Datasheet
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Zener Diode
EDZV series
Application Dimensions (Unit : mm) Land size f igure (Unit : mm)
Constant voltage control
Features
1) Compact,2-pin mini-mold type for
high-density mounting. (EMD2)
2) High reliability.
3) Can be mounted automatically, Structure
using chip mounter.
Construction
Silicon epitaxial planar
Taping specifications (Unit : mm)
Absolute maximum ratings (Ta = 25°C)
Power dissipation P mW
Junction temperature Tj °C
Storage temperature Tstg °C
Operating temperature Topr °C
55 to 150
55 to 150
Parameter Symbol Limits Unit
150
150
Anode
Cathode
EMD2
0.8
1.7
0.6
0.12±0.05
0.6±0.1
0.3±0.05
0.8±0.05
1.2±0.05
1.6±0.1
ROHM : EMD2
JEITA : SC-79
JEDEC :SOD-523
EX. EDZV3.6B
1/5 2015.01 - Rev.B
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© 2015 ROHM Co., Ltd. All rights reserved.
Data Sheet
EDZV series
Electical characteristics (Ta=25°C)
MIN. MAX. Iz(mA) MAX. Iz(mA) MAX. Iz(mA) MAX. VR(V)
EDZV 3.6B 3.600 3.845 5.0 100 5.0 1000 1.0 10.0 1.0
EDZV 3.9B 3.890 4.160 5.0 100 5.0 1000 1.0 5.0 1.0
EDZV 4.3B 4.170 4.430 5.0 100 5.0 1000 1.0 5.0 1.0
EDZV 4.7B 4.550 4.750 5.0 100 5.0 800 0.5 2.0 1.0
EDZV 5.1B 4.980 5.200 5.0 80 5.0 500 0.5 2.0 1.5
EDZV 5.6B 5.490 5.730 5.0 60 5.0 200 0.5 1.0 2.5
EDZV 6.2B 6.060 6.330 5.0 60 5.0 100 0.5 1.0 3.0
EDZV 6.8B 6.650 6.930 5.0 40 5.0 60 0.5 0.5 3.5
EDZV 7.5B 7.280 7.600 5.0 30 5.0 60 0.5 0.5 4.0
EDZV 8.2B 8.020 8.360 5.0 30 5.0 60 0.5 0.5 5.0
EDZV 9.1B 8.850 9.230 5.0 30 5.0 60 0.5 0.5 6.0
EDZV 10B 9.770 10.210 5.0 30 5.0 60 0.5 0.1 7.0
EDZV 11B 10.760 11.220 5.0 30 5.0 60 0.5 0.1 8.0
EDZV 12B 11.740 12.240 5.0 30 5.0 80 0.5 0.1 9.0
EDZV 13B 12.910 13.490 5.0 37 5.0 80 0.5 0.1 10.0
EDZV 15B 14.340 14.980 5.0 42 5.0 80 0.5 0.1 11.0
EDZV 16B 15.850 16.510 5.0 50 5.0 80 0.5 0.1 12.0
EDZV 18B 17.560 18.350 5.0 65 5.0 80 0.5 0.1 13.0
EDZV 20B 19.520 20.390 5.0 85 5.0 100 0.5 0.1 15.0
EDZV 22B 21.540 22.470 5.0 100 5.0 100 0.5 0.1 17.0
EDZV 24B 23.720 24.780 5.0 120 5.0 120 0.5 0.1 19.0
EDZV 27B 26.190 27.530 2.0 150 2.0 150 0.5 0.1 21.0
EDZV 30B 29.190 30.690 2.0 200 2.0 200 0.5 0.1 23.0
EDZV 33B 32.150 33.790 2.0 250 2.0 250 0.5 0.1 25.0
EDZV 36B 35.070 36.870 2.0 300 2.0 300 0.5 0.1 27.0
(1) The zener voltage(Vz) is measured 40ms after power is supplied.
(2) The operating resistances(Zz,Zzk) are measured by superimposing a minute alternating current
on the regulated current(Iz)
MARKING (Type No.)
TYPE TYPE NO. TYPE TYPE NO.
EDZV 3.6B 62 EDZV 12B 25
EDZV 3.9B 72 EDZV 13B 35
EDZV 4.3B 82 EDZV 15B 45
EDZV 4.7B 92 EDZV 16B 55
EDZV 5.1B A2 EDZV 18B 65
EDZV 5.6B C2 EDZV 20B 75
EDZV 6.2B E2 EDZV 22B 85
EDZV 6.8B F2 EDZV 24B 95
EDZV 7.5B H2 EDZV 27B A5
EDZV 8.2B J2 EDZV 30B C5
EDZV 9.1B L2 EDZV 33B E5
EDZV 10B 05 EDZV 36B F5
EDZV 11B 15
Rising operataing
resistance ：Zz(Ω)
Reverse current ：
IR(A)
TYP.
Symbol
Zener voltage ：Vz(V) Operating resistance ：Zz(Ω)
2/5 2015.01 - Rev.B
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© 2015 ROHM Co., Ltd. All rights reserved.
Data Sheet
EDZV series
10
100
1000
0.001 0.01 0.1 1 10 100 1000
Rth(j-a)
Rth(j-c)
POWER DISSIPATION:Pd(mW)
TEMP.COEFFICIENCE:γz(%/°C)
ZENER VOLTAGE：Vz(V)
γz-Vz CHARACTERISTICS TIME:t(s)
Rth-t CHARACTERISTICS
TRANSIENT
THAERMAL IMPEDANCE:Rth (°C/W)
0
50
100
150
200
0 25 50 75 100 125 150
0.001
0.01
0.1
1
10
0 5 10 15 20 25 30 35 40
24
2018
16
15
13
12
11
10
9.1
6.2
5.1
36
33
22 30
27
3.6
8.2
7.5
5.6
6.8
4.7
4.3
3.9
ZENER CURRENT:Iz(mA)
ZENER VOLTAGE:Vz(V)
Vz-Iz CHARACTERISTICS
-5
0
5
10
15
20
25
30
35
40
-0.08
-0.06
-0.04
-0.02
0
0.02
0.04
0.06
0.08
0.1
0 10203040
AMBIENT TEMPERATURE:Ta(°C)
Pd-Ta CHARACTERISTICS
TEMP.COEFFICIENCE:γz(mV/°C)
Mounted on epoxy board
%/°C
mV/°C
3/5 2015.01 - Rev.B
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© 2015 ROHM Co., Ltd. All rights reserved.
Data Sheet
EDZV12B
0.001
0.01
0.1
1
10
10 11 12 13 14
Ta=25°C
Ta=125°C
Ta=75°C
Ta=25°C
ZENER CURRENT:Iz(mA)
ZENER VOLTAGE:Vz(V)
VzIz CHARACTERISTICS
0.01
0.1
1
10
100
1000
0246810
Ta=125°C
Ta=25°C
Ta=75°C
1
10
100
0246810
f=1MHz
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
REVERSE VOLTAGE:VR(V)
VR-Ct CHARACTERISTICS
11.7
11.8
11.9
12.0
12.1
12.2
AVE:12.05V
Ta=25°C
IZ=5mA
n=30pcs
Vz DISRESION MAP
ZENER VOLTAGE:Vz(Ｖ)
0
1
2
3
4
5
6
7
8
9
10
Ta=25°C
VR=9.0V
n=30pcs
AVE:1.13pA
IRDISRESION MAP
REVERSE CURRENT:IR(pA)
10
11
12
13
14
15
16
17
18
19
20
AVE:14.0pF
Ta=25°C
f=1MHz
VR=0V
n=10pcs
Ct DISRESION MAP
CAPACITANCE
BETWEENTERMINALS:Ct(pF)
REVERSE VOLTAGE：VR(V)
VR-IRCHARACTERISTICS
REVERSE CURRENT:IR(pA)
4/5 2015.01 - Rev.B
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© 2015 ROHM Co., Ltd. All rights reserved.
Data Sheet
EDZV12B
1
10
100
1000
10000
0.1 1 10
ZENER CURRENT(mA)
ZzIz CHARACTERISTICS
DYNAMIC IMPEDANCE:Zz(Ω)
0
5
10
15
20
25
30
C=200pF
R=0Ω
C=150pF
R=330Ω
C=100pF
R=1.5kΩ
AVE：10.4kV
No break at 30kV No break at 30kV
ESD DISPERSION MAP
ELECTROSTATIC
DISCHARGE TEST ESD [kV]
5/5 2015.01 - Rev.B
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for applicatio n in ordinar y elec tronic eq uipm ents (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
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accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
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CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
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[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radi ation-proof design.
5. Please verify and confirm ch aracteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
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7. De-rate Po wer Dissipation (P d) depe nding on Ambient temperature (T a). When us ed in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
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Precaution for Mounting / Circuit board design
1. When a highly active halogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
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incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
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isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteriorate if the Products are stored in the pl aces where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommende d b y ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderabilit y of products out of recommended storage time period
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DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
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concerning such information.
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