NL17SV08 Single 2-Input AND Gate The NL17SV08 is an ultra-high performance 2-Input AND gate manufactured in 0.35 mm technology with excellent performance down to 0.9 volts. This device is ideal for extremely high-speed and high-drive applications. Additionally, limitations of board space are no longer a constraint. The very small SOT-553 makes this device fit most tight designs and spaces. http://onsemi.com Features * * * * * * * MARKING DIAGRAM 5 Extremely High Speed: tPD = 1.0 ns (Typ) @ VCC = 3.3 V Designed for 0.9 to 3.3 V Operation Overvoltage Tolerance (OVT)* Input Pins Permit Logic Translation Balanced 24 mA Output Drive @ 3.3 V Near Zero Static Supply Current Ultra-Tiny SOT-553 5 Pin Package Only 1.6 x 1.6 x 0.6 mm These Devices are Pb-Free and are RoHS Compliant 1 UG = Specific Device Code M = Date Code G = Pb-Free Package (Note: Microdot may be in either location) PIN DIAGRAM Typical Applications * * * * UG M G G SOT-553 CASE 463B Cellular Digital Camera PDA Digital Video Industry Standard IN A 1 IN B 2 GND 3 5 VCC 4 OUT Y * Functionally Similar to NC7SV08 and SN74AUC1G08 PIN ASSIGNMENT PIN # FUNCTION 1 IN A 2 IN B 3 GND 4 OUT Y 5 VCC FUNCTION TABLE Input A Input B Output Y L L L L H L H L L H H H ORDERING INFORMATION Device Package Shipping NL17SV08XV5T2G SOT-553 4000 Tape & Reel (Pb-Free) (178 mm) *Overvoltage Tolerance (OVT) enables input pins to function outside (higher) of their operating voltages, with no damage to the devices or to signal integrity. (c) Semiconductor Components Industries, LLC, 2011 July, 2011 - Rev. 6 1 For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: NL17SV08XV5T2/D NL17SV08 MAXIMUM RATINGS Symbol VCC Rating DC Supply Voltage Value Units -0.5 to +4.6 V -0.5 to +4.6 V -0.5 to VCC + 0.5 V VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current VIN < 0 V -50 IOK DC Output Diode Current VOUT < 0 V VOUT > VCC -50 +50 IO DC Output Sink Current 50 mA ICC DC Supply Current per Supply Pin 50 mA IGND DC Ground Current per Ground Pin TSTG Storage Temperature Range mA mA 50 mA -65 to +150 C 260 C +150 C TL Lead Temperature, 1.0 mm from Case for 10 seconds TJ Junction Temperature Under Bias qJA Thermal Resistance (Note 1) 250 C/W PD Power Dissipation in Still Air at 85C 250 mW MSL FR Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V-0 @ 0.125 in Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Units 0.9 3.6 V Digital Input Voltage 0 3.6 V Output Voltage 0 VCC V VCC Positive DC Supply Voltage VIN Vout IOH/IOL tA tr, tf Output Current VCC = 3.0 V to 3.6 V VCC = 2.3 V to 2.7 V VCC = 1.65 V to 1.95 V VCC = 1.4 V to 1.6 V VCC = 1.1 V to 1.3 V VCC = 0.9 V 24 18 6 4 2 0.1 Operating Temperature Range. All Package Types Input Rise or Fall Time VCC = 3.3V 0.3 V DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature C Time, Hours Time, Years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 http://onsemi.com 2 -40 +85 0 10 mA C nS/V NL17SV08 DC CHARACTERISTICS- Digital Section (Voltages Referenced to GND) TA = 25C Symbol Parameter VCC Min VIH High Level Input Voltage 0.90 1.10 VCC 1.30 1.40 VCC 1.60 1.65 VCC 1.95 2.30 VCC 2.70 2.70 VCC 3.60 0.65 x VCC 0.65 x VCC 0.65 x VCC 0.65 x VCC 1.6 2.0 VIL Low Level Input Voltage 0.90 1.10 VCC 1.30 1.40 VCC 1.60 1.65 VCC 1.95 2.30 VCC 2.70 2.70 VCC 3.60 VOH High Level Output Voltage VOL Low Level Output Voltage IIN Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current Condition TA = -40 to 85C Max Min Max 0.65 x VCC 0.65 x VCC 0.65 x VCC 0.65 x VCC 1.6 2.0 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.7 0.8 Units V 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.35 x VCC 0.7 0.8 V V IOH = -100 mA 0.90 1.10 VCC 1.30 1.40 VCC 1.60 1.65 VCC 1.95 2.30 VCC 2.70 2.70 VCC 3.60 VCC - 0.1 VCC - 0.1 VCC - 0.2 VCC - 0.2 VCC - 0.2 VCC - 0.2 VCC - 0.1 VCC - 0.1 VCC - 0.2 VCC - 0.2 VCC - 0.2 VCC - 0.2 IOH = -2.0 mA 1.10 VCC 1.30 0.75 x VCC 0.75 x VCC IOH = -4.0 mA 1.40 VCC 1.60 0.75 x VCC 0.75 x VCC IOH = -6.0 mA 1.65 VCC 1.95 2.30 VCC 2.70 1.25 2.0 1.25 2.0 IOH = -12 mA 2.30 VCC 2.70 2.70 VCC 3.60 1.8 2.2 1.8 2.2 IOH = -18 mA 2.30 VCC 2.70 2.70 VCC 3.60 1.7 2.4 1.7 2.4 IOH = -24 mA 2.70 VCC 3.60 2.2 IOL = 100 mA 0.90 1.10 VCC 1.30 1.40 VCC 1.60 1.65 VCC 1.95 2.30 VCC 2.70 2.70 VCC 3.60 0.1 0.1 0.2 0.2 0.2 0.2 0.1 0.1 0.2 0.2 0.2 0.2 IOL = 2.0 mA 1.10 VCC 1.30 0.25 x VCC 0.25 x VCC IOL = 4.0 mA 1.40 VCC 1.60 0.25 x VCC 0.25 x VCC IOL = 6.0 mA 1.65 VCC 1.95 0.3 0.3 IOL = 12 mA 2.30 VCC 2.70 2.70 VCC 3.60 0.4 0.4 0.4 0.4 IOL = 18 mA 2.30 VCC 2.70 2.70 VCC 3.60 0.6 0.4 0.6 0.4 IOL = 24 mA 2.70 VCC 3.60 0.55 0.55 0 = VI = 3.6 V 0.90 to 3.60 0.1 0.9 mA 0 10 10 mA 0.90 to 3.60 0.9 5 mA VI = VCC or GND http://onsemi.com 3 2.2 V NL17SV08 AC CHARACTERISTICS (Input tr = tf = 3.0 nS) -40C 25C Symbol Parameter Condition VCC Min Typ TPHL, TPLH Propagation Delay CL = 15 pF, RL = 1.0 MW 0.90 CL = 15 pF, RL = 2.0 kW 1.10 VCC 1.30 1.40 VCC 1.60 3.0 1.0 CL = 30 pF, RL = 500 W 1.65 VCC 1.95 2.30 VCC 2.70 2.70 VCC 3.60 1.0 0.8 0.7 85C Max Min Max 6.0 3.2 10.0 6.0 1.0 1.0 14.6 7.2 nS 2.0 1.2 1.0 4.5 2.6 2.3 1.0 0.7 0.6 5.3 3.7 3.0 nS 13 Units nS CIN Input Capacitance 0 2.0 pF COUT Output Capacitance 0 4.5 pF CPD Power Dissipation Capacitance 0.90 to 3.60 20 pF VI = 0 V or VCC F = 10 MHz http://onsemi.com 4 NL17SV08 PACKAGE DIMENSIONS SOT-553, 5 LEAD CASE 463B-01 ISSUE B D -X- 5 A 4 1 e 2 E -Y- 3 b NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. L HE DIM A b c D E e L HE c 5 PL 0.08 (0.003) M X Y MILLIMETERS NOM MAX 0.55 0.60 0.22 0.27 0.13 0.18 1.60 1.70 1.20 1.30 0.50 BSC 0.10 0.20 0.30 1.50 1.60 1.70 MIN 0.50 0.17 0.08 1.50 1.10 INCHES NOM 0.022 0.009 0.005 0.063 0.047 0.020 BSC 0.004 0.008 0.059 0.063 MIN 0.020 0.007 0.003 0.059 0.043 MAX 0.024 0.011 0.007 0.067 0.051 0.012 0.067 SOLDERING FOOTPRINT* 0.3 0.0118 0.45 0.0177 1.35 0.0531 1.0 0.0394 0.5 0.5 0.0197 0.0197 SCALE 20:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). 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