Endura TP945GM Specifications
FEATURE FUNCTION SPECIFICATION
FORM FACTOR Size Mini-ITX motherboard, 6.7” x 6.7”, 170mm x 170mm, 10-
layer PCB
PROCESSOR Type Supports Intel® Core Duo™ and Celeron® M, LV, and
ULV processors
Socket PGA-478 CPU socket and support for BGA-479 CPUs
FSB 667MHz and 533MHz system bus
CHIPSET Type Intel® 945GM Express chipset with Intel® ICH7M
MEMORY Type Two sockets for DDR2-667, DDR2-553 and DDR2-400
DIMM modules
Capacity Up to 4GB of system memory (3.2GB approx available
for system memory)
Performance Dual-Channel memory support
VIDEO Type Intel® Graphics Media Accelerator 950 integrated video
Supports dual independent video outputs
Resolution VGA: 2048 x 1536 at 75Hz and 32-bit color, LVDS:
1600 x 1200
Graphics
Acceleration
x16 PCI Express graphics slot with support for Media
Expansion Cards (ADD2+)
Video Outputs VGA, 18-bit dual channel LVDS, TV output header
TV Output Header for Composite, Component and S-Video
outputs
AUDIO Type Intel® High Definition Audio using Sigmatel STAC9220
eight channel CODEC
Connectors 6 audio jacks for 7.1 surround sound
On-board CD-ROM audio input header
S/PDIF digital audio output
ETHERNET Controller Single or dual Broadcom BCM5789 Gigabit Ethernet
controllers
EXPANSION PCI Express x16 PCI Express graphics slot supports x1 PCI
Express cards
PCI Mini-PCI Type lllA card socket
CompactFlash Type l socket
PCMCIA Type II socket
POWER
MANAGEMENT
ACPI ACPI 3.0 supporting states S0, S3 (suspend to RAM),
S4 and S5
SYSTEM
MANAGEMENT
System Monitoring Voltage, temperature and fan monitoring (3 fans)
Lithium cell voltage monitoring
Automatic fanspeed control based on thermal monitoring
Watchdog Programmable watchdog timer
SMbus SMbus header
POWER SUPPLY Type Support for hard- and soft- switched power supplies
Connector Standard 24-pin ATX power supply connector with an
additional 4-pin ATX 12V connector
BATTERY Lilthium coin cell (5 years operating life typical)
BIOS Phoenix BIOS TrustedCore™ - includes network boot and PXE
Customizable logo and BIOS settings
I/O USB Eight USB 2.0 ports four on rear I/O panel and four on
headers
GPIO 13-bit General Purpose I/O header with an additional
PWM signal
Serial Ports Four RS232 serial ports two on rear I/O panel and two
on headers
IrDA IrDA compliant infrared interface with support for SIR
and ASK
DISKS SATA Two SATA 1.5Gbps ports
IDE One Ultra ATA100 interface with 44-way slim type
header
SECURITY TPM Header connector for a Trusted Platform Module (TPM)
1.2
OPERATING
SYSTEMS
Windows XP
Windows XPe
Windows Vista
Linux
SAFETY
COMPLIANCE
Evaluated in accordance with UL60950, EN60950 and IEC60950
EMC COMPLIANCE Evaluated in accordance with EN55022, EN55024 and FCC Part 15 Class
B
PHYSICAL SPECIFICATIONS
ENVIRONMENT Temperature Operating 0°C to 70°C
Storage -40°C to 85°C
Relative Humidity 5% to 95% non-condensing
Endura TP945GM DATA SHEET | © 2009 RadiSys Corporation | ID: 10-30-2008 7 | Page 2 of 4
* All other tradem arks are the properties of their respective ow ners.
FEATURE SUMMARY
lEnables customers to
quickly develop next-
generation systems with
high performance, low
power consumption and
long life.
lThe Mobile Intel 945GM
Express chipset has a
667MHz front side bus and
supports up to 4GB of dual
channel, DDR2-667
memory for enhanced
performance.
Endura TP945GM
Endura TP945GM Long-life Mini-ITX Express Motherboard
[Print This Datasheet]
HIGH PERFORMANCE
The Endura TP945GM mini-ITX delivers exceptional performance with Intels latest Core™ Duo
T2500 2.0GHz embedded processor. Support for Intel® Celeron® M, LV and ULV processors also
provides cost effective and ultra-low power options.
The Intel® 945GM Express chipset has a 667MHz front-side bus and supports dual-channel DDR2-
667 DIMM memory which enables a 25% higher data rate compared to the previous generation. The
integrated Intel® Graphics Media Accelerator 950 delivers exceptional 3D graphics performance,
2X that of the previous generation.
LOW POWER
The Endura TP945GM is optimized for use with the Intel® Core® Duo processor T2500 with a
thermal design power (TDP) of 31W and the Intel® Core® Duo processor L2400 with a TDP of
15W. Use of the Intel® Celeron® M ULV 423 BGA processor enables an even lower TDP of just
5.5W. This delivers up to 28% less average power consumption compared to the previous
generation. With extended temperature operation up to 70ºC, the Endura TP945GM is ideal for use
in rugged, space constrained applications with demanding thermal performance characteristics.
Components are also selected for a more ruggedized design to support embedded applications
running 24 / 7.
HIGHLY INTEGRATED
With the integrated Intel® GMA 950 graphics controller, dual independent video support, Intel® High
Definition Audio with 7.1 surround sound and interfaces for VGA, LVDS, DVI (via a Media
Expansion Card), TV-out (composite, component, S-video) and S/PDIF digital audio output, the
Endura TP945GM is well suited to all types of multi-media applications.
LONG LIFE
With a projected life time of up to 7 years, the Endura TP945GM is designed for the needs of
embedded system designers. This is backed up by strong engineering support, sustaining and full
product life cycle management from RadiSys.
ROHS COMPLIANT
The Endura TP945GM is fully RoHS 6 compliant to meet the latest legislative and environmental
standards.
Endura TP945GM DATA SHEET | © 2009 RadiSys Corporation | ID: 10-30-2008 7 | Page 2 of 4
* All other tradem arks are the properties of their respective ow ners.
Ordering Information
DESCRIPTION:
TP945GM with single Gigabit Ethernet
PRODUCT CODE: TP1G03-0-0
TP945GM with dual Gigabit Ethernet
PRODUCT CODE: TP2G03-0-0
TP945GM with dual Gigabit Ethernet and CompactFlash socket
PRODUCT CODE: TP2GC03-0-0
TP945GM with single Gigabit Ethernet, ULV Celeron M 423 and
passive heatsink
PRODUCT CODE: TP1G03-423-0
Dual DVI Media Expansion Card
PRODUCT CODE: MEC-DUAL-DVI
I/O shield for TP945GM with single GbE
PRODUCT CODE: IOSHLD-TP1G
I/O shield for TP945GM with dual GbE
PRODUCT CODE: IOSHLD-TP2G
Standard fansink with aluminium heatsink
PRODUCT CODE: FNSNK-TPSTD
Higher performance fansink with copper heatsink
PRODUCT CODE: FNSNK-TPXT
2009 RadiSys Corporation. RadiSys is a registered trademark of RadiSys Corporation. Convedia, Microware and OS-9
are registered trademark s of RadiSys Corporation. Promentum, and Procelerant are trademarks of RadiSys
Corporation. *All other trademark s are the properties of their respective owners. All specifications within this document
are subject to change without notice.
Endura TP945GM DATA SHEET | © 2009 RadiSys Corporation | ID: 10-30-2008 7 | Page 4 of 4