Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012 1
DATA SHEET
SKY77768 Power Amplifier Module for WCDMA / HSDPA /
HSUPA / HSPA+ / LTE – Band VIII (880 MHz–915 MHz)
Applications
• WCDMA handsets
• HSDPA
• HSUPA
• HSPA+
• LTE
Features
• Low voltage positive bias
supply 3.2 V to 4.2 V
• Good linearity
• High efficiency
- 50% at 28.5 dBm
• Large dynamic range
• Small, low profile package
- 3 mm x 3 mm x 0.9 mm
- 10-pad configuration
• Power down control
• InGaP
• Supports low collector
voltage operation
• Digital Enable
• No VREF required
• CMOS compatible control
signals
• Integrated Directional
Coupler
Description
The SKY77768 Power Amplifier Module (PAM) is a fully matched 10-pad surface mount module
developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient
module packs full 880-915 MHz bandwidth coverage into a single compact package. Because of high
efficiencies attained throughout the entire power range, the SKY77768 delivers unsurpassed talk-time
advantages. The SKY77768 meets the stringent spectral linearity requirements of High Speed
Downlink Packet Access (HSDPA), High Speed Uplink Packet Access (HSUPA), and Long Term
Evolution (LTE) data transmission with high power added efficiency. An integrated directional coupler
eliminates the need for any external coupler.
The Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all amplifier
active circuitry, including input and interstage matching circuits. The silicon CMOS support die,
providing precision biasing for the MMIC affords a true CMOS-compatible control interface. Output
match into a 50-ohm load, realized off-chip within the module package, optimizes efficiency and
power performance.
The SKY77768 is manufactured with Skyworks' InGaP GaAs Heterojunction Bipolar Transistor (HBT)
process which provides for all positive voltage DC supply operation and maintains high efficiency and
good linearity. While primary bias to the SKY77768 can be supplied directly from any suitable battery
with an output of 3.2 V to 4.2 V, optimal performance is obtained with VCC2 sourced from a DCDC
power supply adjusted within 0.5 V to 3.6 V based on target output power levels. Power down
executes by setting VENABLE to zero volts. No external supply side switch is needed as typical "off"
leakage is a few microamperes with full primary voltage supplied from the battery.
FIGURE 1. SKY77768 FUNCTIONAL BLOCK DIAGRAM
DATA SHEET SKY77768 POWER AMPLIFIER MODULE for WCDMA /
HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
2 November 29, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201722F
Electrical Specifications
The following tables list the electrical characteristics of the
SKY77768 Power Amplifier. Table 1 lists the absolute maximum
ratings and Table 2 shows the recommended operating
conditions. Electrical specifications for nominal operating
conditions are listed in Table 4. Table 3 presents a truth table for
the power settings. Tables 5 through 8 provide the standard test
configurations for WCDMA (STC1), HSDPA (STC2), and HSUPA
(STC3, STC4) respectively.
TABLE 1. ABSOLUTE MAXIMUM OPERATING CONDITIONS
No damage assuming only one parameter set at limit at a time with all other parameters set at nominal value.
Parameter Symbol Minimum Nominal Maximum Unit
RF Input Power
P
IN
—
0
10
dBm
Supply Voltage1
No RF
V
CC1
—
3.8
6.0
Volts
With RF
—
3.8
5.0
No RF
VCC2
—
3.4
6.0
With RF
—
3.4
4.6
Enable Control Voltage
V
EN
—
1.8
4.2
Volts
Mode Control Voltage
V
MODE0
—
1.8
4.2
Volts
VMODE1
—
1.8
4.2
Case Temperature
2
Operating
TCASE
–30
+25
+110
°C
Storage
T
STG
–40
—
+150
1 Overvoltage shutdown circuitry turns on at approximately 5 V.
2
CASE
TABLE 2. RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Minimum Nominal Maximum Unit
RF Output Power1
WCDMA
P
OUT_MAX
28.50
—
—
dBm
HSDPA
27.50
—
—
HSUPA
24.85
—
—
LTE
27.50
—
—
Operating Frequency
ƒ
O
880.0
897.5
915.0
MHz
Supply Voltage
VCC1
3.02
3.4
4.5
Volts
VCC2
0.5
—
3.6
Enable Control Voltage
Low
V
EN_L
0.0
0.0
0.5
Volts
High
V
EN_H
1.35
1.8
3.1
Mode Control Voltage
Low
V
MODE0
0.0
0.0
0.5
Volts
V
MODE1
0.0
0.0
0.5
High
VMODE0
1.35
1.8
3.1
V
MODE1
1.35
1.8
3.1
Case Operating Temperature3
T
CASE
–20
+25
+85
°C
1 For VCC < 3.4 V, output power back-off = 0.5 dB.
2 Recommended minimum VCC for maximum power output is indicated. VCC2 down to 0.5 V may be used for backed-off power when using DC/DC converter to conserve battery current.
3 Equivalent to –30 °C to +75 °C Ambient Operating Temperature
SKY77768 POWER AMPLIFIER MODULE for WCDMA / DATA SHEET
HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012 3
TABLE 3. MODES OF OPERATION
Power Setting ENABLE VMODE0 VMODE1 VCC
Power Down Mode
Low
Low
Low
On
Standby Mode
Low
—
—
On
High Power Mode (17.0 dBm ≤ P
OUT
≤ 28.5 dBm)
High
Low
—
On
Medium Power Mode (7.0 dBm ≤ POUT ≤ 17.0 dBm)
High
High
Low
On
Low Power Mode (P
OUT
≤ 7.0 dBm)
High
High
High
On
TABLE 4. ELECTRICAL SPECIFICATIONS FOR NOMINAL OPERATING CONDITIONS
Per Table 2 over dynamic range up to 28.5 dBm output power for STC1 modulation, unless otherwise specified.
Characteristics Symbol Condition Minimum Typical Maximum Unit
Gain1
G
LOW
P
OUT
= 7.0 dBm
VCC2 = 0.8 V
10.0
14.0
21.5
dB
GMED POUT
=
17.0 dBm
VCC2 = 1.5 V
19.0 24.0 28.0
G
HIGH
P
OUT
= 28.5 dBm
25.0
28.0
31.0
Rx Band Gain
RxG
—
—
—
–0.5
dB
RxG_GPS
—
—
—
–3.0
RxG
_ISM
—
—
—
–6.0
Power Added Efficiency
PAE
LOW
P
OUT
= 7.0 dBm
10.5
13.0
—
%
PAEMED
POUT = 17.0 dBm
22.0
26.5
—
PAE
HIGH
P
OUT
= 28.5 dBm
43.0
50.0
—
Total Supply Current
ICC_LOW
POUT = 7.0 dBm
—
44
55
mA
I
CC_MED
P
OUT
= 17.0 dBm
—
122
150
I
CC_HIGH
P
OUT
= 28.5 dBm
—
420
500
Quiescent Current
IQ_LOW
Low Power Mode
—
22
28
mA
I
Q_MED
Medium Power Mode
—
38
45
Enable Control Current
I
EN
—
—
20
40
µA
Mode Control Current
IMODE0
—
—
20
40
µA
I
MODE1
—
—
20
40
Total Supply Current in Power Down Mode
I
PD
V
CC
= 3.4 V
VEN = Low
VMODE0 = Low
VMODE1 = Low
—
—
20
µA
ICC1 Current
ICC1_HIGH
—
—
—
10
mA
Adjacent Channel Leakage power Ratio
2
5 MHz offset ACLR5
P
OUT
= 7.0 dBm
—
–43
–40.0
dBc
P
OUT
= 17.0 dBm
—
–45
–40.0
POUT = 28.5 dBm
—
–41
–38.5
10 MHz offset
ACLR10
P
OUT
= 7.0 dBm
—
–59
–50.0
P
OUT
= 17.0 dBm
—
–56
–50.0
POUT = 28.5 dBm
—
–58
–50.0
DATA SHEET SKY77768 POWER AMPLIFIER MODULE for WCDMA /
HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
4 November 29, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201722F
TABLE 4. [CONTINUED] ELECTRICAL SPECIFICATIONS FOR NOMINAL OPERATING CONDITIONS
Per Table 2 over dynamic range up to 28.5 dBm output power for STC1 modulation, unless otherwise specified.
Characteristics Symbol Condition Minimum Typical Maximum Unit
Adjacent Channel Leakage power Ratio3
EUTRA offset
ACLR_EUTRA
POUT ≤ (POUT_MAX – MPR4)
—
–40
—
dBc
UTRA offset
ACLR1
_UTRA
—
—
–42
—
ACLR2
_UTRA
—
—
—
—
Harmonic Suppression
Second
f02
POUT
≤
28.5 dBm
—
–45
–35
dBc
Third
f
0
3
—
–50
–45
Tx Noise in Rx Bands
1
Rx Band 1
925 MHz–960 MHz
—
–136
–134
dBm/Hz
GPS Rx
1574 MHz–1577 MHz
—
—
–140
ISM Rx
2400 MHz–2483.5 MHz
—
—
–143
EVM
EVM1
POUT = POUT_MAX
—
—
3.35
%
EVM2
POUT = POUT_MAX – 3
—
—
2.50
Rise / Fall Time
DC
TON
_DC
—
—
—
20
µs
TOFF_DC
—
—
—
20
RF
TON
_RF
—
—
—
6
TOFF
_RF
—
—
—
6
Coupling Factor
CPL
P
OUT
= P
OUT_MAX
–22
–20
–18
dB
CPL
_OUT
/ P
OUT
Power Ratio Variation Over Output VSWR
2.5:1 VSWR at P
OUT
all VSWR phases
CPL
_IN
50 Ω terminated
—
±0.4
—
dB
Daisy-chain
VSWR
CPL
_IN
and CPL
_OUT
ports
698 MHz to 2620 MHz
V
EN
= Low
—
—
1.3:1
Insertion Loss
CPL
_IN
to CPL
_OUT
ports
698 MHz to 2620 MHz
VEN = Low
—
—
0.45
dB
Input Voltage Standing Wave Ratio VSWR — — 1.2:1 1.9:1 —
Stability (Spurious output)1
S
6:1 VSWR All phases
—
—
–70
dBc
Ruggedness – no damage1,5
Ru
P
OUT
≤ 28.5 dBm
10:1
—
—
VSWR
1 Over conditions
2 ACLR is expressed as a ratio of total adjacent power to WCDMA modulated in-band, both measured in 3.84 MHz bandwidth at specified offsets.
3 LTE: EVM and ACLR are measured with QPSK modulation with 1.4 MHz bandwidth and 5 resource blocks. (Maximum Power Reduction = 0 dBm per 3GPP TS36.101.
4 MPR is the maximum power reduction as defined in 3GPP TS36.101
5 All phases, time = 10 seconds.
SKY77768 POWER AMPLIFIER MODULE for WCDMA / DATA SHEET
HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012 5
TABLE 5. STANDARD TEST CONFIGURATION – STC1 WCDMA MODE
Parameter Level Spread Code Spread Factor
I/Q
β
c
β
d
β
hs
β
ec
β
ed Relative Power (dB)
DPCCH
15 kbps
0
256
Q
8/15
—
—
—
—
–6.547
DPDCH
60 kbps
16
64
I
—
15/15
—
—
—
–1.087
TABLE 6. STANDARD TEST CONFIGURATION – STC2 HSDPA MODE
Parameter Level Spread Code Spread Factor I/Q
β
c
β
d
β
hs
β
ec
β
ed Relative Power (dB)
DPCCH
15 kbps
0
256
Q
12/15
—
—
—
—
–7.095
DPDCH
60 kbps
16
64
I
—
15/15
—
—
—
–5.157
HS-DPCCH
15 kbps
64
256
Q
—
—
24/15
—
—
–3.012
TABLE 7. STANDARD TEST CONFIGURATION – STC3 HSUPA MODE
Parameter Level Spread Code Spread Factor
I/Q
β
c
β
d
β
hs
β
ec
β
ed Relative Power (dB)
DPCCH
15 kbps
0
256
Q
8/15
—
—
—
—
–19.391
DPDCH
960 kbps
1
4
I
—
15/15
—
—
—
–13.931
HS- DPCCH
15 kbps
64
256
Q
—
—
8/15
—
—
–19.391
E-DPCCH
15 kbps
1
256
I
—
—
—
10/15
—
–17.338
E-DPDCH
960 kbps
2
4
I
—
—
—
—
71.5/15
–0.371
TABLE 8. STANDARD TEST CONFIGURATION – STC4 HSUPA MODE
Parameter Level Spread Code Spread Factor
I/Q
β
c
β
d
β
hs
β
ec
β
ed Relative Power (dB)
DPCCH
15 kbps
0
256
Q
6/15
—
—
—
—
–12.499
DPDCH
960 kbps
1
4
I
—
15/15
—
—
—
–4.540
HS- DPCCH
15 kbps
64
256
Q
—
—
2/15
—
—
–22.041
E-DPCCH
15 kbps
1
256
I
—
—
—
12/15
—
–6.478
E-DPDCH
960 kbps
2
4
I
—
—
—
—
15/15
–4.425
DATA SHEET SKY77768 POWER AMPLIFIER MODULE for WCDMA /
HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
6 November 29, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201722F
Evaluation Board Description
The evaluation board is a platform for testing and interfacing
design circuitry. To accommodate the interface testing of the
SKY77768, the evaluation board schematic and assembly
diagrams are included for preliminary analysis and design. Figure
2 shows the basic schematic of the board for the 880 MHz to 915
MHz range shown in Figure 3. Figure 4 is a schematic of the
recommended application shown in Figure 5.
FIGURE 2. EVALUATION BOARD SCHEMATIC
FIGURE 3. EVALUATION BOARD ASSEMBLY DIAGRAM
SKY77768 POWER AMPLIFIER MODULE for WCDMA/ DATA SHEET
HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012 7
FIGURE 4. SKY77768 SCHEMATIC FOR RECOMMENDED APPLICATION DIAGRAM
FIGURE 5. SKY77768 RECOMMENDED APPLICATION DIAGRAM
DATA SHEET SKY77768 POWER AMPLIFIER MODULE for WCDMA /
HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
8 November 29, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201722F
Package Dimensions
The SKY77768 is a multi-layer laminate base, overmold
encapsulated modular package designed for surface mount solder
attachment to a printed circuit board. Figure 6 is a mechanical
drawing of the pad layout for this package. Figure 7 provides a
recommended phone board layout footprint for the PAM to help
the designer attain optimum thermal conductivity, good
grounding, and minimum RF discontinuity for the 50-ohm
terminals.
FIGURE 6. DIMENSIONAL DIAGRAM FOR 3 mm X 3 mm X 0.9 mm PACKAGE – SKY77768 SPECIFIC
SKY77768 POWER AMPLIFIER MODULE for WCDMA/ DATA SHEET
HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012 9
FIGURE 7. PHONE PCB LAYOUT DIAGRAM – 3 mm X 3 mm, 10-PAD PACKAGE – SKY77768
DATA SHEET SKY77768 POWER AMPLIFIER MODULE for WCDMA /
HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
10 November 29, 2012 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 201722F
Package Description
Figure 8 shows the pad functions and the pad numbering
convention, which starts with pad 1 in the upper left and
increments counter-clockwise around the package. Typical case
markings are illustrated in Figure 9.
FIGURE 8. SKY77768 PAD NAMES AND CONFIGURATION (TOP VIEW)
FIGURE 9. TYPICAL CASE MARKINGS
Package Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77768 is capable of withstanding an MSL3/260 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 3 °C per second; maximum temperature
should not exceed 260 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 260 °C for more than 10 seconds. For
details on attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD-020.
Production quantities of this product are shipped in the standard
tape-and-reel format (Figure 10).
Electrostatic Discharge (ESD) Sensitivity
The SKY77768 meets class 1C JESD22-A114 Human Body Model
(HBM), class IV JESD22-C101 Charged-Device Model (CDM), and
class A JESD22-A115 Machine Model (MM) electrostatic
discharge (ESD) sensitivity classification.
To avoid ESD damage, both latent and visible, it is very important
that the product assembly and test areas follow the ESD handling
precautions listed below.
• Personnel Grounding
- Wrist Straps
- Conductive Smocks, Gloves and Finger Cots
- Antistatic ID Badges
• Protective Workstation
- Dissipative Table Top
- Protective Test Equipment (Properly Grounded)
- Grounded Tip Soldering Irons
- Solder Conductive Suckers
- Static Sensors
• Facility
- Relative Humidity Control and Air Ionizers
- Dissipative Floors (less than 1,000 MΩ to GND)
• Protective Packaging and Transportation
- Bags and Pouches (Faraday Shield)
- Protective Tote Boxes (Conductive Static Shielding)
- Protective Trays
- Grounded Carts
- Protective Work Order Holders
SKY77768 POWER AMPLIFIER MODULE for WCDMA/ DATA SHEET
HSDPA / HSUPA / HSPA+ / LTE – BAND VIII (880–915 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
201722F • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • November 29, 2012 11
FIGURE 10. DIMENSIONAL DIAGRAM FOR CARRIER TAPE BODY SIZE – 3 mm X 3 mm X 0.75 / 0.90 mm – MCM
Ordering Information
Product Name Order Number Evaluation Board Part Number
SKY77768 Power Amplifier Module
SKY77768-11
EN40-D345-003
Revision History
Revision Date Description
A
December 20, 2011
Initial Release – Information
B
January 25, 2012
Revise: Figure 1; Table 1
C
March 9, 2012
Revise: Table 4; Figures 2, 3, 6, 7
Add: Figures 4, 5
D
September 19, 2012
Revise: Figures 2–5; Tables 2, 4; Ordering Information Table (last page)
E
October 26, 2012
Revise: Change Data Sheet status from ADVANCE to FINAL; Table 4; Ordering Information table
F November 29, 2012 Revise: Table 1 (Supply Voltage, Case Operating Temperature); Table 2 (Case Operating Temperature
footnote)
References
Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752.
Standard SMT Reflow Profiles: JEDEC Standard J–STD–020
Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-A114 Human Body Model (HBM)
Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-A115 Machine Model (MM)
Electrostatic Discharge Sensitivity (ESD) Testing: JEDEC Standard, JESD22-C101 Charged Device Model (CDM).
Copyright © 2011, 2012, Skyworks Solutions, Inc. All Rights Reserved.
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information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
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