2N7000
Characteristics (Tj = 25°C) Kennwerte (Tj = 25°C)
Min. Typ. Max.
Drain-Source breakdown voltage – Drain-Source Durchbruchspannung
ID = 10 µA V(BR)DSS 60 V
Drain-Source leakage current – Drain-Source Leckstrom G short
VDS = 48 V
VDS = 48 V, Tj = 125°C
IDSS
IDSS
1 µA
1 mA
Gate-Body leakage current – Gate-Substrat Leckstrom
VGS = ±15 V ±IGSS 10 nA
Gate-Threshold voltage – Gate-Source Schwellspannung
VGS = VDS, ID = 1 mA VGS(th) 0.8 V 3 V
Drain-Source on-voltage – Drain-Source-Spannung
VGS = 10 V, ID = 500 mA
VGS = 4.5 V, ID = 75 mA
VDS(on) 2.5 V
0.45 V
Drain-Source on-state resistance – Drain-Source Einschaltwiderstand
VGS = 10 V, ID = 500 mA
VGS = 4.5 V, ID = 75 mA
RDS(on)
RDS(on)
5 Ω
6 Ω
Forward Transconductance – Übertragungssteilheit
VDS = 10 V, ID = 200 mA
gFS 100 mS
Input Capacitance – Eingangskapazität
VDS = 25 V, f = 1 MHz Ciss 60 pF
Output Capacitance – Ausgangskapazität
VDS = 25 V, f = 1 MHz Coss 25 pF
Reverse Transfer Capacitance – Rückwirkungskapazität
VDS = 25 V, f = 1 MHz Crss 5 pF
Turn-On Delay Time – Einschaltverzögerung
VDD= 15 V, RL= 30 Ω, ID= 0.5 A, VGS= 10 V, RG= 25 Ω ton 10 ns
Turn-Off Delay Time – Ausschaltverzögerung
VDD= 15 V, RL= 30 Ω, ID= 0.5 A, VGS= 10 V, RG= 25 Ω toff 10 ns
Thermal resistance junction to ambient air
Wärmewiderstand Sperrschicht – umgebende Luft RthA < 357 K/W 1)
1 Device mounted on standard PCB material
Bauteil montiert auf Standard-Leiterplattenmaterial
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