© Semiconductor Components Industries, LLC, 2015
November, 2018 − Rev. 18
1Publication Order Number:
NL17SZ07/D
NL17SZ07
Single Non-Inverting Buffer
with Open Drain Output
The NL17SZ07 is a single non−inverting buffer with open drain
outputs in tiny footprint packages.
Features
•Designed for 1.65 V to 5.5 V VCC Operation
•2.3 ns tPD at VCC = 5 V (typ)
•Inputs/Outputs Overvoltage Tolerant up to 5.5 V
•IOFF Supports Partial Power Down Protection
•Sink 24 mA at 3.0 V
•Available in SC−88A, SC−74A, SOT−553, SOT−953 and UDFN6
Packages
•Chip Complexity < 100 FETs
•NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Figure 1. Logic Symbol
AY
1
See detailed ordering, marking and shipping information in the
package dimensions section on page 7 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
www.onsemi.com
XX = Specific Device Code
M = Date Code*
G= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
SC−88A
DF SUFFIX
CASE 419A
SOT−553
XV5 SUFFIX
CASE 463B
XX MG
G
XX MG
G
UDFN6
1.0 x 1.0
CASE 517BX
X M
1
SOT−953
P5 SUFFIX
CASE 527AE
X M
1
XXX MG
G
SC−74A
DBV SUFFIX
CASE 318BQ
XM
UDFN6
1.45 x 1.0
CASE 517AQ
1
NL17SZ07
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2
Figure 2. Pinout (Top View)
(SC−88A/SOT−553/SC−74A) SOT−953 UDFN6
VCC
NC
A
Y
GND
OVT
1
2
34
5
VCC
NC
A
Y
GND
1
2
34
5
1
2
3
6
5
4
VCC
GND
NC
Y
ANC
OVT
OVT
PIN ASSIGNMENT
(SC−88A/SOT−553/SC−74A)
Pin
1
2
3
4
5
Function
NC
A
GND
Y
VCC
PIN ASSIGNMENT (SOT−953)
Pin
1
2
3
4
5
Function
A
GND
NC
Y
VCC
PIN ASSIGNMENT (UDFN)
Pin
1
2
3
4
5
Function
NC
A
GND
Y
NC
6V
CC
Input
FUNCTION TABLE
Output
Y
L
Z
A
L
H
NL17SZ07
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3
MAXIMUM RATINGS
Symbol Characteristics Value Unit
VCC DC Supply Voltage UDFN6, SOT−553, SC−88A (NLV)
SC−74A, SC−88A, SOT−953
−0.5 to +7.0
−0.5 to +6.5
V
VIN DC Input Voltage UDFN6, SOT−553, SC−88A (NLV)
SC−74A, SC−88A, SOT−953
−0.5 to +7.0
−0.5 to +6.5
V
VOUT DC Output Voltage Active−Mode (High or Low State)
SC−88A (NLV), Tri−State Mode (Note 1)
UDFN6, SOT−553 Power−Down Mode (VCC = 0 V)
−0.5 to VCC + 0.5
−0.5 to +7.0
−0.5 to +7.0
V
DC Output Voltage Active−Mode (High or Low State)
SC−74A, SC−88A, SOT−953 Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
−0.5 to VCC + 0.5
−0.5 to +6.5
−0.5 to +6.5
V
IIK DC Input Diode Current VIN < GND −50 mA
IOK DC Output Diode Current VOUT < GND ±50 mA
IOUT DC Output Source/Sink Current ±50 mA
ICC or IGND DC Supply Current per Supply Pin or Ground Pin ±100 mA
TSTG Storage Temperature Range −65 to +150 °C
TLLead Temperature, 1 mm from Case for 10 secs 260 °C
TJJunction Temperature Under Bias +150 °C
qJA Thermal Resistance (Note 2) SC−88A
SC−74A
SOT−553
SOT−953
UDFN6
659
555
562
560
382
°C/W
PDPower Dissipation in Still Air SC−88A
SC−74A
SOT−553
SOT−953
UDFN6
190
225
222
223
327
mW
MSL Moisture Sensitivity Level 1 −
FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in −
VESD ESD Withstand Voltage (Note 3) Human Body Model
Charged Device Model
2000
1000
V
ILatchup Latchup Performance (Note 4) $100 mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow.
3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to
EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A.
4. Tested to EIA/JESD78 Class II.
NL17SZ07
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4
RECOMMENDED OPERATING CONDITIONS
Symbol Characteristics Min Max Unit
VCC Positive DC Supply Voltage 1.65 5.5 V
VIN DC Input Voltage 0 5.5 V
VOUT DC Output Voltage Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
0
0
0
VCC
5.5
5.5
TAOperating Temperature Range −55 +125 °C
tr , tfInput Rise and Fall Time VCC = 3.0 V to 3.6 V
(SC−88A (NLV), UDFN6, SOT−553) VCC = 4.5 V to 5.5 V
0
0
100
20
ns/V
Input Rise and Fall Time VCC = 1.65 V to 1.95 V
(SC−74A, SC−88A, SOT−953) VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
0
0
0
0
20
20
10
5
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Condition
VCC
(V)
TA = 255C−555C 3 TA 3 1255C
Units
Min Typ Max Min Max
VIH High−Level Input
Voltage
1.65 to 1.95 0.65 VCC − − 0.65 VCC −V
2.3 to 5.5 0.70 VCC − − 0.70 VCC −
VIL Low−Level Input
Voltage
1.65 to 1.95 − − 0.35 VCC −0.35 VCC V
2.3 to 5.5 − − 0.30 VCC −0.30 VCC
VOL Low−Level Output
Voltage
VIN = VIH or VIL
IOL = 100 mA
IOL = 4 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
−
−
−
−
−
−
−
0.08
0.2
0.22
0.28
0.38
0.42
0.1
0.24
0.3
0.4
0.4
0.55
0.55
−
−
−
−
−
−
−
0.1
0.24
0.3
0.4
0.4
0.55
0.55
V
IIN Input Leakage Current VIN = 5.5 V or GND 1.65 to 5.5 − − ±0.1* −±1.0 mA
IOZ 3−State Output
Leakage Current
VOUT = 0 V to 5.5 V 1.65 to 5.5 − − ±0.5 −±5.0 mA
IOFF Power Off Leakage
Current
VIN = 5.5 V or
VOUT = 5.5 V
0− − 1.0 −10 mA
ICC Quiescent Supply
Current
VIN = VCC or GND 5.5 − − 1.0 −10 mA
ICCT Quiescent Supply
Current
VIN = 3.0 V 3.6 − − 10 −100 mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
*Guaranteed by design.
NL17SZ07
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5
AC ELECTRICAL CHARACTERISTICS (tR = tF = 3.0 ns)
Symbol Parameter Condition
VCC
(V)
TA = 255C−555C 3 TA 3 1255C
Units
Min Typ Max Min Max
tPZL Propagation Delay,
(Figures 3 and 4)
1.65 to 1.95 −6.0 9.0 −9.5 ns
2.3 to 2.7 −3.6 6.1 −6.5
3.0 to 3.6 −2.7 5.6 −6.0
4.5 to 5.5 −2.1 4.4 −4.8
tPLZ Propagation Delay,
(Figures 3 and 4)
1.65 to 1.95 −4.0 9.0 −9.5 ns
2.3 to 2.7 −2.8 6.1 −6.5
3.0 to 3.6 −2.5 5.6 −6.0
4.5 to 5.5 2.2 4.4 −4.8
CAPACITIVE CHARACTERISTICS (tR = tF = 3.0 ns)
Symbol Parameter Condition Typical Units
CIN Input Capacitance VCC = 5.5 V, VIN = 0 V or VCC 2.5 pF
COUT Output Capacitance VCC = 5.5 V, VIN = 0 V or VCC 4.0 pF
CPD Power Dissipation Capacitance
(Note 5)
10 MHz, VCC = 5.5 V, VIN = 0 V or VCC 4.0 pF
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
NL17SZ07
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6
Figure 3. Test Circuit
CL includes probe and jig capacitance
RT is ZOUT of pulse generator (typically 50 W)
f = 1 MHz
R1
OUTPUT
RT
2 x VCC
DUT
GND
OPEN
CL*
RL
Test Switch
Position
CL, pF RL, WR1, W
tPLH / tPHL Open See AC Characteristics Table
tPLZ / tPZL 2 x VCC 50 500 500
tPHZ / tPZH GND 50 500 500
X = Don’t Care
tr = 3 ns
tPZH tPHZ
tPZL tPLZ
Vmo
Vmo
Vmi
Figure 4. Switching Waveforms
90%
10%
90%
10%
INPUT
OUTPUT
OUTPUT
~0 V
INPUT
OUTPUT
OUTPUT
tf = 3 ns
VCC
GND
VOH
VOL
VOH
VOL
Vmo
Vmo
Vmi
tPHL tPLH
tPLH tPHL
Vmo
Vmo
Vmi Vmi
VCC
GND
VOL
VOH
VOH − VY
VOL + VY
~VCC
VCC, V Vmi, V
Vmo, V
VY
, V
tPLH, tPHL tPZL, tPLZ, tPZH, tPHZ
1.65 to 1.95 VCC/2 (VOH − VOL)/2 VCC/2 0.15
2.3 to 2.7 VCC/2 (VOH − VOL)/2 VCC/2 0.15
3.0 to 3.6 VCC/2 (VOH − VOL)/2 VCC/2 0.3
4.5 to 5.5 VCC/2 (VOH − VOL)/2 VCC/2 0.3
NL17SZ07
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7
DEVICE ORDERING INFORMATION
Device Packages Specific Device Code
Pin 1 Orientation
(See below) Shipping†
NL17SZ07DFT2G SC−88A L7 Q4 3000 / Tape & Reel
NLV17SZ07DFT2G* SC−88A L7 Q4 3000 / Tape & Reel
NL17SZ07DBVT1G
(In Development)
SC−74A TBD Q4 3000 / Tape & Reel
NL17SZ07XV5T2G SOT−553 L7 Q4 3000 / Tape & Reel
NL17SZ07P5T5G SOT−953 D
(Rotated 180° CW)
Q2 4000 / Tape & Reel
NL17SZ07MU1TCG
(In Development)
UDFN6, 1.45 x 1.0 x 0.35P TBD Q4 3000 / Tape & Reel
NL17SZ07MU3TCG
(In Development)
UDFN6, 1.0 x 1.0 x 0.35P TBD Q4 3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
Pin 1 Orientation in Tape and Reel
NL17SZ07
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8
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
1.80 2.200.071 0.087
INCHES
B1.15 1.350.045 0.053
C0.80 1.100.031 0.043
D0.10 0.300.004 0.012
G0.65 BSC0.026 BSC
H--- 0.10---0.004
J0.10 0.250.004 0.010
K0.10 0.300.004 0.012
N0.20 REF0.008 REF
S2.00 2.200.079 0.087
B0.2 (0.008) MM
12 3
45
A
G
S
D 5 PL
H
C
N
J
K
−B−
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
ǒmm
inchesǓ
SCALE 20:1
0.65
0.025
0.65
0.025
0.50
0.0197
0.40
0.0157
1.9
0.0748
SOLDER FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NL17SZ07
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9
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM MIN MAX
MILLIMETERS
D
E1
A0.90 1.10
b0.25 0.50
e0.95 BSC
A1 0.01 0.10
c0.10 0.26
L0.20 0.60
M0 10
E2.50 3.00
123
54
E
D
E1
b
A
c
__
0.20
5X
CAB
CSEATING
PLANE
L
M
DETAIL A
TOP VIEW
SIDE VIEW
A
B
END VIEW
1.35 1.65
2.85 3.15
2.40
0.70
5X
DIMENSIONS: MILLIMETERS
RECOMMENDED
0.95
PITCH
1.00
5X
e
A1
0.05
DETAIL A
NL17SZ07
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10
PACKAGE DIMENSIONS
SOT−553, 5 LEAD
CASE 463B
ISSUE C
1.35
0.0531
0.5
0.0197
ǒmm
inchesǓ
SCALE 20:1
0.5
0.0197
1.0
0.0394
0.45
0.0177
0.3
0.0118
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
eM
0.08 (0.003) X
b5 PL
A
c
−X−
−Y−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
D
E
Y
12 3
45
L
HEDIM
A
MIN NOM MAX MIN
MILLIMETERS
0.50 0.55 0.60 0.020
INCHES
b0.17 0.22 0.27 0.007
c
D1.55 1.60 1.65 0.061
E1.15 1.20 1.25 0.045
e0.50 BSC
L0.10 0.20 0.30 0.004
0.022 0.024
0.009 0.011
0.063 0.065
0.047 0.049
0.008 0.012
NOM MAX
1.55 1.60 1.65 0.061 0.063 0.065
HE
0.08 0.13 0.18 0.003 0.005 0.007
0.020 BSC
NL17SZ07
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11
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
E
D
C
A
HE
123
45
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
DIM MIN NOM MAX
MILLIMETERS
A0.34 0.37 0.40
b0.10 0.15 0.20
C0.07 0.12 0.17
D0.95 1.00 1.05
E0.75 0.80 0.85
e0.35 BSC
L
0.95 1.00 1.05
HE
X
Y
PIN ONE
INDICATOR
b
5X
X0.08 Y
L
5X
L3
L2
e
5X
5X
L2 0.05 0.10 0.15
L3 −−− −−− 0.15
0.175 REF
TOP VIEW
SIDE VIEW
BOTTOM VIEW 1.20
DIMENSIONS: MILLIMETERS
0.20
5X
1
PACKAGE
OUTLINE
0.35
PITCH
0.35
5X
NL17SZ07
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12
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
ÉÉÉ
ÉÉÉ
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L6X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
6X
A
A1
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
13
46
DIM MIN MAX
MILLIMETERS
A0.45 0.55
A1 0.00 0.05
b0.20 0.30
D1.45 BSC
E1.00 BSC
e0.50 BSC
L0.30 0.40
L1 −−− 0.15
DIMENSIONS: MILLIMETERS
0.30
6X
1.24
0.53
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.50
1
MOUNTING FOOTPRINT
PACKAGE
OUTLINE
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
L
ÉÉÉ
ÉÉÉ
ÉÉÉ
DETAIL B
MOLD CMPDEXPOSED Cu
OPTIONAL
CONSTRUCTIONS
A2 0.07 REF
6X
A2
DETAIL B
DETAIL A
NL17SZ07
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13
PACKAGE DIMENSIONS
ÉÉÉ
ÉÉÉ
UDFN6, 1x1, 0.35P
CASE 517BX
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
6X
6X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIMENSION: MILLIMETERS
RECOMMENDED
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTION
ÉÉ
ÉÉ
ÇÇ
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTION
0.52
1.20
0.25
0.35
PITCH
PACKAGE
OUTLINE 1
DIM MIN MAX
MILLIMETERS
A0.50 0.65
A1 0.00 0.05
A3 0.13 REF
b0.17 0.23
D1.00 BSC
E1.00 BSC
e0.35
L0.20 0.40
L1 −−− 0.15
L3
L3 0.26 0.33
A B
E
D
BOTTOM VIEW
b
e
6X
L6X
NOTE 3
0.08 C
PIN ONE
REFERENCE
TOP VIEW
0.08 C
A
A1
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
13
46
2X
2X
A3
DETAIL B
A
M
0.07 BC
M
0.05 C
DETAIL A
NL17SZ07/D
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