74LCX257MTCX_Q - FAIRCHILD SEMICONDUCTOR

October, 2012 − Rev. 7

1Publication Order Number:

MC74LCX257/D

MC74LCX257

Low-Voltage CMOS Quad

2-Input Multiplexer

With 5.0 V−Tolerant Inputs and Outputs

(3−State, Non−Inverting)

The MC74LCX257 is a high performance, quad 2−input

multiplexer with 3−state outputs operating from a 2.3 to 3.6 V supply.

High impedance TTL compatible inputs significantly reduce current

loading to input drivers while TTL compatible outputs offer improved

switching noise performance. A VI specification of 5.5 V allows

MC74LCX257 inputs to be safely driven from 5.0 V devices.

Four bits of data from two sources can be selected using the Select

input. The four outputs present the selected data in the true

(non−inverted) form. The outputs may be switched to a high

impedance state by placing a logic HIGH on the Output Enable (OE)

input. Current drive capability is 24 mA at the outputs.

Features

•Designed for 2.3 to 3.6 V VCC Operation

•5.0 V Tolerant − Interface Capability with 5.0 V TTL Logic

•Supports Live Insertion and Withdrawal

•IOFF Specification Guarantees High Impedance When VCC = 0 V

•LVTTL Compatible

•LVCMOS Compatible

•24 mA Balanced Output Sink and Source Capability

•Near Zero Static Supply Current in All Three Logic States (10 mA)

Substantially Reduces System Power Requirements

•Latchup Performance Exceeds 500 mA

•ESD Performance:

♦Human Body Model >2000 V

♦Machine Model >200 V

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

MARKING

DIAGRAMS

See detailed ordering and shipping information in the package

dimensions section on page 3 of this data sheet.

ORDERING INFORMATION

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SOIC−16

D SUFFIX

CASE 751B

TSSOP−16

DT SUFFIX

CASE 948F

A = Assembly Location

WL, L = Wafer Lot

Y = Year

WW, W = Work Week

G or G= Pb−Free Package

LCX257G

AWLYWW

LCX

257

ALYWG

(Note: Microdot may be in either location)

MC74LCX257

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Figure 1. Pinout: 16−Lead Plastic Package

(Top View)

Figure 2. Logic Diagram

1516 14 13 12 11 10

21 34567

VCC

OE I0c I1c Zc I0d I1d Zd

SI0a I1a Za I0b I1b Zb GND

I0a 4

I1a 3

I0b 7

I1b 6

I0c 12

I1c 13

I0d 9

I1d 10

OE 15

PIN NAMES

Pins Function

l0n Source 0 Data Inputs

l1n Source 1 Data Inputs

OE Output Enable Input

SSelect Input

Zn Outputs

TRUTH TABLE

Inputs Outputs

OE S l0n l1n Zn

H X X X Z

L H X L L

L H X H H

L L L X L

L L H X H

H = High Voltage Level

L = Low Voltage Level

X = High or Low Voltage Level and Transitions are Acceptable

Z = High Impedance State

For ICC reasons, DO NOT FLOAT Inputs

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MAXIMUM RATINGS

Symbol Parameter Value Condition Units

VCC DC Supply Voltage −0.5 to +7.0 V

VIDC Input Voltage −0.5 ≤ VI ≤ +7.0 V

VODC Output Voltage −0.5 ≤ VI ≤ +7.0 Output in 3−State V

−0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State (Note 1) V

IIK DC Input Diode Current −50 VI < GND mA

IOK DC Output Diode Current −50 VO < GND mA

+50 VO > VCC mA

IODC Output Source/Sink Current ±50 mA

ICC DC Supply Current Per Supply Pin ±100 mA

IGND DC Ground Current Per Ground Pin ±100 mA

TSTG Storage Temperature Range −65 to +150 °C

MSL Moisture Sensitivity Level 1

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit

values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.

1. IO absolute maximum rating must be observed.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Type Max Units

VCC Supply Voltage

Operating

Data Retention Only

2.0

1.5

2.5, 3.3

3.6

VIInput Voltage 0 5.5 V

VOOutput Voltage

(HIGH or LOW State)

(3−State)

VCC

5.5

IOH HIGH Level Output Current

VCC = 3.0 V − 3.6 V

VCC = 2.7 V − 3.0 V

VCC = 2.3 V − 2.7 V

−24

−12

−8

IOL LOW Level Output Current

VCC = 3.0 V − 3.6 V

VCC = 2.7 V − 3.0 V

VCC = 2.3 V − 2.7 V

+24

+12

TAOperating Free−Air Temperature −40 +85 °C

Dt/DVInput Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V

ORDERING INFORMATION

Device Package Shipping†

MC74LCX257DR2G SOIC−16

(Pb−Free)

2500 Tape & Reel

MC74LCX257DTG TSSOP−16

(Pb−Free)

96 Units / Rail

MC74LCX257DTR2G TSSOP−16

(Pb−Free)

2500 Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

MC74LCX257

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DC ELECTRICAL CHARACTERISTICS

TA = −40°C to +85°C

Symbol Characteristic Condition Min Max Units

VIH HIGH Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 1.7 V

2.7 V ≤ VCC ≤ 3.6 V 2.0

VIL LOW Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 0.7 V

2.7 V ≤ VCC ≤ 3.6 V 0.8

VOH HIGH Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOH = −100 mAVCC −0.2 V

VCC = 2.3 V; IOH = −8 mA 1.8

VCC = 2.7 V; IOH = −12 mA 2.2

VCC = 3.0 V; IOH = −18 mA 2.4

VCC = 3.0 V; IOH = −24 mA 2.2

VOL LOW Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA0.2 V

VCC = 2.3 V; IOL = 8 mA 0.6

VCC = 2.7 V; IOL = 12 mA 0.4

VCC = 3.0 V; IOL = 16 mA 0.4

VCC = 3.0 V; IOL = 24 mA 0.55

IOZ 3−State Output Current VCC = 3.6 V, VIN = VIH or VIL,

VOUT = 0 to 5.5 V

±5mA

IOFF Power Off Leakage Current VCC = 0, VIN = 5.5 V or VOUT = 5.5 V 10 mA

IIN Input Leakage Current VCC = 3.6 V, VIN = 5.5 V or GND ±5mA

ICC Quiescent Supply Current VCC = 3.6 V, VIN = 5.5 V or GND 10 mA

DICC Increase in ICC per Input 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 mA

2. These values of VI are used to test DC electrical characteristics only.

AC CHARACTERISTICS tR = tF = 2.5 ns; RL = 500 W

Limits

TA = −40°C to +85°C

VCC = 3.3 V ± 0.3 V VCC = 2.7 V VCC = 2.5 V ± 0.2 V

CL = 50 pF CL = 50 pF CL = 30 pF

Symbol Parameter Waveform Min Max Min Max Min Max Units

tPLH

tPHL

Propagation Delay

In to Zn

1 1.5

1.5

6.0

1.5

6.5

1.5

7.2

tPLH

tPHL

Propagation Delay

S to Zn

1, 2 1.5

1.5

7.0

1.5

8.5

1.5

9.1

tPZH

tPZL

Output Enable Time to

High and Low Level

3 1.5

1.5

7.0

1.5

8.5

1.5

9.1

tPHZ

tPLZ

Output Disable Time from

High and Low Level

3 1.5

1.5

5.5

1.5

6.0

1.5

6.6

tOSHL

tOSLH

Output−to−Output Skew

(Note 3)

1.0

3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.

The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter

guaranteed by design.

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DYNAMIC SWITCHING CHARACTERISTICS

TA = +25°C

Symbol Characteristic Condition Min Typ Max Units

VOLP Dynamic LOW Peak Voltage

(Note 4)

VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V

VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V

0.8

0.6

VOLV Dynamic LOW Valley Voltage

(Note 4)

VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V

VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V

−0.8

−0.6

4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is

measured in the LOW state.

CAPACITIVE CHARACTERISTICS

Symbol Parameter Condition Typical Units

CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF

CI/O Input/Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF

CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF

WAVEFORM 1 − NON−INVERTING PROPAGATION DELAYS

tR = tF = 2.5 ns, 10% to 90%; f = 1.0 MHz; tW = 500 ns

VCC

0 V

VOH

VOL

In, S

tPHL

tPLH

WAVEFORM 3 − OUTPUT ENABLE AND DISABLE TIMES

tR = tF = 2.5 ns, 10% to 90%; f = 1.0 MHz; tW = 500 ns

VCC

0 V

≈ 0 V

tPZH

≈ 3.0V

tPHZ

tPZL tPLZ

Vmo

VmiVmi

Vmo Vmo

Vmi

VCC

VOH − 0.3

VOL + 0.3 V

GND

Vmi

WAVEFORM 2 − INVERTING PROPAGATION DELAYS

tR = tF = 2.5 ns, 10% to 90%; f = 1.0 MHz; tW = 500 ns

0 V

VOH

tPHL

tPLH

VmiVmi

Vmo Vmo

Symbol

Vcc

3.3 V ± 0.3 V 2.7 V 2.5 V ± 0.2 V

Vmi 1.5 V 1.5 V Vcc/2

Vmo 1.5 V 1.5 V Vcc/2

VHZ VOL + 0.3 V VOL + 0.3 V VOL + 0.15 V

VLZ VOH − 0.3 V VOH − 0.3 V VOH − 0.15 V

Figure 3. AC Waveforms

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PACKAGE DIMENSIONS

SOIC−16

D SUFFIX

CASE 751B−05

ISSUE K

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

16 9

SEATING

PLANE

RX 45_

8 PLP

−B−

−A−

0.25 (0.010) B S

−T−

16 PL

0.25 (0.010) A S

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A9.80 10.00 0.386 0.393

B3.80 4.00 0.150 0.157

C1.35 1.75 0.054 0.068

D0.35 0.49 0.014 0.019

F0.40 1.25 0.016 0.049

G1.27 BSC 0.050 BSC

J0.19 0.25 0.008 0.009

K0.10 0.25 0.004 0.009

M0 7 0 7

P5.80 6.20 0.229 0.244

R0.25 0.50 0.010 0.019

____

6.40

16X

0.58

16X 1.12

1.27

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT

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PACKAGE DIMENSIONS

TSSOP−16

DT SUFFIX

CASE 948F−01

ISSUE B

ÇÇÇ

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A4.90 5.10 0.193 0.200

B4.30 4.50 0.169 0.177

C−−− 1.20 −−− 0.047

D0.05 0.15 0.002 0.006

F0.50 0.75 0.020 0.030

G0.65 BSC 0.026 BSC

H0.18 0.28 0.007 0.011

J0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L6.40 BSC 0.252 BSC

M0 8 0 8

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH. PROTRUSIONS OR GATE BURRS.

MOLD FLASH OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL

NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

____

SECTION N−N

SEATING

PLANE

IDENT.

PIN 1

16 9

DETAIL E

ÉÉÉ

DETAIL E

2X L/2

−U−

U0.15 (0.006) T

0.10 (0.004) V S

0.10 (0.004)

−T−

−V−

−W−

0.25 (0.010)

16X REFK

7.06

16X

0.36 16X

1.26

0.65

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT

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