175MHz, FemtoClock(R) VCXO Based Sonet/SDH Jitter Attenuators 843002I-40 DATA SHEET General Description Features The ICS843002I-40 is a PLL based synchronous clock generator that is optimized for SONET/SDH line card applications where jitter attenuation and frequency translation is needed. The device contains two internal PLL stages that are cascaded in series. The first PLL stage uses a VCXO which is optimized to provide reference clock jitter attenuation and to be jitter tolerant, and to provide a stable reference clock for the 2nd PLL stage (typically 19.44MHz). The second PLL stage provides additional frequency multiplication (x32), and it maintains low output jitter by using a low phase noise FemtoClock VCO. PLL multiplication ratios are selected from internal lookup tables using device input selection pins. The device performance and the PLL multiplication ratios are optimized to support non-FEC (non-Forward Error Correction) SONET/SDH applications with rates up to OC-48 (SONET) or STM-16 (SDH). The VCXO requires the use of an external, inexpensive pullable crystal. VCXO PLL uses external passive loop filter components which are used to optimize the PLL loop bandwidth and damping characteristics for the given line card application. * * * Two Differential LVPECL outputs * * * Maximum output frequency: 175MHz * * * Full 3.3V or mixed 3.3V core/2.5V output operating supply The ICS843002I-40 includes two clock input ports. Each one can accept either a single-ended or differential input. Each input port also includes an activity detector circuit, which reports input clock activity through the LOR0 and LOR1 logic output pins. The two input ports feed an input selection mux. "Hitless switching" is accomplished through proper filter tuning. Jitter transfer and wander characteristics are influenced by loop filter tuning, and phase transient performance is influenced by both loop filter tuning and alignment error between the two reference clocks. Available in lead-free (RoHS 6) package nCLK1 VEE CLK1 R_SEL0 R_SEL1 R_SEL2 XTAL_IN XTAL_OUT 32 31 30 29 28 27 26 25 LF1 1 24 LOR0 LF0 2 23 LOR1 ISET 3 22 nc VCC 4 21 VCCO_LVCMOS CLK0 5 20 VCCO_LVPECL nCLK0 6 19 nQB CLK_SEL 7 18 QB 17 VEE nc Output clock frequency selections: 19.44MHz, 77.76MHz, 155.52MHz, Hi-Z 8 nQA QA VCCA QB_SEL0 9 10 11 12 13 14 15 16 QA_SEL1 * -40C to 85C ambient operating temperature nc Input Reference clock frequency selections: 19.44MHz, 38.88MHz, 77.76MHz, 155.52MHz, 311.04MHz, 622.08MHz RMS phase jitter @ 155.52MHz, using a 19.44MHz crystal (12kHz to 20MHz): 0.81ps (typical) QB_SEL1 * FemtoClock VCO frequency range: 560MHz - 700MHz QA_SEL0 VCXO 19.44MHz crystal CLKx, nCLKx pairs can accept the following differential input levels: LVPECL, LVDS, LVHSTL, SSTL, HCSL or single-ended LVCMOS or LVTTL levels Pin Assignment Typical ICS843002I-40 configuration in SONET/SDH Systems: * Selectable CLKx, nCLKx differential input pairs ICS843002I-40 32-Lead VFQFN 5mm x 5mm x 0.925mm package body K Package Top View 843002I-40 Rev C 9/4/14 1 (c)2014 Integrated Device Technology, Inc. 843002I-40 DATA SHEET Block Diagram LF0 VCCO_LVCMOS CLK1 nCLK1 Activity Detector LOR1 1 R Divider = 1, 2, 4, 8, 16 or 32 Phase Detector Divide by 32 LF1 Charge Pump and Loop Filter 0 CLK0 nCLK0 XTAL_OUT ISET ICS843002I-40 19.44 MHz Pullable xtal XTAL_IN External Loop Components VCXO 19.44 MHz Divide by 32 Activity Detector VCXO Jitter Attenuation PLL LOR0 VCCO_LVPECL 622.08 MHz CLK_SEL 110 FemtoClock PLL x32 110 QA nQA C0 Divider = 4, 8, 32, or HiZ 111 2 QA_SEL1:0 111 R_SEL2:0 QB nQB C1 Divider = 4, 8, 32, or HiZ 3 2 QB_SEL1:0 NOTE: 19.44MHz VCXO crystal shown is typical for SONET/SDH device applications. 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 2 Rev C 9/4/14 843002I-40 DATA SHEET Table 1. Pin Descriptions Number Name Type Description 1, 2 LF1, LF0 Analog Input/Output Loop filter connection node pins. 3 ISET Analog Input/Output Charge pump current setting pin. 4 VCC Power 5 CLK0 Input Pulldown Non-inverting differential clock input. Inverting differential clock input. VCC/2 bias voltage when left floating. Input clock select. LVCMOS/LVTTL interface levels. See Table 3A. Core power supply pin. 6 nCLK0 Input Pullup Pulldown 7 CLK_SEL Input Pulldown 8, 11, 22 nc Unused 9, 10 QA_SEL1, QA_SEL0 Input Pullup Output divider control for QA/nQA LVPECL outputs. LVCMOS/LVTTL interface levels.See Table 3C. 12, 13 QB_SEL1, QB_SEL0 Input Pullup Output divider control for QB/nQB LVPECL outputs. LVCMOS/LVTTL interface levels.See Table 3C. 14 VCCA Power Analog supply pin. 15, 16 QA, nQA Output Differential clock output pair. LVPECL interface levels. 17, 27 VEE Power Negative supply pins. 18, 19 QB, nQB Output Differential clock output pair. LVPECL interface levels. 20 VCCO_LVPECL Power Output supply pin for LVPECL outputs. 21 VCCO_LVCMOS Power Output supply pin for LVCMOS/LVTTL outputs. 23 LOR1 Output Alarm output, loss of reference for CLK1/nCLK1. LVCMOS/LVTTL interface levels. 24 LOR0 Output Alarm output, loss of reference for CLK0/nCLK0. LVCMOS/LVTTL interface levels. 25 nCLK1 Input Pullup Pulldown Inverting differential clock input. VCC/2 bias voltage when left floating. 26 CLK1 Input Pulldown Non-inverting differential clock input. 28, 29, 30 R_SEL0, R_SEL1, R_SEL2 Input Pulldown Input divider selection. LVCMOS/LVTTL interface levels. See Table 3B. 31, 32 XTAL_OUT, XTAL_IN Input No connect. Crystal oscillator interface. The XTAL_IN is the input. XTAL_OUT is the output. NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values. Table 2. Pin Characteristics Symbol Parameter CIN Input Capacitance 4 pF RPULLUP Input Pullup Resistor 50 k RPULLDOWN Input Pulldown Resistor 50 k 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS Test Conditions 3 Minimum Typical Maximum Units Rev C 9/4/14 843002I-40 DATA SHEET Function Tables Table 3A. Input Reference Selection Function Table Input Function CLK_SEL Input Selected 0 CLK0/nCLK0 1 CLK1/nCLK1 Table 3B. Input Reference Divider Selection Function Table Inputs Function R_SEL2 R_SEL1 R_SEL0 R Divider Value or State 0 0 0 /1 0 0 1 /2 0 1 0 /4 0 1 1 /8 1 0 0 /16 1 0 1 /32 1 1 0 bypass VCXO PLL 1 1 1 bypass VCXO and FemtoClock PLLs Table 3C. Output Divider Selection Function Table Inputs Function QX_SEL1 QX_SEL0 Output Divider Value or State 0 0 Output QX/nQX (High-Impedance) 0 1 /32 1 0 /8 1 1 /4 Rev C 9/4/14 4 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 843002I-40 DATA SHEET Absolute Maximum Ratings NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability. Item Rating Supply Voltage, VCC 4.6V Inputs, VI -0.5V to VCC + 0.5V Outputs, VO (LVCMOS) -0.5V to VCCO_LVCMOS + 0.5V Outputs, IO (LVPECL) Continuos Current Surge Current 50mA 100mA Package Thermal Impedance, JA 37C/W (0 mps) Storage Temperature, TSTG -65C to 150C DC Electrical Characteristics Table 4A. Power Supply DC Characteristics, VCC = 3.3V5%, VCCO_LVCMOS, VCCO_LVPECL = 3.3V5% or 2.5V5%, VEE = 0V, TA = -40C to 85C Symbol Parameter VCC Core Supply Voltage VCCA Analog Supply Voltage VCCO_LVCMOS, VCCO_LVPECL Output Supply Voltage IEE ICCA Minimum Typical Maximum Units 3.135 3.3 3.465 V VCC - 0.15 3.3 VCC V 3.135 3.3 3.465 V 2.375 2.5 2.625 V Power Supply Current 210 mA Analog Supply Current 15 mA 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS Test Conditions 5 Rev C 9/4/14 843002I-40 DATA SHEET Table 4B. LVCMOS/LVTTL DC Characteristics, VCC = 3.3V5%, VCCO_LVCMOS = 3.3V5% or 2.5V5%, VEE = 0V, TA = -40C to 85C Symbol Parameter VIH Input High Voltage VIL Input Low Voltage IIH IIL VOH VOL Test Conditions Minimum Typical Maximum Units 2 VCC + 0.3 V -0.3 0.8 V QA_SEL[0:1], QB_SEL[0:1] VCC = VIN = 3.465V 5 A CLK_SEL, R_SEL[0:2] VCC = VIN = 3.465V 150 A Input High Current QA_SEL[0:1], QB_SEL[0:1] VCC = 3.465V, VIN = 0V -150 A CLK_SEL, R_SEL[0:2] VCC = 3.465V, VIN = 0V -5 A VCCO_LVCMOS = 3.465V, IOH = 1mA 2.6 V VCCO_LVCMOS = 2.625V, IOH = 1mA 1.8 V Input Low Current Output High Voltage Output Low Voltage LOR0, LOR1 LOR0, LOR1 VCCO_LVCMOS = 3.465V or 2.625V, IOL= -1mA 0.5 V Table 4C. Differential DC Characteristics, VCC = 3.3V5%, VCCO_LVPECL = 3.3V5% or 2.5V5%, VEE = 0V, TA = -40C to 85C Symbol Parameter Test Conditions IIH Input High Current IIL Input Low Current VPP Peak-to-Peak Voltage; NOTE 1 VCMR Common Mode Input Voltage; NOTE 1, 2 Minimum Typical Maximum Units 150 A CLK0/nCLK0, CLK1/nCLK1 VCC = VIN = 3.465V CLK0, CLK1 VCC = 3.465V, VIN = 0V -5 A nCLK0, nCLK1 VCC = 3.465V, VIN = 0V -150 A 0.15 1.3 V VEE + 0.5 VCC - 0.85 V NOTE 1: VIL cannot be less than -0.3V NOTE 2: Common mode input voltage is defined as VIH. Table 4D. LVPECL DC Characteristics, VCC = VCCO_LVPECL = 3.3V5%, VEE = 0V, TA = -40C to 85C Symbol Parameter VOH Output High Voltage; NOTE 1 VOL Output Low Voltage; NOTE 1 VSWING Peak-to-Peak Output Voltage Swing Test Conditions Minimum Typical Maximum Units VCCO - 1.4 VCCO - 0.9 V VCCO - 2.0 VCCO - 1.7 V 0.6 1.0 V NOTE 1: Outputs terminated with 50 to VCCO_LVPECL - 2V. Rev C 9/4/14 6 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 843002I-40 DATA SHEET Table 4E. LVPECL DC Characteristics, VCC = 3.3V5%, VCCO_LVPECL = 2.5V5%, VEE = 0V, TA = -40C to 85C Symbol Parameter Test Conditions VOH Output High Voltage; NOTE 1 VOL Output Low Voltage; NOTE 1 VSWING Peak-to-Peak Output Voltage Swing Minimum Typical Maximum Units VCCO - 1.4 VCCO - 0.9 V VCCO - 2.0 VCCO - 1.5 V 0.4 1.0 V NOTE 1: Outputs terminated with 50 to VCCO_LVPECL - 2V. AC Electrical Characteristics Table 5. AC Characteristics, VCC = 3.3V5%, VCCO_LVCMOS = VCCO_LVPECL = 3.3V5% or 2.5V5%, VEE = 0V, TA = -40C to 85C Symbol Parameter fOUT Output Frequency tsk(o) Output Skew; NOTE 1, 2 tjit(O) RMS Phase Jitter (Random); NOTE 3 tR / tF Output Rise/Fall Time odc Output Duty Cycle Test Conditions Minimum Typical 19.44 155.52MHz, Integration Range: 12kHz - 20MHz 20% to 80% Maximum Units 175 MHz 150 ps 0.81 ps 100 800 ps 45 55 % See Parameter Measurement Information section. NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditions. NOTE 1: Defined as skew between outputs at the same supply voltage, same frequency, and with equal load conditions. Measured at the output differential cross points. NOTE 2: This parameter is defined in accordance with JEDEC Standard 65. NOTE 3: Please refer to the Phase Noise plots. 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 7 Rev C 9/4/14 843002I-40 DATA SHEET Typical Phase Noise at 155.52MHz Filter Raw Phase Noise Data Noise Power dBc Hz 155.52MHz RMS Phase Jitter (Random) 12kHz to 20MHz = 0.81ps (typical) Phase Noise Result by adding a filter to raw data Offset Frequency (Hz) Rev C 9/4/14 8 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 843002I-40 DATA SHEET Parameter Measurement Information 2.8V 0.04V 2V 2V 2.8V 0.04V 2V VCC, VCCO_LVCMOS VCC, VCCO_LVPECL, VCCO_LVCMOS Qx SCOPE VCCA VCCA VCCO_LVPECL nQx VEE -1.3V 0.165V -0.5V 0.125V 3.3V Core/3.3V LVPECL Output Load AC Test Circuit 3.3V Core/2.5V LVPECL Output Load AC Test Circuit VCC nQx Qx nCLK0, nCLK1 V V Cross Points PP nQy CMR CLK0, CLK1 Qy VEE Differential Input Level Output Skew Noise Power Phase Noise Plot nQA, nQB Phase Noise Mask QA, QB f1 Offset Frequency f2 RMS Jitter = Area Under the Masked Phase Noise Plot Output Rise/Fall Time RMS Phase Jitter 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 9 Rev C 9/4/14 843002I-40 DATA SHEET nQA, nQB QA, QB Output Duty Cycle/Pulse Width/Period Application Information Recommendations for Unused Input and Output Pins Inputs: Outputs: CLK/nCLK Inputs LVPECL Outputs For applications not requiring the use of the differential input, both CLKx and nCLKx can be left floating. Though not required, but for additional protection, a 1k resistor can be tied from CLKx to ground. All unused LVPECL outputs can be left floating. We recommend that there is no trace attached. Both sides of the differential output pair should either be left floating or terminated. LVCMOS Outputs LVCMOS Control Pins All unused LVCMOS output can be left floating. There should be no trace attached. All control pins have internal pull-ups or pull-downs; additional resistance is not required but can be added for additional protection. A 1k resistor can be used. Rev C 9/4/14 10 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 843002I-40 DATA SHEET Power Supply Filtering Technique As in any high speed analog circuitry, the power supply pins are vulnerable to random noise. To achieve optimum jitter performance, power supply isolation is required. The ICS843002I-40 provides separate power supplies to isolate any high switching noise from the outputs to the internal PLL. VCC, VCCA, VCCO_LVPECL and VCCO_LVCMOS should be individually connected to the power supply plane through vias, and 0.01F bypass capacitors should be used for each pin. Figure 1 illustrates this for a generic VCC pin and also shows that VCCA requires that an additional 10 resistor along with a 10F bypass capacitor be connected to the VCCA pin. Figure 1. Power Supply Filtering Wiring the Differential Input to Accept Single Ended Levels Figure 2 shows how the differential input can be wired to accept single ended levels. The reference voltage V_REF = VCC/2 is generated by the bias resistors R1, R2 and C1. This bias circuit should be located as close as possible to the input pin. The ratio of R1 and R2 might need to be adjusted to position the V_REF in the center of the input voltage swing. For example, if the input clock swing is only 2.5V and VCC = 3.3V, V_REF should be 1.25V and R2/R1 = 0.609. VCC R1 1K Single Ended Clock Input CLKx V_REF nCLKx C1 0.1u R2 1K Figure 2. Single-Ended Signal Driving Differential Input 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 11 Rev C 9/4/14 843002I-40 DATA SHEET Differential Clock Input Interface The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, SSTL, HCSL and other differential signals. Both VSWING and VOH must meet the VPP and VCMR input requirements. Figures 3A to 3F show interface examples for the HiPerClockS CLK/nCLK input driven by the most common driver types. The input interfaces suggested here are examples only. Please consult with the vendor of the driver component to confirm the driver termination requirements. For example, in Figure 3A, the input termination applies for IDT HiPerClockS open emitter LVHSTL drivers. If you are using an LVHSTL driver from another vendor, use their termination recommendation. 3.3V 1.8V Zo = 50 CLK Zo = 50 nCLK Differential Input LVHSTL IDT LVHSTL Driver R1 50 R2 50 Figure 3A. HiPerClockS CLK/nCLK Input Driven by an IDT Open Emitter HiPerClockS LVHSTL Driver Figure 3B. HiPerClockS CLK/nCLK Input Driven by a 3.3V LVPECL Driver Figure 3C. HiPerClockS CLK/nCLK Input Driven by a 3.3V LVPECL Driver Figure 3D. HiPerClockS CLK/nCLK Input Driven by a 3.3V LVDS Driver 3.3V 2.5V 3.3V 3.3V 2.5V R3 120 *R3 R4 120 Zo = 60 CLK CLK Zo = 60 nCLK nCLK HCSL *R4 Differential Input SSTL R1 120 Differential Input Figure 3F. HiPerClockS CLK/nCLK Input Driven by a 2.5V SSTL Driver Figure 3E. HiPerClockS CLK/nCLK Input Driven by a 3.3V HCSL Driver Rev C 9/4/14 R2 120 12 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 843002I-40 DATA SHEET VFQFN EPAD Thermal Release Path In order to maximize both the removal of heat from the package and the electrical performance, a land pattern must be incorporated on the Printed Circuit Board (PCB) within the footprint of the package corresponding to the exposed metal pad or exposed heat slug on the package, as shown in Figure 4. The solderable area on the PCB, as defined by the solder mask, should be at least the same size/shape as the exposed pad/slug area on the package to maximize the thermal/electrical performance. Sufficient clearance should be designed on the PCB between the outer edges of the land pattern and the inner edges of pad pattern for the leads to avoid any shorts. and dependent upon the package power dissipation as well as electrical conductivity requirements. Thus, thermal and electrical analysis and/or testing are recommended to determine the minimum number needed. Maximum thermal and electrical performance is achieved when an array of vias is incorporated in the land pattern. It is recommended to use as many vias connected to ground as possible. It is also recommended that the via diameter should be 12 to 13mils (0.30 to 0.33mm) with 1oz copper via barrel plating. This is desirable to avoid any solder wicking inside the via during the soldering process which may result in voids in solder between the exposed pad/slug and the thermal land. Precautions should be taken to eliminate any solder voids between the exposed heat slug and the land pattern. Note: These recommendations are to be used as a guideline only. For further information, please refer to the Application Note on the Surface Mount Assembly of Amkor's Thermally/Electrically Enhance Leadframe Base Package, Amkor Technology. While the land pattern on the PCB provides a means of heat transfer and electrical grounding from the package to the board through a solder joint, thermal vias are necessary to effectively conduct from the surface of the PCB to the ground plane(s). The land pattern must be connected to ground through these vias. The vias act as "heat pipes". The number of vias (i.e. "heat pipes") are application specific PIN PIN PAD SOLDER EXPOSED HEAT SLUG GROUND PLANE THERMAL VIA SOLDER LAND PATTERN (GROUND PAD) PIN PIN PAD Figure 4. P.C. Assembly for Exposed Pad Thermal Release Path - Side View (drawing not to scale) Rev C 9/4/14 13 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 843002I-40 DATA SHEET Termination for 3.3V LVPECL Outputs The clock layout topology shown below is a typical termination for LVPECL outputs. The two different layouts mentioned are recommended only as guidelines. transmission lines. Matched impedance techniques should be used to maximize operating frequency and minimize signal distortion. Figures 5A and 5B show two different layouts which are recommended only as guidelines. Other suitable clock layouts may exist and it would be recommended that the board designers simulate to guarantee compatibility across all printed circuit and clock component process variations. The differential output is a low impedance follower output that generate ECL/LVPECL compatible outputs. Therefore, terminating resistors (DC current path to ground) or current sources must be used for functionality. These outputs are designed to drive 50 R3 125 3.3V R4 125 3.3V 3.3V Zo = 50 + _ LVPECL Input Zo = 50 R1 84 Figure 5A. 3.3V LVPECL Output Termination Rev C 9/4/14 R2 84 Figure 5B. 3.3V LVPECL Output Termination 14 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 843002I-40 DATA SHEET Termination for 2.5V LVPECL Outputs ground level. The R3 in Figure 6B can be eliminated and the termination is shown in Figure 6C. Figure 6A and Figure 6B show examples of termination for 2.5V LVPECL driver. These terminations are equivalent to terminating 50 to VCC - 2V. For VCCO = 2.5V, the VCCO - 2V is very close to 2.5V VCC = 2.5V 2.5V 2.5V VCC = 2.5V R1 250 50 R3 250 + 50 50 + - 50 2.5V LVPECL Driver - R1 50 2.5V LVPECL Driver R2 62.5 R2 50 R4 62.5 R3 18 Figure 6A. 2.5V LVPECL Driver Termination Example Figure 6B. 2.5V LVPECL Driver Termination Example 2.5V VCC = 2.5V 50 + 50 - 2.5V LVPECL Driver R1 50 R2 50 Figure 6C. 2.5V LVPECL Driver Termination Example 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 15 Rev C 9/4/14 843002I-40 DATA SHEET Schematic Example driver. The 2-pole filter example is used in this schematic. Please refer to the ICS843002I-40 datasheet for additional loop filter recommendations. Figure 7 shows a schematic example of the ICS843002I-40 application schematic. In this example, the device is operated at VCC = 3.3V. The decoupling capacitors should be located as close as possible to the power pin. The input is driven by a 3.3V LVPECL Figure 7. ICS843002I-40 Schematic Example Loss of Reference Indicator (LOR0 and LOR1) Output Pins The LOR0 and LOR1 pins are controlled by the internal clock activity monitor circuits. The clock activity monitor circuits are clocked by the VCXO PLL phase detector feedback clock. The LOR output is asserted high if there are three consecutive feedback clock edges without any reference clock edges (in both Rev C 9/4/14 cases, either a negative or positive transition is counted as an "edge"). The LOR output will otherwise be low. In a phase detector observation interval, the activity monitor does not flag excessive reference transitions as an error. The monitor only distinguishes between transitions occurring and no transitions occurring. 16 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 843002I-40 DATA SHEET VCXO-PLL EXTERNAL COMPONENTS Choosing the correct external components and having a proper printed circuit board (PCB) layout is a key task for quality operation of the VCXO-PLL. In choosing a crystal, special precaution must be taken with the package and load capacitance (CL). In addition, frequency, accuracy and temperature range must also be considered. Since the pulling range of a crystal also varies with the package, it is recommended that a metal-canned package like HC49 be used. Generally, a metal-canned package has a larger pulling range than a surface mounted device (SMD). For crystal selection information, refer to the VCXO Crystal Selection Application Note. reduced. The correct value of CL is dependant on the characteristics of the VCXO. The recommended CL in the Crystal Parameter Table balances the tuning range by centering the tuning curve. The VCXO-PLL Loop Bandwidth Selection Table shows RS, CS and CP values for recommended high, mid and low loop bandwidth configurations. The device has been characterized using these parameters. For other configurations, refer to the Loop Filter Component Selection for VCXO Based PLLs Application Note. The crystal and external loop filter components should be kept as close as possible to the device. Loop filter and crystal traces should be kept short and separated from each other. Other signal traces should be kept separate and not run underneath the device, loop filter or crystal components. The crystal's load capacitance CL characteristic determines it resonating frequency and is closely related to the VCXO tuning range. The total external capacitance seen by the crystal when installed on a board is the sum of the stray board capacitance, IC package lead capacitance, internal varactor capacitance and any installed tuning capacitors (CTUNE). If the crystal CL is greater than the total external capacitance, the VCXO will oscillate at a higher frequency than the crystal specification. If the crystal (CL) is lower than the total external capacitance, the VCXO will oscillate at a lower frequency than the crystal specification. In either case, the absolute tuning range is LF0 LF1 ISET RS CP RSET CS XTAL_IN CTUNE 19.44MHz XTAL_OUT CTUNE VCXO Characteristics Table Symbol Parameter Typical Units kVCXO VCXO Gain 5800 Hz/V CV_LOW Low Varactor Capacitance 12.6 pF CV_HIGH High Varactor Capacitance 24.5 pF VCXO-PLL Loop Bandwidth Selection Table Bandwidth Crystal Frequency (MHz) RS (k) CS (F) CP (F) RSET (k) 10Hz (Low) 19.44 5 1.0 0.10 9.5 70Hz (Mid) 19.44 10 1.0 0.01 4.75 100Hz (High) 19.44 15 1.0 0.01 4.75 Crystal Characteristics Symbol Parameter Test Conditions Minimum fN Frequency fT Frequency Tolerance 20 ppm fS Frequency Stability 20 ppm Mode of Oscillation Typical Maximum Units Fundamental 19.44 Operating Temperature Range -40 MHz +85 0 C CL Load Capacitance 12 pF CO Shunt Capacitance 4 pF CO / C1 Pullability Ratio ESR Equivalent Series Resistance 220 50 Drive Level Aging @ 25 0C 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 240 17 1 mW 3 per year ppm Rev C 9/4/14 843002I-40 DATA SHEET Power Considerations This section provides information on power dissipation and junction temperature for the ICS843002I-40. Equations and example calculations are also provided. 1. Power Dissipation. The total power dissipation for the ICS843002I-40 is the sum of the core power plus the power dissipated in the load(s). The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results. NOTE: Please refer to Section 3 for details on calculating power dissipated in the load. * Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 210mA = 727.65mW * Power (outputs)MAX = 30mW/Loaded Output pair If all outputs are loaded, the total power is 2 * 30mW = 60mW Total Power_MAX (3.3V, with all outputs switching) = 727.65mW + 60mW = 787.65mW 2. Junction Temperature. Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The maximum recommended junction temperature for HiPerClockS devices is 125C. The equation for Tj is as follows: Tj = JA * Pd_total + TA Tj = Junction Temperature JA = Junction-to-Ambient Thermal Resistance Pd_total = Total Device Power Dissipation (example calculation is in section 1 above) TA = Ambient Temperature In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and a multi-layer board, the appropriate value is 37C/W per Table 6 below. Therefore, Tj for an ambient temperature of 85C with all outputs switching is: 85C + 0.788W * 37C/W = 114.2C. This is below the limit of 125C. This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of board (single layer or multi-layer). Table 6. Thermal Resistance JA for 48 Lead TQFP, Forced Convection JA by Velocity Meters per Second Multi-Layer PCB, JEDEC Standard Test Boards Rev C 9/4/14 0 1 2.5 37.0C/W 32.4C/W 29.0C/W 18 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 843002I-40 DATA SHEET 3. Calculations and Equations. The purpose of this section is to derive the power dissipated into the load. LVPECL output driver circuit and termination are shown in Figure 8. VCCO Q1 VOUT RL 50 VCCO - 2V Figure 8. LVPECL Driver Circuit and Termination To calculate worst case power dissipation into the load, use the following equations which assume a 50 load, and a termination voltage of VCCO - 2V. * For logic high, VOUT = VOH_MAX = VCCO_MAX - 0.9V (VCCO_MAX - VOH_MAX) = 0.9V * For logic low, VOUT = VOL_MAX = VCCO_MAX - 1.7V (VCCO_MAX - VOL_MAX) = 1.7V Pd_H is power dissipation when the output drives high. Pd_L is the power dissipation when the output drives low. Pd_H = [(VOH_MAX - (VCCO_MAX - 2V))/RL] * (VCCO_MAX - VOH_MAX) = [(2V - (VCCO_MAX - VOH_MAX))/RL] * (VCCO_MAX - VOH_MAX) = [(2V - 0.9V)/50] * 0.9V = 19.8mW Pd_L = [(VOL_MAX - (VCCO_MAX - 2V))/RL] * (VCCO_MAX - VOL_MAX) = [(2V - (VCCO_MAX - VOL_MAX))/RL] * (VCCO_MAX - VOL_MAX) = [(2V - 1.7V)/50] * 1.7V = 10.2mW Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 19 Rev C 9/4/14 843002I-40 DATA SHEET Reliability Information Table 7. JA vs. Air Flow Table for a 32 Lead VFQFN JA vs. Air Flow Meters per Second Multi-Layer PCB, JEDEC Standard Test Boards 0 1 2.5 37.0C/W 32.4C/W 29.0C/W Transistor Count The transistor count for ICS843002I-40 is: 5536 Rev C 9/4/14 20 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 843002I-40 DATA SHEET Package Outline and Package Dimensions Package Outline - K Suffix for 32-Lead VFQFN (Ref.) S eating Plan e N &N Even (N -1)x e (R ef.) A1 Ind ex Area A3 N To p View Anvil Anvil Singulation Singula tion or OR Sawn Singulation L N e (Ty p.) 2 If N & N 1 are Even 2 E2 (N -1)x e (Re f.) E2 2 b A (Ref.) D Chamfer 4x 0.6 x 0.6 max OPTIONAL e N &N Odd 0. 08 C D2 2 Th er mal Ba se D2 C NOTE: The following package mechanical drawing is a generic drawing that applies to any pin count VFQFN package. This drawing is not intended to convey the actual pin count or pin layout of this device. The pin count and pinout are shown on the front page. The package dimensions are in Table 8 below. Table 8. Package Dimensions JEDEC Variation: VHHD-2/-4 All Dimensions in Millimeters Symbol Minimum Nominal Maximum N 32 A 0.80 1.00 A1 0 0.05 A3 0.25 Ref. b 0.18 0.25 0.30 8 ND & NE D&E 5.00 Basic D2 & E2 3.0 3.3 e 0.50 Basic L 0.30 0.40 0.50 Reference Document: JEDEC Publication 95, MO-220 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 21 Rev C 9/4/14 843002I-40 DATA SHEET Ordering Information Table 9. Ordering Information Part/Order Number 843002AKI-40LF 843002AKI-40LFT Marking ICS002AI40L ICS002AI40L Package "Lead-Free" 32 Lead VFQFN "Lead-Free" 32 Lead VFQFN Shipping Packaging Tray 2500 Tape & Reel Temperature -40C to 85C -40C to 85C NOTE: Parts that are ordered with an "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant. 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS 22 Rev C 9/4/14 843002I-40 DATA SHEET Revision History Sheet Rev Table Page A T4B 6 LVCMOS DC Characteristics Table - added conditions to VOH and VOL. 1/22/09 B T5 7 AC Characteristics Table - changed output skew from 50ps max. to 150ps max. 4/27/09 C T9 22 Remove leaded parts from orderables table 11/13/12 1 General Description - Removed Loopbanwidth Updated datasheet format C Description of Change 175MHZ, FEMTOCLOCK(R) VCXO BASED SONET/SDH JITTER ATTENUATORS Date 23 9/4/14 Rev C 9/4/14 Corporate Headquarters Sales Tech Support 6024 Silver Creek Valley Road San Jose, CA 95138 USA 1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.IDT.com email: clocks@idt.com DISCLAIMER Integrated Device Technology, Inc. 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