RB751S40,115 - NEXPERIA - Datasheet.Wiki

1. Product proﬁle

1.1 General description

Planar Schottky barrier single diodes with an integrated guard ring for stress protection,

encapsulated in small Surface-Mounted Device (SMD) plastic packages.

1.2 Features

nLow forward voltage

nLow capacitance

1.3 Applications

nUltra high-speed switching

nVoltage clamping

nLine termination

nReverse polarity protection

1.4 Quick reference data

[1] Pulse test: tp≤300 µs; δ≤0.02.

RB751 series

Schottky barrier single diodes

Rev. 01 — 21 May 2007 Product data sheet

Table 1. Product overview

Type number Package Package

conﬁguration

Nexperia JEITA

RB751CS40 SOD882 - leadless ultra small

RB751S40 SOD523 SC-79 ultra small

RB751V40 SOD323 SC-76 very small

Table 2. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

IFforward current - - 120 mA

VRRM repetitive peak reverse

voltage --40V

VFforward voltage IF=1mA [1] - - 370 mV

RB751_SER_1

Product data sheet Rev. 01 — 21 May 2007 2 of 10

Nexperia RB751 series

Schottky barrier single diodes

2. Pinning information

[1] The marking bar indicates the cathode.

3. Ordering information

4. Marking

Table 3. Pinning

Pin Description Simpliﬁed outline Symbol

SOD882

1 cathode [1]

2 anode

SOD323; SOD523

1 cathode [1]

2 anode

Transparent

top view

sym001

001aab540

sym001

Table 4. Ordering information

Type number Package

Name Description Version

RB751CS40 - leadless ultra small plastic package; 2 terminals;

body 1.0 ×0.6 ×0.5 mm SOD882

RB751S40 SC-79 plastic surface-mounted package; 2 leads SOD523

RB751V40 SC-76 plastic surface-mounted package; 2 leads SOD323

Table 5. Marking codes

Type number Marking code

RB751CS40 F6

RB751S40 G4

RB751V40 W8

RB751_SER_1

Product data sheet Rev. 01 — 21 May 2007 3 of 10

Nexperia RB751 series

Schottky barrier single diodes

5. Limiting values

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2] Reﬂow soldering is the only recommended soldering method.

6. Thermal characteristics

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Reﬂow soldering is the only recommended soldering method.

7. Characteristics

[1] Pulse test: tp≤300 µs; δ≤0.02.

Table 6. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VRRM repetitive peak reverse

voltage -40V

VRreverse voltage - 40 V

IFforward current - 120 mA

IFSM non-repetitive peak forward

current square wave;

tp<10ms - 200 mA

Ptot total power dissipation Tamb ≤25 °C[1]

RB751CS40 [2] - 250 mW

RB751S40 [2] - 280 mW

RB751V40 - 280 mW

Tjjunction temperature - 150 °C

Tamb ambient temperature −65 +150 °C

Tstg storage temperature −65 +150 °C

Table 7. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient in free air [1]

RB751CS40 [2] - - 500 K/W

RB751S40 [2] - - 450 K/W

RB751V40 - - 450 K/W

Table 8. Characteristics

amb

=25

C unless otherwise speciﬁed.

Symbol Parameter Conditions Min Typ Max Unit

VFforward voltage IF=1mA [1] - - 370 mV

IRreverse current VR= 30 V - - 0.5 µA

Cddiode capacitance VR= 1 V; f = 1 MHz - 2 - pF

RB751_SER_1

Product data sheet Rev. 01 — 21 May 2007 4 of 10

Nexperia RB751 series

Schottky barrier single diodes

(1) Tamb = 125 °C

(2) Tamb =85°C

(3) Tamb =25°C

(4) Tamb =−40 °C

(1) Tamb = 125 °C

(2) Tamb =85°C

(3) Tamb =25°C

Fig 1. Forward current as a function of forward

voltage; typical values Fig 2. Reverse current as a function of reverse

voltage; typical values

f = 1 MHz; Tamb =25°C

Fig 3. Diode capacitance as a function of reverse voltage; typical values

102

10−1

10−2

mlc361

0.6 0.80.40.2 1

VF (V)

(mA)

(1) (2) (3) (4)

103

102

10−1

10−2

mlc362

2010 4030 VR (V)

(µA) (1)

(2)

(3)

01020 4030

mlc363

VR (V)

(pF)

RB751_SER_1

Product data sheet Rev. 01 — 21 May 2007 5 of 10

Nexperia RB751 series

Schottky barrier single diodes

8. Package outline

9. Packing information

[1] For further information and the availability of packing methods, see Section 13.

Fig 4. Package outline SOD882 Fig 5. Package outline SOD523 (SC-79)

Fig 6. Package outline SOD323 (SC-76)

03-04-17Dimensions in mm

0.55

0.47

0.65

0.62

0.55 0.50

0.46

cathode marking on top side

1.02

0.95

0.30

0.22

0.30

0.22

02-12-13Dimensions in mm

1.65

1.55 1.25

1.15

0.17

0.11

0.34

0.26

0.65

0.58

0.85

0.75

03-12-17Dimensions in mm

0.25

0.10

0.45

0.15

2.7

2.3 1.8

1.6

0.40

0.25

1.1

0.8

1.35

1.15

Table 9. Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.

[1]

Type number Package Description Packing quantity

3000 8000 10000

RB751CS40 SOD882 2 mm pitch, 8 mm tape and reel - - -315

RB751S40 SOD523 2 mm pitch, 8 mm tape and reel - -315 -

4 mm pitch, 8 mm tape and reel -115 - -135

RB751V40 SOD323 4 mm pitch, 8 mm tape and reel -115 - -135

RB751_SER_1

Product data sheet Rev. 01 — 21 May 2007 6 of 10

Nexperia RB751 series

Schottky barrier single diodes

10. Soldering

Reﬂow soldering is the only recommended soldering method.

Dimensions in mm

Fig 7. Reﬂow soldering footprint SOD882

Reﬂow soldering is the only recommended soldering method.

Dimensions in mm

Fig 8. Reﬂow soldering footprint SOD523 (SC-79)

mbl872

1.30

0.30R = 0.05 (8×) R = 0.05 (8×)

0.60

(2×)0.70

(2×)0.80

(2×)

0.90

0.30

(2×)

0.40

(2×)

0.50

(2×)

solder lands

solder resist

occupied area

solder paste

mgs343

1.80

1.90

0.30

0.40

0.50

1.20 0.60

2.15

solder lands

solder resist

occupied area

solder paste

RB751_SER_1

Product data sheet Rev. 01 — 21 May 2007 7 of 10

Nexperia RB751 series

Schottky barrier single diodes

Dimensions in mm

Fig 9. Reﬂow soldering footprint SOD323 (SC-76)

Dimensions in mm

Fig 10. Wave soldering footprint SOD323 (SC-76)

msa433

1.65

0.50

(2×)

2.10

1.60

2.80

0.60

3.05

0.500.95

solder lands

solder resist

occupied area

solder paste

msa415

1.40

4.40

5.00

1.202.75

preferred transport direction during soldering

solder lands

solder resist

occupied area

RB751_SER_1

Product data sheet Rev. 01 — 21 May 2007 8 of 10

Nexperia RB751 series

Schottky barrier single diodes

11. Revision history

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

RB751_SER_1 20070521 Product data sheet - -

RB751_SER_1

Product data sheet Rev. 01 — 21 May 2007 9 of 10

Nexperia RB751 series

Schottky barrier single diodes

12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Deﬁnitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nexperia.com.

12.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. Nexperia does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local Nexperia sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

12.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable.However,Nexperiadoesnotgiveanyrepresentationsor

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

Right to make changes — Nexperiareservestherighttomake

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — Nexperia products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunctionofaNexperiaproductcanreasonablybeexpectedto

result in personal injury, death or severe property or environmental damage.

Nexperia accepts no liability for inclusion and/or use of Nexperia products in

such equipment or applications and therefore

such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. Nexperia makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — Nexperia products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nexperia.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by Nexperia. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

12.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

13. Contact information

For additional information, please visit: http://www.nexperia.com

For sales ofﬁce addresses, send an email to: salesaddresses@nexperia.com

Document status[1][2] Product status[3] Deﬁnition

Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development.

Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation.

Product [short] data sheet Production This document contains the product speciﬁcation.

Nexperia RB751 series

Schottky barrier single diodes

14. Contents

1 Product proﬁle . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5

9 Packing information. . . . . . . . . . . . . . . . . . . . . . 5

10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9

12.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

13 Contact information. . . . . . . . . . . . . . . . . . . . . . 9

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

For more information, please visit: http://www.nexperia.com

For sales office addresses, please send an email to: salesaddresses@nexperia.com

Date of release:

21 May 2007