Semiconductor Components Industries, LLC, 2001
October, 2001 – Rev. 7 1Publication Order Number:
SN74LS365A/D
SN74LS365A, SN74LS367A,
SN74LS368A
3-State Hex Buffers
These devices are high speed hex buffers with 3-state outputs. They
are organized as single 6-bit or 2-bit/4-bit, with inverting or
non-inverting data (D) paths. The outputs are designed to drive 15
TTL Unit Loads or 60 Low Power Schottky loads when the Enable (E)
is LOW.
When the Output Enable (E) is HIGH, the outputs are forced to a
high impedance “off” state. If the outputs of the 3-state devices are tied
together, all but one device must be in the high impedance state to
avoid high currents that would exceed the maximum ratings.
Designers should ensure that Output Enable signals to 3-state devices
whose outputs are tied together are designed so there is no overlap.
GUARANTEED OPERATING RANGES
Symbol Parameter Min Typ Max Unit
VCC Supply Voltage 4.75 5.0 5.25 V
TAOperating Ambient
Temperature Range 0 25 70 °C
IOH Output Current – High –2.6 mA
IOL Output Current – Low 24 mA
LOW
POWER
SCHOTTKY
SOIC
D SUFFIX
CASE 751B
PLASTIC
N SUFFIX
CASE 648
16
1
16
1
Device Package Shipping
ORDERING INFORMATION
SN74LS365AN 16 Pin DIP 2000 Units/Box
SN74LS365AD SOIC–16 38 Units/Rail
SN74LS365ADR2 SOIC–16 2500/Tape & Reel
SN74LS367AN 16 Pin DIP 2000 Units/Box
SN74LS367AD SOIC–16 38 Units/Rail
SN74LS367ADR2 SOIC–16 2500/Tape & Reel
SN74LS368AN 16 Pin DIP 2000 Units/Box
SN74LS368AD SOIC–16 38 Units/Rail
SN74LS368ADR2 SOIC–16 2500/Tape & Reel
http://onsemi.com
SN74LS365A, SN74LS367A, SN74LS368A
http://onsemi.com
2
14 13 12 11 10 9
123456 7
16 15
8
VCC
E1
E2
GND
14 13 12 11 10 9
123456 7
16 15
8
VCC
E
E
GND
SN74LS365A
HEX 3-STATE BUFFER WITH
COMMON 2-INPUT NOR ENABLE
SN74LS367A
HEX 3-STATE BUFFER
SEPARATE 2-BIT AND 4-BIT SECTIONS
SN74LS368A
HEX 3-STATE INVERTER BUFFER
SEPARATE 2-BIT AND 4-BIT SECTIONS
14 13 12 11 10 9
123456 7
16 15
8
VCC
E
E
GND
TRUTH TABLE
INPUTS OUTPUT
E1E2D
L
L
H
X
L
L
X
H
L
H
X
X
L
H
(Z)
(Z)
TRUTH TABLE
INPUTS OUTPUT
E D
L
L
H
L
H
X
L
H
(Z)
TRUTH TABLE
INPUTS OUTPUT
E D
L
L
H
L
H
X
H
L
(Z)
SN74LS365A, SN74LS367A, SN74LS368A
http://onsemi.com
3
DC CHARACTERISTICS OVER OPERATING TEMPERATURE RANGE (unless otherwise specified)
Limits
Symbol Parameter Min Typ Max Unit Test Conditions
VIH Input HIGH Voltage 2.0 V Guaranteed Input HIGH Voltage for
All Inputs
VIL Input LOW Voltage 0.8 VGuaranteed Input LOW Voltage for
All Inputs
VIK Input Clamp Diode Voltage –0.65 1.5 V VCC = MIN, IIN = –18 mA
VOH Output HIGH Voltage 2.4 3.1 V VCC = MIN, IOH = MAX, VIN = VIH
or VIL per Truth Table
VOL
Out
p
ut LOW Voltage
0.25 0.4 V IOL = 12 mA VCC = VCC MIN,
VIN VIL or VIH
VOL Output LOW Voltage 0.35 0.5 V IOL = 24 mA VIN = VIL or VIH
per Truth Table
IOZH Output Off Current HIGH 20 µA VCC = MAX, VOUT = 2.7 V
IOZL Output Off Current LOW –20 µA VCC = MAX, VOUT = 0.4 V
IIH
In
p
ut HIGH Current
20 µA VCC = MAX, VIN = 2.7 V
IIH Input HIGH Current 0.1 mA VCC = MAX, VIN = 7.0 V
Input LOW Current
E Inputs –0.4 mA VCC = MAX, VIN = 0.4 V
IIL D Inputs –20 µAVCC = MAX, VIN = 0.5 V
Either E Input at 2.0 V
–0.4 mA VCC = MAX, VIN = 0.4 V
Both E Inputs at 0.4 V
IOS Short Circuit Current (Note 1) –40 –225 mA VCC = MAX
I
CC
Power Supply Current
LS365A, 367A 24 mA V
CC
= MAX
ICC
LS368A 21
mA
VCC
=
MAX
Note 1: Not more than one output should be shorted at a time, nor for more than 1 second.
AC CHARACTERISTICS (TA = 25°C, VCC = 5.0 V)
Limits
LS365A/LS367A LS366A/LS368A
Symbol Parameter Min Typ Max Min Typ Max Unit Test Conditions
tPLH
tPHL Propagation Delay 10
9.0 16
22 7.0
12 15
18 ns C
L
= 45 pF,
tPZH
tPZL Output Enable Time 19
24 35
40 18
28 35
45 ns
CL
=
45
F
,
RL = 667
tPHZ
tPLZ Output Disable Time 30
35 32
35 ns CL = 5.0 pF
SN74LS365A, SN74LS367A, SN74LS368A
http://onsemi.com
4
PACKAGE DIMENSIONS
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
FC
S
HGD
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
RX 45
G
8 PLP
–B–
–A–
M
0.25 (0.010) B S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.80 10.00 0.386 0.393
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.229 0.244
R0.25 0.50 0.010 0.019

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SN74LS365A/D
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