HFM101 THRU HFM108 SURFACE MOUNT GLASS PASSIVATED HIGH EFFICIENCY SILICON RECTIFIER VOLTAGE RANGE 50 to 1000 Volts CURRENT 1.0 Ampere FEATURES * * * * * * Glass passivated device Ideal for surface mounted applications Low leakage current Metallurgically bonded construction Mounting position: Any Weight: 0.057 gram DO-214AC 0.067 (1.70 ) 0.051 (1.29 ) MECHANICAL DATA 0.110 ( 2.79 ) 0.086 ( 2.18 ) * Epoxy: Device has UL flammability classification 94V-O 0.180 ( 4.57 ) 0.160 ( 4.06 ) 0.012 ( 0.305 ) 0.006 ( 0.152 ) 0.091 ( 2.31 ) 0.067 ( 1.70 ) 0.059 ( 1.50 ) 0.035 ( 0.89 ) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS 0.008 ( 0.203 ) 0.004 ( 0.102 ) Ratings at 25 o C ambient temperature unless otherwise specified. 0.209 ( 5.31 ) 0.185 ( 4.70 ) Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. Dimensions in inches and (millimeters) MAXIMUM RATINGS (@ TA=25 OC unless otherwise noted) HFM105 HFM106 HFM107 Maximum Recurrent Peak Reverse Voltage SYMBOL HFM101 HFM102 HFM103 HFM104 VRRM 50 100 200 300 400 600 800 1000 Maximum RMS Voltage VRMS 35 70 140 210 280 420 490 700 Volts VDC 50 100 200 300 400 600 800 1000 Volts RATINGS Maximum DC Blocking Voltage Maximum Average Forward Rectified Current at T A = 50 OC Peak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) HFM108 UNITS Volts IO 1.0 Amps I FSM 30 Amps Typical Thermal Resistance (Note 1) RqJL 27 0 C/W Typical Thermal Resistance (Note 1) RqJA 75 0 C/W Typical Junction Capacitance (Note 2) CJ Operating Temperature Range TJ 150 0 C T STG -55 to + 150 0 C Storage Temperature Range 15 12 pF ELECTRICAL CHARACTERISTICS (@TA=25 OC unless otherwise noted) CHARACTERISTICS Maximum Instantaneous Forward Voltage at 1.0A DC Maximum Full Load Reverse Current, Full cycle Average T A =55 OC Maximum Average Reverse Current @T A = 25 o C at Rated DC Blocking Voltage @T A = 125 o C Maximum Reverse Recovery Time (Note 4) SYMBOL HFM101 HFM102 HFM103 HFM104 VF 1.0 HFM105 1.3 IR HFM106 HFM107 1.7 NOTES : 1. Thermal Resistance : Mounted on PCB. 2. Measured at 1 MHz and applied reverse voltage of 4.0 volts. 3. "Fully ROHS compliant", "100% Sn plating (Pb-free)". 4. Test Conditions: IF= 0.5A, IR= -1.0A, IRR= -0.25A. 50 Volts 50 mA 5 mA 100 trr HFM108 UNITS mA 75 nSec 2006-11 RATING AND CHARACTERISTICS CURVES ( HFM101 THRU HFM108 ) 50 W NONINDUCTIVE (+) 25 Vdc (approx) (-) (-) D.U.T PULSE GENERATOR (NOTE 2) 1 NONINDUCTIVE trr +0.5A 10 W NONINDUCTIVE OSCILLOSCOPE (NOTE 1) 0 -0.25A (+) NOTES: 1 Rise Time = 7ns max. Input Impedance = 1 megohm. 22pF. -1.0A 2. Rise Time = 10ns max. Source Impedance = 50 ohms. 1cm SET TIME BASE FOR 50/100 ns/cm AVERAGE FORWARD CURRENT, (A) 1.0 0.8 0.6 0.4 Single Phase Half Wave 60Hz Resistive or Inductive Load 0.2 0 0 25 50 75 100 125 150 AMBIENT TEMPERATURE, (OC) FIG.2 TYPICAL FORWARD CURRENT DERATING CURVE 175 INSTANTANEOUS REVERSE CURRENT, (mA) FIG.1 TEST CIRCUIT DIAGRAM AND REVERSE RECOVERY TIME CHARACTERISTIC 1000 100 TA = 125 OC 10 TA = 75 OC TA = 25 OC 1.0 0.1 0 20 40 60 80 100 120 PERCENT OF RATED PEAK REVERSE VOLTAGE, (%) FIG.3 TYPICAL REVERSE CHARACTERISTICS 140 PEAK FORWARD SURGE CURRENT, (A) 20 10 TJ = 25 OC 3.0 HFM106~HFM108 1.0 0.3 HFM104~HFM105 0.1 HFM101~HFM103 0.03 0.01 Pulse Width=300uS 1% Duty Cycle 0 0.5 1.0 1.5 2.0 2.5 3.0 200 8.3ms Single Half Sine-Wave (JEDED Method) 150 125 100 3.5 50 30 20 10 1 5 INSTANTANEOUS FORWARD VOLTAGE, (V) 10 TJ = 25 OC 100 60 HFM101~HFM105 20 10 6 4 HFM106~HFM108 2 1 0.1 0.2 100 FIG.5 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 200 40 50 NUMBER OF CYCLES AT 60Hz FIG.4 TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS JUNCTION CAPACITANCE, (pF) INSTANTANEOUS FORWARD CURRENT, (A) RATING AND CHARACTERISTICS CURVES ( HFM101 THRU HFM108 ) 0.4 1.0 2 4 10 20 40 REVERSE VOLTAGE, (V) FIG.6 TYPICAL JUNCTION CAPACITANCE 100 Mounting Pad Layout 0.094 MAX. (2.38 MAX.) 0.060MIN. ( 1.52 MIN.) 0.052 MAX. (1.32 MAX.) 0.220 (5.58) REF Dimensions in inches and (millimeters) DISCLAIMER NOTICE Rectron Inc reserves the right to make changes without notice to any product specification herein, to make corrections, modifications, enhancements or other changes. Rectron Inc or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Data sheet specifications and its information contained are intended to provide a product description only. "Typical" parameters which may be included on RECTRON data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. Rectron Inc does not assume any liability arising out of the application or use of any product or circuit. Rectron products are not designed, intended or authorized for use in medical, life-saving implant or other applications intended for life-sustaining or other related applications where a failure or malfunction of component or circuitry may directly or indirectly cause injury or threaten a life without expressed written approval of Rectron Inc. Customers using or selling Rectron components for use in such applications do so at their own risk and shall agree to fully indemnify Rectron Inc and its subsidiaries harmless against all claims, damages and expenditures.