Features
•T-1 (3 mm) auto insertable package
•AlInGaP SunPower intensity
•High light output
•Tinted diffused and tinted non-diffused lens options
•Wide viewing angle
•Variety of colors
•Available with straight or formed lead tape and reel
options
Applications
•General purpose
•High volume manufacturing
Description
This family of 3 mm LED Lamps is capable of
withstanding automatic insertion and wave soldering
processes.
Designed with a thick epoxy flange and soft leadframe
material, it is ideal for clinch and cut operations.
HLMP-N305, HLMP-N405, HLMP-NG0x,
HLMP-NL06, HLMP-NH04
Device Selection Guides
High Brightness Lamps Package Luminous Intensity, Viewing Angle, Package
Color Part Number Tinted Diffused Min. Iv @ 20 mA 2θθ
θθ
θ1/2Outline
Red HLMP-NG05 µ90.2 45 A
HLMP-NG07 µ90.2 60 B
Amber HLMP-NL06 µ96.2 60 B
Red Orange HLMP-NH04 90.2 60 B
High Efficiency Lamps Package Luminous Intensity, Viewing Angle, Package
Color Part Number Tinted Diffused Min. Iv @ 10 mA 2θθ
θθ
θ1/2Outline
GaP Yellow HLMP-N305 X 14.7 45 A
GaP Orange HLMP-N405 X 13.8 45 A
Note:
1. 2θ1/2 is the off axis angle where the luminous intensity is 1/2 the on axis intensity.
HLMP-Nxxx
T-1 (3 mm) Aut o Insertable LED Lamps
Data Sheet
2
Package Dimensions
Package Outline “A”
Package Outline “B”
2.0 (0.08) REF.
0.4 ± 0.2
(0.01 ± 0.01)
2.5 ± 0.3
(0.10 ± 0.01)
0.45 ± 0.10
(0.02 ± 0.007)
0.4 ± 0.2
(0.02 ± 0.01)
0.4 + 0.1
0
(0.2 + 0.00
- 0.00)
3.4 ± 0.2
(0.13 ± 0.01)
CATHODE MARKS
0.65 (0.03) MAX.
3.1 ± 0.2
(0.12 ± 0.01)
4.4 ± 0.3
(0.17 ± 0.01)
3.5 ± 0.3
(0.14 ± 0.01)
5.9 ± 0.5
(0.23 ± 0.02) 23.0
(0.91) 1.0 ± 0.5
(0.04 ± 0.02)
SEATING PLANE
2.0
0.8 MAX. EPOXY MENISCUS
2.54 ± 0.3
0.44 ± 0.2
0.4 + 0.1
– 0
3.60
CATHODE FLAT
0.65 MAX.
3.10 ± 0.203.80 ± 0.30
3.50 ± 0.30
CATHODE LEAD
5.70 ± 0.5 23.0 MIN. 1.0 MIN.
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. LEADS ARE MILD STEEL. SOLDER COATED.
3. EPOXY MENISCUS OF 0.8 mm (0.03 in.) MAXIMUM
MAY EXTEND TO THE LEADS.
3
Absolute Maximum Ratings at TA = 25 ºC
AlIºnGaP
Parameter Orange Yellow Red Orange, Amber & Red Units
DC Forward Current[1] 30 20 30[2,3] mA
Reverse Voltage (Ir = 100 µA) 5 V
Junction Temperature, Tjmax 110 °C
Storage Temperature Range -40 to +85 °C
Operating Temperature Range -20 to +85 -40 to +85 °C
Notes:
1. See Figure 4 for maximum current derating vs. ambient temperature.
2. Suggested minimum DC current: 10 mA.
3. Maximum Peak Pulsed Forward Current: 50 mA, 30 mA average.
Part Numbering System
HLMP - N x xx # xxx
Mechanical Option
002: Tape & Reel, Straight Leads
Viewing Angle Options
01: 45 Degree
05: 45 Degree
04, 06, 07: 60 Degree
Color Options
3: GaP Yellow
4: GaP Orange
G: AlInGaP Red
L: AlInGaP Amber
H: AlInGaP Red Orange
4
Electrical Characteristics at TA = 25ºC
Capacitance Speed of Response
C (pF) ττ
ττ
τs (ns)
Vf = 0, Thermal Time Constant
Forward Voltage Vf (Volts) f = 1 MHz Resistance Rθθ
θθ
θJ-PIN e-t/ττ
ττ
τs
Part Number Typ. Max. If (mA) Typ. (°C/W) Typ.
HLMP-N30x 2.00 2.6 10 15 290 90
HLMP-N40x 1.90 2.6 10 4 290 280
HLMP-NLO6[1] 2.02 2.4 20 40 240 20
HLMP-NG0x[1] 1.90 2.4 20 40 240 20
HLMP-NH04 1.94 2.4 20 40 250 20
Note:
1. Please contact your Avago Sales Representative about operating currents below 10 mA.
Optical Characteristics at TA = 25 ºC Luminous
Typ. Dominant Efficacy
Luminous Intensity Typ. Peak Wavelength Typ. Spectral Width
Part Number Min. If (mA) Wavelength (nm) (nm) Half Width (lm/W)
HLMP-NG05 90.2 20 635 626 17 150
HLMP-NG07 90.2 20 635 626 17 150
HLMP-NL06 96.2 20 592 590 17 480
HLMP-N305 14.7 10 583 585 36 500
HLMP-N405 13.8 10 600 602 37 380
HLMP-NH04 90.2 20 621 615 17 235
Notes:
1. The luminous intensity, lv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned
with this axis.
2. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the color of the device.
3. The radiant intensity, le, in watts per steradian, may be found from the equation le = lv/hv, where lv is the luminous intensity in candelas and hv is the
luminous efficacy in lumens/watt.
5
Figure 1. Relative intensity vs. peak wavelength.
Figure 2. Forward current vs. forward voltage.
RED-ORANGE
AlInGaP RED
WAVELENGTH – nm
RELATIVE INTENSITY
1.0
0.5
0
550 600 650 700
AMBER
HIGH BRIGHTNESS LAMPS
DH AlGaAs RED
ORANGE
WAVELENGTH – nm
RELATIVE INTENSITY
1.0
0.5
0
500 550 600 650 700
YELLOW
HIGH EFFICIENCY LAMPS
0
90
70
60
40
20
IF – FORWARD CURRENT – mA
1.5 3.52.50.5
VF – FORWARD VOLTAGE – V
0 4.0
YELLOW
HIGH EFFICIENCY LAMPS
ORANGE
1.0 2.0 3.0
10
30
50
80
0
70
60
40
20
I
F
– FORWARD CURRENT – mA
V
F
– FORWARD VOLTAGE – V
1.0 3.0
AMBER
HIGH BRIGHTNESS LAMPS
DH AsAlGaAs
RED
1.5 2.0 2.5
10
30
50
AlInGaP
RED/RED-
ORANGE
6
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
0
IF – DC FORWARD CURRENT – mA
10 20
1.0
0.5
30
1.5
HIGH BRIGHTNESS LAMPS
40
AlInGaP
DH As AlGaAs
2.0
Figure 4. Maximum forward DC current vs. ambient temperature.
Figure 3. Relative luminous intensity vs. forward current.
I
F
– FORWARD CURRENT – mA
0
0
T
A
– AMBIENT TEMPERATURE – °C
40 80
40
20
10
20 60
30
5
15
25
35
AlInGaP
Rθ
JA
= 500° C/W
Rθ
JA
= 650° C/W
Rθ
JA
= 750° C/W
10 30 50 70 90
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 10 mA)
0
0
IDC – DC CURRENT PER LED – mA
10 20
4.0
2.0
1.0
515 30
3.0
25
0.5
1.5
2.5
3.5
ORANGE,AND YELLOW
IF – FORWARD CURRENT – mA
0
0
TA – AMBIENT TEMPERATURE – °C
40 80
40
20
10
60
30
5
15
25
35
ORANGE AND YELLOW
RθJA = 470° C/W
RθJA = 705° C/W
RθJA = 300° C/W
YELLOW
ORANGE
20
7
NORMALIZED INTENSITY
1
0
ANGULAR DISPLACEMENT – DEGREES
0.8
0.6
0.5
0.7
0.2
-90
0.1
0.3
0.4
-80 -70 -60 -50 -40 -20 -10 0-30 10 20 30 40 50 60 70 80 90
0.9
Figure 5. Representative spatial radiation pattern for 45° viewing angle.
NORMALIZED INTENSITY
1
0
ANGULAR DISPLACEMENT – DEGREES
0.8
0.6
0.5
0.7
0.2
-90
0.1
0.3
0.4
-80 -70 -60 -50 -40 -20 -10 0-30 10 20 30 40 50 60 70 80 90
0.9
Figure 6. Representative spatial radiation pattern for 60° viewing angle.
8
Intensity Bin Limits Intensity Range (mcd)
Color Bin Min. Max.
H13.8 27.6
I22.0 44.0
J35.2 70.4
K56.4 112.8
L90.2 180.4
M138.0 276.0
N200.0 400.0
O290.0 580.0
Red/Orange P 500.0 1000.0
/Red-Orange Q700.0 1400.0
R1000.0 2000.0
S1400.0 2800.0
T2000.0 4000.0
U2900.0 5800.0
V4200.0 8400.0
W6000.0 12000.0
X8700.0 17400.0
Y12600.0 25200.0
Z18200.0 36400.0
G14.7 29.4
H23.5 47.0
I37.6 75.2
J60.1 120.2
K96.2 192.4
L147.0 294.0
M212.0 424.0
Yellow/Amber N 300.0 600.0
O450.0 900.0
P700.0 1400.0
Q1000.0 2000.0
R1600.0 3200.0
S2600.0 5200.0
T4000.0 8000.0
U6500.0 13000.0
V10000.0 20000.0
W16000.0 30000.0
Maximum tolerance for each bin limit is ±18%.
Amber Color Bin Limits
(nm at 20 mA)
Bin Name Min. Max.
1584.5 587.0
2587.0 589.5
4589.5 592.0
6592.0 594.5
Tolerance for each bin limit is ±0.5 nm.
9
Color Categories Lambda (nm)
Color Category # Min. Max.
1582.0 584.5
3584.5 587.0
Yellow 2 587.0 589.5
4589.5 592.0
5592.0 593.0
1597.0 599.5
2599.5 602.0
3602.0 604.5
Orange 4 604.5 607.5
5607.5 610.5
6610.5 613.5
7613.5 616.5
8616.5 619.5
Tolerance for each bin limit is ±0.5 nm.
Taping Options
Straight Lead
Option #002 #2CA #2CD
Dimension “B” – – –
Dimension “H” 20.5 ± 1.0 18.0 ± 1.0 20.5 ± 1.0
(0.81 ± 0.04) (0.71 ± 0.04) (0.81 ± 0.04)
Formed Lead
Option #2UK #2UL #2UM #2UN #2UP #2UQ #2UR
Dimension “B” 12.0 ± 1.0 9.0 ± 1.0 10.0 ± 1.0 11.0 ± 1.0 13.0 ± 1.0 14.0 ± 1.0 15.0 ± 1.0
(0.47 ± 0.04) (0.35 ± 0.04) (0.39 ± 0.04) (0.43 ± 0.04) (0.51 ± 0.04) (0.55 ± 0.04) (0.59 ± 0.04)
Dimension “H” 16.0 ± 1.0
(0.63 ± 0.04)
Units: mm (inches)
10
STRAIGHT LEAD
FORMED LEAD
1.5 (0.06) MAX.
2.5 (0.10) MAX.
14.0 ± 1.7
(0.55 ± 0.07)
18.0 ± 1.0
(0.71 ± 0.04)
6.4 ± 1.3
(0.25 ± 0.05) 12.7 ± 1.0
(0.50 ± 0.04)
9.1 ± 0.6
(0.36 ± 0.03)
0.0 ± 1.0
(0.00 ± 0.04) 0.0 ± 1.0
(0.00 ± 0.04)
11.0
(0.43)MAX.
DIMENSION "H"
(SEE TABLE)
5.1 ± 0.7
(0.20 ± 0.03)
12.7 ± 0.3
(0.50 ± 0.01)
2.5 ± 0.3
(0.10 ± 0.01)
CATHODE
LEAD
0.7 ± 0.2
(0.03 ± 0.01)
AA
VIEW A–A
∅4.0 ± 0.2
(0.16 ± 0.01)TYP.
1.5 (0.06) MAX.
2.5 (0.10) MAX.
14.0 ± 1.7
(0.55 ± 0.07)
18.0 ± 1.0
(0.71 ± 0.04)
6.4 ± 1.3
(0.25 ± 0.05) 12.7 ± 1.0
(0.50 ± 0.04)
9.1 ± 0.6
(0.36 ± 0.03)
0.0 ± 1.0
(0.00 ± 0.04) 0.0 ± 1.0
(0.00 ± 0.04)
11.0
(0.43)MAX.
DIMENSION "H"
(SEE TABLE)
3.9 ± 0.7
(0.15 ± 0.03)
12.7 ± 0.3
(0.50 ± 0.01)
2.5 ± 0.3
(0.10 ± 0.01)
CATHODE
LEAD
0.7 ± 0.2
(0.03 ± 0.01)
AA
VIEW A–A
∅4.0 ± 0.2
(0.16 ± 0.01)TYP.
DIMENSION "B"
(SEE TABLE)
Tape Outline Drawing
11
Recommended Assembly Condition
• A single-sided phenolic
printed circuit board (PCB) is
preferred. Double-sided PCB
and other materials may cause
greater lead stress.
Recommended through-hole
diameter is 0.93 to 1.03 mm.
Leadlength below the PCB
should be 1.5 to 2.0 mm, and
the clinching angle (angle
between the lead and PCB)
should be 30 ±10 degrees.
• If SMT devices and an
adhesive are used on the same
pcb as these lamps, the
adhesive should be cured
before the lamps are auto-
inserted. If curing must
be done after lamp insertion,
the cure temperature and time
should not exceed 140°C,
100 seconds. This is the
temperature of the surface
normal to the IR source.
TAPE & REEL (for option #002 only)
AMMO PACK (for All options except #002)
Package Options
Lead Option Ammo Pack (1000 pcs.) Tape & Reel (2000 pcs.)
Straight Lead #2C —#002
Formed Lead #2U —–
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE IS FACING
UPWARD.
MADE IN MALAYSIA
ANODE
LEDS
OPERATOR .........
HP PART # ...........
DATE CODE ........
TAPING DATE .....
BIN .......................
NO. OF GAPS .....
QUANTITY ..........
CATHODE
C
A
+
–
ANODE LEAD LEAVES
THE BOX FIRST.
336 (13.23)
52 (2.05)
140 (5.51)
DIMENSIONS IN MILLIMETERS (INCHES).
REELING ORIENTATION
CLOCKWISE
ADHESIVE TAPE MUST BE
FACING TOWARDS THE
OUTSIDE OF THE REEL.
ANODE LEAD LEAVES
THE REEL FIRST.
PROTECTIVE
CARDBOARD
110 (4.33) DIA.
336 (13.23) DIA.
DIMENSIONS IN MILLIMETERS (INCHES).
Precautions
Lead Forming
•The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
•If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
•It is recommended that tooling made to precisely
form and cut the leads to length rather than rely upon
hand operation.
Soldering Conditions
•Care must be taken during PCB assembly and
soldering process to prevent damage to LED
component.
•The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
•Recommended soldering conditions:
•Wave soldering parameter must be set and
maintained according to recommended temperature
and dwell time in the solder wave. Customer is
advised to periodically check on the soldering profile
to ensure the soldering profile used is always
conforming to recommended soldering condition.
•If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
•Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
•Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
•Recommended PC board plated through hole sizes for
LED component leads:
Manual Solder
Wave Soldering Dipping
Pre-heat Temperature 105 °C Max. –
Pre-heat Time 30 sec Max. –
Peak Temperature 250 °C Max. 260 °C Max.
Dwell Time 3 sec Max. 5 sec Max.
LED Component Plated Through
Lead Size Diagonal Hole Diameter
0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm
(0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch)
0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more
information on soldering LED components.
Figure 7. Recommended wave soldering profile.
LAMINAR W A VE BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT W A VE
FLUXING
PREHEAT
01020
30
50
100
150
200
250
30 40 50
TIME – SECONDS
TEMPERATURE – °C
60 70 80 90 100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
12
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4093EN
5989-4257EN May 21, 2006
