H2KJ3E - Hewlett Packard Enterprise

NHS3100

Temperature logger

Rev. 6.03 — 15 June 2018 Product data sheet

1 General description

The NHS3100 is an IC optimized for temperature monitoring and logging. It has

an embedded NFC interface, an internal temperature sensor and a direct battery

connection. These features support an effective system solution with a minimal number

of external components and a single layer foil implementation for temperature monitoring.

The NHS3100 works either battery-powered or NFC-powered.

The embedded ARM Cortex-M0+ offers flexibility to the users of this IC to implement

their own dedicated solution. The NHS3100 contains multiple features, including multiple

Power-down modes and a selectable CPU frequency of up to 8 MHz, for ultra low power

consumption.

Users can program this NHS3100 with the industry-wide standard solutions for ARM

Cortex-M0+ processors.

As of September 22, 2017, this device has been certified by the NFC forum (certification

ID: 58516).

CAUTION

Semiconductors are light sensitive. Exposure to light sources can cause the IC to

malfunction. The IC must be protected against light. The protection must be applied to all

sides of the IC.

CAUTION

msc896

This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling

electrostatic sensitive devices.

Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or

equivalent standards.

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2 Features and benefits

2.1 System

•ARM Cortex-M0+ processor running at frequencies of up to 8 MHz

•ARM Cortex-M0+ built-in Nested Vectored Interrupt Controller (NVIC)

•ARM Serial Wire Debug (SWD)

•System tick timer

•IC reset input

2.2 Memory

•32 kB on-chip flash programming memory

•4 kB on-chip EEPROM of which 320 bytes are write-protected

•8 kB SRAM

2.3 Digital peripherals

•Up to 12 General Purpose Input Output (GPIO) pins with configurable pull-up/pull-down

resistors and repeater mode

•GPIO pins which can be used as edge and level sensitive interrupt sources

•High-current drivers (sink only; 20 mA) on four GPIO pins

•High-current drivers (sink only; 20 mA) on two I2C-bus pins

•Programmable WatchDog Timer (WDT)

2.4 Analog peripherals

•Temperature sensor with ±0.3 °C absolute temperature accuracy between 0 °C and

40 °C and ±0.5 °C in the range −40 °C and +85 °C

2.5 Communication interfaces

•NFC/RFID ISO 14443 type A interface; NFC forum type 2 compatible

•I2C-bus interface supporting full I2C-bus specification and Fast-mode with a data rate of

400 kbit/s, with multiple-address recognitions and Monitor mode

2.6 Clock generation

•8 MHz internal RC oscillator, trimmed to 2 % accuracy, which is used for the system

clock

•Timer oscillator operating at 32 kHz linked to the RTC timer unit

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2.7 Power control

•Support for 1.72 V to 3.6 V external voltages

•The NHS3100 can also be powered from the NFC field.

•Activation via NFC possible

•Integrated Power Management Unit (PMU) for versatile control of power consumption

•Four reduced power modes for ARM Cortex-M0+: Sleep, Deep-sleep, Deep power-

down and Battery-off

•Power gating for each analog peripheral for ultra-low power operation

•< 50 nA IC current consumption in Battery-off mode at 3.0 V

•Power-On Reset (POR)

2.8 General

•Unique device serial number for identification

3 Applications

•Temperature measurement

•Temperature logging

•Cold chain validation

4 Ordering information

Table 1. Ordering information

PackageType number

Name Description Version

NHS3100 HVQFN24 plastic thermal enhanced very thin quad flat package; no leads;

24 terminals; body 4 × 4 × 0.85 mm

SOT616-3

NHS3100UK WLCSP25 wafer level chip-scale package; 25 balls; 2.51 × 2.51 × 0.5 mm SOT1401-1

NHS3100W8 bumped die bumped die with 8 functional bumps; 2.51 × 2.51 × 0.16 mm SOT1870-1

5 Marking

Table 2. Marking codes

Type number Marking code

NHS3100 NHS3100

NHS3100UK NHS3100

NHS3100W8 no marking code

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6 Block diagram

The internal block diagram of the NHS3100 is shown in Figure 1. It consists of a Power

Management Unit (PMU), clocks, timers, a digital computation, and a control cluster

(ARM Cortex-M0+ and memories) and AHB-APB slave modules.

POWER

PADS

WAKE-UP

TIMER

32 kHz FRO

CLOCK

SHOP

EXTERNAL

POWER

SWITCH

INTERNAL

POWER

SWITCHES

POR

LDO (1.6 V)

LDO (1.2 V)

8 MHz FRO

MFIO

(DIGITAL)

HIGH

DRIVE

DIGITAL

SWITCH

MATRIX I2C-BUS SPI GPIO

32 kB FLASH

4 kB EEPROM

ARM M0+

AHB-APB BRIDGE

8 kB SRAM

PMU

NFC/RFID

FLASH

CONTROL

EEPROM

CONTROL

TIMERS WATCHDOG SYSCONFIG

IOCONFIG

TEMPERATURE

SENSOR

I2C-BUS

aaa-015348

Figure 1. NHS3100 block diagram

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7 Pinning information

7.1 Pinning

7.1.1 HVQFN24 package

Figure 2 shows the pad layout of the NHS3100 in the HVQFN24 package.

aaa-015349

Transparent top view

PIO0_7/CT16B_M1

PIO0_8/MISO

PIO0_9/MOSI

PIO0_3/CT16B_M0

PIO0_6/SCLK PIO0_10/CT32B_M0/SWCLK

PIO0_2/SSEL PIO0_11/CT32B_M1/SWDIO

PIO0_1/CLKOUT (reserved)

PIO0_0/WAKEUP (reserved)

25 VSS

VDDBAT

VSS

RESETN

(reserved)

PIO0_4/SCL

PIO0_5/SDA

(

)

(

)

(

)

(

)

terminal 1

index area

6 13

5 14

4 15

3 16

2 17

1 18

Figure 2. Pad configuration HVQFN24

Table 3. Pad allocation table of the HVQFN24 package

Pad Symbol Pad Symbol

1 PIO0_0/WAKEUP 13[1] PIO0_7/CT16B_M1

2 PIO0_1/CLKOUT 14[1] PIO0_3/CT16B_M0

3 PIO0_2/SSEL 15[1] PIO0_10/CT32B_M0/SWCLK

4 PIO0_6/SCLK 16[1] PIO0_11/CT32B_M1/SWDIO

5 PIO0_8/MISO 17[2] (reserved)

6 PIO0_9/MOSI 18[2] (reserved)

7 VDDBAT 19 LB

8 VSS 20 LA

9 RESETN 21[2] (reserved)

10 (reserved) 22[2] (reserved)

11 PIO0_4/SCL 23[2] (reserved)

12 PIO0_5/SDA 24[2] (reserved)

[1] High source current pads. See Section 8.6.3.

[2] These pads must be tied to ground.

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Table 4. Pad description of the HVQFN24 package

Pad Symbol Type Description

Supply

7 VDDBAT supply positive supply voltage

8 VSS supply ground

GPIO[1]

PIO0_0 I/O GPIO1

WAKEUP I Deep power-down mode wake-up pin[2]

PIO0_1 I/O GPIO2

CLKOUT O clock output

PIO0_2 I/O GPIO3

SSEL I SPI/SSP serial select line

PIO0_3 I/O GPIO14

CT16B_M0 O 16-bit timer match output 0

PIO0_4 I/O GPIO11

SCL I/O I2C-bus SCL clock line

PIO0_5 I/O GPIO12

SDA I/O I2C-bus SDA data line

PIO0_6 I/O GPIO4

SCLK I/O SPI/SSP serial clock line

PIO0_7 I/O GPIO13

CT16B_M1 O 16-bit timer match output 1

PIO0_8 I/O GPIO5

MISO O SPI/SSP master-in slave-out line

PIO0_9 I/O GPIO6

MOSI I SPI/SSP master-out slave-in line

PIO0_10 I/O GPIO

CT32B_M0 O 32-bit timer match output 0

SWCLK I ARM SWD clock

PIO0_11 I/O GPIO

CT32B_M1 O 32-bit timer match output 1

SWDIO I/O ARM SWD I/O

Radio

20 LA A NFC antenna/coil terminal A

19 LB A NFC antenna/coil terminal B

Reset

9 RESETN I external reset input[3]

[1] The GPIO port is a 12-bit I/O port with individual direction and function controls for each bit. The operation of port 0 pads

depends on the function selected through the IOCONFIG register block.

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[2] If external wake-up is enabled on this pad, it must be pulled HIGH before entering Deep power-down mode and pulled

LOW for a minimum of 100 µs to exit Deep power-down mode. It has weak pull-up to VBAT or internal NFC voltage

(whichever is highest).

[3] A LOW on this pad resets the device. This reset causes I/O ports and peripherals to take on their default states, and

processor execution to begin at address 0. It has weak pull-up to VDDBAT.

7.1.2 WLCSP25 package

Figure 3 shows the ball layout of the NHS3100 in the WLCSP25 package.

ball A1

index area NHS3100UK

aaa-024187

Transparent top view

1 2 3 4 5

Figure 3. Ball configuration WLCSP25

Table 5. Ball allocation table of the WLCSP25 package

Ball Symbol Ball Symbol

A1 VDDBAT C4[1] PIO0_7/CT16B_M1

A2 VSS C5[1] PIO0_11/CT32B_M1/SWDIO

A3 RESETN D1 PIO0_0/WAKEUP

A4 PIO0_4/SCL D2 PIO0_1/CLKOUT

A5 PIO0_5/SDA D3[2] (reserved)

B1 PIO0_8/MISO D4[2] (reserved)

B2 PIO0_9/MOSI D5[2] (reserved)

B3 (reserved) E1[2] (reserved)

B4[1] PIO0_3/CT16B_M0 E2[2] (reserved)

B5[1] PIO0_10/CT32B_M0/SWCLK E3[2] (reserved)

C1 PIO0_2/SSEL E4 LA

C2 PIO0_6/SCLK E5 LB

C3 VSS - -

[1] High source current balls. See Section 8.6.3.

[2] These balls must be tied to ground.

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Table 6. Ball description of the WLCSP25 package

Ball Symbol Type Description

Supply

A1 VDDBAT supply positive supply voltage

A2, C3 VSS supply ground

GPIO[1]

PIO0_0 I/O GPIOD1

WAKEUP I Deep power-down mode wake-up pin[2]

PIO0_1 I/O GPIOD2

CLKOUT O clock output

PIO0_2 I/O GPIOC1

SSEL I SPI/SSP serial select line

PIO0_3 I/O GPIOB4

CT16B_M0 O 16-bit timer match output 0

PIO0_4 I/O GPIOA4

SCL I/O I2C-bus SCL clock line

PIO0_5 I/O GPIOA5

SDA I/O I2C-bus SDA data line

PIO0_6 I/O GPIOC2

SCLK I/O SPI/SSP serial clock line

PIO0_7 I/O GPIOC4

CT16B_M1 O 16-bit timer match output 1

PIO0_8 I/O GPIOB1

MISO O SPI/SSP master-in slave-out line

PIO0_9 I/O GPIOB2

MOSI I SPI/SSP master-out slave-in line

PIO0_10 I/O GPIO

CT32B_M0 O 32-bit timer match output 0

SWCLK I ARM SWD clock

PIO0_11 I/O GPIO

CT32B_M1 O 32-bit timer match output 1

SWDIO I/O ARM SWD I/O

Radio

E4 LA A NFC antenna/coil terminal A

E5 LB A NFC antenna/coil terminal B

Reset

A3 RESETN I external reset input[3]

[1] The GPIO port is a 12-bit I/O port with individual direction and function controls for each bit. The operation of port 0 pins

depend on the function selected through the IOCONFIG register block.

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[2] If external wake-up is enabled on this pin, it must be pulled HIGH before entering Deep power-down mode and pulled

LOW for a minimum of 100 μs to exit Deep power-down mode.

[3] A LOW on this pin resets the device. This reset causes I/O ports and peripherals to take on their default states, and

processor execution to begin at address 0. It has weak pull-up to VDDBAT or internal NFC voltage (whichever is highest).

7.1.3 NHS3100W8 gold bump version

Figure 4 shows the bump layout of the NHS3100W8.

aaa-025706

789

pin numbering

Figure 4. Bump configuration Bump die: Top view, bumps up

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Table 7. Bump allocation table of the NHS3100W8 package

Bump Symbol Bump Symbol

1 PIO0_0/WAKEUP 7 TP1

2 TP0 8 VSS

3 LA 9 VDDBAT

4 LB 10 PIO0_6

5 PIO0_11/CT32B_M1/SWDIO 11 TP2

6 PIO0_10/CT32B_M0/SWCLK 12 TP3

Table 8. Bump description of the NHS3100W8 package

Bump Symbol Type Description

Supply

9 VDDBAT supply positive supply voltage

8 VSS supply ground

GPIO[1]

PIO0_0 I/O GPIO1

WAKEUP I Deep power-down mode wake-up pin[2]

10 PIO0_6 I/O GPIO

PIO0_10 I/O GPIO

CT32B_M0 O 32-bit timer match output 0

SWCLK I ARM SWD clock

PIO0_11 I/O GPIO

CT32B_M1 O 32-bit timer match output 1

SWDIO I/O ARM SWD I/O

Radio

3 LA A NFC antenna/coil terminal A

4 LB A NFC antenna/coil terminal B

Test pins

2 TP0 - test pin - do not connect

7 TP1 - test pin - do not connect, or connect to ground

11 TP2 - test pin - do not connect

12 TP3 - test pin - do not connect

[1] The GPIO port is a 12-bit I/O port with individual direction and function controls for each bit. The operation of port 0 balls

depends on the function selected through the IOCONFIG register block.

[2] If external wake-up is enabled on this ball, it must be pulled HIGH before entering Deep power-down mode and pulled

LOW for a minimum of 100 μs to exit Deep power-down mode.

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8 Functional description

8.1 ARM Cortex-M0+ core

Refer to the Cortex-M0+ Devices Technical Reference Manual (Ref. 1) for a detailed

description of the ARM Cortex-M0+ processor.

The NHS3100 ARM Cortex-M0+ core has the following configuration:

•System options

–Nested Vectored Interrupt Controller (NVIC)

–Fast (single-cycle) multiplier

–System tick timer

–Support for wake-up interrupt controller

–Vector table remapping register

–Reset of all registers

•Debug options

–Serial Wire Debug (SWD) with two watchpoint comparators and four breakpoint

comparators

–Halting debug is supported

8.2 Memory map

Figure 5 shows the memory and peripheral address space of the NHS3100.

The only AHB peripheral device on the NHS3100 is the GPIO module. The APB

peripheral area is 512 kB in size. Each peripheral is allocated 16 kB of space.

All peripheral register addresses are 32-bit word aligned. Byte and halfword addressing is

not possible. All reading and writing are done per full word.

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aaa-017231

0x4000 0000

0x4000 4000

0x4000 C000

0x4003 4000

0x4001 4000

0x4003 C000

0x4003 8000

0x4004 0000

0x4004 4000

0x4004 8000

0x4005 4000

0x4005 8000

0x4006 0000

l2C-bus

watchdog timer

(reserved)

16-bit timer

(reserved)

32-bit timer

(reserved)

EEPROM controller

PMU

flash controller

SPI/SSP

IOCONFIG

system configuration

(reserved)

RTC timer

(reserved)

RFID/NFC

(reserved)

temperature sensor

0x0000 7FFF

0x0000 0000

0x0FFF FFFF

0x0000 8000

0x2FFF FFFF

0x1000 2000

0x1000 1FFF

0x1000 0000

0x3000 0FFF

0x3000 0000

0x3000 1000

0x3FFF FFFF

0x4007 FFFF

0x4000 0000

0x4FFF FFFF

0x4008 0000

0x501F FFFF

0x5000 0000

0x5020 0000

0xE01F FFFF

0xE000 0000

0xFFFF FFFF

0xE020 0000

0xDFFF FFFF

(reserved)

private peripheral bus

AHB peripherals

APB peripherals

4 kB EEPROM

8 kB SRAM

32 kB on-chip flash

0x5001 0000

0x5000 FFFF

0x5000 0000

0x501F FFFF

GPIO PIO0

(reserved)

AHB peripherals

APB peripherals

Figure 5. NHS3100 memory map

8.3 System configuration

The system configuration APB block controls oscillators, start logic, and clock generation

of the NHS3100. Also included in this block is a register for remapping the interrupt

vector table.

8.3.1 Clock generation

The NHS3100 Clock Generator Unit (CGU) includes two independent RC oscillators.

These oscillators are the System Free-Running Oscillator (SFRO) and the Timer Free-

Running Oscillator (TFRO).

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The SFRO runs at 8 MHz. The system clock is derived from it and can be set to 8 MHz,

4 MHz, 2 MHz, 1 MHz, 500 kHz, 250 kHz, 125 kHz, or 62.5 kHz (Note: Some features

are not available when using the lower clock speeds). The TFRO runs at 32.768 kHz and

is the clock source for the timer unit. The TFRO cannot be disabled.

Following reset, the NHS3100 starts operating at the default 500 kHz system clock

frequency to minimize dynamic current consumption during the boot cycle.

The SYSAHBCLKCTRL register gates the system clock to the various peripherals and

memories. The temperature sensor receives a fixed clock frequency, irrespective of the

system clock divider settings, while the digital part uses the system clock (AHB clock 0).

aaa-015352

SYSTEM FRO

(8 MHz)

SYSTEM CLOCK

DIVIDER

SYSCLKTRIM

fixed-frequency taps

system clock (AHB clock 0)

peripheral clocks

analog peripheral clocks

SPI/SSP

WDT_PCLK

wake-up timer

PMU/always-on-domain

SYSCLKDIV[2:0]

SPI/SSP CLOCK

DIVIDER

SSPCLKDIV

WDTCLKDIV

SYSAHBCLKCTRL

TIMER FRO

(32 kHz)

TMRCLKTRIM

TMRUEN

WATCHDOG CLOCK

DIVIDER

WDTSEL

Figure 6. NHS3100 clock generator block diagram

8.3.2 Reset

Reset has three sources on the NHS3100:

•The RESETN pin

•Watchdog reset

•A software reset

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8.4 Power management

The Power Management Unit (PMU) controls the switching between available power

sources and the powering of the different voltage domains in the IC.

8.4.1 System power architecture

The NHS3100 accepts power from two different sources: from the external power supply

pin VDDBAT, or from the built-in NFC/RFID rectifier.

The NHS3100 has a small automatic source selector that monitors the power inputs

(VBAT and VNFC, see Figure 7) as well as pin RESETN. The PSWBAT switch is kept

open until a trigger is given on pin RESETN or via the NFC field. If the trigger is given,

the always-on domain, VDD_ALON, itself is powered via the PSWBAT or the PSWNFC

switch: via VBAT, if VBAT > 1.72 V, or VNFC. Priority is given to VBAT when both VBAT

and VNFC are present.

The automatic source selector unit in the PMU decides on the powering of the internal

domains based on the power source.

•If a voltage > 1.72 V is detected on VBAT and not VNFC, VBAT powers the internal

domains after a trigger on pin RESETN or via NFC.

•If a voltage ≤ 1.72 V is detected on VBAT, and a higher voltage is detected on VNFC,

the internal domains are powered from VNFC.

•If a voltage > 1.72 V is detected at both VBAT and VNFC, the internal domains are

powered from VBAT.

•Switchover between power sources is possible. If initially both VBAT and VNFC are

available, the system is powered from VBAT. If VBAT then becomes unavailable

(because it is switched off externally, or by a PSWBAT/PSWNFC power switch

override), the internal domains are immediately powered from VNFC. Switchover is

supported in both directions.

•The user can force the selection of the VBAT input by disabling the automatic power

switch, which disables the automatic source selector voltage comparator.

When on NFC power only (passive operation), connecting one or more 100 nF external

capacitors in parallel to a GPIO pad, and setting that pad as an output driven to logic 1, is

advised. Preferably a high-drive pin should be chosen and several pins can be connected

in parallel.

PSWNFC and PSWBAT are the power switches. PSWNFC connects power to the

VDD_ALON power net when an RF field is present. PSWBAT connects power from the

battery when a positive edge is detected on RESETN. If no RF power is available, the

PMU can open this PSWBAT switch, effectively switching off the device. After connecting

VDDBAT to a power source, the PSWBAT switch is open until a rising edge is detected

on RESETN or RF power is applied.

Each component of the NHS3100 resides in one of several internal power domains,

as indicated in Figure 7. The domains are VBAT, VNFC, VDD_ALON, VDD1V2 and

VDD1V6. The domains VDD_ALON, VDD1V2 and VDD1V6 are either powered or not

powered, depending on the mode of the NHS3100. There are 5 modes:

•Active

•Sleep

•Deep-sleep

•Deep power-down

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•Battery-off

The VDD_ALON domain contains BrownOut Detection (BOD). When enabled, it raises a

BOD interrupt if the VDD_ALON voltage drops below 1.8 V.

The PMU controls the Active, Sleep, Deep-sleep, and Deep power-down modes. In this

way, the power flows to the different internal components.

The PMU has two LDOs powering the internal VDD1V2 and VDD1V6 voltage domains.

LDO1V2 converts voltages in the range 1.72 V to 3.6 V to 1.22 V. LDO1V6 converts

voltages in the range 1.72 V to 3.6 V to 1.6 V. Each LDO can be enabled separately.

When powered via VNFC, a 1.2 nF buffer capacitor is included at the input of the LDOs.

The trigger detector (not shown in Figure 7) and the power gate have a leakage of less

than 50 nA, allowing a long shelf life before activation.

aaa-019962

AUTOMATIC SOURCE SELECTOR UNIT

< 1.85 V

1.72 V to 3.6 V

1.2 V

75 kΩ

PMU

32 kHz FRO

ALWAYS-ON DOMAIN

pin mode override if PCON.WAKEUP set,

when entering Deep power-down mode

DIGITAL CORE

PERIPHERALS

VDD_ALON

PSWNFC

PSWBAT

VNFC

VBAT

RESETN

VDDBAT

PIO0_0

WAKEUP

ANALOG

PERIPHERALS,

FLASH MEMORY

EEPROM MEMORY

NFC core

RTC

BOD

LDO1V2

SFRO

LDO1V6

GPREGx

1.6 V

Figure 7. NHS3100 power architecture

Table 9 summarizes the PMU states and settings of the LDOs. Figure 8 shows the state

transitions.

Table 10 and Table 11 summarize the events that can influence wake-up from Deep

power-down or Deep-sleep modes (DEEPPDN or DEEPSLEEP to ACTIVE state

transition).

Table 9. IC power states

State VDD_ALON DPDN[1] Sleep or Deep-

sleep

LDO1 (1.2 V) LDO2 (1.6 V)

BATTERY-OFF (No power) no X[2] X[2] off off

ACTIVE yes 0 0 on on

DEEPPDN yes 1 0 off off

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State VDD_ALON DPDN[1] Sleep or Deep-

sleep

LDO1 (1.2 V) LDO2 (1.6 V)

SLEEP/DEEPSLEEP yes 0 1 on on

[1] DPDN indicates whether the system is in Deep power-down mode.

[2] X = don’t care.

aaa-019373

BATTERY-OFF

ACTIVE

DEEP

POWER-DOWN

SLEEP OR

DEEP-SLEEP

Figure 8. PMU state transition diagram

Figure 9 shows the power-up sequence. Applying battery power when the PSWBAT

switch is closed, or NFC power becomes available, provides the always-on part with a

Power-On Reset (POR) signal. The TFRO is initiated, which starts a state machine in

the PMU. In the first state, the LDO1V2, powering the digital domain, is started. In the

second state, the LDO1V6, powering the analog domain, is started which starts the flash

memory. Enabling the LDO1V2, and the SFRO stabilizing, triggers the system_por. The

system is now considered to be ‘on’. The system can boot when the flash memory is fully

operational.

The total start-up time from trigger to active mode/boot is about 2.5 ms.

If there is no battery power, but there is RF power, the same procedure is followed

except that PSWNFC connects power to the LDOs.

The user cannot disable the TFRO as it is used by the PMU.

Table 10. State transition events for DEEPSLEEP to ACTIVE

Event Description

RESETN reset asserted

RTC event if the timer reaches preset value

Watchdog watchdog issues interrupt or reset

WAKEUP signal on WAKEUP pin

RF field RF field is detected, potential NFC command input (if set in PMU)

Start logic interrupt one of the enabled start logic interrupts is asserted

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Table 11. State transition events for DEEPPDN to ACTIVE

Event Description

RESETN reset asserted

RTC event if the timer reaches preset value

WAKEUP signal on WAKEUP pin (when enabled)

RF field RF field is detected, potential NFC command input (if set in PMU)

aaa-016479

VDD_ALON

start TFRO enable 1.2 V LDO

enable 1.6 V LDO

for analog domain

and flash memory

POR always-on

domain

SFRO starts running

power

flash and

digital

power

analog

off

SFRO stable (64 µs)

system_por

Figure 9. NHS3100 power-up sequence

8.4.2 Power Management Unit (PMU)

The Power Management Unit (PMU) partly resides in the digital power domain and partly

in the always-on domain. The PMU controls the Sleep, Deep-sleep, and Deep power-

down modes and the power flow to the different internal circuit blocks. Five general-

purpose registers in the PMU can be used to retain data during Deep power-down mode.

These registers are located in the always-on domain. When configured, the PMU also

raises a BOD interrupt if VDD_ALON drops to below 1.8 V.

The power to the different APB analog slaves is controlled through a power-down

configuration register.

The power control register selects whether an ARM Cortex-M0+ controlled Power-down

mode (Sleep mode or Deep-sleep mode) or the Deep power-down mode is entered. It

also provides the flags for Sleep or Deep-sleep modes and Deep power-down mode

respectively. In addition, it contains the overrides for the power source selection.

8.5 Nested Vectored Interrupt Controller (NVIC)

The Nested Vectored Interrupt Controller (NVIC) is a part of the ARM Cortex-M0+. The

tight integration of the processor core and NVIC enables fast processing of interrupts,

dramatically reducing the interrupt latency.

8.5.1 Features

•NVIC that is a part of the ARM Cortex-M0+

•Tightly coupled interrupt controller provides low interrupt latency

•Controls system exceptions and peripheral interrupts

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•Four programmable interrupt priority levels with hardware priority level masking

•Software interrupt generation

8.5.2 Interrupt sources

Table 12 lists the interrupt sources for each peripheral function. Each peripheral device

may have one or more interrupt lines to the Nested Vectored Interrupt Controller. Each

line may represent more than one interrupt source. There is no significance or priority

about which line is connected where, except for certain standards from ARM.

Table 12. Connection of interrupt source to the Nested Vector Interrupt Controller

Exception

number

Vector

offset

Function Flags

0 to 12 - start logic wake-up

interrupts

each interrupt connected to a PIO0 input pin serves

as wake-up from Deep-sleep mode[1]

13 - RFID/NFC RFID/NFC access detected/command received/read

acknowledge

14 - RTC On/Off timer RTC on/off timer event interrupt

15 - I2C Slave Input (SI) (state change)

16 - CT16B 16-bit timer

17 - PMU power from NFC field detected

18 - CT32B 32-bit timer

19 - BOD brownout detection (power drop)

20 - SPI/SSP TX FIFO half empty/RX FIFO half full/RX time-out/RX

overrun

21 - TSENS temperature sensor end of conversion/low threshold/

high threshold

22 to 25 - - (reserved)

26 - WDT watchdog interrupt (WDINT)

27 - flash flash memory

28 - EEPROM EEPROM memory

29 to 30 - - (reserved)

31 - PIO0 GPIO interrupt status of port 0

[1] Interrupt 0 to 10 correspond to PIO0_0 to PIO0_10; interrupt 11 corresponds to RFID/NFC external access; interrupt 12

corresponds to the RTC On/Off timer.

8.6 I/O configuration

The I/O configuration registers control the electrical characteristics of the pads. The

following features are programmable:

•Pin function

•Internal pull-up/pull-down resistor or bus keeper function

•Low-pass filter

•I2C-bus mode for pads hosting the I2C-bus function

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The IOCON registers control the function (GPIO or peripheral function), the input mode,

and the hysteresis of all PIO0_m pins. In addition, the I2C-bus pins can be configured for

different I2C-bus modes.

The FUNC bits in the IOCON registers can be set to GPIO (FUNC = 000) or to a

peripheral function. If the pins are GPIO pins, the GPIO0DIR registers determine whether

the pin is configured as an input or output. For any peripheral function, the pin direction

is controlled automatically depending on the functionality of the pin. The GPIO0DIR

registers have no effect on peripheral functions.

8.6.1 PIO0 pin mode

The MODE bits in the IOCON register allow the selection of on-chip pull-up or pull-down

resistors for each pin, or to select the repeater mode. The possible on-chip resistor

configurations are pull-up enabled, pull-down enabled, or no pull-up/pull-down. The

default value is no pull-up or pull-down enabled. The repeater mode enables the pull-up

resistor when the pin is at logic 1, and enables the pull-down resistor when the pin is at

logic 0. This mode causes the pin to retain its last known state if it is configured as an

input and is not driven externally. The state retention is not applicable to the Deep power-

down mode. Repeater mode is typically used to prevent a pin from floating when it is

temporarily not driven. Allowing it to float could potentially use significant power.

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8.6.2 PIO0 I2C-bus mode

If the FUNC bits of registers PIO0_4 and PIO0_5 select the I2C-bus function, the I2C-bus

pins can be configured for different I2C-bus modes:

•Standard-mode/Fast-mode I2C-bus with input glitch filter (including an open-drain

output according to the I2C-bus specification)

•Standard open-drain I/O functionality without input filter

8.6.3 PIO0 current source mode

PIO0_3, PIO0_7, PIO0_10 and PIO0_11 are high-source pads that can deliver up to

20 mA to the load. These PIO pins can be set to either digital mode or analog current

sink mode. In digital mode, the output voltage of the pad switches between VSS and

VDD. In analog current drive mode, the output current sink switches between the values

set by the ILO and IHI bits. The maximum pad voltage is limited to 5 V.

aaa-015353

repeater mode

enable

configured

as output

configured

as input

data input

data output

CDRIVE

IHI[7:0]

ILO[7:0]

CURRENT

SINK

pull-up enable

ESD

Figure 10. Pin configuration with current source mode

8.7 Fast general-purpose parallel I/O

The GPIO registers control device pins that are not connected to a specific peripheral

function. Pins may be dynamically configured as inputs or outputs. Multiple outputs can

be set or cleared in one write operation.

The NHS3100 uses accelerated GPIO functions:

•GPIO registers are on the ARM Cortex-M0+ I/O bus for fastest possible single-cycle I/O

timing

•An entire port value can be written in one instruction

•Mask, set, and clear operations are supported for the entire port

All GPIO port pins are fixed-pin functions that are enabled or disabled on the pins by the

switch matrix. Therefore each GPIO port pin is assigned to one specific pin and cannot

be moved to another pin.

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8.7.1 Features

•Bit level port registers allow a single instruction to set and clear any number of bits in

one write operation

•Direction control of individual bits

•After reset, all I/Os default to GPIO inputs without pull-up or pull-down resistors; The

I2C-bus true open-drain pins PIO0_4 and PIO0_5 and the SWD pins PIO0_10 and

PIO0_11 are exceptions

•Pull-up/pull-down Configuration, Repeater, and Open-drain modes can be programmed

through the IOCON block for each GPIO pin

•Direction (input/output) can be set and cleared individually per pin

•Pin direction bits can be toggled

8.8 I2C-bus controller

8.8.1 Features

Standard I2C-bus compliant interfaces may be configured as master, slave, or master/

slave.

•Arbitration is handled between simultaneously transmitting masters without corruption

of serial data on the bus

•Programmable clock allows adjustment of I2C-bus transfer rates

•Data transfer is bidirectional between masters and slaves

•Serial clock synchronization allows devices with different bit rates to communicate via

one serial bus

•Serial clock synchronization is used as a handshake mechanism to suspend and

resume serial transfer

•Supports Standard-mode (100 kbit/s) and Fast-mode (400 kbit/s)

•Optional recognition of up to four slave addresses

•Monitor mode allows observing all I2C-bus traffic, regardless of slave address

•The I2C-bus can be used for test and diagnostic purposes

•The I2C-bus contains a standard I2C-bus compliant interface with two pins

•Possibility to wake up NHS3100 on matching I2C-bus slave address

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8.8.2 General description

Two types of data transfers are possible on the I2C-bus, depending on the state of the

direction bit (R/W):

•Data transfer from a master transmitter to a slave receiver

The first byte transmitted by the master is the slave address. Next follows a number of

data bytes. The slave returns an acknowledge bit after each received byte.

•Data transfer from a slave transmitter to a master receiver

The master transmits the first byte (the slave address). The slave then returns an

acknowledge bit. The slave then transmits the data bytes to the master. The master

returns an acknowledge bit after all received bytes other than the last byte. At the end

of the last received byte, a not-acknowledge is returned. The master device generates

all of the serial clock pulses and the START and STOP conditions. A transfer is ended

with a STOP condition or with a repeated START condition. As a repeated START

condition is also the beginning of the next serial transfer, the I2C-bus is not released.

The I2C-bus interface is byte oriented and has four operating modes: Master transmitter

mode, Master receiver mode, Slave transmitter mode, and Slave receiver mode.

The I2C-bus interface is completely I2C-bus compliant, supporting the ability to power off

the NHS3100 independent of other devices on the same I2C-bus.

The I2C-bus interface requires a minimum 2 MHz system clock to operate in Normal

mode, and 8 MHz for Fast-mode.

8.8.3 I2C-bus pin description

Table 13. I2C-bus pin description

Pin Type Description

SDA I/O I2C-bus serial data

SCL I/O I2C-bus serial clock

The I2C-bus pins must be configured through the PIO0_4 and PIO0_5 registers for

Standard-mode or Fast-mode. The I2C-bus pins are open-drain outputs and fully

compatible with the I2C-bus specification.

8.9 SPI controller

8.9.1 Features

•Compatible with Motorola SPI, 4-wire Texas Instruments Synchronous Serial Interface

(SSI), and National Semiconductor Microwire buses

•Synchronous serial communication

•Supports master or slave operation

•Eight-frame FIFOs for both transmit and receive

•4-bit to 16-bit frame

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8.9.2 General description

The SPI/SSP is a Synchronous Serial Port (SSP) controller capable of operation on an

SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on

the bus. Only a single master and a single slave can communicate on the bus during a

given data transfer. Data transfers are in principle full duplex, with frames from 4 bits to

16 bits of bidirectional data flowing between master and slave. In practice, often only one

of these two data flows carries meaningful data.

8.9.3 Pin description

Table 14. SPI pin description

name

Type Interface

pin SPI

SSI Microwire Description

SCLK I/O SCLK CLK SK serial clock

SSEL I/O SSEL FS CS frame sync/slave select

MISO I/O MISO DR (M)

DX (S)

SI (M)

SO (S)

master input slave output

MOSI I/O MOSI DX (M)

DR (S)

SO (M)

SI (S)

master output slave input

8.9.3.1 Pin detailed description

Serial clock

SCK/CLK/SK is a clock signal used to synchronize the transfer of data. The master

drives the clock signal and the slave receives it. When SPI/SSP interface is used, the

clock is programmable to be active HIGH or active LOW, otherwise it is always active

HIGH. SCK only switches during a data transfer. At any other time, the SPI/SSP interface

either stays in its inactive state or is not driven (remains in high-impedance state).

Frame sync/slave select

When the SPI/SSP interface is a bus master, it drives this signal to an active state before

the start of serial data. It then releases it to an inactive state after the data has been

sent. The active state can be HIGH or LOW depending upon the selected bus and mode.

When the SPI/SSP interface is a bus slave, this signal qualifies the presence of data from

the master according to the protocol in use.

When there is only one master and slave, the master signals, frame sync, or slave select,

can be connected directly to the corresponding slave input. When there are multiple

slaves, further qualification of frame sync/slave select inputs is normally necessary to

prevent more than one slave from responding to a transfer.

Master Input Slave Output (MISO)

The MISO signal transfers serial data from the slave to the master. When the SPI/SSP

is a slave, it outputs serial data on this signal. When the SPI/SSP is a master, it clocks in

serial data from this signal. It does not drive this signal and leaves it in a high-impedance

state when the SPI/SSP is a slave and not selected by FS/SSEL.

Master Output Slave Input (MOSI)

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The MOSI signal transfers serial data from the master to the slave. When the SPI/SSP

is a master, it outputs serial data on this signal. When the SPI/SSP is a slave, it clocks in

serial data from this signal.

8.10 RFID/NFC communication unit

8.10.1 Features

•ISO/IEC14443A part 1 to part 3 compatible

•MIFARE (Ultralight) EV1 compatible

•NFC Forum Type 2 compatible

•Easy interfacing with standard user memory space READ/WRITE commands

•Passive operation possible

8.10.2 General description

The RFID/NFC interface allows communication using 13.56 MHz proximity signaling.

aaa-015354

RFID

ANALOG

INTERFACE

EEPROM

SUBSYSTEM

SRAM

APB

INTERFACE

CMDIN

DATAOUT

SR Register

APB SLAVE SUBSYSTEM irq

APB

RFID DIGITAL SUBSYSTEM

VDD_RFID

EEPROM

INTERFACE

RFID

MAIN

CONTROLLER

RFID

ANALOG

SUBSYSTEM

Figure 11. Block diagram of the RFID/NFC interface

The CMDIN, DATAOUT, Status Register (SR), and SRAM are mapped in the user

memory space of the RFID core. The RFID READ and WRITE commands allow wireless

communication to this shared memory.

Messages can be in Raw mode (user proprietary protocol) or formatted according to NFC

Forum Type 2 NDEF messaging and ISO/IEC 11073.

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8.11 16-bit timer

8.11.1 Features

One 16-bit timer with a programmable 16-bit prescaler.

•Timer operation

•Four 16-bit match registers that allow:

–Continuous operation with optional interrupt generation on match

–Stop timer on match with optional interrupt generation

–Reset timer on match with optional interrupt generation

•Up to two CT16B external outputs corresponding to the match registers with the

following capabilities:

–Set LOW on match

–Set HIGH on match

–Toggle on match

–Do nothing on match

•Up to two match registers can be configured as Pulse Width Modulation (PWM)

allowing the use of up to two match outputs as single edge controlled PWM outputs

8.11.2 General description

The peripheral clock (PCLK), which is derived from the system clock, clocks the timer.

The timer can optionally generate interrupts or perform other actions at specified timer

values based on four match registers. The peripheral clock is provided by the system

clock.

Each timer also includes one capture input to trap the timer value when an input signal

transitions, optionally generating an interrupt.

In PWM mode, four match registers can be used to provide a single-edge controlled

PWM output on the match output pins. The use of the match registers that are not pinned

out to control the PWM cycle length is recommended.

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8.12 32-bit timer

8.12.1 Features

One 32-bit timer with a programmable 32-bit prescaler.

•Timer operation

•Four 32-bit match registers that allow:

–Continuous operation with optional interrupt generation on match

–Stop timer on match with optional interrupt generation

–Reset timer on match with optional interrupt generation

•Up to two CT32B external outputs corresponding to the match registers with the

following capabilities:

–Set LOW on match

–Set HIGH on match

–Toggle on match

–Do nothing on match

•Up to two match registers can be configured as PWM allowing the use of up to two

match outputs as single edge controlled PWM outputs

8.12.2 General description

The peripheral clock (PCLK), which is derived from the system clock, clocks the timer.

The timer can optionally generate interrupts or perform other actions at specified timer

values based on four match registers. The peripheral clock is provided by the system

clock.

Each timer also includes one capture input to trap the timer value when an input signal

transitions, optionally generating an interrupt.

In PWM mode, four match registers can be used to provide a single-edge controlled

PWM output on the match output pins. Use of the match registers that are not pinned out

to control the PWM cycle length is recommended.

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8.13 WatchDog Timer (WDT)

If the microcontroller enters an erroneous state, the purpose of the WatchDog Timer

(WDT) is to reset it within a reasonable amount of time.

When enabled, if the user program fails to feed (or reload) the WDT within a

predetermined amount of time, the WDT generates a system reset.

8.13.1 Features

•If not periodically reloaded, it internally resets the microcontroller

•Debug mode

•Enabled by software but requires a hardware reset or a WDT reset/interrupt to be

disabled

•If enabled, incorrect/incomplete feed sequence causes reset/interrupt

•Flag to indicate WDT reset

•Programmable 24-bit timer with internal prescaler

•Selectable time period from (TWDCLK × 256 × 4) to (TWDCLK × 224 × 4) in multiples

of TWDCLK × 4

•The WDT clock (WDCLK) source is a 2 MHz clock derived from the SFRO, or the

external clock as set by the SYSCLKCTRL register

8.13.2 General description

The WDT consists of a divide by 4 fixed prescaler and a 24-bit counter. The clock is fed

to the timer via a prescaler. The timer decrements when clocked. The minimum value by

which the counter is decremented is 0xFF. Setting a value lower than 0xFF causes 0xFF

to be loaded in the counter. Hence the minimum WDT interval is (TWDCLK × 256 × 4)

and the maximum is (TWDCLK × 224 × 4), in multiples of (TWDCLK × 4).

8.14 System tick timer

8.14.1 Features

•Simple 24-bit timer

•Uses dedicated exception vector

•Clocked internally by the system clock or the system clock divided by two

8.14.2 General description

The SYSTICK timer is a part of the Cortex-M0+. The SYSTICK timer can be used to

generate a fixed periodic interrupt for use by an operating system or other system.

Since the SYSTICK timer is a part of the Cortex-M0+, it facilitates porting of software by

providing a standard timer available on Cortex-M0+ based devices. The SYSTICK timer

can be used for management software.

Refer to the Cortex-M0+ Devices - Generic User Guide (Ref. 2) for details.

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8.15 Real-Time Clock (RTC) timer

8.15.1 Features

The Real-Time Clock (RTC) block contains two counters:

•A countdown timer generating a wake-up signal when it expires

•A continuous counter that counts seconds since power-up or the last system reset

The countdown timer runs on a low speed clock and runs in an always-on power domain.

The delay, as well as a clock tuning prescaler, can be configured via the APB bus. The

RTC countdown timer generates both the deep power-down wake-up signal and the RTC

interrupt signal (wake-up interrupt 12). The deep power-down wake-up signal is always

generated, while the interrupt can be masked according to the settings in the RTCIMSC

8.15.2 General description

The RTC module consists of two parts:

•The RTC core module, implementing the RTC timers themselves. This module runs in

the always-on VDD_ALON domain.

•The AMBA APB slave interface. This module allows configuration of the RTC core via

an APB bus. This module runs in the switched power domain.

8.16 Temperature sensor

8.16.1 Features

The temperature sensor block measures the chip temperature and outputs a raw value or

a calibrated value in Kelvin.

8.16.2 General description

The temperature is measured using a high-precision, zoom-ADC. The analog part is able

to measure a highly temperature-dependent X = Vbe / ΔVbe1. It determines the value of

X by first applying a coarse search (successive approximation), and then a sigma-delta

in a limited range. The conversion time depends on the resolution mode as shown in

Table 15.

Table 15. Conversion time for different resolution of TSENS

Resolution (bit) Resolution (°C) Conversion time (ms)

7 ±0.8 4

8 ±0.4 7

9 ±0.2 14

10 ±0.1 26

1Vbe is the base-emitter voltage of a bipolar transistor. Basically, the temperature sensor measures the

voltage drop over a diode formed by the base-emitter junction of a bipolar transistor. It compares the Vbe

at different current levels (from which follows the ΔVbe).

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Resolution (bit) Resolution (°C) Conversion time (ms)

11 ±0.05 50

12 ±0.025 100

8.17 Serial Wire Debug (SWD)

The debug functions are integrated into the ARM Cortex-M0+. Serial Wire Debug (SWD)

functions are supported. The ARM Cortex-M0+ is configured to support up to four

breakpoints and two watchpoints.

•Supports ARM SWD mode

•Direct debug access to all memories, registers, and peripherals

•No target resources are required for the debugging session

•Four breakpoints

Four instruction breakpoints that can also be used to remap instruction addresses for

code patches. Two data comparators that can be used to remap addresses for patches

to literal values.

•Two data watchpoints that can also be used as triggers

8.18 On-chip flash memory

The NHS3100 contains a 32 kB flash memory of which 30 kB can be used as program

and data memory.

The flash is organized in 32 sectors of 1 kB. Each sector consists of 16 rows of 16 × 32-

bit words.

8.18.1 Reading from flash

Reading is done via the AHB interface. The memory is mapped on the bus address

space as a contiguous address space. Memory data words are seen on the bus using a

little endian arrangement.

8.18.2 Writing to flash

Writing to flash means copying a word of data over the AHB to the page buffer of the

flash. It does not actually program the data in the memory array. This programming is

done by subsequent erase and program cycles.

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8.18.3 Erasing/programming flash

Erasing and programming are separate operations. Both are possible only on memory

sectors that are unprotected and unlocked. Protect/lock information is stored inside the

memory itself, so the controller is not aware of protection status. Therefore, if a program/

erase operation is performed on a protected or locked sector, it does not flag an error.

Protection

At exit from reset, all sectors are protected against accidental modification. To allow

modification, a sector must be unprotected. It can then be protected again after that the

modification is performed.

Locking

Each flash sector has a lock bit. Lock bits can be set but cannot be cleared. Locked

sectors cannot be erased and reprogramed.

8.19 On-chip SRAM

The NHS3100 contains a total of 8 kB on-chip SRAM memory configured as

256 × 2 × 4 × 32 bit.

8.20 On-chip EEPROM

The NHS3100 contains a 4 kB EEPROM. This EEPROM is organized in 64 rows of

32 × 16-bit words. Of these rows, the last four contain calibration and test data and are

locked. This data is either used by the boot loader after reset, or made accessible to the

application via firmware Application Programming Interface (API).

8.20.1 Reading from EEPROM

Reading is done via the AHB interface. The memory is mapped on the bus address

space, as a contiguous address space. Memory data words are seen on the bus using a

little endian arrangement.

8.20.2 Writing to EEPROM

Erasing and programming is performed, as a single operation, on one or more words

inside a single page.

Previous write operations have transferred the data to be programmed into the memory

page buffer. The page buffer tracks which words were written to (offset within the page

only). Words not written to, retain their previous content.

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9 Limiting values

Table 16. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDD supply voltage −0.5 +3.6 V

normal PIO pads (VDD = 0.6 V) −0.5 +3.6 V

high-source PIO pads −0.5 +5.5 V

VIinput voltage

LA/LB pads −0.5 +5.5 V

IDD supply current per supply pin - 100 mA

ISS ground supply current per supply pin - 100 mA

Ilu latch-up current I/O; −0.5VDD < VI < +1.5VDD;

Tj < 125 °C

- 100 mA

Tstg storage temperature −40 +125 °C

Tjjunction temperature - 125 °C

Ptot total power dissipation - 1 W

human body model; all pins −2000 +2000 VVESD electrostatic discharge voltage

charged device model; all pins −500 +500 V

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10 Static characteristics

Table 17. Static characteristics

Tamb = −40 °C to +85 °C, unless otherwise stated.

Symbol Parameter Conditions Min Typ Max Unit

Supply pins

VDD supply voltage 1.72 3.0 3.60 V

IDD supply current voltage and clock frequency

dependent

[1] - - - µA

IL(off) off-state leakage current - - 50 nA

IDD(pd) power-down mode supply current Deep power-down mode - 3 - µA

Standard GPIO pins

VIH HIGH-level input voltage 0.7VDD - - V

VIL LOW-level input voltage - - 0.3VDD V

Vhys hysteresis voltage 0.4 - - V

Rpd pull-down resistance - 72 - kΩ

Rpu pull-up resistance - 73 - kΩ

HIGH-level VDD = 1.8 V [2] - 2 - mA

HIGH-level VDD = 3.6 V [2] - 8 - mA

LOW-level VDD = 1.8 V [2] - 4 - mA

ISsource current

LOW-level VDD = 3.6 V [2] - 16 - mA

High-drive GPIO pins

HIGH-level VDD = 1.8 V [3] 4 - 6 mA

HIGH-level VDD = 3.6 V [3] 13 - 18 mA

LOW-level VDD = 1.8 V [3] 5.5 - 8 mA

ISsource current

LOW-level VDD = 3.6 V [3] 22 - 32 mA

I2C-bus pins

LOW-level VDD = 1.8 V [4] 2 - 8.5 mAISsource current

LOW-level VDD = 3.6 V [4] 9.5 - 38 mA

Brownout detect

falling VDD - 1.8 - VVtrip(bo) brownout trip voltage

rising VDD - 1.875 - V

Vhys hysteresis voltage - 75 - mV

General

Rpu(int) internal pull-up resistance on pin RESETN - 100 - kΩ

Cext external capacitance on pin RESETN - - 1 nF

[1] See Figure 12

[2] PIO0_0, PIO0_1, PIO0_2, PIO0_6, PIO0_8, PIO0_9

[3] PIO0_3, PIO0_7, PIO0_10, PIO0_11

[4] PIO0_4, PIO0_5

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VDD (V)

1.5 43.52.5 32

aaa-022790

400

600

200

800

1000

IDD

(µA)

(3)

(2)

(1)

(4)

(5)

(6)

Plot of IDD / VDD when ARM running a while - 1 loop in Normal mode, no NFC field present.

(1) System clock = 250 kHz

(2) System clock = 500 kHz

(3) System clock = 1 MHz

(4) System clock = 2 MHz

(5) System clock = 4 MHz

(6) System clock = 8 MHz

Figure 12. Active current consumption

Table 18. Temperature sensor characteristics

Symbol Parameter Conditions Min Typ Max Unit

ICC(pd) power-down mode supply current TSENS disabled - - 1 nA

Istb standby current TSENS enabled - 6 7 µA

ICC(oper) operating supply current TSENS converting - 10 12 µA

Tamb = 0 °C to +40 °C −0.3 - +0.3 °CTacc temperature accuracy

Tamb = −40 °C to +85 °C −0.5 - +0.5 °C

12-bit mode - 0.025 - °CTres temperature resolution

8-bit mode - 0.4 - °C

12-bit mode - 100 - msTconv conversion period

8-bit mode - 7 - ms

Note: The absolute accuracy is valid for the factory calibration of the temperature sensor.

The sensor can be user-calibrated to reach higher accuracy.

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Product data sheet Rev. 6.03 — 15 June 2018

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Table 19. Antenna input characteristics

Symbol Parameter Conditions Min Typ Max Unit

Ciinput capacitance [1] - 50 - pF

fiinput frequency - 13.56 - MHz

[1] Tamb = 22 °C, f = 13.56 MHz, RMS voltage between LA and LB is 1.5 V

Table 20. EEPROM characteristics

Symbol Parameter Conditions Min Typ Max Unit

tret(data) data retention time Tamb = 22 °C 10 - - year

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11 Dynamic characteristics

11.1 I/O pins

Table 21. I/O dynamic characteristics

These characteristics apply to standard port pins and RESETN pin.

Tamb = −40 °C to +85 °C.

Symbol Parameter Conditions Min Typ Max Unit

trrise time pin configured as output 3.0 - 5.0 ns

tffall time pin configured as output 2.5 - 5.0 ns

11.2 I2C-bus

Table 22. I2C-bus dynamic characteristics

See UM10204 - I2C-bus specification and user manual (Ref. 3) for details. Tamb = −40 °C to +85 °C[1]; see the timing

diagram in Figure 13.

Symbol Parameter Conditions Min Typ Max Unit

Standard-mode 0 - 100 kHzfSCL SCL clock frequency

Fast-mode 0 - 400 kHz

Standard-mode [2] [3] [4] - - 300 nstffall time of both SDA and SCL

signals Fast-mode [2] [3] [4] 20 + 0.1 × Cb- 300 ns

Standard-mode 4.7 - - µstLOW LOW period of the SCL clock

Fast-mode 1.3 - - µs

Standard-mode 4.0 - - µstHIGH HIGH period of the SCL clock

Fast-mode 0.6 - - µs

Standard-mode [2] [5] [6] 0 - - µstHD;DAT data hold time

Fast-mode [2] [5] [6] 0 - - µs

Standard-mode [7] [8] 250 - - nstSU;DAT data setup time

Fast-mode [7] [8] 100 - - ns

[1] Parameters are valid over operating temperature range unless otherwise specified.

[2] A device must internally provide a hold time of at least 300 ns for the SDA signal (regarding the VIH(min) of the SCL signal). The hold time is to bridge the

undefined region of the falling edge of SCL.

[3] Cb = total capacitance of one bus line in pF.

[4] The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA output stage tf is specified at 250 ns. It allows

series protection resistors to be connected between the SDA and the SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tf.

[5] tHD;DAT is the data hold time that is measured from the falling edge of SCL; applies to data in transmission and the acknowledge.

[6] The maximum tHD;DAT could be 3.45 μs and 0.9 μs for Standard-mode and Fast-mode. However, it must be less than the maximum of tVD;DAT or tVD;ACK

by a transition time (see Ref. 3). Only meet this maximum if the device does not stretch the LOW period (tLOW) of the SCL signal. If the clock stretches the

SCL, the data must be valid by the setup time before it releases the clock.

[7] tSU;DAT is the data setup time that is measured against the rising edge of SCL; applies to data in transmission and the acknowledge.

[8] A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system but it must meet the requirement tSU;DAT = 250 ns. This requirement

is automatically the case if the device does not stretch the LOW period of the SCL signal. If it does, it must output the next data bit to the SDA line

tr(max) + tSU;DAT = 1000 + 250 = 1250 ns before the SCL line is released. This procedure is in accordance with the Standard-mode I2C-bus specification.

Also, the acknowledge timing must meet this setup time.

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Product data sheet Rev. 6.03 — 15 June 2018

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002aaf425

70 %

30 %

SDA

70 %

30 %

70 %

30 %

70 %

30 %

tHD;DAT

SCL

1 / fSCL

70 %

30 %

70 %

30 %

tVD;DAT

tHIGH

tLOW

tSU;DAT

Figure 13. I2C-bus pins clock timing

11.3 SPI interfaces

Table 23. Dynamic characteristics of SPI pins in SPI mode

Symbol Parameter Conditions Min Typ Max Unit

SPI master

full-duplex mode [1] 50 - - nstcy(clk) clock cycle time

when only transmitting [1] 40 - - ns

2.4 V ≤ VDD < 3.6 V [2] 15 - - ns

2.0 V ≤ VDD < 2.4 V [2] 20 - - ns

tSU;DAT data setup time

1.8 V ≤ VDD < 2.0 V [2] 24 - - ns

tHD;DAT data hold time [2] 0 - - ns

tv(Q) data output valid time [2] - - 10 ns

th(Q) data output hold time [2] 0 - - ns

SPI slave

Tcy(PCLK) PCLK cycle time [3] [4] 0 - - ns

tHD;DAT data hold time [3] [4] 3 × Tcy(PCLK) + 4 - - ns

tv(Q) data output valid time [3] [4] - - 3 × Tcy(PCLK) + 11 ns

th(Q) data output hold time [3] [4] - - 2 × Tcy(PCLK) + 5 ns

[1] tcy(clk) = (SSPCLKDIV × (1 + SCR) × CPSDVSR) / fmain. The clock cycle time derived from the SPI bit rate tcy(clk) is a function of:

•The main clock frequency fmain

•The SPI peripheral clock divider (SSPCLKDIV)

•The SPI SCR parameter (specified in the SSP0CR0 register)

•The SPI CPSDVSR parameter (specified in the SPI clock prescale register)

[2] Tamb = −40 °C to +105 °C

[3] tcy(clk) = 12 × Tcy(PCLK)

[4] Tamb = 25 °C for normal voltage supply: VDD = 3.3 V

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SCK (CPOL = 0)

MOSI

MISO

tcy(clk)

tSU;DAT tHD;DAT

tv(Q)

DATA VALID DATA VALID

th(Q)

SCK (CPOL = 1)

DATA VALID DATA VALID

MOSI

MISO

tSU;DAT tHD;DAT

DATA VALID DATA VALID

th(Q)

DATA VALID DATA VALID

tv(Q)

CPHA = 1

CPHA = 0

aaa-024226

Figure 14. SPI master timing in SPI mode

SCK (CPOL = 0)

MOSI

MISO

tcy(clk)

tv(Q)

DATA VALID DATA VALID

th(Q)

SCK (CPOL = 1)

DATA VALID DATA VALID

MOSI

MISO

tv(Q)

DATA VALID DATA VALID

th(Q)

DATA VALID DATA VALID

CPHA = 1

CPHA = 0

tSU;DAT tHD;DAT

aaa-024227

Figure 15. SPI slave timing in SPI mode

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12 Package outline

References

Outline

version

European

projection Issue date

IEC JEDEC JEITA

SOT616-3 MO-220

sot616-3_po

16-02-17

16-07-14

Unit(1)

max

nom

min

1 0.05 4.1 2.75 4.1

0.5 2.5

A(1)

Dimensions (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;

24 terminals; body 4 x 4 x 0.85 mm SOT616-3

A1b

0.30

c D(1) DhE(1) Ehe e1e2

2.5

L v

0.1

w y

0.2 0.10.05 0.05

0.32.450.00 3.9 2.45 3.90.18

0.52.75

0 2.5 5 mm

scale

AA1

detail X

yy1C

7 12

24 19

B A

terminal 1

index area

terminal 1

index area

1/2 e

Figure 16. HVQFN24 package outline

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Product data sheet Rev. 6.03 — 15 June 2018

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References

Outline

version

European

projection Issue date

IEC JEDEC

- - -

JEITA

sot1401-1

sot1401-1_po

15-10-05

16-07-26

Unit

max

nom

min

0.29 2.54 2.54

0.15 0.03

Dimensions (mm are the original dimensions)

WLCSP25: wafer level chip-scale package, 25 balls; 2.51 x 2.51 x 0.5 mm SOT1401-1

A1A2

0.325

0.275

0.26 2.51 2.51 0.4

b D E e

1.6

e2v w

0.05

0.23 2.48 2.48

0.300

0.23

0.17

0.20

0.54

0.46

0.50

detail X

54321

ebAC B

Ø v

CØ w

3 mm0

scale

ball A1

index area

ball A1

index area

Figure 17. WLCSP25 package outline

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Product data sheet Rev. 6.03 — 15 June 2018

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sot1870-1_ssv

terminal 1

index area

terminal 1

index area

1.012

Dimensions are in mm

0.422

1.058

0.512

0.763

0.18

0.382

9 8 7

1.058

0 2 mm

scale

References

Outline

version

European

projection

IEC JEDEC JEITA

SOT1870-1 - - -

Bumped die with 8 functional bumps; 2.51 mm x 2.51 mm x 0.16 mm SOT1870-1

0.682

0.291

detail X

0.160

± 0.015

0.150

± 0.015

0.010

± 0.002

2.51 ± 0.03

Figure 18. Bumped die package outline

NXP Semiconductors NHS3100

Temperature logger

Product data sheet Rev. 6.03 — 15 June 2018

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13 Abbreviations

Table 24. Abbreviations

Acronym Description

ADC Analog-to-Digital Converter

AHB Advanced High-performance Bus

AMBA Advanced Microcontroller Bus Architecture

APB Advanced Peripheral Bus

API Application Programming Interface

ARM Advanced RISC Machine

BOD BrownOut Detection

CGU Clock Generator Unit

EEPROM Electrically Erasable Programmable Read-Only Memory

GPIO General Purpose Input Output

I2C Inter-Integrated Circuit

LDO Low DropOut

MISO Master Input Slave Output

MOSI Master Output Slave Input

NDEF NFC Data Exchange Format

NFC Near Field Communication

NVIC Nested Vectored Interrupt Controller

PMU Power Management Unit

POR Power-On Reset

PWM Pulse Width Modulation

RFID Radio Frequency Identification

RISC Reduced Instruction Set Computer

RTC Real-Time Clock

SFRO System Free-Running Oscillator

SI Slave Input

SO Slave Output

SPI Serial Peripheral Interface

SR Status Register

SSI Synchronous Serial Interface

SSP Synchronous Serial Port

SWD Serial Wire Debug

TFRO Timer Free-Running Oscillator

WDT WatchDog Timer

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Product data sheet Rev. 6.03 — 15 June 2018

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14 References

1DDI0484C_cortex_m0p_r0p1_trm Cortex-M0+ Devices - Technical Reference Manual

2DUI0662B_cortex_m0p_r0p1_dgug Cortex-M0+ Devices - Generic User Guide

3UM10204 user manual I2C-bus specification and user manual; 2014, NXP

Semiconductors

15 Revision history

Table 25. Revision history

Document ID Release date Data sheet status Change notice Supersedes

NHS3100 v.6 <Tbd> Product data sheet - NHS3100 v.5

Modifications: •NFC certification and logo have been added.

•Text has been updated throughout the document.

NHS3100 v.5 20161205 Product data sheet - NHS3100 v.4

Modifications •Addition of NHS3100W8 package data

NHS3100 v.4 20160905 Product data sheet - NHS3100 v.3

Modifications •General update

•Static characteristics updated

•Drawing revisions

NHS3100 v.3 20160601 Preliminary data sheet - NHS3100 v.2

Modifications •General update

NHS3100 v.2 20160531 Objective data sheet - NHS3100 v.1

Modifications •Section 7.1 "Pinning" updated

•Section 8.4 "Power Management Unit (PMU)" major revision

•Section 11.2 "I2C-bus" updated

•Section 11.3 "SPI interfaces" added

•WLCSP25 package added

•Cautions added

•Table 15 "Static characteristics" updated

•Section 8.7 "Fast General-Purpose parallel I/O" added

NHS3100 v.1 20150811 Objective data sheet - -

NXP Semiconductors NHS3100

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Product data sheet Rev. 6.03 — 15 June 2018

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16 Legal information

16.1 Data sheet status

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product

development.

Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple

devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

16.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences

of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is

intended for quick reference only and should not be relied upon to contain

detailed and full information. For detailed and full information see the

relevant full data sheet, which is available on request via the local NXP

Semiconductors sales office. In case of any inconsistency or conflict with the

short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product

is deemed to offer functions and qualities beyond those described in the

Product data sheet.

16.3 Disclaimers

Limited warranty and liability — Information in this document is believed

to be accurate and reliable. However, NXP Semiconductors does not

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accuracy or completeness of such information and shall have no liability

for the consequences of use of such information. NXP Semiconductors

takes no responsibility for the content in this document if provided by an

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Semiconductors be liable for any indirect, incidental, punitive, special or

consequential damages (including - without limitation - lost profits, lost

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of any products or rework charges) whether or not such damages are based

on tort (including negligence), warranty, breach of contract or any other

legal theory. Notwithstanding any damages that customer might incur for

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liability towards customer for the products described herein shall be limited

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Right to make changes — NXP Semiconductors reserves the right to

make changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

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authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

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Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes

no representation or warranty that such applications will be suitable

for the specified use without further testing or modification. Customers

are responsible for the design and operation of their applications and

products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

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Semiconductors product is suitable and fit for the customer’s applications

and products planned, as well as for the planned application and use of

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their applications and products. NXP Semiconductors does not accept any

liability related to any default, damage, costs or problem which is based

on any weakness or default in the customer’s applications or products, or

the application or use by customer’s third party customer(s). Customer is

responsible for doing all necessary testing for the customer’s applications

and products using NXP Semiconductors products in order to avoid a

default of the applications and the products or of the application or use by

customer’s third party customer(s). NXP does not accept any liability in this

respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or

the grant, conveyance or implication of any license under any copyrights,

patents or other industrial or intellectual property rights.

NXP Semiconductors NHS3100

Temperature logger

Product data sheet Rev. 6.03 — 15 June 2018

44 / 45

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor

tested in accordance with automotive testing or application requirements.

NXP Semiconductors accepts no liability for inclusion and/or use of non-

automotive qualified products in automotive equipment or applications. In

the event that customer uses the product for design-in and use in automotive

applications to automotive specifications and standards, customer (a) shall

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such automotive applications, use and specifications, and (b) whenever

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of the product for automotive applications beyond NXP Semiconductors’

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Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

16.4 Licenses

Purchase of NXP ICs with NFC technology

Purchase of an NXP Semiconductors IC that complies with one of the

Near Field Communication (NFC) standards ISO/IEC 18092 and ISO/

IEC 21481 does not convey an implied license under any patent right

infringed by implementation of any of those standards. Purchase of NXP

Semiconductors IC does not include a license to any NXP patent (or other

IP right) covering combinations of those products with other products,

whether hardware or software.

16.5 Trademarks

Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

MIFARE — is a trademark of NXP B.V.

NXP Semiconductors NHS3100

Temperature logger

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 15 June 2018

Document identifier: NHS3100

Contents

1 General description ............................................ 1

2 Features and benefits .........................................2

2.1 System ...............................................................2

2.2 Memory ..............................................................2

2.3 Digital peripherals .............................................. 2

2.4 Analog peripherals .............................................2

2.5 Communication interfaces ................................. 2

2.6 Clock generation ................................................2

2.7 Power control .....................................................3

2.8 General .............................................................. 3

3 Applications .........................................................3

4 Ordering information .......................................... 3

5 Marking .................................................................3

6 Block diagram ..................................................... 4

7 Pinning information ............................................ 5

7.1 Pinning ...............................................................5

7.1.1 HVQFN24 package ............................................5

7.1.2 WLCSP25 package ........................................... 7

7.1.3 NHS3100W8 gold bump version ....................... 9

8 Functional description ......................................11

8.1 ARM Cortex-M0+ core .....................................11

8.2 Memory map ....................................................11

8.3 System configuration ....................................... 12

8.3.1 Clock generation ..............................................12

8.3.2 Reset ................................................................13

8.4 Power management .........................................14

8.4.1 System power architecture .............................. 14

8.4.2 Power Management Unit (PMU) ......................17

8.5 Nested Vectored Interrupt Controller (NVIC) ....17

8.5.1 Features ...........................................................17

8.5.2 Interrupt sources ..............................................18

8.6 I/O configuration .............................................. 18

8.6.1 PIO0 pin mode ................................................ 19

8.6.2 PIO0 I2C-bus mode .........................................20

8.6.3 PIO0 current source mode .............................. 20

8.7 Fast general-purpose parallel I/O .................... 20

8.7.1 Features ...........................................................21

8.8 I2C-bus controller ............................................ 21

8.8.1 Features ...........................................................21

8.8.2 General description ..........................................22

8.8.3 I2C-bus pin description ....................................22

8.9 SPI controller ................................................... 22

8.9.1 Features ...........................................................22

8.9.2 General description ..........................................23

8.9.3 Pin description ................................................. 23

8.9.3.1 Pin detailed description ................................... 23

8.10 RFID/NFC communication unit ........................ 24

8.10.1 Features ...........................................................24

8.10.2 General description ..........................................24

8.11 16-bit timer .......................................................25

8.11.1 Features ...........................................................25

8.11.2 General description ..........................................25

8.12 32-bit timer .......................................................26

8.12.1 Features ...........................................................26

8.12.2 General description ..........................................26

8.13 WatchDog Timer (WDT) .................................. 27

8.13.1 Features ...........................................................27

8.13.2 General description ..........................................27

8.14 System tick timer ............................................. 27

8.14.1 Features ...........................................................27

8.14.2 General description ..........................................27

8.15 Real-Time Clock (RTC) timer .......................... 28

8.15.1 Features ...........................................................28

8.15.2 General description ..........................................28

8.16 Temperature sensor ........................................ 28

8.16.1 Features ...........................................................28

8.16.2 General description ..........................................28

8.17 Serial Wire Debug (SWD) ............................... 29

8.18 On-chip flash memory ..................................... 29

8.18.1 Reading from flash .......................................... 29

8.18.2 Writing to flash .................................................29

8.18.3 Erasing/programming flash ..............................30

8.19 On-chip SRAM .................................................30

8.20 On-chip EEPROM ............................................30

8.20.1 Reading from EEPROM .................................. 30

8.20.2 Writing to EEPROM .........................................30

9 Limiting values ..................................................31

10 Static characteristics ........................................ 32

11 Dynamic characteristics ...................................35

11.1 I/O pins ............................................................ 35

11.2 I2C-bus ............................................................ 35

11.3 SPI interfaces .................................................. 36

12 Package outline .................................................38

13 Abbreviations .................................................... 41

14 References ......................................................... 42

15 Revision history ................................................ 42

16 Legal information .............................................. 43