NL17SV08XV5T2G - ON Semiconductor L.L.C.

Publication Order Number:

NL17SV08XV5T2/D

July, 2011 − Rev. 6

NL17SV08

Single 2-Input AND Gate

The NL17SV08 is an ultra−high performance 2−Input AND gate

manufactured in 0.35 mm technology with excellent performance

down to 0.9 volts. This device is ideal for extremely high−speed and

high−drive applications. Additionally, limitations of board space are

no longer a constraint. The very small SOT−553 makes this device fit

most tight designs and spaces.

Features

•Extremely High Speed: tPD = 1.0 ns (Typ) @ VCC = 3.3 V

•Designed for 0.9 to 3.3 V Operation

•Overvoltage Tolerance (OVT)* Input Pins Permit Logic Translation

•Balanced ±24 mA Output Drive @ 3.3 V

•Near Zero Static Supply Current

•Ultra−Tiny SOT−553 5 Pin Package Only 1.6 x 1.6 x 0.6 mm

•These Devices are Pb−Free and are RoHS Compliant

Typical Applications

•Cellular

•Digital Camera

•PDA

•Digital Video

Industry Standard

•Functionally Similar to NC7SV08 and SN74AUC1G08

*Overvoltage Tolerance (OVT) enables input pins to function outside (higher) of

their operating voltages, with no damage to the devices or to signal integrity.

SOT−553

CASE 463B

FUNCTION TABLE

Input A Input B

VCC

IN A

IN B

OUT YGND

Output Y

MARKING

DIAGRAM

UG M G

PIN DIAGRAM

http://onsemi.com

UG = Specific Device Code

M = Date Code

G= Pb−Free Package

(Note: Microdot may be in either location)

PIN ASSIGNMENT

3 GND

IN A

IN B

OUT Y

PIN # FUNCTION

Device Package Shipping†

ORDERING INFORMATION

NL17SV08XV5T2G SOT−553

(Pb−Free)

4000 Tape & Reel

(178 mm)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

NL17SV08

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MAXIMUM RATINGS

Symbol Rating Value Units

VCC DC Supply Voltage −0.5 to +4.6 V

VIDC Input Voltage −0.5 to +4.6 V

VODC Output Voltage −0.5 to VCC + 0.5 V

IIK DC Input Diode Current

VIN < 0 V −50

IOK DC Output Diode Current

VOUT < 0 V

VOUT > VCC

−50

+50

IODC Output Sink Current ±50 mA

ICC DC Supply Current per Supply Pin ±50 mA

IGND DC Ground Current per Ground Pin ±50 mA

TSTG Storage Temperature Range −65 to +150 °C

TLLead Temperature, 1.0 mm from Case for 10 seconds 260 °C

TJJunction Temperature Under Bias +150 °C

qJA Thermal Resistance (Note 1) 250 °C/W

PDPower Dissipation in Still Air at 85°C 250 mW

MSL Moisture Sensitivity Level 1

FRFlammability Rating

Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit

values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Max Units

VCC Positive DC Supply Voltage 0.9 3.6 V

VIN Digital Input Voltage 0 3.6 V

Vout Output Voltage 0 VCC V

IOH/IOL Output Current

VCC = 3.0 V to 3.6 V

VCC = 2.3 V to 2.7 V

VCC = 1.65 V to 1.95 V

VCC = 1.4 V to 1.6 V

VCC = 1.1 V to 1.3 V

VCC = 0.9 V

±24

±18

±6

±4

±2

±0.1

tAOperating Temperature Range. All Package Types −40 +85 °C

tr, tfInput Rise or Fall Time

VCC = 3.3V ± 0.3 V 0 10

nS/V

DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES

Junction Temperature °CTime, Hours Time, Years

80 1,032,200 117.8

90 419,300 47.9

100 178,700 20.4

110 79,600 9.4

120 37,000 4.2

130 17,800 2.0

140 8,900 1.0

NL17SV08

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DC CHARACTERISTICS– Digital Section (Voltages Referenced to GND)

Condition VCC

TA = 25°C TA = −40 to 85°C

Symbol Parameter Min Max Min Max Units

VIH High Level

Input Voltage

0.90

1.10 ≤ VCC ≤ 1.30

1.40 ≤ VCC ≤ 1.60

1.65 ≤ VCC ≤ 1.95

2.30 ≤ VCC ≤ 2.70

2.70 ≤ VCC ≤ 3.60

0.65 x VCC

1.6

2.0

0.65 x VCC

1.6

2.0

VIL Low Level

Input Voltage

0.90

1.10 ≤ VCC ≤ 1.30

1.40 ≤ VCC ≤ 1.60

1.65 ≤ VCC ≤ 1.95

2.30 ≤ VCC ≤ 2.70

2.70 ≤ VCC ≤ 3.60

0.35 x VCC

0.7

0.8

0.35 x VCC

0.7

0.8

VOH High Level

Output Voltage

IOH = −100 mA0.90

1.10 ≤ VCC ≤ 1.30

1.40 ≤ VCC ≤ 1.60

1.65 ≤ VCC ≤ 1.95

2.30 ≤ VCC ≤ 2.70

2.70 ≤ VCC ≤ 3.60

VCC − 0.1

VCC − 0.2

VCC − 0.1

VCC − 0.2

IOH = −2.0 mA 1.10 ≤ VCC ≤ 1.30 0.75 x VCC 0.75 x VCC

IOH = −4.0 mA 1.40 ≤ VCC ≤ 1.60 0.75 x VCC 0.75 x VCC

IOH = −6.0 mA 1.65 ≤ VCC ≤ 1.95

2.30 ≤ VCC ≤ 2.70

1.25

2.0

1.25

2.0

IOH = −12 mA 2.30 ≤ VCC ≤ 2.70

2.70 ≤ VCC ≤ 3.60

1.8

2.2

1.8

2.2

IOH = −18 mA 2.30 ≤ VCC ≤ 2.70

2.70 ≤ VCC ≤ 3.60

1.7

2.4

1.7

2.4

IOH = −24 mA 2.70 ≤ VCC ≤ 3.60 2.2 2.2

VOL Low Level

Output Voltage

IOL = 100 mA0.90

1.10 ≤ VCC ≤ 1.30

1.40 ≤ VCC ≤ 1.60

1.65 ≤ VCC ≤ 1.95

2.30 ≤ VCC ≤ 2.70

2.70 ≤ VCC ≤ 3.60

0.1

0.2

0.1

0.2

IOL = 2.0 mA 1.10 ≤ VCC ≤ 1.30 0.25 x VCC 0.25 x VCC

IOL = 4.0 mA 1.40 ≤ VCC ≤ 1.60 0.25 x VCC 0.25 x VCC

IOL = 6.0 mA 1.65 ≤ VCC ≤ 1.95 0.3 0.3

IOL = 12 mA 2.30 ≤ VCC ≤ 2.70

2.70 ≤ VCC ≤ 3.60

0.4

IOL = 18 mA 2.30 ≤ VCC ≤ 2.70

2.70 ≤ VCC ≤ 3.60

0.6

0.4

0.6

0.4

IOL = 24 mA 2.70 ≤ VCC ≤ 3.60 0.55 0.55

IIN Input

Leakage Current

0 = VI = 3.6 V 0.90 to 3.60 ±0.1 ±0.9 mA

IOFF Power Off

Leakage Current

0 10 10 mA

ICC Quiescent

Supply Current

VI = VCC or GND 0.90 to 3.60 0.9 5 mA

NL17SV08

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AC CHARACTERISTICS (Input tr = tf = 3.0 nS)

−40°C 25°C 85°C

Symbol Parameter Condition VCC Min Typ Max Min Max Units

TPHL,

TPLH

Propagation Delay CL = 15 pF, RL = 1.0 MW0.90 13 nS

CL = 15 pF, RL = 2.0 kW1.10 ≤ VCC ≤ 1.30

1.40 ≤ VCC ≤ 1.60

3.0

1.0

6.0

3.2

10.0

6.0

1.0

14.6

7.2

CL = 30 pF, RL = 500 W1.65 ≤ VCC ≤ 1.95

2.30 ≤ VCC ≤ 2.70

2.70 ≤ VCC ≤ 3.60

1.0

0.8

0.7

2.0

1.2

1.0

4.5

2.6

2.3

1.0

0.7

0.6

5.3

3.7

3.0

CIN Input Capacitance 0 2.0 pF

COUT Output Capacitance 0 4.5 pF

CPD Power Dissipation

Capacitance

VI = 0 V or VCC

F = 10 MHz

0.90 to 3.60 20 pF

NL17SV08

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PACKAGE DIMENSIONS

SOT−553, 5 LEAD

CASE 463B−01

ISSUE B

0.08 (0.003) X

b5 PL

−X−

−Y−

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS

3. MAXIMUM LEAD THICKNESS INCLUDES

LEAD FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS

OF BASE MATERIAL.

12 3

1.35

0.0531

0.5

0.0197

ǒmm

inchesǓ

SCALE 20:1

0.5

0.0197

1.0

0.0394

0.45

0.0177

0.3

0.0118

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

HEDIM

MIN NOM MAX MIN

MILLIMETERS

0.50 0.55 0.60 0.020

INCHES

b0.17 0.22 0.27 0.007

D1.50 1.60 1.70 0.059

E1.10 1.20 1.30 0.043

e0.50 BSC

L0.10 0.20 0.30 0.004

0.022 0.024

0.009 0.011

0.063 0.067

0.047 0.051

0.008 0.012

NOM MAX

1.50 1.60 1.70 0.059 0.063 0.067

0.08 0.13 0.18 0.003 0.005 0.007

0.020 BSC

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

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Japan Customer Focus Center

Phone: 81−3−5773−3850

NL17SV08XV5T2/D

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