Memory Module Specifications HX424C15FB2K2/16 16GB (8GB 1G x 64-Bit x 2 pcs.) DDR4-2400 CL15 288-Pin DIMM SPECIFICATIONS CL(IDD) 15 cycles Row Cycle Time (tRCmin) 46.75ns(min.) Refresh to Active/Refresh Command Time (tRFCmin) 350ns(min.) Row Active Time (tRASmin) 29.125ns(min.) Maximum Operating Power TBD W* UL Rating 94 V - 0 Operating Temperature 0o C to +85o C Storage Temperature -55o C to +100o C *Power will vary depending on the SDRAM used. DESCRIPTION FEATURES HyperX HX424C15FB2K2/16 is a kit of two 1G x 64-bit (8GB) * Power Supply: VDD = 1.2V Typical DDR4-2400 CL15 SDRAM (Synchronous DRAM) 1Rx8, memory * VDDQ = 1.2V Typical module, based on eight 1G x 8-bit FBGA components per module. * VPP - 2.5V Typical Each module kit supports Intel(R) Extreme Memory Profiles * VDDSPD = 2.2V to 3.6V (Intel(R) XMP) 2.0. Total kit capacity is 16GB. Each module has * Nominal and dynamic on-die termination (ODT) for been tested to run at DDR4-2400 at a low latency timing of 15-15-15 data, strobe, and mask signals at 1.2V. Additional timing parameters are shown in the * Low-power auto self refresh (LPASR) Plug-N-Play (PnP) Timing Parameters section below. The * Data bus inversion (DBI) for data bus JEDEC standard electrical and mechanical specifications are * On-die VREFDQ generation and calibration as follows: * Single-rank * On-board I2 serial presence-detect (SPD) EEPROM Note: The PnP feature offers a range of speed and timing options to support the widest variety of processors and chipsets. Your maximum speed will be determined by your BIOS. * 16 internal banks; 4 groups of 4 banks each * Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) * Selectable BC4 or BL8 on-the-fly (OTF) JEDEC/XMP TIMING PARAMETERS * Fly-by topology * Terminated control command and address bus * JEDEC/PnP: DDR4-2400 CL15-15-15 @1.2V * Height 1.340" (34.04mm), w/heatsink DDR4-2133 CL14-14-14 @1.2V *XMP Profile #1: DDR4-2400 CL15-15-15 @1.2V Continued >> kingston.com/hyperx Document No. 4807668-001.A00 03/18/16 Page 1 continued MODULE WITH HEAT SPREADER 7.08 mm 34.04 mm 133.35 mm MODULE DIMENSIONS 133.35 129.55 31.25 2.10 0.15 Pin 1 Detail A 3.35 Detail B Pin 35 Pin 47 Detail D Detail E 64.60 28.90 14.60 17.60 8.00 11.00 2.700.15 3.00 Detail C Pin 105 Pin 117 56.10 22.95 FOR MORE INFORMATION, GO TO HYPERXGAMING.COM All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components. HyperX is a division of Kingston. (c)2016 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA. All rights reserved. All trademarks and registered trademarks are the property of their respective owners. Document No. 4807668-001.A00 Page 2 hyperxgaming.com