NCV4296-2C 30 mA Low Dropout Voltage Regulator with Inhibit The NCV4296-2C is a monolithic integrated low dropout voltage regulator with an output current capability of 30 mA available in the TSOP-5 package. The output voltage is accurate within 4.0% with a maximum dropout voltage of 250 mV with an input up to 45 V. Low quiescent current is a feature typically drawing only 160 mA with a 1 mA load. With Inhibit feature, the regulator can be turned off and the device consumes less than 5 mA of quiescent current. This part is ideal for automotive and all battery operated microprocessor equipment. The regulator is protected against reverse battery, short circuit and thermal overload conditions. * * MARKING DIAGRAM 5 TSOP-5 CASE 483 5 1 Features * * * * * * * * www.onsemi.com Output Voltage Options: 3.3 V, 5.0 V Output Voltage Accuracy: 4.0% Output Current: up to 30 mA Low Quiescent Current (typ. 160 mA @ 1 mA) Low Dropout Voltage (typ. 65 mV @ 20 mA) Wide Input Voltage Operating Range: up to 45 V Inhibit Input Protection Features: Current Limitation Thermal Shutdown Reverse Polarity Protection and Reverse Bias Protection AEC-Q100 Grade 1 Qualified and PPAP Capable This is a Pb-Free Device xxxAYWG G 1 xxx A Y W G = Specific Device Code = Assembly Location = Year = Work Week = Pb-Free Package (Note: Microdot may be in either location) PIN CONNECTIONS INH 1 GND 2 Vin 3 5 GND 4 Vout (Top View) Typical Applications * Microprocessor Systems Power Supply Input Cin 100 nF Vout Vin NCV4296-2C INH ORDERING INFORMATION See detailed ordering, marking and shipping information on page 10 of this data sheet. Output Cout 2.2 mF GND Inhibit Figure 1. Applications Circuit (c) Semiconductor Components Industries, LLC, 2015 November, 2017 - Rev. 1 1 Publication Order Number: NCV4296-2C/D NCV4296-2C Vout Vin VOLTAGE REFERENCE VREF SP INHIBIT INH SATURATION PROTECTION THERMAL SHUTDOWN VREF SP TSD TSD GND Figure 2. Simplified Block Diagram PIN FUNCTION DESCRIPTION Pin No. TSOP-5 Pin Name 1 INH Inhibit Input. Low level disables the IC. 2 GND Power Supply Ground. 3 Vin Unregulated Positive Power Supply Input. Connect 0.1 mF capacitor to ground. 4 Vout Regulated Positive Output Voltage. Connect 2.2 mF capacitor with ESR < 7 W to ground. 5 GND Power Supply Ground. Description ABSOLUTE MAXIMUM RATINGS Rating Symbol Min Max -42 45 - 60 -6 30 -42 45 -0.5 -5 - 5 TJ(max) -40 150 C TSTG -50 150 C Input Voltage DC (Note 1) DC Vin Input Voltage (Note 2) Load Dump - Suppressed Us Output Voltage Vout Inhibit Input Voltage DC VINH Inhibit Input Current Range DC Transient, -0.3 V Vin 45 V, tp < 1 ms IINH Maximum Junction Temperature Storage Temperature Unit V V V V mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. Load Dump Test B (with centralized load dump suppression) according to ISO16750-2 standard. Guaranteed by design. Not tested in production. Passed Class A according to ISO16750-1. ESD CAPABILITY (Note 3) Rating ESD Capability, Human Body Model Symbol Min Max Unit ESDHBM -2 2 kV 3. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC-Q100-002 (JS-001-2010) Field Induced Charge Device Model ESD characterization is not performed on plastic molded packages with body sizes <50mm2 due to the inability of a small package body to acquire and retain enough charge to meet the minimum CDM discharge current waveform characteristic defined in JEDEC JS-002-2014. www.onsemi.com 2 NCV4296-2C LEAD SOLDERING TEMPERATURE AND MSL (Note 4) Symbol Rating Moisture Sensitivity Level MSL Min Max 1 Unit - 4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D THERMAL CHARACTERISTICS Rating Thermal Characteristics, TSOP-5 Thermal Resistance, Junction-to-Air (Note 5) Symbol Value RJA 136.2 Unit C/W 5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. RECOMMENDED OPERATING RANGES Rating Input Voltage (Note 6) Inhibit Input Voltage Junction Temperature Symbol Min Max Unit Vin Vout, nom + 0.5 or 3.5 45 V VINH -0.3 40 V TJ -40 150 C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 6. Minimum Vin = Vout, nom + 0.5 or 3.5, whichever is higher. www.onsemi.com 3 NCV4296-2C ELECTRICAL CHARACTERISTICS Vin = 13.5 V, VINH > 2.5 V, Cin = 0.1 mF, Cout = 2.2 mF, for typical values TJ = 25C, for min/max values TJ = -40C to 150C; unless otherwise noted. (Note 7) Parameter Test Conditions Symbol Min Typ Max Unit Vout 4.80 4.80 3.17 3.17 5.00 5.00 3.30 3.30 5.20 5.20 3.43 3.43 V REGULATOR OUTPUT Output Voltage 5.0 V Vin = 13.5 V, Iout = 1 mA to 30 mA Vin = 6 V to 40 V, Iout = 10 mA 3.3 V Vin = 13.5 V, Iout = 1 mA to 30 mA Vin = 4.3 V to 40 V, Iout = 10 mA Line Regulation Vin = Vin, min to 36 V, Iout = 5 mA, TJ = 25C Vin = Vin, min to 36 V, Iout = 5 mA Regline - - 5 10 20 30 mV Load Regulation Iout = 1 mA to 25 mA, TJ = 25C Iout = 1 mA to 25 mA Regload - - 3 10 20 30 mV Dropout Voltage (Note 8) Iout = 20 mA VDO - 65 250 mV IDIS - - 0 0 1 5 A - - - 150 160 0.8 170 200 4 A A mA ILIM 30 - - mA PSRR - 60 - dB 0.4 - 1.76 1.82 - 2.2 IINH_OFF IINH_ON -2 - - 6 2 12 TSD 151 175 195 DISABLE AND QUIESCENT CURRENTS Disable Current Quiescent Current, Iq = Iin - Iout VINH <= 0.4 V, TJ < 85C VINH <= 0.4 V Iq Iout < 0.1 mA, TJ < 85C Iout < 1 mA Iout < 30 mA CURRENT LIMIT PROTECTION Current Limit Vout = Vout, nom - 100 mV PSRR Power Supply Ripple Rejection f = 100 Hz, 0.5 Vpp INHIBIT Inhibit Input Threshold Voltage Low (Off-State) High (On-State) Vout < 0.1 V Vout > 0.95 x Vout, nom Inhibit Input Current Low (Off-State) High (On-State) VINH = 0 V VINH = 5 V VINH V A THERMAL SHUTDOWN Thermal Shutdown Temperature (Note 9) C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 7. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [TJ. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 8. Measured when output voltage falls 100 mV below the regulated voltage at Vin = 13.5 V. If Vout < 5 V, then VDO = Vin - Vout. Maximum dropout voltage value is limited by minimum input voltage Vin = Vout, nom + 0.5 V recommended for guaranteed operation at maximum output current. 9. Values based on design and/or characterization. www.onsemi.com 4 NCV4296-2C TYPICAL CHARACTERISTICS - 5.0 V VERSION 1000 Unstable Region ESR (W) 100 10 Stable Region 1 Cout 2.2 mF TJ = 25C 0.1 0.01 0 5 10 15 20 25 30 Iout, OUTPUT CURRENT (mA) Figure 3. Output Stability with Output Capacitor ESR 6 Vin = 13.5 V RL = 5 kW Vout, OUTPUT VOLTAGE (V) Vout, OUTPUT VOLTAGE (V) 5.10 5.05 5.00 4.95 4.90 -40 0 40 80 120 3 2 RL = 166 W TJ = 25C 1 0 1 2 3 5 4 6 7 8 9 TJ, JUNCTION TEMPERATURE (C) Vin, INPUT VOLTAGE (V) Figure 4. Output Voltage vs. Junction Temperature Figure 5. Output Voltage vs. Input Voltage 10 70 TJ = 125C 100 Iout, OUTPUT CURRENT (mA) VDO, DROPOUT VOLTAGE (mV) 4 0 160 150 TJ = 25C TJ = -40C 50 0 5 0 5 10 15 20 25 60 50 40 30 20 0 30 Vout = 0 V TJ = 25C 10 0 5 10 15 20 25 30 35 40 Iout, OUTPUT CURRENT (mA) Vin, INPUT VOLTAGE (V) Figure 6. Dropout Voltage vs. Output Current Figure 7. Maximum Output Current vs. Input Voltage www.onsemi.com 5 45 NCV4296-2C TYPICAL CHARACTERISTICS - 5.0 V VERSION 300 0.7 Iq, QUIESCENT CURRENT (mA) Vin = 13.5 V TJ = 25C 0.6 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 200 100 0 30 Vin = 13.5 V TJ = 25C 0 1 2 3 4 Iout, OUTPUT CURRENT (mA) Iout, OUTPUT CURRENT (mA) Figure 8. Quiescent Current vs. Output Current (High Load) Figure 9. Quiescent Current vs. Output Current (Low Load) 5.0 Iq, QUIESCENT CURRENT (mA) Iq, QUIESCENT CURRENT (mA) 0.8 4.5 RL = 166 W TJ = 25C 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 5 10 15 20 25 30 35 Vin, INPUT VOLTAGE (V) Figure 10. Quiescent Current vs. Input Voltage www.onsemi.com 6 40 5 NCV4296-2C TYPICAL CHARACTERISTICS - 3.3 V VERSION 1000 Unstable Region 100 ESR (W) 10 Stable Region 1 Cout 2.2 mF TJ = 25C 0.1 0.01 0 5 10 15 20 25 30 Iout, OUTPUT CURRENT (mA) Figure 11. Output Stability with Output Capacitor ESR 4.0 Vin = 13.5 V RL = 3.3 kW Vout, OUTPUT VOLTAGE (V) Vout, OUTPUT VOLTAGE (V) 3.40 3.35 3.30 3.25 3.20 -40 0 40 80 120 2.5 2.0 1.5 1.0 RL = 110 W TJ = 25C 0.5 0 1 2 3 4 5 6 7 8 9 TJ, JUNCTION TEMPERATURE (C) Vin, INPUT VOLTAGE (V) Figure 12. Output Voltage vs. Junction Temperature Figure 13. Output Voltage vs. Input Voltage 10 5.0 Iq, QUIESCENT CURRENT (mA) Iout, OUTPUT CURRENT (mA) 3.0 0 160 70 60 50 40 30 20 Vout = 0 V TJ = 25C 10 0 3.5 0 5 10 15 20 25 30 35 40 45 4.5 RL = 110 W TJ = 25C 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 5 10 15 20 25 30 35 40 Vin, INPUT VOLTAGE (V) Vin, INPUT VOLTAGE (V) Figure 14. Maximum Output Current vs. Input Voltage Figure 15. Quiescent Current vs. Input Voltage www.onsemi.com 7 NCV4296-2C TYPICAL CHARACTERISTICS - 3.3 V VERSION 300 0.7 Iq, QUIESCENT CURRENT (mA) Vin = 13.5 V TJ = 25C 0.6 0.5 0.4 0.3 0.2 0.1 0 0 5 10 15 20 25 200 100 0 30 Vin = 13.5 V TJ = 25C 0 1 2 3 4 Iout, OUTPUT CURRENT (mA) Iout, OUTPUT CURRENT (mA) Figure 16. Quiescent Current vs. Output Current (High Load) Figure 17. Quiescent Current vs. Output Current (Low Load) RqJA, THERMAL RESISTANCE (C/W) Iq, QUIESCENT CURRENT (mA) 0.8 200 175 1 oz 150 2 oz 125 100 0 100 200 300 400 PCB Cu Area 500 600 (mm2) Figure 18. RqJA vs. PCB Cu Area www.onsemi.com 8 700 5 NCV4296-2C DEFINITIONS General output load current. If Inhibit pin is set to LOW the regulator reduces its internal bias and shuts off the output, this term is called the disable current (IDIS). All measurements are performed using short pulse low duty cycle techniques to maintain junction temperature as close as possible to ambient temperature. Current Limit Output voltage Current Limit is value of output current by which output voltage drops 100 mV below its nominal value. It means that the device is capable to supply minimum 30 mA. The output voltage parameter is defined for specific temperature, input voltage and output current values or specified over Line, Load and Temperature ranges. PSRR Line Regulation Power Supply Rejection Ratio is defined as ratio of output voltage and input voltage ripple. It is measured in decibels (dB). The change in output voltage for a change in input voltage measured for specific output current over operating ambient temperature range. Thermal Protection Load Regulation Internal thermal shutdown circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated at typically 175C, the regulator turns off. This feature is provided to prevent failures from accidental overheating. The change in output voltage for a change in output current measured for specific input voltage over operating ambient temperature range. Dropout Voltage The input to output differential at which the regulator output no longer maintains regulation against further reductions in input voltage. It is measured when the output drops 100 mV below its nominal value. The junction temperature, load current, and minimum input supply requirements affect the dropout level. Maximum Package Power Dissipation The power dissipation level is maximum allowed power dissipation for particular package or power dissipation at which the junction temperature reaches its maximum operating value, whichever is lower. Quiescent and Disable Currents Quiescent Current (Iq) is the difference between the input current (measured through the LDO input pin) and the www.onsemi.com 9 NCV4296-2C APPLICATIONS INFORMATION configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. When the NCV4296-2C has good thermal conductivity through the PCB, the junction temperature will be relatively low with high power applications. The maximum dissipation the NCV4296-2C can handle is given by: The NCV4296-2C low dropout regulator is self-protected with internal thermal shutdown and internal current limit. Typical characteristics are shown in Figure 3 to Figure 18. Input Decoupling (Cin) A ceramic or tantalum 0.1 mF capacitor is recommended and should be connected close to the NCV4296-2C package. Higher capacitance and lower ESR will improve the overall line and load transient response. PD(MAX) + T J(MAX) * T A (eq. 1) R qJA Since TJ is not recommended to exceed 150C, then the NCV4296-2C soldered on 645 mm2, 1 oz copper area, FR4 can dissipate up to 0.92 W when the ambient temperature (TA) is 25C. See Figure 18 for RthJA versus PCB area. The power dissipated by the NCV4296-2C can be calculated from the following equations: Output Decoupling (Cout) The NCV4296-2C is a stable component and does not require a minimum Equivalent Series Resistance (ESR) for the output capacitor. Stability region of ESR vs. Output Current is shown in Figures 3 and 11. The minimum output decoupling value is 2.2 mF and can be augmented to fulfill stringent load transient requirements. The regulator works with ceramic chip capacitors as well as tantalum devices. Larger values improve noise rejection and load transient response. PD [ V inIq@I out ) I outVin * Vout (eq. 2) or Vin(MAX) [ Inhibit Operation The Inhibit pin will turn the regulator on or off. The threshold limits are covered in the electrical characteristics table in this data sheet. P D(MAX) ) V out I out I out ) I q (eq. 3) Hints Vin and GND printed circuit board traces should be as wide as possible. When the impedance of these traces is high, there is a chance to pick up noise or cause the regulator to malfunction. Place external components, especially the output capacitor, as close as possible to the NCV4296-2C and make traces as short as possible. Thermal Considerations As power in the NCV4296-2C increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad ORDERING INFORMATION Marking Package Shipping NCV4296-2CSN50T1G 65V NCV4296-2CSN33T1G 63V TSOP-5 (Pb-Free) 3000 / Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 10 NCV4296-2C PACKAGE DIMENSIONS TSOP-5 CASE 483 ISSUE M D 5X NOTE 5 2X NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. 0.20 C A B 0.10 T M 2X 0.20 T B 5 1 4 2 B S 3 K DETAIL Z G A A TOP VIEW H SIDE VIEW DETAIL Z J C 0.05 C SEATING PLANE DIM A B C D G H J K M S END VIEW MILLIMETERS MIN MAX 2.85 3.15 1.35 1.65 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 0_ 10 _ 2.50 3.00 SOLDERING FOOTPRINT* 0.95 0.037 1.9 0.074 2.4 0.094 1.0 0.039 0.7 0.028 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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