Voltage: 250 Volts
Current: 0.2Amp
BAS21
Feature
High Voltage Switching Diode
Surface Mount Package Ideally Suited for
Automatic Insertion
For General Purpose Switching
Applications
Surface Mount Switching Diode
www.comchip.com.tw
COMCHIP
Rating Symbol Value Units
Continuous Reverse Voltage V
R
250 V
DC
Peak Forward Current I
F
200.0 mAdc
Peak Surge Forward Current I
FSM
(surge) 625 mAdc
Characteristic Symbol Max Units
Total Device Dissipation FR– 5 Board(1) T
A
= 25°C 225.0 mW
Derate above 25°C 1.8 mW/°C
Thermal Resistance, Junction to Ambient R
JA
556.0 °C/W
Total Device Dissipation Alumina Substrate,(2) T
A
= 25°C 300 mW
Derate above 25°C 2.4 mW/°C
Thermal Resistance, Junction to Ambient R
JA
417 °C/W
Junction and Storage Temperature T
J
,T
stg
–55 to +150 °C
Characteristic Symbol Min Max Units
Reverse Voltage Leakage Current V
R
= 200 Vdc -1.0
V
R
= 200 Vdc, TJ = 150°C -100
Reverse Breakdown Voltage (BR = 100 Adc) V(BR) 250 - Vdc
Forward Voltage F = 100 mAdc 1000
F = 200 mAdc 1250
Diode Capacitance (V
R
= 0, f = 1.0 MHz)) C
D
5pF
Reverse Recovery Time (I
F
= IR = 30 mAdc, RL = 100 ) Trr 50 nS
mV
1.FR–5 = 1.0 X 0.75X 0.062 in. 2.Alumina = 0.4X 0.3X 0.024 in. 99.5% alumina.
P
D
Electrical Characterics
(TA = 25°C unless otherwise noted)
I
R
VF
Maximum Ratings
Thermal Characteristics
P
D
uAdc
Dimensions in inches (millimeters)
Mechanical Data
Case: SOT -23, Plastic
Terminals : Solderable per NIL-STD -202,
Method 208
Approx. Weight: 0.008 gram
MDS0209006A
.037(0.95).037(0.95)
.006(0.15)max.
.119 (3.0)
.020 (0.5).020 (0.5)
Top View
.103(2.6)
.006(0.15)
.044(1.10)
.110 (2.8)
.047 (1.20
)
.002(0.05)
.086 (2.2)
.035(0.90)
.020 (0.5)
.056 (1.40)