
62mmC-SerienModulmitTrench/FeldstopIGBT³undEmitterControlled³Diode
62mmC-seriesmodulewithtrench/fieldstopIGBT³andEmitterControlled³diode
1
TechnischeInformation/TechnicalInformation
FF200R17KE3
IGBT-Module
IGBT-modules
preparedby:HS
approvedby:WR
dateofpublication:2013-10-03
revision:2.1
VorläufigeDaten
PreliminaryDataIGBT,Wechselrichter/IGBT,Inverter
HöchstzulässigeWerte/MaximumRatedValues
Kollektor-Emitter-Sperrspannung
Collector-emittervoltage Tvj = 25°C VCES 1700 V
Kollektor-Dauergleichstrom
ContinuousDCcollectorcurrent TC = 80°C, Tvj max = 150°C
TC = 25°C, Tvj max = 150°C
IC nom
IC200
310 A
A
PeriodischerKollektor-Spitzenstrom
Repetitivepeakcollectorcurrent tP = 1 ms ICRM 400 A
Gesamt-Verlustleistung
Totalpowerdissipation TC = 25°C, Tvj max = 150 Ptot 1250 W
Gate-Emitter-Spitzenspannung
Gate-emitterpeakvoltage VGES +/-20 V
CharakteristischeWerte/CharacteristicValues min. typ. max.
Kollektor-Emitter-Sättigungsspannung
Collector-emittersaturationvoltage IC = 200 A, VGE = 15 V
IC = 200 A, VGE = 15 V VCE sat
2,00
2,40
2,45
V
V
Tvj = 25°C
Tvj = 125°C
Gate-Schwellenspannung
Gatethresholdvoltage IC = 8,00 mA, VCE = VGE, Tvj = 25°C VGEth 5,2 5,8 6,4 V
Gateladung
Gatecharge VGE = -15 V ... +15 V QG2,30 µC
InternerGatewiderstand
Internalgateresistor Tvj = 25°C RGint 3,8 Ω
Eingangskapazität
Inputcapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cies 18,0 nF
Rückwirkungskapazität
Reversetransfercapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cres 0,60 nF
Kollektor-Emitter-Reststrom
Collector-emittercut-offcurrent VCE = 1700 V, VGE = 0 V, Tvj = 25°C ICES 3,0 mA
Gate-Emitter-Reststrom
Gate-emitterleakagecurrent VCE = 0 V, VGE = 20 V, Tvj = 25°C IGES 400 nA
Einschaltverzögerungszeit,induktiveLast
Turn-ondelaytime,inductiveload IC = 200 A, VCE = 900 V
VGE = ±15 V
RGon = 6,8 Ω
td on
0,28
0,30
µs
µs
Tvj = 25°C
Tvj = 125°C
Anstiegszeit,induktiveLast
Risetime,inductiveload IC = 200 A, VCE = 900 V
VGE = ±15 V
RGon = 6,8 Ω
tr
0,08
0,10
µs
µs
Tvj = 25°C
Tvj = 125°C
Abschaltverzögerungszeit,induktiveLast
Turn-offdelaytime,inductiveload IC = 200 A, VCE = 900 V
VGE = ±15 V
RGoff = 6,8 Ω
td off
0,80
1,00
µs
µs
Tvj = 25°C
Tvj = 125°C
Fallzeit,induktiveLast
Falltime,inductiveload IC = 200 A, VCE = 900 V
VGE = ±15 V
RGoff = 6,8 Ω
tf
0,12
0,20
µs
µs
Tvj = 25°C
Tvj = 125°C
EinschaltverlustenergieproPuls
Turn-onenergylossperpulse IC = 200 A, VCE = 900 V, LS = 60 nH
VGE = ±15 V
RGon = 6,8 ΩEon 58,0
78,0
mJ
mJ
Tvj = 25°C
Tvj = 125°C
AbschaltverlustenergieproPuls
Turn-offenergylossperpulse IC = 200 A, VCE = 900 V, LS = 60 nH
VGE = ±15 V
RGoff = 6,8 ΩEoff 43,0
63,0
mJ
mJ
Tvj = 25°C
Tvj = 125°C
Kurzschlußverhalten
SCdata VGE ≤ 15 V, VCC = 1000 V
VCEmax = VCES -LsCE ·di/dt ISC
800
A
Tvj = 125°C
tP ≤ 10 µs,
Wärmewiderstand,ChipbisGehäuse
Thermalresistance,junctiontocase proIGBT/perIGBT RthJC 0,10 K/W
Wärmewiderstand,GehäusebisKühlkörper
Thermalresistance,casetoheatsink proIGBT/perIGBT
λPaste=1W/(m·K)/λgrease=1W/(m·K) RthCH 0,033 K/W
TemperaturimSchaltbetrieb
Temperatureunderswitchingconditions Tvj op -40 125 °C