General Description
The MAX6469–MAX6484 are low-dropout linear regula-
tors with a fully integrated microprocessor reset circuit.
Each is available with preset output voltages from +1.5V
to +3.3V in 100mV increments and delivers up to 300mA
of load current. These devices consume only 82µA of
supply current. The low supply current, low dropout volt-
age, and integrated reset functionality make these
devices ideal for battery-powered portable equipment.
The MAX6469–MAX6484 include a reset output that indi-
cates when the regulator output drops below standard
microprocessor supply tolerances (-7.5% or -12.5% of
nominal output voltage). This eliminates the need for an
external microprocessor supervisor, while ensuring that
supply voltages and clock oscillators have stabilized
before processor activity is enabled. Push-pull and open-
drain active-low reset outputs are available, with reset
timeout periods of 2.5ms, 20ms, 150ms, or 1200ms (min).
The MAX6469/MAX6470/MAX6473–MAX6478/MAX6481–
MAX6484 also have a shutdown feature that reduces the
supply current to 0.1µA (typ). The MAX6471–MAX6474/
MAX6479–MAX6482 offer a manual reset input to assert a
microprocessor reset while the regulator output is within
specification. The MAX6475/MAX6476/MAX6483/
MAX6484 feature a remote feedback sense pin for use
with an external NPN transistor for higher-current applica-
tions. The MAX6469–MAX6476 are available in 6-pin
SOT23 and 8-pin TDFN packages. The MAX6477–
MAX6484 are available in a 3 ×3 chip-scale package
(UCSP™). All devices are specified for operation from
-40°C to +85°C.
Applications
Handheld Instruments (PDAs, Palmtops)
PCMCIA Cards/USB Devices
Cellular/Cordless Telephones
CD/DVD Drives
Notebook Computers
Digital Cameras
Bluetooth Modules/Wireless LAN
Features
o3 3 UCSP, 6-Pin SOT23, and 8-Pin TDFN
Packages
oPreset +1.5V to +3.3V Output (100mV Increments)
oSET Pin for Adjustable Output Voltage
o75µVRMS LDO Output Voltage Noise
(MAX6477–MAX6484)
o±2.0% Accuracy Over Temperature
oGuaranteed 300mA Output Current
oLow Dropout Voltage
55mV at 150mA
114mV at 300mA
o82µA Supply Current, 0.1µA Shutdown Current
oInput Reverse Current, Thermal and Short-Circuit
Protection
oMicroprocessor Reset with Four Timeout Options
oPush-Pull or Open-Drain RESET
oManual Reset Input
oRemote Feedback Sense
MAX6469–MAX6484
300mA LDO Linear Regulators with
Internal Microprocessor Reset Circuit
________________________________________________________________
Maxim Integrated Products
1
Ordering Information
19-2532; Rev 6; 2/11
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
PART* TEMP RANGE PIN-
PACKAGE
MAX6469UT_ _ _D_-T -40°C to +85°C 6 SOT23-6
MAX6469TA_ _ _D_-T** -40°C to +85°C 8 TDFN-EP***
MAX6470UT_ _ _D_-T -40°C to +85°C 6 SOT23-6
MAX6470TA_ _ _D_-T** -40°C to +85°C 8 TDFN-EP***
Note: The first “_ _
are placeholders for the output voltage lev-
els of the devices. Desired output voltages are set by the suffix
found in the Output Voltage Suffix Guide (Table 1). The third “_”
is a placeholder for the reset threshold accuracy. Desired reset
threshold accuracy is set by the suffix found in the Reset
Threshold Accuracy Guide (Table 2). The “_” following the D is
a placeholder for the reset timeout delay time. Desired reset
timeout delay time is set by the suffix found in the Reset
Timeout Delay Guide (Table 3). For example, the
MAX6481BL30BD4-T has a 3.0V output voltage, 12.5% reset
threshold tolerance, and a 1200ms (min) reset timeout delay.
Sample stock is generally available on standard versions only
(Table 4). Standard versions require a minimum order incre-
ment of 2.5k units. Nonstandard versions must be ordered in
10k-unit increments. Contact factory for availability.
Ordering Information continued at end of data sheet.
Pin Configurations appear at end of data sheet.
Typical Operating Circuits appear at end of data sheet.
UCSP is a trademark of Maxim Integrated Products, Inc.
*
Devices are also available in a lead(Pb)-free/RoHS-compliant
packages. Specify lead(Pb)-free by substituting a +T instead of
a -T when ordering.
**
Future product—contact factory for availability.
***
EP = Exposed pad.
EVALUATION KIT
AVAILABLE
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND, unless otherwise noted.)
IN, SHDN, OUT, FB ..................................................-0.3V to +7V
MR, SET .......................................................-0.3V to (VIN + 0.3V)
RESET (push-pull) ...................................-0.3V to (VOUT + 0.3V)
RESET (open drain)..................................................-0.3V to +7V
OUT Short Circuit .......................................................Continuous
Input/Output Current (all pins except IN and OUT) ............20mA
Continuous Power Dissipation (TA= +70°C)
3 x 3 UCSP (derate 10.5mW/°C above +70°C) ............840mW
6-Pin SOT23 (derate 9.1mW/°C above +70°C).............727mW
8-Pin TDFN (derate 24.4mW/°C above +70°C) ..........1951mW
Operating Temperature Range ..........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow)
Lead(Pb)-free packages...............................................+260°C
Packages containing lead(Pb)......................................+240°C
ELECTRICAL CHARACTERISTICS
(VIN = (VOUT + 0.5V) or +2.5V, whichever is greater, COUT = 3.3µF, TA= -40°C to +85°C. Typical specifications are at TA= +25°C,
unless otherwise noted.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Input Voltage Range VIN 2.5 5.5 V
Input Undervoltage Lockout VUVLO VIN falling 2.25 2.47 V
IOUT = 0A 82 136
Supply Current (Ground Current) IQIOUT = 300mA 96 µA
Shutdown Supply Current ISHDN TA = +25°C 0.1 1 µA
REGULATOR CIRCUIT
Output Current 300 mA
1mA IOUT 150mA, TA = +25°C -1.3 +1.3
1mA IOUT 150mA, TA = -40°C to +85°C -2.3 +2.3
Output Voltage Accuracy (Fixed
Output Voltage Operation,
Table 1) MAX6469–MAX6476 1mA IOUT 300mA, TA = -40°C to +85°C -2.7 +2.7
%
2mA IOUT 100mA, TA = +25°C -1.1 +1.1
2mA IOUT 100mA, TA = -40°C to +85°C -2.0 +2.0
Output Voltage Accuracy (Fixed
Output Voltage Operation,
Table 1) MAX6477–MAX6484 2mA IOUT 300mA, TA = -40°C to +85°C
(Note 3) -2.5 +2.5
%
Adjustable Output Voltage Range VSET 5.0 V
SET Reference Voltage VSET 1.200 1.229 1.258 V
SET Dual ModeTM Threshold 185 mV
SET Input Leakage Current ISET VSET = 0V, +1.2V (Note 3) ±20 ±100 nA
Dual Mode is a trademark of Maxim Integrated Products, Inc.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: The MAX6477–MAX6484 are constructed using a unique set of packaging techniques that impose a limit on the thermal pro-
file the devices can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder
profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and
Convection reflow. Pre-heating is required. Hand or wave soldering is not allowed.
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(VIN = (VOUT + 0.5V) or +2.5V, whichever is greater, COUT = 3.3µF, TA= -40°C to +85°C. Typical specifications are at TA= +25°C,
unless otherwise noted.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
IOUT = 50mA 23 32
IOUT = 150mA 55 90
VOUT = +3.3V
(fixed output operation) IOUT = 300mA 114 180
IOUT = 50mA 25 40
IOUT = 150mA 61 100
VOUT = +3.0V
(fixed output operation) IOUT = 300mA 114 190
IOUT = 50mA 26 50
IOUT = 150mA 65 110
VOUT = +2.8V
(fixed output operation) IOUT = 300mA 137 210
IOUT = 50mA 30 60
IOUT = 150mA 75 150
Dropout Voltage
(Notes 3, 4) VDO
VOUT = +2.5V
(fixed output operation) IOUT = 300mA 158 250
mV
Output Current Limit VIN 2.5V (Note 3) 450 mA
Input Reverse Leakage Current
(OUT to IN Leakage Current) VIN = 4V, VOUT = 5.5V, SHDN deasserted 0.01 1.5 µA
Startup Time Response
Rising edge of VIN or SHDN to VOUT
within specification, RL = 68, SET = GND,
IOUT = 10mA
20 µs
SHDN Input Low Voltage VIL 0.3 × VIN V
SHDN Input High Voltage VIH 0.7 × VIN V
SHDN Input Current VSHDN = VIN or VGND -1 0.1 +1 µA
Thermal-Shutdown Temperature TSHDN 180 °C
Thermal-Shutdown Hysteresis TSHDN 20 °C
Line Regulation VOUT = 1.5V, 2.5V VIN 5.5V,
IOUT = 10mA 0.09 %/V
Load Regulation VOUT = 1.5V, VIN = 2.5V, 1mA IOUT
150mA 0.2 %
MAX6469–MAX6476 150
Output Voltage Noise
10Hz to 100kHz,
CIN = 0.1µF,
IOUT = 100mA,
VOUT = 1.5V MAX6477–MAX6484 75
µVRMS
RESET CIRCUIT
MAX64_ _ _ _ _ _ A 90 92.5 95
VOUT Reset Threshold
(VFB for MAX6475/MAX6476/
MAX6483/MAX6484) (Note 5)
VTHOUT MAX64_ _ _ _ _ _ B 85 87.5 90
%VOUT
VOUT to Reset Delay
(VFB for MAX6475/MAX6476/
MAX6483/MAX6484)
35 µs
D1 2.5 3.75 5.0
D2 20 30 40
D3 150 225 300
Reset Timeout Period
(Note 6) tRP
D4 1200 1800 2400
ms
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
4 _______________________________________________________________________________________
Note 2: All devices are 100% production tested at +25°C and are guaranteed by correlation for TA= TMIN to TMAX.
Note 3: Guaranteed by design.
Note 4: Dropout voltage is defined as (VIN - VOUT) when VOUT is 2% below the value of VOUT for VIN = VOUT(NOM) + 1V.
Note 5: MAX6473/MAX6474/MAX6481/MAX6482 are guaranteed by design for VOUT < 2.5V.
Note 6: Select the reset timeout period using the
Reset Timeout Delay Guide
(Table 3). Insert the appropriate suffix in the part number
when ordering.
ELECTRICAL CHARACTERISTICS (continued)
(VIN = (VOUT + 0.5V) or +2.5V, whichever is greater, COUT = 3.3µF, TA= -40°C to +85°C. Typical specifications are at TA= +25°C,
unless otherwise noted.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
MR Input Low Voltage VIL 0.3 ×
VOUT V
MR Input High Voltage VIH (Note 3) 0.7 ×
VOUT V
MR Minimum Input Pulse s
MR Glitch Rejection 120 ns
MR to Reset Delay 200 ns
MR Pullup Resistance MR to OUT 25 40 70 k
VOUT 1.0V, ISINK = 50µA, RESET asserted 0.3
RESET Output Voltage
(Open Drain) VOL V
OU T
1.5V , IS IN K = 3.2m A, RES ET asser ted 0.4 V
Open-Drain Reset Output
Leakage Current ILKG (Note 3) A
VOUT 1.0V, ISINK = 50µA, RESET asserted 0.3
VOL V
OU T
1.5V , IS IN K = 3.2m A, RES ET asser ted 0.4
RESET Output Voltage Push-Pull
VOH VOUT 2.0V, ISOURCE = 500µA, RESET
deasserted
0.8 ×
VOUT
V
GROUND CURRENT vs. INPUT VOLTAGE
(NO LOAD)
MAX6469 toc01
INPUT VOLTAGE (V)
GROUND CURRENT (µA)
54321
20
40
60
80
100
120
0
06
+85°C
+25°C
-40°C
GROUND CURRENT vs. INPUT VOLTAGE
(300mA LOAD)
MAX6469 toc02
INPUT VOLTAGE (V)
GROUND CURRENT (µA)
20
40
60
80
100
120
0
5432106
+85°C
+25°C
-40°C
MAXIMUM TRANSIENT DURATION
vs. RESET THRESHOLD OVERDRIVE
MAX6469 toc03
RESET THRESHOLD OVERDRIVE (mV)
PULSE DURATION (µs)
10
25
50
75
100
125
150
0
1 100
RESET ASSERTS ABOVE
THIS LINE
Typical Operating Characteristics
(VIN = 5V, VOUT = 3.3V, COUT = 3.3µF, TA= +25°C, unless otherwise noted.)
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
_______________________________________________________________________________________
5
DROPOUT VOLTAGE vs. LOAD CURRENT
MAX6469 toc04
LOAD CURRENT (mA)
DROPOUT VOLTAGE (mV)
25020015010050
25
50
75
100
125
0
0 300
VOUT = 3.3V
COUT = 3.3µF
PSRR vs. FREQUENCY
MAX6469 toc05
FREQUENCY (kHz)
PSRR (dB)
1001010.1
-50
-40
-30
-20
-10
0
-60
0.01 1000
VOUT = 3.3V
COUT = 3.3µF
ILOAD = 30mA
REGION OF STABLE COUT ESR
vs. LOAD CURRENT
MAX6469 toc06
LOAD CURRENT (mA)
COUT ESR ()
25020015010050
1
2
3
4
5
0
0300
COUT = 4.7µF
COUT = 3.3µF
STABLE REGION
OUTPUT NOISE
MAX6469 toc07
500µs/div
100µV/div
VIN = 4.5V
VOUT = 3.3V
ILOAD = 100mA
100
0
10 100 10k 100k
OUTPUT NOISE vs. FREQUENCY
20
40
80
60
MAX6469 toc08
FREQUENCY (Hz)
VRMS (µV)
1k
VIN = 2.5V
VOUT = 1.5V
IOUT = 100mA
SHUTDOWN RESPONSE
MAX6469 toc09
20ms/div
VOUT
2V/div
VSHDN
5V/div
ILOAD = 50mA
STARTUP RESPONSE
MAX6469 toc10
10µs/div
VIN
2V/div
VOUT
2V/div
MAX6469 toc11
100µs/div
VOUT
20mV/div
LOAD-TRANSIENT RESPONSE
VIN = 5V
VOUT = 3.3V
ILOAD = 10mA TO 300mA
MAX6469 toc12
10µs/div
VIN = 5V
VOUT = 3.3V
ILOAD = 100mA
VOUT
5mV/div
LOAD-TRANSIENT RESPONSE
NEAR DROPOUT
Typical Operating Characteristics (continued)
(VIN = 5V, VOUT = 3.3V, COUT = 3.3µF, TA= +25°C, unless otherwise noted.)
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
6 _______________________________________________________________________________________
NORMALIZED OUTPUT VOLTAGE
vs. TEMPERATURE
MAX6469 toc17
TEMPERATURE (°C)
NORMALIZED OUTPUT VOLTAGE
603510-15
0.994
1.000
1.006
1.012
0.988
-40 85
NORMALIZED TO +25°C
ILOAD = 10mA
ILOAD = 150mA ILOAD = 300mA
MAX6469 toc13
100µs/div
VOUT
20mV/div
AC-COUPLED
5V
4.5V
VIN
500mV/div
VOUT = 3.3V
ILOAD = 10mA
LINE-TRANSIENT RESPONSE
MAX6469 toc14
200ms/div
VIN
1V TO 4V
2V/div
RESET
2V/div
RESET DELAY RESPONSE
MAX6469 toc15
200ns/div
MR
2V/div
RESET
2V/div
RESET RESPONSE TO MR
MAX6469 toc16
200ms/div
VOUT
2V/div
RESET
2V/div
RESET RESPONSE TO VIN RISING
VIN
5V/div
Typical Operating Characteristics (continued)
(VIN = 5V, VOUT = 3.3V, COUT = 3.3µF, TA= +25°C, unless otherwise noted.)
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
_______________________________________________________________________________________ 7
MAX6469/MAX6470/MAX6477/MAX6478 Pin Description
PIN BUMP
MAX6469/MAX6470 MAX6477/MAX6478
SOT23 TDFN-EP UCSP
NAME FUNCTION
1 1, 2 A1 IN Regulator Input. Bypass IN to GND with a 0.1µF capacitor.
2 3 A2 GND Ground. This pin also functions as a heatsink. Solder to large pads or
the circuit-board ground plane to maximize thermal dissipation.
34 A3 SHDN Active-Low Shutdown Input. Connect SHDN to VIN for normal operation.
45 C3 RESET
Active-Low Reset Output. RESET remains low while VOUT is below the
reset threshold. RESET remains low for the duration of the reset timeout
period after the reset conditions are terminated. RESET is available in
open-drain and push-pull configurations.
5 6 C2 SET
Feedback Input for Externally Setting the Output Voltage. Connect SET
to GND to select the preset output voltage. Connect SET to an external
resistor-divider network for adjustable output operation.
6 7, 8 C1 OUT Regulator Output. Bypass OUT to GND with a minimum 3.3µF low-ESR
capacitor.
—— EP
Exposed Paddle (TDFN Only). EP is internally connected to GND.
Connect EP to the ground plane to provide a low thermal-resistance
path from the IC junction to the PCB. Do not use as the electrical
connection to GND.
MAX6471/MAX6472/MAX6479/MAX6480 Pin Description
PIN BUMP
MAX6471/MAX6472 MAX6479/MAX6480
SOT23 TDFN-EP UCSP
NAME FUNCTION
1 1, 2 A1 IN Regulator Input. Bypass IN to GND with a 0.1µF capacitor.
2 3 A2 GND Ground. This pin also functions as a heatsink. Solder to large pads or
the circuit-board ground plane to maximize thermal dissipation.
34 A3 MR
Active-Low Manual Reset Input. The reset output is asserted while MR
is pulled low and remains asserted for the duration of the reset timeout
period after MR transitions from low to high. Leave MR unconnected or
connect to VOUT if not used. MR has an internal pullup resistor of 40k
(typ) to VOUT.
45 C3 RESET
Active-Low Reset Output. RESET remains low while VOUT is below the
reset threshold or while MR is held low. RESET remains low for the
duration of the reset timeout period after the reset conditions are
terminated. RESET is available in open-drain and push-pull
configurations.
5 6 C2 SET
Feedback Input for Externally Setting the Output Voltage. Connect SET
to GND to select the preset output voltage. Connect SET to an external
resistor-divider network for adjustable output operation.
6 7, 8 C1 OUT Regulator Output. Bypass OUT to GND with a minimum 3.3µF low-ESR
capacitor.
—— EP
Exposed Paddle (TDFN Only). EP is internally connected to GND.
Connect EP to the ground plane to provide a low thermal-resistance
path from the IC junction to the PCB. Do not use as the electrical
connection to GND.
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
8 _______________________________________________________________________________________
MAX6473/MAX6474/MAX6481/MAX6482 Pin Description
PIN BUMP
MAX6473/MAX6474 MAX6481/MAX6482
SOT23 TDFN-EP UCSP
NAME FUNCTION
1 1, 2 A1 IN Regulator Input. Bypass IN to GND with a 0.1µF capacitor.
2 3 A2 GND Ground. This pin also functions as a heatsink. Solder to large pads or
the circuit-board ground plane to maximize thermal dissipation.
34 A3 SHDN Active-Low Shutdown Input. Connect SHDN to VIN for normal operation.
45 C3 RESET
Active-Low Reset Output. RESET remains low while VOUT is below the
reset threshold or while MR is held low. RESET remains low for the
duration of the reset timeout period after the reset conditions are
terminated. RESET is available in open-drain and push-pull
configurations.
56 C2 MR
Active-Low Manual Reset Input. The reset output is asserted while MR
is pulled low and remains asserted for the duration of the reset timeout
period after MR transitions from low to high. Leave MR unconnected or
connect to VOUT if not used. MR has an internal pullup resistor of 40k
(typ) to VOUT.
6 7, 8 C1 OUT Regulator Output. Bypass OUT to GND with a minimum 3.3µF (min)
low-ESR capacitor.
—— EP
Exposed Paddle (TDFN Only). EP is internally connected to GND.
Connect EP to the ground plane to provide a low thermal-resistance
path from the IC junction to the PCB. Do not use as the electrical
connection to GND.
MAX6475/MAX6476/MAX6483/MAX6484 Pin Description
PIN BUMP
MAX6475/MAX6476 MAX6483/MAX6484
SOT23 TDFN-EP UCSP
NAME FUNCTION
1 1, 2 A1 IN Regulator Input. Bypass IN to GND with a 0.1µF capacitor.
2 3 A2 GND Ground. This pin also functions as a heatsink. Solder to large pads or
the circuit-board ground plane to maximize thermal dissipation.
34 A3 SHDN Active-Low Shutdown Input. Connect SHDN to VIN for normal operation.
45 C3 RESET
Active-Low Reset Output. RESET remains low while FB is below the
reset threshold. RESET remains low for the duration of the reset timeout
period after the reset conditions are terminated. RESET is available in
open-drain and push-pull configurations.
56 C2 FB
Feedback Input for Linear Regulator Controller or Remote Sense
Applications. Connect FB to the external load (VCC) to obtain the fixed
output voltage.
6 7, 8 C1 OUT Regulator Output. Bypass OUT to GND with a minimum 3.3µF low-ESR
capacitor.
—— EP
Exposed Paddle (TDFN Only). EP is internally connected to GND.
Connect EP to the ground plane to provide a low thermal-resistance path
from the IC junction to the PCB. Do not use as the electrical connection
to GND.
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
_______________________________________________________________________________________ 9
Detailed Description
The MAX6469–MAX6484 are ultra-low, quiescent cur-
rent, low-dropout linear regulators with an integrated
microprocessor reset circuit. These devices guarantee
300mA (min) drive capabilities and are available with
preset output voltages in 100mV increments between
+1.5V and +3.3V. The internal reset circuit monitors the
regulator output voltage and asserts the reset output
when the regulator output is below the microprocessor
supply tolerance.
Regulator
The regulator core operates with +2.5V to +5.5V input
voltage range. The output voltage is offered in 100mV
increments between +1.5V and +3.3V (contact factory
for other output voltage options). The MAX6469–
MAX6472/MAX6477–MAX6480 offer an adjustable out-
put voltage implemented with an external resistor-
divider network between OUT, SET, and GND (Figure
1). SET must be connected to either GND for fixed
VOUT or to an external divider for adjustable VOUT. The
MAX6469–MAX6472/MAX6477–MAX6480 automatically
determine the feedback path depending on the con-
nection of SET. The
Typical Operating Circuit
shows a
typical connection for the MAX6469. OUT is an internal-
ly regulated low-dropout (LDO) linear regulator that
powers a microprocessor.
Reset Circuit
The reset supervisor circuit is fully integrated in the
MAX6469–MAX6484 and uses the same reference volt-
age as the regulator. Two supply tolerance reset
thresholds, -7.5% and -12.5%, are provided for each
type of device.
-7.5% Reset: Reset does not assert until the regulator
output voltage is at least -5% out of tolerance and
always asserts before the regulator output voltage is
-10% out of tolerance.
-12.5% Reset: Reset does not assert until the regulator
output voltage is at least -10% out of tolerance and
always asserts before the regulator output voltage is
-15% out of tolerance.
RESET Output
A µP’s reset input starts the µP in a known state. The
MAX6469–MAX6484 µP supervisory circuits assert
RESET during power-up, power-down, and brownout
conditions. RESET asserts when the input voltage is
below the undervoltage lockout threshold. RESET
asserts when VOUT is below the reset threshold and
remains asserted for at least the minimum selected reset
timeout period (tRP, Table 3) after VIN rises above the
undervoltage lockout threshold and VOUT rises above
the reset threshold. RESET asserts when MR is pulled
low (MAX6471–MAX6474/MAX6479–MAX6482). RESET
asserts when SHDN is pulled low (MAX6469/
MAX6470/MAX6473–MAX6478/MAX6481–MAX6484).
Shutdown
(MAX6469/MAX6470/MAX6473–MAX6478/MAX6481–
MAX6484 only)
SHDN allows the regulator to shut down, thereby reduc-
ing the total IIN consumption of the device. SHDN pro-
vides a digitally controlled active-low shutdown. In
shutdown mode, the pass transistor, control circuit, and
reference turn off to reduce the supply current to below
0.1µA. Connect SHDN to IN for normal operation.
Manual Reset Input
(MAX6471–MAX6474/MAX6479–MAX6482 only)
Many µP-based products require manual reset capabil-
ity, allowing the operator, a test technician, or external
logic circuitry to initiate a reset. A logic low on MR
asserts reset while the regulator output voltage is still
within tolerance.
Reset remains asserted while MR is low and for the
reset timeout period (tRP) after MR returns high. The
MR input has an internal pullup of 40k(typ) to OUT.
MR can be driven with TTL/CMOS logic levels or with
open-drain/collector outputs. Connect a normally open
switch from MR to GND to create a manual reset func-
tion; external debounce circuitry is not required. If MR
is driven from long cables or the device is used in a
noisy environment, connect a 0.1µF capacitor from MR
to GND to provide additional noise immunity.
Feedback Input
(MAX6475/MAX6476/MAX6483/MAX6484 only)
The feedback input (FB) connects to an internal resistor-
divider network (
Functional Diagram
). FB is not internally
connected to VOUT, and as a result can be used to
MAX6469–MAX6472
MAX6477–MAX6480
R1
R2
COUT
MANUAL
RESET GND
IN
OUT
SET
2.5V TO 5.5V
(MR)
( ) ARE FOR MAX6471/MAX6472/MAX6479/MAX6480 ONLY
Figure 1. Adjustable Output Voltage Configuration
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
10 ______________________________________________________________________________________
remotely sense the output voltage of the device. Using
FB with an external npn transistor, the current drive capa-
bility can be increased according to the following equa-
tion (Figure 2):
IOUT(TOTAL) = IOUT (β+1)
The external npn pass transistor must meet specifica-
tions for current gain, power dissipation, and collector
current. The beta influences the maximum output cur-
rent the circuit can deliver. The largest guaranteed out-
put current is given by ILOAD (max) = 300mA ×beta
(min). The transistor’s rated power dissipation must
exceed the actual power dissipated in the transistor.
The power dissipated (PD) equals the maximum load
current (ILOAD (max)) times the maximum input-to-out-
put voltage differential: PD = ILOAD (max) ×(VIN (max) -
VOUT). The rated transistor collector current must
exceed the maximum load current.
Reverse Leakage Protection
Reverse OUT to IN Current
An internal circuit monitors the MAX6469–MAX6484
input and output voltages. When the output voltage is
greater than the input voltage, the internal IN-to-OUT
pass transistor and parasitic diode turn off. An external
voltage applied to OUT does not reverse charge a bat-
tery or power source applied to IN (the leakage path
from OUT to IN is 0.01µA typ). When the output voltage
exceeds the input voltage, OUT powers the device and
shutdown must be logic high (greater than 0.7 VOUT).
RESET asserts until IN exceeds OUT and OUT is above
the specified VTHOUT threshold (based on the selected
or adjusted regulator OUT nominal voltage).
Reverse OUT to Ground Current
The MAX6469–MAX6484 maintain a low OUT-to-GND
reverse-current flow when the IN power source is
removed. When IN floats (input battery removed) and
SHDN is pulled up to VOUT (by an external diode), the
OUT-to-GND current through the LDO is 40µA (typ). The
regulator output can be held up with an external super
capacitor or backup battery at OUT until the IN battery is
replaced. The RESET output is asserted while the IN bat-
tery is removed to place the system in a low-power
mode. Volatile memory content is maintained until the
super capacitor or battery voltage drops below RAM
standby specifications. RESET deasserts when the IN
battery has been replaced and OUT exceeds the
desired reset threshold. For nonrechargeable backup
battery applications, place a reverse diode between
OUT and the backup battery (to prevent battery charg-
ing). The external diode does not affect the regulator’s
dropout voltage because it is not between the LDO out-
put and the processor/memory VCC supply. The diode
can be replaced with a current-limiting resistor for
rechargeable backup battery applications.
Current Limit
The MAX6469–MAX6484 include an internal current-
limit circuit that monitors and controls the pass transis-
tor’s gate voltage, limiting the output current to 450mA
(min). The output can be shorted to ground indefinitely
without damaging the part.
Thermal Shutdown
When the junction temperature (TJ) exceeds +180°C
(typ), the thermal sensor signals the shutdown logic,
turning off the pass transistor and allowing the IC to
Figure 3. Battery Backup
MAX6469
MAX6484
µPMEMORY
OUTIN
SHDN
3.0V
LITHIUM
REMOVABLE
LITHIUM ION OR
3-CELL
ALKALINE
REMOVABLE
LITHIUM ION OR
3-CELL
ALKALINE
MAX6469
MAX6484
µPMEMORY
OUT
IN
SHDN
SUPERCAP
3.3µF
3.3µF
Figure 2. High-Current, External Transistor Application
MAX6475/MAX6476
MAX6483/MAX6484
RPULLUP
0.1µF3.3µF330
µP
5.0V
OUT
FB
RESET
GND
IN VCC = 3.3V1A TOTAL CURRENT
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
______________________________________________________________________________________ 11
cool. The thermal sensor turns the pass transistor on
again after the IC’s junction temperature cools by 20°C,
resulting in a pulsed output during continuous thermal
overload conditions. Thermal overload protection is
designed to protect the MAX6469–MAX6484 in the
event of fault conditions. For continuous operation, do
not exceed the absolute maximum junction temperature
rating of TJMAX = +150°C.
Operating Region and Power Dissipation
The MAX6469–MAX6484’s maximum power dissipation
depends on the thermal resistance of the case and cir-
cuit board, the temperature difference between the die
junction and the ambient air, and the rate of airflow. The
power dissipation across the device is:
P = IOUT (VIN - VOUT)
The maximum power dissipation is:
PMAX = (TJ- TA) / (ØJB + ØBA)
where TJ- TAis the temperature difference between the
die junction and the surrounding air, ØJB (or ØJC) is the
thermal resistance of the package, and ØBA is the ther-
mal resistance through the PC board, copper traces,
and other materials to the surrounding air. The
MAX6469–MAX6476 TDFN package ØJC = 41°C/W,
and the MAX6469–MAX6476 SOT package ØJC =
110°C/W.
The MAX6469–MAX6484’s ground pin (GND) performs
the dual function of providing an electrical connection
to the system ground and channeling heat away.
Connect GND to the system ground using a large pad
or ground plane. For continuous operation, do not
exceed the absolute maximum junction temperature
rating of TJMAX = +150°C.
Applications Information
Output Voltage Selection
The MAX6469–MAX6484 feature dual-mode operation:
they operate in either a preset output voltage mode
or an adjustable mode. In preset voltage mode, internal
feedback resistors set the MAX6469–MAX6484’s output
from +1.5V to +3.3V (Table 1). Select this mode by con-
necting SET to ground (MAX6469–MAX6472/
MAX6477–MAX6480). In adjustable mode, select an
output between 1.25V and 5.5V using two external
resistors connected as a voltage-divider to SET (Figure
1). The output voltage is set by the following equation:
VOUT = VSET (1 + R1 / R2)
where VSET = 1.23V. To simplify resistor selection:
R1 = R2(VOUT / VSET - 1)
Choose R2 = 50kto maintain stability, accuracy and
high-frequency power-supply rejection. Avoid selecting
resistor values greater than 100k. In preset voltage
mode, the impedance between SET and ground should
always be less than 50k. In most applications, con-
nect SET directly to ground.
Low-Noise UCSP Output
MAX6477–MAX6484 UCSP products include internal fil-
tering to yield low output noise without an additional
external bypass capacitor. The devices yield 75µVRMS
(typ) output noise (for VOUT = 3.0V) and 150µVRMS (for
VOUT = 3.3V). This low-noise feature makes the
MAX6477–MAX6484 ideal for audio applications.
Capacitor Selection and Regulator
Stability
For stable operation over the full temperature range
and with load currents up to 300mA, use a 3.3µF (min)
ceramic output capacitor with an ESR <0.2. To
reduce noise and improve load transient response, sta-
bility, and power-supply rejection, use large output
capacitor values such as 10µF.
Note that some ceramic capacitors exhibit large capac-
itance and ESR variation with temperature. With capaci-
tor dielectrics such as Z5U and Y5V, use 4.7µF or more
to ensure stability over temperature. With X7R or X5R
capacitor dielectrics, 3.3µF should be sufficient at all
operating temperatures. Higher ESR capacitors require
more capacitance to maintain stability. A graph of the
Region of Stable ESR vs. Load Current is shown in the
Typical Operating Characteristics
.
To improve power-supply rejection and transient
response, use a 1µF capacitor between IN and GND.
The MAX6469–MAX6484 remain stable with purely
resistive loads or current loads up to 300mA.
Reset Transient Immunity
The reset circuit is relatively immune to short-duration,
falling VOUT transients. The
Typical Operating
Characteristics
section shows a graph of the Maximum
Transient Duration vs. Reset Threshold Overdrive for
which reset is not asserted. The graph was produced
using falling VOUT transients starting at VOUT and end-
ing below the reset threshold by the magnitude indicat-
ed (reset threshold overdrive). The graph shows the
maximum pulse width that a falling VOUT transient can
typically have without triggering a reset pulse. As the
amplitude of the transient increases (i.e., goes further
below the reset threshold), the maximum allowable
pulse width decreases. Typically, a VOUT transient that
goes only 10mV below the reset threshold and lasts for
75µs does not trigger a reset pulse.
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
12 ______________________________________________________________________________________
Power Dissipation Consideration
For the SOT23 package, any pin except the SET pin
can be used as a heatsink. If the SET pin is used as a
heatsink, excessive parasitic capacitance can affect
stability. For the TDFN package, the exposed metal
pad on the back side of a package connects to GND of
the chip. This metal pad can be used as a heatsink.
UCSP Consideration
For general UCSP package information and PC layout
considerations, refer to Maxim Application Note:
Wafer-
Level Chip-Scale Package
.
UCSP Reliability
The chip-scale package (UCSP) represents a unique
packaging form factor that might not perform equally to
a packaged product through traditional mechanical
reliability tests. CSP reliability is integrally linked to the
user’s assembly methods, circuit-board material, and
usage environment. The user should closely review
these areas when considering a CSP package.
Performance through operating life test and moisture
resistance remains uncompromised, because it is pri-
marily determined by the wafer-fabrication process.
Mechanical stress performance is a greater considera-
tion for a CSP package. CSPs are attached through
direct solder contact to the user’s PC board, forgoing
the inherent stress relief of a packaged product’s lead
frame. Solder-joint contact integrity must be considered.
Information on Maxim’s qualification plan, test data, and
recommendations are detailed in the UCSP application
note on Maxim’s website at www.maxim-ic.com.
SUFFIX OUTPUT
VOLTAGE (V)
15 1.5
16 1.6
17 1.7
18 1.8
19 1.9
20 2.0
21 2.1
22 2.2
23 2.3
24 2.4
25 2.5
26 2.6
27 2.7
28 2.8
285 2.85
29 2.9
30 3.0
31 3.1
32 3.2
33 3.3
Table 1. Output Voltage Suffix Guide
Note: Factory-trimmed custom output voltages may be avail-
able; contact factory for availability.
SUFFIX VOUT RESET
TOLERANCE (%)
A-7.5
B -12.5
Table 2. Reset Threshold Accuracy Guide
SUFFIX MINIMUM RESET
TIMEOUT PERIOD (ms)
D1 2.5
D2 20
D3 150
D4 1200
Table 3. Reset Timeout Delay Guide
MAX6469–MAX6484
DEVICE TOP MARK
MAX6469TA15BD3 ADO
MAX6469TA18AD3 ADP
MAX6469TA25BD3 ADQ
MAX6469TA28AD3 ACT
MAX6469TA30BD3 ADR
MAX6469TA33AD3 ADS
MAX6470TA15BD3 ADT
MAX6470TA18AD3 ADU
MAX6470TA25BD3 ADV
MAX6470TA28AD3 ADW
MAX6470TA30BD3 ADY
MAX6470TA33AD3 ACU
MAX6471TA15AD3 ADZ
MAX6471TA18BD3 AEA
MAX6471TA25AD3 AEB
MAX6471TA28BD3 AEC
MAX6471TA30AD3 AED
MAX6471TA33BD3 AEE
MAX6472TA15AD3 AEF
MAX6472TA18BD3 ACW
MAX6472TA25AD3 AEG
MAX6472TA28BD3 AEH
MAX6472TA30AD3 AEI
MAX6472TA33BD3 AEJ
MAX6473TA15AD3 AEK
MAX6473TA18BD3 AEL
MAX6473TA25AD3 AEM
MAX6473TA28BD3 AEN
MAX6473TA30AD3 AEO
MAX6473TA33BD3 AEP
MAX6474TA15AD3 AEQ
MAX6474TA18BD3 AER
MAX6474TA25AD3 AES
DEVICE TOP MARK
MAX6474TA28BD3 AET
MAX6474TA30AD3 AEU
MAX6474TA33BD3 AEV
MAX6475TA15BD3 AEW
MAX6475TA18AD3 AEX
MAX6475TA25BD3 AEY
MAX6475TA28AD3 AEZ
MAX6475TA30BD3 AFA
MAX6475TA33AD3 ACZ
MAX6476TA15BD3 AFB
MAX6476TA18AD3 AFC
MAX6476TA25BD3 AFD
MAX6476TA28AD3 AFE
MAX6476TA30BD3 AEF
MAX6476TA33AD3 AFG
MAX6477BL15BD3 ABW
MAX6477BL18AD3 ABG
MAX6477BL25BD3 ABX
MAX6477BL28AD3 ABY
MAX6477BL30BD3 ABZ
MAX6477BL33AD3 ACA
MAX6478BL15BD3 ACB
MAX6478BL18AD3 ACC
MAX6478BL25BD3 ACD
MAX6478BL28AD3 ACE
MAX6478BL30BD3 ACF
MAX6478BL33AD3 ACG
MAX6479BL15AD3 ACH
MAX6479BL18BD3 ACI
MAX6479BL25AD3 ACJ
MAX6479BL28BD3 ACK
MAX6479BL30AD3 ACL
MAX6479BL33BD3 ACM
Table 4. Standard Versions
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
______________________________________________________________________________________ 13
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
14 ______________________________________________________________________________________
DEVICE TOP MARK
MAX6480BL15BD3 ACN
MAX6480BL18AD3 ACO
MAX6480BL25BD3 ACP
MAX6480BL28AD3 ACQ
MAX6480BL30BD3 ACR
MAX6480BL33AD3 ABJ
MAX6481BL15BD3 ACS
MAX6481BL18AD3 ACT
MAX6481BL25BD3 ACU
MAX6481BL28AD3 ACV
MAX6481BL30BD3 ACW
MAX6481BL33AD3 ACX
MAX6482BL15BD3 ACY
MAX6482BL18AD3 ACZ
MAX6482BL25BD3 ADA
Table 4. Standard Versions (continued)
DEVICE TOP MARK
MAX6482BL28AD3 ADB
MAX6482BL30BD3 ADC
MAX6482BL33AD3 ADD
MAX6483BL15BD3 ADE
MAX6483BL18AD3 ADF
MAX6483BL25BD3 ADG
MAX6483BL28AD3 ADH
MAX6483BL30BD3 ADI
MAX6483BL33AD3 ADJ
MAX6484BL15BD3 ADK
MAX6484BL18AD3 ADL
MAX6484BL25BD3 ADM
MAX6484BL28AD3 ADN
MAX6484BL30BD3 ADO
MAX6484BL33AD3 ADP
Sample stock is generally available on standard versions only. Standard versions require a minimum order increment of 2.5k units.
Nonstandard versions must be ordered in 10k-unit increments. Contact factory for availability.
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
______________________________________________________________________________________ 15
TOP VIEW
GND
RESETSHDN
1 6 OUT
5 SET
IN
MAX6469
MAX6470
SOT23-6
2
34
GND
RESETSHDN
1 6 OUT
5MR
IN
MAX6473
MAX6474
SOT23-6
2
34
GND
RESETSHDN
1 6 OUT
5FB
IN
MAX6475
MAX6476
SOT23-6
2
34
GND
RESETMR
1 6 OUT
5 SET
IN
MAX6471
MAX6472
SOT23-6
2
34
134
865
OUT MR RESET
MAX6473
MAX6474
2
7
OUT
IN GND SHDNIN
TDFN
134
865
OUT FB RESET
MAX6475
MAX6476
2
7
OUT
IN GND SHDNIN
TDFN
1
EP*
EP* EP*
*EP = EXPOSED PAD.
34
865
OUT SET RESET
MAX6469
MAX6470
2
7
OUT
IN GND SHDNIN
TDFN
134
865
OUT SET RESET
MAX6471
MAX6472
2
7
OUT
IN GND MRIN
TDFN
Pin Configurations
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
16 ______________________________________________________________________________________
UCSP DEVICES SHOWN AS
MOUNTED ON PC BOARD.
BALL SOLDERED DOWN.
FB
3 x 3 UCSP
A1 A2 A3
IN GND SHDN
C1 C2 C3
OUT SET RESET
MAX6477
MAX6478
3 x 3 UCSP
A1 A2 A3
IN GND SHDN
C1 C2 C3
OUT MR RESET
MAX6481
MAX6482
3 x 3 UCSP
A1 A2 A3
IN GND MR
C1 C2 C3
OUT SET RESET
MAX6479
MAX6480
3 x 3 UCSP
A1 A2 A3
IN GND SHDN
C1 C2 C3
OUT RESET
MAX6483
MAX6484
TOP VIEW
Pin Configurations (continued)
MAX6469–MAX6484
1.23V
REVERSE
LEAKAGE
PROTECTION
MOS DRIVER WITH
CURRENT LIMIT
RESET
TIMEOUT
OUTPUT
STAGE
THERMAL SENSOR
IN
SHDN*
OUT
GND
RESET
RESET
COMPARATOR
ERROR
AMP
185mV
SET**
FEEDBACK-MODE
COMPARATOR
MR***
MAX6469–MAX6474
MAX6477–MAX6482
*MAX6469/MAX6470/MAX6473–MAX6478/MAX6481–MAX6484
**MAX6469–MAX6472/MAX6477–MAX6480
***MAX6471–MAX6474/MAX6479–MAX6482
Functional Diagrams
1.23V
REVERSE
LEAKAGE
PROTECTION
MOS DRIVER WITH
CURRENT LIMIT
RESET
TIMEOUT
OUTPUT
STAGE
THERMAL SENSOR
IN
SHDN
RESET
FB
OUT
GND
RESET
COMPARATOR
ERROR
AMP
MAX6475/MAX6476
MAX6483/MAX6484
µP
OUT
IN
SHDN
RESET
SET
GND GND
RESET
VCC
3.3µF
2.5V TO 5.5V
MAX6469/MAX6470
MAX6477/MAX6478
Typical Operating Circuit Chip Information
PROCESS: BiCMOS
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
______________________________________________________________________________________ 17
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
18 ______________________________________________________________________________________
PART SET SHDN MR FB PUSH-PULL
RESET
OPEN-DRAIN
RESET PACKAGE
MAX6469 √√—— SOT23-6/8-TDFN
MAX6470 √√—— SOT23-6/8-TDFN
MAX6471 SOT23-6/8-TDFN
MAX6472 —— SOT23-6/8-TDFN
MAX6473 √√ SOT23-6/8-TDFN
MAX6474 √√—— SOT23-6/8-TDFN
MAX6475 √√ SOT23-6/8-TDFN
MAX6476 SOT23-6/8-TDFN
MAX6477 √√—— 3 x 3 UCSP B9-3
MAX6478 √√—— 3 x 3 UCSP B9-3
MAX6479 3 x 3 UCSP B9-3
MAX6480 —— 3 x 3 UCSP B9-3
MAX6481 √√ 3 x 3 UCSP B9-3
MAX6482 √√—— 3 x 3 UCSP B9-3
MAX6483 √√ 3 x 3 UCSP B9-3
MAX6484 3 x 3 UCSP B9-3
Selector Guide
PART* TEMP RANGE PIN-
PACKAGE
MAX6471UT_ _ _D_-T -40°C to +85°C 6 SOT23-6
MAX6471TA_ _ _D_-T** -40°C to +85°C 8 TDFN-EP***
MAX6472UT_ _ _D_-T -40°C to +85°C 6 SOT23-6
MAX6472TA_ _ _D_-T** -40°C to +85°C 8 TDFN-EP***
MAX6473UT_ _ _D_-T -40°C to +85°C 6 SOT23-6
MAX6473TA_ _ _D_-T** -40°C to +85°C 8 TDFN-EP***
MAX6474UT_ _ _D_-T -40°C to +85°C 6 SOT23-6
MAX6474TA_ _ _D_-T** -40°C to +85°C 8 TDFN-EP***
MAX6475UT_ _ _D_-T -40°C to +85°C 6 SOT23-6
MAX6475TA_ _ _D_-T** -40°C to +85°C 8 TDFN-EP***
PART* TEMP RANGE PIN-
PACKAGE
MAX6476UT_ _ _D_-T -40°C to +85°C 6 SOT23-6
MAX6476TA_ _ _D_-T** -40°C to +85°C 8 TDFN-EP***
MAX6477BL_ _ _D_-T -40°C to +85°C 6 UCSP-6
MAX6478BL_ _ _D_-T -40°C to +85°C 6 UCSP-6
MAX6479BL_ _ _D_-T -40°C to +85°C 6 UCSP-6
MAX6480BL_ _ _D_-T -40°C to +85°C 6 UCSP-6
MAX6481BL_ _ _D_-T -40°C to +85°C 6 UCSP-6
MAX6482BL_ _ _D_-T -40°C to +85°C 6 UCSP-6
MAX6483BL_ _ _D_-T -40°C to +85°C 6 UCSP-6
MAX6484BL_ _ _D_-T -40°C to +85°C 6 UCSP-6
Ordering Information (continued)
Note: The first “_ _
are placeholders for the output voltage levels of the devices. Desired output voltages are set by the suffix found
in the Output Voltage Suffix Guide (Table 1). The third “_” is a placeholder for the reset threshold accuracy. Desired reset threshold
accuracy is set by the suffix found in the Reset Threshold Accuracy Guide (Table 2). The “_” following the D is a placeholder for the
reset timeout delay time. Desired reset timeout delay time is set by the suffix found in the Reset Timeout Delay Guide (Table 3). For
example, the MAX6481BL30BD4-T has a 3.0V output voltage, 12.5% reset threshold tolerance, and a 1200ms (min) reset timeout
delay. Sample stock is generally available on standard versions only (Table 4). Standard versions require a minimum order incre-
ment of 2.5k units. Nonstandard versions must be ordered in 10k-unit increments. Contact factory for availability.
*
Devices are also available in a lead(Pb)-free/RoHS-compliant packages. Specify lead(Pb)-free by substituting a +T instead of a -T
when ordering.
**
Future product—contact factory for availability.
***
EP = Exposed pad.
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
______________________________________________________________________________________ 19
Package Information
For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing per-
tains to the package regardless of RoHS status.
PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND
PATTERN NO.
6 SOT23-6 U6F-6 21-0058 90-0175
8 TDFN-EP T833-2 21-0137 90-0059
6 UCSP B9-3 21-0093
MAX6469–MAX6484
300mA LDO Linear Regulators with Internal
Microprocessor Reset Circuit
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
20
____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2011 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
Revision History
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
0 07/02 Initial release
4 04/05 Removed SOT23 standard versions from the data sheet 13, 14
5 12/07 Updated Typical Operating Characteristics and Pin Descriptions sections 1, 5, 7, 8
6 2/11
Added soldering temperatures to the Absolute Maximum Ratings section
and corrected MAX6471/MAX6472/MAX6479/MAX6480 Pin Description
section
2, 7
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Maxim Integrated:
MAX6469TA15BD3+T MAX6469TA18AD3+T MAX6469TA25BD3+T MAX6469TA28AD3+T MAX6469TA30BD3+T
MAX6469TA33AD3+T MAX6470TA15BD3+T MAX6470TA18AD3+T MAX6470TA25BD3+T MAX6470TA28AD3+T
MAX6470TA30BD3+T MAX6470TA33AD3+T MAX6471TA15AD3+T MAX6471TA18BD3+T MAX6471TA25AD3+T
MAX6471TA28BD3+T MAX6471TA30AD3+T MAX6471TA33BD3+T MAX6472TA18BD3+T MAX6472TA25AD3+T
MAX6472TA28BD3+T MAX6472TA30AD3+T MAX6472TA33BD3+T MAX6473TA15AD3+T MAX6473TA18BD3+T
MAX6473TA25AD3+T MAX6473TA28BD3+T MAX6473TA30AD3+T MAX6473TA33BD3+T MAX6474TA15AD3+T
MAX6474TA18BD3+T MAX6474TA25AD3+T MAX6474TA28BD3+T MAX6474TA30AD3+T MAX6474TA33BD3+T
MAX6475TA15BD3+T MAX6475TA18AD3+T MAX6475TA25BD3+T MAX6475TA28AD3+T MAX6475TA30BD3+T
MAX6475TA33AD3+T MAX6476TA15BD3+T MAX6476TA18AD3+T MAX6476TA28AD3+T MAX6476TA30BD3+T
MAX6469UT28AD3+T