MMBTA42LT1-D - ON Semiconductor

 Semiconductor Components Industries, LLC, 2002

December, 2002 - Rev. 4 1Publication Order Number:

MMBTA42LT1/D

MMBTA42LT1,

MMBTA43LT1

MMBTA42LT1 is a Preferred Device

High Voltage Transistors

NPN Silicon

MAXIMUM RATINGS

Rating Symbol MMBTA42 MMBTA43 Unit

Collector- Emitter Voltage VCEO 300 200 Vdc

Collector- Base Voltage VCBO 300 200 Vdc

Emitter- Base Voltage VEBO 6.0 6.0 Vdc

Collector Current-Continuous IC500 mAdc

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Total Device Dissipation FR-5 Board (Note 1)

TA = 25°C

Derate above 25°C

PD225

1.8

mW/°C

Thermal Resistance, Junction to Ambient RJA 556 °C/W

Total Device Dissipation

Alumina Substrate (Note 2)

TA = 25°C

Derate above 25°C

PD300

2.4

mW/°C

Thermal Resistance, Junction to Ambient RJA 417 °C/W

Junction and Storage Temperature TJ, Tstg -55 to

+150 °C

1. FR-5 = 1.0 x 0.75 x 0.062 in.

2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.

Device Package Shipping

ORDERING INFORMATION

MMBTA42LT1 SOT-23

SOT-23 (TO-236)

CASE 318

STYLE 6

3000/Tape & Reel

Preferred devices are recommended choices for future use

and best overall value.

MARKING DIAGRAMS

1D X

MMBTA42LT1

M1E X

MMBTA43LT1

MMBTA43LT3 SOT-23 3000/Tape & Reel

http://onsemi.com

1D, M1E = Specific Device Code

X = Date Code

COLLECTOR

BASE

EMITTER

MMBTA42LT1, MMBTA43LT1

http://onsemi.com

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Characteristic Symbol Min Max Unit

OFF CHARACTERISTICS

Collector- Emitter Breakdown Voltage (Note 3)

(IC = 1.0 mAdc, IB = 0) MMBTA42

MMBTA43

V(BR)CEO 300

200 -

Vdc

Collector- Base Breakdown Voltage

(IC = 100 Adc, IE = 0) MMBTA42

MMBTA43

V(BR)CBO 300

200 -

Vdc

Emitter- Base Breakdown Voltage

(IE = 100 Adc, IC = 0) V(BR)EBO 6.0 - Vdc

Collector Cutoff Current

(VCB = 200 Vdc, IE = 0) MMBTA42

(VCB = 160 Vdc, IE = 0) MMBTA43

ICBO -

-0.1

0.1

Adc

Emitter Cutoff Current

(VEB = 6.0 Vdc, IC = 0) MMBTA42

(VEB = 4.0 Vdc, IC = 0) MMBTA43

IEBO -

-0.1

0.1

Adc

ON CHARACTERISTICS (Note 3)

DC Current Gain

(IC = 1.0 mAdc, VCE = 10 Vdc) Both Types

(IC = 10 mAdc, VCE = 10 Vdc) Both Types

(IC = 30 mAdc, VCE = 10 Vdc) MMBTA42

MMBTA43

hFE 25

Collector- Emitter Saturation Voltage

(IC = 20 mAdc, IB = 2.0 mAdc) MMBTA42

MMBTA43

VCE(sat) -

-0.5

0.5

Vdc

Base-Emitter Saturation Voltage

(IC = 20 mAdc, IB = 2.0 mAdc) VBE(sat) - 0.9 Vdc

SMALL- SIGNAL CHARACTERISTICS

Current- Gain - Bandwidth Product

(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz) fT50 - MHz

Collector-Base Capacitance

(VCB = 20 Vdc, IE = 0, f = 1.0 MHz) MMBTA42

MMBTA43

Ccb -

-3.0

4.0

3. Pulse Test: Pulse Width  300 s, Duty Cycle  2.0%.

MMBTA42LT1, MMBTA43LT1

http://onsemi.com

C, CAPACITANCE (pF)

Figure 1. DC Current Gain

VR, REVERSE VOLTAGE (VOLTS)

0.1

100

0.1

1.0 10 1000

Ceb @ 1MHz

Figure 2. Capacitance

IC, COLLECTOR CURRENT (mA)

10070503020107.05.03.02.0

TJ = 25°C

VCE = 20 V

f = 20 MHz

f, CURRENT−GAIN  BANDWIDTH (MHz)

1.0

IC, COLLECTOR CURRENT (mA)

Figure 3. Current-Gain - Bandwidth

V, VOLTAGE (VOLTS)

1.4

0.0

1.2

1.0

0.8

0.6

0.4

0.2

100100.1 1.0

100

1.0 Ccb @ 1MHz

VBE(on) @ 25°C, VCE = 10 V

VCE(sat) @ 25°C, IC/IB = 10

VBE(sat) @ 25°C, IC/IB = 10

VCE(sat) @ 125°C, IC/IB = 10

VCE(sat) @ −55°C, IC/IB = 10

VBE(sat) @ 125°C, IC/IB = 10

VBE(sat) @ −55°C, IC/IB = 10

VBE(on) @ 125°C, VCE = 10 V

VBE(on) @ −55°C, VCE = 10 V

Figure 4. “ON” Voltages

IC, COLLECTOR CURRENT (mA)

120

0.1 1.0 10

100

hFE, DC CURRENT GAIN

TJ = +125°C

25°C

−55°C

VCE = 10 Vdc

100

MMBTA42LT1, MMBTA43LT1

http://onsemi.com

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values

into the equation for an ambient temperature TA of 25°C,

one can calculate the power dissipation of the device which

in this case is 225 milliwatts.

INFORMATION FOR USING THE SOT-23 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the

total design. The footprint for the semiconductor packages

must be the correct size to insure proper solder connection

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

SOT-23

inches

0.037

0.95

0.037

0.95

0.079

2.0

0.035

0.9

0.031

0.8

SOT-23 POWER DISSIPATION

PD = TJ(max) - TA

RθJA

PD = 150°C - 25°C

556°C/W = 225 milliwatts

The power dissipation of the SOT-23 is a function of th e

pad size. This can vary from the minimum pad size for

soldering to a pad size given for maximum power dissipa-

tion. Power dissipation for a surface mount device is deter-

mined b y T J(max), the maximum rated junction temperature

of the die, RθJA, the thermal resistance from the device

junction to ambient, and the operating temperature, TA.

Using the values provided on the data sheet for the SOT-23

package, PD can be calculated as follows:

The 556°C/W for the SOT-23 package assumes the use

of the recommended footprint on a glass epoxy printed

circuit board to achieve a power dissipation of 225 milli-

watts. There are other alternatives to achieving higher

power dissipation from the SOT-23 package. Another

alternative would be to use a ceramic substrate or an

aluminum core board such as Thermal Clad. Using a

board material such as Thermal Clad, an aluminum core

board, the power dissipation can be doubled using the same

footprint.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the

rated temperature of the device. When the entire device is

heated to a high temperature, failure to complete soldering

within a short time could result in device failure. There-

fore, the following items should always be observed in

order to minimize the thermal stress to which the devices

are subjected.

•Always preheat the device.

•The delta temperature between the preheat and

soldering should be 100°C or less.*

•When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering

method, the difference shall be a maximum of 10°C.

•The soldering temperature and time shall not exceed

260°C for more than 10 seconds.

•When shifting from preheating to soldering, the

maximum temperature gradient shall be 5°C or less.

•After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and

result in latent failure due to mechanical stress.

•Mechanical stress or shock should not be applied

during cooling.

* Soldering a device without preheating can cause exces-

sive thermal shock and stress which can result in damage

to the device.

MMBTA42LT1, MMBTA43LT1

http://onsemi.com

PACKAGE DIMENSIONS

CASE 318-08

ISSUE AH

SOT-23 (TO-236)

DIM

MIN MAX MIN MAX

MILLIMETERS

0.1102 0.1197 2.80 3.04

INCHES

B0.0472 0.0551 1.20 1.40

C0.0350 0.0440 0.89 1.11

D0.0150 0.0200 0.37 0.50

G0.0701 0.0807 1.78 2.04

H0.0005 0.0040 0.013 0.100

J0.0034 0.0070 0.085 0.177

K0.0140 0.0285 0.35 0.69

L0.0350 0.0401 0.89 1.02

S0.0830 0.1039 2.10 2.64

V0.0177 0.0236 0.45 0.60

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD THICKNESS

IS THE MINIMUM THICKNESS OF BASE

MATERIAL.

4. 318−03 AND −07 OBSOLETE, NEW STANDARD

318−08.

STYLE 6:

PIN 1. BASE

2. EMITTER

3. COLLECTOR

MMBTA42LT1, MMBTA43LT1

http://onsemi.com

Notes

MMBTA42LT1, MMBTA43LT1

http://onsemi.com

Notes

MMBTA42LT1, MMBTA43LT1

http://onsemi.com

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make

changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any

particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all

liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be

validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.

SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death

may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC

and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees

arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized u se, even if such claim alleges that

SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.

PUBLICATION ORDERING INFORMATION

JAPAN: ON Semiconductor, Japan Customer Focus Center

2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051

Phone: 81-3-5773-3850

Email: r14525@onsemi.com

ON Semiconductor Website: http://onsemi.com

For additional information, please contact your local

Sales Representative.

MMBTA42LT1/D

Thermal Clad is a registered trademark of the Bergquist Company.

Literature Fulfillment:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada

Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada

Email: ONlit@hibbertco.com

N. American Technical Support: 800-282-9855 Toll Free USA/Canada