BC857BWH6327XTSA1 - INFINEON TECHNOLOGIES AG

2008-04-29

1

BC856...-BC860...

PNP Silicon AF Transistor

• For AF input stages and driver applications

• High current gain

• Low collector-emitter saturation voltage

• Low noise between 30 hz and 15 kHz

• Complementary types:

BC846...-BC850... (NPN)

• Pb-free (RoHS compliant) package1)

• Qualified according AEC Q101

1Pb-containing package may be available upon special request

2008-04-29

2

BC856...-BC860...

Type Marking Pin Configuration Package

BC856A

BC856B

BC856BW

BC857A

BC857B

BC857BF*

BC857BL3

BC857BW

BC857C

BC857CW

BC858A

BC858B

BC858BL3

BC858BW

BC858C

BC858CW

BC859C

BC860B

BC860BW

BC860CW

3As

3Bs

3Es

3Fs

3F

3Fs

3Gs

3Js

3Ks

3K

3Ks

3Ls

4Cs

4Fs

4Gs

1=B

2=E

3=C

-

SOT23

SOT323

SOT23

TSFP-3

TSLP-3-1

SOT323

SOT23

SOT323

SOT23

TSLP-3-1

SOT323

SOT23

SOT323

SOT23

SOT323

* Not for new design

2008-04-29

3

BC856...-BC860...

Maximum Ratings

Parameter Symbol Value Unit

Collector-emitter voltage

BC856...

BC857..., BC860...

BC858..., BC859...

VCEO

65

45

30

V

Collector-base voltage

BC856...

BC857..., BC860...

BC858..., BC859...

VCBO

80

50

30

Emitter-base voltage VEBO 5

Collector current IC100 mA

Peak collector current, tp ≤ 10 ms ICM 200

Total power dissipation

TS ≤ 71 °C, BC856-BC860

TS ≤ 128 °C, BC857BF-BC858BF

TS ≤ 135 °C, BC857BL3, BC860BL3

TS ≤ 124 °C, BC856W-BC860W

Ptot

330

250

mW

Junction temperature Tj150 °C

Storage temperature Tst

g

-65 ... 150

Thermal Resistance

Parameter Symbol Value Unit

Junction - soldering point1)

BC856-BC860

BC857BF-BC858BF

BC857BL3, BC858BL3

BC856W-BC860W

RthJS

≤ 240

≤ 90

≤ 60

≤ 105

K/W

1For calculation of RthJA please refer to Application Note Thermal Resistance

2008-04-29

4

BC856...-BC860...

Electrical Characteristics at T

A

= 25°C, unless otherwise specified

Parameter Symbol Values Unit

min. typ. max.

DC Characteristics

Collector-emitter breakdown voltage

IC = 10 mA, IB = 0 , BC856...

IC = 10 mA, IB = 0 , BC857..., BC860...

IC = 10 mA, IB = 0 , BC858..., BC859...

V(BR)CEO

65

45

30

-

V

Collector-base breakdown voltage

IC = 10 µA, IE = 0 , BC856...

IC = 10 µA, IE = 0 , BC857..., BC860...

IC = 10 µA, IE = 0 , BC858..., BC859...

V(BR)CBO

80

50

30

-

Emitter-base breakdown voltage

IE = 1 µA, IC = 0

V(BR)EBO 5 - -

Collector-base cutoff current

VCB = 45 V, IE = 0

VCB = 30 V, IE = 0 , TA = 150 °C

ICBO

-

0.015

5

µA

DC current gain1)

IC = 10 µA, VCE = 5 V, hFE-grp.A

IC = 10 µA, VCE = 5 V, hFE-grp.B

IC = 10 µA, VCE = 5 V, hFE-grp.C

IC = 2 mA, VCE = 5 V, hFE-grp.A

IC = 2 mA, VCE = 5 V, hFE-grp.B

IC = 2 mA, VCE = 5 V, hFE-grp.C

hFE

-

125

220

420

140

250

480

180

290

520

-

250

475

800

-

Collector-emitter saturation voltage1)

IC = 10 mA, IB = 0.5 mA

IC = 100 mA, IB = 5 mA

VCEsat

-

75

250

300

650

mV

Base emitter saturation voltage1)

IC = 10 mA, IB = 0.5 mA

IC = 100 mA, IB = 5 mA

VBEsat

-

700

850

-

Base-emitter voltage1)

IC = 2 mA, VCE = 5 V

IC = 10 mA, VCE = 5 V

VBE(ON)

600

-

650

-

750

820

1Pulse test: t < 300µs; D < 2%

2008-04-29

5

BC856...-BC860...

Electrical Characteristics at TA = 25°C, unless otherwise specified

Parameter Symbol Values Unit

min. typ. max.

AC Characteristics

Transition frequency

IC = 20 mA, VCE = 5 V, f = 100 MHz

fT- 250 - MHz

Collector-base capacitance

VCB = 10 V, f = 1 MHz

Ccb - 1.5 - pF

Emitter-base capacitance

VEB = 0.5 V, f = 1 MHz

Ceb - 8 -

Short-circuit input impedance

IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A

IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B

IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C

h11e

-

2.7

4.5

8.7

-

kΩ

Open-circuit reverse voltage transf. ratio

IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A

IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B

IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C

h12e

-

1.5

2

3

-

10-4

Short-circuit forward current transf. ratio

IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A

IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B

IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C

h21e

-

200

330

600

-

Open-circuit output admittance

IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.A

IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.B

IC = 2 mA, VCE = 5 V, f = 1 kHz, hFE-grp.C

h22e

-

18

30

60

-

µS

Noise figure

I

C = 0.2 mA,

V

CE = 5 V, f = 1 kHz,

D

f

= 200

Hz, RS = 2 kΩ, BC859, BC850

F

-

1 4 dB

Equivalent noise voltage

IC = 200 mA, VCE = 5 V, R

S

= 2 kΩ,

f = 10...50 Hz, BC860

Vn- - 0.11 µV

2008-04-29

6

BC856...-BC860...

DC current gain hFE = ƒ(IC)

VCE = 1 V

10 10 10 10

EHP00382

h

mA

-2 -1 12

FE

3

10

2

0

10

5

10

1

0

10

5

555

100

25

-50

C

Ι

C

Collector-emitter saturation voltage

IC = ƒ(VCEsat), hFE = 20

10 0

EHP00380

V

CEsat

10

mA

10

2

1

0

-1

5

V

0.3 0.5

100

25

-50

0.1 0.2 0.4

C

Ι

C

Base-emitter saturation voltage

IC = ƒ(VBEsat), hFE = 20

0

10

EHP00379

BEsat

V

0.6 V 1.2

-1

100

101

2

10

5

Ι

C

mA

0.2 0.4 0.8

C

25

C

100

C

-50

C

Collector cutoff current ICBO = ƒ(TA)

VCBO = 30 V

10 0 50 100 150

EHP00381

TA

5

10

nA

10

Ι

CB0

5

10

4

3

2

1

0

-1

max

typ

C

2008-04-29

7

BC856...-BC860...

Transition frequency fT = ƒ(IC)

VCE = 5 V

10 10 10 10

EHP00378

f

mA

MHz

-1 0 1 2

5

T

3

10

2

1

10

5

C

Ι

Collector-base capacitance Ccb = ƒ(VCB)

Emitter-base capacitance Ceb = ƒ(VEB)

0 4 8 12 16 V22

VCB(VEB

)

0

1

2

3

4

5

6

7

8

9

10

pF

12

CCB(CEB)

CCB

CEB

Total power dissipation Ptot = ƒ(TS)

BC856-BC860

0 15 30 45 60 75 90 105 120 °C 150

TS

0

30

60

90

120

150

180

210

240

270

300

mW

360

Ptot

Total power dissipation Ptot = ƒ(TS)

BC857BF, BC858BF

0 15 30 45 60 75 90 105 120 °C 150

TS

0

25

50

75

100

125

150

175

200

225

250

mW

300

Ptot

2008-04-29

8

BC856...-BC860...

Total power dissipation Ptot = ƒ(TS)

BC857BL3, BC858BL3

0 15 30 45 60 75 90 105 120 °C 150

TS

0

25

50

75

100

125

150

175

200

225

250

mW

300

Ptot

Total power dissipation Ptot = ƒ(TS)

BC856W-BC860W

0 15 30 45 60 75 90 105 120 °C 150

TS

0

25

50

75

100

125

150

175

200

225

250

mW

300

Ptot

Permissible Pulse Load

Ptotmax/PtotDC = ƒ(tp)

BC856/W-BC860/W

10

EHP00377

-6

0

10

5

D

=

5

101

5

102

3

10

10-5 10-4 10-3 10-2 100

s

0

0.005

0.01

0.02

0.05

0.1

0.2

0.5

tp

=

DT

tp

T

tot max

tot

PDC

P

p

t

Permissible Puls Load RthJS = ƒ (tp)

BC857BF, BC858BF

10 -6 10 -5 10 -4 10 -3 10 -2 10 0

s

tp

-1

10

0

10

1

10

2

10

K/W

RthJS

D=0.5

0.2

0.1

0.05

0.02

0.01

0.005

0

2008-04-29

9

BC856...-BC860...

Permissible Pulse Load

Ptotmax/PtotDC = ƒ(tp)

BC857BF, BC858BF

10 -6 10 -5 10 -4 10 -3 10 -2 10 0

s

tp

0

10

1

10

2

10

3

10

Ptotmax/PtotDC

D=0

0.005

0.01

0.02

0.05

0.1

0.2

0.5

Permissible Puls Load RthJS = ƒ (tp)

BC857BL3, BC858BL3

10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0

s

tp

-1

10

0

10

1

10

2

10

RthJS

0.5

0.2

0.1

0.05

0.02

0.01

0.005

D = 0

Permissible Pulse Load

Ptotmax/PtotDC = ƒ(tp)

BC857BL3, BC858BL3

10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0

s

tp

0

10

1

10

2

10

3

10

Ptotmax/ PtotDC

D = 0

0.005

0.01

0.02

0.05

0.1

0.2

0.5

2008-04-29

10

BC856...-BC860...

Package SOT23

Package Outline

Foot Print

Marking Layout (Example)

Standard Packing

Reel ø180 mm = 3.000 Pieces/Reel

Reel ø330 mm = 10.000 Pieces/Reel

EH

s

BCW66

Type code

Pin 1

0.8

0.9 0.91.3

0.8 1.2

0.25 MBC

1.9

-0.05

+0.1

0.4

±0.1

2.9

0.95

C

B

0...8˚

0.2 A

0.1 MAX.

10˚ MAX.

0.08...0.15

1.3

±0.1

10˚ MAX.

M

2.4

±0.15

±0.1

1

A

0.15 MIN.

1)

1) Lead width can be 0.6 max. in dambar area

12

3

3.15

4

2.65

2.13

0.9

8

0.2

1.15

Pin 1

Manufacturer

2005, June

Date code (YM)

2008-04-29

11

BC856...-BC860...

Package SOT323

Package Outline

Foot Print

Marking Layout (Example)

Standard Packing

Reel ø180 mm = 3.000 Pieces/Reel

Reel ø330 mm = 10.000 Pieces/Reel

1.25

±0.1

0.1 MAX.

2.1

±0.1

0.15

+0.1

-0.05

0.3

+0.1

±0.1

0.9

12

3

A

±0.2

2

-0.05

0.650.65

M

3x

0.1

0.1 MIN.

0.1

M

0.2 A

0.2

4

2.15 1.1

8

2.3

Pin 1

2005, June

Date code (YM)

BCR108W

Type code

0.6

0.8

1.6

0.65

Manufacturer

2008-04-29

12

BC856...-BC860...

Package TSFP-3

4

Package Outline

Foot Print

Marking Layout (Example)

Standard Packing

Reel ø180 mm = 3.000 Pieces/Reel

Reel ø330 mm = 10.000 Pieces/Reel

±0.05

0.2

3

±0.05

1.2

12

10˚ MAX.

±0.05

0.8

1.2±0.05

±0.04

0.55

±0.05

0.2

±0.05

0.15

±0.05

0.2

0.4

±0.05

0.4

±0.05

0.4

0.45

1.05

0.4 0.4

BCR847BF

Type code

Pin 1

0.2

1.35

0.3

0.7

1.2

1.5

8

Pin 1

Manufacturer

2008-04-29

13

BC856...-BC860...

Package TSLP-3-1

2

3

1

0.4

+0.1

BFR193L3

Type code

Pin 1 marking

Laser marking

0.76

4

1.16

0.5

Pin 1

marking

8

Reel ø180 mm = 15.000 Pieces/Reel

For board assembly information please refer to Infineon website "Packages"

Package Outline

Foot Print

Marking Layout (Example)

Standard Packing

Stencil aperturesCopper Solder mask

0.275

0.2

0.315

0.945

0.45

0.17

0.355

0.2

0.35

0.225

1

0.6

0.225

0.15

0.35

0.3

R0.1

1

2

±0.05

0.35

±0.035

2x 0.15

1)

Top view Bottom view

1) Dimension applies to plated terminal

±0.035

0.5

1)

±0.05

0.6

3

±0.05

0.65

±0.035

2x

0.25

1)

±0.035

0.25

1)

1

±0.05

Pin 1

marking

0.05 MAX.

2008-04-29

14

BC856...-BC860...

Edition 2006-02-01

Published by

Infineon Technologies AG

81726 München, Germany

Attention please!

The information given in this dokument shall in no event be regarded as a guarantee

of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any

examples or hints given herein, any typical values stated herein and/or any information

regarding the application of the device, Infineon Technologies hereby disclaims any

and all warranties and liabilities of any kind, including without limitation warranties of

non-infringement of intellectual property rights of any third party.

Information

For further information on technology, delivery terms and conditions and prices

please contact your nearest Infineon Technologies Office ( www.infineon.com).

Warnings

Due to technical requirements components may contain dangerous substances.

For information on the types in question please contact your nearest

Infineon Technologies Office.

Infineon Technologies Components may only be used in life-support devices or

systems with the express written approval of Infineon Technologies, if a failure of

such components can reasonably be expected to cause the failure of that

life-support device or system, or to affect the safety or effectiveness of that

device or system.

Life support devices or systems are intended to be implanted in the human body,

or to support and/or maintain and sustain and/or protect human life. If they fail,

it is reasonable to assume that the health of the user or other persons

may be endangered.