplemented
Bit 2:0 = 000 Sets baud rate divisor to 2
SPIxS = 0x00(%00000000)
Bit 7 SPRF = 0 Flag is set when receive data buffer is full
Bit 6 SPMF = 0 Flag is set when SPIMH/L = receive data buffer
Bit 5 SPTEF = 0 Flag is set when transmit data buffer is empty
Bit 4 MODF = 0 Mode fault flag for master mode
Bit 3:0 = 0 Unimplemented
SPIxMH = 0xXX
In 16-bit mode, this register holds bits 8–15 of the hardware match buffer. In 8-bit mode, writes to this register will be
ignored.
SPIxML = 0xXX
Holds bits 0–7 of the hardware match buffer.
SPIxDH = 0xxx
In 16-bit mode, this register holds bits 8–15 of the data to be transmitted by the transmit buffer and received by the
receive buffer.
SPIxDL = 0xxx
Holds bits 0–7 of the data to be transmitted by the transmit buffer and received by the receive buffer.
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 269
Figure 15-16. Initialization Flowchart Example for SPI Master Device in 16-bit Mode
INITIALIZE SPI
SPIxC1 = 0x54
SPIxC2 = 0xC0
SPIxBR = 0x00
SPIxMH = 0xXX
RESET
YES
READ SPMF WHILE SET
TO CLEAR FLAG,
THEN WRITE A 1 TO IT
CONTINUE
SPMF = 1
?
READ
SPIxDH:SPIxDL
SPRF = 1
?
WRITE TO
SPIxDH:SPIxDL
SPTEF = 1
?
NO
NO
NO
YES
YES
YES
Serial Peripheral Interface (S08SPI16V1)
MC9S08JM60 Series Data Sheet, Rev. 3
270 Freescale Semiconductor
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 271
Chapter 16
Timer/Pulse-Width Modulator (S08TPMV3)
16.1 Introduction
The MC9S08JM60 series includes two independent timer/PWM (TPM) modules which support traditional
input capture, output compare, or buffered edge-aligned pulse-width modulation (PWM) on each channel.
A control bit in each TPM configures all channels in that timer to operate as center-aligned PWM
functions. In each of these two TPMs, timing functions are based on a separate 16-bit counter with
prescaler and modulo features to control frequency and range (period between overflows) of the time
reference.
Chapter 16 Timer/Pulse-Width Modulator (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
272 Freescale Semiconductor
Figure 16-1. MC9S08JM60 Series Block Diagram Highlighting the TPM Blocks and Pins
PTD4/ADP11
PTD5
PTD6
PTC1/SDA
PTC0/SCL
VSS
VDD
PTA5– PTA0
PTE0/TxD1
PTE1/RxD1
PTD1/ADP9/ACMP–
PTD0/ADP8/ACMP+
PTC6
PTC5/RxD2
PTC4
PTC3/TxD2
PTC2
PORT A
PORT C
PORT D
8-BIT KEYBOARD
INTERRUPT MODULE (KBI)
IIC MODULE (IIC)
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
USER Flash (IN BYTES)
USER RAM (IN BYTES)
ON-CHIP ICE AND
DEBUG MODULE (DBG)
MC9S08JM60 = 60,912
HCS08 CORE
CPUBDC
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pull-down device if IRQ is enabled
(IRQPE = 1). Pull-down is enabled if rising edge detect is selected (IRQEDG = 1)
3. IRQ does not have a clamp diode to VDD. IRQ must not be driven above VDD.
4. Pin contains integrated pullup device.
5. When pin functions as KBI (KBIPEn = 1) and associated pin is configured to enable the
pullup device, KBEDGn can be used to reconfigure the pullup as a pull-down device.
PTB5/KBIP5/ADP5
PORT B
PTE5/MOSI1
PTE4/MISO1
PTE6/SPSCK1
PTE7/SS1
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
VOLTAGE
REGULATOR
COP IRQ LVD
LOW-POWER OSCILLATOR
MULTI-PURPOSE CLOCK
GENERATOR (MCG)
RESET
VSSAD
VDDAD
VREFH
ANALOG-TO-DIGITAL
CONVERTER (ADC)
PTD7
6
PTB4/KBIP4/ADP4
PTG3/KBIP7
PTG2/KBIP6
PORT G
12-CHANNEL, 12-BIT
BKGD/MS
PTF6
PTF7
INTERFACE MODULE (SCI1)
SERIAL COMMUNICATIONS
INTERFACE MODULE (SCI2)
SERIAL COMMUNICATIONS
PTG0/KBIP0
PTG1/KBIP1
MC9S08JM32 = 32,768
VREFL
PTG4/XTAL
PTG5/EXTAL
IRQ/TPMCLK RxD2
TxD2
SDA
SCL
8
KBIPx
KBIPx
SPSCK1
SS1
MISO1
MOSI1
RxD1
TxD1
EXTAL
XTAL
4
4
USB SIE
USB ENDPOINT
RAM
FULL SPEED
USB
TRANSCEIVER
USBDP
USBDN
MISO2
SS2
SPSCK2
MOSI2 PTB1/MOSI2/ADP1
PTB0/MISO2/ADP0
PTB7/ADP7
PTB6/ADP6
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI2)
REAL-TIME COUNTER
(RTC)
PTB3/SS2/ADP3
PTB2/SPSCK2/ADP2
4
4
ANALOG COMPARATOR
(ACMP)
SYSTEM
USB 3.3-V VOLTAGE REGULATOR
VUSB33
MC9S08JM60 = 4096
MC9S08JM32 = 2048
ACMPO
ACMP+
ACMP–
PTD3/KBIP3/ADP10
PTD2/KBIP2/ACMPO
V
SSOSC
PTE3/TPM1CH1
PTE2/TPM1CH0
PORT E
2-CHANNEL TIMER/PWM
MODULE (TPM2)
6-CHANNEL TIMER/PWM
MODULE (TPM1)
PTF3/TPM1CH5
PTF2/TPM1CH4
PTF0/TPM1CH2
PTF1/TPM1CH3
PORT F
PTF5/TPM2CH1
PTF4/TPM2CH0
TPMCLK
TPMCLK
TPM1CH1
TPM1CH0
TPM1CHx
TPM2CH1
TPM2CH0
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 273
16.1.1 Features
The TPM includes these distinctive features:
• One to eight channels:
— Each channel may be input capture, output compare, or edge-aligned PWM
— Rising-Edge, falling-edge, or any-edge input capture trigger
— Set, clear, or toggle output compare action
— Selectable polarity on PWM outputs
• Module may be configured for buffered, center-aligned pulse-width-modulation (CPWM) on all
channels
• Timer clock source selectable as prescaled bus clock, fixed system clock, or an external clock pin
— Prescale taps for divide-by 1, 2, 4, 8, 16, 32, 64, or 128
— Fixed system clock source are synchronized to the bus clock by an on-chip synchronization
circuit
— External clock pin may be shared with any timer channel pin or a separated input pin
• 16-bit free-running or modulo up/down count operation
• Timer system enable
• One interrupt per channel plus terminal count interrupt
16.1.2 Modes of Operation
In general, TPM channels may be independently configured to operate in input capture, output compare,
or edge-aligned PWM modes. A control bit allows the whole TPM (all channels) to switch to
center-aligned PWM mode. When center-aligned PWM mode is selected, input capture, output compare,
and edge-aligned PWM functions are not available on any channels of this TPM module.
When the microcontroller is in active BDM background or BDM foreground mode, the TPM temporarily
suspends all counting until the microcontroller returns to normal user operating mode. During stop mode,
all system clocks, including the main oscillator, are stopped; therefore, the TPM is effectively disabled
until clocks resume. During wait mode, the TPM continues to operate normally. Provided the TPM does
not need to produce a real time reference or provide the interrupt source(s) needed to wake the MCU from
wait mode, the user can save power by disabling TPM functions before entering wait mode.
• Input capture mode
When a selected edge event occurs on the associated MCU pin, the current value of the 16-bit timer
counter is captured into the channel value register and an interrupt flag bit is set. Rising edges,
falling edges, any edge, or no edge (disable channel) may be selected as the active edge which
triggers the input capture.
• Output compare mode
When the value in the timer counter register matches the channel value register, an interrupt flag
bit is set, and a selected output action is forced on the associated MCU pin. The output compare
action may be selected to force the pin to zero, force the pin to one, toggle the pin, or ignore the
pin (used for software timing functions).
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
274 Freescale Semiconductor
• Edge-aligned PWM mode
The value of a 16-bit modulo register plus 1 sets the period of the PWM output signal. The channel
value register sets the duty cycle of the PWM output signal. The user may also choose the polarity
of the PWM output signal. Interrupts are available at the end of the period and at the duty-cycle
transition point. This type of PWM signal is called edge-aligned because the leading edges of all
PWM signals are aligned with the beginning of the period, which is the same for all channels within
a TPM.
• Center-aligned PWM mode
Twice the value of a 16-bit modulo register sets the period of the PWM output, and the
channel-value register sets the half-duty-cycle duration. The timer counter counts up until it
reaches the modulo value and then counts down until it reaches zero. As the count matches the
channel value register while counting down, the PWM output becomes active. When the count
matches the channel value register while counting up, the PWM output becomes inactive. This type
of PWM signal is called center-aligned because the centers of the active duty cycle periods for all
channels are aligned with a count value of zero. This type of PWM is required for types of motors
used in small appliances.
This is a high-level description only. Detailed descriptions of operating modes are in later sections.
16.1.3 Block Diagram
The TPM uses one input/output (I/O) pin per channel, TPMxCHn (timer channel n) where n is the channel
number (1-8). The TPM shares its I/O pins with general purpose I/O port pins (refer to I/O pin descriptions
in full-chip specification for the specific chip implementation).
Figure 16-2 shows the TPM structure. The central component of the TPM is the 16-bit counter that can
operate as a free-running counter or a modulo up/down counter. The TPM counter (when operating in
normal up-counting mode) provides the timing reference for the input capture, output compare, and
edge-aligned PWM functions. The timer counter modulo registers, TPMxMODH:TPMxMODL, control
the modulo value of the counter (the values 0x0000 or 0xFFFF effectively make the counter free running).
Software can read the counter value at any time without affecting the counting sequence. Any write to
either half of the TPMxCNT counter resets the counter, regardless of the data value written.
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 275
Figure 16-2. TPM Block Diagram
PRESCALE AND SELECT
16-BIT COMPARATOR
PS2:PS1:PS0
TOF
TOIE
INTER-
16-BIT COUNTER
RUPT
LOGIC
16-BIT COMPARATOR
16-BIT LATCH
ELS0B ELS0A PORT
CHANNEL 0
CH0IE
CH0F
LOGIC
INTER-
RUPT
LOGIC
CPWMS
MS0B MS0A
COUNTER RESET
CLKSB:CLKSA
³1, 2, 4, 8, 16, 32, 64,
BUS CLOCK
FIXED SYSTEM CLOCK
EXTERNAL CLOCK SYNC
16-BIT COMPARATOR
16-BIT LATCH
CHANNEL 1 ELS1B ELS1A
CH1IE
CH1F
INTERNAL BUS
PORT
LOGIC
INTER-
RUPT
LOGIC
MS1B MS1A
16-BIT COMPARATOR
16-BIT LATCH
CHANNEL 7 ELS7B ELS7A
CH7IE
CH7F
PORT
LOGIC
INTER-
RUPT
LOGIC
MS7B MS7A
Up to 8 channels
CLOCK SOURCE
SELECT
OFF, BUS, FIXED
SYSTEM CLOCK, EXT or ³128
TPMxMODH:TPMxMODL
TPMxC0VH:TPMxC0VL
TPMxC1VH:TPMxC1VL
TPMxCH0
TPMxCH1
TPMxC7VH:TPMxC7VL
TPMxCH7
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
276 Freescale Semiconductor
The TPM channels are programmable independently as input capture, output compare, or edge-aligned
PWM channels. Alternately, the TPM can be configured to produce CPWM outputs on all channels. When
the TPM is configured for CPWMs, the counter operates as an up/down counter; input capture, output
compare, and EPWM functions are not practical.
If a channel is configured as input capture, an internal pullup device may be enabled for that channel. The
details of how a module interacts with pin controls depends upon the chip implementation because the I/O
pins and associated general purpose I/O controls are not part of the module. Refer to the discussion of the
I/O port logic in a full-chip specification.
Because center-aligned PWMs are usually used to drive 3-phase AC-induction motors and brushless DC
motors, they are typically used in sets of three or six channels.
16.2 Signal Description
Table 16-1 shows the user-accessible signals for the TPM. The number of channels may be varied from
one to eight. When an external clock is included, it can be shared with the same pin as any TPM channel;
however, it could be connected to a separate input pin. Refer to the I/O pin descriptions in full-chip
specification for the specific chip implementation.
Refer to documentation for the full-chip for details about reset states, port connections, and whether there
is any pullup device on these pins.
TPM channel pins can be associated with general purpose I/O pins and have passive pullup devices which
can be enabled with a control bit when the TPM or general purpose I/O controls have configured the
associated pin as an input. When no TPM function is enabled to use a corresponding pin, the pin reverts
to being controlled by general purpose I/O controls, including the port-data and data-direction registers.
Immediately after reset, no TPM functions are enabled, so all associated pins revert to general purpose I/O
control.
16.2.1 Detailed Signal Descriptions
This section describes each user-accessible pin signal in detail. Although Table 16-1 grouped all channel
pins together, any TPM pin can be shared with the external clock source signal. Since I/O pin logic is not
part of the TPM, refer to full-chip documentation for a specific derivative for more details about the
interaction of TPM pin functions and general purpose I/O controls including port data, data direction, and
pullup controls.
Table 16-1. Signal Properties
Name Function
EXTCLK1
1When preset, this signal can share any channel pin; however depending upon full-chip
implementation, this signal could be connected to a separate external pin.
External clock source which may be selected to drive the TPM counter.
TPMxCHn2
2n=channel number (1 to 8)
I/O pin associated with TPM channel n
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 277
16.2.1.1 EXTCLK — External Clock Source
Control bits in the timer status and control register allow the user to select nothing (timer disable), the
bus-rate clock (the normal default source), a crystal-related clock, or an external clock as the clock which
drives the TPM prescaler and subsequently the 16-bit TPM counter. The external clock source is
synchronized in the TPM. The bus clock clocks the synchronizer; the frequency of the external source must
be no more than one-fourth the frequency of the bus-rate clock, to meet Nyquist criteria and allowing for
jitter.
The external clock signal shares the same pin as a channel I/O pin, so the channel pin will not be usable
for channel I/O function when selected as the external clock source. It is the user’s responsibility to avoid
such settings. If this pin is used as an external clock source (CLKSB:CLKSA = 1:1), the channel can still
be used in output compare mode as a software timer (ELSnB:ELSnA = 0:0).
16.2.1.2 TPMxCHn — TPM Channel n I/O Pin(s)
Each TPM channel is associated with an I/O pin on the MCU. The function of this pin depends on the
channel configuration. The TPM pins share with general purpose I/O pins, where each pin has a port data
register bit, and a data direction control bit, and the port has optional passive pullups which may be enabled
whenever a port pin is acting as an input.
The TPM channel does not control the I/O pin when (ELSnB:ELSnA = 0:0) or when (CLKSB:CLKSA =
0:0) so it normally reverts to general purpose I/O control. When CPWMS = 1 (and ELSnB:ELSnA not =
0:0), all channels within the TPM are configured for center-aligned PWM and the TPMxCHn pins are all
controlled by the TPM system. When CPWMS=0, the MSnB:MSnA control bits determine whether the
channel is configured for input capture, output compare, or edge-aligned PWM.
When a channel is configured for input capture (CPWMS=0, MSnB:MSnA = 0:0 and ELSnB:ELSnA not
= 0:0), the TPMxCHn pin is forced to act as an edge-sensitive input to the TPM. ELSnB:ELSnA control
bits determine what polarity edge or edges will trigger input-capture events. A synchronizer based on the
bus clock is used to synchronize input edges to the bus clock. This implies the minimum pulse width—that
can be reliably detected—on an input capture pin is four bus clock periods (with ideal clock pulses as near
as two bus clocks can be detected). TPM uses this pin as an input capture input to override the port data
and data direction controls for the same pin.
When a channel is configured for output compare (CPWMS=0, MSnB:MSnA = 0:1 and ELSnB:ELSnA
not = 0:0), the associated data direction control is overridden, the TPMxCHn pin is considered an output
controlled by the TPM, and the ELSnB:ELSnA control bits determine how the pin is controlled. The
remaining three combinations of ELSnB:ELSnA determine whether the TPMxCHn pin is toggled, cleared,
or set each time the 16-bit channel value register matches the timer counter.
When the output compare toggle mode is initially selected, the previous value on the pin is driven out until
the next output compare event—then the pin is toggled.
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
278 Freescale Semiconductor
When a channel is configured for edge-aligned PWM (CPWMS=0, MSnB=1 and ELSnB:ELSnA not =
0:0), the data direction is overridden, the TPMxCHn pin is forced to be an output controlled by the TPM,
and ELSnA controls the polarity of the PWM output signal on the pin. When ELSnB:ELSnA=1:0, the
TPMxCHn pin is forced high at the start of each new period (TPMxCNT=0x0000), and the pin is forced
low when the channel value register matches the timer counter. When ELSnA=1, the TPMxCHn pin is
forced low at the start of each new period (TPMxCNT=0x0000), and the pin is forced high when the
channel value register matches the timer counter.
Figure 16-3. High-True Pulse of an Edge-Aligned PWM
Figure 16-4. Low-True Pulse of an Edge-Aligned PWM
CHnF BIT
TOF BIT
0... 123456780 12...
TPMxMODH:TPMxMODL = 0x0008
TPMxCnVH:TPMxCnVL = 0x0005
TPMxCNTH:TPMxCNTL
TPMxCHn
CHnF BIT
TOF BIT
0... 123456780 12...
TPMxMODH:TPMxMODL = 0x0008
TPMxCnVH:TPMxCnVL = 0x0005
TPMxCNTH:TPMxCNTL
TPMxCHn
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 279
When the TPM is configured for center-aligned PWM (and ELSnB:ELSnA not = 0:0), the data direction
for all channels in this TPM are overridden, the TPMxCHn pins are forced to be outputs controlled by the
TPM, and the ELSnA bits control the polarity of each TPMxCHn output. If ELSnB:ELSnA=1:0, the
corresponding TPMxCHn pin is cleared when the timer counter is counting up, and the channel value
register matches the timer counter; the TPMxCHn pin is set when the timer counter is counting down, and
the channel value register matches the timer counter. If ELSnA=1, the corresponding TPMxCHn pin is set
when the timer counter is counting up and the channel value register matches the timer counter; the
TPMxCHn pin is cleared when the timer counter is counting down and the channel value register matches
the timer counter.
Figure 16-5. High-True Pulse of a Center-Aligned PWM
Figure 16-6. Low-True Pulse of a Center-Aligned PWM
CHnF BIT
TOF BIT
... 787654321 012 345678 76 5 ...
TPMxMODH:TPMxMODL = 0x0008
TPMxCnVH:TPMxCnVL = 0x0005
TPMxCNTH:TPMxCNTL
TPMxCHn
CHnF BIT
TOF BIT
... 787654321 012 345678 76 5...
TPMxMODH:TPMxMODL = 0x0008
TPMxCnVH:TPMxCnVL = 0x0005
TPMxCNTH:TPMxCNTL
TPMxCHn
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
280 Freescale Semiconductor
16.3 Register Definition
This section consists of register descriptions in address order. A typical MCU system may contain multiple
TPMs, and each TPM may have one to eight channels, so register names include placeholder characters to
identify which TPM and which channel is being referenced. For example, TPMxCnSC refers to timer
(TPM) x, channel n. TPM1C2SC would be the status and control register for channel 2 of timer 1.
16.3.1 TPM Status and Control Register (TPMxSC)
TPMxSC contains the overflow status flag and control bits used to configure the interrupt enable, TPM
configuration, clock source, and prescale factor. These controls relate to all channels within this timer
module.
76543210
RTOF
TOIE CPWMS CLKSB CLKSA PS2 PS1 PS0
W0
Reset00000000
Figure 16-7. TPM Status and Control Register (TPMxSC)
Table 16-2. TPMxSC Field Descriptions
Field Description
7
TOF
Timer overflow flag. This read/write flag is set when the TPM counter resets to 0x0000 after reaching the modulo
value programmed in the TPM counter modulo registers. Clear TOF by reading the TPM status and control
register when TOF is set and then writing a logic 0 to TOF. If another TPM overflow occurs before the clearing
sequence is complete, the sequence is reset so TOF would remain set after the clear sequence was completed
for the earlier TOF. This is done so a TOF interrupt request cannot be lost during the clearing sequence for a
previous TOF. Reset clears TOF. Writing a logic 1 to TOF has no effect.
0 TPM counter has not reached modulo value or overflow
1 TPM counter has overflowed
6
TOIE
Timer overflow interrupt enable. This read/write bit enables TPM overflow interrupts. If TOIE is set, an interrupt is
generated when TOF equals one. Reset clears TOIE.
0 TOF interrupts inhibited (use for software polling)
1 TOF interrupts enabled
5
CPWMS
Center-aligned PWM select. When present, this read/write bit selects CPWM operating mode. By default, the TPM
operates in up-counting mode for input capture, output compare, and edge-aligned PWM functions. Setting
CPWMS reconfigures the TPM to operate in up/down counting mode for CPWM functions. Reset clears CPWMS.
0 All channels operate as input capture, output compare, or edge-aligned PWM mode as selected by the
MSnB:MSnA control bits in each channel’s status and control register.
1 All channels operate in center-aligned PWM mode.
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 281
16.3.2 TPM-Counter Registers (TPMxCNTH:TPMxCNTL)
The two read-only TPM counter registers contain the high and low bytes of the value in the TPM counter.
Reading either byte (TPMxCNTH or TPMxCNTL) latches the contents of both bytes into a buffer where
they remain latched until the other half is read. This allows coherent 16-bit reads in either big-endian or
little-endian order which makes this more friendly to various compiler implementations. The coherency
mechanism is automatically restarted by an MCU reset or any write to the timer status/control register
(TPMxSC).
Reset clears the TPM counter registers. Writing any value to TPMxCNTH or TPMxCNTL also clears the
TPM counter (TPMxCNTH:TPMxCNTL) and resets the coherency mechanism, regardless of the data
involved in the write.
4–3
CLKS[B:A]
Clock source selects. As shown in Table 16-3, this 2-bit field is used to disable the TPM system or select one of
three clock sources to drive the counter prescaler. The fixed system clock source is only meaningful in systems
with a PLL-based system clock. When there is no PLL, the fixed-system clock source is the same as the bus rate
clock. The external source is synchronized to the bus clock by TPM module, and the fixed system clock source
(when a PLL is present) is synchronized to the bus clock by an on-chip synchronization circuit. When a PLL is
present but not enabled, the fixed-system clock source is the same as the bus-rate clock.
2–0
PS[2:0]
Prescale factor select. This 3-bit field selects one of 8 division factors for the TPM clock input as shown in
Ta b le 1 6 - 4. This prescaler is located after any clock source synchronization or clock source selection so it affects
the clock source selected to drive the TPM system. The new prescale factor will affect the clock source on the
next system clock cycle after the new value is updated into the register bits.
Table 16-3. TPM-Clock-Source Selection
CLKSB:CLKSA TPM Clock Source to Prescaler Input
00 No clock selected (TPM counter disable)
01 Bus rate clock
10 Fixed system clock
11 External source
Table 16-4. Prescale Factor Selection
PS2:PS1:PS0 TPM Clock Source Divided-by
000 1
001 2
010 4
011 8
100 16
101 32
110 64
111 128
Table 16-2. TPMxSC Field Descriptions (continued)
Field Description
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
282 Freescale Semiconductor
When BDM is active, the timer counter is frozen (this is the value that will be read by user); the coherency
mechanism is frozen such that the buffer latches remain in the state they were in when the BDM became
active, even if one or both counter halves are read while BDM is active. This assures that if the user was
in the middle of reading a 16-bit register when BDM became active, it will read the appropriate value from
the other half of the 16-bit value after returning to normal execution.
In BDM mode, writing any value to TPMxSC, TPMxCNTH or TPMxCNTL registers resets the read
coherency mechanism of the TPMxCNTH:L registers, regardless of the data involved in the write.
16.3.3 TPM Counter Modulo Registers (TPMxMODH:TPMxMODL)
The read/write TPM modulo registers contain the modulo value for the TPM counter. After the TPM
counter reaches the modulo value, the TPM counter resumes counting from 0x0000 at the next clock, and
the overflow flag (TOF) becomes set. Writing to TPMxMODH or TPMxMODL inhibits the TOF bit and
overflow interrupts until the other byte is written. Reset sets the TPM counter modulo registers to 0x0000
which results in a free running timer counter (modulo disabled).
Writing to either byte (TPMxMODH or TPMxMODL) latches the value into a buffer and the registers are
updated with the value of their write buffer according to the value of CLKSB:CLKSA bits, so:
• If (CLKSB:CLKSA = 0:0), then the registers are updated when the second byte is written
• If (CLKSB:CLKSA not = 0:0), then the registers are updated after both bytes were written, and the
TPM counter changes from (TPMxMODH:TPMxMODL - 1) to (TPMxMODH:TPMxMODL). If
the TPM counter is a free-running counter, the update is made when the TPM counter changes from
0xFFFE to 0xFFFF
The latching mechanism may be manually reset by writing to the TPMxSC address (whether BDM is
active or not).
When BDM is active, the coherency mechanism is frozen (unless reset by writing to TPMxSC register)
such that the buffer latches remain in the state they were in when the BDM became active, even if one or
both halves of the modulo register are written while BDM is active. Any write to the modulo registers
bypasses the buffer latches and directly writes to the modulo register while BDM is active.
76543210
R Bit 15 14 13 12 11 10 9 Bit 8
W Any write to TPMxCNTH clears the 16-bit counter
Reset00000000
Figure 16-8. TPM Counter Register High (TPMxCNTH)
76543210
RBit 7654321Bit 0
W Any write to TPMxCNTL clears the 16-bit counter
Reset00000000
Figure 16-9. TPM Counter Register Low (TPMxCNTL)
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 283
Reset the TPM counter before writing to the TPM modulo registers to avoid confusion about when the first
counter overflow will occur.
16.3.4 TPM Channel n Status and Control Register (TPMxCnSC)
TPMxCnSC contains the channel-interrupt-status flag and control bits used to configure the interrupt
enable, channel configuration, and pin function.
76543210
R
Bit 15 14 13 12 11 10 9 Bit 8
W
Reset00000000
Figure 16-10. TPM Counter Modulo Register High (TPMxMODH)
76543210
R
Bit 7654321Bit 0
W
Reset00000000
Figure 16-11. TPM Counter Modulo Register Low (TPMxMODL)
76543210
RCHnF
CHnIE MSnB MSnA ELSnB ELSnA
00
W0
Reset00000000
= Unimplemented or Reserved
Figure 16-12. TPM Channel n Status and Control Register (TPMxCnSC)
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
284 Freescale Semiconductor
Table 16-5. TPMxCnSC Field Descriptions
Field Description
7
CHnF
Channel n flag. When channel n is an input-capture channel, this read/write bit is set when an active edge occurs
on the channel n pin. When channel n is an output compare or edge-aligned/center-aligned PWM channel, CHnF
is set when the value in the TPM counter registers matches the value in the TPM channel n value registers. When
channel n is an edge-aligned/center-aligned PWM channel and the duty cycle is set to 0% or 100%, CHnF will not
be set even when the value in the TPM counter registers matches the value in the TPM channel n value registers.
A corresponding interrupt is requested when CHnF is set and interrupts are enabled (CHnIE = 1). Clear CHnF by
reading TPMxCnSC while CHnF is set and then writing a logic 0 to CHnF. If another interrupt request occurs
before the clearing sequence is complete, the sequence is reset so CHnF remains set after the clear sequence
completed for the earlier CHnF. This is done so a CHnF interrupt request cannot be lost due to clearing a previous
CHnF.
Reset clears the CHnF bit. Writing a logic 1 to CHnF has no effect.
0 No input capture or output compare event occurred on channel n
1 Input capture or output compare event on channel n
6
CHnIE
Channel n interrupt enable. This read/write bit enables interrupts from channel n. Reset clears CHnIE.
0 Channel n interrupt requests disabled (use for software polling)
1 Channel n interrupt requests enabled
5
MSnB
Mode select B for TPM channel n. When CPWMS=0, MSnB=1 configures TPM channel n for edge-aligned PWM
mode. Refer to the summary of channel mode and setup controls in Table 16-6.
4
MSnA
Mode select A for TPM channel n. When CPWMS=0 and MSnB=0, MSnA configures TPM channel n for
input-capture mode or output compare mode. Refer to Table 1 6 -6 for a summary of channel mode and setup
controls.
Note: If the associated port pin is not stable for at least two bus clock cycles before changing to input capture
mode, it is possible to get an unexpected indication of an edge trigger.
3–2
ELSnB
ELSnA
Edge/level select bits. Depending upon the operating mode for the timer channel as set by CPWMS:MSnB:MSnA
and shown in Table 16-6, these bits select the polarity of the input edge that triggers an input capture event, select
the level that will be driven in response to an output compare match, or select the polarity of the PWM output.
Setting ELSnB:ELSnA to 0:0 configures the related timer pin as a general purpose I/O pin not related to any timer
functions. This function is typically used to temporarily disable an input capture channel or to make the timer pin
available as a general purpose I/O pin when the associated timer channel is set up as a software timer that does
not require the use of a pin.
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 285
16.3.5 TPM Channel Value Registers (TPMxCnVH:TPMxCnVL)
These read/write registers contain the captured TPM counter value of the input capture function or the
output compare value for the output compare or PWM functions. The channel registers are cleared by
reset.
Table 16-6. Mode, Edge, and Level Selection
CPWMS MSnB:MSnA ELSnB:ELSnA Mode Configuration
X XX 00 Pin not used for TPM - revert to general
purpose I/O or other peripheral control
0 00 01 Input capture Capture on rising edge
only
10 Capture on falling edge
only
11 Capture on rising or
falling edge
01 01 Output compare Toggle output on
compare
10 Clear output on
compare
11 Set output on compare
1X 10 Edge-aligned
PWM
High-true pulses (clear
output on compare)
X1 Low-true pulses (set
output on compare)
1 XX 10 Center-aligned
PWM
High-true pulses (clear
output on compare-up)
X1 Low-true pulses (set
output on compare-up)
76543210
R
Bit 15 14 13 12 11 10 9 Bit 8
W
Reset00000000
Figure 16-13. TPM Channel Value Register High (TPMxCnVH)
76543210
R
Bit 7654321Bit 0
W
Reset00000000
Figure 16-14. TPM Channel Value Register Low (TPMxCnVL)
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
286 Freescale Semiconductor
In input capture mode, reading either byte (TPMxCnVH or TPMxCnVL) latches the contents of both bytes
into a buffer where they remain latched until the other half is read. This latching mechanism also resets
(becomes unlatched) when the TPMxCnSC register is written (whether BDM mode is active or not). Any
write to the channel registers will be ignored during the input capture mode.
When BDM is active, the coherency mechanism is frozen (unless reset by writing to TPMxCnSC register)
such that the buffer latches remain in the state they were in when the BDM became active, even if one or
both halves of the channel register are read while BDM is active. This assures that if the user was in the
middle of reading a 16-bit register when BDM became active, it will read the appropriate value from the
other half of the 16-bit value after returning to normal execution. The value read from the TPMxCnVH
and TPMxCnVL registers in BDM mode is the value of these registers and not the value of their read
buffer.
In output compare or PWM modes, writing to either byte (TPMxCnVH or TPMxCnVL) latches the value
into a buffer. After both bytes are written, they are transferred as a coherent 16-bit value into the
timer-channel registers according to the value of CLKSB:CLKSA bits and the selected mode, so:
• If (CLKSB:CLKSA = 0:0), then the registers are updated when the second byte is written.
• If (CLKSB:CLKSA not = 0:0 and in output compare mode) then the registers are updated after the
second byte is written and on the next change of the TPM counter (end of the prescaler counting).
• If (CLKSB:CLKSA not = 0:0 and in EPWM or CPWM modes), then the registers are updated after
the both bytes were written, and the TPM counter changes from (TPMxMODH:TPMxMODL - 1)
to (TPMxMODH:TPMxMODL). If the TPM counter is a free-running counter then the update is
made when the TPM counter changes from 0xFFFE to 0xFFFF.
The latching mechanism may be manually reset by writing to the TPMxCnSC register (whether BDM
mode is active or not). This latching mechanism allows coherent 16-bit writes in either big-endian or
little-endian order which is friendly to various compiler implementations.
When BDM is active, the coherency mechanism is frozen such that the buffer latches remain in the state
they were in when the BDM became active even if one or both halves of the channel register are written
while BDM is active. Any write to the channel registers bypasses the buffer latches and directly write to
the channel register while BDM is active. The values written to the channel register while BDM is active
are used for PWM & output compare operation once normal execution resumes. Writes to the channel
registers while BDM is active do not interfere with partial completion of a coherency sequence. After the
coherency mechanism has been fully exercised, the channel registers are updated using the buffered values
written (while BDM was not active) by the user.
16.4 Functional Description
All TPM functions are associated with a central 16-bit counter which allows flexible selection of the clock
source and prescale factor. There is also a 16-bit modulo register associated with the main counter.
The CPWMS control bit chooses between center-aligned PWM operation for all channels in the TPM
(CPWMS=1) or general purpose timing functions (CPWMS=0) where each channel can independently be
configured to operate in input capture, output compare, or edge-aligned PWM mode. The CPWMS control
bit is located in the main TPM status and control register because it affects all channels within the TPM
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 287
and influences the way the main counter operates. (In CPWM mode, the counter changes to an up/down
mode rather than the up-counting mode used for general purpose timer functions.)
The following sections describe the main counter and each of the timer operating modes (input capture,
output compare, edge-aligned PWM, and center-aligned PWM). Because details of pin operation and
interrupt activity depend upon the operating mode, these topics will be covered in the associated mode
explanation sections.
16.4.1 Counter
All timer functions are based on the main 16-bit counter (TPMxCNTH:TPMxCNTL). This section
discusses selection of the clock source, end-of-count overflow, up-counting vs. up/down counting, and
manual counter reset.
16.4.1.1 Counter Clock Source
The 2-bit field, CLKSB:CLKSA, in the timer status and control register (TPMxSC) selects one of three
possible clock sources or OFF (which effectively disables the TPM). See Table 16-3. After any MCU reset,
CLKSB:CLKSA=0:0 so no clock source is selected, and the TPM is in a very low power state. These
control bits may be read or written at any time and disabling the timer (writing 00 to the CLKSB:CLKSA
field) does not affect the values in the counter or other timer registers.
The bus rate clock is the main system bus clock for the MCU. This clock source requires no
synchronization because it is the clock that is used for all internal MCU activities including operation of
the CPU and buses.
In MCUs that have no PLL or the PLL is not engaged, the fixed system clock source is the same as the
bus-rate-clock source, and it does not go through a synchronizer. When a PLL is present and engaged, a
synchronizer is required between the crystal divided-by two clock source and the timer counter so counter
transitions will be properly aligned to bus-clock transitions. A synchronizer will be used at chip level to
synchronize the crystal-related source clock to the bus clock.
The external clock source may be connected to any TPM channel pin. This clock source always has to pass
through a synchronizer to assure that counter transitions are properly aligned to bus clock transitions. The
bus-rate clock drives the synchronizer; therefore, to meet Nyquist criteria even with jitter, the frequency
of the external clock source must not be faster than the bus rate divided-by four. With ideal clocks the
external clock can be as fast as bus clock divided by four.
Table 16-7. TPM Clock Source Selection
CLKSB:CLKSA TPM Clock Source to Prescaler Input
00 No clock selected (TPM counter disabled)
01 Bus rate clock
10 Fixed system clock
11 External source
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
288 Freescale Semiconductor
When the external clock source shares the TPM channel pin, this pin should not be used for other channel
timing functions. For example, it would be ambiguous to configure channel 0 for input capture when the
TPM channel 0 pin was also being used as the timer external clock source. (It is the user’s responsibility
to avoid such settings.) The TPM channel could still be used in output compare mode for software timing
functions (pin controls set not to affect the TPM channel pin).
16.4.1.2 Counter Overflow and Modulo Reset
An interrupt flag and enable are associated with the 16-bit main counter. The flag (TOF) is a
software-accessible indication that the timer counter has overflowed. The enable signal selects between
software polling (TOIE=0) where no hardware interrupt is generated, or interrupt-driven operation
(TOIE=1) where a static hardware interrupt is generated whenever the TOF flag is equal to one.
The conditions causing TOF to become set depend on whether the TPM is configured for center-aligned
PWM (CPWMS=1). In the simplest mode, there is no modulus limit and the TPM is not in CPWMS=1
mode. In this case, the 16-bit timer counter counts from 0x0000 through 0xFFFF and overflows to 0x0000
on the next counting clock. TOF becomes set at the transition from 0xFFFF to 0x0000. When a modulus
limit is set, TOF becomes set at the transition from the value set in the modulus register to 0x0000. When
the TPM is in center-aligned PWM mode (CPWMS=1), the TOF flag gets set as the counter changes
direction at the end of the count value set in the modulus register (that is, at the transition from the value
set in the modulus register to the next lower count value). This corresponds to the end of a PWM period
(the 0x0000 count value corresponds to the center of a period).
16.4.1.3 Counting Modes
The main timer counter has two counting modes. When center-aligned PWM is selected (CPWMS=1), the
counter operates in up/down counting mode. Otherwise, the counter operates as a simple up counter. As
an up counter, the timer counter counts from 0x0000 through its terminal count and then continues with
0x0000. The terminal count is 0xFFFF or a modulus value in TPMxMODH:TPMxMODL.
When center-aligned PWM operation is specified, the counter counts up from 0x0000 through its terminal
count and then down to 0x0000 where it changes back to up counting. Both 0x0000 and the terminal count
value are normal length counts (one timer clock period long). In this mode, the timer overflow flag (TOF)
becomes set at the end of the terminal-count period (as the count changes to the next lower count value).
16.4.1.4 Manual Counter Reset
The main timer counter can be manually reset at any time by writing any value to either half of
TPMxCNTH or TPMxCNTL. Resetting the counter in this manner also resets the coherency mechanism
in case only half of the counter was read before resetting the count.
16.4.2 Channel Mode Selection
Provided CPWMS=0, the MSnB and MSnA control bits in the channel n status and control registers
determine the basic mode of operation for the corresponding channel. Choices include input capture,
output compare, and edge-aligned PWM.
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 289
16.4.2.1 Input Capture Mode
With the input-capture function, the TPM can capture the time at which an external event occurs. When
an active edge occurs on the pin of an input-capture channel, the TPM latches the contents of the TPM
counter into the channel-value registers (TPMxCnVH:TPMxCnVL). Rising edges, falling edges, or any
edge may be chosen as the active edge that triggers an input capture.
In input capture mode, the TPMxCnVH and TPMxCnVL registers are read only.
When either half of the 16-bit capture register is read, the other half is latched into a buffer to support
coherent 16-bit accesses in big-endian or little-endian order. The coherency sequence can be manually
reset by writing to the channel status/control register (TPMxCnSC).
An input capture event sets a flag bit (CHnF) which may optionally generate a CPU interrupt request.
While in BDM, the input capture function works as configured by the user. When an external event occurs,
the TPM latches the contents of the TPM counter (which is frozen because of the BDM mode) into the
channel value registers and sets the flag bit.
16.4.2.2 Output Compare Mode
With the output-compare function, the TPM can generate timed pulses with programmable position,
polarity, duration, and frequency. When the counter reaches the value in the channel-value registers of an
output-compare channel, the TPM can set, clear, or toggle the channel pin.
In output compare mode, values are transferred to the corresponding timer channel registers only after both
8-bit halves of a 16-bit register have been written and according to the value of CLKSB:CLKSA bits, so:
• If (CLKSB:CLKSA = 0:0), the registers are updated when the second byte is written
• If (CLKSB:CLKSA not = 0:0), the registers are updated at the next change of the TPM counter
(end of the prescaler counting) after the second byte is written.
The coherency sequence can be manually reset by writing to the channel status/control register
(TPMxCnSC).
An output compare event sets a flag bit (CHnF) which may optionally generate a CPU-interrupt request.
16.4.2.3 Edge-Aligned PWM Mode
This type of PWM output uses the normal up-counting mode of the timer counter (CPWMS=0) and can
be used when other channels in the same TPM are configured for input capture or output compare
functions. The period of this PWM signal is determined by the value of the modulus register
(TPMxMODH:TPMxMODL) plus 1. The duty cycle is determined by the setting in the timer channel
register (TPMxCnVH:TPMxCnVL). The polarity of this PWM signal is determined by the setting in the
ELSnA control bit. 0% and 100% duty cycle cases are possible.
The output compare value in the TPM channel registers determines the pulse width (duty cycle) of the
PWM signal (Figure 16-15). The time between the modulus overflow and the output compare is the pulse
width. If ELSnA=0, the counter overflow forces the PWM signal high, and the output compare forces the
PWM signal low. If ELSnA=1, the counter overflow forces the PWM signal low, and the output compare
forces the PWM signal high.
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
290 Freescale Semiconductor
Figure 16-15. PWM Period and Pulse Width (ELSnA=0)
When the channel value register is set to 0x0000, the duty cycle is 0%. 100% duty cycle can be achieved
by setting the timer-channel register (TPMxCnVH:TPMxCnVL) to a value greater than the modulus
setting. This implies that the modulus setting must be less than 0xFFFF in order to get 100% duty cycle.
Because the TPM may be used in an 8-bit MCU, the settings in the timer channel registers are buffered to
ensure coherent 16-bit updates and to avoid unexpected PWM pulse widths. Writes to any of the registers
TPMxCnVH and TPMxCnVL, actually write to buffer registers. In edge-aligned PWM mode, values are
transferred to the corresponding timer-channel registers according to the value of CLKSB:CLKSA bits, so:
• If (CLKSB:CLKSA = 0:0), the registers are updated when the second byte is written
• If (CLKSB:CLKSA not = 0:0), the registers are updated after the both bytes were written, and the
TPM counter changes from (TPMxMODH:TPMxMODL - 1) to (TPMxMODH:TPMxMODL). If
the TPM counter is a free-running counter then the update is made when the TPM counter changes
from 0xFFFE to 0xFFFF.
16.4.2.4 Center-Aligned PWM Mode
This type of PWM output uses the up/down counting mode of the timer counter (CPWMS=1). The output
compare value in TPMxCnVH:TPMxCnVL determines the pulse width (duty cycle) of the PWM signal
while the period is determined by the value in TPMxMODH:TPMxMODL. TPMxMODH:TPMxMODL
should be kept in the range of 0x0001 to 0x7FFF because values outside this range can produce ambiguous
results. ELSnA will determine the polarity of the CPWM output.
pulse width = 2 x (TPMxCnVH:TPMxCnVL)
period = 2 x (TPMxMODH:TPMxMODL); TPMxMODH:TPMxMODL=0x0001-0x7FFF
If the channel-value register TPMxCnVH:TPMxCnVL is zero or negative (bit 15 set), the duty cycle will
be 0%. If TPMxCnVH:TPMxCnVL is a positive value (bit 15 clear) and is greater than the (non-zero)
modulus setting, the duty cycle will be 100% because the duty cycle compare will never occur. This
implies the usable range of periods set by the modulus register is 0x0001 through 0x7FFE (0x7FFF if you
do not need to generate 100% duty cycle). This is not a significant limitation. The resulting period would
be much longer than required for normal applications.
TPMxMODH:TPMxMODL=0x0000 is a special case that should not be used with center-aligned PWM
mode. When CPWMS=0, this case corresponds to the counter running free from 0x0000 through 0xFFFF,
but when CPWMS=1 the counter needs a valid match to the modulus register somewhere other than at
0x0000 in order to change directions from up-counting to down-counting.
PERIOD
PULSE
WIDTH
OVERFLOW OVERFLOW OVERFLOW
OUTPUT
COMPARE OUTPUT
COMPARE
OUTPUT
COMPARE
TPMxCHn
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 291
The output compare value in the TPM channel registers (times 2) determines the pulse width (duty cycle)
of the CPWM signal (Figure 16-16). If ELSnA=0, a compare occurred while counting up forces the
CPWM output signal low and a compare occurred while counting down forces the output high. The
counter counts up until it reaches the modulo setting in TPMxMODH:TPMxMODL, then counts down
until it reaches zero. This sets the period equal to two times TPMxMODH:TPMxMODL.
Figure 16-16. CPWM Period and Pulse Width (ELSnA=0)
Center-aligned PWM outputs typically produce less noise than edge-aligned PWMs because fewer I/O pin
transitions are lined up at the same system clock edge. This type of PWM is also required for some types
of motor drives.
Input capture, output compare, and edge-aligned PWM functions do not make sense when the counter is
operating in up/down counting mode so this implies that all active channels within a TPM must be used in
CPWM mode when CPWMS=1.
The TPM may be used in an 8-bit MCU. The settings in the timer channel registers are buffered to ensure
coherent 16-bit updates and to avoid unexpected PWM pulse widths. Writes to any of the registers
TPMxMODH, TPMxMODL, TPMxCnVH, and TPMxCnVL, actually write to buffer registers.
In center-aligned PWM mode, the TPMxCnVH:L registers are updated with the value of their write buffer
according to the value of CLKSB:CLKSA bits, so:
• If (CLKSB:CLKSA = 0:0), the registers are updated when the second byte is written
• If (CLKSB:CLKSA not = 0:0), the registers are updated after the both bytes were written, and the
TPM counter changes from (TPMxMODH:TPMxMODL - 1) to (TPMxMODH:TPMxMODL). If
the TPM counter is a free-running counter, the update is made when the TPM counter changes from
0xFFFE to 0xFFFF.
When TPMxCNTH:TPMxCNTL=TPMxMODH:TPMxMODL, the TPM can optionally generate a TOF
interrupt (at the end of this count).
Writing to TPMxSC cancels any values written to TPMxMODH and/or TPMxMODL and resets the
coherency mechanism for the modulo registers. Writing to TPMxCnSC cancels any values written to the
channel value registers and resets the coherency mechanism for TPMxCnVH:TPMxCnVL.
PERIOD
PULSE WIDTH
COUNT=
COUNT= 0
COUNT=
OUTPUT
COMPARE
(COUNT DOWN)
OUTPUT
COMPARE
(COUNT UP)
TPMxCHn
2 x TPMxMODH:TPMxMODL
2 x TPMxCnVH:TPMxCnVL
TPMxMODH:TPMxMODLTPMxMODH:TPMxMODL
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
292 Freescale Semiconductor
16.5 Reset Overview
16.5.1 General
The TPM is reset whenever any MCU reset occurs.
16.5.2 Description of Reset Operation
Reset clears the TPMxSC register which disables clocks to the TPM and disables timer overflow interrupts
(TOIE=0). CPWMS, MSnB, MSnA, ELSnB, and ELSnA are all cleared which configures all TPM
channels for input-capture operation with the associated pins disconnected from I/O pin logic (so all MCU
pins related to the TPM revert to general purpose I/O pins).
16.6 Interrupts
16.6.1 General
The TPM generates an optional interrupt for the main counter overflow and an interrupt for each channel.
The meaning of channel interrupts depends on each channel’s mode of operation. If the channel is
configured for input capture, the interrupt flag is set each time the selected input capture edge is
recognized. If the channel is configured for output compare or PWM modes, the interrupt flag is set each
time the main timer counter matches the value in the 16-bit channel value register.
All TPM interrupts are listed in Table 16-8 which shows the interrupt name, the name of any local enable
that can block the interrupt request from leaving the TPM and getting recognized by the separate interrupt
processing logic.
The TPM module will provide a high-true interrupt signal. Vectors and priorities are determined at chip
integration time in the interrupt module so refer to the user’s guide for the interrupt module or to the chip’s
complete documentation for details.
16.6.2 Description of Interrupt Operation
For each interrupt source in the TPM, a flag bit is set upon recognition of the interrupt condition such as
timer overflow, channel-input capture, or output-compare events. This flag may be read (polled) by
software to determine that the action has occurred, or an associated enable bit (TOIE or CHnIE) can be set
Table 16-8. Interrupt Summary
Interrupt Local
Enable Source Description
TOF TOIE Counter overflow Set each time the timer counter reaches its terminal
count (at transition to next count value which is
usually 0x0000)
CHnF CHnIE Channel event An input capture or output compare event took
place on channel n
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 293
to enable hardware interrupt generation. While the interrupt enable bit is set, a static interrupt will generate
whenever the associated interrupt flag equals one. The user’s software must perform a sequence of steps
to clear the interrupt flag before returning from the interrupt-service routine.
TPM interrupt flags are cleared by a two-step process including a read of the flag bit while it is set (1)
followed by a write of zero (0) to the bit. If a new event is detected between these two steps, the sequence
is reset and the interrupt flag remains set after the second step to avoid the possibility of missing the new
event.
16.6.2.1 Timer Overflow Interrupt (TOF) Description
The meaning and details of operation for TOF interrupts varies slightly depending upon the mode of
operation of the TPM system (general purpose timing functions versus center-aligned PWM operation).
The flag is cleared by the two step sequence described above.
16.6.2.1.1 Normal Case
Normally TOF is set when the timer counter changes from 0xFFFF to 0x0000. When the TPM is not
configured for center-aligned PWM (CPWMS=0), TOF gets set when the timer counter changes from the
terminal count (the value in the modulo register) to 0x0000. This case corresponds to the normal meaning
of counter overflow.
16.6.2.1.2 Center-Aligned PWM Case
When CPWMS=1, TOF gets set when the timer counter changes direction from up-counting to
down-counting at the end of the terminal count (the value in the modulo register). In this case the TOF
corresponds to the end of a PWM period.
16.6.2.2 Channel Event Interrupt Description
The meaning of channel interrupts depends on the channel’s current mode (input-capture, output-compare,
edge-aligned PWM, or center-aligned PWM).
16.6.2.2.1 Input Capture Events
When a channel is configured as an input capture channel, the ELSnB:ELSnA control bits select no edge
(off), rising edges, falling edges or any edge as the edge which triggers an input capture event. When the
selected edge is detected, the interrupt flag is set. The flag is cleared by the two-step sequence described
in Section 16.6.2, “Description of Interrupt Operation.”
16.6.2.2.2 Output Compare Events
When a channel is configured as an output compare channel, the interrupt flag is set each time the main
timer counter matches the 16-bit value in the channel value register. The flag is cleared by the two-step
sequence described Section 16.6.2, “Description of Interrupt Operation.”
Timer/PWM Module (S08TPMV3)
MC9S08JM60 Series Data Sheet, Rev. 3
294 Freescale Semiconductor
16.6.2.2.3 PWM End-of-Duty-Cycle Events
For channels configured for PWM operation there are two possibilities. When the channel is configured
for edge-aligned PWM, the channel flag gets set when the timer counter matches the channel value register
which marks the end of the active duty cycle period. When the channel is configured for center-aligned
PWM, the timer count matches the channel value register twice during each PWM cycle. In this CPWM
case, the channel flag is set at the start and at the end of the active duty cycle period which are the times
when the timer counter matches the channel value register. The flag is cleared by the two-step sequence
described Section 16.6.2, “Description of Interrupt Operation.”
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 295
Chapter 17
Universal Serial Bus Device Controller (S08USBV1)
17.1 Introduction
This chapter describes an universal serial bus device controller (S08USBV1) module that is based on the
Universal Serial Bus Specification Rev 2.0. The USB bus is designed to replace existing bus interfaces
such as RS-232, PS/2, and IEEE 1284 for PC peripherals.
The S08USBV1 module provides a single-chip solution for full-speed (12 Mbps) USB device applications,
and integrates the required transceiver with Serial Interface Engine (SIE), 3.3 V regualtor, Endpoint RAM
and other control logics.
17.1.1 Clocking Requirements
The S08USBV1 requires two clock sources, the 24 MHz bus clock and a 48 MHz reference clock. The
48 MHz clock is sourced directly from MCGOUT. To achieve the 48 MHz clock rate, the MCG must be
configured properly for PLL engaged external (PEE) mode with an external crystal.
For USB operation, examples of MCG configuration using PEE mode include:
• 2 MHz crystal – RDIV = 000 and VDIV = 0110
• 4 MHz crystal – RDIV = 001 and VDIV = 0110
17.1.2 Current Consumption in USB Suspend
In USB suspend mode, the USB device current consumption is limited to 500 μA. When the USB device
goes into suspend mode, the firmware typically enters stop3 to meet the USB suspend requirements on
current consumption.
NOTE
Enabling LVD increases current consumption in stop3. Consequently, when
trying to satisfy USB suspend requirements, disabling LVD before entering
stop3.
17.1.3 3.3 V Regulator
If using an external 3.3 V regulator as an input to VUSB33 (only when USBVREN = 0), the supply voltage,
VDD, must not fall below the input voltage at the VUSB33 pin. If using the internal 3.3 V regulator
(USBVREN = 1), do not connect an external supply to the VUSB33 pin. In this case, VDD must fall between
3.9 V and 5.5 V for the internal 3.3 V regulator to operate correctly.
Chapter 17 Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
296 Freescale Semiconductor
Table 17-1. USBVREN Configuration
USBVREN 3.3-V Regulator VDD Supply Voltage Range
0External 3.3-V Regulator (as input to VUSB33 pin) VUSB33 ≤ VDD Supply Voltage
1Internal 3.3-V Regulator (no external supply connected to
VUSB33 pin)
3.9 V ≤ VDD Supply Voltage ≤ 5.5V
Chapter 17 Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 297
Figure 17-1. MC9S08JM60 Series Block Diagram Highlighting USB Blocks and Pins
PTD4/ADP11
PTD5
PTD6
PTC1/SDA
PTC0/SCL
VSS
VDD
PTE3/TPM1CH1
PTE2/TPM1CH0
PTA5– PTA0
PTE0/TxD1
PTE1/RxD1
PTD1/ADP9/ACMP–
PTD0/ADP8/ACMP+
PTC6
PTC5/RxD2
PTC4
PTC3/TxD2
PTC2
PORT A
PORT C
PORT D
PORT E
8-BIT KEYBOARD
INTERRUPT MODULE (KBI)
IIC MODULE (IIC)
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI1)
USER Flash (IN BYTES)
USER RAM (IN BYTES)
On Chip ICE AND
DEBUG MODULE (DBG)
MC9S08JM60 = 60,912
HCS08 CORE
CPUBDC
NOTES:
1. Port pins are software configurable with pullup device if input port.
2. Pin contains software configurable pullup/pull-down device ifpullup IRQ is enabled
(IRQPE = 1). Pull-down is enabled if rising edge detect is selected (IRQEDG = 1)
3. IRQ does not have a clamp diode to VDD. IRQ must not be driven above VDD.
4. Pin contains integrated pullup device.
5. When pin functions as KBI (KBIPEn = 1) and associated pin is configured to enable the
pullup device, KBEDGn can be used to reconfigure the pullup as a pull-down device.
2-CHANNEL TIMER/PWM
MODULE (TPM2)
PTB5/KBIP5/ADP5
PORT B
PTE5/MOSI1
PTE4/MISO1
PTE6/SPSCK1
PTE7/SS1
HCS08 SYSTEM CONTROL
RESETS AND INTERRUPTS
MODES OF OPERATION
POWER MANAGEMENT
VOLTAGE
REGULATOR
COP IRQ LVD
LOW-POWER OSCILLATOR
MULTI-PURPOSE CLOCK
GENERATOR (MCG)
RESET
VSSAD
VDDAD
VREFH
ANALOG-TO-DIGITAL
CONVERTER (ADC)
6-CHANNEL TIMER/PWM
MODULE (TPM1)
PTD7
6
PTB4/KBIP4/ADP4
PTG3/KBIP7
PTG2/KBIP6
PORT G
12-CHANNEL, 12-BIT
BKGD/MS
PTF3/TPM1CH5
PTF2/TPM1CH4
PTF0/TPM1CH2
PTF1/TPM1CH3
PORT F
PTF5/TPM2CH1
PTF4/TPM2CH0
PTF6
PTF7
INTERFACE MODULE (SCI1)
SERIAL COMMUNICATIONS
INTERFACE MODULE (SCI2)
SERIAL COMMUNICATIONS
PTG0/KBIP0
PTG1/KBIP1
MC9S08JM32 = 32,768
VREFL
PTG4/XTAL
PTG5/EXTAL
IRQ/TPMCLK RxD2
TxD2
SDA
SCL
8
KBIPx
KBIPx
TPMCLK
SPSCK1
SS1
MISO1
MOSI1
TPMCLK
TPM1CH1
TPM1CH0
RxD1
TxD1
EXTAL
XTAL
4
4
USB SIE
USB ENDPOINT
RAM
FULL SPEED
USB
TRANSCEIVER
USBDP
USBDN
MISO2
SS2
SPSCK2
MOSI2 PTB1/MOSI2/ADP1
PTB0/MISO2/ADP0
PTB7/ADP7
PTB6/ADP6
8-/16-BIT SERIAL PERIPHERAL
INTERFACE MODULE (SPI2)
REAL-TIME COUNTER
(RTC)
PTB3/SS2/ADP3
PTB2/SPSCK2/ADP2
TPM1CHx
4
TPM2CH1
TPM2CH0
4
ANALOG COMPARATOR
(ACMP)
SYSTEM
USB 3.3 V VOLTAGE REGULATOR
VUSB33
MC9S08JM60 = 4096
MC9S08JM32 = 2048
ACMPO
ACMP+
ACMP–
PTD3/KBIP3/ADP10
PTD2/KBIP2/ACMPO
V
SSOSC
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
298 Freescale Semiconductor
17.1.4 Features
Features of the USB module include:
• USB 2.0 compliant
— 12 Mbps full-speed (FS) data rate
— USB data control logic:
– Packet identification and decoding/generation
– CRC generation and checking
– NRZI (non-return-to-zero inverted) encoding/decoding
– Bit-stuffing
– Sync detection
– End-of-packet detection
• Seven USB endpoints
— Bidirectional endpoint 0
— Six unidirectional data endpoints configurable as interrupt, bulk, or isochronous
— Endpoints 5 and 6 support double-buffering
•USB RAM
— 256 bytes of buffer RAM shared between system and USB module
— RAM may be allocated as buffers for USB controller or extra system RAM resource
• USB reset options
— USB module reset generated by MCU
— Bus reset generated by the host, which triggers a CPU interrupt
• Suspend and resume operations with remote wakeup support
• Transceiver features
— Converts USB differential voltages to digital logic signal levels
• On-chip USB pullup resistor
• On-chip 3.3-V regulator
17.1.5 Modes of Operation
Table 17-2. Operating Modes
Mode Description
Stop1 USB module is not functional. Before entering stop1, the internal USB voltage regulator and USB transceiver
enter shutdown mode; therefore, the USB voltage regulator and USB transceiver must be disabled by firmware.
Stop2 USB module is not functional. Before entering stop2, the internal USB voltage regulator and USB transceiver
enter shutdown mode; therefore, the USB voltage regulator and USB transceiver must be disabled by firmware.
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 299
17.1.6 Block Diagram
Figure 17-2 is a block diagram of the USB module.
Figure 17-2. USB Module Block Diagram
Stop3 The USB module is optionally available in stop3.
A reduced current consumption mode may be required for USB suspend mode per USB Specification Rev. 2.0,
and stop3 mode is useful for achieving lower current consumption for the MCU and hence the overall USB
device. Before entering stop3 via firmware, the user must ensure that the device settings are configured for
stop3 to achieve USB suspend current consumption targets.
The USB module is notified about entering suspend mode when the SLEEPF flag is set; this occurs after the
USB bus is idle for 3 ms. The device USB suspend mode current consumption level requirements are defined
by the USB Specification Rev. 2.0 (500 μA for low-power and 2.5 mA for high-power with remote-wakeup
enabled).
If USBRESMEN in USBCTL0 is set, and a K-state (resume signaling) is detected on the USB bus, the LPRESF
bit in USBCTL0 will be set. This triggers an asynchronous interrupt that will wakeup the MCU from stop3 mode
and enable clocks to the USB module. The USBRESMEN bit must then be cleared immediately after stop3
recovery to clear the LPRESF flag bit.
Wait USB module is operational.
Table 17-2. Operating Modes (continued)
Mode Description
SkyBlue Gasket
RAM
Arbitration
USB RAM
256 bytes
IRQ
Local Bus
USBDP
USBDN
Serial Interface Engine
To Interrupt Controller
Peripheral Bus
USB CONTROLLER
XCVR
VREG
Protocol and Rate
Match
VUSB33
BVCI
Target
TX
Logic
BVCI
Initiator
RX
Logic
48-MHz Reference Clock
24-MHz Clock (bus clk)
Enable
(SIE) USBDP Pullup
Buffer
Manager
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
300 Freescale Semiconductor
17.2 External Signal Description
The USB module requires both data and power pins. Table 17-3 describes each of the USB external pin
17.2.1 USBDP
USBDP is the positive USB differential signal. In a USB peripheral application, connect an external
33 Ω ±1% resistor in series with this signal in order to meet the USB Specification Rev. 2.0 impedance
requirement.
17.2.2 USBDN
USBDN is the negative USB differential signal. In a USB peripheral application, connect an external
33 Ω ±1% resistor in series with this signal in order to meet the USB Specification, Rev. 2.0 impedance
requirement.
17.2.3 VUSB33
VUSB33 is connected to the on-chip 3.3-V voltage regulator (VREG). VUSB33 maintains an output voltage
of 3.3 V and can only source enough current for USB internal transceiver (XCVR) and USB pullup
resistor. If the VREG is disabled by software, the application must input an external 3.3 V power supply
to the USB module via VUSB33.
17.3 Register Definition
This section describes the memory map and control/status registers for the USB module.
Table 17-3. USB External Pins
Name Port Direction Function Reset State
Positive USB differential signal USBDP I/O Differential USB signaling. High
impedance
Negative USB differential signal USBDN I/O Differential USB signaling. High
impedance
USB voltage regulator power pin VUSB33 Power
3.3 V USB voltage regulator output
or 3.3 V USB transceiver/resistor
supply input.
—
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 301
17.3.1 USB Control Register 0 (USBCTL0)
17.3.2 Peripheral ID Register (PERID)
The PERID reads back the value of 0x04. This value is defined for the USB module peripheral.
76543210
R0
USBPU USBRES
MEN
LPRESF 0
USBVREN
0
USBPHYEN
WUSBRESET
Reset00000000
= Unimplemented or Reserved
Figure 17-3. USB Transceiver and Regulator Control Register 0 (USBCTL0)
Table 17-4. USBCTL0 Field Descriptions
Field Description
7
USBRESET
USB Reset — This bit generates a hard reset of the USB module, USBPHYEN and USBVREGEN bits will also
be cleared. (need remember to restart USB Transceiver and USB voltage regulator).
When set to 1, this bit automatically clears when the reset occurs.
0 USB module normal operation
1 Returns the USB module to its reset state
6
USBPU
Pull Up Source — This bit determines the source of the pullup resistor on the USBDP line.
0 Internal USBDP pullup resistor is disabled; The application can use an external pullup resistor
1 Internal USBDP pullup resistor is enabled
5
USBRESMEN
USB Low-Power Resume Event Enable — This bit, when set, enables the USB module to send an
asynchronous wakeup interrupt to the MCU upon detection that the LPRESF bit has been set, indicating
a K-state on the USB bus. This bit must be set before entering low-power stop3 mode only after SLEEPF=1 (USB
is entering suspend mode). It must be cleared immediately after stop3 recovery in order to clear the Low-Power
Resume Flag.
0 USB asynchronous wakeup from suspend mode disabled
1 USB asynchronous wakeup from suspend mode enabled
4
LPRESF
Low-Power Resume Flag — This bit becomes set in USB suspend mode if USBRESMEN=1 and a K-state is
detected on the USB bus, indicating resume signaling while the device is in a low-power stop3 mode. This flag
bit will trigger an asynchronous interrupt, which will wake the device from stop3. Firmware must then clear the
USBRESMEN bit in order to clear the LPRESF bit.
0 No K-state detected on the USB bus while the device is in stop3 and the USB is suspended.
1 K-state detected on the USB bus when USBRESMEN=1, the device is in stop3, and the USB is suspended.
2
USBVREN
USB Voltage Regulator Enable — This bit enables the on-chip 3.3V USB voltage regulator.
0 On-chip USB voltage regulator is disabled (OFF MODE)
1 On-chip USB voltage regulator is enabled for active or standby mode
0
USBPHYEN
USB Transceiver Enable — When the USB Transceiver (XCVR) is disabled, USBDP and USBDN are hi-Z. It is
recommended that the XCVR be enabled before setting the USBEN bit in the CTL register. The firmware must
ensure that the XCVR remains enabled when entering USB SUSPEND mode.
0 On-chip XCVR is disabled
1 On-chip XCVR is enabled
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
302 Freescale Semiconductor
17.3.3 Peripheral ID Complement Register (IDCOMP)
The IDCOMP reads back the complement of the peripheral ID register. For the USB module peripheral this will be
0xFB.
17.3.4 Peripheral Revision Register (REV)
The REV reads back the value of the USB peripheral revision.
76543210
R 0 0 ID5 ID4 ID3 ID2 ID1 ID0
W
Reset00000100
= Unimplemented or Reserved
Figure 17-4. Peripheral ID Register (PERID)
Table 17-5. PERID Field Descriptions
Field Description
5:0
ID[5:0]
Peripheral Configuration Number —This number is set to 0x04 and indicates that the peripheral is the
full-speed USB module.
76543210
R 1 1 NID5 NID4 NID3 NID2 NID1 NID0
W
Reset11111011
= Unimplemented or Reserved
Figure 17-5. Peripheral ID Complement Register (IDCOMP)
Table 17-6. IDCOMP Field Descriptions
Field Description
5:0
NID[5:0]
Compliment ID Number — One’s complement version of ID[5:0].
76543210
R REV7 REV6 REV5 REV4 REV3 REV2 REV1 REV0
W
Reset00000000
= Unimplemented or Reserved
Figure 17-6. Peripheral Revision Register (REV)
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 303
17.3.5 Interrupt Status Register (INTSTAT)
The INTSTAT contains bits for each of the interrupt source within the USB module. Each of these bits is
qualified with its respective interrupt enable bits (see the interrupt enable register). All bits of the register
are logically OR'ed together to form a single interrupt source for the microcontroller. Once an interrupt bit
has been set, it may only be cleared by writing a 1 to the respective interrupt bit. This register will contain
the value of 0x00 after a reset.
Table 17-7. REV Field Descriptions
Field Description
8–0
REV[7:0]
Revision — Revision number of the USB module.
76543210
R
STALLF
0
RESUMEF SLEEPF TOKDNEF SOFTOKF ERRORF USBRSTF
W
Reset00000000
= Unimplemented or Reserved
Figure 17-8. Interrupt Status Register (INTSTAT)
Table 17-9. INTSTAT Field Descriptions
Field Description
7
STALLF
Stall Flag — The stall interrupt is used in device mode. In device mode the stall flag is asserted when a STALL
handshake is sent by the serial interface engine (SIE).
0 A STALL handshake has not been sent
1 A STALL handshake has been sent
5
RESUMEF
Resume Flag — This bit is set 2.5 μs after clocks to the USB module have restarted following resume signaling.
It can be used to indicate remote wakeup signaling on the USB bus. This interrupt is enabled only when the
USB module is about to enter suspend mode (usually when SLEEPF interrupt detected).
0 No RESUME observed
1 RESUME detected (K-state is observed on the USBDP/USBDN signals for 2.5 μs)
4
SLEEPF
Sleep Flag — This bit is set if the USB module has detected a constant idle on the USB bus for 3 ms, indicating
that the USB module will go into suspend mode. The sleep timer is reset by activity on the USB bus.
0 No constant idle state of 3 ms has been detected on the USB bus
1 A constant idle state of 3 ms has been detected on the USB bus
3
TOKDNEF
Token Complete Flag — This bit is set when the current transaction is completed. The firmware must
immediately read the STAT register to determine the endpoint and BD information. Clearing this bit (by setting it
to 1) causes the STAT register to be cleared or the STAT FIFO holding register to be loaded into the STAT register.
0 No tokens being processed are complete
1 Current token being processed is complete
2
SOFTOKF
SOF Token Flag — This bit is set if the USB module has received a start of frame (SOF) token.
0 The USB module has not received an SOF token
1 The USB module has received an SOF token
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
304 Freescale Semiconductor
17.3.6 Interrupt Enable Register (INTENB)
The INTENB contains enabling bits for each of the interrupt sources within the USB module. Setting any of these
bits will enable the respective interrupt source in the INTSTAT register. This register will contain the value of 0x00
after a reset, i.e. all interrupts disabled.
1
ERRORF
Error Flag — This bit is set when any of the error conditions within the ERRSTAT register has occurred. The
firmware must then read the ERRSTAT register to determine the source of the error.
0 No error conditions within the ERRSTAT register have been detected
1 Error conditions within the ERRSTAT register have been detected
0
USBRSTF
USB Reset Flag —This bit is set when the USB module has decoded a valid USB reset. When asserted, this bit
will inform the MCU to automatically write 0x00 to the address register and to enable endpoint 0. USBRSTF is
set once a USB reset has been detected for 2.5 μs. It will not be asserted again until the USB reset condition has
been removed, and then reasserted.
0 No USB reset observed
1 USB reset detected
76543210
R
STALL
0
RESUME SLEEP TOKDNE SOFTOK ERROR USBRST
W
Reset00000000
Figure 17-9. Interrupt Enable Register (INTENB)
Table 17-10. INTENB Field Descriptions
Field Description
7
STALL
STALL Interrupt Enable — Setting this bit will enable STALL interrupts.
0 Interrupt disabled
1 Interrupt enabled
5
RESUME
RESUME Interrupt Enable — Setting this bit will enable RESUME interrupts.
0 Interrupt disabled
1 Interrupt enabled
4
SLEEP
SLEEP Interrupt Enable — Setting this bit will enable SLEEP interrupts.
0 Interrupt disabled
1 Interrupt enabled
3
TOKDNE
TOKDNE Interrupt Enable — Setting this bit will enable TOKDNE interrupts.
0 Interrupt disabled
1 Interrupt enabled
2
SOFTOK
SOFTOK Interrupt Enable — Setting this bit will enable SOFTOK interrupts.
0 Interrupt disabled
1 Interrupt enabled
Table 17-9. INTSTAT Field Descriptions (continued)
Field Description
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 305
17.3.7 Error Interrupt Status Register (ERRSTAT)
The ERRSTAT contains bits for each of the error sources within the USB module. Each of these bits
corresponds to its respective error enable bit (See Section 17.3.8, “Error Interrupt Enable Register
(ERRENB)”.) The result is OR'ed together and sent to the ERROR bit of the INTSTAT register. Once an
interrupt bit has been set, it may only be cleared by writing a 1 to the corresponding flag bit. Each bit is
set as soon as the error condition is detected. Thus, the interrupt will typically not correspond with the end
of a token being processed. This register will contain the value of 0x00 after reset.
1
ERROR
ERROR Interrupt Enable — Setting this bit will enable ERROR interrupts.
0 Interrupt disabled
1 Interrupt enabled
0
USBRST
USBRST Interrupt Enable — Setting this bit will enable USBRST interrupts.
0 Interrupt disabled
1 Interrupt enabled
76543210
R
BTSERRF Reserved BUFERRF BTOERRF DFN8F CRC16F CRC5F PIDERRF
W
Reset00000000
Figure 17-10. Error Interrupt Status Register (ERRSTAT)
Table 17-11. ERRSTAT Field Descriptions
Field Description
7
BTSERRF
Bit Stuff Error Flag — A bit stuff error has been detected. If set, the corresponding packet will be rejected due
to a bit stuff error.
0 No bit stuff error detected
1 Bit stuff error flag set
5
BUFERRF
Buffer Error Flag — This bit is set if the USB module has requested a memory access to read a new BD but
has not been given the bus before the USB module needs to receive or transmit data. If processing a TX (IN
endpoint) transfer, this would cause a transmit data underflow condition. Or if processing an Rx (OUT endpoint)
transfer, this would cause a receive data overflow condition. This bit is also set if a data packet to or from the host
is larger than the buffer size that is allocated in the BD. In this case the data packet is truncated as it is put into
buffer memory.
0 No buffer error detected
1 A buffer error has occurred
4
BTOERRF
Bus Turnaround Error Timeout Flag — This bit is set if a bus turnaround timeout error has occurred. The USB
module uses a bus turnaround timer to keep track of the amount of time elapsed between the token and data
phases of a SETUP or OUT TOKEN or the data and handshake phases of an IN TOKEN. If more than 16-bit
times are counted from the previous EOP before a transition from IDLE, a bus turnaround timeout error will occur.
0 No bus turnaround timeout error has been detected
1 A bus turnaround timeout error has occurred
Table 17-10. INTENB Field Descriptions (continued)
Field Description
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
306 Freescale Semiconductor
17.3.8 Error Interrupt Enable Register (ERRENB)
3
DFN8F
Data Field Error Flag — The data field received was not an interval of 8 bits. The USB Specification specifies
that the data field must be an integer number of bytes. If the data field was not an integer number of bytes, this
bit will be set.
0 The data field was an integer number of bytes
1 The data field was not an integer number of bytes
2
CRC16F
CRC16 Error Flag — The CRC16 failed. If set, the data packet was rejected due to a CRC16 error.
0 No CRC16 error detected
1 CRC16 error detected
1
CRC5F
CRC5 Error Flag — This bit will detect a CRC5 error in the token packets generated by the host. If set, the
token packet was rejected due to a CRC5 error.
0 No CRC5 error detected
1 CRC5 error detected, and the token packet was rejected.
0
PIDERRF
PID Error Flag — The PID check failed.
0 No PID check error detected
1 PID check error detected
76543210
R
BTSERR
0
BUFERR BTOERR DFN8 CRC16 CRC5 PIDERR
W
Reset00000000
Figure 17-11. Error Interrupt Enable Register (ERRENB)
Table 17-12. ERRSTAT Field Descriptions
Field Description
7
BTSERR
BTSERR Interrupt Enable — Setting this bit will enable BTSERR interrupts.
0 Interrupt disabled
1 Interrupt enabled
5
BUFERR
BUFERR Interrupt Enable — Setting this bit will enable BUFERR interrupts.
0 Interrupt disabled
1 Interrupt enabled
4
BTOERR
BTOERR Interrupt Enable — Setting this bit will enable BTOERR interrupts.
0 Interrupt disabled
1 Interrupt enabled
3
DFN8
DFN8 Interrupt Enable — Setting this bit will enable DFN8 interrupts.
0 Interrupt disabled
1 Interrupt enabled
2
CRC16
CRC16 Interrupt Enable — Setting this bit will enable CRC16 interrupts.
0 Interrupt disabled
1 Interrupt enabled
Table 17-11. ERRSTAT Field Descriptions (continued)
Field Description
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 307
17.3.9 Status Register (STAT)
The STAT reports the transaction status within the USB module. When the MCU receives a TOKDNE
interrupt, the STAT is read to determine the status of the previous endpoint communication. The data in
the status register is valid only when the TOKDNEF interrupt flag is asserted. The STAT register is actually
a read window into a status FIFO maintained by the USB module. When the USB module uses a BD, it
updates the status register. If another USB transaction is performed before the TOKDNE interrupt is
serviced, the USB module will store the status of the next transaction in the STAT FIFO. Thus, the STAT
register is actually a four byte FIFO which allows the microcontroller to process one transaction while the
serial interface engine (SIE) is processing the next. Clearing the TOKDNEF bit in the INTSTAT register
causes the SIE to update the STAT register with the contents of the next STAT value. If the next data in the
STAT FIFO holding register is valid, the SIE will immediately reassert the TOKDNE interrupt.
1
CRC5
CRC5 Interrupt Enable — Setting this bit will enable CRC5 interrupts.
0 Interrupt disabled
1 Interrupt enabled
0
PIDERR
PIDERR Interrupt Enable — Setting this bit will enable PIDERR interrupts.
0 Interrupt disabled
1 Interrupt enabled
76543210
R ENDP[3:0] IN ODD 0 0
W
Reset00000000
= Unimplemented or Reserved
Figure 17-12. Status Register (STAT)
Table 17-13. STAT Field Descriptions
Field Description
7–4
ENDP[3:0]
Endpoint Number — These four bits encode the endpoint address that received or transmitted the previous
token. This allows the microcontroller to determine which BDT entry was updated by the last USB transaction.
0000 Endpoint 0
0001 Endpoint 1
0010 Endpoint 2
0011 Endpoint 3
0100 Endpoint 4
0101 Endpoint 5
0110 Endpoint 6
Table 17-12. ERRSTAT Field Descriptions (continued)
Field Description
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
308 Freescale Semiconductor
17.3.10 Control Register (CTL)
The CTL provides various control and configuration information for the USB module.
3
IN
In/Out Transaction — This bit indicates whether the last BDT updated was for a transmit (IN) transfer or a
receive (OUT) data transfer.
0 Last transaction was a receive (OUT) data transfer
1 Last BDT updated was for transmit (IN) transfer
2
ODD
Odd/Even Transaction —This bit indicates whether the last buffer descriptor updated was in the odd bank of
the BDT or the even bank of the BDT, See earlier section for more information on BDT address generation.
0 Last buffer descriptor updated was in the EVEN bank
1 Last buffer descriptor updated was in the ODD bank
76543210
R
TSUSPEND CRESUME ODDRST USBEN
W
Reset00000000
Figure 17-13. Control Register (CTL)
Table 17-14. CTL Field Descriptions
Field Description
5
TSUSPEND
Transaction Suspend — This bit is set by the serial interface engine (SIE) when a setup token is received,
allowing software to dequeue any pending packet transactions in the BDT before resuming token processing.
The TSUSPEND bit informs the processor that the SIE has disabled packet transmission and reception.
Clearing this bit allows the SIE to continue token processing.
0 Allows the SIE to continue token processing
1 Set by the SIE when a setup token is received; SIE has disabled packet transmission and reception.
2
CRESUME
Resume Signaling — Setting this bit will allow the USB module to execute resume signaling. This will allow
the USB module to perform remote wakeup. Software must set CRESUME to 1 for the amount of time
required by the USB Specification Rev. 2.0 and then clear it to 0.
0 Do not execute remote wakeup
1 Execute resume signaling - remote wakeup
1
ODDRST
Odd Reset — Setting this bit will reset all the buffer descriptor ODD ping-pong bits to 0 which will then specify
the EVEN descriptor bank. This bit is used with double-buffered endpoints 5 and 6. This bit has no effect on
endpoints 0 through 4.
0 Do not reset
1 Reset all the buffer descriptor ODD ping/pong bits to 0 which will then specify the EVEN descriptor bank
0
USBEN
USB Enable Setting this bit will enable the USB module to operate. Setting this bit causes the SIE to reset
all of its ODD bits to the BDTs. Thus, setting this bit will reset much of the logic in the SIE.
0 Disable the USB module
1 Enable the USB module for operation, will not affect Transceiver and VREG.
Table 17-13. STAT Field Descriptions (continued)
Field Description
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 309
17.3.11 Address Register (ADDR)
The ADDR register contains the unique 7-bit address the device will be recognized as through USB. The
register is reset to 0x00 after the reset input has gone active or the USB module has decoded USB reset
signaling. That will initialize the address register to decode address 0x00 as required by the USB
specification. Firmware will change the value when it processes a SET_ADDRESS request.
17.3.12 Frame Number Register (FRMNUML, FRMNUMH)
The frame number registers contains the 11-bit frame number. The frame number registers require two
8-bit registers to implement. The low order byte is contained in FRMNUML, and the high order byte is
contained in FRMNUMH. These registers are updated with the current frame number whenever a SOF
TOKEN is received.
76543210
R0
ADDR6 ADDR5 ADDR4 ADDR3 ADDR2 ADDR1 ADDR0
W
Reset00000000
Figure 17-14. Address Register (ADDR)
Table 17-15. ADDR Field Descriptions
Field Description
6–0
ADDR[6:0]
USB Address — This 7-bit value defines the USB address that the USB module will decode
76543210
R FRM7 FRM6 FRM5 FRM4 FRM3 FRM2 FRM1 FRM0
W
Reset00000000
= Unimplemented or Reserved
Figure 17-15. Frame Number Register Low (FRMNUML)
Table 17-16. FRMNUML Field Descriptions
Field Description
7–0
FRM[7:0]
Frame Number — These bits represent the low order bits of the 11 bit frame number.
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
310 Freescale Semiconductor
17.3.13 Endpoint Control Register (EPCTLn, n=0-6)
The endpoint control registers contains the endpoint control bits (EPCTLDIS, EPRXEN, EPTXEN, and
EPHSHK) for each endpoint available within the USB module for a decoded address. These four bits
define all of the control necessary for any one endpoint. The formats for these registers are shown in the
tables below. Endpoint 0 (ENDP0) is associated with control pipe 0 which is required by the USB for all
functions. Therefore, after a USBRST interrupt has been received, the microcontroller must set EPCTL0
to contain 0x0D.
76543210
R00000FRM10FRM9FRM8
W
Reset00000000
= Unimplemented or Reserved
Figure 17-16. Frame Number Register High (FRMNUMH)
Table 17-17. FRMNUMH Field Descriptions
Field Description
2–0
FRM[10:8]
Frame Number — These bits represent the high order bits of the 11-bit frame number.
76543210
R0 0
0 EPCTLDIS EPRXEN EPTXEN EPSTALL EPHSHK
W
Reset
(EP0-6) 00000000
= Unimplemented or Reserved
Figure 17-17. Endpoint Control Register (EPCTLn)
Table 17-18. EPCTLn Field Descriptions
Field Description
4
EPCTLDIS
Endpoint Control — This bit defines if an endpoint is enabled and the direction of the endpoint. The
endpoint enable/direction control is defined in Table 17-19.
3
EPRXEN
Endpoint Rx Enable — This bit defines if an endpoint is enabled for OUT transfers. The endpoint
enable/direction control is defined in Ta bl e 1 7 - 1 9 .
2
EPTXEN
Endpoint Tx Enable — This bit defines if an endpoint is enabled for IN transfers. The endpoint
enable/direction control is defined in Ta bl e 1 7 - 1 9 .
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 311
17.4 Functional Description
This section describes the functional behavior of the USB module. It documents data packet processing
for endpoint 0 and data endpoints, USB suspend and resume states, SOF token processing, reset conditions
and interrupts.
17.4.1 Block Descriptions
Figure 17-2 is the block diagram. The module’s sub-blocks and external signals are described in the
following sections. The module involves several major blocks — USB transceiver (XCVR), USB serial
interface engine (SIE), a 3.3 V regulator (VREG), endpoint buffer manager, shared RAM arbitration, USB
RAM and the SkyBlue gasket.
17.4.1.1 USB Serial Interface Engine (SIE)
The SIE is composed of two major functions: TX Logic and RX Logic. These major functions are
described below in more detail. The TX and RX logic are connected by a USB protocol engine which
manages packet flow to and from the USB module. The SIE is connected to the rest of the system via
1
EPSTALL
Endpoint Stall — When set, this bit indicates that the endpoint is stalled. This bit has priority over all other
control bits in the endpoint control register, but is only valid if EPTXEN=1 or EPRXEN=1. Any access to this
endpoint will cause the USB module to return a STALL handshake. Once an endpoint is stalled it requires
intervention from the host controller.
0 Endpoint n is not stalled
1 Endpoint n is stalled
0
EPHSHK
Endpoint Handshake — This bit determines if the endpoint will perform handshaking during a transaction
to the endpoint. This bit will generally be set unless the endpoint is isochronous.
0 No handshaking performed during a transaction to this endpoint (usually for isochronous endpoints)
1 Handshaking performed during a transaction to this endpoint
Table 17-19. Endpoint Enable/Direction Control
Bit Name
Endpoint Enable/Direction Control
4
EPCTLDIS
3
EPRXEN
2
EPTXEN
X00
Disable endpoint
X01Enable endpoint for IN(TX) transfers only
X10Enable endpoint for OUT(RX) transfers only
0 1 1 Enable endpoint for IN, OUT and SETUP transfers.
1 1 1 RESERVED
Table 17-18. EPCTLn Field Descriptions (continued)
Field Description
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
312 Freescale Semiconductor
internal basic virtual component interface (BVCI) compliant target and initiator buses. The BVCI target
interface is used to configure the USB SIE and to provide status and interrupts to CPU. The BVCI initiator
interface provides the integrated DMA controller access to the buffer descriptor table (BDT), and transfers
USB data to or from USB RAM memory.
17.4.1.1.1 Serial Interface Engine (SIE) Transmitter Logic
The SIE transmitter logic has two primary functions. The first is to format the USB data packets that have
been stored in the endpoint buffers. The second is to transmit data packets via the USB transceiver.
All of the necessary USB data formatting is performed by the SIE transmitter logic, including:
• NRZI encoding
• bit-stuffing
• CRC computation
• addition of the SYNC field
• addition of the End-of-packet (EOP)
The CPU typically places data in the endpoint buffers as part of the application. When the buffer is
configured as an IN buffer and the USB host requests a packet, the SIE responds with a properly formatted
data packet.
The transmitter logic is also used to generate responses to packets received from the USB host. When a
properly formatted packet is received from the USB host, the transmitter logic responds with the
appropriate ACK, NAK or STALL handshake.
When the SIE transmitter logic is transmitting data from the buffer space for a particular endpoint, CPU
access to that endpoint buffer space is not recommended.
17.4.1.1.2 Serial Interface Engine (SIE) Receiver Logic
The SIE receiver logic receives USB data and stores USB packets in USB RAM for processing by the CPU
and the application software. Serial data from the transceiver is converted to a byte-wide parallel data
stream, checked for proper packet framing, and stored in the USB RAM memory.
Received bitstream processing includes the following operations:
• decodes an NRZI USB serial data stream
• Sync detection
• Bit-stuff removal (and error detection)
• End-of-packet (EOP) detection
• CRC validation
•PID check
• other USB protocol layer checks.
The SIE receiver logic provides error detection including:
• Bad CRC
• Timeout detection for EOP
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 313
• Bit stuffing violation
If a properly formatted packet is received, the receiver logic initiates a handshake response to the host. If
the packet is not decoded correctly due to bit stuff violation, CRC error or other packet level problem, the
receiver ignores it. The USB host will eventually time-out waiting for a response, and retransmit the
packet.
When the SIE receiver logic is receiving data in the buffer space for a particular endpoint, CPU access to
that buffer space is not recommended.
17.4.1.2 MCU/Memory Interfaces
17.4.1.2.1 SkyBlue Gasket
The SkyBlue gasket connects the USB module to the SoC internal peripheral bus. The gasket maps
accesses to the endpoint buffer descriptors or the endpoint buffers into the shared RAM block, and it also
maps accesses to the peripherals register set into the serial interface engine (SIE) register space. The
SkyBlue gasket interface includes registers to control the USB transceiver and voltage regulator.
17.4.1.2.2 Endpoint Buffer Manager
Each endpoint supported by the USB device transmits data to and from buffers stored in the shared buffer
memory. The serial interface engine (SIE) uses a table of descriptors, the Buffer Descriptor Table (BDT),
which is also stored in the USB RAM to describe the characteristics of each endpoint. The endpoint buffer
manager is responsible for mapping requests to access endpoint buffer descriptors into physical addresses
within the USB RAM block.
17.4.1.2.3 RAM Arbitration
The arbitration block allows access to the USB RAM block from the SkyBlue gasket block and from the
SIE.
17.4.1.3 USB RAM
The USB module includes 256 bytes of high speed RAM, accessible by the USB serial interface engine
(SIE) and the CPU. The USB RAM runs at twice the speed of the bus clock to allow interleaved
non-blocked access by the CPU and SIE. The USB RAM is used for storage of the buffer descriptor table
(BDT) and endpoint buffers. USB RAM that is not allocated for the BDT and endpoint buffers can be used
as system memory. If the USB module is not enabled, then the entire USB RAM may be used as unsecured
system memory.
17.4.1.4 USB Transceiver (XCVR)
The USB transceiver is electrically compliant to the Universal Serial Bus Specification 2.0. This block
provides the necessary 2-wire differential NRZI signaling for USB communication. The transceiver is
on-chip to provide a cost effective single chip USB peripheral solution.
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
314 Freescale Semiconductor
17.4.1.5 USB On-Chip Voltage Regulator (VREG)
The on-chip 3.3-V regulator provides a stable power source to power the USB internal transceiver and
provide for the termination of an internal or external pullup resistor. When the on-chip regulator is enabled,
it requires a voltage supply input in the range from 3.9 V to 5.5 V, and the voltage regulator output will be
in the range of 3.0 V to 3.6 V.
With a dedicated on-chip USB 3.3-V regulator and a separate power supply for the MCU, the MCU and
USB can operate at different voltages (See the USB electricals regarding the USB voltage regulator
electrical characteristics). When the on-chip 3.3-V regulator is disabled, a 3.3-V source must be provided
through the VUSB33 pin to power the USB transceiver. In this case, the power supply voltage to the MCU
must not fall below the input voltage at the VUSB33 pin.
The 3.3-V regulator has 3 modes including:
• Active mode — This mode is entered when USB is active. Current requirement is sufficient to
power the transceiver and the USBDP pullup resistor.
• Standby — The voltage regulator standby mode is entered automatically when the USB device is
in suspend mode. When the USB device is forced into suspend mode by the USB bus, the firmware
must configure the MCU for stop3 mode. In standby mode, the requirement is to maintain the
USBDP pin voltage at 3.0 V to 3.6 V, with a 900 Ω (worst-case) pullup.
• Power off — This mode is entered anytime when stop2 or stop1 is entered or when the voltage
regulator is disabled.
17.4.1.6 USB On-Chip USBDP Pullup Resistor
The pullup resistor on the USBDP line required for full-speed operation by the USB Specification Rev. 2.0
can be internal or external to the MCU, depending on the application requirements. An on-chip pullup
resistor, implemented as specified in the USB 2.0 resistor ECN, is optionally available via firmware
configuration. Alternatively, this on-chip pullup resistor can be disabled, and the USB module can be
configured to use an external pullup resistor for the USBDP line instead. If using an external pullup resistor
on the USBDP line, the resistor must comply with the requirements in the USB 2.0 resistor ECN found at
http://www.usb.org.
The USBPU bit in the USBCTL0 register can be used to indicate if the pullup resistor is internal or external
to the MCU. If USBPU is clear, the internal pullup resistor on USBDP is disabled, and an external USBDP
pullup can be used. When using an external USBDP pullup, if the voltage regulator is enabled, the VUSB33
voltage output can be used with the USBDP pullup. While the use of the internal USBDP pullup resistor
is generally recommended, the figure below shows the USBDP pullup resistor configuration for a USB
device using an external resistor tied to VUSB33.
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 315
Figure 17-18. USBDP/USBDN Pullup Resistor Configuration for USB module
17.4.1.7 USB Powering and USBDP Pullup Enable Options
The USB module provides a single-chip solution for USB device applications that are self-powered or
bus-powered. The USB device needs to know when it has a valid USB connection in order to enable or
disable the pullup resistor on the USBDP line. For the USB module on this device, the pullup on USBDP
is only applied when a valid VBUS connection is sensed, as required by the USB specification.
In bus-powered applications, system power must be derived from VBUS. Because VBUS is only available
when a valid USB connection from host to device is made, the VBUS sensing is built-in, and the USBDP
pullup can be enabled accordingly.
With self-powered applications, determining when a valid USB connection is made is different from that
of bus-powered applications. In self-powered applications, VBUS sensing must be built into the
application. For instance, a KBI pin interrupt can be utilized (if available). When a valid VBUS connection
is made, the KBI interrupt can notify the application that a valid USB connection is available, and the
internal pullup resistor can be enabled using the USBPU bit. If an external pullup resistor is used instead
of the internal one, the VBUS sensing mechanism must be included in the system design.
Table 17-20 summarizes the differences in enabling the USBDP pullup for different USB power modes.
Table 17-20. USBDP Pullup Enable for Different USB Power Modes
Power USBDP Pullup Pullup Enable
Bus Power
(Built-in VBUS sense)
Internal Set USBPU bit
External Build into application
Self Power
(Build VBUS sense into application)
Internal Set USBPU bit
External Build into application
USBDP
USBDN
USB DEVICE
VUSB33
3.3 V
RDPPU
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
316 Freescale Semiconductor
17.4.2 Buffer Descriptor Table (BDT)
To efficiently manage USB endpoint communications, the USB module implements a buffer descriptor
table (BDT) comprised of buffer descriptors (BD) in the local USB RAM. The BD entries provide status
or control information for a corresponding endpoint. The BD entries also provide an address to the
endpoint’s buffer. A single BD for an endpoint direction requires 3-bytes. A detailed description of the
BDT format is provided in the next sections.
The software API intelligently manages buffers for the USB module by updating the BDT when needed.
This allows the USB module to efficiently handle data transmission and reception, while the
microcontroller performs communication overhead processing and other function dependent applications.
Because the buffers are shared between the microcontroller and the USB module, a simple semaphore
mechanism is used to distinguish who is allowed to update the BDT and buffers in buffer memory. A
semaphore bit, the OWN bit, is cleared to 0 when the BD entry is owned by the microcontroller. The
microcontroller is allowed read and write access to the BD entry and the data buffer when the OWN bit is
0. When the OWN bit is set to 1, the BD entry and the data buffer are owned by the USB module. The USB
module now has full read and write access and the microcontroller must not modify the BD or its
corresponding data buffer.
17.4.2.1 Multiple Buffer Descriptor Table Entries for a Single Endpoint
Every endpoint direction requires at least one three-byte Buffer Descriptor entry. Thus, endpoint 0, a
bidirectional control endpoint, requires one BDT entry for the IN direction, and one for the OUT direction.
Using two BD entries also allows for double-buffering. Double-buffering BDs allows the USB module to
easily transfer data at the maximum throughput provided by the USB module. Double buffering allows the
MCU to process one BD while the USB module is processing the other BD.
To facilitate double-buffering, two buffer descriptor (BD) entries are needed for each endpoint direction.
One BD entry is the EVEN BD and the other is the ODD BD.
17.4.2.2 Addressing Buffer Descriptor Table Entries
The BDT addressing is hardwired into the module. The BDT occupies the first portion of the USB RAM.
To access endpoint data via the USB or MCU, the addressing mechanism of the buffer descriptor table
must be understood.
All enabled IN and OUT endpoint BD entries are indexed into the BDT to allow easy access via the USB
module or the MCU. The figure below shows the USB RAM organization. The figure shows that the first
entries in the USB RAM are dedicated to storage of the BDT entries - i.e. the first 30 bytes of the USB
RAM (0x00 to 0x1D) are used to implement the BDT.
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 317
When the USB module receives a USB token on an enabled endpoint, it interrogates the BDT. The USB
module reads the corresponding endpoint BD entry and determines if it owns the BD and corresponding
data buffer.
17.4.2.3 Buffer Descriptor Formats
The buffer descriptors (BDs) are groups of registers that provide endpoint buffer control information for
the USB module and the MCU. The BDs have different meanings based on who is reading the BD in
memory.
The USB module uses the data stored in the BDs to determine:
• Who owns the buffer in system memory
• Data0 or Data1 PID
• Release Own upon packet completion
• Data toggle synchronization enable
• How much data to be transmitted or received
• Where the buffer resides in the buffer RAM.
The microcontroller uses the data stored in the BDs to determine:
• Who owns the buffer in system memory
• Data0 or Data1 PID
• The received TOKEN PID
Table 17-21. USB RAM Organization
USB RAM
Offset USB RAM Description of Contents
0x00
BDT
Endpoint 0 IN
Endpoint 0, OUT
Endpoint 1
Endpoint 2
Endpoint 3
Endpoint 4
Endpoint 5, Buffer EVEN
Endpoint 5, Buffer ODD
Endpoint 6, Buffer EVEN
0x1D Endpoint 6, Buffer ODD
0x1E RESERVED
0x1F RESERVED
0x20
0xFF
USB RAM available for endpoint buffers
Universal Serial Bus Device Controller (S08USBV1)
MC9S08JM60 Series Data Sheet, Rev. 3
318 Freescale Semiconductor
• How much data was transmitted or received.
• Where the buffer resides in buffer memory
The BDT is composed of buffer descriptors (BD) which are used to define and control the actual buffers
in the USB RAM space. BDs always occur as a 3-bytes block. See Figure 17-19 for the BD example of
Endpoint 0 IN start from USB RAM offset 0x00.
The format for the buffer descriptor is shown in Table 17-22.
Offset 7 6 5 4 3 2 1 0
0x00
R
OWN DATA0/1
BDTKPID[3] BDTKPID[3] BDTKPID[1] BDTKPID[0]
0 0
W00DTSBDTSTALL
0x01
R
BC[7:0]
W
0x02
R
EPADR[9:4]
W
Figure 17-19. Buffer Descriptor Example
Table 17-22. Buffer Descriptor Table Fields
Field Description
OWN
OWN — This OWN bit determines who currently owns the buffer. The USB SIE generally writes a 0 to this bit
when it has completed a token. The USB module ignores all other fields in the BD when OWN=0. Once the BD
has been assigned to the USB module (OWN=1), the MCU must not change it in any way. This byte of the BD
must always be the last byte the MCU (firmware) updates when it initializes a BD. Although the hardware will
not block the MCU from accessing the BD while owned by the USB SIE, doing so may cause undefined
behavior and is generally not recommended.
0 The MCU has exclusive access to the entire BD
1 The USB module has exclusive access to the BD
DATA0/1
Data Toggle — This bit defines if a DATA0 field (DATA0/1=0) or a DATA1 (DATA0/1=1) field was transmitted or
received. It is unchanged by the USB module.
0 Data 0 packet
1 Data 1 packet
BDTKPID[3:0]
The current token PID is written back to the BD by the USB module when a transfer completes. The values
written back are the token PID values from the USB specification: 0x1 for an OUT token, 0x9 for and IN token
or 0xd for a SETUP token.
DTS
Data Toggle Synchronization— This bit enables data toggle synchronization.
0 No data toggle synchronization is performed.
1 Data toggle synchronization is performed.
BDTSTALL
BDT Stall — Setting this bit will cause the USB module to issue a STALL handshake if a token is received by
the SIE that would use the BDT in this location. The BDT is not consumed by the SIE (the OWN bit remains
and the rest of the BD is unchanged) when the BDTSTALL bit is set.
0 BDT stall is disabled
1 USB will issue a STALL handshake if a token is received by the SIE that would use the BDT in this location
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17.4.3 USB Transactions
When the USB module transmits or receives data, it will first compute the BDT address based on the
endpoint number, data direction, and which buffer is being used (even or odd), then it will read the BD.
Once the BD has been read, and if the OWN bit equals 1, the serial interface engine (SIE) will transfer the
packet data to or receive the packet data from the buffer pointed to by the EPADR field of the BD. When
the USB TOKEN is complete, the USB module will update the BDT and change the OWN bit to 0.
The STAT register is updated and the TOKDNE interrupt is set. When the microcontroller processes the
TOKDNE interrupt, it reads the status register. This gives the microcontroller all the information it needs
to process the endpoint. At this point the microcontroller can allocate a new BD, so additional USB data
can be transmitted or received for that endpoint, and it can process the previous BD. Figure 17-20 shows
a timeline for how a typical USB token would be processed.
BC[7:0]
Byte Count — The Byte Count bits represent the 8-bit byte count. The USB module serial interface engine
(SIE) will change this field upon the completion of a RX transfer with the byte count of the data received. Note
that while USB supports packets as large as 1023 bytes for isochronous endpoints, this module limits packet
size to 64 bytes.
EPADR[9:4]
Endpoint Address— The endpoint address bits represent the upper 6 bits of the 10-bit buffer address within
the module’s local USB RAM. Bits [3:0] of EPADR are always zero, therefore the address of the buffer must
always start on a 16-byte aligned address within the local RAM. These bits are unchanged by the USB module.
This is NOT the address of the memory on the system bus. EPADR is relative to the start of the local USB RAM.
Table 17-22. Buffer Descriptor Table Fields (continued)
Field Description
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Figure 17-20. USB Packet Flow
The USB has two sources of data overrun error:
• The memory latency to the local USB RAM interface may be too high and cause the receive buffer
to overflow. This is predominantly a hardware performance issue, usually caused by transient
memory access issues.
• The packet received may be larger than the negotiated MAXPACKET size. This is caused by a
software bug.
In the first case, the USB will respond with a NAK or bus timeout (BTO) as appropriate for the class of
transaction. The BTOERR bit will be set in the ERRSTAT register. Depending on the values of the
INTENB and ERRENB register, USB module may assert an interrupt to notify the CPU of the error. In
device mode the BDT is not written back nor is the TOKDNE interrupt triggered because it is assumed
that a second attempt will be queued at future time and will succeed.
In the second case of oversized data packets, the USB specification assumes correct software drivers on
both sides. The overrun is not due to memory latency but to a lack of space to put the excess data. NAK'ing
the packet will likely cause another retransmission of the already oversized packet data. In response to
oversized packets, the USB module will still ACK the packet for non-isochronous transfers. The data
written to memory is clipped to the MAXPACKET size so as not to corrupt the buffer space. The USB
module will assert the BUFERRF bit of the ERRSTAT register (which could trigger an interrupt, as above)
and a TOKDNE interrupt fails. The BDTKPID field of the BDT will not be “1111” because the BUFERRF
is not due to latency. The packet length field written back to the BDT will be the MAXPACKET value to
represent the length of the clipped data actually written to memory. From here the software can decide an
= USB Host = Function
USB RST SOF
USBRST
Interrupt Generated
SOF
Interrupt Generated
SETUP TOKEN DATA ACK
TOKDNE
Interrupt Generated
IN TOKEN DATA ACK
OUT TOKEN DATA ACK
TOKDNE
Interrupt Generated
TOKDNE
Interrupt Generated
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appropriate course of action for future transactions — stalling the endpoint, canceling the transfer,
disabling the endpoint, etc.
17.4.4 USB Packet Processing
Packet processing for a USB device consists of managing buffers for IN (to the USB Host) and OUT (to
the USB device) transactions. Packet processing is further divided into request processing on Endpoint 0,
and data packet processing on the data endpoints.
17.4.4.1 USB Data Pipe Processing
Data pipe processing is essentially a buffer management task. The firmware is responsible for managing
the shared buffer RAM to ensure that a BD is always ready for the hardware to process (OWN bit = 1).
The device allocates buffers within the shared RAM, sets up the buffer descriptors, and waits for interrupts.
On receipt of a TOKDNE interrupt, the firmware reads the STAT register to determine which endpoint is
affected, then reads the corresponding BDT entry to determine what to do next.
When processing data packets, firmware is responsible for managing the size of the packet buffers to be
in compliance with the USB specification, and the physical limitations of this module. Packet sizes up to
64 bytes are supported on all endpoints. Isochronous endpoints also can only specify packet sizes up to 64
bytes.
Firmware is also responsible for setting the appropriate bits in the BDT. For most applications using bulk
packets (control, bulk, and interrupt-type transfers), the firmware will set the DTS, BC and EPADR fields
for each BD. For isochronous packets, firmware will set BC and EPADR fields. In all cases, firmware will
set the OWN bit to enable the endpoint for data transfers.
17.4.4.2 Request Processing on Endpoint 0
In most cases, commands to the USB device are directed to Endpoint 0. The host uses the “Standard
Requests” described in Chapter 9 of the USB specification to enumerate and configure the device. Class
drivers or product specific drivers running on the host send class (HID, Mass Storage, Imaging) and vendor
specific commands to the device on endpoint 0.
USB requests always follow a specific format:
• Host sends a SETUP token, followed by an 8-byte setup packet, and the device hardware can send
a handshake packet.
• If the setup packet specifies a data phase, the host and device may transfer up to 64 Kbytes of data
(either IN or OUT, not both).
• The request is terminated by a status phase.
Device firmware monitors the INTSTAT and STAT registers, the endpoint 0 buffer descriptors (BD’s), and
the contents of the setup packet to correctly execute the host’s request.
The flow for processing endpoint 0 requests is as follows:
1. Allocate 8-byte buffers for endpoint 0 OUT.
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2. Create BDT entries for Endpoint 0 OUT, and set the DTS and OWN bits to 1.
3. Wait for interrupt TOKDNE.
4. Read STAT register.
— The status register must show Endpoint 0, RX. If it does not, then assert the EPSTALL bit in
the endpoint control register.
5. Read Endpoint 0 OUT BD.
— Verify that the token type is a SETUP token. If it is not, then assert the EPSTALL bit in the
endpoint control register.
6. Decode and process the setup packet.
— If the direction field in the setup packet indicates an OUT transfer, then process the out data
phase to receive exactly the number of bytes specified in the wLength field of the setup packet.
— If the direction field in the setup packet indicates an IN transfer, then process the in data phase
to deliver no more than the number of bytes specified in the wLength field. Note that it is
common for the host to request more bytes than it needs, expecting the device to only send as
much as it needs to.
7. After processing the data phase (if there was one), create a zero-byte status phase transaction.
— This is accomplished for an OUT data phase (IN status phase) by setting the BC to 0 in the next
BD, while also setting OWN=1. For an IN data phase (OUT status phase), the host will send a
zero-byte packet to the device.
— Firmware can verify completion of the data phase by verifying the received token in the BD on
receipt of the TOKDNE interrupt. If the data phase was of type IN, then the status phase token
will be OUT. If the data phase was of type OUT, then the status phase token will be IN.
17.4.4.3 Endpoint 0 Exception Conditions
The USB includes a number of error checking and recovery mechanisms to ensure reliable data transfer.
One such exception occurs when the host sends a SETUP packet to a device, and the host never receives
the acknowledge handshake from the device. In this case, the host will retry the SETUP packet.
Endpoint 0 request handlers on the device must be aware of the possibility that after receiving a correct
SETUP packet, they could receive another SETUP packet before the data phase actually begins.
17.4.5 Start of Frame Processing
The USB host allocates time in 1.0 ms chunks called “Frames” for the purposes of packet scheduling. The
USB host starts each frame with a broadcast token called SOF (start of frame) that includes an 11-bit
sequence number. The TOKSOF interrupt is used to notify firmware when an SOF token was received.
Firmware can read the current frame number from the FRMNUML/FRMNUMH registers.
In general, the SOF interrupt is only monitored by devices using isochronous endpoints to help ensure that
the device and host remain synchronized.
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17.4.6 Suspend/Resume
The USB supports a single low-power mode called suspend. Getting into and out of the suspend state is
described in the following sections.
17.4.6.1 Suspend
The USB host can put a single device or the entire bus into the suspend state at any time. The MCU
supports suspend mode for low power. Suspend mode will be entered when the USB data lines are in the
idle state for more than 3 ms. Entry into suspend mode is announced by the SLEEPF bit in the INTSTAT
register.
Per the USB specification, a low-power bus-powered USB device is required to draw less than 500 µA in
suspend state. A high-power device that supports remote wakeup and has its remote wake-up feature
enabled by the host can draw up to 2.5 mA of current. After the initial 3-ms idle, the USB device will reach
this state within 7 ms. This low-current requirement means that firmware is responsible for entering stop3
mode once the SLEEPF flag has been set and before the USB module has been placed in the suspend state.
On receipt of resume signaling from the USB, the module can generate an asynchronous interrupt to the
MCU which brings the device out of stop mode and wakes up the clocks. Setting the USBRESMEN bit in
the USBCTL0 register immediately after the SLEEPF bit is set enables this asynchronous notification
feature. The USB resume signaling will then cause the LPRESF bit to be set, indicating a low-power
SUSPEND resume, which will wake the CPU from stop3 mode.
During normal operation, while the host is sending SOF packets, the USB module will not enter suspend
mode.
17.4.6.2 Resume
There are three ways to get out of the suspend state. When the USB module is in suspend state, the resume
detection is active even if all the clocks are disabled and the MCU is in stop3 mode. The MCU can be
activated from the suspend state by normal bus activity, a USB reset signal, or upstream resume (remote
wakeup).
17.4.6.2.1 Host Initiated Resume
The host signals a resume from suspend by initiating resume signaling (K state) for at least 20 ms followed
by a standard low-speed EOP signal. This 20 ms ensures that all devices in the USB network are awakened.
After resuming the bus, the host must begin sending bus traffic within 3 ms to prevent the device from
re-entering suspend mode.
Depending on the power mode the device is in while suspended, the notification for a host initiated resume
will be different:
• Run mode - RESUME must be set after SLEEPF becomes set to enable the RESUMEF interrupt.
Then, upon resume signaling, the RESUMEF interrupt will trigger after a K-state has been
observed on the USBDP/USBDN lines for 2.5 µs.
• Stop3 mode - USBRESMEN must be set after SLEEPF becomes set to arm the LPRESF bit. Then,
upon a K-state on the bus while the device is in stop3 mode, the LPRESF bit will be set, indicating
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a resume from low-power suspend. This will trigger an asynchronous interrupt to wake the CPU
from stop3 mode and resume clocks to the USB module.
NOTE
As a precaution, after LPRESF is set, firmware must check the state of the
USB bus to see if the K-state was a result of a transient event and not a true
host-initiated resume. If this is the case, then the device can drop back into
stop3 if necessary. To do this, the RESUME interrupt can be enabled in
conjunction with the USBRESMEN feature. Then, after LPRESF is set, and
a K-state is still detected approximately 2.5 µs after clocks have restarted,
firmware can check that the RESUMEF interrupt has triggered, indicating
resume signaling from the host.
17.4.6.2.2 USB Reset Signaling
Reset can wake a device from the suspend state.
17.4.6.2.3 Remote Wakeup
The USB device can send a resume event to the host by writing to the CRESUME bit. Firmware must first
set the bit for the time period required by the USB Specification Rev. 2.0 (Section 7.1.7.7) and then clear
it to 0.
17.4.7 Resets
The module supports multiple types of resets. The first is a bus reset generated by the USB Host, the
second is a module reset generated by the MCU.
17.4.7.1 USB Bus Reset
At any time, the USB host may issue a reset to one or all of the devices attached to the bus. A USB reset
is defined as a period of single ended zero (SE0) on the cable for greater than 2.5 μs. When the device
detects reset signaling, it resets itself to the unconfigured state, and sets its USB address zero. The USB
host uses reset signaling to force one or all connected devices into a known state prior to commencing
enumeration.
The USB module responds to reset signaling by asserting the USBRST interrupt in the INTSTAT register.
Software is required to service this interrupt to ensure correct operation of the USB.
17.4.7.2 USB Module Reset
USB module resets are initiated on-chip. During a module reset, the USB module is configured in the
default mode. The USB module can also be forced into its reset state by setting the USBRESET bit in the
USBCTL0 register. The default mode includes the following settings:
• Interrupts masked.
• USB clock enabled
• USB voltage regulator disabled
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• USB transceiver disabled
• USBDP pullup disabled
• Endpoints disabled
• USB address register set to zero
17.4.8 Interrupts
Interrupts from the INTSTAT register signify events which occur during normal operation — USB start of
frame tokens (TOKSOF), packet completion (TOKDNE), USB bus reset (USBRST), endpoint errors
(ERROR), suspend and resume (SLEEP and RESUME), and endpoint stalled (STALL).
The ERRSTAT interrupts carry information about specific types of errors, which is needed on an
application specific basis. Using ERRSTAT, an application can determine exactly why a packet transfer
failed — due to CRC error, PID check error and so on.
Both registers are maskable via the INTENB and ERRENB registers. The INTSTAT and ERRSTAT are
used to signal interrupts in a two-level structure. Unmasked interrupts from the ERRSTAT register are
reported in the INTSTAT register.
Note that the interrupt registers work in concert with the STAT register. On receipt of an INTSTAT
interrupt, software can check the STAT register and determine which BDT entry was affected by the
transaction.
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Chapter 18
Development Support
18.1 Introduction
Development support systems in the HCS08 include the background debug controller (BDC) and the
on-chip debug module (DBG). The BDC provides a single-wire debug interface to the target MCU that
provides a convenient interface for programming the on-chip flash and other nonvolatile memories. The
BDC is also the primary debug interface for development and allows non-intrusive access to memory data
and traditional debug features such as CPU register modify, breakpoints, and single instruction trace
commands.
In the HCS08 family, address and data bus signals are not available on external pins (not even in test
modes). Debug is done through commands fed into the target MCU via the single-wire background debug
interface. The debug module provides a means to selectively trigger and capture bus information so an
external development system can reconstruct what happened inside the MCU on a cycle-by-cycle basis
without having external access to the address and data signals.
The alternate BDC clock source for MC9S08JM60 Series is the MCGLCLK. See Chapter 12,
“Multi-Purpose Clock Generator (S08MCGV1),” for more information about MCGLCLK and how to
select clock sources.
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18.1.1 Features
Features of the BDC module include:
• Single pin for mode selection and background communications
• BDC registers are not located in the memory map
• SYNC command to determine target communications rate
• Non-intrusive commands for memory access
• Active background mode commands for CPU register access
• GO and TRACE1 commands
• BACKGROUND command can wake CPU from stop or wait modes
• One hardware address breakpoint built into BDC
• Oscillator runs in stop mode, if BDC enabled
• COP watchdog disabled while in active background mode
Features of the ICE system include:
• Two trigger comparators: Two address + read/write (R/W) or one full address + data + R/W
• Flexible 8-word by 16-bit FIFO (first-in, first-out) buffer for capture information:
— Change-of-flow addresses or
— Event-only data
• Two types of breakpoints:
— Tag breakpoints for instruction opcodes
— Force breakpoints for any address access
• Nine trigger modes:
— Basic: A-only, A OR B
— Sequence: A then B
— Full: A AND B data, A AND NOT B data
— Event (store data): Event-only B, A then event-only B
— Range: Inside range (A ≤ address ≤ B), outside range (address < A or address > B)
18.2 Background Debug Controller (BDC)
All MCUs in the HCS08 family contain a single-wire background debug interface that supports in-circuit
programming of on-chip nonvolatile memory and sophisticated non-intrusive debug capabilities. Unlike
debug interfaces on earlier 8-bit MCUs, this system does not interfere with normal application resources.
It does not use any user memory or locations in the memory map and does not share any on-chip
peripherals.
BDC commands are divided into two groups:
• Active background mode commands require that the target MCU is in active background mode (the
user program is not running). Active background mode commands allow the CPU registers to be
read or written, and allow the user to trace one user instruction at a time, or GO to the user program
from active background mode.
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• Non-intrusive commands can be executed at any time even while the user’s program is running.
Non-intrusive commands allow a user to read or write MCU memory locations or access status and
control registers within the background debug controller.
Typically, a relatively simple interface pod is used to translate commands from a host computer into
commands for the custom serial interface to the single-wire background debug system. Depending on the
development tool vendor, this interface pod may use a standard RS-232 serial port, a parallel printer port,
or some other type of communications such as a universal serial bus (USB) to communicate between the
host PC and the pod. The pod typically connects to the target system with ground, the BKGD pin, RESET,
and sometimes VDD. An open-drain connection to reset allows the host to force a target system reset,
which is useful to regain control of a lost target system or to control startup of a target system before the
on-chip nonvolatile memory has been programmed. Sometimes VDD can be used to allow the pod to use
power from the target system to avoid the need for a separate power supply. However, if the pod is powered
separately, it can be connected to a running target system without forcing a target system reset or otherwise
disturbing the running application program.
Figure 18-1. BDM Tool Connector
18.2.1 BKGD Pin Description
BKGD is the single-wire background debug interface pin. The primary function of this pin is for
bidirectional serial communication of active background mode commands and data. During reset, this pin
is used to select between starting in active background mode or starting the user’s application program.
This pin is also used to request a timed sync response pulse to allow a host development tool to determine
the correct clock frequency for background debug serial communications.
BDC serial communications use a custom serial protocol first introduced on the M68HC12 Family of
microcontrollers. This protocol assumes the host knows the communication clock rate that is determined
by the target BDC clock rate. All communication is initiated and controlled by the host that drives a
high-to-low edge to signal the beginning of each bit time. Commands and data are sent most significant
bit first (MSB first). For a detailed description of the communications protocol, refer to Section 18.2.2,
“Communication Details.”
If a host is attempting to communicate with a target MCU that has an unknown BDC clock rate, a SYNC
command may be sent to the target MCU to request a timed sync response signal from which the host can
determine the correct communication speed.
BKGD is a pseudo-open-drain pin and there is an on-chip pullup so no external pullup resistor is required.
Unlike typical open-drain pins, the external RC time constant on this pin, which is influenced by external
capacitance, plays almost no role in signal rise time. The custom protocol provides for brief, actively
driven speedup pulses to force rapid rise times on this pin without risking harmful drive level conflicts.
Refer to Section 18.2.2, “Communication Details,” for more detail.
2
4
6NO CONNECT 5
NO CONNECT 3
1
RESET
BKGD GND
VDD
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When no debugger pod is connected to the 6-pin BDM interface connector, the internal pullup on BKGD
chooses normal operating mode. When a debug pod is connected to BKGD it is possible to force the MCU
into active background mode after reset. The specific conditions for forcing active background depend
upon the HCS08 derivative (refer to the introduction to this Development Support section). It is not
necessary to reset the target MCU to communicate with it through the background debug interface.
18.2.2 Communication Details
The BDC serial interface requires the external controller to generate a falling edge on the BKGD pin to
indicate the start of each bit time. The external controller provides this falling edge whether data is
transmitted or received.
BKGD is a pseudo-open-drain pin that can be driven either by an external controller or by the MCU. Data
is transferred MSB first at 16 BDC clock cycles per bit (nominal speed). The interface times out if
512 BDC clock cycles occur between falling edges from the host. Any BDC command that was in progress
when this timeout occurs is aborted without affecting the memory or operating mode of the target MCU
system.
The custom serial protocol requires the debug pod to know the target BDC communication clock speed.
The clock switch (CLKSW) control bit in the BDC status and control register allows the user to select the
BDC clock source. The BDC clock source can either be the bus or the alternate BDC clock source.
The BKGD pin can receive a high or low level or transmit a high or low level. The following diagrams
show timing for each of these cases. Interface timing is synchronous to clocks in the target BDC, but
asynchronous to the external host. The internal BDC clock signal is shown for reference in counting
cycles.
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Figure 18-2 shows an external host transmitting a logic 1 or 0 to the BKGD pin of a target HCS08 MCU.
The host is asynchronous to the target so there is a 0-to-1 cycle delay from the host-generated falling edge
to where the target perceives the beginning of the bit time. Ten target BDC clock cycles later, the target
senses the bit level on the BKGD pin. Typically, the host actively drives the pseudo-open-drain BKGD pin
during host-to-target transmissions to speed up rising edges. Because the target does not drive the BKGD
pin during the host-to-target transmission period, there is no need to treat the line as an open-drain signal
during this period.
Figure 18-2. BDC Host-to-Target Serial Bit Timing
EARLIEST START
TARGET SENSES BIT LEVEL
10 CYCLES
SYNCHRONIZATION
UNCERTAINTY
BDC CLOCK
(TARGET MCU)
HOST
TRANSMIT 1
HOST
TRANSMIT 0
PERCEIVED START
OF BIT TIME
OF NEXT BIT
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Figure 18-3 shows the host receiving a logic 1 from the target HCS08 MCU. Because the host is
asynchronous to the target MCU, there is a 0-to-1 cycle delay from the host-generated falling edge on
BKGD to the perceived start of the bit time in the target MCU. The host holds the BKGD pin low long
enough for the target to recognize it (at least two target BDC cycles). The host must release the low drive
before the target MCU drives a brief active-high speedup pulse seven cycles after the perceived start of the
bit time. The host should sample the bit level about 10 cycles after it started the bit time.
Figure 18-3. BDC Target-to-Host Serial Bit Timing (Logic 1)
HOST SAMPLES BKGD PIN
10 CYCLES
BDC CLOCK
(TARGET MCU)
HOST DRIVE
TO BKGD PIN
TARGET MCU
SPEEDUP PULSE
PERCEIVED START
OF BIT TIME
HIGH-IMPEDANCE
HIGH-IMPEDANCE HIGH-IMPEDANCE
BKGD PIN
R-C RISE
10 CYCLES
EARLIEST START
OF NEXT BIT
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Figure 18-4 shows the host receiving a logic 0 from the target HCS08 MCU. Because the host is
asynchronous to the target MCU, there is a 0-to-1 cycle delay from the host-generated falling edge on
BKGD to the start of the bit time as perceived by the target MCU. The host initiates the bit time but the
target HCS08 finishes it. Because the target wants the host to receive a logic 0, it drives the BKGD pin low
for 13 BDC clock cycles, then briefly drives it high to speed up the rising edge. The host samples the bit
level about 10 cycles after starting the bit time.
Figure 18-4. BDM Target-to-Host Serial Bit Timing (Logic 0)
10 CYCLES
BDC CLOCK
(TARGET MCU)
HOST DRIVE
TO BKGD PIN
TARGET MCU
DRIVE AND
PERCEIVED START
OF BIT TIME
HIGH-IMPEDANCE
BKGD PIN
10 CYCLES
SPEED-UP PULSE
SPEEDUP
PULSE
EARLIEST START
OF NEXT BIT
HOST SAMPLES BKGD PIN
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18.2.3 BDC Commands
BDC commands are sent serially from a host computer to the BKGD pin of the target HCS08 MCU. All
commands and data are sent MSB-first using a custom BDC communications protocol. Active background
mode commands require that the target MCU is currently in the active background mode while
non-intrusive commands may be issued at any time whether the target MCU is in active background mode
or running a user application program.
Table 18-1 shows all HCS08 BDC commands, a shorthand description of their coding structure, and the
meaning of each command.
Coding Structure Nomenclature
This nomenclature is used in Table 18-1 to describe the coding structure of the BDC commands.
Commands begin with an 8-bit hexadecimal command code in the host-to-target
direction (most significant bit first)
/ = separates parts of the command
d = delay 16 target BDC clock cycles
AAAA = a 16-bit address in the host-to-target direction
RD = 8 bits of read data in the target-to-host direction
WD = 8 bits of write data in the host-to-target direction
RD16 = 16 bits of read data in the target-to-host direction
WD16 = 16 bits of write data in the host-to-target direction
SS = the contents of BDCSCR in the target-to-host direction (STATUS)
CC = 8 bits of write data for BDCSCR in the host-to-target direction (CONTROL)
RBKP = 16 bits of read data in the target-to-host direction (from BDCBKPT breakpoint
register)
WBKP = 16 bits of write data in the host-to-target direction (for BDCBKPT breakpoint register)
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Table 18-1. BDC Command Summary
Command
Mnemonic
Active BDM/
Non-intrusive
Coding
Structure Description
SYNC Non-intrusive n/a1
1The SYNC command is a special operation that does not have a command code.
Request a timed reference pulse to determine
target BDC communication speed
ACK_ENABLE Non-intrusive D5/d Enable acknowledge protocol. Refer to
Freescale document order no. HCS08RMv1/D.
ACK_DISABLE Non-intrusive D6/d Disable acknowledge protocol. Refer to
Freescale document order no. HCS08RMv1/D.
BACKGROUND Non-intrusive 90/d Enter active background mode if enabled
(ignore if ENBDM bit equals 0)
READ_STATUS Non-intrusive E4/SS Read BDC status from BDCSCR
WRITE_CONTROL Non-intrusive C4/CC Write BDC controls in BDCSCR
READ_BYTE Non-intrusive E0/AAAA/d/RD Read a byte from target memory
READ_BYTE_WS Non-intrusive E1/AAAA/d/SS/RD Read a byte and report status
READ_LAST Non-intrusive E8/SS/RD Re-read byte from address just read and report
status
WRITE_BYTE Non-intrusive C0/AAAA/WD/d Write a byte to target memory
WRITE_BYTE_WS Non-intrusive C1/AAAA/WD/d/SS Write a byte and report status
READ_BKPT Non-intrusive E2/RBKP Read BDCBKPT breakpoint register
WRITE_BKPT Non-intrusive C2/WBKP Write BDCBKPT breakpoint register
GO Active BDM 08/d Go to execute the user application program
starting at the address currently in the PC
TRACE1 Active BDM 10/d Trace 1 user instruction at the address in the
PC, then return to active background mode
TAGGO Active BDM 18/d Same as GO but enable external tagging
(HCS08 devices have no external tagging pin)
READ_A Active BDM 68/d/RD Read accumulator (A)
READ_CCR Active BDM 69/d/RD Read condition code register (CCR)
READ_PC Active BDM 6B/d/RD16 Read program counter (PC)
READ_HX Active BDM 6C/d/RD16 Read H and X register pair (H:X)
READ_SP Active BDM 6F/d/RD16 Read stack pointer (SP)
READ_NEXT Active BDM 70/d/RD Increment H:X by one then read memory byte
located at H:X
READ_NEXT_WS Active BDM 71/d/SS/RD Increment H:X by one then read memory byte
located at H:X. Report status and data.
WRITE_A Active BDM 48/WD/d Write accumulator (A)
WRITE_CCR Active BDM 49/WD/d Write condition code register (CCR)
WRITE_PC Active BDM 4B/WD16/d Write program counter (PC)
WRITE_HX Active BDM 4C/WD16/d Write H and X register pair (H:X)
WRITE_SP Active BDM 4F/WD16/d Write stack pointer (SP)
WRITE_NEXT Active BDM 50/WD/d Increment H:X by one, then write memory byte
located at H:X
WRITE_NEXT_WS Active BDM 51/WD/d/SS Increment H:X by one, then write memory byte
located at H:X. Also report status.
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The SYNC command is unlike other BDC commands because the host does not necessarily know the
correct communications speed to use for BDC communications until after it has analyzed the response to
the SYNC command.
To issue a SYNC command, the host:
• Drives the BKGD pin low for at least 128 cycles of the slowest possible BDC clock (The slowest
clock is normally the reference oscillator/64 or the self-clocked rate/64.)
• Drives BKGD high for a brief speedup pulse to get a fast rise time (This speedup pulse is typically
one cycle of the fastest clock in the system.)
• Removes all drive to the BKGD pin so it reverts to high impedance
• Monitors the BKGD pin for the sync response pulse
The target, upon detecting the SYNC request from the host (which is a much longer low time than would
ever occur during normal BDC communications):
• Waits for BKGD to return to a logic high
• Delays 16 cycles to allow the host to stop driving the high speedup pulse
• Drives BKGD low for 128 BDC clock cycles
• Drives a 1-cycle high speedup pulse to force a fast rise time on BKGD
• Removes all drive to the BKGD pin so it reverts to high impedance
The host measures the low time of this 128-cycle sync response pulse and determines the correct speed for
subsequent BDC communications. Typically, the host can determine the correct communication speed
within a few percent of the actual target speed and the communication protocol can easily tolerate speed
errors of several percent.
18.2.4 BDC Hardware Breakpoint
The BDC includes one relatively simple hardware breakpoint that compares the CPU address bus to a
16-bit match value in the BDCBKPT register. This breakpoint can generate a forced breakpoint or a tagged
breakpoint. A forced breakpoint causes the CPU to enter active background mode at the first instruction
boundary following any access to the breakpoint address. The tagged breakpoint causes the instruction
opcode at the breakpoint address to be tagged so that the CPU will enter active background mode rather
than executing that instruction if and when it reaches the end of the instruction queue. This implies that
tagged breakpoints can only be placed at the address of an instruction opcode while forced breakpoints can
be set at any address.
The breakpoint enable (BKPTEN) control bit in the BDC status and control register (BDCSCR) is used to
enable the breakpoint logic (BKPTEN = 1). When BKPTEN = 0, its default value after reset, the
breakpoint logic is disabled and no BDC breakpoints are requested regardless of the values in other BDC
breakpoint registers and control bits. The force/tag select (FTS) control bit in BDCSCR is used to select
forced (FTS = 1) or tagged (FTS = 0) type breakpoints.
The on-chip debug module (DBG) includes circuitry for two additional hardware breakpoints that are more
flexible than the simple breakpoint in the BDC module.
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18.3 On-Chip Debug System (DBG)
Because HCS08 devices do not have external address and data buses, the most important functions of an
in-circuit emulator have been built onto the chip with the MCU. The debug system consists of an 8-stage
FIFO that can store address or data bus information, and a flexible trigger system to decide when to capture
bus information and what information to capture. The system relies on the single-wire background debug
system to access debug control registers and to read results out of the eight stage FIFO.
The debug module includes control and status registers that are accessible in the user’s memory map.
These registers are located in the high register space to avoid using valuable direct page memory space.
Most of the debug module’s functions are used during development, and user programs rarely access any
of the control and status registers for the debug module. The one exception is that the debug system can
provide the means to implement a form of ROM patching. This topic is discussed in greater detail in
Section 18.3.6, “Hardware Breakpoints.”
18.3.1 Comparators A and B
Two 16-bit comparators (A and B) can optionally be qualified with the R/W signal and an opcode tracking
circuit. Separate control bits allow you to ignore R/W for each comparator. The opcode tracking circuitry
optionally allows you to specify that a trigger will occur only if the opcode at the specified address is
actually executed as opposed to only being read from memory into the instruction queue. The comparators
are also capable of magnitude comparisons to support the inside range and outside range trigger modes.
Comparators are disabled temporarily during all BDC accesses.
The A comparator is always associated with the 16-bit CPU address. The B comparator compares to the
CPU address or the 8-bit CPU data bus, depending on the trigger mode selected. Because the CPU data
bus is separated into a read data bus and a write data bus, the RWAEN and RWA control bits have an
additional purpose, in full address plus data comparisons they are used to decide which of these buses to
use in the comparator B data bus comparisons. If RWAEN = 1 (enabled) and RWA = 0 (write), the CPU’s
write data bus is used. Otherwise, the CPU’s read data bus is used.
The currently selected trigger mode determines what the debugger logic does when a comparator detects
a qualified match condition. A match can cause:
• Generation of a breakpoint to the CPU
• Storage of data bus values into the FIFO
• Starting to store change-of-flow addresses into the FIFO (begin type trace)
• Stopping the storage of change-of-flow addresses into the FIFO (end type trace)
18.3.2 Bus Capture Information and FIFO Operation
The usual way to use the FIFO is to setup the trigger mode and other control options, then arm the
debugger. When the FIFO has filled or the debugger has stopped storing data into the FIFO, you would
read the information out of it in the order it was stored into the FIFO. Status bits indicate the number of
words of valid information that are in the FIFO as data is stored into it. If a trace run is manually halted by
writing 0 to ARM before the FIFO is full (CNT = 1:0:0:0), the information is shifted by one position and
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the host must perform ((8 – CNT) – 1) dummy reads of the FIFO to advance it to the first significant entry
in the FIFO.
In most trigger modes, the information stored in the FIFO consists of 16-bit change-of-flow addresses. In
these cases, read DBGFH then DBGFL to get one coherent word of information out of the FIFO. Reading
DBGFL (the low-order byte of the FIFO data port) causes the FIFO to shift so the next word of information
is available at the FIFO data port. In the event-only trigger modes (see Section 18.3.5, “Trigger Modes”),
8-bit data information is stored into the FIFO. In these cases, the high-order half of the FIFO (DBGFH) is
not used and data is read out of the FIFO by simply reading DBGFL. Each time DBGFL is read, the FIFO
is shifted so the next data value is available through the FIFO data port at DBGFL.
In trigger modes where the FIFO is storing change-of-flow addresses, there is a delay between CPU
addresses and the input side of the FIFO. Because of this delay, if the trigger event itself is a
change-of-flow address or a change-of-flow address appears during the next two bus cycles after a trigger
event starts the FIFO, it will not be saved into the FIFO. In the case of an end-trace, if the trigger event is
a change-of-flow, it will be saved as the last change-of-flow entry for that debug run.
The FIFO can also be used to generate a profile of executed instruction addresses when the debugger is
not armed. When ARM = 0, reading DBGFL causes the address of the most-recently fetched opcode to be
saved in the FIFO. To use the profiling feature, a host debugger would read addresses out of the FIFO by
reading DBGFH then DBGFL at regular periodic intervals. The first eight values would be discarded
because they correspond to the eight DBGFL reads needed to initially fill the FIFO. Additional periodic
reads of DBGFH and DBGFL return delayed information about executed instructions so the host debugger
can develop a profile of executed instruction addresses.
18.3.3 Change-of-Flow Information
To minimize the amount of information stored in the FIFO, only information related to instructions that
cause a change to the normal sequential execution of instructions is stored. With knowledge of the source
and object code program stored in the target system, an external debugger system can reconstruct the path
of execution through many instructions from the change-of-flow information stored in the FIFO.
For conditional branch instructions where the branch is taken (branch condition was true), the source
address is stored (the address of the conditional branch opcode). Because BRA and BRN instructions are
not conditional, these events do not cause change-of-flow information to be stored in the FIFO.
Indirect JMP and JSR instructions use the current contents of the H:X index register pair to determine the
destination address, so the debug system stores the run-time destination address for any indirect JMP or
JSR. For interrupts, RTI, or RTS, the destination address is stored in the FIFO as change-of-flow
information.
18.3.4 Tag vs. Force Breakpoints and Triggers
Tagging is a term that refers to identifying an instruction opcode as it is fetched into the instruction queue,
but not taking any other action until and unless that instruction is actually executed by the CPU. This
distinction is important because any change-of-flow from a jump, branch, subroutine call, or interrupt
causes some instructions that have been fetched into the instruction queue to be thrown away without being
executed.
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A force-type breakpoint waits for the current instruction to finish and then acts upon the breakpoint
request. The usual action in response to a breakpoint is to go to active background mode rather than
continuing to the next instruction in the user application program.
The tag vs. force terminology is used in two contexts within the debug module. The first context refers to
breakpoint requests from the debug module to the CPU. The second refers to match signals from the
comparators to the debugger control logic. When a tag-type break request is sent to the CPU, a signal is
entered into the instruction queue along with the opcode so that if/when this opcode ever executes, the
CPU will effectively replace the tagged opcode with a BGND opcode so the CPU goes to active
background mode rather than executing the tagged instruction. When the TRGSEL control bit in the DBGT
register is set to select tag-type operation, the output from comparator A or B is qualified by a block of
logic in the debug module that tracks opcodes and only produces a trigger to the debugger if the opcode at
the compare address is actually executed. There is separate opcode tracking logic for each comparator so
more than one compare event can be tracked through the instruction queue at a time.
18.3.5 Trigger Modes
The trigger mode controls the overall behavior of a debug run. The 4-bit TRG field in the DBGT register
selects one of nine trigger modes. When TRGSEL = 1 in the DBGT register, the output of the comparator
must propagate through an opcode tracking circuit before triggering FIFO actions. The BEGIN bit in
DBGT chooses whether the FIFO begins storing data when the qualified trigger is detected (begin trace),
or the FIFO stores data in a circular fashion from the time it is armed until the qualified trigger is detected
(end trigger).
A debug run is started by writing a 1 to the ARM bit in the DBGC register, which sets the ARMF flag and
clears the AF and BF flags and the CNT bits in DBGS. A begin-trace debug run ends when the FIFO gets
full. An end-trace run ends when the selected trigger event occurs. Any debug run can be stopped manually
by writing a 0 to ARM or DBGEN in DBGC.
In all trigger modes except event-only modes, the FIFO stores change-of-flow addresses. In event-only
trigger modes, the FIFO stores data in the low-order eight bits of the FIFO.
The BEGIN control bit is ignored in event-only trigger modes and all such debug runs are begin type
traces. When TRGSEL = 1 to select opcode fetch triggers, it is not necessary to use R/W in comparisons
because opcode tags would only apply to opcode fetches that are always read cycles. It would also be
unusual to specify TRGSEL = 1 while using a full mode trigger because the opcode value is normally
known at a particular address.
The following trigger mode descriptions only state the primary comparator conditions that lead to a trigger.
Either comparator can usually be further qualified with R/W by setting RWAEN (RWBEN) and the
corresponding RWA (RWB) value to be matched against R/W. The signal from the comparator with
optional R/W qualification is used to request a CPU breakpoint if BRKEN = 1 and TAG determines
whether the CPU request will be a tag request or a force request.
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A-Only — Trigger when the address matches the value in comparator A
A OR B — Trigger when the address matches either the value in comparator A or the value in
comparator B
A Then B — Trigger when the address matches the value in comparator B but only after the address for
another cycle matched the value in comparator A. There can be any number of cycles after the A match
and before the B match.
A AND B Data (Full Mode) — This is called a full mode because address, data, and R/W (optionally)
must match within the same bus cycle to cause a trigger event. Comparator A checks address, the low byte
of comparator B checks data, and R/W is checked against RWA if RWAEN = 1. The high-order half of
comparator B is not used.
In full trigger modes it is not useful to specify a tag-type CPU breakpoint (BRKEN = TAG = 1), but if you
do, the comparator B data match is ignored for the purpose of issuing the tag request to the CPU and the
CPU breakpoint is issued when the comparator A address matches.
A AND NOT B Data (Full Mode) — Address must match comparator A, data must not match the low
half of comparator B, and R/W must match RWA if RWAEN = 1. All three conditions must be met within
the same bus cycle to cause a trigger.
In full trigger modes it is not useful to specify a tag-type CPU breakpoint (BRKEN = TAG = 1), but if you
do, the comparator B data match is ignored for the purpose of issuing the tag request to the CPU and the
CPU breakpoint is issued when the comparator A address matches.
Event-Only B (Store Data) — Trigger events occur each time the address matches the value in
comparator B. Trigger events cause the data to be captured into the FIFO. The debug run ends when the
FIFO becomes full.
A Then Event-Only B (Store Data) — After the address has matched the value in comparator A, a trigger
event occurs each time the address matches the value in comparator B. Trigger events cause the data to be
captured into the FIFO. The debug run ends when the FIFO becomes full.
Inside Range (A ≤ Address ≤ B) — A trigger occurs when the address is greater than or equal to the value
in comparator A and less than or equal to the value in comparator B at the same time.
Outside Range (Address < A or Address > B) — A trigger occurs when the address is either less than
the value in comparator A or greater than the value in comparator B.
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18.3.6 Hardware Breakpoints
The BRKEN control bit in the DBGC register may be set to 1 to allow any of the trigger conditions
described in Section 18.3.5, “Trigger Modes,” to be used to generate a hardware breakpoint request to the
CPU. TAG in DBGC controls whether the breakpoint request will be treated as a tag-type breakpoint or a
force-type breakpoint. A tag breakpoint causes the current opcode to be marked as it enters the instruction
queue. If a tagged opcode reaches the end of the pipe, the CPU executes a BGND instruction to go to active
background mode rather than executing the tagged opcode. A force-type breakpoint causes the CPU to
finish the current instruction and then go to active background mode.
If the background mode has not been enabled (ENBDM = 1) by a serial WRITE_CONTROL command
through the BKGD pin, the CPU will execute an SWI instruction instead of going to active background
mode.
18.4 Register Definition
This section contains the descriptions of the BDC and DBG registers and control bits.
Refer to the high-page register summary in the device overview chapter of this data sheet for the absolute
address assignments for all DBG registers. This section refers to registers and control bits only by their
names. A Freescale-provided equate or header file is used to translate these names into the appropriate
absolute addresses.
18.4.1 BDC Registers and Control Bits
The BDC has two registers:
• The BDC status and control register (BDCSCR) is an 8-bit register containing control and status
bits for the background debug controller.
• The BDC breakpoint match register (BDCBKPT) holds a 16-bit breakpoint match address.
These registers are accessed with dedicated serial BDC commands and are not located in the memory
space of the target MCU (so they do not have addresses and cannot be accessed by user programs).
Some of the bits in the BDCSCR have write limitations; otherwise, these registers may be read or written
at any time. For example, the ENBDM control bit may not be written while the MCU is in active
background mode. (This prevents the ambiguous condition of the control bit forbidding active background
mode while the MCU is already in active background mode.) Also, the four status bits (BDMACT, WS,
WSF, and DVF) are read-only status indicators and can never be written by the WRITE_CONTROL serial
BDC command. The clock switch (CLKSW) control bit may be read or written at any time.
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18.4.1.1 BDC Status and Control Register (BDCSCR)
This register can be read or written by serial BDC commands (READ_STATUS and WRITE_CONTROL)
but is not accessible to user programs because it is not located in the normal memory map of the MCU.
76543210
R
ENBDM
BDMACT
BKPTEN FTS CLKSW
WS WSF DVF
W
Normal
Reset
00000000
Reset in
Active BDM:
11001000
= Unimplemented or Reserved
Figure 18-5. BDC Status and Control Register (BDCSCR)
Table 18-2. BDCSCR Register Field Descriptions
Field Description
7
ENBDM
Enable BDM (Permit Active Background Mode) — Typically, this bit is written to 1 by the debug host shortly
after the beginning of a debug session or whenever the debug host resets the target and remains 1 until a normal
reset clears it.
0 BDM cannot be made active (non-intrusive commands still allowed)
1 BDM can be made active to allow active background mode commands
6
BDMACT
Background Mode Active Status — This is a read-only status bit.
0 BDM not active (user application program running)
1 BDM active and waiting for serial commands
5
BKPTEN
BDC Breakpoint Enable — If this bit is clear, the BDC breakpoint is disabled and the FTS (force tag select)
control bit and BDCBKPT match register are ignored.
0 BDC breakpoint disabled
1 BDC breakpoint enabled
4
FTS
Force/Tag Select — When FTS = 1, a breakpoint is requested whenever the CPU address bus matches the
BDCBKPT match register. When FTS = 0, a match between the CPU address bus and the BDCBKPT register
causes the fetched opcode to be tagged. If this tagged opcode ever reaches the end of the instruction queue,
the CPU enters active background mode rather than executing the tagged opcode.
0 Tag opcode at breakpoint address and enter active background mode if CPU attempts to execute that
instruction
1 Breakpoint match forces active background mode at next instruction boundary (address need not be an
opcode)
3
CLKSW
Select Source for BDC Communications Clock — CLKSW defaults to 0, which selects the alternate BDC clock
source.
0 Alternate BDC clock source
1 MCU bus clock
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18.4.1.2 BDC Breakpoint Match Register (BDCBKPT)
This 16-bit register holds the address for the hardware breakpoint in the BDC. The BKPTEN and FTS
control bits in BDCSCR are used to enable and configure the breakpoint logic. Dedicated serial BDC
commands (READ_BKPT and WRITE_BKPT) are used to read and write the BDCBKPT register but is
not accessible to user programs because it is not located in the normal memory map of the MCU.
Breakpoints are normally set while the target MCU is in active background mode before running the user
application program. For additional information about setup and use of the hardware breakpoint logic in
the BDC, refer to Section 18.2.4, “BDC Hardware Breakpoint.”
18.4.2 System Background Debug Force Reset Register (SBDFR)
This register contains a single write-only control bit. A serial background mode command such as
WRITE_BYTE must be used to write to SBDFR. Attempts to write this register from a user program are
ignored. Reads always return 0x00.
Figure 18-6. System Background Debug Force Reset Register (SBDFR)
2
WS
Wait or Stop Status — When the target CPU is in wait or stop mode, most BDC commands cannot function.
However, the BACKGROUND command can be used to force the target CPU out of wait or stop and into active
background mode where all BDC commands work. Whenever the host forces the target MCU into active
background mode, the host should issue a READ_STATUS command to check that BDMACT = 1 before
attempting other BDC commands.
0 Target CPU is running user application code or in active background mode (was not in wait or stop mode when
background became active)
1 Target CPU is in wait or stop mode, or a BACKGROUND command was used to change from wait or stop to
active background mode
1
WSF
Wait or Stop Failure Status — This status bit is set if a memory access command failed due to the target CPU
executing a wait or stop instruction at or about the same time. The usual recovery strategy is to issue a
BACKGROUND command to get out of wait or stop mode into active background mode, repeat the command
that failed, then return to the user program. (Typically, the host would restore CPU registers and stack values and
re-execute the wait or stop instruction.)
0 Memory access did not conflict with a wait or stop instruction
1 Memory access command failed because the CPU entered wait or stop mode
0
DVF
Data Valid Failure Status — This status bit is not used in the MC9S08JM60 Series because it does not have
any slow access memory.
0 Memory access did not conflict with a slow memory access
1 Memory access command failed because CPU was not finished with a slow memory access
76543210
R00000000
WBDFR1
1BDFR is writable only through serial background mode debug commands, not from user programs.
Reset00000000
= Unimplemented or Reserved
Table 18-2. BDCSCR Register Field Descriptions (continued)
Field Description
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18.4.3 DBG Registers and Control Bits
The debug module includes nine bytes of register space for three 16-bit registers and three 8-bit control
and status registers. These registers are located in the high register space of the normal memory map so
they are accessible to normal application programs. These registers are rarely if ever accessed by normal
user application programs with the possible exception of a ROM patching mechanism that uses the
breakpoint logic.
18.4.3.1 Debug Comparator A High Register (DBGCAH)
This register contains compare value bits for the high-order eight bits of comparator A. This register is
forced to 0x00 at reset and can be read at any time or written at any time unless ARM = 1.
18.4.3.2 Debug Comparator A Low Register (DBGCAL)
This register contains compare value bits for the low-order eight bits of comparator A. This register is
forced to 0x00 at reset and can be read at any time or written at any time unless ARM = 1.
18.4.3.3 Debug Comparator B High Register (DBGCBH)
This register contains compare value bits for the high-order eight bits of comparator B. This register is
forced to 0x00 at reset and can be read at any time or written at any time unless ARM = 1.
18.4.3.4 Debug Comparator B Low Register (DBGCBL)
This register contains compare value bits for the low-order eight bits of comparator B. This register is
forced to 0x00 at reset and can be read at any time or written at any time unless ARM = 1.
18.4.3.5 Debug FIFO High Register (DBGFH)
This register provides read-only access to the high-order eight bits of the FIFO. Writes to this register have
no meaning or effect. In the event-only trigger modes, the FIFO only stores data into the low-order byte
of each FIFO word, so this register is not used and will read 0x00.
Reading DBGFH does not cause the FIFO to shift to the next word. When reading 16-bit words out of the
FIFO, read DBGFH before reading DBGFL because reading DBGFL causes the FIFO to advance to the
next word of information.
Table 18-3. SBDFR Register Field Description
Field Description
0
BDFR
Background Debug Force Reset — A serial active background mode command such as WRITE_BYTE allows
an external debug host to force a target system reset. Writing 1 to this bit forces an MCU reset. This bit cannot
be written from a user program.
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18.4.3.6 Debug FIFO Low Register (DBGFL)
This register provides read-only access to the low-order eight bits of the FIFO. Writes to this register have
no meaning or effect.
Reading DBGFL causes the FIFO to shift to the next available word of information. When the debug
module is operating in event-only modes, only 8-bit data is stored into the FIFO (high-order half of each
FIFO word is unused). When reading 8-bit words out of the FIFO, simply read DBGFL repeatedly to get
successive bytes of data from the FIFO. It isn’t necessary to read DBGFH in this case.
Do not attempt to read data from the FIFO while it is still armed (after arming but before the FIFO is filled
or ARMF is cleared) because the FIFO is prevented from advancing during reads of DBGFL. This can
interfere with normal sequencing of reads from the FIFO.
Reading DBGFL while the debugger is not armed causes the address of the most-recently fetched opcode
to be stored to the last location in the FIFO. By reading DBGFH then DBGFL periodically, external host
software can develop a profile of program execution. After eight reads from the FIFO, the ninth read will
return the information that was stored as a result of the first read. To use the profiling feature, read the FIFO
eight times without using the data to prime the sequence and then begin using the data to get a delayed
picture of what addresses were being executed. The information stored into the FIFO on reads of DBGFL
(while the FIFO is not armed) is the address of the most-recently fetched opcode.
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18.4.3.7 Debug Control Register (DBGC)
This register can be read or written at any time.
76543210
R
DBGEN ARM TAG BRKEN RWA RWAEN RWB RWBEN
W
Reset00000000
Figure 18-7. Debug Control Register (DBGC)
Table 18-4. DBGC Register Field Descriptions
Field Description
7
DBGEN
Debug Module Enable — Used to enable the debug module. DBGEN cannot be set to 1 if the MCU is secure.
0DBG disabled
1 DBG enabled
6
ARM
Arm Control — Controls whether the debugger is comparing and storing information in the FIFO. A write is used
to set this bit (and ARMF) and completion of a debug run automatically clears it. Any debug run can be manually
stopped by writing 0 to ARM or to DBGEN.
0 Debugger not armed
1 Debugger armed
5
TAG
Tag/Force Select — Controls whether break requests to the CPU will be tag or force type requests. If
BRKEN = 0, this bit has no meaning or effect.
0 CPU breaks requested as force type requests
1 CPU breaks requested as tag type requests
4
BRKEN
Break Enable — Controls whether a trigger event will generate a break request to the CPU. Trigger events can
cause information to be stored in the FIFO without generating a break request to the CPU. For an end trace, CPU
break requests are issued to the CPU when the comparator(s) and R/W meet the trigger requirements. For a
begin trace, CPU break requests are issued when the FIFO becomes full. TRGSEL does not affect the timing of
CPU break requests.
0 CPU break requests not enabled
1 Triggers cause a break request to the CPU
3
RWA
R/W Comparison Value for Comparator A — When RWAEN = 1, this bit determines whether a read or a write
access qualifies comparator A. When RWAEN = 0, RWA and the R/W signal do not affect comparator A.
0 Comparator A can only match on a write cycle
1 Comparator A can only match on a read cycle
2
RWAEN
Enable R/W for Comparator A — Controls whether the level of R/W is considered for a comparator A match.
0 R/W is not used in comparison A
1 R/W is used in comparison A
1
RWB
R/W Comparison Value for Comparator B — When RWBEN = 1, this bit determines whether a read or a write
access qualifies comparator B. When RWBEN = 0, RWB and the R/W signal do not affect comparator B.
0 Comparator B can match only on a write cycle
1 Comparator B can match only on a read cycle
0
RWBEN
Enable R/W for Comparator B — Controls whether the level of R/W is considered for a comparator B match.
0 R/W is not used in comparison B
1 R/W is used in comparison B
Development Support
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 347
18.4.3.8 Debug Trigger Register (DBGT)
This register can be read any time, but may be written only if ARM = 0, except bits 4 and 5 are hard-wired
to 0s.
76543210
R
TRGSEL BEGIN
00
TRG3 TRG2 TRG1 TRG0
W
Reset00000000
= Unimplemented or Reserved
Figure 18-8. Debug Trigger Register (DBGT)
Table 18-5. DBGT Register Field Descriptions
Field Description
7
TRGSEL
Trigger Type — Controls whether the match outputs from comparators A and B are qualified with the opcode
tracking logic in the debug module. If TRGSEL is set, a match signal from comparator A or B must propagate
through the opcode tracking logic and a trigger event is only signalled to the FIFO logic if the opcode at the match
address is actually executed.
0 Trigger on access to compare address (force)
1 Trigger if opcode at compare address is executed (tag)
6
BEGIN
Begin/End Trigger Select — Controls whether the FIFO starts filling at a trigger or fills in a circular manner until
a trigger ends the capture of information. In event-only trigger modes, this bit is ignored and all debug runs are
assumed to be begin traces.
0 Data stored in FIFO until trigger (end trace)
1 Trigger initiates data storage (begin trace)
3:0
TRG[3:0]
Select Trigger Mode — Selects one of nine triggering modes, as described below.
0000 A-only
0001 A OR B
0010 A Then B
0011 Event-only B (store data)
0100 A then event-only B (store data)
0101 A AND B data (full mode)
0110 A AND NOT B data (full mode)
0111 Inside range: A ≤ address ≤ B
1000 Outside range: address < A or address > B
1001 – 1111 (No trigger)
Development Support
MC9S08JM60 Series Data Sheet, Rev. 3
348 Freescale Semiconductor
18.4.3.9 Debug Status Register (DBGS)
This is a read-only status register.
76543210
R AF BF ARMF 0 CNT3 CNT2 CNT1 CNT0
W
Reset00000000
= Unimplemented or Reserved
Figure 18-9. Debug Status Register (DBGS)
Table 18-6. DBGS Register Field Descriptions
Field Description
7
AF
Trigger Match A Flag — AF is cleared at the start of a debug run and indicates whether a trigger match A
condition was met since arming.
0 Comparator A has not matched
1 Comparator A match
6
BF
Trigger Match B Flag — BF is cleared at the start of a debug run and indicates whether a trigger match B
condition was met since arming.
0 Comparator B has not matched
1 Comparator B match
5
ARMF
Arm Flag — While DBGEN = 1, this status bit is a read-only image of ARM in DBGC. This bit is set by writing 1
to the ARM control bit in DBGC (while DBGEN = 1) and is automatically cleared at the end of a debug run. A
debug run is completed when the FIFO is full (begin trace) or when a trigger event is detected (end trace). A
debug run can also be ended manually by writing 0 to ARM or DBGEN in DBGC.
0 Debugger not armed
1 Debugger armed
3:0
CNT[3:0]
FIFO Valid Count — These bits are cleared at the start of a debug run and indicate the number of words of valid
data in the FIFO at the end of a debug run. The value in CNT does not decrement as data is read out of the FIFO.
The external debug host is responsible for keeping track of the count as information is read out of the FIFO.
0000 Number of valid words in FIFO = No valid data
0001 Number of valid words in FIFO = 1
0010 Number of valid words in FIFO = 2
0011 Number of valid words in FIFO = 3
0100 Number of valid words in FIFO = 4
0101 Number of valid words in FIFO = 5
0110 Number of valid words in FIFO = 6
0111 Number of valid words in FIFO = 7
1000 Number of valid words in FIFO = 8
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 349
Appendix A
Electrical Characteristics
A.1 Introduction
This appendix contains electrical and timing specifications for the MC9S08JM60 series of
microcontrollers available at the time of publication.
A.2 Parameter Classification
The electrical parameters shown in this supplement are guaranteed by various methods. To give the
customer a better understanding the following classification is used and the parameters are tagged
accordingly in the tables where appropriate:
NOTE
The classification is shown in the column labeled “C” in the parameter
tables where appropriate.
A.3 Absolute Maximum Ratings
Absolute maximum ratings are stress ratings only, and functional operation at the maxima is not
guaranteed. Stress beyond the limits specified in Table A-2 may affect device reliability or cause
permanent damage to the device. For functional operating conditions, refer to the remaining tables in this
section.
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (for instance, either VSS or VDD).
Table A-1. Parameter Classifications
PThose parameters are guaranteed during production testing on each individual device.
CThose parameters are achieved by the design characterization by measuring a statistically relevant
sample size across process variations.
T
Those parameters are achieved by design characterization on a small sample size from typical devices
under typical conditions unless otherwise noted. All values shown in the typical column are within this
category.
DThose parameters are derived mainly from simulations.
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
350 Freescale Semiconductor
A.4 Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and it is user-determined rather than being controlled by the MCU design. In order to take
PI/O into account in power calculations, determine the difference between actual pin voltage and VSS or
VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy
loads), the difference between pin voltage and VSS or VDD will be very small.
Table A-2. Absolute Maximum Ratings
Rating Symbol Value Unit
Supply voltage VDD – 0.3 to + 5.8 V
Input voltage VIn – 0.3 to VDD + 0.3 V
Instantaneous maximum current
Single pin limit (applies to all port pins)1,2,3
1Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive (VDD) and negative (VSS) clamp
voltages, then use the larger of the two resistance values.
2All functional non-supply pins are internally clamped to VSS and VDD.
3Power supply must maintain regulation within operating VDD range during instantaneous and
operating maximum current conditions. If positive injection current (VIn > VDD) is greater than
IDD, the injection current may flow out of VDD and could result in external power supply going
out of regulation. Ensure external VDD load will shunt current greater than maximum injection
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if
no system clock is present, or if the clock rate is very low which would reduce overall power
consumption.
ID± 25 mA
Maximum current into VDD IDD 120 mA
Storage temperature Tstg –55 to +150 °C
Table A-3. Thermal Characteristics
Num C Rating Symbol Value Unit Temp.
Code
1 T Operating temperature range (packaged) TA–40 to 85 °CC
2 D Maximum junction temperature TJ135 °C
3T
Thermal resistance
Single layer board
64-pin QFP
64-pin LQFP
48-pin QFN
44-pin LQFP
Four layer board
64-pin QFP
64-pin LQFP
48-pin QFN
44-pin LQFP
θJA
55
73
84
71
41
54
28
49
°C/W —
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 351
The average chip-junction temperature (TJ) in °C can be obtained from:
TJ = TA + (PD × θJA)Eqn. A-1
where:
TA = Ambient temperature, °C
θJA = Package thermal resistance, junction-to-ambient, °C/W
PD = Pint + PI/O
Pint = IDD × VDD, Watts — chip internal power
PI/O = Power dissipation on input and output pins — user determined
For most applications, PI/O << Pint and can be neglected. An approximate relationship between PD and TJ
(if PI/O is neglected) is:
PD = K ÷ (TJ + 273°C) Eqn. A-2
Solving equations 1 and 2 for K gives:
K = PD × (TA + 273°C) + θJA × (PD)2Eqn. A-3
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring
PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by
solving equations 1 and 2 iteratively for any value of TA.
A.5 ESD Protection and Latch-Up Immunity
Although damage from electrostatic discharge (ESD) is much less common on these devices than on early
CMOS circuits, normal handling precautions must be used to avoid exposure to static discharge.
Qualification tests are performed to ensure that these devices can withstand exposure to reasonable levels
of static without suffering any permanent damage.
All ESD testing is in conformity with AEC-Q100 Stress Test Qualification for Automotive Grade
Integrated Circuits. During the device qualification ESD stresses were performed for the Human Body
Model (HBM) and the Charge Device Model (CDM).
A device is defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification. Complete DC parametric and functional testing is performed per the applicable device
specification at room temperature followed by hot temperature, unless specified otherwise in the device
specification.
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
352 Freescale Semiconductor
A.6 DC Characteristics
This section includes information about power supply requirements, I/O pin characteristics, and power
supply current in various operating modes.
Table A-4. ESD and Latch-up Test Conditions
Model Description Symbol Value Unit
Human Body
Series Resistance R1 1500 Ω
Storage Capacitance C 100 pF
Number of Pulse per pin — 3
Latch-up Minimum input voltage limit –2.5 V
Maximum input voltage limit 7.5 V
Table A-5. ESD and Latch-Up Protection Characteristics
Num Rating Symbol Min Max Unit
1 Human Body Model (HBM) VHBM ±2000 — V
2 Charge Device Model (CDM) VCDM ±500 — V
3 Latch-up Current at TA = 85°CI
LAT ±100 — mA
Table A-6. DC Characteristics
Num C Parameter Symbol Min Typical1Max. Unit
1 Operating voltage22.7 — 5.5 V
2P
Output high voltage — Low drive (PTxDSn = 0)
5 V, ILoad = –4 mA
3 V, ILoad = –2 mA
5 V, ILoad = –2 mA
3 V, ILoad = –1 mA VOH
VDD – 1.5
VDD – 1.5
VDD – 0.8
VDD – 0.8
—
—
—
—
—
—
—
—
V
Output high voltage — High drive (PTxDSn = 1)
5 V, ILoad = –15 mA
3 V, ILoad = –8 mA
5 V, ILoad = –8 mA
3 V, ILoad = –4 mA
VDD – 1.5
VDD – 1.5
VDD – 0.8
VDD – 0.8
—
—
—
—
—
—
—
—
3P
Output low voltage — Low drive (PTxDSn = 0)
5 V, ILoad = 4 mA
3 V, ILoad = 2 mA
5 V, ILoad = 2 mA
3 V, ILoad = 1 mA VOL
—
—
—
—
—
—
—
—
1.5
1.5
0.8
0.8
V
Output low voltage — High drive (PTxDSn = 1)
5 V, ILoad = 15 mA
3 V, ILoad = 8 mA
5 V, ILoad = 8 mA
3 V, ILoad = 4 mA
—
—
—
—
—
—
—
—
1.5
1.5
0.8
0.8
4 P Output high current — Max. total IOH for all ports
5 V
3 V
IOHT —
—
—
—
100
60
mA
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 353
5 P Output low current — Max. total IOL for all ports
5 V
3 V
IOLT —
—
—
—
100
60
mA
6 C Input high voltage; all digital inputs
5 V
3 V
VIH 0.65 × VDD
0.70 × VDD
——
V
C Input low voltage; all digital inputs VIL — — 0.35 × VDD
7
C Input hysteresis; all digital inputs Vhys 0.06 × VDD mV8
9 C Input leakage current (per pin); input only pins |IIn|—0.1 1μA
10 P Hi-Z (off-state) leakage current (per pin) |IOZ|— 0.1 1μA
11 P Internal pullup resistors3RPU 20 45 65 kΩ
12 P Internal pulldown resistors4RPD 20 45 65 kΩ
13 T Internal pullup resistor to USBDP (to VUSB33)
Idle
Transmit
RPUPD 900
1425
1300
2400
1575
3090
kΩ
14 D DC injection current5 6 7 8 (single pin limit)
VIN >VDD
VIN <VSS
IIC
0
0
—
—
2
–0.2
mA
DC injection current (Total MCU limit, includes
sum of all stressed pins)
VIN >VDD
VIN <VSS
0
0
—
—
25
–5
mA
15 D Input capacitance; all non-supply pins CIn —— 8pF
16 D RAM retention voltage VRAM —0.61.0V
17 D POR re-arm voltage VPOR 0.9 1.4 2.0 V
18 D POR re-arm time tPOR 10 — — μs
Table A-6. DC Characteristics (continued)
Num C Parameter Symbol Min Typical1Max. Unit
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
354 Freescale Semiconductor
19 P
Low-voltage detection threshold —
High range
VDD falling
VDD rising
VLVD 1 3.9
4.0
4.0
4.1
4.1
4.2
V
P
Low-voltage detection threshold —
Low range
VDD falling
VDD rising
VLVD 0 2.48
2.54
2.56
2.62
2.64
2.70
V20
P
Low-voltage warning threshold —
High range 1
VDD falling
VDD rising
VLVW 3 4.5
4.6
4.6
4.7
4.7
4.8
V21
C
Low-voltage warning threshold —
High range 0
VDD falling
VDD rising
VLVW 2 4.2
4.3
4.3
4.4
4.4
4.5
V22
P
Low-voltage warning threshold
Low range 1
VDD falling
VDD rising
VLVW 1 2.84
2.90
2.92
2.98
3.00
3.06
V23
C
Low-voltage warning threshold —
Low range 0
VDD falling
VDD rising
VLVW 0 2.66
2.72
2.74
2.80
2.82
2.88
V24
25 T
Low-voltage inhibit reset/recover hysteresis
+5V
+3V
Vhys —
—
100
60
—
—
mV
mV
26 P Bandgap voltage reference
factory trimmed at VDD = 5.0 V, Temp = 25°CVBG 1.19 1.20 1.21 V
1Typical values are based on characterization data at 25°C unless otherwise stated.
2Maximum is highest voltage that POR is guaranteed.
3Measured with VIn = VSS.
4Measured with VIn = VDD.
5Power supply must maintain regulation within operating VDD range during instantaneous and operating
maximum current conditions. If positive injection current (VIn > VDD) is greater than IDD, the injection current may
flow out of VDD and could result in external power supply going out of regulation. Ensure external VDD load will
shunt current greater than maximum injection current. This will be the greatest risk when the MCU is not
consuming power. Examples are: if no system clock is present, or if clock rate is very low (which would reduce
overall power consumption).
6All functional non-supply pins are internally clamped to VSS and VDD.
7Input must be current limited to the value specified. To determine the value of the required current-limiting
resistor, calculate resistance values for positive and negative clamp voltages, then use the larger of the two
values.
8The RESET pin does not have a clamp diode to VDD. Do not drive this pin above VDD.
Table A-6. DC Characteristics (continued)
Num C Parameter Symbol Min Typical1Max. Unit
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 355
Figure A-1. Typical Low-side Drive (sink) characteristics – High Drive (PTxDSn = 1)
Figure A-2. Typical Low-side Drive (sink) characteristics – Low Drive (PTxDSn = 0)
Figure A-3. Typical High-side Drive (source) characteristics – High Drive (PTxDSn = 1)
Typical V
OL vs. IOL AT VDD = 5V
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0123456789101112131415
IOL (mA)
VOL
(v)
Hot (85°C)
Room (25°C)
Cold (-40°C)
Typical VOL vs. IOL AT VDD = 3V
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
IOL (mA)
VOL (v)
Hot (85°C)
Room (25°C)
Cold (-40°C)
Typical V
OL vs. IOL AT VDD = 5V
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
012345
IOL (mA)
VOL
(v)
Hot (85°C)
Room (25°C)
Cold (-40°C)
Typical VOL vs. IOL AT VDD = 3V
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
01 23
IOL (mA)
VOL (v)
Hot (85°C)
Room (25°C)
Cold (-40°C)
Typical VDD - VOH vs. IOH AT VDD
= 5
V
0.0
0.2
0.4
0.6
0.8
0 -1-2-3-4-5 -6-7-8-9-10-11-12-13-14-15
IOH (mA)
VDD - VOH (v)
Hot (85°C)
Room (25°C)
Cold (-40°C)
Typical VDD - VOH vs. IOH AT VDD = 3V
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 -1-2-3-4-5-6-7-8-9-10-11-12-13-14-15
IOH (mA)
VDD
- VOH
(v)
Hot (85°C)
Room (25°C)
Cold (-40°C)
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
356 Freescale Semiconductor
Figure A-4. Typical High-side Drive (source) characteristics – Low Drive (PTxDSn = 0)
Typical VDD - VOH vs. IOH AT VDD = 5V
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0-1-2-3-4-5
IOH (mA)
VDD
- VOH
(v)
Hot ( 85 ° C)
Room (25°C)
Cold (-40°C)
Typical VDD - VOH vs. IOH AT VDD = 3V
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 -1-2-3
IOH (mA)
VDD
- VOH
(v)
Hot (85°C)
Room (25°C)
Cold (-40°C)
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 357
A.7 Supply Current Characteristics
Table A-7. Supply Current Characteristics
Num C Parameter Symbol VDD (V) Typical1
1Typicals are measured at 25°C.
Max2
2Values given here are preliminary estimates prior to completing characterization.
Unit
1C
Run supply current3 measured at
(Core clock = 2 MHz, fBus = 1 MHz, BLPE mode)
3All modules except USB and ADC active, Oscillator disabled (ERCLKEN = 0), using external clock resource for input, and does
not include any dc loads on port pins.
RIDD
51.11.6
mA
30.81.5
2P
Run supply current3 measured at
(Core clock = 8 MHz, fBus = 4 MHz, FBE mode)
54.9 8
mA
34.3 7
3C
Run supply current3 measured at
(Core clock = 48 MHz, fBus = 24 MHz, PEE mode)
523 30
mA
322 30
4P
Stop2 mode supply current
–40 °C
25 °C
85 °C
–40 °C
25 °C
85 °C
S2IDD
50.80 3
3
20
μA
30.80
3
3
20 μA
5P
Stop3 mode supply current
–40 °C
25 °C
85 °C
–40 °C
25 °C
85 °C
S3IDD
50.90 3
3
20
μA
30.90
3
3
20
μA
6P
Adder to stop2 or stop3 for RTC enabled4, 25°C
4Most customers are expected to find that auto-wakeup from stop2 or stop3 can be used instead of the higher current wait mode.
Wait mode typical is 560 μA at 5 V and 422 μA at 3V with fBus = 1 MHz.
ΔISRTC
5300 nA
3300 nA
7P
Adder to stop3 for LVD enabled
(LVDE = LVDSE = 1) ΔISLVD
5110 μA
390 μA
8P
Adder to stop3 for oscillator enabled5
(ERCLKEN = 1 and EREFSTEN = 1)
5Values given under the following conditions: low range operation (RANGE = 0), low power mode (HGO = 0).
ΔISOSC
55 μA
35 μA
9 T USB module enable current6ΔIUSBE 51.5 mA
10 T USB suspend current7ISUSP 5 270 500 μA
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
358 Freescale Semiconductor
A.8 Analog Comparator (ACMP) Electricals
A.9 ADC Characteristics
6Here USB module is enabled and clocked at 48 MHz (USBEN = 1, USBVREN =1, USBPHYEN = 1 and USBPU = 1), and D+
and D– pull down by two 15.1kΩ resisters independently. The current consumption may be much higher when the packets are
being transmitted through the attached cable.
7MCU enters into Stop3 mode, USB bus in idle state. The USB suspend current will be dominated by the D+ pull up resister.
Table A-8. Analog Comparator Electrical Specifications
Num C Rating Symbol Min Typical Max Unit
1 — Supply voltage VDD 2.7 — 5.5 V
2 D Supply current (active) IDDAC —2035μA
3 D Analog input voltage VAIN VSS – 0.3 — VDD V
4 D Analog input offset voltage VAIO 20 40 mV
5 D Analog Comparator hysteresis VH3.0 6.0 20.0 mV
6 D Analog input leakage current IALKG 1.0 μA
7 D Analog Comparator initialization delay tAINIT ——1.0μs
Table A-9. 5 Volt 12-bit ADC Operating Conditions
Characteristic Conditions Symb Min Typ1Max Unit Comment
Supply voltage
Absolute VDDAD 2.7 — 5.5 V
Delta to VDD (VDD-VDDAD)2ΔVDDAD –100 0 +100 mV
Ground voltage Delta to VSS (VSS-VSSAD)2ΔVSSAD –100 0 +100 mV
Ref Voltage
High VREFH 2.7 VDDAD VDDAD V
Ref Voltage
Low VREFL VSSAD VSSAD VSSAD V
Input Voltage VADIN VREFL —V
REFH V
Input
Capacitance CADIN —4.55.5pF
Input
Resistance RADIN —3 5kΩ
Analog Source
Resistance
12 bit mode
fADCK > 4 MHz
fADCK < 4 MHz
RAS
—
—
—
—
2
5
kΩExternal to MCU10 bit mode
fADCK > 4 MHz
fADCK < 4 MHz
—
—
—
—
5
10
8 bit mode (all valid fADCK)——10
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 359
Figure A-5. ADC Input Impedance Equivalency Diagram
ADC
Conversion
Clock Freq.
High Speed (ADLPC=0)
fADCK
0.4 — 8.0
MHz
Low Power (ADLPC=1) 0.4 — 4.0
1Typical values assume VDDAD = 5.0 V, Temp = 25°C, fADCK = 1.0 MHz unless otherwise stated. Typical values are for
reference only and are not tested in production.
2DC potential difference.
Table A-9. 5 Volt 12-bit ADC Operating Conditions (continued)
Characteristic Conditions Symb Min Typ1Max Unit Comment
+
–
+
–
V
AS
R
AS
C
AS
V
ADIN
Z
AS
Pad
leakage
due to
input
protection
Z
ADIN
SIMPLIFIED
INPUT PIN EQUIVALENT
CIRCUIT
R
ADIN
ADC SAR
ENGINE
SIMPLIFIED
CHANNEL SELECT
CIRCUIT
INPUT PIN
R
ADIN
C
ADIN
INPUT PIN
R
ADIN
INPUT PIN
R
ADIN
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
360 Freescale Semiconductor
Table A-10. 5 Volt 12-bit ADC Characteristics (VREFH = VDDAD, VREFL = VSSAD)
Characteristic Conditions C Symb Min Typ1Max Unit Comment
Supply Current
ADLPC=1
ADLSMP=1
ADCO=1
TI
DDAD — 133 — μA
Supply Current
ADLPC=1
ADLSMP=0
ADCO=1
TI
DDAD — 218 — μA
Supply Current
ADLPC=0
ADLSMP=1
ADCO=1
TI
DDAD — 327 — μA
Supply Current
ADLPC=0
ADLSMP=0
ADCO=1
TI
DDAD —0.582 1 mA
Supply Current Stop, Reset, Module Off IDDAD —0.011 1 μA
ADC
Asynchronous
Clock Source
High Speed (ADLPC=0)
Tf
ADACK
23.35
MHz tADACK =
1/fADACK
Low Power (ADLPC=1) 1.25 2 3.3
Conversion
Time (Including
sample time)
Short Sample (ADLSMP=0)
Tt
ADC
—20—
ADCK
cycles See Table
10.13 for
conversion
time variances
Long Sample (ADLSMP=1) — 40 —
Sample Time
Short Sample (ADLSMP=0)
Tt
ADS
—3.5—
ADCK
cycles
Long Sample (ADLSMP=1) — 23.5 —
To tal
Unadjusted
Error
12 bit mode T
ETUE
—±3.0 ±10.0
LSB2Includes
quantization
10 bit mode P — ±1±2.5
8 bit mode T — ±0.5 ±1.0
Differential
Non-Linearity
12 bit mode T
DNL
—±1.75 ±4.0
LSB2
10 bit mode3P—±0.5 ±1.0
8 bit mode2T—±0.3 ±0.5
Integral
Non-Linearity
12 bit mode T
INL
—±1.5 ±4.0
LSB2
10 bit mode T — ±0.5 ±1.0
8 bit mode T — ±0.3 ±0.5
Zero-Scale
Error
12 bit mode T
EZS
—±1.5 ±6.0
LSB2VADIN = VSSAD
10 bit mode P — ±0.5 ±1.5
8 bit mode T — ±0.5 ±0.5
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 361
Full-Scale
Error
12 bit mode T
EFS
—±1±4.0
LSB2VADIN = VDDAD
10 bit mode P — ±0.5 ±1
8 bit mode T — ±0.5 ±0.5
Quantization
Error
12 bit mode
DE
Q
— –1 to 0 –1 to 0
LSB2
10 bit mode — — ±0.5
8 bit mode — — ±0.5
Input Leakage
Error
12 bit mode
DE
IL
—±1±10
LSB2Pad leakage4 *
RAS
10 bit mode — ±0.2 ±2.5
8 bit mode — ±0.1 ±1
Te mp S en sor
Voltage 25°CDV
TEMP25 —1.396— V
Temp Sensor
Slope
–40 °C — 25 °C
Dm
—3.266—
mV/°C
25 °C — 125 °C — 3.638 —
1Typical values assume VDDAD = 5.0 V, Temp = 25°C, fADCK = 1.0 MHz unless otherwise stated. Typical values are for reference
only and are not tested in production.
21 LSB = (VREFH – VREFL)/2N
3Monotonicity and no-missing-codes guaranteed in 10 bit and 8 bit modes.
4Based on input pad leakage current. Refer to pad electricals.
Table A-10. 5 Volt 12-bit ADC Characteristics (VREFH = VDDAD, VREFL = VSSAD) (continued)
Characteristic Conditions C Symb Min Typ1Max Unit Comment
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
362 Freescale Semiconductor
A.10 External Oscillator (XOSC) Characteristics
Table A-11. Oscillator Electrical Specifications (Temperature Range = –40 to 85°C Ambient)
Num C Rating Symbol Min Typ1
1Typical data was characterized at 3.0 V, 25°C or is recommended value.
Max Unit
1C
Oscillator crystal or resonator (EREFS = 1, ERCLKEN = 1)
Low range (RANGE = 0)
High range (RANGE = 1) FEE or FBE mode 2
High range (RANGE = 1) PEE or PBE mode 3
High range (RANGE = 1, HGO = 1) BLPE mode
High range (RANGE = 1, HGO = 0) BLPE mode
2When MCG is configured for FEE or FBE mode, input clock source must be divided using RDIV to within the range of 31.25 kHz
to 39.0625 kHz.
3When MCG is configured for PEE or PBE mode, input clock source must be divided using RDIV to within the range of 1 MHz to
2 MHz.
flo
fhi-fll
fhi-pll
fhi-hgo
fhi-lp
32
1
1
1
1
—
—
—
—
—
38.4
5
16
16
8
kHz
MHz
MHz
MHz
MHz
2 — Load capacitors C1, C2
See crystal or resonator
manufacturer’s recommendation.
3—
Feedback resistor
Low range (32 kHz to 38.4 kHz)
High range (1 MHz to 16 MHz)
RF10
1
MΩ
MΩ
4—
Series resistor
Low range, low gain (RANGE = 0, HGO = 0)
Low range, high gain (RANGE = 0, HGO = 1)
High range, low gain (RANGE = 1, HGO = 0)
High range, high gain (RANGE = 1, HGO = 1)
≥ 8 MHz
4 MHz
1 MHz
RS
—
—
—
—
—
—
0
100
0
0
0
0
—
—
—
0
10
20
kΩ
5T
Crystal start-up time 4
Low range, low gain (RANGE = 0, HGO = 0)
Low range, high gain (RANGE = 0, HGO = 1)
High range, low gain (RANGE = 1, HGO = 0)5
High range, high gain (RANGE = 1, HGO = 1)5
4This parameter is characterized and not tested on each device. Proper PC board layout procedures must be followed to achieve
specifications.
54 MHz crystal
tCSTL-LP
tCSTL-HGO
tCSTH-LP
tCSTH-HGO
—
—
—
—
200
400
5
15
—
—
—
—
ms
6T
Square wave input clock frequency (EREFS = 0, ERCLKEN = 1)
FEE or FBE mode 2
PEE or PBE mode 3
BLPE mode
fextal
0.03125
1
0
—
—
—
5
16
40
MHz
MHz
MHz
MCU
EXTAL XTAL
Crystal or Resonator
R
S
C2
RF
C1
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 363
A.11 MCG Specifications
Table A-12. MCG Frequency Specifications (Temperature Range = –40 to 125°C Ambient)
Num C Rating Symbol Min Typical Max Unit
1P
Internal reference frequency - factory trimmed at VDD =
5 V and temperature = 25 °Cfint_ft — 31.25 — kHz
2P
Average internal reference frequency – untrimmed 1
1TRIM register at default value (0x80) and FTRIM control bit at default value (0x0).
fint_ut 25 32.7 41.66 kHz
3 P Average internal reference frequency Q – user trimmed fint_t 31.25 — 39.0625 kHz
4 D Internal reference startup time tirefst —60100μs
5—
DCO output frequency range - untrimmed 1
value provided for reference: fdco_ut = 1024 X fint_ut
fdco_ut 25.6 33.48 42.66 MHz
6 P DCO output frequency range - trimmed fdco_t 32 — 40 MHz
7C
Resolution of trimmed DCO output frequency at fixed
voltage and temperature (using FTRIM) Δfdco_res_t —±0.1 ±0.2 %fdco
8C
Resolution of trimmed DCO output frequency at fixed
voltage and temperature (not using FTRIM) Δfdco_res_t —±0.2 ±0.4 %fdco
9P
Total deviation of trimmed DCO output frequency over
voltage and temperature Δfdco_t —+0.5
–1.0 ±2%fdco
10 C Total deviation of trimmed DCO output frequency over
fixed voltage and temperature range of 0 –70 °CΔfdco_t —±0.5 ±1%fdco
11 C FLL acquisition time 2
2This specification applies to any time the FLL reference source or reference divider is changed, trim value changed or changing
from FLL disabled (BLPE, BLPI) to FLL enabled (FEI, FEE, FBE, FBI). If a crystal/resonator is being used as the reference, this
specification assumes it is already running.
tfll_acquire —— 1ms
12 D PLL acquisition time 3
3This specification applies to any time the PLL VCO divider or reference divider is changed, or changing from PLL disabled (BLPE,
BLPI) to PLL enabled (PBE, PEE). If a crystal/resonator is being used as the reference, this specification assumes it is already
running.
tpll_acquire —— 1ms
13 C Long term Jitter of DCO output clock (averaged over
2ms interval) 4CJitter — 0.02 0.2 %fdco
14 D VCO operating frequency fvco 7.0 — 55.0 MHz
15 D PLL reference frequency range fpll_ref 1.0 — 2.0 MHz
16 T Long term accuracy of PLL output clock (averaged over
2 ms) fpll_jitter_2ms —0.5905—%fpll
17 T Jitter of PLL output clock measured over 625 ns fpll_jitter_625ns —0.5665—%fpll
18 D Lock entry frequency tolerance 6Dlock ±1.49 — ±2.98 %
19 D Lock exit frequency tolerance 7Dunl ±4.47 — ±5.97 %
20 D Lock time – FLL tfll_lock ——
tfll_acquire+
1075(1/fint_t)
s
21 D Lock time – PLL tpll_lock ——
tpll_acquire+
1075(1/fpll_ref)
s
22 D Loss of external clock minimum frequency – RANGE = 0 floc_low (3/5) x fint — — kHz
23 D Loss of external clock minimum frequency – RANGE = 1 floc_high (16/5) x fint — — kHz
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
364 Freescale Semiconductor
o
A.12 AC Characteristics
This section describes ac timing characteristics for each peripheral system.
A.12.1 Control Timing
4Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum fBUS.
Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise injected
into the FLL circuitry via VDD and VSS and variation in crystal oscillator frequency increase the CJitter percentage for a given
interval.
5Jitter measurements are based upon a 48 MHz MCGOUT clock frequency..
6Below Dlock minimum, the MCG is guaranteed to enter lock. Above Dlock maximum, the MCG will not enter lock. But if the MCG
is already in lock, then the MCG may stay in lock.
7Below Dunl minimum, the MCG will not exit lock if already in lock. Above Dunl maximum, the MCG is guaranteed to exit lock.
Table A-13. Control Timing
Num C Parameter Symbol Min Typ1
1Typical values are based on characterization data at VDD = 5.0 V, 25 °C unless otherwise stated.
Max Unit
1 Bus frequency (tcyc = 1/fBus)f
Bus dc — 24 MHz
2 Internal low-power oscillator period tLPO 800 1500 μs
3 External reset pulse width2
2This is the shortest pulse that is guaranteed to be recognized as a reset pin request. Shorter pulses are not guaranteed to
override reset requests from internal sources.
textrst 100 — ns
4 Reset low drive trstdrv 66 x tcyc —ns
5 Active background debug mode latch setup time tMSSU 500 — ns
6 Active background debug mode latch hold time tMSH 100 — ns
7 IRQ pulse width
Asynchronous path2
Synchronous path3
3This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or
may not be recognized. In stop mode, the synchronizer is bypassed so shorter pulses can be recognized in that case.
tILIH, tIHIL 100
1.5 x tcyc
——ns
8 KBIPx pulse width
Asynchronous path2
Synchronous path3tILIH, tIHIL 100
1.5 x tcyc
——ns
9 Port rise and fall time
low output drive (PTxDS = 0), (load = 50 pF)4
Slew rate control disabled (PTxSE = 0)
Slew rate control enabled (PTxSE = 1)
high output drive (PTxDS = 1), (load = 50 pF)
Slew rate control disabled (PTxSE = 0)
Slew rate control enabled (PTxSE = 1)
4Timing is shown with respect to 20% VDD and 80% VDD levels. Temperature range –40 °C to 85 °C.
tRise, tFall
—
—
—
—
40
75
11
35
ns
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 365
Figure A-6. Reset Timing
Figure A-7. IRQ/KBIPx Timing
A.12.2 Timer/PWM (TPM) Module Timing
Synchronizer circuits determine the shortest input pulses that can be recognized or the fastest clock that
can be used as the optional external source to the timer counter. These synchronizers operate from the
current bus rate clock.
Figure A-8. Timer External Clock
Table A-14. TPM Input Timing
NUM C Function Symbol Min Max Unit
1 — External clock frequency fTPMext dc fBus/4 MHz
2 — External clock period tTPMext 4—t
cyc
3 D External clock high time tclkh 1.5 — tcyc
4 D External clock low time tclkl 1.5 — tcyc
5 D Input capture pulse width tICPW 1.5 — tcyc
textrst
RESET PIN
tIHIL
IRQ/KBIPx
tILIH
IRQ/KBIPx
tTPMext
tclkh
tclkl
TPMxCLK
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
366 Freescale Semiconductor
Figure A-9. Timer Input Capture Pulse
A.12.3 SPI Characteristics
Table A-15 and Figure A-10 through Figure A-13 describe the timing requirements for the SPI system.
Table A-15. SPI Electrical Characteristic
Num1C Characteristic2Symbol Min Max Unit
1D
Operating frequency
Master
Slave
fop
fop
fBus/2048
dc
fBus/2
fBus/4 Hz
2D
Cycle time
Master
Slave
tSCK
tSCK
2
4
2048
—
tcyc
tcyc
3D
Enable lead time
Master
Slave
tLead
tLead
—
1/2
1/2
—
tSCK
tSCK
4D
Enable lag time
Master
Slave
tLag
tLag
—
1/2
1/2
—
tSCK
tSCK
5D
Clock (SPSCK) high time Master and
Slave tSCKH 1/2 tSCK – 25 — ns
6D
Clock (SPSCK) low time Master and
Slave tSCKL 1/2 tSCK – 25 — ns
7D
Data setup time (inputs)
Master
Slave
tSI(M)
tSI(S)
30
30
—
—
ns
ns
8D
Data hold time (inputs)
Master
Slave
tHI(M)
tHI(S)
30
30
—
—
ns
ns
9 D Access time, slave3tA040ns
10 D Disable time, slave4tdis —40ns
11 D
Data setup time (outputs)
Master
Slave
tSO
tSO
25
25
—
—
ns
ns
12 D
Data hold time (outputs)
Master
Slave
tHO
tHO
–10
–10
—
—
ns
ns
tICPW
TPMxCHn
tICPW
TPMxCHn
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 367
Figure A-10. SPI Master Timing (CPHA = 0)
1Refer to Figure A-10 through Figure A-13.
2All timing is shown with respect to 20% VDD and 70% VDD, unless noted; 100 pF load on all SPI pins. All
timing assumes slew rate control disabled and high drive strength enabled for SPI output pins.
3Time to data active from high-impedance state.
4Hold time to high-impedance state.
SCK
(OUTPUT)
SCK
(OUTPUT)
MISO
(INPUT)
MOSI
(OUTPUT)
SS1
(OUTPUT)
MSB IN2
BIT 6 . . . 1
LSB IN
MSB OUT2LSB OUT
BIT 6 . . . 1
(CPOL = 0)
(CPOL = 1)
NOTES:
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
1. SS output mode (MODFEN = 1, SSOE = 1).
1
23
5
67
10 11
5
10
4
4
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
368 Freescale Semiconductor
Figure A-11. SPI Master Timing (CPHA = 1)
Figure A-12. SPI Slave Timing (CPHA = 0)
SCK
(OUTPUT)
SCK
(OUTPUT)
MISO
(INPUT)
MOSI
(OUTPUT)
MSB IN(2)
BIT 6 . . . 1
LSB IN
MSB OUT(2) LSB OUT
BIT 6 . . . 1
(CPOL = 0)
(CPOL = 1)
SS(1)
(OUTPUT)
1. SS output mode (MODFEN = 1, SSOE = 1).
2. LSBF = 0. For LSBF = 1, bit order is LSB, bit 1, ..., bit 6, MSB.
NOTES:
2
1
3
4
5
67
10 11
5
4
SCK
(INPUT)
SCK
(INPUT)
MOSI
(INPUT)
MISO
(OUTPUT)
SS
(INPUT)
MSB IN
BIT 6 . . . 1
LSB IN
MSB OUT SLAVE LSB OUT
BIT 6 . . . 1
(CPOL = 0)
(CPOL = 1)
NOTE:
SLAVE SEE
NOTE
1. Not defined but normally MSB of character just received
1
2
3
4
67
8
9
10 11
5
5
4
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 369
Figure A-13. SPI Slave Timing (CPHA = 1)
A.13 Flash Specifications
This section provides details about program/erase times and program-erase endurance for the flash
memory.
Program and erase operations do not require any special power sources other than the normal VDD supply.
For more detailed information about program/erase operations.
Table A-16. Flash Characteristics
Num C Characteristic Symbol Min Typ1
1Typical values are based on characterization data at VDD = 5.0 V, 25°C unless otherwise stated.
Max Unit
1 Supply voltage for program/erase Vprog/erase 2.7 5.5 V
2 Supply voltage for read operation VRead 2.7 5.5 V
3 Internal FCLK frequency2fFCLK 150 200 kHz
4 Internal FCLK period (1/FCLK) tFcyc 56.67μs
5 Byte program time (random location)(2) tprog 9t
Fcyc
6 Byte program time (burst mode)(2) tBurst 4t
Fcyc
7 Page erase time3tPage 4000 tFcyc
8 Mass erase time(2) tMass 20,000 tFcyc
9 C Program/erase endurance4
TL to TH = –40°C to + 85°C
T = 25°C
10,000
—
—
100,000
—
—
cycles
10 Data retention5tD_ret 15 100 — years
SCK
(INPUT)
SCK
(INPUT)
MOSI
(INPUT)
MISO
(OUTPUT)
MSB IN
BIT 6 . . . 1
LSB IN
MSB OUT SLAVE LSB OUT
BIT 6 . . . 1
SEE
(CPOL = 0)
(CPOL = 1)
SS
(INPUT)
NOTE:
SLAVE
NOTE
1. Not defined but normally LSB of character just received
1
2
3
4
67
8
9
10 11
4
5
5
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
370 Freescale Semiconductor
A.14 USB Electricals
The USB electricals for the S08USBV1 module conform to the standards documented by the Universal
Serial Bus Implementers Forum. For the most up-to-date standards, visit http://www.usb.org.
If the Freescale S08USBV1 implementation has electrical characteristics that deviate from the standard or
require additional information, this space would be used to communicate that information.
A.15 EMC Performance
Electromagnetic compatibility (EMC) performance is highly dependant on the environment in which the
MCU resides. Board design and layout, circuit topology choices, location and characteristics of external
components as well as MCU software operation all play a significant role in EMC performance. The
system designer must consult Freescale applications notes such as AN2321, AN1050, AN1263, AN2764,
and AN1259 for advice and guidance specifically targeted at optimizing EMC performance.
A.15.1 Radiated Emissions
Microcontroller radiated RF emissions are measured from 150 kHz to 1 GHz using the TEM/GTEM Cell
method in accordance with the IEC 61967-2 and SAE J1752/3 standards. The measurement is performed
with the microcontroller installed on a custom EMC evaluation board while running specialized EMC test
software. The radiated emissions from the microcontroller are measured in a TEM cell in two package
orientations (North and East). For more detailed information concerning the evaluation results, conditions
and setup, please refer to the EMC Evaluation Report for this device.
The maximum radiated RF emissions of the tested configuration in all orientations are less than or equal
to the reported emissions levels.
2The frequency of this clock is controlled by a software setting.
3These values are hardware state machine controlled. User code does not need to count cycles. This information
supplied for calculating approximate time to program and erase.
4Typical endurance for Flash is based on the intrinsic bitcell performance. For additional information on how
Freescale Semiconductor defines typical endurance, please refer to Engineering Bulletin EB619/D, Ty pi ca l
Endurance for Nonvolatile Memory.
5Typical data retention values are based on intrinsic capability of the technology measured at high temperature and
de-rated to 25 °C using the Arrhenius equation. For additional information on how Freescale Semiconductor defines
typical data retention, please refer to Engineering Bulletin EB618/D, Typical Data Retention for Nonvolatile Memory.
Table A-17. Internal USB 3.3V Voltage Regulator Characteristics
Symbol Unit Min Typ Max
Regulator operating voltage Vregin V 3.9 — 5.5
VREG output Vregout V33.33.6
VUSB33 input with internal
VREG disabled
Vusb33in V33.33.6
VREG Quiescent Current IVRQ mA — 0.5 —
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 371
Table A-18. Radiated Emissions
Parameter Symbol Conditions Frequency fOSC/fBUS
Level1
(Max)
1Data based on qualification test results.
Unit
Radiated emissions,
electric field VRE_TEM
VDD = 5.0 V
TA = +25oC
0.15 – 50 MHz
4 MHz crystal
24 MHz Bus
20
dBμV
50 – 150 MHz 27
150 – 500 MHz 27
500 – 1000 MHz 16
IEC Level 1 —
SAE Level 3 —
Appendix A Electrical Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
372 Freescale Semiconductor
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor 373
Appendix B
Ordering Information and Mechanical Drawings
B.1 Ordering Information
This section contains ordering numbers for MC9S08JM60 series devices. See below for an example of the
device numbering system.
B.2 Orderable Part Numbering System
B.3 Mechanical Drawings
This following pages contain mechanical specifications for MC9S08JM60 series package options. See
Table B-2 for the document numbers that correspond to each package type.
Table B-1. Device Numbering System
Device Number1
1See Tab le 1 - 1 for a complete description of modules included on each device.
Memory Available Packages2
2See Tab le B - 2 for package information.
Flash RAM Type
MC9S08JM60 60,912 4096 64-pin LQFP
64-pin QFP
48-pin QFN
44-pin LQFP
MC9S08JM32 32,768 2048
Table B-2. Package Information
Pin Count Type Designator Document No.
44 LQFP LD 98ASS23225W
48 QFN GT 98ARH99048A
64 LQFP LH 98ASS23234W
64 QFP QH 98ASB42844B
Package designator
Temperature range
Family
Memory
Status
Core
Pb free indicator
(C = –40°C to 85°C)
(MC = Fully Qualified)
(9 = Flash-based)
MC 9 S08 JM 60 C XX E
Memory size designator
(See Tabl e B -2 )
MC9S08JM60
Rev. 3, 1/2009
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