TDA2030 14 W hi-fi audio amplifier Features Wide-range supply voltage, up to 36 V Single or split power supply Short-circuit protection to ground Thermal shutdown Description Pentawatt (horizontal) The TDA2030 is a monolithic integrated circuit in the Pentawatt(R) package, intended for use as a low frequency class-AB amplifier. Typically it provides 14 W output power (d = 0.5%) at 14 V/4 . At 14 V or 28 V, the guaranteed output power is 12 W on a 4 load and 8 W on an 8 (DIN45500). Table 1. Device summary Order code Package TDA2030H Pentawatt horizontal The TDA2030 provides high output current and has very low harmonic and crossover distortion. Furthermore, the device incorporates an original (and patented) short-circuit protection system comprising an arrangement for automatically limiting the dissipated power so as to keep the operating point of the output transistors within their safe operating range. A conventional thermal shutdown system is also included. Figure 1. June 2011 Ex: Functional block diagram Doc ID 1458 Rev 3 1/17 www.st.com 17 Device overview 1 2/17 TDA2030 Device overview Figure 2. Pin connections (top view) Figure 3. Test circuit Doc ID 1458 Rev 3 TDA2030 Electrical specifications 2 Electrical specifications 2.1 Absolute maximum ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit 18 (36) V Vs Supply voltage Vi Input voltage Vs Vi Differential input voltage 15 V Io Output peak current internally limited) 3.5 A Ptot Power dissipation at Tcase = 90 C 20 W Tstg, Tj Storage and junction temperature -40 to 150 C 2.2 Thermal data Table 3. Thermal data Symbol Rth j-case 2.3 Parameter Thermal resistance junction-case Value Unit max 3 C Electrical characteristics Refer to the test circuit in Figure 3; VS = 14 V, Tamb = 25C unless otherwise specified. Table 4. Electrical characteristics Symbol Parameter Test conditions Min. Typ. 6 12 Max. Unit 18 36 V Vs Supply voltage Id Quiescent drain current 40 60 mA Ib Input bias current 0.2 2 A 2 20 mV 20 200 nA VOS IOS Po Input offset voltage Input offset current Vs = 18 (Vs = 36) Output power d = 0.5%, f = 40 to 15,000 Hz; GV = 30 dB RL = 4 RL = 8 12 8 14 9 W W d = 10%, f =1 kHz; GV = 30 dB RL = 4 RL = 8 12 8 14 9 W W Doc ID 1458 Rev 3 3/17 Electrical specifications Table 4. Electrical characteristics (continued) Symbol d TDA2030 Parameter Distortion B Frequency response (-3 dB) Ri Input resistance (pin 1) Gv Voltage gain (open loop) Gv Voltage gain (closed loop) eN Input noise voltage iN Input noise current Test conditions Typ. Max. Unit Po = 0.1 to 12 W, RL = 4 , GV = 30 dB f = 40 to 15.000 Hz 0.2 0.5 % Po = 0.1 to 8 W, RL = 8 , GV = 30 dB f = 40 to 15.000 Hz 0.1 0.5 % Po = 12 W, RL = 4 ; GV = 30 dB 0.5 f = 1 kHz GV = 30 dB; RL = 4 , Rg = 22 k, fripple = 100 Hz; Vripple = 0.5 Veff Id Drain current Po = 14 W, RL = 4 Po = 9 W, RL = 8 Tj Thermal shutdown junction temperature 4/17 29.5 10 Hz to 140 Hz 5 M 90 dB 30 30.5 dB 3 10 V 80 200 pA B = 22 Hz to 22 kHz Supply voltage rejection SVR Min. 40 50 dB 900 500 mA 145 Doc ID 1458 Rev 3 C TDA2030 Electrical specifications 2.4 Characterizations Figure 4. Output power vs. supply voltage Figure 5. Output power vs. supply voltage Figure 6. Distortion vs. output power Figure 7. Distortion vs. output power Doc ID 1458 Rev 3 5/17 Electrical specifications Figure 8. Distortion vs. output power Figure 10. Distortion vs. frequency 6/17 TDA2030 Figure 9. Distortion vs. frequency Figure 11. Frequency response with different values of the rolloff capacitor C8 (see typical amplifier with split power supply) Doc ID 1458 Rev 3 TDA2030 Electrical specifications Figure 12. Quiescent current vs. supply voltage Figure 13. Supply voltage rejection vs. voltage gain Figure 14. Power dissipation and efficiency vs. output power Figure 15. Maximum power dissipation vs. supply voltage (sine wave operation) Doc ID 1458 Rev 3 7/17 Applications 3 TDA2030 Applications Figure 16. Typical amplifier with split power supply Figure 17. Typical amplifier with single power supply Figure 18. PC board and component layout for Figure 19. PC board and component layout for a typical amplifier with split power a typical amplifier with single power supply supply 8/17 Doc ID 1458 Rev 3 TDA2030 Applications Figure 20. Bridge amplifier configuration with split power supply (Po = 28 W, Vs = 14 V) Doc ID 1458 Rev 3 9/17 Practical considerations TDA2030 4 Practical considerations 4.1 Printed circuit board The layout shown in Figure 19 should be adopted by the designers. If different layouts are used, the ground points of input 1 and input 2 must be well decoupled from the ground return of the output in which a high current flows. 4.2 Assembly suggestion No electrical isolation is needed between the package and the heatsink with single supply voltage configuration. 4.3 Application suggestions The recommended values of the components are those shown on application circuit of Figure 16. However, if different values are chosen, then the following table can be helpful. Table 5. Variations from recommended values Component 1. Recommanded Purpose value Smaller than recommanded value R1 22 k Closed loop gain setting Increase of gain Decrease in gain(1) R2 680 Closed loop gain setting Decrease of gain(1) Increase in gain R3 22 k Non-inverting input biasing Increase of input impedance Decrease in input impedance R4 1 Frequency stability Danger of oscillation at high frequencies with inductive loads R5 3 R2 Upper frequency cutoff Poor high-frequency attenuation C1 1 F Input DC decoupling Increase in lowfrequency cutoff C2 22 F Inverting input DC decoupling Increase in lowfrequency cutoff C3C4 0.1 F Supply voltage bypass Danger of oscillation C5C6 100 F Supply voltage bypass Danger of oscillation C7 0.22 F Frequency stability Danger of oscillation C8 1 -----------------2BR 1 D1D2 1N4001 Upper frequency cutoff Smaller bandwidth To protect the device against output voltage spikes Closed loop gain must be higher than 24 dB 10/17 Larger than recommanded value Doc ID 1458 Rev 3 Danger of oscillation Larger bandwidth TDA2030 Table 6. Practical considerations Single supply application Component Recommanded Purpose value Larger than Smaller than recommanded value recommanded value R1 150 k Closed loop gain setting Increase in gain Decrease in gain(1) R2 4.7 k Closed loop gain setting Decrease in gain(1) Increase in gain R3 100 k Non-inverting input biasing Increase of input impedance Decrease in input Impedance R4 1 Frequency stability Danger of oscillation at high frequencies with inductive loads RA/RB 100 k Non-inverting input biasing Poor high-frequency attenuation C1 1 F Input DC decoupling Increase in lowfrequency cutoff C2 22 F Inverting DC decoupling Increase in lowfrequency cutoff C3 0.1 F Supply voltage bypass Danger of oscillation C5 100 F Supply voltage bypass Danger of oscillation C7 0.22 F Frequency stability Danger of oscillation C8 1 -----------------2BR 1 Upper frequency cutoff D1D2 1N4001 To protect the device against output voltage spikes. Smaller bandwidth Danger of oscillation Larger bandwidth 1. Closed loop gain must be higher than 24 dB Doc ID 1458 Rev 3 11/17 Short-circuit protection 5 TDA2030 Short-circuit protection The TDA2030 has an original circuit which limits the current of the output transistors. Figure 21 shows that the maximum output current is a function of the collector emitter voltage; hence the output transistors work within their safe operating area (Figure 5). This function can therefore be considered as being peak power limiting rather than simple current limiting. It reduces the possibility that the device gets damaged during an accidental short-circuit from AC output to ground. Figure 21. Maximum output current vs. Figure 22. Safe operating area and collector voltage [VCEsat] across each output characteristics of the protected transistor power transistor 12/17 Doc ID 1458 Rev 3 TDA2030 6 Thermal shutdown Thermal shutdown The presence of a thermal limiting circuit offers the following advantages: 1. An overload on the output (even if it is permanent), or an above limit ambient temperature can be easily supported since Tj cannot be higher than 150C. 2. The heatsink can have a smaller factor of safety compared with that of a conventional circuit. There is no possibility of device damage due to high junction temperature. If for any reason, the junction temperature increases to 150C, the thermal shutdown simply reduces the power dissipation at the current consumption. The maximum allowable power dissipation depends upon the size of the external heatsink (i.e. its thermal resistance); Figure 25 shows this power dissipation as a function of ambient temperature for different thermal resistances. Figure 23. Output power and drain current vs. Figure 24. Output power and drain current vs. case temperature (RL = 4 ) case temperature (RL = 8 ) Doc ID 1458 Rev 3 13/17 Thermal shutdown TDA2030 Figure 26. Example of heatsink Figure 25. Maximum allowable power dissipation vs. ambient temperature The following table shows the length that the heatsink in Figure 26 must have for several values of Ptot and Rth. Table 7. Recommended values of heatsink Dimension 14/17 Recommended values Unit Ptot 12 8 6 W Length of heatsink 60 40 30 mm Rth of heatsink 4.2 6.2 8.3 C/W Doc ID 1458 Rev 3 TDA2030 7 Package mechanical data Package mechanical data Figure 27. Pentawatt (horizontal) package outline and dimensions DIM. mm MIN. inch TYP. MAX. A MIN. TYP. 4.80 C 0.188 1.37 0.054 D 2.40 2.80 0.094 0.11 D1 1.20 1.35 0.047 0.053 E 0.35 0.55 0.014 0.022 F 0.80 1.05 0.031 0.041 F1 1.00 1.40 0.039 0.055 G 3.20 3.40 3.60 0.126 0.134 0.142 G1 6.60 6.80 7.00 0.260 0.267 0.275 H2 10.40 H3 10.05 10.40 0.41 0.395 0.409 L 14.20 15.00 0.56 0.59 L1 5.70 6.20 0.224 0.244 L2 14.60 15.20 0.574 0.598 L3 3.50 4.10 0.137 L4 OUTLINE AND MECHANICAL DATA MAX. .161 1.29 0.05 L5 2.60 3.00 0.102 0.118 L6 15.10 15.80 0.594 0.622 L7 6.00 6.60 0.236 0.260 L9 2.10 2.70 0.083 0.106 L10 4.30 4.80 0.170 0.189 DIA 3.65 3.85 0.143 0.151 Pentawatt H L C D A D1 L1 E L3 F L2 L7 L5 L4 G G1 H2 H3 F1 Resin between leads Dia. L9 L6 L10 PENTHME.EPS 0015982 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Doc ID 1458 Rev 3 15/17 Revision history 8 TDA2030 Revision history Table 8. Document revision history Date Revision June 1998 2 Second issue 3 Added Features on page 1 Removed Pentawatt (vertical) package option Replaced Figure 27 with Pentawatt (horizontal) package data Updated presentation of document, minor textual changes 21-Jun-2011 16/17 Changes Doc ID 1458 Rev 3 TDA2030 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. 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