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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM7301
SNOS879I –AUGUST 1999–REVISED MAY 2016
LM7301 Low Power, 4-MHz GBW, Rail-to-Rail Input-Output Operational Amplifier in
SOT-23 Package
1
1 Features
1• At VS= 5 V (Typical Unless Otherwise Noted)
• Tiny, Space-Saving, 5-Pin SOT-23 Package
• Greater than Rail-to-Rail Input CMVR: −0.25 V to
5.2 V
• Rail-to-Rail Output Swing: 007 V to 4.93 V
• Wide Gain-Bandwidth: 4 MHz
• Low Supply Current: 0.6 mA
• Wide Supply Range: 1.8 V to 32 V
• High PSRR: 104 dB
• High CMRR: 93 dB
• Excellent Gain: 97 dB
2 Applications
• Portable Instrumentation
• Signal Conditioning Amplifiers/ADC Buffers
• Active Filters
• Modems
• PCMCIA Cards
3 Description
The LM7301 provides high performance in a wide
range of applications. The LM7301 offers greater than
rail-to-rail input range, full rail-to-rail output swing,
large capacitive load driving ability, and low distortion.
With only 0.6-mA supply current, the 4-MHz gain-
bandwidth of this device supports new portable
applications where higher power devices
unacceptably drain battery life.
The LM7301 can be driven by voltages that exceed
both power supply rails, thus eliminating concerns
over exceeding the common-mode voltage range.
The rail-to-rail output swing capability provides the
maximum possible dynamic range at the output. This
is particularly important when operating on low supply
voltages.
Operating on supplies of 1.8 V to 32 V, the LM7301 is
excellent for a very wide range of applications in low
power systems.
Placing the amplifier right at the signal source
reduces board size and simplifies signal routing. The
LM7301 fits easily on low profile PCMCIA cards.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM7301 SOIC (8) 4.90 mm × 3.91 mm
SOT-23 (5) 2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Gain and Phase Gain and Phase, 2.7-V Supply
2
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics: 5-V DC............................. 5
6.6 Electrical Characteristics: AC.................................... 6
6.7 Electrical Characteristics: 2.2-V DC.......................... 6
6.8 Electrical Characteristics: 30-V DC........................... 7
6.9 Typical Characteristics.............................................. 9
7 Detailed Description............................................ 12
7.1 Overview................................................................. 12
7.2 Feature Description................................................. 12
7.3 Device Functional Modes........................................ 14
8 Applications and Implementation ...................... 16
8.1 Application Information............................................ 16
8.2 Typical Applications ................................................ 16
9 Power Supply Recommendations...................... 19
10 Layout................................................................... 19
10.1 Layout Guidelines ................................................. 19
10.2 Layout Example .................................................... 19
11 Device and Documentation Support................. 20
11.1 Community Resource............................................ 20
11.2 Trademarks........................................................... 20
11.3 Electrostatic Discharge Caution............................ 20
11.4 Glossary................................................................ 20
12 Mechanical, Packaging, and Orderable
Information........................................................... 20
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision H (March 2013) to Revision I Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
• Changed 58°C to 42°C in Power Dissipation....................................................................................................................... 15
• Changed 113°C to 59°C in Power Dissipation..................................................................................................................... 15
• Changed 29°C to 21°C in Power Dissipation....................................................................................................................... 15
• Changed 57°C to 30°C in Power Dissipation....................................................................................................................... 15
Changes from Revision G (March 2013) to Revision H Page
• Changed layout of National Semiconductor Data Sheet to TI format .................................................................................. 16
3
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5 Pin Configuration and Functions
D Package
8-Pin SOIC
Top View DBV Package
5-Pin SOT-23
Top View
Pin Functions
PIN I/O DESCRIPTION
NAME SOIC SOT-23
–IN 2 4 I Inverting input voltage
+IN 3 3 I Noninverting input voltage
N/C 1, 5, 8 — — No connection
OUT 6 1 O Output
V– 4 2 I Negative supply
V+ 7 5 I Positive supply
4
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Applies to both single-supply and split-supply operation. Continuous short-circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(4) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(MAX) −TA)/RθJA. All numbers apply for packages soldered directly into a PC board.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Differential input voltage 15 V
Voltage at input and output pin (V+) + 0.3 (V–) – 0.3 V
Supply voltage (V+−V−) 35 V
Current at input pin ±10 mA
Current at output pin(3) ±20 mA
Current at power supply pin 25 mA
Junction temperature, TJ(4) 150 °C
Storage temperature, Tstg –65 150 °C
(1) JEDEC document JEP155 states that 2500-V HBM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(MAX) −TA)/RθJA. All numbers apply for packages soldered directly into a PC board.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN NOM MAX UNIT
Supply voltage 1.8 32 V
Operating temperature (2) –40 85 °C
Package thermal resistance (RθJA)(2) 5-pin SOT-23 325 325 °C/W
8-pin SOIC 165 165 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1) LM7301
UNITDBV (SOT-23) D (SOIC)
5 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 169 120 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 122 65 °C/W
RθJB Junction-to-board thermal resistance 30 61 °C/W
ψJT Junction-to-top characterization parameter 17 16 °C/W
ψJB Junction-to-board characterization parameter 29 60 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
5
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(1) All limits are ensured by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
(3) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the devices such that TJ= TA. No ensure of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where TJ> TA.
6.5 Electrical Characteristics: 5-V DC
Unless otherwise specified, all limits ensured for TA= 25°C, V+= 5V, V−= 0V, VCM = VO= V+/2 and RL> 1MΩto V+/2 unless
noted that limits apply at the temperature extremes.(1) (2)(3)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOS Input offset voltage TA= 25°C 0.03 6 mV
TA= TJ8
TCVOS Input offset voltage average
drift TA= TJ2μV/°C
IBInput bias current VCM = 0 V TA= 25°C 90 200
nA
TA= TJ250
VCM = 5 V TA= 25°C −40 −75
TA= TJ−85
IOS Input offset current VCM = 0 V TA= 25°C 0.7 70
nA
TA= TJ80
VCM = 5 V TA= 25°C 0.7 55
TA= TJ65
RIN Input resistance, CM 0 V ≤VCM ≤5 V 39 MΩ
CMRR Common mode rejection ratio 0 V ≤VCM ≤5 V TA= 25°C 70 88 dBTA= TJ67
0 V ≤VCM ≤3.5 V 93
PSRR Power supply rejection ratio 2.2 V ≤V+≤30 V TA= 25°C 87 104 dB
TA= TJ84
VCM Input common-mode voltage
range CMRR ≥65 dB 5.1 V
−0.1
AVLarge signal voltage gain RL= 10 kΩ
VO= 4 VPP
TA= 25°C 14 71 V/mV
TA= TJ10
VOOutput swing
RL= 10 kΩ
TA= 25°C 0.07 0.12
V
4.93
TA= TJ4.88 0.15
4.85
RL= 2 kΩ
TA= 25°C 0.14 0.2
0.22
TA= TJ4.80 4.87
4.78
ISC Output short-circuit current Sourcing TA= 25°C 8 11
mA
TA= TJ5.5
Sinking TA= 25°C 6 9.5
TA= TJ5
ISSupply current TA= 25°C 0.6 1.1 mA
TA= TJ1.24
6
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(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the devices such that TJ= TA. No ensure of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where TJ> TA.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
6.6 Electrical Characteristics: AC
TA= 25°C, V+= 2.2 V to 30 V, V−= 0 V, VCM = VO= V+/2 and RL> 1 MΩto V+/2(1)
PARAMETER TEST CONDITIONS TYP (2) UNIT
SR Slew rate ±4-V Step at VS±6 V 1.25 V/µs
GBW Gain-bandwidth product f = 100 kHz, RL= 10 kΩ4 MHz
enInput-referred voltage noise f = 1 kHz 36 nV/√Hz
inInput-referred current noise f = 1 kHz 0.24 pA/√Hz
T.H.D. Total harmonic distortion f = 10 kHz 0.006%
(1) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
(2) All limits are ensured by testing or statistical analysis.
6.7 Electrical Characteristics: 2.2-V DC
Unless otherwise specified, all limits ensured for TA= 25°C, V+= 2.2 V, V−= 0 V, VCM = VO= V+/2 and RL> 1 MΩto V+/2
unless noted that limits apply at the temperature. (1)(2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOS Input offset voltage TA= 25°C 0.04 6 mV
TA= TJ8
TCVOS Input offset voltage average
drift TA= TJ2 µV/°C
IBInput bias current VCM = 0 V TA= 25°C 89 200
nA
TA= TJ250
VCM = 2.2 V TA= 25°C −75 −35
TA= TJ−85
IOS Input offset current VCM = 0 V TA= 25°C 0.8 70
nA
TA= TJ80
VCM = 2.2 V TA= 25°C 0.4 55
TA= TJ65
RIN Input resistance 0 V ≤VCM ≤2.2 V 18 MΩ
CMRR Common-mode rejection ratio 0 V ≤VCM ≤2.2 V TA= 25°C 60 82 dB
TA= TJ56
PSRR Power supply rejection ratio 2.2 V ≤V+≤30 V TA= 25°C 87 104 dB
TA= TJ84
VCM Input common-mode voltage
range CMRR > 60 dB 2.3 V
–0.1
AVLarge signal voltage gain RL= 10 kΩ
VO= 1.6 VPP
TA= 25°C 6.5 46 V/mV
TA= TJ5.4
VOOutput swing RL= 10 kΩTA= 25°C 0.05 0.08
V
2.15
TA= TJ0.1
RL= 2 kΩTA= 25°C 0.09 0.13
TA= TJ0.14
7
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Electrical Characteristics: 2.2-V DC (continued)
Unless otherwise specified, all limits ensured for TA= 25°C, V+= 2.2 V, V−= 0 V, VCM = VO= V+/2 and RL> 1 MΩto V+/2
unless noted that limits apply at the temperature. (1)(2)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISC Output short-circuit current Sourcing TA= 25°C 8 10.9
mA
TA= TJ5.5
Sinking TA= 25°C 6 7.7
TA= TJ5
ISSupply current TA= 25°C 0.57 0.97 mA
TA= TJ1.24
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the devices such that TJ= TA. No ensure of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where TJ> TA.
(2) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(MAX) −TA)/RθJA. All numbers apply for packages soldered directly into a PC board.
6.8 Electrical Characteristics: 30-V DC
Unless otherwise specified, all limits ensured for TA= 25°C, V+= 30 V, V−= 0 V, VCM = VO= V+/2 and RL> 1 MΩto V+/2
unless noted that limits apply at the temperature(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOS Input offset voltage 0.04 6 mV
8
TCVOS Input offset voltage average
drift TA= TJ2μV/°C
IBInput bias current VCM = 0 V TA= 25°C 103 300
nA
TA= TJ500
VCM = 30 V TA= 25°C −100 −50
TA= TJ−200
IOS Input offset current VCM = 0 V TA= 25°C 1.2 90
nA
TA= TJ190
VCM = 30 V TA= 25°C 0.5 65
TA= TJ135
RIN Input resistance 0 V ≤VCM ≤30 V 200 MΩ
CMRR Common mode rejection ratio 0 V ≤VCM ≤30 V TA= 25°C 80 104
dB
TA= TJ78
0 V ≤VCM ≤27 V TA= 25°C 90 115
TA= TJ88
PSRR Power supply rejection ratio 2.2 V ≤V+≤30 V TA= 25°C 87 104 dB
TA= TJ84
VCM Input common-mode voltage
range CMRR > 80 dB 30.1 V
−0.1
AVLarge signal voltage gain RL= 10 kΩ
VO= 28 VPP
TA= 25°C 30 105 V/mV
TA= TJ20
VOOutput swing RL= 10 kΩ
TA= 25°C 0.16 0.275
V
TA= TJ0.375
TA= 25°C 29.75 29.8
TA= TJ28.65
ISC Output short-circuit current
Sourcing(2) TA= 25°C 8.8 11.7
mA
TA= TJ6.5
Sinking(2) TA= 25°C 8.2 11.5
TA= TJ6
8
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Electrical Characteristics: 30-V DC (continued)
Unless otherwise specified, all limits ensured for TA= 25°C, V+= 30 V, V−= 0 V, VCM = VO= V+/2 and RL> 1 MΩto V+/2
unless noted that limits apply at the temperature(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ISSupply current TA= 25°C 0.72 1.3 mA
TA= TJ1.35
9
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6.9 Typical Characteristics
TA= 25°C, RL= 1 MΩunless otherwise specified
Figure 1. Supply Current vs Supply Voltage Figure 2. VOS vs Supply Voltage
Figure 3. VOS vs VCM VS= ±1.1 V Figure 4. VOS vs VCM VS= ±2.5 V
Figure 5. VOS vs VCM VS= ±15 V Figure 6. Inverting Input Bias Current vs Common Mode
Voltage VS= ±1.1 V
10
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Typical Characteristics (continued)
TA= 25°C, RL= 1 MΩunless otherwise specified
Figure 7. Noninverting Input Bias Current vs Common Mode
Voltage VS= ±1.1 V Figure 8. Inverting Input Bias Current vs Common Mode
Voltage VS= ±2.5 V
Figure 9. Noninverting Input Bias Current vs Common Mode
Voltage VS= ±2.5 V Figure 10. Noninverting Input Bias Current vs Common
Mode Voltage VS= ±15 V
Figure 11. Inverting Input Bias Current vs Common Mode
Voltage VS= ±15 V Figure 12. VOvs IOVS= ±1.1 V
11
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Typical Characteristics (continued)
TA= 25°C, RL= 1 MΩunless otherwise specified
Figure 13. VOvs IOVS= ±2.5 V Figure 14. Short-Circuit Current vs Supply Voltage
Figure 15. Voltage Noise vs Frequency Figure 16. Current Noise vs Frequency
Figure 17. Gain and Phase Figure 18. Gain and Phase, 2.7-V Supply
+
±
-2.5 V
+2.5 V
Copyright © 2016, Texas Instruments Incorporated
10 NŸ
10 NŸ
12
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7 Detailed Description
7.1 Overview
Low supply current, wide bandwidth, input common mode voltage range that includes both rails, rail-to-rail
output, good capacitive load driving ability, wide supply voltage (1.8 V to 32 V), and low distortion all make the
LM7301 ideal for many diverse applications.
The high common-mode rejection ratio and full rail-to-rail input range provides precision performance when
operated in noninverting applications where the common-mode error is added directly to the other system errors.
7.2 Feature Description
7.2.1 Capacitive Load Driving
The LM7301 has the ability to drive large capacitive loads. For example, 1000 pF only reduces the phase margin
to about 25°.
7.2.2 Transient Response
The LM7301 offers a very clean, well-behaved transient response. Figure 19,Figure 20,Figure 22, and
Figure 23 show the response when operated at gains of +1 and −1 when handling both small and large signals.
The large phase margin, typically 70° to 80°, assures clean and symmetrical response. In the large signal scope
photos, Figure 19 and Figure 22, the input signal is set to 4.8 V. The output goes to within 100 mV of the
supplies cleanly and without overshoot. In the small signal samples, the response is clean, with only slight
overshoot when used as a follower. Figure 21 and Figure 24 are the circuits used to make these photos.
Figure 19. AV= –1 V/V, Large Signal Behavior (1 V/div,
2 µs/div) Figure 20. AV= –1 V/V, Small Signal Behavior (0.2 V/div,
100 µs/div)
Figure 21. AV= –1 V/V Schematic
+
±
-2.5 V
+2.5 V
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Feature Description (continued)
Figure 22. AV= 1 V/V, Large Signal Behavior (1 V/div,
2 us/div) Figure 23. AV= 1 V/V, Small Signal Behavior (0.2 V/div,
200 µs/div)
Figure 24. AV= 1-V/V Schematic
7.2.3 Wide Supply Range
The high power-supply rejection ratio (PSRR) and common-mode rejection ratio (CMRR) provide precision
performance when operated on battery or other unregulated supplies. This advantage is further enhanced by the
very wide supply range (2.2 V to 30 V, ensured) offered by the LM7301. In situations where highly variable or
unregulated supplies are present, the excellent PSRR and wide supply range of the LM7301 benefit the system
designer with continued precision performance, even in such adverse supply conditions.
7.2.4 Specific Advantages of 5-Pin SOT-23 (TinyPak)
The obvious advantage of the 5-pin SOT-23, TinyPak, is that it can save board space, a critical aspect of any
portable or miniaturized system design. The need to decrease overall system size is inherent in any handheld,
portable, or lightweight system application.
Furthermore, the low profile can help in height limited designs, such as consumer hand-held remote controls,
sub-notebook computers, and PCMCIA cards.
An additional advantage of the tiny package is that it allows better system performance due to ease of package
placement. Because the tiny package is so small, it can fit on the board right where the operational amplifier
must be placed for optimal performance, unconstrained by the usual space limitations. This optimal placement of
the tiny package allows for many system enhancements that are not easily achieved with the constraints of a
larger package. For example, problems such as system noise due to undesired pickup of digital signals can be
easily reduced or mitigated. This pickup problem is often caused by long wires in the board layout going to or
from an operational amplifier. By placing the tiny package closer to the signal source and allowing the LM7301
output to drive the long wire, the signal becomes less sensitive to such pickup. An overall reduction of system
noise results.
Often times system designers try to save space by using dual or quad op amps in their board layouts. This
causes a complicated board layout due to the requirement of routing several signals to and from the same place
on the board. Using the tiny operational amplifier eliminates this problem.
Additional space savings parts are available in tiny packages from Texas Instruments, including low-power
amplifiers, precision-voltage references, and voltage regulators.
+
±
LM7301
Output
Snubber
Network
CC
100 pF
RC
100 Ÿ
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V+
OUT
VHZ Ccomp
V-
-
+
-
+
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Feature Description (continued)
7.2.5 Low-Distortion, High-Output Drive Capability
The LM7301 offers superior low-distortion performance, with a total-harmonic-distortion-plus-noise of 0.06% at f
= 10 kHz. The advantage offered by the LM7301 is its low distortion levels, even at high output current and low
load resistance. See Stability Considerations for methods used to ensure stability under all load conditions.
7.3 Device Functional Modes
7.3.1 Stability Considerations
Rail-to-rail output amplifiers like the LM7301 use the collector of the drive transistor(s) at the output pin, as
shown in Figure 25. This allows the load to be driven as close as possible towards either supply rail.
Figure 25. Simplified Output Stage Block Diagram
While this architecture maximizes the load voltage swing range, it increases the dependence of loop gain and
subsequently stability, on load impedance and DC load current, compared to a non-rail-to-rail architecture. Thus,
with this type of output stage, it is even more crucial to ensure stability by meticulous bench verification under all
load conditions, and to apply the necessary compensation or circuit modifications to overcome any instability, if
necessary. Any such bench verification should also include temperature, supply voltage, input common mode
and output bias point variations as well as capacitive loading.
For example, one set of conditions for which stability of the LM7301 amplifier may be compromised is when the
DC output load is larger than ±0.5 mA, with input and output biased to mid-rail. Under such conditions, it may be
possible to observe open-loop gain response peaking at a high frequency (for example, 200 MHz), which is
beyond the expected frequency range of the LM7301 (4 MHz GBW). Without taking any precautions against gain
peaking, it is possible to see increased settling time or even oscillations, especially with low closed loop gain and
/ or light AC loading. It is possible to reduce or eliminate this gain peaking by using external compensation
components. One possible scheme that can be applied to reduce or eliminate this gain peaking is shown in
Figure 26.
Figure 26. Non-Dissipating Snubber Network to Reduce Gain Peaking
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Device Functional Modes (continued)
The non-dissipating snubber, consisting of Rcand Cc, acts as AC load to reduce high-frequency gain peaking
with no DC loading so that total power dissipation is not increased. The increased AC load effectively reduces
loop gain at higher frequencies thereby reducing gain peaking due to the possible causes stated in the previous
sentence. For the particular set of Rcand Ccvalues shown in Figure 26, loop gain peaking is reduced by about
25 dB under worst case peaking conditions (I_source= 2mA DC at around 180 MHz) thus confining loop gain to
less than 0 dB and eliminating any possible instability. For best results, it may be necessary to tune the values of
Rcand Ccin a particular application to consider other subtleties and tolerances.
7.3.2 Power Dissipation
Although the LM7301 has internal output current limiting, shorting the output to ground when operating on a 30-V
power supply will cause the operational amplifier to dissipate about 350 mW. This is a worst-case example. In
the 8-pin SOIC package, this will cause a temperature rise of 42°C. In the 5-pin SOT-23 package, the higher
thermal resistance will cause a calculated rise of 59°C. This can raise the junction temperature to greater than
the absolute maximum temperature of 150°C.
Operating from split supplies greatly reduces the power dissipated when the output is shorted. Operating on
±15-V supplies can only cause a temperature rise of 21°C in the 8-pin SOIC and 30°C in the 5-pin SOT-23
package, assuming the short is to ground.
S E N S E 3
O U T C H A R G E C H A R G E
1
R R
V I 1 I
R
u
u : u
+
±
Load
RSENSE
0.2 Ÿ
R1
2 k
V+
R2
2 k
ICHARGE
+
-
Q1
2N3906 VOUT
Copyright © 2016, Texas Instruments Incorporated
R3
10 k
C1
Optional
16
LM7301
SNOS879I –AUGUST 1999–REVISED MAY 2016
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Product Folder Links: LM7301
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8 Applications and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Handheld Remote Controls
The LM7301 offers outstanding specifications for applications requiring good speed/power trade-off. In
applications such as remote control operation, where high bandwidth and low power consumption are needed,
the LM7301 performance can easily meet these requirements.
8.1.2 Remote Microphone in Personal Computers
Remote microphones in Personal Computers often use a microphone at the top of the monitor which must drive
a long cable in a high noise environment. One method often used to reduce the nose is to lower the signal
impedance, which reduces the noise pickup. In this configuration, the amplifier usually requires 30 db to 40 db of
gain, at bandwidths higher than most low-power CMOS parts can achieve. The LM7301 offers the tiny package,
higher bandwidths, and greater output drive capability than other rail-to-rail input/output parts can provide for this
application.
8.1.3 Optical Line Isolation for Modems
The combination of the low distortion and good load driving capabilities of the LM7301 make it an excellent
choice for driving opto-coupler circuits to achieve line isolation for modems. This technique prevents telephone
line noise from coupling onto the modem signal. Superior isolation is achieved by coupling the signal optically
from the computer modem to the telephone lines; however, this also requires a low distortion at relatively high
currents. Due to its low distortion at high-output drive currents, the LM7301 fulfills this need, in this and in other
telecom applications. See Stability Considerations for methods used to ensure stability under all load conditions.
8.2 Typical Applications
The circuit shown in Figure 27 uses the wide supply voltage range (1.8 V to 32 V), rail-to-rail input and output
voltage capability, and the unity gain stability of the LM7301 to sense the current flow from the power supply to a
load, such as a battery being charged, or any other load. The circuit creates a ground-referenced output voltage,
which varies linearly with the load current, for easy interface to the rest of the circuitry to create fault-protection,
current and power metering, or current regulation functions.
Figure 27. High Side Current Sensing
OS
OUT OS
I R2 R3
V I 10 k
R1
D ´ ´
D = = ´
OS
OUT OS
V R3
V 5 V
R1
D ´
D = = D
R3 5
R1
=
OUT
SENSE CHARGE _MAX
V
R3
R1 R I
=
´
CHARGE _MIN
I 30 mA>
OS
SENSE
CHARGE_MIN
V
RI
>
17
LM7301
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Typical Applications (continued)
8.2.1 Design Requirements
The output port is designed for easy interface; it is ground-referenced and it produces 0 V with 0 A of load
current. A typical stage that follows this stage, an ADC which samples the load current for example, is easily
connected to the Q1 collector with no level shifting or additional biasing required.
Apart from a wide supply voltage capability, the operational amplifier used in Figure 27 must have an input
voltage range that includes the V+ rail voltage to allow high side current sensing. Furthermore, it should be unity
gain stable and have an output voltage range which is less than one Vbe from V+. The LM7301 has all these
requirements.
8.2.2 Detailed Design Procedure
8.2.2.1 Selecting RSENSE
Pick the value of RSENSE low enough to minimize its heat / voltage loss while observing Equation 1 for minimum
detectable load current, ICHARGE_MIN , and device offset voltage, VOS:
(1)
With the schematic values shown and LM7301's VOS limit of 6 mV:
(2)
If the system has the ability to be initialized and corrected for initial readings, it may be possible to lower the
value of RSENSE.
8.2.2.2 Selecting R1, and R3 Values
Pick the R3 / R1 ratio to get the proper full-scale VOUT when the maximum load current, ICHARGE_MAX, flows:
(3)
For example, to get 3-V output with 3 A of load current when RSENSE = 0.2 Ωresults in:
(4)
Ensure that the resulting transfer function also satisfies the application’s need when the minimum load current,
ICHARGE_MIN is being sensed. In this example, the minimum output voltage will be 30 mV (when ICHARGE_MIN = 30
mA).
With the R3/R1 ratio determined, pick the value of R3 for Q1 collector current less than 1 mA at the maximum
VOUT, and determine R1 from that.
8.2.2.3 R1, R2 Selection
Normally, R2 is set equal to R1 to cancel out the error term due to the input bias current, IB(approximately 200
nA for the LM7301).
8.2.2.4 Error Terms Expressions
Here are the expressions for the output change caused by various parameter shifts, evaluated for Figure 27
values with ICHARGE_MAX= 3 A:
Offset Voltage, ΔVOS:
(5)
Offset current, IOS:
(6)
I_CHARGE (Amp)
VOUT (V)
0 1 2 3 4 5
0
3
6
9
12
15
18
D002
0.1 :
0.2 :
0.5 :
1 :
I_CHARGE (A)
VOUT (V)
0 0.02 0.04 0.06 0.08 0.1
0
0.02
0.04
0.06
0.08
0.1
D003
0.1 :
0.2 :
0.5 :
1 :
Frequency (Hz)
Response (dB)
100 1000 10000 100000 1000000 1E+7
-20
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
D001
0
10 pF
100 pF
1 nF
10 nF
OUT SENSE CHARGE _MAX SENSE
R3
V R I R 15
R1
D = D ´ ´ = D ´
18
LM7301
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Typical Applications (continued)
Self-heating of RSENSE causing ΔRSENSE with ICHARGE_MAX flowing:
(7)
8.2.2.5 Frequency Response
Depending on the application, it may be useful to have the means to control the upper end of the circuit’s
frequency response. An example is limiting the circuit’s response to high-frequency load current spikes or
switching frequencies so that the circuit only reacts to DC or lower frequencies. Capacitor C1 in Figure 27 can be
used to accomplish just that. The original circuit has a –3-dB bandwidth close to 4.5 MHz which can be reduced
by increasing the value of C1, as shown in Figure 28.
Figure 28. Current Sense Frequency Response vs C1 Value
8.2.3 Application Curves
Figure 29 shows the transfer function of the circuit for several values of RSENSE. Notice that with 1 Ω, the output
is limited to approximately 16 V because of the additional drop across the sense resistor at higher load currents.
Figure 30 shows the low-end of the load current is more non-linear for low RSENSE values, as noted in
Selecting RSENSE due to VOS. Higher RSENSE values help with this at the expense of a higher loss and voltage
drop.
Use lower sense resistor value to avoid voltage limitation!
Figure 29. Current Sense Transfer Function for Various
RSENSE Values
Line showing linearity degradation at the lower end.
Figure 30. Low-End Transfer Function for Various RSENSE
VOUT
NC
±IN
+IN
V±
NC
V+
OUT
NC
VS+
GND
Use low-ESR, ceramic
Bypass capacitor
GND VS±
(or GND for single supply)
Only needed
for dual-supply
operation
GND
VIN
RG
RIN
RF
Run the input
traces as far away
from the supply
lines as possible
Place components
close to device
and to each other
to reduce parasitic
errors
Copyright © 2016, Texas Instruments Incorporated
+
±VOUT
VIN RIN
RG
RF
Copyright © 2016, Texas Instruments Incorporated
19
LM7301
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Submit Documentation FeedbackCopyright © 1999–2016, Texas Instruments Incorporated
9 Power Supply Recommendations
The LM7301 is specified for operation from 1.8 V to 32 V (±0.9 V to ±16 V). Being a rail-to-rail input and output
device, any operating voltage conditions within the supply voltage range can be accommodated.
Place 0.1-μF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high-
impedance power supplies.
10 Layout
10.1 Layout Guidelines
For best operational performance of the device, TI recommends good printed-circuit board (PCB) layout
practices. Low-loss, 0.1-μF bypass capacitors should be connected between each supply pin and ground, placed
as close to the device as possible. A single bypass capacitor from V+ to ground is applicable to single supply
applications.
10.2 Layout Example
Figure 31. Schematic Representation
Figure 32. Operational Amplifier Board Layout for Noninverting Configuration
20
LM7301
SNOS879I –AUGUST 1999–REVISED MAY 2016
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Product Folder Links: LM7301
Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated
11 Device and Documentation Support
11.1 Community Resource
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.4 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM7301IM NRND SOIC D 8 95 Non-RoHS &
Non-Green Call TI Call TI -40 to 85 LM73
01IM
LM7301IM/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM73
01IM
LM7301IM5 NRND SOT-23 DBV 5 1000 Non-RoHS &
Non-Green Call TI Call TI -40 to 85 A04A
LM7301IM5/NOPB ACTIVE SOT-23 DBV 5 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 A04A
LM7301IM5X NRND SOT-23 DBV 5 3000 Non-RoHS &
Non-Green Call TI Call TI -40 to 85 A04A
LM7301IM5X/NOPB ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 A04A
LM7301IMX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM73
01IM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM7301IM5 SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM7301IM5/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM7301IM5X SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM7301IM5X/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LM7301IMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM7301IM5 SOT-23 DBV 5 1000 210.0 185.0 35.0
LM7301IM5/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LM7301IM5X SOT-23 DBV 5 3000 210.0 185.0 35.0
LM7301IM5X/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LM7301IMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Sep-2019
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
www.ti.com
PACKAGE OUTLINE
C
0.22
0.08 TYP
0.25
3.0
2.6
2X 0.95
1.9
1.45
0.90
0.15
0.00 TYP
5X 0.5
0.3
0.6
0.3 TYP
8
0 TYP
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/E 09/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
5X (1.1)
5X (0.6)
(2.6)
(1.9)
2X (0.95)
(R0.05) TYP
4214839/E 09/2019
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
(1.9)
2X(0.95)
5X (1.1)
5X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
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