This is information on a product in full production.
March 2016 DocID028762 Rev 1 1/10
ESDA8P80-1U1M
High power transient voltage suppressor
Datasheet - production data
Features
Low clamping voltage
Typical peak pulse power:
– 1100 W (8/20µs)
Stand-off voltage 6.3 V
Unidirectional diode
Low leakage current:
– 0.2 µA at 25 °C
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
Portable multimedia, tablets, mobile phone,
smart phone
USB VBUS protection
Power supply protection
Battery protection
Description
The ESDA8P80-1U1M is a unidirectional single
line TVS diode designed to protect the power line
against EOS and ESD transients.
The device is ideal for applications where high
power TVS and board space saving are required.
Figure 1. Pin configuration
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Characteristics ESDA8P80-1U1M
2/10 DocID028762 Rev 1
1 Characteristics
Figure 2. Electrical characteristics (definitions)
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol Parameter Value Unit
VPP
Peak pulse voltage:
IEC 61000-4-2 contact discharge
IEC 61000-4-2 air discharge
> 30
> 30
kV
PPP Peak pulse power (8/20 µs) 1100 W
IPP Peak pulse current (8/20 µs) 80 A
Tstg Storage temperature range -55 to +150 °C
Top Operating junction temperature range -55 to +150 °C
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Table 2. Electrical characteristics (values, Tamb = 25 °C)
Symbol Test conditions Min. Typ. Max. Unit
VBR IR = 1 mA 6.9 7.3 V
IRM VRM = 5.5 V 200 nA
IRM VRM = 6.3 V 1µA
VCL IPP = 60 A 8/20 µs 10.8 12 V
VCL IPP = 80 A 8/20 µs 11.8 13.2 V
Rd8/20 µs 0.06 Ω
VFIF = 10 mA 0.75 V
DocID028762 Rev 1 3/10
ESDA8P80-1U1M Characteristics
10
Figure 3. Peak pulse power dissipation versus
initial junction temperature (typical values) Figure 4. Peak pulse power ve rsu s expo nent ial
pulse duration (maximum values)
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Figure 5. Peak pulse current versus clamping
voltage (maximum values) Figure 6. Leakage current versus junction
temperature (t yp ic a l valu es )
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Figure 7. ESD response to IEC 61000-4- 2
(-8 kV contact discharge) Figure 8. ESD response to IEC 61000-4-2
(+8 kV contact discharge)
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Package information ESDA8P80-1U1M
4/10 DocID028762 Rev 1
2 Package information
Epoxy meets UL94, V0
Dot indicates pin 1
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
2.1 QFN 1610 package information
Figure 9. QFN 1610 package outline
Table 3. Package mechanical dat a
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.51 0.55 0.60 0.02001 0.0217 0.0236
A1 0.00 0.02 0.05 0.0000 0.0008 0.0020
b 0.75 0.80 0.85 0.0295 0.0315 0.0335
D 1.50 1.60 1.70 0.0591 0.0630 0.0669
E 0.90 1.00 1.10 0.0354 0.0394 0.0433
e 1.05 0.0413
L 0.30 0.35 0.40 0.0118 0.0138 0.0157
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DocID028762 Rev 1 5/10
ESDA8P80-1U1M Package information
10
Figure 12. Marking
Note: Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no
case should this product marking be used to orient the component for its placement on a
PCB. Only pin 1 mark is to be used for this purpose.
Figure 13. Tape and reel specifications
Figure 10. Footprint, dimensions in mm Figure 11. Alternative footprint, dimensions in
mm
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Recommendation on PCB assembly ESDA8P80-1U1M
6/10 DocID028762 Rev 1
3 Recommendation on PCB assembly
3.1 Stencil opening design
1. General recommendation on stencil opening design
a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 14. Stencil opening dimensions
b) General design rule
Stencil thickness (T) = 75 ~ 125 µm
2. Reference design
a) Stencil opening thickness: 100 µm
b) Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 15. Recommended stencil win dow
position Figure 16. Alternative stencil window
position
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DocID028762 Rev 1 7/10
ESDA8P80-1U1M Recommendation on PCB assembly
10
3.2 Solder paste
1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste recommended.
3. Offers a high tack force to resist component displacement during PCB movement.
4. Use solder paste with fine particles: powder particle size 20-45 µm.
3.3 Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
3. Standard tolerance of ± 0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
3.4 PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. A
symmetrical layout is recommended, to avoid any tilt phenomena caused by
asymmetrical solder paste due to solder flow away.
Recommendation on PCB assembly ESDA8P80-1U1M
8/10 DocID028762 Rev 1
3.5 Reflow profile
Figure 17. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Note: Minimize air convection currents in the reflow oven to avoid component movement.
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DocID028762 Rev 1 9/10
ESDA8P80-1U1M Ordering information
10
4 Ordering information
Figure 18. Ordering information scheme
5 Revision history
Table 4. Ordering information
Order code Marking Weight Base qty. Delivery mode
ESDA8P80-1U1M J(1)
1. The marking can be rotated by multiples of 90° to differentiate assembly location
2.4 mg 8000 Tape and reel
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Table 5. Document revision history
Date Revision Changes
02-Mar-2016 1Initial release.
ESDA8P80-1U1M
10/10 DocID028762 Rev 1
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