NCV8705 500 mA, Ultra-Low Quiescent Current, IQ 13 mA, Ultra-Low Noise, LDO Voltage Regulator www.onsemi.com The NCV8705 is a low noise, low power consumption and low dropout Linear Voltage Regulator. With its excellent noise and PSRR specifications, the device is ideal for use in products utilizing RF receivers, imaging sensors, audio processors or any component requiring an extremely clean power supply. The NCV8705 uses an innovative Adaptive Ground Current circuit to ensure ultra low ground current during light load conditions. MARKING DIAGRAM 1 WDFN6, 2x2 CASE 511BR XX M XX = Specific Device Code M = Date Code Features 1 * Operating Input Voltage Range: 2.5 V to 5.5 V * Available - Fixed Voltage Option: 0.8 V to 3.5 V * * * * * * * * * * * * * DFN8, 3x3 CASE 506DB 1 Available - Adjustable Voltage Option: 0.8 V to 5.5 V-VDROP Reference Voltage 0.8 V Ultra-Low Quiescent Current of Typ. 13 mA Ultra-Low Noise: 12 mVRMS from 100 Hz to 100 kHz Very Low Dropout: 230 mV Typical at 500 mA 2% Accuracy Over Load/Line/Temperature High PSRR: 71 dB at 1 kHz Internal Soft-Start to Limit the Turn-On Inrush Current Thermal Shutdown and Current Limit Protections Stable with a 1 mF Ceramic Output Capacitor Active Output Discharge for Fast Turn-Off Wettable Flank Package Option Available NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q100 Qualified and PPAP Capable These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant 1 1 A L Y W G CIN 1 mF ON OFF OUT NCV8705 EN N/C GND = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package PIN CONNECTIONS 1 2 3 OUT 1 8 IN N/C 2 7 N/C N/C or ADJ 3 GND 4 6 EXP 5 4 WDFN6 2x2 mm (Top View) * ADAS, Infotainment & Cluster, and Telematics * General Purpose Automotive & Industrial * Building & Factory Automation, Smart Meters IN 8705L XXX ALYWG G (Note: Microdot may be in either location) Typical Applicaitons VIN DFNW8, 3x3 CASE 507AD 8705W XXX ALYWG G EXP 6 N/C 5 EN DFN8/DFNW8 3x3 mm (Top View) ORDERING INFORMATION See detailed ordering, marking and shipping information in the package dimensions section on page 20 of this data sheet. VOUT VIN 1 mF CIN COUT 1 mF OFF OUT IN NCV8705 EN ADJ ON GND VOUT R1 C1 COUT 1 mF R2 Fixed Voltage Version Adjustable Voltage Version Figure 1. Typical Application Schematic (c) Semiconductor Components Industries, LLC, 2017 February, 2017 - Rev. 8 1 Publication Order Number: NCV8705/D NCV8705 IN ENABLE LOGIC EN BANDGAP REFERENCE UVLO INTEGRATED SOFT-START THERMAL SHUTDOWN MOSFET DRIVER WITH CURRENT LIMIT OUT AUTO LOW POWER MODE ACTIVE DISCHARGE EN GND IN ENABLE LOGIC EN BANDGAP REFERENCE UVLO INTEGRATED SOFT-START THERMAL SHUTDOWN MOSFET DRIVER WITH CURRENT LIMIT OUT AUTO LOW POWER MODE ACTIVE DISCHARGE ADJ EN GND Figure 2. Simplified Schematic Block Diagrams www.onsemi.com 2 NCV8705 Table 1. PIN FUNCTION DESCRIPTION Pin Name Pin No. - Fixed DFN8/DFNW8 Pin No. - Adjustable DFN8/DFNW8 Pin No. - Fixed WDFN6 Pin No. - Adjustable WDFN6 OUT 1 1 1 1 Regulated output voltage pin. A small 1 mF ceramic capacitor is needed from this pin to ground to assure stability. GND 4 4 3 3 Power supply ground. Expose pad must be tied with GND pin. Soldered to the copper plane allows for effective heat dissipation. EN 5 5 4 4 Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode. IN 8 8 6 6 Input pin. A small capacitor is needed from this pin to ground to assure stability. ADJ - 3 - 2 Feedback pin for set-up output voltage. Use resistor divider for voltage selection. N/C 2, 3, 6, 7 2, 6, 7 2, 5 5 Not connected. This pin can be tied to ground to improve thermal dissipation. Description Table 2. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit VIN -0.3 V to 6 V V Output Voltage VOUT -0.3 V to VIN + 0.3 V V Enable Input VEN -0.3 V to VIN + 0.3 V V Adjustable Input VADJ -0.3 V to VIN + 0.3 V V tSC Indefinite s TJ(MAX) 125 C TSTG -55 to 150 C ESD Capability, Human Body Model (Note 2) ESDHBM 2000 V ESD Capability, Machine Model (Note 2) ESDMM 200 V Input Voltage (Note 1) Output Short Circuit Duration Maximum Junction Temperature Storage Temperature Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC-Q100-002 (EIA/JESD22-A114) ESD Machine Model tested per AEC-Q100-003 (EIA/JESD22-A115) Latchup Current Maximum Rating tested per JEDEC standard: JESD78. Table 3. THERMAL CHARACTERISTICS (Note 3) Symbol Value Thermal Characteristics, WDFN6 2x2 mm Thermal Resistance, Junction-to-Air Thermal Resistance Parameter, Junction-to-Board qJA YJB 116.5 30 Thermal Characteristics, DFN8 3x3 mm / DFNW8 3x3 mm Thermal Resistance, Junction-to-Air Thermal Resistance Parameter, Junction-to-Board qJA YJB 92.6 35.1 Rating 3. Single component mounted on 1 oz, FR 4 PCB with 645 mm2 Cu area. www.onsemi.com 3 Unit C/W C/W NCV8705 Table 4. ELECTRICAL CHARACTERISTICS -40C TJ 125C; VIN = VOUT(NOM) + 0.5 V or 2.5 V, whichever is greater; VEN = 0.9 V, IOUT = 10 mA, CIN = COUT = 1 mF unless otherwise noted. Typical values are at TJ = +25C. (Note 4) Parameter Test Conditions Operating Input Voltage Output Voltage Range (Adjustable) Symbol Min Max Unit VIN 2.5 5.5 V VOUT 0.8 5.5- VDO V 1.9 V +2 % Undervoltage Lock-out VIN rising UVLO 1.2 Output Voltage Accuracy VOUT + 0.5 V VIN 5.5 V, IOUT = 0 - 500 mA VOUT -2 Reference Voltage Typ VREF VREF 1.6 0.8 Reference Voltage Accuracy IOUT = 10 mA Line Regulation VOUT + 0.5 V VIN 4.5 V, IOUT = 10 mA VOUT + 0.5 V VIN 5.5 V, IOUT = 10 mA RegLINE 550 750 mV/V Load Regulation IOUT = 0 mA to 500 mA RegLOAD 12 mV/mA Load Transient IOUT = 1 mA to 500 mA or 500 mA to 1 mA in 1 ms, COUT = 1 mF TranLOAD 120 mV Dropout Voltage (Note 5) IOUT = 500 mA, VOUT(nom) = 2.8 V VDO 230 350 mV Output Current Limit VOUT = 90% VOUT(nom) ICL 750 950 mA Quiescent Current IOUT = 0 mA IQ 13 25 mA Ground Current IOUT = 500 mA IGND 260 mA Shutdown Current VEN 0.4 V, TJ = +25C IDIS 0.12 mA VEN 0 V, VIN = 2.0 to 4.5 V, TJ = -40 to +85C IDIS 0.55 EN Pin Threshold Voltage High Threshold Low Threshold VEN Voltage increasing VEN Voltage decreasing EN Pin Input Current VEN = 5.5 V ADJ Pin Current VADJ = 0.8 V Turn-On Time COUT = 1.0 mF, from assertion EN pin to 98% VOUT(nom) Power Supply Rejection Ratio VIN = 3.8 V, VOUT = 2.8 V (Fixed), IOUT = 500 mA Output Noise Voltage -2 V 510 +2 2 % mA V VEN_HI VEN_LO 0.9 0.4 IEN 100 1 nA tON 150 ms PSRR 73 71 56 dB VOUT = 2.5 V (Fixed), VIN = 3.5 V, IOUT = 500 mA f = 100 Hz to 100 kHz VN 12 mVrms Thermal Shutdown Temperature Temperature increasing from TJ = +25C TSD 160 C Thermal Shutdown Hysteresis Temperature falling from TSD TSDH f = 100 Hz f = 1 kHz f = 10 kHz - 20 500 - nA C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at TJ = TA = 25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 5. Characterized when VOUT falls 100 mV below the regulated voltage at VIN = VOUT(NOM) + 0.5 V. www.onsemi.com 4 NCV8705 TYPICAL CHARACTERISTICS OUTPUT VOLTAGE NOISE (mV/rtHz) 10 1 IOUT = 10 mA IOUT IOUT = 500 mA 0.1 0.01 VIN = 2.5 V VOUT = 0.8 V CIN = COUT = 1 mF MLCC, X7R, 1206 size 0.001 0.01 0.1 IOUT = 100 mA RMS Output Noise (mV) 10 Hz - 100 kHz 100 Hz - 100 kHz 18.21 10 mA 19.06 100 mA 15.99 15.04 300 mA 14.42 13.39 500 mA 13.70 12.60 IOUT = 300 mA 1 100 10 1000 FREQUENCY (kHz) Figure 3. Output Voltage Noise Spectral Density for VOUT = 0.8 V, COUT = 1 mF OUTPUT VOLTAGE NOISE (mV/rtHz) 10 IOUT = 100 mA 1 IOUT = 10 mA IOUT 0.1 0.01 VIN = 2.5 V VOUT = 0.8 V CIN = 1 mF COUT = 10 mF MLCC, X7R, 1206 size 0.001 0.01 IOUT = 500 mA RMS Output Noise (mV) 10 Hz - 100 kHz 100 Hz - 100 kHz 15.28 10 mA 16.17 100 mA 16.41 15.65 300 mA 14.94 14.10 500 mA 14.08 13.11 IOUT = 300 mA 0.1 1 10 100 1000 FREQUENCY (kHz) Figure 4. Output Voltage Noise Spectral Density for VOUT = 0.8 V, COUT = 10 mF OUTPUT VOLTAGE NOISE (mV/rtHz) 10 1 IOUT = 100 mA IOUT IOUT = 300 mA 0.1 0.01 10 mA VIN = 3.8 V VOUT = 3.3 V CIN = COUT = 1 mF MLCC, X7R, 1206 size 0.001 0.01 0.1 IOUT = 500 mA RMS Output Noise (mV) 10 Hz - 100 kHz 100 Hz - 100 kHz 18.12 15.39 100 mA 16.42 13.50 300 mA 16.35 12.47 500 mA 16.00 12.10 IOUT = 10 mA 1 10 100 1000 FREQUENCY (kHz) Figure 5. Output Voltage Noise Spectral Density for VOUT = 3.3 V, COUT = 1 mF www.onsemi.com 5 NCV8705 TYPICAL CHARACTERISTICS OUTPUT VOLTAGE NOISE (mV/rtHz) 10 IOUT = 300 mA 1 IOUT = 10 mA IOUT IOUT = 100 mA 0.1 0.01 VIN = 3.8 V VOUT = 3.3 V CIN = 1 mF COUT = 10 mF MLCC, X7R, 1206 size 0.001 0.01 RMS Output Noise (mV) 10 Hz - 100 kHz 100 Hz - 100 kHz 14.07 1 mA 17.35 100 mA 17.43 14.29 300 mA 16.55 13.33 500 mA 16.48 13.20 IOUT = 500 mA 0.1 1 10 100 1000 FREQUENCY (kHz) Figure 6. Output Voltage Noise Spectral Density for VOUT = 3.3 V, COUT = 10 mF OUTPUT VOLTAGE NOISE (mV/rtHz) 10 VOUT = 3.3 V, R1 = 25k, R2 = 8.2k 1 VOUT 0.1 0.01 VOUT = 1.5 V, R1 = 15k, R2 = 13k RMS Output Noise (mV) 10 Hz - 100 kHz 100 Hz - 100 kHz 1.5 V 31.40 30.33 3.3 V 49.14 44.30 VIN = VOUT =+1 V CIN = 1 mF COUT = 10 mF IOUT = 10 mA 0.001 0.01 0.1 1 10 100 1000 FREQUENCY (kHz) Figure 7. Output Voltage Noise Spectral Density for Adjustable Version - Different Output Voltage OUTPUT VOLTAGE NOISE (mV/rtHz) 10 C1 = none C1 = 100 pF 1 C1 = 1 nF C1 = 10 nF IOUT 0.1 0.01 VIN = 4.3 V VOUT = 3.3 V R1 = 255k, R2 = 82k CIN = COUT = 1 mF IOUT = 10 mA 0.001 0.01 0.1 1 10 100 RMS Output Noise (mV) 10 Hz - 100 kHz 100 Hz - 100 kHz none 50.17 43.85 100 pF 46.90 40.39 1 nF 36.92 27.99 10 nF 27.02 18.31 1000 FREQUENCY (kHz) Figure 8. Output Voltage Noise Spectral Density for Adjustable Version for Various C1 www.onsemi.com 6 NCV8705 TYPICAL CHARACTERISTICS 160 400 350 IGND, GROUND CURRENT (mA) IGND, GROUND CURRENT (mA) 450 VOUT = 0.8 V 300 VOUT = 3.3 V 250 VOUT = 2.5 V 200 150 VIN = VOUT + 0.5 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 100 50 0 0 50 VOUT = 0.8 V 80 60 VIN = VOUT + 0.5 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 40 20 0 0.25 0.5 0.75 1 1.25 1.5 1.75 IOUT, OUTPUT CURRENT (mA) Figure 9. Ground Current vs. Output Current Figure 10. Ground Current vs. Output Current from 0 mA to 2 mA 2 160 IGND, GROUND CURRENT (mA) IGND, GROUND CURRENT (mA) VOUT = 2.5 V 100 IOUT, OUTPUT CURRENT (mA) 300 250 TJ = 125C 200 TJ = 25C 150 VIN = 3.8 V VOUT = 3.3 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size TJ = -40C 100 50 0 0 50 100 150 200 140 120 100 TJ = 125C 80 TJ = 25C 60 40 TJ = -40C 20 VIN = 3.8 V VOUT = 3.3 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 0 250 300 350 400 450 500 0 0.25 0.5 0.75 1 1.25 1.5 1.75 IOUT, OUTPUT CURRENT (mA) IOUT, OUTPUT CURRENT (mA) Figure 11. Ground Current vs. Output Current at Temperatures Figure 12. Ground Current vs. Output Current 0 mA to 2 mA at Temperature 320 VDROP, DROPOUT VOLTAGE (mV) 16 IQ, QUIESCENT CURRENT (mA) VOUT = 3.3 V 120 0 250 300 350 400 450 500 100 150 200 140 VOUT = 3.3 V 14 12 VOUT = 2.5 V 10 VOUT = 0.8 V 8 6 VIN = VOUT + 0.5 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 4 2 0 -40 VIN = VOUT + 0.5 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 280 240 200 2 TJ = 125C TJ = 25C 160 120 80 TJ = -40C 40 0 -20 0 20 40 60 80 100 120 140 0 50 100 150 200 250 300 350 400 450 500 TJ, JUNCTION TEMPERATURE (C) IOUT, OUTPUT CURRENT (mA) Figure 13. Quiescent Current vs. Temperature Figure 14. Dropout Voltage vs. Output Current at Temperature (2.5 V) www.onsemi.com 7 NCV8705 TYPICAL CHARACTERISTICS 400 VIN = VOUT + 0.5 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 280 240 200 160 VDROP, DROPOUT VOLTAGE (mV) VDROP, DROPOUT VOLTAGE (mV) 320 TJ = 125C TJ = 25C 120 80 TJ = -40C 40 0 0 50 100 150 200 250 300 350 400 VIN = VOUT + 0.5 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 350 300 200 IOUT = 300 mA 150 100 IOUT = 0 mA 50 0 -40 450 500 -20 0 IOUT, OUTPUT CURRENT (mA) 250 IOUT = 500 mA 200 IOUT = 300 mA 150 100 IOUT = 0 mA 50 0 -40 VOUT, OUTPUT VOLTAGE (V) 4 VIN = VOUT + 0.5 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size VOUT, OUTPUT VOLTAGE (V) 300 40 60 80 100 120 140 Figure 16. Dropout Voltage vs. Temperature (2.5 V) IIN = 0 mA COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 3.5 3 2.5 VOUT = 3.3 V VOUT = 2.5 V 2 1.5 VOUT = 0.8 V 1 0.5 0 -20 0 20 40 60 80 100 120 140 0 1 3 2 4 6 5 TJ, JUNCTION TEMPERATURE (C) VIN, INPUT VOLTAGE (V) Figure 17. Dropout Voltage vs. Temperature, (3.3 V) Figure 18. Input Voltage vs. Output Voltage 0.8014 0.8012 0.8010 0.8008 0.8006 0.8004 0.8002 0.8000 0.7998 0.7996 0.7994 0.7992 0.7990 -40 -20 VIN = 2.5 V VOUT = 0.8 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 0 20 40 60 80 100 120 VOUT, OUTPUT VOLTAGE (V) VDROP, DROPOUT VOLTAGE (mV) 350 20 TJ, JUNCTION TEMPERATURE (C) Figure 15. Dropout Voltage vs. Output Current at Temperatures (3.3 V) 400 IOUT = 500 mA 250 140 1.804 1.803 1.802 1.801 1.800 1.799 1.798 1.797 1.796 1.795 1.794 1.793 1.792 -40 -20 VIN = 3 V VOUT = 2.5 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 0 20 40 60 80 100 120 140 TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C) Figure 19. Output Voltage vs. Temperature, (0.8 V) Figure 20. Output Voltage vs. Temperature, (2.5 V) www.onsemi.com 8 NCV8705 TYPICAL CHARACTERISTICS VIN = 3.8 V VOUT = 3.3 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 0 20 40 60 80 REGLINE, LINE REGULATION (mV/V) 100 120 140 VIN = 3.8 V VOUT = 3.3 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 950 900 850 800 750 700 -40 -20 0 20 40 60 80 100 120 140 600 580 560 540 520 VIN = 2.5 V VOUT = 1.8 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 500 -40 -20 0 20 40 60 80 100 120 140 8 7 6 5 VIN = 2.5 V VOUT = 1.8 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 4 3 2 1 0 -40 -20 0 20 40 60 80 100 120 140 TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C) Figure 23. Line Regulation vs. Temperature, (3.3 V) Figure 24. Load Regulation vs. Temperature, (1.8 V) 0.3 VIN = 3.8 V VOUT = 3.3 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size IDIS, DISABLE CURRENT (mA) 5 620 Figure 22. Line Regulation vs. Temperature, (1.8 V) 1000 6 640 Figure 21. Output Voltage vs. Temperature, (3.3 V) 1050 7 660 TJ, JUNCTION TEMPERATURE (C) 1150 8 680 TJ, JUNCTION TEMPERATURE (C) 1200 REGLOAD, LOAD REGULATION (mV/mA) REGLINE, LINE REGULATION (mV/V) 700 REGLOAD, LOAD REGULATION (mV/mA) VOUT, OUTPUT VOLTAGE (V) 3.305 3.304 3.303 3.302 3.301 3.300 3.299 3.298 3.297 3.296 3.295 3.294 3.293 -40 -20 4 3 2 1 0 -40 -20 0 20 40 60 80 100 120 0.25 0.2 0.15 VEN 0.4 V RL = 330 W COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size VIN = 4.5 V 0.1 0.05 VIN = 2.3 V 0 -0.05 -40 -20 140 0 20 40 60 80 100 120 140 TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C) Figure 25. Load Regulation vs. Temperature, (3.3 V) Figure 26. Disable Current vs. Temperature www.onsemi.com 9 NCV8705 750 120 735 ICL, CURRENT LIMIT (mA) VEN = 5.5 V 100 80 VEN = 0.4 V 60 VIN = 3.8 V VOUT = 3.3 V RL = 330 W COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 40 20 0 -40 -20 0 20 40 60 80 100 120 720 705 VOUT = 1.8 V 690 675 660 VOUT = 3.3 V VIN = VOUT + 0.5 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 645 630 615 600 -40 -20 140 0 20 40 60 80 100 120 140 TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C) Figure 27. Enable Current vs. Temperature Figure 28. Current Limit vs. Temperature ISC, SHORT-CIRCUIT CURRENT (mA) 800 780 VOUT = 3.3 V 760 740 720 VOUT = 1.8 V 700 680 VIN = VOUT + 0.5 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 660 640 620 600 -40 -20 0 20 40 60 80 100 120 140 800 780 760 740 VOUT = 0.8 V CIN = 1 mF COUT = 1 mF MLCC, X7R 1206 size 720 700 680 660 640 620 600 2.5 3.00 3.50 4.00 4.50 5.00 TJ, JUNCTION TEMPERATURE (C) VIN, INPUT VOLTAGE (V) Figure 29. Short-Circuit vs. Temperature Figure 30. Short-Circuit Current vs. Temperature 1 1 0.9 0.9 VEN, ENABLE VOLTAGE (V) VEN, ENABLE VOLTAGE (V) ISC, SHORT-CIRCUIT CURRENT (mA) IEN, CURRENT TO ENABLE PIN (nA) TYPICAL CHARACTERISTICS 0.8 0.7 0.6 0.5 VIN = 3.8 V VOUT = 3.3 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 0.4 0.3 0.2 0.1 0 -40 -20 0 20 40 60 80 100 120 0.8 0.7 0.6 0.5 VIN = 3.8 V VOUT = 3.3 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 0.4 0.3 0.2 0.1 140 0 -40 -20 0 20 40 60 80 100 TJ, JUNCTION TEMPERATURE (C) TJ, JUNCTION TEMPERATURE (C) Figure 31. Enable Threshold (High) Figure 32. Enable Threshold (Low) www.onsemi.com 10 5.50 120 140 NCV8705 390 380 370 360 250 VIN = 3.8 V VOUT = 3.3 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size tSTART-UP, START-UP TIME (ms) 400 350 340 330 320 310 300 -40 -20 0 20 60 40 80 40 VIN = 2.8 V + 100 mVPP VOUT = 1.8 V COUT = 1 mF CIN = none MLCC, X7R, 1206 size 0.1 1 100 1k 20 40 60 80 100 120 140 IOUT = 10 mA IOUT = 100 mA IOUT = 300 mA IOUT = 500 mA 80 70 60 50 40 VIN = 3.8 V + 100 mVPP VOUT = 2.8 V COUT = 1 mF CIN = none MLCC, X7R, 1206 size 30 20 10 10k 0.01 0.1 1 10 100 1k Figure 36. Power Supply Rejection Ratio, VOUT = 2.8 V 60 50 VIN = 4.3 V + 100 mVPP VOUT = 3.3 V COUT = 1 mF CIN = none MLCC, X7R, 1206 size 0.1 1 80 70 60 50 40 VIN = 4.3 V + 100 mVPP VOUT = 3.3 V CIN = none MLCC, X7R, 1206 size 30 20 10 COUT = 1 mF COUT = 4.7 mF COUT = 10 mF 0 10 100 1k 10k 90 IOUT = 10 mA IOUT = 100 mA IOUT = 300 mA IOUT = 500 mA 0 0.01 0 Figure 35. Power Supply Rejection Ratio, VOUT = 1.8 V 70 10 160 FREQUENCY (kHz) 80 20 170 FREQUENCY (kHz) 90 30 180 0 10 100 40 VIN = 3.8 V VOUT = 3.3 V COUT = 1 mF CIN = 1 mF MLCC, X7R, 1206 size 190 90 IOUT = 10 mA IOUT = 100 mA IOUT = 300 mA IOUT = 500 mA 0 0.01 200 Figure 34. Start-up Time vs. Temperature 50 10 210 Figure 33. Discharge Resistance vs. Temperature 60 20 220 TJ, JUNCTION TEMPERATURE (C) 70 30 230 150 -40 -20 140 RR, RIPPLE REJECTION (dB) RR, RIPPLE REJECTION (dB) 120 240 TJ, JUNCTION TEMPERATURE (C) 80 RR, RIPPLE REJECTION (dB) 100 RR, RIPPLE REJECTION (dB) RDIS, ACTIVE DISCHARGE RESISTANCE () TYPICAL CHARACTERISTICS 10k 0.01 0.1 1 10 100 1k FREQUENCY (kHz) FREQUENCY (kHz) Figure 37. Power Supply Rejection Ratio, VOUT = 3.3 V Figure 38. Power Supply Rejection Ratio, VOUT = 3.3 V, IOUT = 10 mA - Different COUT www.onsemi.com 11 10k NCV8705 TYPICAL CHARACTERISTICS 90 80 70 60 50 40 30 20 10 VIN = 4.3 V + 100 mVPP VOUT = 3.3 V ILOAD = 500 mA CIN = none MLCC, X7R, 1206 size 0 0.01 0.1 1 10 100 1k C1 = none C1 = 100 pF C1 = 1 nF C1 = 10 nF C1 = 100 nF 70 60 50 40 30 20 10 VIN = 4.3 V + 100 mVPP VOUT = 3.3 V R1 = 225k, R2 = 82k ILOAD = 10 mA COUT = 1 mF MLCC, X7R, 1206 size 0 0.01 10k 0.1 1 10 100 1k FREQUENCY (kHz) Figure 40. Power Supply Rejection Ratio, VOUT = 3.3 V, IOUT = 500 mA - Different COUT ESR, EQUIVALENT SERIAL RESISTANCE (W) FREQUENCY (kHz) Figure 39. Power Supply Rejection Ratio, VOUT = 3.3 V, IOUT = 500 mA - Different COUT 10k 100 UNSTABLE REGION 10 VOUT = 0.8 V 1 VOUT = 3.3 V 0.1 STABLE REGION 0.01 0 50 100 150 200 250 300 350 400 450 500 IOUT, OUTPUT CURRENT (mA) VIN = 3.8 V VOUT = 3.3 V VEN = 1 V COUT = 1 mF CIN = 1 mF IOUT = 500 mA VOUT IINRUSH 1 V/div IINRUSH VEN 100 ms/div VIN = 3.8 V VOUT = 3.3 V VEN = 1 V COUT = 1 mF CIN = 1 mF IOUT = 500 mA VOUT 100 ms/div Figure 42. Enable Turn-on Response, COUT = 1 mF, IOUT = 10 mA Figure 43. Enable Turn-on Response, COUT = 1 mF, IOUT = 500 mA www.onsemi.com 12 200 mA/div 500 mV/div VEN 200 mA/div 500 mV/div Figure 41. Output Capacitor ESR vs. Output Current 1 V/div RR, RIPPLE REJECTION (dB) COUT = 1 mF COUT = 4.7 mF COUT = 10 mF RR, RIPPLE REJECTION (dB) 80 100 NCV8705 VOUT IINRUSH 1 V/div VIN = 3.8 V VOUT = 3.3 V VEN = 1 V COUT = 10 mF CIN = 1 mF IOUT = 500 mA VOUT 100 ms/div Figure 45. Enable Turn-on Response, COUT = 10 mF, IOUT = 500 mA tRISE = 1 ms 500 mV/div 100 ms/div VEN VIN = 2.5 V VOUT = 0.8 V VEN = 1 V IOUT = 10 mA VEN tFALL = 1 ms 20 mV/div VOUT VIN = 2.5 V VOUT = 0.8 V VEN = 1 V IOUT = 10 mA COUT = 10 mF COUT = 10 mF VOUT COUT = 1 mF 5 ms/div 5 ms/div Figure 46. Line Transient Response - Rising Edge, VOUT = 0.8 V, IOUT = 10 mA Figure 47. Line Transient Response - Falling Edge, VOUT = 0.8 V, IOUT = 10 mA VEN tRISE = 1 ms 500 mV/div 500 mV/div 20 mV/div COUT = 1 mF VIN = 3.8 V VOUT = 3.3 V VEN = 1 V IOUT = 10 mA VEN tFALL = 1 ms COUT = 1 mF VOUT VIN = 3.8 V VOUT = 3.3 V VEN = 1 V IOUT = 10 mA COUT = 10 mF COUT = 10 mF 20 mV/div 20 mV/div VIN = 3.8 V VOUT = 3.3 V VEN = 1 V COUT = 10 mF CIN = 1 mF IOUT = 500 mA Figure 44. Enable Turn-on Response, COUT = 10 mF, IOUT = 10 mA 500 mV/div 1 V/div IINRUSH VEN VOUT COUT = 1 mF 10 ms/div 10 ms/div Figure 48. Line Transient Response - Rising Edge, VOUT = 3.3 V, IOUT = 10 mA Figure 49. Line Transient Response - Falling Edge, VOUT = 3.3 V, IOUT = 10 mA www.onsemi.com 13 200 mA/div 500 mV/div VEN 200 mA/div 500 mV/div TYPICAL CHARACTERISTICS NCV8705 500 mV/div VEN tRISE = 1 ms COUT = 10 mF VOUT COUT = 1 mF 5 ms/div 10 ms/div Figure 50. Line Transient Response - Rising Edge, VOUT = 3.3 V, IOUT = 500 mA Figure 51. Line Transient Response - Falling Edge, VOUT = 3.3 V, IOUT = 500 mA IOUT VIN = 2.5 V VOUT = 0.8 V CIN = 1 mF (MLCC) tRISE = 1 ms IOUT tFALL = 1 ms COUT = 10 mF VOUT 50 mV/div VOUT 100 mV/div VIN = 2.5 V VOUT = 0.8 V CIN = 1 mF (MLCC) COUT = 1 mF COUT = 10 mF COUT = 1 mF 10 ms/div 100 ms/div Figure 52. Load Transient Response - Rising Edge, VOUT = 0.8 V, IOUT = 1 mA to 500 mA, COUT = 1 mF, 10 mF Figure 53. Load Transient Response - Falling Edge, VOUT = 0.8 V, IOUT = 1 mA to 500 mA, COUT = 1 mF, 10 mF 200 mA/div 200 mA/div VIN = 3.8 V VOUT = 3.3 V VEN = 1 V IOUT = 500 mA COUT = 10 mF VOUT 20 mV/div 20 mV/div tFALL = 1 ms VIN = 3.8 V VOUT = 3.3 V VEN = 1 V IOUT = 500 mA COUT = 1 mF 200 mA/div VEN 200 mA/div 500 mV/div TYPICAL CHARACTERISTICS VIN = 2.5 V VOUT = 0.8 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) IOUT VIN = 2.5 V VOUT = 0.8 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) IOUT tFALL_IOUT = 1 ms tRISE_IOUT = 10 ms VOUT 50 mV/div 100 mV/div VOUT tRISE_IOUT = 1 ms tFALL_IOUT = 10 ms 10 ms/div 10 ms/div Figure 54. Load Transient Response - Rising Edge, VOUT = 0.8 V, IOUT = 1 mA to 500 mA, tRISE_IOUT = 1 ms, 10 ms Figure 55. Load Transient Response - Falling Edge, VOUT = 0.8 V, IOUT = 1 mA to 500 mA, tFALL_IOUT = 1 ms, 10 ms www.onsemi.com 14 NCV8705 200 mA/div 200 mA/div TYPICAL CHARACTERISTICS VIN = 3.8 V VOUT = 3.3 V CIN = 1 mF (MLCC) IOUT VIN = 3.8 V VOUT = 3.3 V CIN = 1 mF (MLCC) IOUT COUT = 1 mF 50 mV/div VOUT COUT = 10 mF COUT = 1 mF 5 ms/div 50 ms/div Figure 56. Load Transient Response - Rising Edge, VOUT = 3.3 V, IOUT = 1 mA to 500 mA, COUT = 1 mF, 10 mF Figure 57. Load Transient Response - Falling Edge, VOUT = 3.3 V, IOUT = 1 mA to 500 mA, COUT = 1 mF, 10 mF 200 mA/div 200 mA/div 100 mV/div COUT = 10 mF VOUT VIN = 3.8 V VOUT = 3.3 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) IOUT IOUT tFALL_IOUT = 1 ms VOUT 50 mV/div 50 mV/div VOUT tRISE_IOUT = 10 ms tRISE_IOUT = 1 ms VIN = 3.8 V VOUT = 3.3 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) tFALL_IOUT = 10 ms 10 ms/div 50 ms/div Figure 58. Load Transient Response - Rising Edge, VOUT = 3.3 V, IOUT = 1 mA to 500 mA, tRISE_IOUT = 1 ms, 10 ms Figure 59. Load Transient Response - Falling Edge, VOUT = 3.3 V, IOUT = 1 mA to 500 mA, tFALL_IOUT = 1 ms, 10 ms 1 V/div VIN = 3.3 V IOUT = 1 mA CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) VIN = 5.5 V VOUT = 3.3 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) VOUT Short-Circuit 500 mA/div 600 mV/div VIN VOUT Thermal Shutdown IOUT 5 ms/div 20 ms/div Figure 60. Turn-on/off, Slow Rising VIN Figure 61. Short-Circuit and Thermal Shutdown www.onsemi.com 15 NCV8705 VIN = 5.5 V VOUT = 3.3 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) VOUT 500 mA/div 1 V/div TYPICAL CHARACTERISTICS VIN = 5.5 V VOUT = 3.3 V CIN = 1 mF (MLCC) COUT = 1 mF (MLCC) VEN COUT = 10 mF 1 V/div 500 mA/div VOUT IOUT COUT = 1 mF 50 ms/div 5 ms/div Figure 62. Short-Circuit Current Peak Figure 63. Enable Turn-off www.onsemi.com 16 NCV8705 APPLICATIONS INFORMATION General 10 The NCV8705 is a high performance 500 mA Low Dropout Linear Regulator. This device delivers excellent noise and dynamic performance. Thanks to its adaptive ground current feature the device consumes only 13 mA of quiescent current at no*load condition. The regulator features ultra*low noise of 12 mVRMS, PSRR of 71 dB at 1 kHz and very good load/line transient performance. Such excellent dynamic parameters and small package size make the device an ideal choice for powering the precision analog and noise sensitive circuitry in portable applications. The LDO achieves this ultra low noise level output without the need for a noise bypass capacitor. A logic EN input provides ON/OFF control of the output voltage. When the EN is low the device consumes as low as typ. 10 nA from the IN pin. The device is fully protected in case of output overload, output short circuit condition and overheating, assuring a very robust design. CAPACITY CHANGE (%) 0 -10 -20 -30 -40 Package Size -50 1206 0805 0603 0402 -60 -70 -80 0 1 2 3 4 5 6 DC BIAS (V) 7 8 9 10 Figure 64. Capacitance Change vs. DC Bias No-load Operation The regulator remains stable and regulates the output voltage properly within the 2% tolerance limits even with no external load applied to the output. Input Capacitor Selection (CIN) It is recommended to connect a minimum of 1 mF Ceramic X5R or X7R capacitor close to the IN pin of the device. This capacitor will provide a low impedance path for unwanted AC signals or noise modulated onto constant input voltage. There is no requirement for the min. /max. ESR of the input capacitor but it is recommended to use ceramic capacitors for their low ESR and ESL. A good input capacitor will limit the influence of input trace inductance and source resistance during sudden load current changes. Larger input capacitor may be necessary if fast and large load transients are encountered in the application. Adjustable Operation The output voltage range can be set from 0.8 V to 5.5 V-VDO by resistor divider network. Use Equations 1 and 2 to calculate appropriate values of resistors and output voltage. Typical current to ADJ pin is 1 nA. For output voltage 0.8 V ADJ pin can be tied directly to Vout pin. V OUT + 0.8 @ 1 ) R2 ^ R1 @ Output Decoupling (COUT) The NCV8705 requires an output capacitor connected as close as possible to the output pin of the regulator. The minimal capacitor value is 1 mF and X7R or X5R dielectric due to its low capacitance variations over the specified temperature range. The NCV8705 is designed to remain stable with minimum effective capacitance of 1 mF to account for changes with temperature, DC bias and package size. Especially for small package size capacitors such as 0402 the effective capacitance drops rapidly with the applied DC bias. Refer to the Figure 64, for the capacitance vs. package size and DC bias voltage dependence. There is no requirement for the minimum value of Equivalent Series Resistance (ESR) for the COUT but the maximum value of ESR should be less than 900 m. Larger output capacitors and lower ESR could improve the load transient response or high frequency PSRR as shown in typical characteristics. It is not recommended to use tantalum capacitors on the output due to their large ESR. The equivalent series resistance of tantalum capacitors is also strongly dependent on the temperature, increasing at low temperature. The tantalum capacitors are generally more costly than ceramic capacitors. R1 ) R 1 @ I ADJ R2 (eq. 1) 1 VOUT *1 0.8 (eq. 2) The resistor divider should be designed carefully to achieve the best performance. Recommended current through divider is 10 mA and more. Too high values of resistors (MW) cause increasing noise and longer start-up time. The suggested values of the resistors are in Table 5. To improve dynamic performance capacitor C1 should be at least 1 nF. Recommended range of capacity is between 10 nF and 100 nF. Higher value of capacitor C1 increasing start-up time. Table 5. Proposal Resistor Values for Various VOUT www.onsemi.com 17 VOUT R1 R2 1.5 V 130k 150k 3.3 V 256k 82k 5.0 V 430k 82k NCV8705 1 mF CIN OFF VOUT OUT IN NCV8705 EN ADJ ON GND R1 C1 Internal Soft-Start circuit NCV8705 contains an internal soft-start circuitry to protect against large inrush currents which could otherwise flow during the start-up of the regulator. Soft-start feature protects against power bus disturbances and assures a controlled and monotonic rise of the output voltage. COUT 1 mF R2 Thermal Shutdown Figure 65. NCV8705 Adjustable with Noise Improvement Capacitor When the die temperature exceeds the Thermal Shutdown threshold (TSD - 160C typical), Thermal Shutdown event is detected and the device is disabled. The IC will remain in this state until the die temperature decreases below the Thermal Shutdown Reset threshold (TSDU - 140C typical). Once the IC temperature falls below the 140C the LDO is enabled again. The thermal shutdown feature provides the protection from a catastrophic device failure due to accidental overheating. This protection is not intended to be used as a substitute for proper heat sinking. Enable Operation The NCV8705 uses the EN pin to enable/disable its device and to deactivate/activate the active discharge function. If the EN pin voltage >0.9 V the device is guaranteed to be enabled. The NCV8705 regulates the output voltage and the active discharge transistor is turned-off. The EN pin has internal pull-down current source with typ. value of 110 nA which assures that the device is turned-off when the EN pin is not connected. Build in 2 mV hysteresis into the EN prevents from periodic on/off oscillations that can occur due to noise. In the case where the EN function isn't required the EN should be tied directly to IN. Power Dissipation As power dissipated in the NCV8705 increases, it might become necessary to provide some thermal relief. The maximum power dissipation supported by the device is dependent upon board design and layout. Mounting pad configuration on the PCB, the board material, and the ambient temperature affect the rate of junction temperature rise for the part. The maximum power dissipation the NCV8705 can handle is given by: Undervoltage Lockout The internal UVLO circuitry assures that the device becomes disabled when the VIN falls below typ. 1.5 V. When the VIN voltage ramps-up the NCV8705 becomes enabled, if VIN rises above typ. 1.6 V. The 100 mV hysteresis prevents from on/off oscillations that can occur due to noise on VIN line. P D(MAX) + Output Current Limit Output Current is internally limited within the IC to a typical 750 mA. The NCV8705 will source this amount of current measured with a voltage drops on the 90% of the nominal VOUT. If the Output Voltage is directly shorted to ground (VOUT = 0 V), the short circuit protection will limit the output current to 800 mA (typ). The current limit and short circuit protection will work properly up to VIN = 5.5 V at TA = 125C. There is no limitation for the short circuit duration. P D [ V INI GND@I OUT ) I OUTV IN * V OUT (eq. 4) 1.6 qJA, JUNCTION-TO-AMBIENT THERMAL RESISTANCE (C/W) 200 PD(MAX), TA = 25C, 2 oz Cu 1.4 1.2 180 1 160 PD(MAX), TA = 25C, 1 oz Cu 140 qJA, 1 oz Cu 120 100 qJA, 2 oz Cu 0 (eq. 3) q JA The power dissipated by the NCV8705 for given application conditions can be calculated from the following equations: 220 80 TJ(MAX) * TA 100 200 300 400 500 600 COPPER HEAT SPREADER AREA (mm2) 0.8 0.6 0.4 0.2 700 Figure 66. qJA and PD(MAX) vs. Copper Area (WDFN6) www.onsemi.com 18 PD(MAX), MAXIMUM POWER DISSIPATION (W) VIN NCV8705 qJA, JUNCTION-TO-AMBIENT THERMAL RESISTANCE (C/W) PD(MAX), TA = 25C, 2 oz Cu 250 1.5 1.2 200 PD(MAX), TA = 25C, 1 oz Cu 0.9 150 qJA, 1 oz Cu 0.6 100 qJA, 2 oz Cu 0.3 50 0 0 100 200 300 400 500 600 COPPER HEAT SPREADER AREA (mm2) PD(MAX), MAXIMUM POWER DISSIPATION (W) 1.8 300 0 700 Figure 67. qJA and PD(MAX) vs. Copper Area (DFN8/DFNW8) Reverse Current the range 100 kHz - 10 MHz can be tuned by the selection of COUT capacitor and proper PCB layout. The PMOS pass transistor has an inherent body diode which will be forward biased in the case that VOUT > VIN. Due to this fact in cases, where the extended reverse current condition can be anticipated the device may require additional external protection. Output Noise The IC is designed for ultra-low noise output voltage without external noise filter capacitor (Cnr). Figures 3 - 6 shows NCV8705 noise performance. Generally the noise performance in the indicated frequency range improves with increasing output current. Load Regulation The NCV8705 features very good load regulation of maximum 2 mV in 0 mA to 500 mA range. In order to achieve this very good load regulation a special attention to PCB design is necessary. The trace resistance from the OUT pin to the point of load can easily approach 100 mW which will cause 50 mV voltage drop at full load current, deteriorating the excellent load regulation. The turn-on time is defined as the time period from EN assertion to the point in which VOUT will reach 98% of its nominal value. This time is dependent on various application conditions such as VOUT(NOM), COUT, TA. Line Regulation PCB Layout Recommendations Turn-On Time To obtain good transient performance and good regulation characteristics place CIN and COUT capacitors close to the device pins and make the PCB traces wide. In order to minimize the solution size, use 0402 capacitors. Larger copper area connected to the pins will also improve the device thermal resistance. The actual power dissipation can be calculated from the equation above (Equation 4). The IC features very good line regulation of 0.75 mV/V measured from VIN = VOUT + 0.5 V to 5.5V. For battery operated applications it may be important that the line regulation from VIN = VOUT + 0.5 V up to 4.5 V is only 0.55 mV/V. Power Supply Rejection Ratio The NCV8705 features very good Power Supply Rejection ratio. If desired the PSRR at higher frequencies in www.onsemi.com 19 NCV8705 ORDERING INFORMATION Device Voltage Option Marking NCV8705MT12TCG 1.2 V VF NCV8705MT18TCG 1.8 V VA NCV8705MT28TCG 2.8 V VC NCV8705MT30TCG 3.0 V VD NCV8705MT33TCG 3.3 V VE NCV8705MTADJTCG Adjustable VJ NCV8705MW12TCG 1.2 V 8705W 120 NCV8705MW18TCG 1.8 V 8705W 180 NCV8705MW28TCG 2.8 V 8705W 280 NCV8705MW30TCG 3.0 V 8705W 300 NCV8705MW33TCG 3.3 V 8705W 330 Adjustable 8705W ADJ 3.3 V 8705L 330 NCV8705MWADJTCG NCV8705ML33TCG Package Feature Shipping WDFN6 (Pb-Free) Non-Wettable Flank 3000 / Tape & Reel DFN8 (Pb-Free) Wettable Flank, SFS Process 3000 / Tape & Reel DFNW8 (Pb-Free) Wettable Flank, SLP Process 3000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 20 NCV8705 PACKAGE DIMENSIONS WDFN6 2x2, 0.65P CASE 511BR ISSUE B D CC EE A B A1 0.10 C 0.10 C MOLD CMPD ALTERNATE B-2 DETAIL B ALTERNATE CONSTRUCTIONS E L L TOP VIEW ALTERNATE A-1 ALTERNATE A-2 DETAIL A A3 ALTERNATE CONSTRUCTIONS A 6X 0.05 C A1 NOTE 4 C SIDE VIEW SEATING PLANE 1 MILLIMETERS MIN MAX 0.70 0.80 0.00 0.05 0.20 REF 0.25 0.35 2.00 BSC 1.50 1.70 2.00 BSC 0.90 1.10 0.65 BSC 0.40 0.20 --0.15 RECOMMENDED MOUNTING FOOTPRINT* D2 DETAIL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. FOR DEVICES CONTAINING WETTABLE FLANK OPTION, DETAIL A ALTERNATE CONSTRUCTION A-2 AND DETAIL B ALTERNATE CONSTRUCTION B-2 ARE NOT APPLICABLE. DIM A A1 A3 b D D2 E E2 e L L1 L1 DETAIL B 0.05 C EE CC EXPOSED Cu ALTERNATE B-1 III III III PIN ONE REFERENCE A3 L 1.72 3 6X 0.45 E2 1.12 6 4 6X e BOTTOM VIEW 2.30 b 0.10 M C A 0.05 M C B PACKAGE OUTLINE NOTE 3 6X 0.40 1 0.65 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 21 NCV8705 PACKAGE DIMENSIONS DFN8, 3x3, 0.65P CASE 506DB ISSUE A A B D PIN ONE REFERENCE 2X 0.10 C EEEE EEEE EEEE 0.10 C 2X L DETAIL A E CC EE TOP VIEW DETAIL B 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. (A3) DIM A A1 A3 b b1 D D2 E E2 e e1 L L1 A3 A1 A DETAIL B 0.05 C NOTE 4 A1 SIDE VIEW C SEATING PLANE RECOMMENDED SOLDERING FOOTPRINT* D2 DETAIL A 4 1 8X MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.25 0.35 0.20 0.30 3.00 BSC 1.65 1.85 3.00 BSC 1.40 1.60 0.65 BSC 0.65 REF 0.30 0.50 0.00 0.15 3.30 2.05 L 8X 0.63 PACKAGE OUTLINE E2 e1 4X 1.64 3.30 b1 8 5 e/2 e 0.65 PITCH 8X b 1 0.10 C A B 0.05 C 0.65 PITCH NOTE 3 BOTTOM VIEW 12X 0.40 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 22 NCV8705 PACKAGE DIMENSIONS DFNW8 3x3, 0.65P CASE 507AD ISSUE O A B D L3 L EEE EEE EEE L ALTERNATE CONSTRUCTION DETAIL A E PIN ONE REFERENCE EXPOSED COPPER A4 A1 TOP VIEW DETAIL B 0.05 C PLATING A1 A4 A ALTERNATE CONSTRUCTION DETAIL B A3 C C 0.05 C NOTE 4 A4 C SIDE VIEW SEATING PLANE PLATED SURFACES D2 DETAIL A 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30mm FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. THIS DEVICE CONTAINS WETTABLE FLANK DESIGN FEATURE TO AID IN FILLET FORMATION ON THE LEADS DURING MOUNTING. L3 L3 SECTION C-C 4 DIM A A1 A3 A4 b D D2 E E2 e K L L3 MILLIMETERS MIN NOM MAX 0.80 0.90 1.00 --- --- 0.05 0.20 REF 0.10 REF 0.25 0.30 0.35 2.90 3.00 3.10 2.30 2.40 2.50 2.90 3.00 3.10 1.55 1.65 1.75 0.65 BSC 0.28 REF 0.30 0.40 0.50 0.05 REF RECOMMENDED SOLDERING FOOTPRINT* 2.50 8X 2.35 L E2 K 8 5 e/2 e 8X 8X 0.58 8 5 1 4 3.30 1.75 b 0.10 C A B 0.05 C NOTE 3 BOTTOM VIEW PACKAGE OUTLINE 8X 0.65 PITCH 0.40 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 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