© Semiconductor Components Industries, LLC, 2012
September, 2012 Rev. 8
1Publication Order Number:
MM5Z2V4T1/D
MM5ZxxxT1G Series,
SZMM5ZxxxT1G Series
Zener Voltage Regulators
200 mW SOD523 Surface Mount
This series of Zener diodes is packaged in a SOD523 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
Specification Features:
Standard Zener Breakdown Voltage Range 2.4 V to 75 V
Steady State Power Rating of 200 mW
Small Body Outline Dimensions:
0.047 x 0.032 (1.20 mm x 0.80 mm)
Low Body Height: 0.028 (0.7 mm)
ESD Rating of Class 3 (> 16 kV) per Human Body Model
AECQ101 Qualified and PPAP Capable SZMM5ZxxxT1G
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These are PbFree Devices*
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating Symbol Max Unit
Total Device Dissipation FR5 Board,
@ TA = 25°C
PD200 mW
Thermal Resistance,
JunctiontoAmbient (Note 1)
RqJA 390 °C/W
Junction and Storage
Temperature Range
TJ, Tstg 65 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. EIA/JEDEC51.3 board design and EIA/JEDEC51.2 still air test method
(25 mm2, 2 oz., 3.8 mm plating).
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Device Package Shipping
ORDERING INFORMATION
1
Cathode
2
Anode
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 3 of this data sheet.
DEVICE MARKING INFORMATION
http://onsemi.com
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
SOD523
CASE 502
STYLE 1
MARKING DIAGRAM
12
MM5ZxxxxT1G SOD523
(PbFree)
3,000 /
Tape & Reel
XX = Specific Device Code
M = Date Code*
G= PbFree Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
XX M G
G
SZMM5ZxxxT1G SOD523
(PbFree)
3,000 /
Tape & Reel
MM5ZxxxT1G Series, SZMM5ZxxxT1G Series
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted,
VF = 0.9 V Max. @ IF = 10 mA for all types)
Symbol Parameter
VZReverse Zener Voltage @ IZT
IZT Reverse Current
ZZT Maximum Zener Impedance @ IZT
IZK Reverse Current
ZZK Maximum Zener Impedance @ IZK
IRReverse Leakage Current @ VR
VRReverse Voltage
IFForward Current
VFForward Voltage @ IF
QVZMaximum Temperature Coefficient of VZ
CMax. Capacitance @VR = 0 and f = 1 MHz Zener Voltage Regulator
IF
V
I
IR
IZT
VR
VZ
VF
TYPICAL CHARACTERISTICS
TEMPERATURE (°C)
250
100
40
20
0
POWER DISSIPATION (%)
50 75 100 125 150
80
60
Figure 1. Steady State Power Derating
MM5ZxxxT1G Series, SZMM5ZxxxT1G Series
http://onsemi.com
3
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types)
Device*
Device
Marking
Zener Voltage (Note 1) Zener Impedance Leakage Current
QVZ
(mV/k) @ IZT
C
@ VR = 0
f = 1 MHz
VZ (Volts) @ IZT
ZZT
@ IZT ZZK @ IZK IR @ VR
Min Nom Max mA W W mA mAVolts Min Max pF
MM5Z2V4T1G 00 2.2 2.4 2.6 5 100 1000 1.0 50 1.0 3.5 0 450
MM5Z2V7T1G 01 2.5 2.7 2.9 5 100 1000 1.0 20 1.0 3.5 0 450
MM5Z3V0T1G 02 2.8 3.0 3.2 5 100 1000 1.0 10 1.0 3.5 0 450
MM5Z3V3T1G 05 3.1 3.3 3.5 5 95 1000 1.0 5 1.0 3.5 0 450
MM5Z3V6T1G 06 3.4 3.6 3.8 5 90 1000 1.0 5 1.0 3.5 0 450
MM5Z3V9T1G 07 3.7 3.9 4.1 5 90 1000 1.0 3 1.0 3.5 2.5 450
MM5Z4V3T1G 08 4.0 4.3 4.6 5 90 1000 1.0 3 1.0 3.5 0 450
MM5Z4V7T1G 09 4.4 4.7 5.0 5 80 800 1.0 3 2.0 3.5 0.2 260
MM5Z5V1T1G 0A 4.8 5.1 5.4 5 60 500 1.0 2 2.0 2.7 1.2 225
MM5Z5V6T1G 0C 5.2 5.6 6.0 5 40 200 1.0 1 2.0 2.0 2.5 200
MM5Z6V2T1G 0E 5.8 6.2 6.6 5 10 100 1.0 3 4.0 0.4 3.7 185
MM5Z6V8T1G 0F 6.4 6.8 7.2 5 15 160 1.0 2 4.0 1.2 4.5 155
MM5Z7V5T1G 0G 7.0 7.5 7.9 5 15 160 1.0 1 5.0 2.5 5.3 140
MM5Z8V2T1G 0H 7.7 8.2 8.7 5 15 160 1.0 0.7 5.0 3.2 6.2 135
MM5Z9V1T1G 0K 8.5 9.1 9.6 5 15 160 1.0 0.2 7.0 3.8 7.0 130
MM5Z10VT1G 0L 9.4 10 10.6 5 20 160 1.0 0.1 8.0 4.5 8.0 130
MM5Z11VT1G 0M 10.4 11 11.6 5 20 160 1.0 0.1 8.0 5.4 9.0 130
MM5Z12VT1G 0N 11.4 12 12.7 5 25 80 1.0 0.1 8.0 6.0 10 130
MM5Z13VT1G 0P 12.4 13.25 14.1 5 30 80 1.0 0.1 8.0 7.0 11 120
MM5Z15VT1G 0T 14.3 15 15.8 5 30 80 1.0 0.05 10.5 9.2 13 110
MM5Z16VT1G 0U 15.3 16.2 17.1 5 40 80 1.0 0.05 11.2 10.4 14 105
MM5Z18VT1G 0W 16.8 18 19.1 5 45 80 1.0 0.05 12.6 12.4 16 100
MM5Z20VT1G 0Z 18.8 20 21.2 5 55 100 1.0 0.05 14.0 14.4 18 85
MM5Z22VT1G 10 20.8 22 23.3 5 55 100 1.0 0.05 15.4 16.4 20 85
MM5Z24VT1G 11 22.8 24.2 25.6 5 70 120 1.0 0.05 16.8 18.4 22 80
MM5Z27VT1G 12 25.1 27 28.9 2 80 300 1.0 0.05 18.9 21.4 25.3 70
MM5Z30VT1G 14 28 30 32 2 80 300 1.0 0.05 21.0 24.4 29.4 70
MM5Z33VT1G 18 31 33 35 2 80 300 1.0 0.05 23.2 27.4 33.4 70
MM5Z36VT1G 19 34 36 38 2 90 500 1.0 0.05 25.2 30.4 37.4 70
MM5Z39VT1G 20 37 39 41 2 130 500 1.0 0.05 27.3 33.4 41.2 45
MM5Z43VT1G 21 40 43 46 2 150 500 1.0 0.05 30.1 37.6 46.6 40
MM5Z47VT1G 1A 44 47 50 2 170 500 1.0 0.05 32.9 42.0 51.8 40
MM5Z51VT1G 1C 48 51 54 2 180 500 1.0 0.05 35.7 46.6 57.2 40
MM5Z56VT1G 1D 52 56 60 2 200 500 1.0 0.05 39.2 52.2 63.8 40
MM5Z62VT1G 1E 58 62 66 2 215 500 1.0 0.05 43.4 58.8 71.6 35
MM5Z68VT1G 1F 64 68 72 2 240 500 1.0 0.05 47.6 65.6 79.8 35
MM5Z75VT1G 1G 70 75 79 2 255 500 1.0 0.05 52.5 73.4 88.6 35
1. Zener voltage is measured with a pulse test current IZ at an ambient temperature of 25°C.
*Include SZ-prefix devices where applicable.
MM5ZxxxT1G Series, SZMM5ZxxxT1G Series
http://onsemi.com
4
PACKAGE DIMENSIONS
SOD523
CASE 502
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
E
D
X
Y
b
2X
M
0.08 X Y
A
H
c
DIM MIN NOM MAX
MILLIMETERS
D1.10 1.20 1.30
E0.70 0.80 0.90
A0.50 0.60 0.70
b0.25 0.30 0.35
c0.07 0.14 0.20
L0.30 REF
H1.50 1.60 1.70
12
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
E
E
RECOMMENDED
TOP VIEW
SIDE VIEW
2X
BOTTOM VIEW
L2
L
2X
2X
0.48
0.40
2X
1.80
DIMENSION: MILLIMETERS
PACKAGE
OUTLINE
L2 0.15 0.20 0.25
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
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