SMS15CT1G - ON SEMICONDUCTOR

October, 2011 − Rev. 7

1Publication Order Number:

SMS05C/D

SMS05C, SMS12C, SMS15C,

SMS24C

5-Line Transient Voltage

Suppressor Array

This 5−line voltage transient suppressor array is designed for

application requiring transient voltage protection capability. It is

intended for use in over−transient voltage and ESD sensitive

equipment such as computers, printers, automotive electronics,

networking communication and other applications. This device

features a monolithic common anode design which protects five

independent lines in a single TSOP−6 package.

Features

•Protects up to 5 Lines in a Single TSOP−6 Package

•Peak Power Dissipation − 350 W (8 20 ms Waveform)

•ESD Rating of Class 3B (Exceeding 8.0 kV) per Human Body Model

and Class C (Exceeding 400 V) per Machine Model

•Compliance with IEC 61000−4−2 (ESD) 15 kV (Air), 8.0 kV

(Contact)

•Flammability Rating of UL 94 V−0

•These are Pb−Free Devices

Applications

•Hand−Held Portable Applications

•Networking and Telecom

•Automotive Electronics

•Serial and Parallel Ports

•Notebooks, Desktops, Servers

MAXIMUM RATINGS (TJ = 25°C unless otherwise specified)

Symbol Rating Value Unit

PPK 1 Peak Power Dissipation

8 20 ms Double Exponential Waveform

(Note 1)

350 W

TJOperating Junction Temperature Range −40 to 150 °C

TSTG Storage Temperature Range −55 to 150 °C

TLLead Solder Temperature (10 s) 260 °C

ESD Human Body Model ( HBM)

Machine Model (MM)

IEC 61000−4−2 Air (ESD)

IEC 61000−4−2 Contact (ESD)

>8000

>400

>15000

>8000

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Non−repetitive current pulse per Figure 3.

TSOP−6 FIVE TRANSIENT

VOLTAGE SUPPRESSOR

350 W PEAK POWER

TSOP−6

CASE 318G

MARKING DIAGRAM

PIN ASSIGNMENT

Device Package Shipping†

ORDERING INFORMATION

SMS05CT1G

PIN 1. CATHODE

2. ANODE

3. CATHODE

4. CATHODE

5. CATHODE

6. CATHODE

http://onsemi.com

6x MG

x = SMS05C:J

= SMS12C:K

= SMS15C:L

= SMS24C:M

M= Date Code

G= Pb−Free Package

SMS12CT1G

SMS15CT1G

TSOP−6

(Pb−Free) 3000/Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

SMS24CT1G

http://onsemi.com

(Note: Microdot may be in either location)

SMS05C, SMS12C, SMS15C, SMS24C

http://onsemi.com

SMS05C ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified)

Parameter Symbol Conditions Min Typ Max Unit

Reverse Working Voltage VRWM (Note 2) 5.0 V

Breakdown Voltage VBR IT = 1.0 mA (Note 3) 6.2 7.2 V

Reverse Leakage Current IRVRWM = 5.0 V 5.0 mA

Clamping Voltage VCIPP = 5.0 A (8 20 ms Waveform) 9.8 V

Clamping Voltage VCIPP = 24 A (8 20 ms Waveform) 14.5 V

Maximum Peak Pulse Current IPP 8 20 ms Waveform 24 A

Capacitance CJVR = 0 V, f = 1.0 MHz (Line to GND) 260 400 pF

SMS12C ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified)

Parameter Symbol Conditions Min Typ Max Unit

Reverse Working Voltage VRWM (Note 2) 12 V

Breakdown Voltage VBR IT = 1.0 mA (Note 3) 13.3 15 V

Reverse Leakage Current IRVRWM = 12 V 0.001 1.0 mA

Clamping Voltage VCIPP = 5.0 A (8 20 ms Waveform) 19 V

Clamping Voltage VCIPP = 15 A (8 20 ms Waveform) 23 V

Maximum Peak Pulse Current IPP 8 20 ms Waveform 15 A

Capacitance CJVR = 0 V, f = 1.0 MHz (Line to GND) 120 150 pF

SMS15C ELECTRICAL CHARACTERISTICS (TJ = 25°C, unless otherwise specified) (See Note 4)

Parameter Symbol Conditions Min Typ Max Unit

Reverse Working Voltage VRWM (Note 2) 15 V

Breakdown Voltage VBR IT = 1.0 mA (Note 3) 17 19 V

Reverse Leakage Current IRVRWM = 15 V 0.05 1.0 mA

Clamping Voltage VCIPP = 5.0 A (8 20 ms Waveform) 24 V

Clamping Voltage VCIPP = 12 A (8 20 ms Waveform) 29 V

Maximum Peak Pulse Current IPP 8 20 ms Waveform 12 A

Capacitance CJVR = 0 V, f = 1.0 MHz (Line to GND) 95 125 pF

SMS24C ELECTRICAL CHARACTERISTICS (TJ = 25°C, unless otherwise specified)

Parameter Symbol Conditions Min Typ Max Unit

Reverse Working Voltage VRWM (Note 2) 24 V

Breakdown Voltage VBR IT = 1.0 mA (Note 3) 26.7 32 V

Reverse Leakage Current IRVRWM = 24 V 0.001 1.0 mA

Clamping Voltage VCIPP = 5.0 A (8 20 ms Waveform) 40 V

Clamping Voltage VCIPP = 8 A (8 20 ms Waveform) 44 V

Maximum Peak Pulse Current IPP 8 20 ms Waveform 8.0 A

Capacitance CJVR = 0 V, f = 1.0 MHz (Line to GND) 60 75 pF

2. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC

or continuous peak operating voltage level.

3. VBR is measured at pulse test current IT

4. Parametrics are the same for the Pb−Free packages, which are suffixed with a “G’’.

SMS05C, SMS12C, SMS15C, SMS24C

http://onsemi.com

TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise specified)

Figure 1. Pulse Derating Curve

100

00 25 50 75 100 125 150 175 200

TA, AMBIENT TEMPERATURE (°C)

PEAK PULSE DERATING IN % OF PEAK POWER

OR CURRENT @ TA= 25 C

Figure 2. 8 × 20 ms Pulse Waveform

100

00204060

t, TIME (ms)

% OF PEAK PULSE CURRENT

PULSE WIDTH (tP) IS DEFINED

AS THAT POINT WHERE THE

PEAK CURRENT DECAY = 8 ms

PEAK VALUE IRSM @ 8 ms

HALF VALUE IRSM/2 @ 20 ms

Figure 3. Clamping Voltage vs. Peak Pulse Current

00510

IPP

, PEAK PULSE CURRENT (A)

VC, CLAMPING VOLTAGE (V)

15 20 25

Figure 4. Junction Capacitance vs. Reverse Voltage

300

250

200

150

100

005

VBR, REVERSE VOLTAGE (V)

JUNCTION CAPACITANCE (pF)

10 15 20 25

8 x 20 ms

PULSE WAVEFORM

f = 1.0 MHz

SMS05C

SMS12C

SMS15C

SMS24C

SMS05C

SMS12C

SMS15C SMS24C

Figure 5. ESD Pulse IEC 61000−4−2

(8.0 kV Contact)

Figure 6. SMS15CT1 ESD Response for IEC

61000−4−2 (+8.0 kV Contact)

SMS05C, SMS12C, SMS15C, SMS24C

http://onsemi.com

TYPICAL COMMON ANODE APPLICATIONS

A 5 TVS junction common anode design in a TSOP−6

package protects four separate lines using only one package.

This adds flexibility and creativity to PCB design especially

when board space is at a premium. A simplified example of

SMS05C Series Device applications is illustrated below.

KEYBOARD

TERMINAL

PRINTER

ETC.

FUNCTIONAL

DECODER

I/O

SMS05C SERIES DEVICE

GND

Figure 7. Computer Interface Protection

Figure 8. Microprocessor Protection

RAM ROM

CLOCK

CPU

CONTROL BUS

ADDRESS BUS

DATA BUS

GND

VGG

VDD

SMS05C SERIES DEVICE

I/O

SMS05C, SMS12C, SMS15C, SMS24C

http://onsemi.com

PACKAGE DIMENSIONS

TSOP−6

CASE 318G−02

ISSUE U

ÉÉ

456

0.05

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM

LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.

4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,

PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR

GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D

AND E1 ARE DETERMINED AT DATUM H.

5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

MIN NOM MAX

MILLIMETERS

0.90 1.00 1.10

A1 0.01 0.06 0.10

b0.25 0.38 0.50

c0.10 0.18 0.26

D2.90 3.00 3.10

E2.50 2.75 3.00

e0.85 0.95 1.05

L0.20 0.40 0.60

0.25 BSC

−

0°10°

1.30 1.50 1.70

RECOMMENDED

NOTE 5

SEATING

PLANE

GAUGE

PLANE

DETAIL Z

0.60

3.20 0.95

0.95

PITCH

DIMENSIONS: MILLIMETERS

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

SMS05C/D

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