S8GC - S8MC
Taiwan Semiconductor
1 Version:D1708
8A, 400V - 1000V Surface Mount Glass Passivated Rectifier
FEATURES
Low forward voltage drop
Ideal for automated placement
High surge current capability
Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
Halogen-free according to IEC 61249-2-21
APPLICATIONS
Switching mode power supply (SMPS)
Adapters
Lighting application
Converter
MECHANICAL DATA
Case: DO-214AB (SMC)
Molding compound meets UL 94V-0 flammability rating
Part no. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound
(halogen-free)
Moisture sensitivity level: level 1, per J-STD-020
Terminal: Matte tin plated leads, solderable per J-STD-002
Meet JESD 201 class 2 whisker test
Polarity: As marked
Weight: 0.27 g (approximately)
KEY PARAMETERS
PARAMETER
VALUE
UNIT
IF(AV)
8
A
VRRM
400 - 1000
V
IFSM
200
A
TJ MAX
150
°C
Package
DO-214AB (SMC)
Configuration
Single die
DO-214AB (SMC)
PARAMETER
SYMBOL
S8GC
S8JC
S8KC
S8MC
UNIT
Marking code on the device
S8GC
S8JC
S8KC
S8MC
Repetitive peak reverse voltage
VRRM
400
600
800
1000
V
Reverse voltage, total rms value
VR(RMS)
280
420
560
700
V
Maximum DC blocking voltage
VDC
400
600
800
1000
V
Forward current
IF(AV)
8
A
Surge peak forward current, 8.3 ms
single half sine-wave superimposed on
rated load per diode
TJ =25°C
IFSM
200
A
TJ =125°C
170
A
Surge peak forward current, 1.0 ms
single half sine-wave superimposed on
rated load per diode
TJ =25°C
IFSM
600
A
TJ =125°C
338
A
Junction temperature
TJ
- 55 to +150
°C
Storage temperature
TSTG
- 55 to +150
°C
S8GC - S8MC
Taiwan Semiconductor
2 Version:D1708
PARAMETER
SYMBOL
LIMIT
UNIT
Junction-to-lead thermal resistance per diode
RӨJL
12.5
°C/W
Junction-to-ambient thermal resistance per diode
RӨJA
44.0
°C/W
PARAMETER
CONDITIONS
SYMBOL
TYP.
MAX.
UNIT
Forward voltage per diode (1)
IF = 8A, TJ = 25°C
VF
-
0.985
V
Reverse current @ rated VR per diode (2)
TJ = 25°C
IR
-
10
µA
TJ = 125°C
-
250
µA
Junction capacitance
1 MHz, VR=4.0V
CJ
48
-
pF
Notes:
1. Pulse test with PW=0.3 ms
2. Pulse test with PW=30 ms
PART NO.
PART NO.
SUFFIX
PACKING
CODE
PACKING CODE
SUFFIX
PACKAGE
PACKING
S8xC
(Note 1)
H
R7
G
SMC
850 / 7" Plastic reel
R6
SMC
3,000 / 13" Paper reel
M6
SMC
3,000 / 13" Plastic reel
V7
Matrix SMC
850 / 7" Plastic reel
V6
Matrix SMC
3,000 / 13" Plastic reel
Note :
1. "x" defines voltage from 400V (S8GC) to 1000V (S8MC)
EXAMPLE P/N
PART NO.
PART NO.
SUFFIX
PACKING
CODE
PACKING CODE
SUFFIX
DESCRIPTION
S8GCHR7G
S8GC
H
R7
G
AEC-Q101 qualified
Green compound
S8GC - S8MC
Taiwan Semiconductor
3 Version:D1708
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.1 Forward Current Derating Curve
Fig.2 Maximum Non-repetitive Forward Surge
Current
Fig.3 Typical Reverse Characteristics
Fig.4 Typical Forward Characteristics
0
2
4
6
8
10
025 50 75 100 125 150
RESISTIVEOR
INDUCTIVE LOAD
0
50
100
150
200
250
110 100
PEAK FORWARD SURGE CURRENT(A)
NUMBER OF CYCLES AT 60 HZ
8.3ms Single Half Sine Wave
0.01
0.1
1
10
100
020 40 60 80 100
TJ=125°C
TJ=25°C
0.1
1
10
100
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
TJ=125°C
TJ=25°C
INSTANTANEOUS REVERSE CURRENT (μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
INSTANTANEOUS FORWARD CURRENT (A)
(A)
0.001
0.01
0.1
1
10
0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2
Pulse width
TJ=25°C
TJ=125°C
UF1DLW
FORWARD VOLTAGE (V)
AVERAGE FORWARD CURRENT (A)
LEAD TEMPERATURE (°C)
S8GC - S8MC
Taiwan Semiconductor
4 Version:D1708
PACKAGE OUTLINE DIMENSIONS
DO-214AB (SMC)
DIM.
Unit (mm)
Unit (inch)
Min.
Max.
Min.
Max.
A
2.90
3.20
0.114
0.126
B
6.60
7.11
0.260
0.280
C
5.59
6.22
0.220
0.245
D
2.00
2.62
0.079
0.103
E
1.00
1.60
0.039
0.063
F
7.75
8.13
0.305
0.320
G
0.10
0.20
0.004
0.008
H
0.15
0.31
0.006
0.012
SUGGESTED PAD LAYOUT
MARKING DIAGRAM
Symbol
Unit (mm)
Unit (inch)
A
3.30
0.130
B
2.50
0.098
C
6.80
0.268
D
4.40
0.173
E
9.40
0.370
P/N
=Marking Code
G
=Green Compound
YW
=Date Code
F
=Factory Code
S8GC - S8MC
Taiwan Semiconductor
5 Version:D1708
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
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merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
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